CN115389914A

CN115389914A - Circuit board testing equipment

Info

Publication number: CN115389914A
Application number: CN202211109761.1A
Authority: CN
Inventors: 黄建东
Original assignee: XFusion Digital Technologies Co Ltd
Current assignee: XFusion Digital Technologies Co Ltd
Priority date: 2022-09-13
Filing date: 2022-09-13
Publication date: 2022-11-25

Abstract

The embodiment of the application provides circuit board testing equipment, and relates to the technical field of server testing. The circuit board testing equipment comprises a universal testing platform, a sub-clamp module and a connector; the sub-clamp module is detachably arranged in the universal test platform, and the sub-clamp module is connected with the universal test platform through a connector; the circuit board testing device comprises a sub-clamp module, a testing module and a testing module, wherein the sub-clamp module comprises a sub-clamp upper module and a sub-clamp lower module, the sub-clamp upper module and the sub-clamp lower module are arranged oppositely, and one surface of the sub-clamp lower module, which faces the sub-clamp upper module, is used for placing a circuit board to be tested; and the upper module of the sub-clamp is provided with an interface butt joint structure, and the interface butt joint structure is in adaptive connection with an interface on the circuit board to be tested. Therefore, different types of circuit boards can be tested by replacing the sub-clamp module, the application range of the circuit board testing equipment is favorably expanded, and the utilization rate of universal resources in the circuit board testing equipment is improved.

Description

Circuit board testing equipment

Technical Field

The embodiment of the application relates to the technical field of server testing, in particular to a circuit board testing device.

Background

Before shipping, the server needs to perform a Functional Test (FT) or a Boundary scan test (BSI) on the server motherboard through a testing device. During specific operation, the staff places the server mainboard that awaits measuring in test equipment, and external equipment among the test equipment can test the server mainboard.

As is well known, the interface structure of the server motherboard is complex, and the types and the number of the interfaces of the server motherboard are numerous, so that the types and the number of the external devices arranged in the test equipment are large, and the structure of the test equipment is complex and the cost is high.

However, at present, a kind of test equipment can only test one kind of motherboard correspondingly, so that the application range of the test equipment is small, and the utilization rate of general resources in the test equipment is low.

Disclosure of Invention

The embodiment of the application provides a circuit board test equipment, can test different kinds of circuit boards through the mode of replacing the sub-clamp module group, be favorable to enlarging circuit board test equipment's application scope, improve the utilization ratio of universal resource among the circuit board test equipment.

The embodiment of the application provides a circuit board testing device, which comprises a general testing platform, a sub-clamp module and a connector; the sub-clamp module is detachably arranged in the general test platform, and the sub-clamp module is connected with the general test platform through a connector; the circuit board testing device comprises a sub-clamp module, a testing module and a testing module, wherein the sub-clamp module comprises a sub-clamp upper module and a sub-clamp lower module, the sub-clamp upper module and the sub-clamp lower module are oppositely arranged, and one surface of the sub-clamp lower module, which faces to the sub-clamp upper module, is used for placing a circuit board to be tested; and an interface butt joint structure is arranged on the upper module of the sub-clamp and is in adaptive connection with an interface on the circuit board to be tested.

The embodiment of the application provides a circuit board test device, which comprises a general test platform, a sub-clamp module and a connector. The circuit board testing device comprises a sub-clamp module, a circuit board testing module and a test module, wherein the sub-clamp module comprises a sub-clamp upper module and a sub-clamp lower module, the sub-clamp upper module and the sub-clamp lower module are arranged oppositely, and one surface of the sub-clamp lower module facing the sub-clamp upper module is used for arranging the circuit board to be tested; simultaneously, through with sub-clamp module detachable setting in general test platform to make sub-clamp module and general test platform pass through the connector and connect, on the one hand, make sub-clamp module and general test platform switch on, thereby can use the universal resource on the general test platform to test the circuit board that awaits measuring in the sub-clamp module. On the other hand, the circuit board testing equipment can test different types of circuit boards by replacing the sub-clamp module, so that the application range of the circuit board testing equipment is expanded, and the utilization rate of universal resources in the circuit board testing equipment is improved; and corresponding circuit board test equipment does not need to be manufactured aiming at each circuit board, thereby being beneficial to saving the cost.

In a possible implementation manner, the upper sub-clip module comprises an upper sub-clip plate and a floating panel, and the floating panel is movably arranged on one surface of the upper sub-clip plate facing the lower sub-clip module; the interface butt joint structure is arranged on one surface, facing the sub-clamp lower module, of the floating panel and is used for being in butt joint with an interface on a circuit board to be tested, placed on the sub-clamp lower module in an adaptive mode.

The upper sub-clamp module comprises an upper sub-clamp plate and a floating panel, and the floating panel is used for being in butt joint with a circuit board to be tested placed on the lower sub-clamp module; and through the mobilizable setting of panel that will float at the sub-one side of sub-clamp upper plate orientation sub-clamp lower module to can fuse circuit board test equipment's interface butt joint structure's tolerance chain, and then make interface butt joint structure can the interface of the adaptation circuit board that awaits measuring that floats, be favorable to improving the butt joint precision.

In a possible implementation manner, the sub-clip upper module further comprises a connecting piece, and the floating panel and the sub-clip upper plate are movably connected through the connecting piece.

Through passing through connecting piece swing joint with unsteady panel and sub-clamp upper plate to be favorable to guaranteeing convenience and the reliability of connecting.

In a possible implementation manner, the connecting piece comprises a stopping part, a light shaft section and a threaded section which are connected in sequence and have gradually reduced radial sizes; one of the sub-clamp upper plate and the floating panel is provided with a through hole, the other one of the sub-clamp upper plate and the floating panel is provided with a threaded hole, the optical axis section is in clearance fit with the through hole, the axial size of the optical axis section is larger than that of the through hole, and the threaded section is in threaded connection with the threaded hole.

Through setting up the connecting piece including connect gradually and radial dimension reduces backstop portion, optical axis section and screw thread section gradually to set up the through-hole through one in sub-clamp upper plate and floating panel, another sets up the screw hole, make optical axis section and through-hole clearance fit, and the axial dimension of optical axis section is greater than the axial dimension of through-hole, makes screw thread section and screw hole threaded connection, thereby can realize floating panel along the purpose of a plurality of direction activities for sub-clamp upper plate.

In one possible implementation manner, the distance of the floating panel moving along the direction perpendicular to the upper plate of the sub-clamp ranges from 0.4mm to 0.6mm; and/or the floating panel moves for a distance ranging from 0.4mm to 0.6mm along the direction parallel to the upper plate of the sub-clamp.

The distance range of the floating panel moving along the direction vertical to the upper plate of the sub-clamp is 0.4mm-0.6mm; and/or the floating panel is arranged to move in a direction parallel to the upper plate of the sub-clip by a distance ranging from 0.4mm to 0.6mm, so that the floating panel can move relative to the upper plate of the sub-clip, and the moving range is ensured to be within a proper range.

In one possible implementation manner, one of the floating panel and the sub-clip lower module is provided with a positioning pin, and the other is provided with a positioning pin hole, and the positioning pin is in clearance fit with the positioning pin hole.

One of the modules is provided with a positioning pin through the arrangement of the floating panel and the sub-clamp, and the other one of the modules is provided with a positioning pin hole, so that the positioning pin and the positioning pin hole are in clearance fit, the floating panel can be in floating butt joint with the sub-clamp lower module, and the butt joint precision and the butt joint reliability can be guaranteed.

In a possible implementation manner, one surface of the floating panel facing the sub-clamp lower module is provided with a limiting bulge, and the limiting bulge is used for supporting between the floating panel and the circuit board to be tested.

The limiting bulge is arranged on one surface of the floating panel facing the sub-clamp lower module, and is supported between the floating panel and the circuit board to be tested, so that the interface butt joint structure on the floating panel and the interface on the circuit board to be tested can be prevented from being excessively extruded and damaged.

In a possible implementation manner, a plurality of supporting legs are arranged on one surface, facing the sub-clip lower module, of the sub-clip upper plate, and the supporting legs are arranged at intervals along the circumferential edge of the sub-clip upper plate; the length of the support leg extension is not less than the maximum distance between one surface of the floating panel departing from the upper plate of the sub-clamp and the upper plate of the sub-clamp.

The supporting legs are arranged on the upper plate of the sub-clamp towards one surface of the lower sub-clamp module, the supporting legs are arranged along the circumferential edge of the upper sub-clamp plate at intervals, the extending length of the supporting legs is not smaller than the maximum distance between one surface of the upper floating panel back ion clamp plate and the upper sub-clamp plate, and therefore when the upper sub-clamp module is placed on the platform, the supporting legs can support the upper sub-clamp module, and the interface butt joint structure on the floating panel is prevented from being damaged by pressure.

In one possible implementation manner, the universal test platform comprises a cabinet body and a female clamp module, the female clamp module comprises a female clamp upper module and a female clamp lower module, the female clamp upper module and the female clamp lower module are arranged in the cabinet body along the height direction of the cabinet body, and the female clamp upper module is located above the female clamp lower module; the upper sub-clamp module is detachably mounted in the cabinet body through the upper main clamp module, and the lower sub-clamp module is detachably mounted in the cabinet body through the lower main clamp module.

Through set up the female module of going up of pressing from both sides and female clamp module down in the cabinet body, make the sub-clamp go up the module and press from both sides module detachable through female and install in the cabinet body, the sub-clamp is down the module and is installed in the cabinet body through female clamp module detachable down to be convenient for the sub-clamp go up the module and the installation of sub-clamp lower module in the cabinet body.

In a possible implementation manner, the upper female clamp module comprises two guide grooves and a fixing piece arranged on the guide grooves, and the two guide grooves are respectively arranged on two opposite inner side walls in the width direction of the cabinet body and extend along the depth direction of the cabinet body; the two opposite sides of the sub-clip upper module are respectively accommodated in the two guide grooves and slide along the guide grooves; the fixing piece is used for fixing the sub-clamp upper module when the sub-clamp upper module is installed in place.

The upper die set of the main clamp comprises the guide groove, and the upper die set of the sub clamp is installed or disassembled along the guide groove in a sliding manner, so that the upper die set of the sub clamp is convenient and rapid to install and disassemble; and through setting up female clamp upper die group and including the mounting, the mounting is fixed sub clamp upper die group when sub clamp upper die group installation targets in place to the installation that makes sub clamp upper die group is more reliable and more stable.

In a possible implementation manner, the lower female clamp module comprises a bracket, a lifting mechanism and a telescopic plate, the bracket is connected to two opposite inner side walls in the width direction of the cabinet body, the lifting mechanism is arranged above the bracket, the telescopic plate is arranged above the lifting mechanism, and the lower sub-clamp module is detachably placed above the telescopic plate; the telescopic plate is connected with the lifting mechanism in a sliding manner, and the telescopic plate slides back and forth along the depth direction of the cabinet body; the lifting mechanism drives the expansion plate to move up and down.

The telescopic plate is connected with the lifting mechanism in a sliding manner and slides back and forth along the depth direction of the cabinet body, so that the lower sub-clamp module is convenient and quick to mount and dismount on the telescopic plate; and the lifting mechanism is arranged to drive the telescopic plate to move up and down, so that the lower sub-clamp module can move up and down, and a circuit board to be tested on the lower sub-clamp module can be in butt joint with or separated from the upper sub-clamp module.

In a possible implementation manner, the universal test platform further includes a programmable logic controller and a control computer, wherein the programmable logic controller is disposed in the cabinet and is used for controlling the controllable devices in the cabinet; the control computer is arranged outside the cabinet body and is used for presenting an interface of the programmable logic controller; and/or, general test platform is still including setting up switch, VGA capture card, LED test component and CPU radiator unit in the cabinet body, the switch is used for connecting the net gape, the VGA capture card with LED test component is used for the test respectively correspond the device on the circuit board that awaits measuring, CPU radiator unit is used for right CPU on the circuit board that awaits measuring dispels the heat.

By arranging the universal test platform and further comprising the programmable logic controller and the control computer, the programmable logic controller and the control computer can assist the universal test platform to better realize a test function, more equipment or devices can be brought into universal resources, the utilization rate is improved, and the cost is saved.

Through setting up general test platform still including setting up switch, VGA collection card, LED test component and the CPU heat dissipation component in the cabinet body to not only make switch, VGA collection card, LED test component and CPU heat dissipation component can assist the better realization test function of general test platform, be favorable to bringing more equipment or device equipment into universal resource moreover, improve the utilization ratio, practice thrift the cost.

In a possible implementation manner, the connector is a heavy-duty connector, the heavy-duty connector includes a male head and a female head, one of the general test platform and the sub-clip upper module is provided with the male head, and the other is provided with the female head; when the upper module of the sub-clamp is installed in the general test platform, the male head and the female head are mutually inserted.

By arranging the heavy-duty connector to comprise a male head and a female head, one of the universal test platform and the upper module of the sub-clip is provided with the male head, and the other is provided with the female head; when the upper die set of the sub-clamp is installed in the universal test platform, the male head and the female head are mutually inserted, so that blind insertion is conveniently realized, and the accuracy and the reliability of mutual insertion of the male head and the female head are improved.

In a possible implementation manner, the sub-clip lower module comprises a sub-clip lower plate and a support plate, the support plate is arranged on one surface, facing the sub-clip upper module, of the sub-clip lower plate, and the one surface, facing the sub-clip upper module, of the support plate is used for placing a circuit board to be tested.

Through setting up the support plate in the face that the sub-clamp hypoplastron was gone up the module towards the sub-clamp to make the one side that the support plate was gone up the module towards the sub-clamp be used for placing the circuit board that awaits measuring, thereby be favorable to providing the platform that is fit for the circuit board that awaits measuring and places.

In a possible implementation manner, a positioning element is arranged on one surface of the carrier plate facing the sub-clamp upper module, and the positioning element is used for positioning and placing a circuit board to be tested on the carrier plate.

The positioning piece is arranged on one surface of the carrier plate, facing the upper module of the sub-clamp, and is used for positioning the circuit board to be tested, which is placed on the carrier plate, so that the stability and reliability of the circuit board to be tested, which is placed on the carrier plate, can be ensured.

In one possible implementation manner, the circuit board to be tested includes a server motherboard.

The circuit board to be tested comprises the server mainboard, so that the circuit board testing equipment can be used for testing the server mainboard.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board testing apparatus according to an embodiment of the present application;

fig. 2 is a schematic structural diagram illustrating an assembly of a sub-clip module and a main clip module of a circuit board testing apparatus according to an embodiment of the present disclosure;

fig. 3 is a first schematic structural diagram of a female clamp module of a circuit board testing apparatus according to an embodiment of the present application;

fig. 4 is a second schematic structural diagram of a female clamp module of a circuit board testing apparatus according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a module on a mother clamp of a circuit board testing apparatus according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a female clip lower module of a circuit board testing apparatus according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a sub-clip module of a circuit board testing apparatus according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of an upper module of a sub-clip of a circuit board testing apparatus according to an embodiment of the present application;

FIG. 9 is a partial cross-sectional view of a sub-clip upper plate and a floating panel module of a circuit board testing apparatus connected by a connector according to an embodiment of the present application;

fig. 10 is a schematic structural view of a lower sub-clip module of a circuit board testing apparatus according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of a female connector of a circuit board testing device according to an embodiment of the present application;

fig. 12 is a schematic plan view illustrating an interface of a connector of a circuit board testing device according to an embodiment of the present application.

Description of reference numerals:

110-a cabinet body; 111-upper chamber; 1111-upper front wall; 1112-a lower front wall; 112-a caster; 113-a foot cup; 114-an indicator light;

120-a female clamp module; 121-mother clip on module; 1211-guide groove; 1212-a fixture; 1213-Beam; 1214-snap members; 1215-a first connecting tab; 122-female clip lower module; 1221-scaffold; 1222-a lifting mechanism; 12221-a lift motor; 12222-slide rail; 12223-sliding guide; 12224-lifter plate; 1223-expansion plate; 12231-a sliding mechanism; 1224 — the counterpart; 1225-a second connecting tab; 123-connecting shaft;

200-a sub-clip module; 210-a sub-clip upper module; 211-sub clip upper plate; 2111-supporting foot; 2112-handle; 212-a floating panel; 2121-interface docking structure; 2122-locating pins; 2123-limit protrusion; 213-a connector; 2131-a stop; 2132-optical axis segment; 2133-a threaded segment; 220-a sub-clip lower module; 221-sub clip lower plate; 2211-bumps; 2212-positioning pin holes; 222-a carrier plate;

300-a connector; 310-male head; 320-female head; 321-plug pins.

Detailed Description

The terminology used in the description of the embodiments of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the application, as the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

The server comprises a case and a mainboard arranged in the case, wherein the mainboard needs to perform Functional Test (FT) or Boundary scan test (BSI) to ensure the quality and function of the mainboard. The test equipment comprises external equipment and an interface butt joint structure, wherein the interface butt joint structure is used for butt joint of an interface of the mainboard, and the external equipment is used for realizing the test function of the test equipment.

Because the interface butt joint structure of the existing test equipment is fixed in position and structure, on one hand, the test equipment can only test one type of mainboard, namely, when the interface of the mainboard changes, new test equipment needs to be manufactured, so that the application range of the test equipment is small, and the utilization rate of universal resources in the test equipment is low; on the other hand, the tolerance chain of the interface docking structure of the test equipment is long, and the docking precision of the interface docking structure and the mainboard interface is affected.

Based on this, this application embodiment provides a circuit board test equipment. The circuit board testing equipment comprises a universal testing platform, a sub-clamp module and a connector. The circuit board testing device is characterized in that the sub-clamp module comprises a sub-clamp upper module and a sub-clamp lower module, the sub-clamp upper module and the sub-clamp lower module are arranged oppositely, and one surface of the sub-clamp lower module facing the sub-clamp upper module is used for arranging a circuit board to be tested; meanwhile, the sub-clamp module is detachably arranged in the universal test platform, and the sub-clamp module is connected with the universal test platform through the connector, so that on one hand, the sub-clamp module is conducted with the universal test platform, and therefore the universal resource on the universal test platform can be used for testing the circuit board to be tested in the sub-clamp module. On the other hand, the circuit board testing equipment can test different types of circuit boards by replacing the sub-clamp module, so that the application range of the circuit board testing equipment is expanded, and the utilization rate of universal resources in the circuit board testing equipment is improved; and corresponding circuit board test equipment does not need to be manufactured aiming at each circuit board, thereby being beneficial to saving the cost.

In addition, the circuit board test equipment's that this application embodiment provided goes up module on the sub-clamp includes sub-clamp upper plate and floating panel, and floating panel is used for with the circuit board butt joint that awaits measuring of placing module under the sub-clamp. Through the one side of the mobilizable setting of panel that will float at sub-clamp upper plate orientation sub-clamp lower module to can fuse circuit board test equipment's interface butt joint structure's tolerance chain, and then make interface butt joint structure can the interface of the adaptation circuit board that awaits measuring that floats, be favorable to improving the butt joint precision.

The specific structure of the circuit board testing device will be described in detail below with reference to the accompanying drawings.

The embodiment of the application provides a circuit board testing device, which is used for performing Functional Test (FT) or Boundary scan test (BSI) on a circuit board to ensure the quality and the function of the circuit board. The circuit board includes, but is not limited to, a server motherboard, a backplane, a switch board, and the like. The circuit board test equipment provided by the embodiment of the application mainly takes a server mainboard as a circuit board to be tested for explanation.

The circuit board test equipment that this application embodiment provided includes general test platform, sub-clamp module and connector, and sub-clamp module detachable sets up in general test platform, and sub-clamp module and general test platform pass through the connector and connect.

Referring to fig. 1, the universal test platform according to the embodiment of the present application includes a cabinet 110, a sub-clip module 200 may be detachably disposed in the cabinet 110, and a connector 300 may be disposed between the cabinet 110 and the sub-clip module 200. In a specific application, the sub-clip module 200 may be detached from the cabinet 110, or may be installed in the cabinet 110, and is connected to the cabinet 110 through the connector 300. Because the sub-clip module 200 is used for being butted with the circuit board to be tested, the purpose of testing different circuit boards to be tested by the general test platform can be realized by replacing different sub-clip modules 200, so that the application range of the general test platform is enlarged, the utilization rate of the general test platform is improved, and the cost is saved.

The cabinet 110 may include a frame structure, which may include a quadrangular bottom frame, a quadrangular top frame, and four pillars correspondingly connecting four corners of the bottom frame and four corners of the top frame. The cabinet body 110 may also include a bottom wall, a top wall, a front wall, a rear wall, a left side wall and a right side wall, the bottom wall and the top wall set up bottom surface and top surface at frame construction respectively along the direction of height of the cabinet body 110, the depth direction of the front wall and the rear wall along the cabinet body 110 sets up respectively in front and at the back of frame construction, the left side wall and the right side wall set up respectively at frame construction's left surface and right surface along the width direction of the cabinet body 110, so that the bottom wall, the top wall, the front wall, the rear wall, the left side wall and the right side wall enclose the cabinet body 110 with closed accommodation chamber jointly.

The accommodating cavity of the cabinet 110 may be divided into an upper cavity 111 and a lower cavity along the height direction of the cabinet 110, and the sub-clip module 200 may be disposed in the upper cavity 111 of the cabinet 110. The separation plate can be arranged between the upper cavity 111 and the lower cavity, and not only can support the sub-clamp module 200 and the like arranged in the upper cavity 111, but also can protect parts, components or devices and the like arranged in the lower cavity.

In a possible implementation manner, a part of the front wall, the rear wall, the left side wall, and the right side wall of the upper cavity 111 may be set as a transparent wall, and another part of the front wall may be set as a non-transparent wall, for example, the whole front wall or the upper part of the front wall of the upper cavity 111 may be set as a transparent wall, and the rest of the walls of the upper cavity 111 may be set as non-transparent walls, so that when a circuit board to be tested is located in the sub-clip module 200 of the upper cavity 111 for testing, the test condition inside the upper cavity 111 is conveniently observed. In other possible implementation manners, the front wall, the rear wall, the left side wall, and the right side wall of the upper cavity 111 may be set as transparent wall surfaces according to actual needs; alternatively, the front wall, the rear wall, the left side wall and the right side wall of the upper cavity 111 may be set as non-transparent wall surfaces according to actual needs. Wherein, the transparent wall surface comprises but is not limited to at least one of a glass wall surface, a plastic wall surface and an acrylic wall surface; the non-transparent wall includes, but is not limited to, at least one of an aluminum alloy wall, a stainless steel wall, a plastic wall, and a carbon fiber wall.

In one possible implementation, the front wall of the upper cavity 111 may include two portions, namely, an upper front wall 1111 and a lower front wall 1112, the upper front wall 1111 and the lower front wall 1112 are adjacently disposed along a height direction of the cabinet 110, and the upper front wall 1111 is located above the lower front wall 1112. The lower front wall 1112 may correspond to a region where the sub-clip module 200 is hidden, the upper front wall 1111 may correspond to a region above the sub-clip module 200, the upper front wall 1111 may be a transparent wall, and the lower front wall 1112 may be a non-transparent wall. The upper front wall 1111 may be provided as a cabinet door structure that can be opened and closed, for example, a single door structure opened from one side, or a double door structure opened from the middle. The lower front wall 1112 may be configured to be pushed and pulled open in a depth direction of the cabinet 110.

In a possible implementation manner, at least one of the rear wall, the left side wall and the right side wall of the upper cavity 111 may be provided as an openable and closable cabinet door structure. For example, the left or right side wall of the upper cavity 111 may be configured as a single-door structure opened from one side or a double-door structure opened from the middle according to actual needs. Thereby facilitating the installation, debugging and maintenance of the parts, components, devices, the sub-clip module 200 and the like arranged inside the upper cavity 111.

In a possible implementation manner, the front wall, the rear wall, the left side wall and the right side wall of the lower cavity can be all set to be non-transparent wall surfaces, so that parts, components, devices and the like arranged in the lower cavity can be shielded, and the appearance of the cabinet body 110 can be more attractive. In other possible implementation manners, the front wall, the rear wall, the left side wall and the right side wall of the lower cavity can be set as transparent wall surfaces according to actual needs; or, according to actual needs, a part of the front wall, the rear wall, the left side wall and the right side wall of the lower cavity may be set as a non-transparent wall, and the other part may be set as a transparent wall. Wherein, the transparent wall surface comprises but is not limited to at least one of a glass wall surface, a plastic wall surface and an acrylic wall surface; the non-transparent wall includes, but is not limited to, at least one of an aluminum alloy wall, a stainless steel wall, a plastic wall, and a carbon fiber wall.

At least one side wall surface of the front wall, the rear wall, the left side wall and the right side wall of the lower cavity can be set to be a cabinet door structure capable of being opened and closed. For example, the front wall of the lower cavity can be set to be a single-door structure which is opened from one side or a double-cabinet structure which is opened from two sides according to actual needs; alternatively, the left side wall or the right side wall of the lower cavity can be set to be a single-door structure opened from one side or a double-door structure split from the middle according to actual needs. Thereby being convenient for installing, debugging and maintaining parts, components, devices and the like arranged in the lower cavity.

The bottom of the cabinet body 110 may be provided with casters 112, for example, four casters 112 may be provided, and the four casters 112 may be respectively provided at four corners of the bottom surface of the cabinet body 110, so as to not only ensure the structural strength of the connection between the casters 112 and the cabinet body 110, but also ensure the stability of the cabinet body 110 supported by the casters 112. The casters 112 are arranged at the bottom of the cabinet 110, so that the cabinet 110 can move conveniently, and manpower is saved.

The bottom of the cabinet body 110 can be provided with the foot cup 113, for example, four foot cups 113 can be arranged, and the four foot cups 113 can be respectively arranged at four corners of the bottom surface of the cabinet body 110, so that not only the structural strength of the connection between the foot cup 113 and the cabinet body 110 can be ensured, but also the stability of the cabinet body 110 supported by the foot cup 113 can be ensured. The stability and the stationarity of the cabinet body 110 can be ensured by arranging the foot cup 113 at the bottom of the cabinet body 110.

The top surface of the cabinet 110 may be provided with an indicator light 114, and the indicator light 114 may include a plurality of colors, each color may represent a status of the circuit board testing device. For example, the indicator light 114 may include three colors of red, yellow, and green, the red light may indicate a fault alarm state of the circuit board testing device, the yellow light may indicate a standby state of the circuit board testing device, and the green light may indicate an operation state of the circuit board testing device.

Referring to fig. 2, the universal test platform according to the embodiment of the present application may further include a female clamp module 120, the female clamp module 120 is disposed in the cabinet 110, for example, the female clamp module 120 may be disposed in the upper cavity 111 of the cabinet 110, and two sides of the female clamp module 120 along the width direction of the cabinet 110 may be correspondingly connected to two opposite inner sidewalls of the cabinet 110 in the width direction. The sub-clamping module 200 is detachably connected to the main clamping module 120, so that the sub-clamping module 200 is detachably mounted in the cabinet 110 through the main clamping module 120. The connector 300 may be disposed between the sub-clip module 200 and the female clip module 120 so that the sub-clip module 200 and the female clip module 120 are connected by the connector 300.

The female clip module 120 may include a female clip upper module 121 and a female clip lower module 122, the female clip upper module 121 and the female clip lower module 122 are disposed in the cabinet 110 along a height direction of the cabinet 110, and the female clip upper module 121 is located above the female clip lower module 122. The sub-clip module 200 comprises a sub-clip upper module 210 and a sub-clip lower module 220, wherein the sub-clip upper module 210 is detachably connected with the main clip upper module 121, so that the sub-clip upper module 210 is detachably mounted in the cabinet body 110; the sub-clip lower module 220 is detachably connected to the main clip lower module 122, so that the sub-clip lower module 220 is detachably mounted in the cabinet 110.

Referring to fig. 3, the female clamp module 120 further includes a connecting shaft 123, one end of the female clamp upper module 121 close to the rear wall of the cabinet 110 is rotatably connected to one end of the female clamp lower module 122 close to the rear wall of the cabinet 110 through the connecting shaft 123, and the connecting shaft 123 extends along the width direction of the cabinet 110, so that the female clamp upper module 121 can be turned up or covered by rotating upward or downward around the rotating shaft relative to the female clamp lower module 122, thereby facilitating installation, debugging or maintenance of the female clamp lower module 122 or the sub-clamp lower module 220 disposed on the female clamp lower module 122.

For example, a plurality of first connecting lugs 1215 may be arranged at intervals on the lower edge of one end of the upper female clip die set 121 close to the rear wall of the cabinet 110, and first shaft holes are formed in the first connecting lugs 1215. A plurality of second connection lugs 1225 may be disposed at intervals at an upper edge of one end of the female clip lower module 122 close to the rear wall of the cabinet body 110, and a second shaft hole is disposed on the second connection lugs 1225. When the upper female-clamp module 121 and the lower female-clamp module 122 are assembled, the first shaft hole is aligned with the second shaft hole, and the rotating shaft penetrates through the first shaft hole and the second shaft hole so as to rotatably connect the upper female-clamp module 121 and the lower female-clamp module 122.

Referring to fig. 4, a clamping piece 1214 is disposed at one end of the mother clip upper module 121 close to the front wall of the cabinet 110, and a fitting piece 1224 is disposed at one end of the mother clip lower module 122 close to the front wall of the cabinet 110, when the mother clip upper module 121 rotates downwards around the rotation axis relative to the mother clip lower module 122 to cover the mother clip lower module 122, the clamping piece 1214 and the fitting piece 1224 are clamped with each other, so as to ensure the connection stability and reliability of the mother clip upper module 121 and the mother clip lower module 122, and further, to ensure the stability and reliability of the sub clip upper module 210 and the sub clip lower module 220 clamping the circuit board to be tested.

Illustratively, the engaging elements 1214 may include two engaging elements 1214, two engaging elements 1214 are respectively disposed on two sides of one end of the female clip upper module 121 near the front wall of the cabinet 110, correspondingly, the engaging elements 1224 may include two engaging elements 1224, two engaging elements 1224 are respectively disposed on two sides of one end of the female clip lower module 122 near the front wall of the cabinet 110, and the two engaging elements 1214 and the two engaging elements 1224 are respectively engaged with or disengaged from each other. The engaging member 1214 can be a hook, and the engaging member 1224 can also be a hook, both of which can be engaged with or disengaged from each other.

Referring to fig. 5, in one possible implementation, the female clip upper module 121 may include two guide grooves 1211, two guide grooves 1211 respectively disposed on two opposite inner sidewalls of the cabinet 110 in the width direction, for example, the two guide grooves 1211 may be respectively mounted on the two opposite inner sidewalls of the cabinet 110 in the width direction by a fastener such as a screw and extend in the depth direction of the cabinet 110, and two opposite sides of the female clip upper module 210 may be respectively received in the two guide grooves 1211 and slide along the guide grooves 1211. When the upper sub-clip module 210 is installed, the upper sub-clip module 210 may enter the guide groove 1211 from one end of the guide groove 1211, which is close to the front wall of the cabinet 110, and slide toward the rear wall of the cabinet 110 to be installed in place; when the upper sub-clip module 210 is detached, the upper sub-clip module 210 slides toward the front wall of the cabinet 110 and leaves the guide slot 1211 from the end of the guide slot 1211 close to the front wall of the cabinet 110. Alternatively, the engaging member 1214 may be disposed at an end of the guide groove 1211 close to the front wall of the cabinet 110.

In one possible implementation, the upper female clip module 121 may further include a fixing piece 1212, the fixing piece 1212 is disposed on the guide groove 1211, and the fixing piece 1212 is used for fixing the upper sub-clip module 210 when the upper sub-clip module 210 is installed in place. Optionally, the two guide grooves 1211 may be provided with a fixing member 1212, so as to fix the two opposite sides of the upper sub-clip module 210 mounted on the upper main clip module 121, thereby being beneficial to ensuring the stability and reliability of the upper sub-clip module mounted on the upper main clip module 121; alternatively, a fixing member 1212 may be provided on one of the guide grooves 1211 to fix one side of the sub-clip upper module 210 mounted on the main clip upper module 121, as required. Optionally, a fixing member 1212 may be disposed on one of the guide grooves 1211; alternatively, at least two fixing members 1212 may be provided on one guide groove 1211, and the at least two fixing members 1212 may be arranged at intervals along the extending direction of the guide groove 1211.

For example, the fixing member 1212 may be a fixing pin, the guide groove 1211 has an upper groove wall and a lower groove wall spaced apart from each other in a height direction of the cabinet 110, and pin holes are formed in the upper groove wall and the lower groove wall at opposite positions, and the fixing pin is inserted into the pin holes of the upper groove wall and the lower groove wall and can move up and down in the height direction of the cabinet 110. The side edges of the upper sub-clip module 210 corresponding to the guide grooves 1211 are provided with latch notches. In a specific application, the fixing pin is firstly pulled up along the height direction of the cabinet body 110, then the side edge of the upper sub-clip module 210 enters the guide groove 1211 from one end of the guide groove 1211 close to the front wall of the cabinet body 110, and is slidably installed in place along the guide groove 1211, and finally the fixing pin is pressed down along the height direction of the cabinet body 110, so that the fixing pin sequentially penetrates through the pin hole of the upper groove wall of the guide groove 1211, the pin notch of the side edge of the upper sub-clip module 210 and the pin hole of the lower groove wall of the guide groove 1211, and the upper sub-clip module 210 is fixed in the guide groove 1211.

In a possible implementation manner, the upper female-clip module 121 may further include a cross beam 1213, the cross beam 1213 is connected between two ends of the guide groove 1211 close to the rear wall of the cabinet 110, and the connector 300 may be disposed between the cross beam 1213 and one end of the upper sub-clip module 210 close to the cross beam 1213, so that the connector 300 is also connected when the upper sub-clip module 210 is slidably mounted in place along the guide groove 1211.

For example, the connector 300 may include a male connector 310 and a female connector 320, the female connector 320 may be disposed on the beam 1213, and the male connector 310 may be disposed on the sub-clip upper module 210, or the male connector 310 may be disposed on the beam 1213 and the female connector 320 may be disposed on the sub-clip upper module 210. When the sub-clip upper module 210 is slidably installed in place along the guide groove 1211, the male head 310 and the female head 320 are inserted; when the sub-clip upper module 210 is slidingly removed along the guide slots 1211, the male connector 310 and the female connector 320 are disengaged.

Referring to fig. 6, in one possible implementation, the female clip lower module 122 may include a bracket 1221, a lifting mechanism 1222 disposed above the bracket 1221, and a retractable plate 1223 disposed above the lifting mechanism 1222, and the female clip lower module 220 may be detachably placed above the retractable plate 1223.

Wherein, support 1221 can include the support 1221 bottom plate and connect the support 1221 curb plate in the relative both sides of support 1221 bottom plate, and two support 1221 curb plates set up respectively on two relative inside walls of the width direction of cabinet body 110, and is exemplary, and two support 1221 curb plates can be connected respectively on two relative inside walls of the width direction of cabinet body 110 through fasteners such as screws. Alternatively, the engagement members 1224 may be disposed at an end of the side panels of the rack 1221 adjacent the front wall of the cabinet 110.

The lifting mechanism 1222 may include a lifting motor 12221, a sliding rail 12222, a sliding guide 12223, and a lifting plate 12224, the lifting motor 12221 and the sliding rail 12222 may be both mounted on the bottom plate of the bracket 1221, and the sliding rail 12222 may extend in the depth direction of the cabinet 110. The sliding guide 12223 connects the sliding rail 12222 and an output shaft of the lifting motor 12221, and the sliding guide 12223 can be driven by the lifting motor 12221 to reciprocate along the sliding rail 12222. The sliding guide 12223 is provided with a guide slope obliquely extending in a depth direction of the cabinet 110, and the bottom surface of the lifting plate 12224 is provided with a roller supported on the guide slope and capable of rolling along the guide slope.

For example, one end of the guide slope near the front wall of the cabinet 110 may be higher than one end of the guide slope near the rear wall of the cabinet 110. When the sliding guide 12223 is moved toward the front wall of the cabinet 110 along the sliding rail 12222 by the driving of the lifting motor 12221, the roller moves downward along the guiding slope, and drives the lifting plate 12224 to descend; when the sliding guide 12223 is moved toward the rear wall of the cabinet 110 along the sliding rail 12222 by the driving of the lifting motor 12221, the roller moves upward along the guiding slope, and drives the lifting plate 12224 to ascend.

The expansion plate 1223 is disposed above the lifting plate 12224, and a sliding mechanism 12231 may be disposed between the expansion plate 1223 and the lifting plate 12224, so that the expansion plate 1223 may slide back and forth along the depth direction of the cabinet 110. For example, the sliding mechanism 12231 may include a slide and a slider, the slide and the slider are engaged with each other, the slider may be disposed on a surface of the expansion plate 1223 facing the expansion plate 12224, the slide may be disposed on a surface of the expansion plate 12224 facing the expansion plate 1223, the slide extends along a depth direction of the cabinet 110, and the slider is accommodated in the slide and may slide back and forth along the slide, so that the expansion plate 1223 may slide along the depth direction of the cabinet 110 to retract into the cabinet 110, or slide and extend from a side where a front wall of the cabinet 110 is located. Alternatively, the lower front wall 1112 may be attached to an end of the expansion panel 1223 proximate the front wall of the cabinet 110 so as to open as the expansion panel 1223 is extended and close as the expansion panel 1223 is retracted.

In one possible implementation, the extension and retraction of the retractable plate 1223 may be driven by a retractable motor, the lower front wall 1112 may be provided with a button, the button may be electrically connected to the retractable motor, and the button may be configured to control the extension and retraction of the retractable plate 1223.

In specific application, the sub-clamp module 200 is installed in place in the main clamp module 120, when a test is started, a key is pressed down, the expansion plate 1223 drives the sub-clamp lower module 220 to extend out from one side where the front wall of the cabinet body 110 is located, and a circuit board to be tested is placed on the sub-clamp lower module 220; when the key is pressed again, the expansion board 1223 carries the sub-clip lower module 220 and the circuit board to be tested on the sub-clip lower module 220 to retract into the cabinet 110. At this time, the lifting mechanism 1222 may drive the expansion plate 1223 to support the lower sub-clip module 220 and the circuit board to be tested on the lower sub-clip module 220 to ascend, so that the circuit board to be tested is butted in place with the upper sub-clip module 210, so as to test the circuit board to be tested. After the test is completed, the lifting mechanism 1222 may drive the retractable plate 1223 to support the lower sub-clip module 220 and the circuit board on the lower sub-clip module 220 to be lowered, so as to press the button, so that the retractable plate 1223 with the lower sub-clip module 220 and the circuit board on the lower sub-clip module 220 extends out from the side where the front wall of the cabinet 110 is located, so as to take out the circuit board.

Referring to fig. 7, the sub-clip module 200 includes a sub-clip upper module 210 and a sub-clip lower module 220, the sub-clip upper module 210 and the sub-clip lower module 220 are disposed opposite to each other, and a surface of the sub-clip lower module 220 facing the sub-clip upper module 210 is used for placing a circuit board to be tested.

Referring to fig. 8, the upper sub-clip set 210 includes an upper sub-clip plate 211 and a floating plate 212, the upper sub-clip plate 211 is detachably connected to the upper main clip set 121, two opposite side edges of the upper sub-clip plate 211 are exemplarily configured to be received in two guide grooves 1211 of the upper main clip set 121, and latch notches may be disposed at two opposite side edges of the upper sub-clip plate 211. The floating panel 212 is movably disposed on one surface of the sub-clip upper plate 211 facing the sub-clip lower module 220, an interface docking structure 2121 is disposed on one surface of the floating panel 212 facing the sub-clip lower module 220, and the interface docking structure 2121 is configured to dock with a circuit board to be tested placed on the sub-clip lower module 220. Various devices for testing can be arranged on the surface of the sub-clip upper plate 211, which is far away from the floating panel 212; the side of the sub-clip upper plate 211 facing the floating panel 212 and not covered by the floating panel 212 may also be provided with various devices for testing. Alternatively, the male connector 310 or the female connector 320 of the connector 300 is disposed at an end of the sub-clip upper plate 211 near the rear wall of the cabinet 110.

With continued reference to fig. 8, in one possible implementation, a side of floating panel 212 facing sub-clip lower module 220 is provided with positioning pins 2122, and a side of sub-clip lower module 220 facing floating panel 212 is provided with positioning pin holes 2212 matched with positioning pins 2122; in other possible implementations, a side of the floating panel 212 facing the sub-clip lower module 220 is provided with positioning pin holes 2212, and a side of the sub-clip lower module 220 facing the floating panel 212 is provided with positioning pins 2122 matched with the positioning pin holes 2212. The positioning pins 2122 and the positioning pin holes 2212 are in clearance fit, so that smooth butt joint of the sub-clamp lower module 220 and the floating panel 212 is ensured, and the butt joint stability and reliability of the panel to be detected on the sub-clamp lower module 220 and the floating panel 212 are ensured; and the floating panel 212 is favorable for floating, and the positioning pins 2122 and the positioning pin holes 2212 can still be smoothly butted.

With continued reference to fig. 8, in one possible implementation, a side of floating panel 212 facing sub-clip lower die set 220 is provided with a stop protrusion 2123, and stop protrusion 2123 is configured to be supported between floating panel 212 and sub-clip lower die set 220. For example, the limiting protrusion 2123 may include a plurality of limiting protrusions 2123, and the plurality of limiting protrusions 2123 may be arranged at intervals in the circumferential direction of the floating panel 212; the stopper protrusion 2123 may have a cylindrical shape. In a specific application, when the circuit board to be tested on the sub-clip lower module 220 is butted with the floating panel 212, the limiting protrusion 2123 is supported between the floating panel 212 and the sub-clip lower module 220, so that the interface on the circuit board to be tested and the interface butting structure 2121 on the floating panel 212 can be protected, and the interface on the circuit board to be tested and the interface butting structure 2121 on the floating panel 212 are prevented from being extruded and damaged.

With continued reference to fig. 8, in one possible implementation, a surface of the sub-clip upper plate 211 facing the sub-clip lower module 220 is provided with a plurality of supporting legs 2111, and the supporting legs 2111 may have a cylindrical structure. The supporting legs 2111 are arranged at intervals along the circumferential edge of the upper plate 211 of the sub-clip, and the length of the extending of the supporting legs 2111 is not less than the maximum distance between the surface of the floating panel 212 facing away from the upper plate 211 of the sub-clip and the upper plate 211 of the sub-clip. Thus, when the upper sub-clip assembly 210 is placed on the table top, the support legs 2111 can support the upper sub-clip plate 211 to avoid crushing the devices on the side of the upper sub-clip plate 211 facing the floating panel 212 and the interface docking structure 2121 on the floating panel 212.

With continued reference to fig. 8, in one possible implementation, a handle 2112 is provided at an end of the sub-clip upper plate 211 facing the front wall of the cabinet 110, so that an operator can grasp the handle 2112 to pull the sub-clip upper module 210 out of the main clip upper module 121 or push the sub-clip upper module 210 into the main clip upper module 121.

Referring to fig. 9, the sub-clip upper module 210 may further include a connector 213, and the floating panel 212 and the sub-clip upper plate 211 are movably connected by the connector 213. In a possible implementation manner, the connecting member 213 includes a stopping portion 2131, an optical axis section 2132 and a threaded section 2133, which are sequentially connected and have gradually reduced radial dimensions, one of the sub-clip upper plate 211 and the floating panel 212 is provided with a through hole, the other one of the sub-clip upper plate 211 and the floating panel 212 is provided with a threaded hole, the optical axis section 2132 is in clearance fit with the through hole, the axial dimension of the optical axis section 2132 is greater than the axial dimension of the through hole, and the threaded section 2133 is in threaded connection with the threaded hole, so that not only the floating panel 212 can move in a direction perpendicular to the sub-clip upper plate 211, but also the floating panel 212 can move in a direction parallel to the sub-clip panel, and further, the interface docking structure 2121 on the floating panel 212 can be floatingly fitted to the interface of the circuit board to be tested, so as to improve the docking accuracy.

For example, a through hole penetrating through the upper sub-clip plate 211 may be formed in the upper sub-clip plate 211, a threaded hole may be formed in the floating panel 212, the connecting member 213 is inserted into the through hole and the threaded hole, so that the threaded section 2133 is in threaded connection with the threaded hole, the optical axis section 2132 is in clearance fit with the through hole, and the stop portion 2131 overlaps with a surface of the upper sub-clip plate 211 that faces away from the floating panel 212. At this time, the axial dimension of the optical axis segment 2132 is larger than the thickness of the sub clip upper plate 211, and the radial dimension of the optical axis segment 2132 is smaller than the radial dimension of the through hole.

In one possible implementation, the floating panel 212 moves in a direction perpendicular to the sub-clip upper plate 211 by a distance ranging from 0.4mm to 0.6mm. For example, the distance that the floating panel 212 moves in the direction perpendicular to the upper board 211 of the sub-clip may be set to 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, or any value between 0.4mm and 0.6mm according to actual needs. In other possible implementations, the range of the distance that the floating panel 212 moves in the direction perpendicular to the sub-clip upper plate 211 may be a range less than 0.4mm, for example, 0.3mm or 0.35mm, etc.; alternatively, it may be in a range of more than 0.6mm, for example, 0.65mm or 0.7mm, etc.

In one possible implementation, the floating panel 212 moves in a direction parallel to the sub-clip upper plate 211 by a distance ranging from 0.4mm to 0.6mm. For example, the distance that the floating panel 212 moves in the direction parallel to the upper board 211 of the sub-clip may be set to 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, or any value between 0.4mm and 0.6mm according to actual needs. In other possible implementations, the range of the distance that the floating panel 212 moves in the direction parallel to the sub-clip upper plate 211 may be a range of less than 0.4mm, for example, 0.3mm or 0.35mm, etc.; alternatively, it may be in a range of more than 0.6mm, for example, 0.65mm, 0.7mm, or the like. It is understood that the direction parallel to the sub-clip upper plate 211 includes, but is not limited to, a width direction of the cabinet 110 and a depth direction of the cabinet 110.

Referring to fig. 10, the sub-clip lower module 220 includes a sub-clip lower plate 221 and a carrier plate 222, and the carrier plate 222 is disposed on a surface of the sub-clip lower plate 221 facing the sub-clip upper module 210. For example, a protrusion 2211 may be disposed on an edge of the sub-clip lower plate 221 facing the carrier plate 222, and an avoiding notch may be disposed on an edge of the carrier plate 222, where the protrusion 2211 is received when the carrier plate 222 is mounted on the sub-clip lower plate 221, so as to position the carrier plate 222. Alternatively, when the floating panel 212 is provided with the positioning pins 2122, the positioning pin holes 2212 to be fitted with the positioning pins 2122 may be provided on the sub-clip lower plate 221, for example, on the projections 2211 of the sub-clip lower plate 221; alternatively, when the floating panel 212 is provided with the positioning pin holes 2212, the positioning pins 2122 fitted to the positioning pin holes 2212 may be provided on the sub-clip lower plate 221, for example, on the projections 2211 of the sub-clip lower plate 221. The carrier plate 222 may be fixed to the sub-clip lower plate 221 by pins.

The side of the carrier 222 facing the module 210 is used for placing a circuit board to be tested. Optionally, a positioning element may be disposed on a surface of the carrier plate 222 facing the sub-clip upper module 210, and the positioning element may position the circuit board to be tested on the carrier plate 222. For example, the positioning element may be a positioning protrusion, and the circuit board to be tested is provided with a positioning gap, and when the circuit board to be tested is placed on the carrier plate 222, the positioning protrusion is received in the positioning gap.

Referring to fig. 11, the connector 300 may be a heavy-duty connector, the heavy-duty connector includes a male connector (not shown) and a female connector 320, one of the universal test platform and the upper module of the sub-clip is provided with the male connector, the other one is provided with the female connector, and when the upper module of the sub-clip is installed in the universal test platform, the male connector and the female connector are plugged into each other. The heavy-duty connector can provide real-time communication between the module on the sub-clip and the universal test platform.

For example, the female head 320 may be movably disposed on the female clip upper module, so that the female head 320 may float along the height direction and the width direction of the cabinet, and the floating gap range of the female head 320 along the height direction and the width direction of the cabinet may be set to be 0.4mm to 0.6mm, for example, any value between 0.4mm, 0.5mm, 0.6mm, or 0.4mm to 0.6mm. The male head can be fixedly arranged on the upper module of the sub-clip. When the upper module of the sub-clamp is installed in place in the upper module of the main clamp, the male head and the female head are mutually inserted. Optionally, one of the female head and the male head may be provided with an insertion pin 321, the other may be provided with an insertion pin hole, and the male head and the female head realize positioning insertion through the cooperation of the insertion pin 321 and the insertion pin hole.

Referring to fig. 12, in one possible implementation, the connector 300 is a heavy-duty connector, and the interfaces of the heavy-duty connector can be divided into 6 groups (A, B, C, D, E, F), where each group is defined fixedly and can be left empty but cannot be interchanged to ensure design normalization. Illustratively, the definition of the 6 sets of interfaces for a heavy-duty connector is as follows:

in a possible implementation manner, the universal test platform may further include a programmable logic controller and a control computer, and the programmable logic controller is disposed in the cabinet and is used for controlling the controllable devices in the cabinet. The control computer is arranged outside the cabinet body, and exemplarily, the control computer can be connected to the outer surface of the cabinet body, or the control computer can be arranged at a position having a preset distance with the cabinet body and is in communication connection with the cabinet body, and the control computer is used for presenting an interface of the programmable logic controller. The control computer includes, but is not limited to, an industrial control computer. The programmable logic controller and the control computer are used as universal resources on the universal test platform and can be used when the circuit board test equipment replaces any sub-clamp module and tests the circuit board, so that the utilization rate of the universal resources is improved, and the cost is reduced.

In a possible implementation manner, the universal test platform may further include a switch, a Video Graphics Array (abbreviated VGA) acquisition card, a Light-emitting Diode (abbreviated LED) test component, and a Central Processing Unit (abbreviated CPU) heat dissipation component, which are arranged in the cabinet body, wherein the switch is used for connecting the network port, the VGA acquisition card and the LED test component are respectively used for testing corresponding devices on the circuit board to be tested, and the CPU heat dissipation component is used for dissipating heat from the CPU on the circuit board to be tested. The switch, the VGA acquisition card, the LED test assembly and the CPU heat dissipation assembly are used as universal resources on a universal test platform, and can be selectively called when any sub-clamp module 200 is replaced and a circuit board is tested by circuit board test equipment, so that the utilization rate of the universal resources is improved, and the cost is reduced.

The vertical, numerical and numerical ranges related to the embodiments of the present application are approximate values, and a certain range of errors may exist due to the influence of the manufacturing process, and the error can be considered to be ignored by those skilled in the art.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto. Although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: it is also possible to modify the solutions described in the previous embodiments or to substitute some or all of them with equivalents. And these modifications or substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. The circuit board testing equipment is characterized by comprising a universal testing platform, a sub-clamp module and a connector;

the sub-clamp module is detachably arranged in the general test platform, and the sub-clamp module is connected with the general test platform through a connector;

the circuit board testing device comprises a sub-clamp module, a testing module and a testing module, wherein the sub-clamp module comprises a sub-clamp upper module and a sub-clamp lower module, the sub-clamp upper module and the sub-clamp lower module are oppositely arranged, and one surface of the sub-clamp lower module, which faces to the sub-clamp upper module, is used for placing a circuit board to be tested; and an interface butt joint structure is arranged on the upper module of the sub-clamp and is in adaptive connection with an interface on the circuit board to be tested.

2. The apparatus for testing circuit boards according to claim 1, wherein the sub-clip upper module comprises a sub-clip upper plate and a floating panel movably disposed on a side of the sub-clip upper plate facing the sub-clip lower module;

one side of the floating panel, which faces the sub-clamp lower module, is provided with the interface butt joint structure, and the interface butt joint structure is used for being in butt joint with an interface on a circuit board to be tested, which is placed on the sub-clamp lower module in a matched mode.

3. The circuit board testing apparatus of claim 2, wherein the sub-clip upper module further comprises a connector, and the floating panel and the sub-clip upper plate are movably connected by the connector.

4. The circuit board testing apparatus of claim 3, wherein the connecting member comprises a stopper portion, an optical axis section and a threaded section, which are connected in sequence and have gradually reduced radial dimensions;

one of the sub-clip upper plate and the floating panel is provided with a through hole, the other one of the sub-clip upper plate and the floating panel is provided with a threaded hole, the optical axis section is in clearance fit with the through hole, the axial size of the optical axis section is larger than that of the through hole, and the threaded section is in threaded connection with the threaded hole.

5. The apparatus for testing a circuit board according to claim 2, wherein one of the floating panel and the sub-clip lower module is provided with a positioning pin, and the other is provided with a positioning pin hole, and the positioning pin hole are in clearance fit.

6. The circuit board testing device according to claim 2, wherein a surface of the floating panel facing the sub-clip lower module is provided with a limiting protrusion for being supported between the floating panel and the circuit board to be tested.

7. The circuit board testing device according to claim 2, wherein a plurality of supporting legs are arranged on one surface of the sub-clip upper plate facing the sub-clip lower module, and are arranged at intervals along the circumferential edge of the sub-clip upper plate;

the length of the support leg extension is not less than the maximum distance between one surface of the floating panel departing from the upper plate of the sub-clamp and the upper plate of the sub-clamp.

8. The circuit board testing device according to any one of claims 1 to 7, wherein the universal testing platform comprises a cabinet body and a female clamp module, the female clamp module comprises a female clamp upper module and a female clamp lower module, the female clamp upper module and the female clamp lower module are arranged in the cabinet body along the height direction of the cabinet body, and the female clamp upper module is positioned above the female clamp lower module;

the upper sub-clamp module is detachably mounted in the cabinet body through the upper main clamp module, and the lower sub-clamp module is detachably mounted in the cabinet body through the lower main clamp module.

9. The circuit board testing device according to claim 8, wherein the female clamp upper die set comprises two guide grooves and a fixing piece arranged on the guide grooves, the two guide grooves are respectively arranged on two opposite inner side walls in the width direction of the cabinet body and extend along the depth direction of the cabinet body;

the two opposite sides of the sub-clip upper module are respectively accommodated in the two guide grooves and slide along the guide grooves;

the fixing piece is used for fixing the sub-clamp upper module when the sub-clamp upper module is installed in place.

10. The circuit board testing device according to claim 8, wherein the lower female clip module comprises a bracket, a lifting mechanism and a retractable plate, the bracket is connected to two opposite inner side walls in the width direction of the cabinet body, the lifting mechanism is arranged above the bracket, the retractable plate is arranged above the lifting mechanism, and the lower sub-clip module is detachably placed above the retractable plate;

the telescopic plate is connected with the lifting mechanism in a sliding manner, and the telescopic plate slides back and forth along the depth direction of the cabinet body;

the lifting mechanism drives the telescopic plate to move up and down.

11. The circuit board testing apparatus of claim 8, wherein the universal test platform further comprises a programmable logic controller and a control computer, the programmable logic controller being disposed in the cabinet and configured to control the controllable devices in the cabinet; the control computer is arranged outside the cabinet body and is used for presenting an interface of the programmable logic controller;

and/or the presence of a gas in the atmosphere,

the universal test platform further comprises a switch, a VGA acquisition card, an LED test assembly and a CPU heat dissipation assembly, wherein the switch, the VGA acquisition card, the LED test assembly and the CPU heat dissipation assembly are arranged in the cabinet body, the switch is used for connecting a network port, the VGA acquisition card and the LED test assembly are respectively used for testing corresponding devices on the circuit board to be tested, and the CPU heat dissipation assembly is used for dissipating heat of a CPU on the circuit board to be tested.

12. The apparatus for testing circuit boards according to any one of claims 1 to 7 wherein the connector is a heavy duty connector comprising a male head and a female head, one of the universal test platform and the sub-clip on module being provided with the male head and the other being provided with the female head;

when the upper module of the sub-clamp is installed in the general test platform, the male head and the female head are mutually inserted.

13. The device for testing circuit boards according to any one of claims 1-7, wherein the sub-clip lower module comprises a sub-clip lower board and a carrier board, the carrier board is arranged on a side of the sub-clip lower board facing the sub-clip upper module, and a side of the carrier board facing the sub-clip upper module is used for placing a circuit board to be tested.

14. The apparatus for testing circuit boards according to claim 13, wherein a positioning member is disposed on a surface of the carrier board facing the module on the sub-clip, and the positioning member is used for positioning a circuit board to be tested placed on the carrier board.