CN115397124B - Method for improving gold-plating efficiency of multilayer circuit board - Google Patents
Method for improving gold-plating efficiency of multilayer circuit board Download PDFInfo
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- CN115397124B CN115397124B CN202211089265.4A CN202211089265A CN115397124B CN 115397124 B CN115397124 B CN 115397124B CN 202211089265 A CN202211089265 A CN 202211089265A CN 115397124 B CN115397124 B CN 115397124B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of multi-layer circuit board gold melting, in particular to a method for improving the gold melting efficiency of a multi-layer circuit board, which solves the problems of low efficiency, low effect and increased cost caused by the fact that the existing multi-layer circuit board is not subjected to dust removal treatment before gold melting, the multi-layer circuit board is required to be subjected to multiple times of gold melting treatment, and the problem that the edge of the multi-layer circuit board cannot be subjected to high automation and large-scale treatment; compared with the prior art, the invention can thoroughly clean the multilayer circuit board before gold melting, and can also carry out high-automation and large-scale treatment on the edge of the multilayer circuit board.
Description
Technical Field
The invention relates to the technical field of multi-layer circuit board gold plating, in particular to a method for improving the gold plating efficiency of a multi-layer circuit board.
Background
The circuit board surface treatment is carried out by adopting a very common process, namely a gold deposition process, wherein the gold deposition process adopts a chemical deposition method, a layer of metal coating is generated on the circuit board surface through a chemical oxidation-reduction reaction, copper metal and air can be effectively prevented from being oxidized, namely gold melting is carried out, jin Yiji chemical gold is melted, a layer of coating is generated through a chemical oxidation-reduction reaction method, the thickness is generally thicker, and a thicker gold layer can be achieved through a chemical nickel Jin Jinceng deposition method.
The multi-layer circuit board is exposed to the external environment, so that a large amount of dust and fluff are attached to the surface of the multi-layer circuit board before the gold plating is performed.
The existing device does not remove dust before carrying out gold removal on the multilayer circuit board, so that a large amount of dust on the surface of the device can prevent the multilayer circuit board from carrying out complete coating, the multilayer circuit board needs to be subjected to multiple coating, the gold removal efficiency and the cost are seriously reduced, the existing processing mode of the board edge in the gold chemical precipitation process is generally carried out manually, time and labor are wasted, management and control in the processing process are difficult, uniformity cannot be achieved, and the process cannot realize automatic operation and large-scale operation, so that the production efficiency is seriously influenced.
In view of the above technical drawbacks, a solution is now proposed.
Disclosure of Invention
1. The invention aims to provide a method for improving the gold-melting efficiency of a multilayer circuit board, which is characterized in that a first motor, a first bevel gear, a first rotating wheel and the like are used for driving the two roller brushes to rotate at the same rotation speed in opposite directions, so that the two roller brushes can clean two sides of the multilayer circuit board to the same extent, the problems of low efficiency, low effect and increased cost caused by the fact that the existing multilayer circuit board is not subjected to dust removal treatment before gold melting, the multilayer circuit board needs to be subjected to multiple gold melting treatments are solved, the first coating roller is used for coating gold-melting resistant ink attached to the surface of the first coating roller on the upper edge and the lower edge of the multilayer circuit board in a rolling coating mode, the sliding cylinder and the second coating roller are driven by the rotation of a threaded rod to move along the vertical direction, and then automatic uniform coating is carried out on the other two edges of the multilayer circuit board, and the problem that the existing device cannot carry out high automation and large-scale treatment on the edges of the multilayer circuit board is solved.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a method for improving the gold-plating efficiency of a multilayer circuit board comprises the following steps:
step one: when the multi-layer circuit board processing device is used, the driving roller in the multi-layer circuit board processing device is started, the multi-layer circuit board is placed between the corresponding abutting discs in the frame, the distance between the abutting discs and the supporting seat cylinder is adjusted through the second compression spring, further, clamping and conveying of the multi-layer circuit boards of different types are achieved, the first motor drives the first bevel gear and the third bevel gear to rotate, the first bevel gear and the third bevel gear drive the first roller brush to rotate at the same rotation speed in a reverse direction through a series of driving, the first roller brush and the third roller brush at the same rotation speed clean the multi-layer circuit board to the same degree, and further the problem that the multi-layer circuit board is crushed or even broken due to the fact that the advancing directions of the multi-layer circuit board are offset due to the fact that the rotation speeds of the two roller brushes are different is avoided;
step two: the dust and the fluff cleaned from the surface of the multilayer circuit board are attached to the roller hairbrush, the roller hairbrush is matched with the hollow spatula, meanwhile, air blown out by the blower is blown out through the blowing pipe and the vent hole, the dust and the fluff scraped from the surface of the roller hairbrush are blown into the air, and the suction fan absorbs the dust and the fluff suspended in the air through the air suction pipe and the dust hood, so that the dust on the surface of the multilayer circuit board is cleaned and absorbed, and the problem of secondary pollution caused by the dust and the fluff to the multilayer circuit board is effectively avoided;
step three: the spray nozzle wets the surface of the multilayer circuit board, scrapes the liquid on the surface of the multilayer circuit board through a scraping pad connected with the side surface of the extrusion plate, further removes greasy dirt on the surface of the multilayer circuit board, and then dries the multilayer circuit board through a dryer;
step four: after the multilayer circuit board passes through the first coating roller, two edges of the multilayer circuit board are automatically coated by the first coating roller, the second coating roller is matched with the threaded rod and the sliding cylinder to automatically coat the other two edges of the multilayer circuit board, and the coated multilayer circuit board is dried and then subjected to the next gold-plating process.
Further, the multilayer circuit board processing device comprises a frame and a driving roller, wherein an electric push rod I is symmetrically fixed on the inner wall of the frame, a cleaning component is installed at the output end of the electric push rod I, a front support and a rear support are symmetrically and fixedly connected to the inner wall of the frame, the driving roller is movably connected to the front support and the rear support through bearings, a conveying belt is connected to the outer side of the driving roller, and the cleaning component is located between the front support and the rear support;
the cleaning assembly comprises a vertical plate, the output end of the first electric push rod is fixed with the vertical plate through spot welding, one side of the vertical plate is fixed with a clamping through spot welding, the inside of the clamping is movably connected with a first rotating rod through a bearing, a roller brush is sleeved and fixed on the outer side of the first rotating rod, bristles are uniformly arranged on the outer side of the roller brush, a dust hood is fixedly arranged on one side of the vertical plate, an air suction pipe is communicated with one side of the dust hood, a blower and an air suction fan are arranged on the outer side of the frame, the air suction pipe is communicated with the air suction fan, and a hollow spatula is fixed on one side of the dust hood through spot welding.
Further, the hollow spatula is matched with the roller hairbrush, a plurality of ventilation holes are formed in one side of the hollow spatula, a blowing pipe is communicated with one side of the hollow spatula, and the blowing pipe is communicated with the blower.
Further, the top and the bottom of riser all are provided with connecting rod one through bearing swing joint, two be provided with the connecting seat between the riser, the one end that the riser was kept away from to connecting rod one passes through bearing swing joint with the connecting seat, and one of them the bottom fixedly connected with baffle of connecting seat, one side fixed mounting of baffle has motor one, the output of motor one is fixed with bevel gear one through spot welding, one side of baffle is provided with bull stick two and bull stick three through the base, and bull stick two and bull stick three all pass through bearing swing joint with the base, the one end fixedly connected with bevel gear two of bull stick two, the one end fixedly connected with bevel gear three of bull stick three, bevel gear two and bevel gear three meshing are connected.
Further, the top of bull stick one is fixed with the runner one through spot welding, the outside cover of bull stick three is established and is fixed with the runner two, the output cover of motor one is established and is fixed with the runner three, runner two and runner three are all connected with the runner one that corresponds the setting through the belt.
Further, be provided with edge coating subassembly in the frame, edge coating subassembly includes the diaphragm, the both ends of diaphragm all with frame inside wall fixed connection, the notch has been seted up at the middle part of diaphragm, notch inner wall fixedly connected with slide bar, the outside cover of slide bar is equipped with two slider and compression spring three, and compression spring three's both ends all with the slider one fixed connection who corresponds the setting, the bottom of slider one has the coating roller one through bearing swing joint, the inside wall fixed mounting of frame has electric putter two, electric putter two's output is fixed with the push pedal through spot welding.
Further, the side bottom fixedly connected with connecting plate of push pedal, the top symmetry of connecting plate is provided with the threaded rod, the outside cover of threaded rod is equipped with a section of thick bamboo that slides, a section of thick bamboo and threaded rod threaded connection slide, the spacing groove has been seted up in the outside of push pedal, the one end sliding connection of a section of thick bamboo that slides is in the spacing inslot, the other end of a section of thick bamboo that slides is fixed with the bracing piece through spot welding, the one end of bracing piece is connected with coating roller two through the joint frame, go out liquid tubule storehouse with one side of coating roller two is all installed out liquid tubule storehouse, one side intercommunication that goes out liquid tubule storehouse has the liquid pipe.
Further, the scraping assembly is installed to the inboard of frame, the scraping assembly includes a plurality of spray nozzle and drying-machine, the inner wall fixed mounting of frame has spray nozzle and drying-machine, the one end of spray nozzle passes through the aqueduct and is connected with outside water supply installation, the inside wall fixedly connected with of frame is a plurality of horizontal poles, and corresponds the one side rotation of horizontal pole that sets up and be connected with the gag lever post, the other end and the stripper plate side rotation of gag lever post are connected, the guide way has been seted up in the outside of stripper plate, one side fixedly connected with L type pole of horizontal pole, the inboard fixedly connected with sleeve of L type pole, sliding connection has the ejector pin in the sleeve, the one end sliding connection of ejector pin is in the guide way, fixedly connected with compression spring one between ejector pin and the sleeve.
Further, a support cylinder is arranged at the outer side of the conveyor belt at equal intervals, a second sliding block is connected in the support cylinder in a sliding manner, a second compression spring is fixedly connected between the second sliding block and the inner wall of the support cylinder, a supporting rod is arranged at the outer side of the support cylinder, one end of the supporting rod is fixedly connected with the second sliding block, and the other end of the supporting rod is fixedly provided with a supporting disc through spot welding.
Compared with the prior art, the invention has the beneficial effects that:
1. when the multi-layer circuit board is used, the two roller brushes rotate reversely at the same rotating speed through the transmission structure such as the motor I, the bevel gear I and the rotating wheel I, so that the two roller brushes clean two sides of the multi-layer circuit board to the same extent, the problem that the multi-layer circuit board is extruded and damaged or even broken due to the fact that the multi-layer circuit board is deviated and slipped due to different rotating speeds of the two roller brushes is avoided;
2. when the anti-melting-point gold plating device is used, in the process that a multilayer circuit board passes through the first coating rollers, the first coating rollers smear anti-melting-point gold printing ink attached to the surfaces of the first coating rollers on the upper edge and the lower edge of the multilayer circuit board in a rolling smearing mode, the second electric push rod drives the push plate to move until the second coating rollers are in contact with and abut against the multilayer circuit board, the rotation of the threaded rod drives the sliding cylinder and the second coating rollers to move along the vertical direction, and further automatic and uniform coating of the other two edges of the multilayer circuit board is realized, and the problem that large-scale, automatic and high-efficiency treatment cannot be realized due to the fact that the existing treatment mode aiming at edges of the multilayer circuit board in the melting process is mostly manual;
3. the edge coating component has strong replaceability, and the coating roller I and the coating roller II assist in coating the edges of the multilayer circuit board by replacing the liquid outlet thin pipe bin with the anti-chemical gold adhesive tape rolls, and after the coating is finished, the adhesive tape can be cut off and the subsequent multilayer circuit board can be continuously coated by using an automatic control adhesive tape cutting device, so that the automatic and large-scale edge treatment of the multilayer circuit board is realized, and the treatment efficiency of the multi-layer circuit board for melting gold is further improved.
Drawings
For the convenience of those skilled in the art, the present invention will be further described with reference to the accompanying drawings;
FIG. 1 is a top view of the overall structure of the present invention;
FIG. 2 is a top view of the rear bracket structure of the present invention;
FIG. 3 is a top view of a roller brush construction in accordance with the present invention;
FIG. 4 is a front view of a frame structure in accordance with the present invention;
FIG. 5 is a top view of the stripper plate of the present invention;
FIG. 6 is a front view of the stripper plate of the present invention;
FIG. 7 is a schematic view of a separator plate according to the present invention;
FIG. 8 is a top exploded view of the overall structure of the present invention;
FIG. 9 is a top view of a support rod structure of the present invention;
FIG. 10 is a side view of the threaded rod structure of the present invention;
FIG. 11 is an enlarged view of the area A according to the present invention;
FIG. 12 is an enlarged view of the area B according to the present invention;
fig. 13 is a schematic view of the hollow spatula according to the present invention.
Reference numerals: 1. a frame; 2. an electric push rod I; 3. a cleaning assembly; 301. a riser; 302. a clip; 303. a first rotating rod; 304. roller brushes; 305. a dust hood; 306. an air suction pipe; 307. a blower; 308. a suction fan; 309. a hollow spatula; 310. a vent hole; 311. a blowing pipe; 312. a first connecting rod; 313. a connecting seat; 314. a partition plate; 315. a first motor; 316. bevel gears I; 317. bevel gears II; 318. bevel gears III; 319. a first rotating wheel; 320. a second rotating wheel; 321. a third rotating wheel; 322. a belt; 4. a front bracket; 5. a rear bracket; 6. a driving roller; 7. a conveyor belt; 8. a support cylinder; 9. a scraping assembly; 901. a spray nozzle; 902. a dryer; 903. a cross bar; 904. a limit rod; 905. an extrusion plate; 906. an L-shaped rod; 907. a sleeve; 908. a push rod; 909. a guide groove; 10. an edge coating assembly; 101. a cross plate; 102. a slide bar; 103. a first sliding block; 104. a first coating roller; 105. an electric push rod II; 106. a push plate; 107. a connecting plate; 108. a threaded rod; 109. a slipping cylinder; 110. a limit groove; 111. a support rod; 112. a liquid outlet tubule bin; 113. a liquid supply pipe; 11. a supporting rod; 12. abutting the disc.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-13, the present invention provides a technical solution:
embodiment one:
the multilayer circuit board is exposed in the external environment, so that a large amount of dust and fluff are attached to the surface of the multilayer circuit board before the gold melting is carried out, but the traditional device does not remove dust before the gold melting is carried out on the multilayer circuit board, so that the surface of the multilayer circuit board cannot be completely plated due to the fact that a large amount of dust is blocked on the surface of the multilayer circuit board when the gold melting is carried out, the multilayer circuit board needs to be plated for multiple times, huge loss is caused to the electroless gold deposition cost, meanwhile, the problem of uneven thickness exists in the thickness of the plated on the surface of the multilayer circuit board, and the method specifically comprises the following steps of:
firstly, a multilayer circuit board is placed between two frames 1, a front support 4 and a rear support 5 are fixed on one adjacent sides of the two frames 1, a driving roller 6 is installed in the front support 4 and the rear support 5, a conveying belt 7 is sleeved on the outer side of the driving roller 6, a support cylinder 8 is equidistantly arranged on the outer side of the conveying belt 7, a second sliding block is connected in the support cylinder 8 in a sliding mode, a second compression spring is fixedly connected between the second sliding block and the inner wall of the support cylinder 8, a supporting rod 11 is arranged on the outer side of the support cylinder 8, one end of the supporting rod 11 is fixedly connected with the second sliding block, and a supporting disc 12 is fixed on the other end of the supporting rod 11 through spot welding, as shown in fig. 1, the symmetrically arranged supporting discs 12 can tightly clamp the multilayer circuit boards with different thicknesses under the action of the second compression spring, meanwhile, the fact that the multilayer circuit boards are clamped and damaged in the clamping and conveying process can be avoided through the driving roller 6 through the structures such as the conveying belt 7 and the support cylinder 8;
as shown in fig. 1-3, when one end of the multilayer circuit board is led out from the conveyor belt 7 of the front bracket 4, the electric push rod one 2 is started, the output end of the electric push rod one 2 is fixedly provided with a riser 301 through spot welding, the top and the bottom of the riser 301 are movably connected with a connecting rod one 312 through bearings, a connecting seat 313 is arranged between the two risers 301, one end of the connecting rod one 312 far away from the riser 301 is movably connected with the connecting seat 313 through bearings, the bottom of one connecting seat 313 is fixedly connected with a baffle 314, one side of the baffle 314 is fixedly provided with a motor one 315, the output end of the motor one 315 is fixedly provided with a bevel gear one 316 through spot welding, one side of the baffle 314 is provided with a second rotating rod and a third rotating rod through a base, the second rotating rod and the third rotating rod are movably connected with the base through bearings, one end of the second rotating rod is fixedly connected with a bevel gear two 317, one end of the third rotating rod is fixedly connected with a bevel gear three 318, and the second bevel gear 317 is in meshed connection with the first bevel gear 316 and the third bevel gear 318;
the specific setting is as follows: the first motor 315 drives the third rotating wheel 321 and the first bevel gear 316 to rotate, the first bevel gear 316 drives the third bevel gear 318 and the second rotating wheel 320 to rotate through the second bevel gear 317, the second rotating wheel 320 and the third rotating wheel 321 drive the first rotating wheel 319 to rotate through the belt 322, and it is required to explain that the first bevel gear 316 and the third bevel gear 318 are of the same model and the same size, and the rotation directions of the first bevel gear 316 and the third bevel gear 318 are opposite, so that the first rotating rod 303 connected with the corresponding clamping 302 drives the roller brushes 304 to rotate in the same rotation speed and reversely, the two roller brushes 304 clean the surface of the multilayer circuit board, and as the two roller brushes 304 rotate in the same rotation speed and reversely, the two roller brushes 304 clean the two sides of the multilayer circuit board to the same degree through the first motor 315, so that the problem that the multilayer circuit board is damaged or broken due to the fact that the rotation speeds of the two roller brushes 304 are different and the multilayer circuit board is deviated is avoided;
a dust hood 305 is fixedly arranged on one side of the vertical plate 301, an air suction pipe 306 is communicated on one side of the dust hood 305, a blower 307 and an air suction fan 308 are arranged on the outer side of the frame 1, the air suction pipe 306 is communicated with the air suction fan 308, a plurality of ventilation holes 310 are formed on one side of the hollow spatula 309, a blowing pipe 311 is communicated on one side of the hollow spatula 309, the blowing pipe 311 is communicated with the blower 307, in the process of cleaning the multilayer circuit board by the roller brush 304, the rotating roller brush 304 is matched with the hollow spatula 309, so that dust and fluff attached to the surface of the roller brush 304 fall off from the surface of the roller brush 304, the dust and fluff are blown up by wind in the blowing pipe 311 through the ventilation holes 310 on the hollow spatula 309, and meanwhile, the air suction fan 308 absorbs the floating dust and fluff through the air suction pipe 306 and the dust hood 305, so that the secondary pollution of the dust and fluff to the multilayer circuit board is avoided, and the subsequent problem of the multilayer circuit board gold melting effect is affected is solved;
embodiment two:
the cleaned part of the multilayer circuit board passing through the roller brush 304 passes through the spray nozzle 901, the spray nozzle 901 wets and decontaminates the surface of the multilayer circuit board, the inner side wall of the frame 1 is fixedly connected with a plurality of cross rods 903, one side of the corresponding cross rod 903 is rotationally connected with a limiting rod 904, the other end of the limiting rod 904 is rotationally connected with the side surface of the extrusion plate 905, torsion springs are arranged at the rotational connection parts of the two ends of the limiting rod 904 with the cross rod 903 and the extrusion plate 905, the outer side of the extrusion plate 905 is provided with a guide groove 909, one side of the cross rod 903 is fixedly connected with an L-shaped rod 906, the inner side of the L-shaped rod 906 is fixedly connected with a sleeve 907, the sleeve 907 is slidably connected with a push rod 908, one end of the ejector rod 908 is slidably connected in the guide groove 909, a compression spring I is fixedly connected between the ejector rod 908 and the sleeve 907, scraping pads are arranged at the adjacent ends of the two extrusion plates 905, when the scraping pads at one side of the extrusion plates 905 are in contact with the multilayer circuit boards, the extrusion plates 905 are expanded by the multilayer circuit boards and then drive the limiting rods 904 to deflect, the extrusion plates 905 of the limiting rods 904 move, the extrusion plates 905 can extrude the ejector rod 908 to move towards the sleeve 907 through the guide groove 909 in the moving process, and further, the purpose of scraping stains attached to two sides of the multilayer circuit boards of different types is achieved by adjusting the extrusion plates 905, and the parts of the multilayer circuit boards which are wiped by the scraping pads are subjected to surface drying by the dryer 902;
the scraping assembly 9 and the cleaning assembly 3 are matched with each other, so that dust and fluff on the surface of the multilayer circuit board are thoroughly cleaned, and the effect that the surface of the multilayer circuit board is affected by dust to realize subsequent gold dissolving is effectively avoided;
embodiment III:
when the surface of the multilayer circuit board is subjected to gold melting, the actual factors such as high gold melting cost, the cutting size of the circuit board after gold melting and the like are considered, so that the edge of the multilayer circuit board generally does not need gold melting treatment, but the edge of the multilayer circuit board needs to be sealed to avoid the plate edge from being deposited with gold, but the coating of anti-gold ink on the edge of the multilayer circuit board or the pasting of anti-gold adhesive tape is generally carried out manually, so that the process cannot realize automatic operation and large-scale operation, and further the production efficiency is seriously influenced, and in order to solve the problem, the specific operation is as follows:
the two ends of the transverse plate 101 are fixedly connected with the inner side wall of the frame 1, a notch is formed in the middle of the transverse plate 101, a sliding rod 102 is fixedly connected to the inner wall of the notch, two first sliding blocks 103 and a third compression spring are sleeved on the outer side of the sliding rod 102, the two ends of the third compression spring are fixedly connected with the first sliding blocks 103 which are correspondingly arranged, the bottoms of the first sliding blocks 103 are movably connected with first coating rollers 104 through bearings, when the multilayer circuit board passes through the first two coating rollers 104, the first coating rollers 104 smear anti-melting ink attached to the surfaces of the multilayer circuit board on the upper edge and the lower edge of the multilayer circuit board in a rolling smearing mode until the upper edge and the lower edge of the multilayer circuit board are completely smeared, and meanwhile, the middle of the multilayer circuit board is propped by a propping disc 12 on the rear support 5;
then, the second electric push rod 105 is started, the second electric push rod 105 drives the push plate 106 to move until the second coating roller connected through the supporting rod 111 contacts and abuts against the multilayer circuit board, the connecting plate 107 is fixedly connected to the bottom of the side face of the push plate 106, threaded rods 108 are symmetrically arranged at the top of the connecting plate 107, sliding cylinders 109 are sleeved on the outer sides of the threaded rods 108, the sliding cylinders 109 are in threaded connection with the threaded rods 108, as shown in fig. 9-10, the bottom end of one threaded rod 108 is connected with the second motor, the output end of the second motor is fixedly connected with an engagement wheel, the engagement wheel drives the engagement wheel on the other side and the threaded rods 108 to synchronously rotate through a chain belt, and as the limiting groove 110 is formed in the outer side of the push plate 106, one end of the sliding cylinders 109 is slidingly connected in the limiting groove 110, further, the sliding cylinders 109 positioned on the two sides of the same side of the multilayer circuit board and the second coating roller move along the vertical direction, liquid tubule bins 112 are respectively arranged on one sides of the first coating roller 104 and the second coating roller, one side of the liquid tubule bins 112 is communicated with liquid supply pipes 113, the liquid supply tubes 113 supply ink to the liquid tubule bins 112, and ink is used for the liquid tubule bins 112, and is anti-melting ink, and the ink is completely used for coating ink, and the anti-melting ink is completely and completely covering the edge of the first coating roller 104 and the first coating roller and the second coating roller;
by combining the first embodiment with the second embodiment, the continuous treatment processes of dust removal, drying and ink smearing on the multilayer circuit board are realized, so that the subsequent effect of gold-smearing on the multilayer circuit board due to the fact that dust is attached to the surface of the multilayer circuit board is effectively avoided, the full-automatic even smearing effect on the edges of the multilayer circuit board is realized through the arrangement of the edge coating assembly 10, and the problems that the existing treatment mode for edges of the multilayer circuit board in the gold-smearing process is mostly manual treatment, and large-scale, automatic and high-efficiency treatment cannot be realized are solved;
the edge coating assembly 10 has strong replaceability, and the adhesive tape can be cut off and continuously applied to the subsequent multilayer circuit board by using the automatic control adhesive tape cutting device after the adhesive tape is applied, so that the automatic and large-scale multilayer circuit board edge treatment is realized, and the treatment efficiency of the multilayer circuit board gold melting is further improved.
The foregoing is merely illustrative of the structures of this invention and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the invention or from the scope of the invention as defined in the accompanying claims.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (9)
1. A method for improving the gold-plating efficiency of a multilayer circuit board is characterized by comprising the following steps:
step one: when the multi-layer circuit board processing device is used, the driving roller (6) in the multi-layer circuit board processing device is started, the multi-layer circuit board is placed between the corresponding abutting discs (12) in the frame (1), the abutting discs (12) are used for adjusting the distance between the supporting cylinders (8) through the second compression springs, further, clamping and conveying of the multi-layer circuit boards of different types are achieved, the first motor (315) drives the first bevel gear (316) and the third rotating wheel (321) to rotate, the first bevel gear (316) and the third rotating wheel (321) drive the two roller brushes (304) to rotate at the same rotating speed in a reverse direction through a series of transmission, the two roller brushes (304) at the same rotating speed clean the multi-layer circuit board to the same extent, and further the problem that the multi-layer circuit board is crushed or even broken due to the fact that the running directions of the multi-layer circuit board are offset due to the fact that the rotating speeds of the two roller brushes (304) are different is avoided;
step two: dust and fluff cleaned from the surface of the multilayer circuit board are attached to the roller brush (304), the roller brush (304) is matched with the hollow spatula (309), meanwhile, air blown out by the blower (307) is blown out through the blowing pipe (311) and the vent hole (310), the dust and fluff scraped from the surface of the roller brush (304) are blown into the air, the suction fan (308) absorbs the dust and fluff suspended in the air through the suction pipe (306) and the dust hood (305), and further, the cleaning absorption of the dust on the surface of the multilayer circuit board is realized, and the problem of secondary pollution of the dust and fluff to the multilayer circuit board is effectively avoided;
step three: the spray nozzle (901) wets the surface of the multilayer circuit board, and scrapes the liquid on the surface of the multilayer circuit board by a scraping pad connected with the side surface of the extrusion plate (905), so as to remove greasy dirt on the surface of the multilayer circuit board, and then the multilayer circuit board is dried by the dryer (902);
step four: after the multilayer circuit board passes through the first coating roller (104), the first coating roller (104) automatically coats two edges of the multilayer circuit board, the second coating roller automatically coats the other two edges of the multilayer circuit board under the cooperation of the threaded rod (108) and the sliding cylinder (109), and the coated multilayer circuit board is dried and then subjected to the next gold-plating process.
2. The method for improving the gold-plating efficiency of the multilayer circuit board according to claim 1, wherein the multilayer circuit board processing device comprises a frame (1) and a driving roller (6), an electric push rod I (2) is symmetrically fixed on the inner wall of the frame (1), a cleaning component (3) is installed at the output end of the electric push rod I (2), a front support (4) and a rear support (5) are symmetrically and fixedly connected on the inner wall of the frame (1), the driving roller (6) is movably connected in the front support (4) and the rear support (5) through bearings, a conveying belt (7) is connected on the outer side of the driving roller (6), and the cleaning component (3) is located between the front support (4) and the rear support (5);
the cleaning assembly (3) comprises a vertical plate (301), the output end of an electric push rod (2) is fixed with the vertical plate (301) through spot welding, one side of the vertical plate (301) is fixed with a clamp (302) through spot welding, the inside of the clamp (302) is movably connected with a rotating rod (303) through a bearing, the outer side of the rotating rod (303) is sleeved with a roller brush (304), bristles are uniformly arranged on the outer side of the roller brush (304), a dust hood (305) is fixedly arranged on one side of the vertical plate (301), one side of the dust hood (305) is communicated with an air suction pipe (306), the outer side of the frame (1) is provided with a blower (307) and an air suction pipe (308), and one side of the dust hood (305) is fixedly provided with a hollow spatula (309) through spot welding.
3. The method for improving the gold-plating efficiency of the multilayer circuit board according to claim 2, wherein the hollow spatula (309) is matched with the roller brush (304), a plurality of ventilation holes (310) are formed in one side of the hollow spatula (309), a blowing pipe (311) is communicated with one side of the hollow spatula (309), and the blowing pipe (311) is communicated with the blower (307).
4. A method for improving the gold-plating efficiency of a multilayer circuit board according to claim 3, wherein the top and the bottom of the vertical plate (301) are respectively and movably connected with a first connecting rod (312) through bearings, two connecting seats (313) are arranged between the two vertical plates (301), one end of the first connecting rod (312) far away from the vertical plate (301) is movably connected with the connecting seats (313) through bearings, one bottom of the connecting seats (313) is fixedly connected with a partition plate (314), one side of the partition plate (314) is fixedly provided with a first motor (315), the output end of the first motor (315) is fixedly provided with a first bevel gear (316) through spot welding, one side of the partition plate (314) is provided with a second rotating rod and a third rotating rod through a base, the second rotating rod and the third rotating rod are respectively and movably connected with the base through bearings, one end of the second rotating rod is fixedly connected with a second bevel gear (317), one end of the third rotating rod is fixedly connected with a third bevel gear (318), and the second bevel gear (317) is meshed with the third bevel gear (316).
5. The method for improving the gold-plating efficiency of the multilayer circuit board according to claim 4, wherein the top end of the first rotating rod (303) is fixed with a first rotating wheel (319) through spot welding, the outer side of the third rotating rod is sleeved and fixed with a second rotating wheel (320), the output end of the first motor (315) is sleeved and fixed with a third rotating wheel (321), and the second rotating wheel (320) and the third rotating wheel (321) are connected with the first rotating wheel (319) which is correspondingly arranged through a belt (322).
6. The method for improving the gold-plating efficiency of the multilayer circuit board according to claim 2, wherein an edge coating assembly (10) is arranged in the frame (1), the edge coating assembly (10) comprises a transverse plate (101), two ends of the transverse plate (101) are fixedly connected with the inner side wall of the frame (1), a notch is formed in the middle of the transverse plate (101), a sliding rod (102) is fixedly connected with the inner wall of the notch, two first sliding blocks (103) and a third compression spring are sleeved on the outer side of the sliding rod (102), two ends of the third compression spring are fixedly connected with the first sliding blocks (103) which are correspondingly arranged, the bottom of the first sliding blocks (103) is movably connected with a first coating roller (104) through bearings, an second electric push rod (105) is fixedly arranged on the inner side wall of the frame (1), and a push plate (106) is fixedly arranged at the output end of the second electric push rod (105) through spot welding.
7. The method for improving the gold-plating efficiency of the multilayer circuit board according to claim 6, wherein a connecting plate (107) is fixedly connected to the bottom of the side face of the push plate (106), threaded rods (108) are symmetrically arranged at the top of the connecting plate (107), sliding cylinders (109) are sleeved outside the threaded rods (108), limiting grooves (110) are formed in the outer side of the push plate (106), one ends of the sliding cylinders (109) are slidably connected in the limiting grooves (110), supporting rods (111) are fixedly arranged at the other ends of the sliding cylinders (109) through spot welding, second coating rollers are connected to one ends of the supporting rods (111) through clamping frames, first liquid outlet thin pipe bins (112) are respectively arranged on one sides of the first coating rollers (104) and the second coating rollers, and liquid supply pipes (113) are communicated to one sides of the second liquid outlet thin pipe bins (112).
8. The method for improving the gold-plating efficiency of the multilayer circuit board according to claim 2, wherein a scraping assembly (9) is installed on the inner side of the frame (1), the scraping assembly (9) comprises a plurality of spray nozzles (901) and a dryer (902), the spray nozzles (901) and the dryer (902) are fixedly installed on the inner wall of the frame (1), one end of the spray nozzles (901) is connected with an external water supply device through a water guide pipe, a plurality of cross bars (903) are fixedly connected to the inner side wall of the frame (1), one side of the corresponding cross bar (903) is rotatably connected with a limiting rod (904), the other end of the limiting rod (904) is rotatably connected with the side face of a pressing plate (905), a guide groove (909) is formed in the outer side of the pressing plate (905), an L-shaped rod (906) is fixedly connected to one side of the cross bar (903), a sleeve (907) is fixedly connected to the inner side of the L-shaped rod (906), one end of the ejector rod (908) is slidably connected with a sleeve (908) in the guide groove (908), and one end of the ejector rod (908) is fixedly connected with a compression sleeve (909).
9. The method for improving the gold-plating efficiency of the multilayer circuit board according to claim 2, wherein a support cylinder (8) is arranged on the outer side of the conveyor belt (7) at equal distance, a second sliding block is connected in the support cylinder (8) in a sliding mode, a second compression spring is fixedly connected between the second sliding block and the inner wall of the support cylinder (8), a supporting rod (11) is arranged on the outer side of the support cylinder (8), one end of the supporting rod (11) is fixedly connected with the second sliding block, and a supporting disc (12) is fixedly arranged on the other end of the supporting rod (11) through spot welding.
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| CN202211089265.4A CN115397124B (en) | 2022-09-07 | 2022-09-07 | Method for improving gold-plating efficiency of multilayer circuit board |
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| CN115397124B true CN115397124B (en) | 2023-07-21 |
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| CN108354314A (en) * | 2018-03-31 | 2018-08-03 | 桂林恒正科技有限公司 | A kind of dedusting circuit board hairbrush |
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