CN115383622A - Split type universal joint for polishing head and polishing device - Google Patents
Split type universal joint for polishing head and polishing device Download PDFInfo
- Publication number
- CN115383622A CN115383622A CN202210424345.4A CN202210424345A CN115383622A CN 115383622 A CN115383622 A CN 115383622A CN 202210424345 A CN202210424345 A CN 202210424345A CN 115383622 A CN115383622 A CN 115383622A
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- China
- Prior art keywords
- polishing
- polishing head
- split type
- connecting structure
- universal joint
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a split type universal joint for a polishing head and a polishing device, wherein the polishing head is provided with a connecting disc and a polishing part, the connecting disc is provided with a pore channel, the polishing part is provided with a base, and the split type universal joint comprises a guide part and is suitable for floating up and down in the pore channel; the fixing part is suitable for being fixedly connected with the base; the connecting structure is connected between the guide part and the fixing part and is respectively fixedly connected with the guide part and the fixing part, and the guide part is suitable for swinging relative to the fixing part through the connecting structure. Because it is split type design, the processing degree of difficulty has been reduced, and the rejection rate has also reduced plastic deformation and cracked risk even.
Description
Technical Field
The invention relates to a universal joint for a polishing head, in particular to a split type universal joint for the polishing head and a polishing device.
Background
In the process of manufacturing integrated circuits, it is inevitable to deposit several layers of stacked structures of different materials on a wafer. This results in irregularities on the wafer surface. The irregular wafer surface can cause some lithographic process problems such as insufficient depth of focus (DOF) and image transfer bias. Therefore, in the fabrication of integrated circuits, it is often necessary to planarize irregular surfaces of the wafer with a planarization technique, such as a CMP technique.
The CMP technique is to press a wafer to be polished face down onto a polishing pad (polishing pad), the wafer to be polished is fixed by a disk-shaped mechanism called a polishing head (carrier head), during the polishing stage, the polishing head drives the wafer to be polished to rotate by a fixed shaft, and the polishing pad rotates by another rotating shaft, and then the dielectric layer or metal layer to be removed on the wafer surface is polished by a chemical or mechanical method. The current popular polishing head design is a floating head design that utilizes a flexible membrane (backing plate) to hold a wafer support plate or backing plate under a pedestal. During the polishing phase, gas may be used to pressurize the wafer support plate to evenly distribute the downforce applied to the wafer back.
A common problem encountered in the early CMP processes was that the pattern distribution and the height and drop on the surface of the wafer to be polished are not uniform, and thus, the force applied to the wafer during polishing tends to vary greatly.
Later to address this problem, polishing heads were modified. The modified polishing head is shown in figure 1 as a multi-zone bladder configuration. Generally consisting of a connection disc 1a, a flexible membrane polishing portion and a rotary seal ring 3a connecting the two. The connecting disc 1a is fixedly connected with a rotating shaft of the polishing head, and a hole 10a is formed in the center of the connecting disc 1 a. The flexible membrane polishing portion comprises a base 2a, a flexible air bag 5a positioned at the lower opening of the base 2a, and a universal joint 4a which is positioned in the upper opening of the base 2a and fixedly mounted with the base, wherein the universal joint is usually made of metal, the universal joint 4a extends into the hole 10a of the connecting disc 1a in an inverted T shape, and can move downwards or upwards in the hole 10a when the rotary sealing ring 3a is inflated or contracted in vacuum, so that the force exerted on the wafer 6a by the polishing head is uniform. The gimbal 3a can also compensate for the non-parallelism difference between the polishing head portion and the polishing pad portion by its own elastic deformation.
As shown in fig. 2, when the bottom surface of the wafer 6a is not parallel, the land 1a will deflect relative to the base 2a, and the land 1a will abut against the gimbal 4a, so that the gimbal 4a is stressed at the corner (e.g., the circle in fig. 2) and is easily subjected to plastic deformation or even cracking. And because it is integral type T type structure, the processing degree of difficulty is great, and the processing cost is higher, and the replacement cost is also higher correspondingly.
Disclosure of Invention
The invention aims to overcome the defects that in the prior art, the universal joint is T-shaped, the processing difficulty is high, and the polishing head is easy to deform plastically or even crack at the corner in the using process, so that the polishing head fails, thereby providing the split type universal joint for the polishing head and the polishing device, which are easy to process and difficult to deform plastically or even crack.
The invention provides a split type universal joint for a polishing head, wherein the polishing head is provided with a connecting disc and a polishing part, a pore passage is arranged on the connecting disc, the polishing part is provided with a base, and the split type universal joint comprises:
the guide part is suitable for floating up and down in the pore channel;
the fixing part is suitable for being fixedly connected with the base;
the connecting structure is connected between the guide part and the fixing part and is respectively fixedly connected with the guide part and the fixing part, and the guide part is suitable for swinging relative to the fixing part through the connecting structure.
Optionally, the connecting structure is a flexible structure, one end of the flexible structure is connected with the guide portion, and the other end of the flexible structure is connected with the fixing portion.
Optionally, one end of the connecting structure is detachably connected with the guide portion, and the other end of the connecting structure is detachably connected with the fixing portion.
Optionally, a first connection hole is formed in the fixing portion, and one end of the connection structure is embedded in the first connection hole and connected with the first connection hole through an elastic ring; and/or the lower end of the guide part is provided with a second connecting hole, and the other end of the connecting structure is embedded into the second connecting hole and is connected with the second connecting hole through an elastic ring.
Optionally, the connecting structure is made of rubber.
Optionally, the outer side of the connecting structure is provided with a tooth-shaped protrusion.
Optionally, the guide is made of a metal material.
Optionally, the fixing portion is made of metal.
Optionally, the fixing portion and the connecting structure are integrally formed.
The invention also provides a polishing device which comprises the split type universal joint for the polishing head.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic cross-sectional view of a prior art polishing apparatus including a gimbal;
FIG. 2 is a schematic view of the connection pad when tilted relative to the base;
FIG. 3 is a schematic sectional view of a polishing apparatus including a split type gimbal for a polishing head provided in an embodiment of the present invention;
fig. 4 is a schematic view of a second embodiment of a split-type gimbal for a polishing head.
Description of the reference numerals
1. A connecting disc; 10. a duct; 2. a base; 3. rotating the seal ring; 4. a split universal joint; 40. a guide portion; 41. a connecting structure; 42. a fixed part; 43. a protrusion; 46. a first clamping rod; 47. a second clamping rod; 48. an elastic ring; 5. a polishing section; 6. a wafer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly unless otherwise explicitly specified or limited. For example, it can be a fixed link, it can be detachable, or it can be integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to FIG. 3, a cross-sectional view of a polishing apparatus including a split type gimbal for a polishing head is shown. The polishing head is a multi-zone air bag structure and comprises a connecting disc 1 and a polishing part 5 which are connected through a rotary sealing ring 3. The connecting disc 1 is fixedly connected with a rotating shaft of the machine table, and a hole 10 is formed in the middle of the connecting disc. The polishing part 5 comprises a base 2, and the split type universal joint 4 is fixed on the base 2. When the rotary seal ring 3 is inflated, the base 2 moves downward relative to the connection plate 1, and the segment joint 4 moves downward in the bore 10. When the rotary seal ring 3 is vacuum shrunk, the base 2 moves upward relative to the connecting disc 1, and the split type universal joint 4 moves upward in the hole 10. When the surface flatness of the wafer 6 is poor, the connection plate 1 and the base 2 may be relatively tilted, resulting in the split type gimbal 4 being squeezed.
In the first embodiment, the split type universal joint 4 has an inverted T-shaped structure as a whole, and includes the fixing portion 42, the connecting structure 41, and the guide portion 40. The fixing portion 42 is fixedly connected to the base 2. The fixing portion 42 and the guide portion 40 are cylindrical, are made of metal, and have the advantages of simple shape, convenience in processing, low processing cost and low defect rate.
The connecting structure 41 is connected between the guiding portion 40 and the fixing portion 42 and is respectively fixedly connected with the guiding portion 40 and the fixing portion 42, and the guiding portion 40 can swing relative to the fixing portion 42 through the connecting structure 41. In this embodiment, the connection structure 41 is a flexible structure and made of rubber so as to obtain better elasticity, and when the connection disc 1 and the base 2 are not parallel to each other to a large extent, the connection structure 41 can absorb the force applied by the connection disc 1 to the guide portion 40, so as to protect the fixing portion 42 and the guide portion 40 from a large external force, and further avoid phenomena such as cracking and plastic deformation. Specifically, when the connecting disc 1 inclines relative to the base 2, the connecting disc 1 abuts against the guide portion 40, the guide portion 40 transmits the force applied by the connecting disc 1 to the connecting structure 41 connected thereto, the connecting structure 41 is elastically deformed and deformed to one side, and the guide portion 40 connected thereto is driven to swing relative to the fixing portion 42. Of course, the flexible structure may be made of other flexible materials. The toothed projections 43 are arranged on the outer side of the flexible structure, so that the deformation resistance of the split type universal joint 4 can be reduced, and the adaptability to the surface unevenness of the wafer 6 is better.
One end of the flexible structure is detachably connected with the fixing portion 42, and the other end is detachably connected with the guide portion 40. The flexible structure is detachably connected, so that subsequent replacement can be facilitated. Specifically, be equipped with first connecting hole on the fixed part 42, flexible construction's one end is equipped with first kelly 46, first kelly 46 with first connecting hole joint, be equipped with the second connecting hole on the guide part 40, the last second kelly 47 that is equipped with of flexible construction, the second kelly 47 with second connecting hole joint. The guide portion 40 and the connecting structure 41 can float up and down in the duct 10.
When the rotary seal ring 3 is inflated, the segment joint 4 moves downward together with the base 2, and accordingly, the guide portion 40 and the connecting structure 41 move downward in the duct 10. When the rotary seal ring 3 is vacuum shrunk, the segment joint 4 moves upward together with the base 2, and accordingly, the guide portion 40 and the connecting structure 41 move upward in the duct 10. When the surface of the wafer 6 has unevenness, the connecting disc 1 and the base 2 will not be parallel any more, the two will incline relatively, the connecting disc 1 will abut against the split-type gimbal 4, and the inclination between the two is achieved by the swinging of the connecting structure 41. When the connecting structure 41 undergoes multiple swings, the deformation ratio is large, and the connecting structure is no longer suitable for use, the connecting structure can be directly detached and replaced.
In the first embodiment, the first connecting hole may also be provided on the flexible structure, and accordingly, the first locking rod 46 may be provided on the fixing portion 42, and the second connecting hole may also be provided on the flexible structure, and accordingly, the second locking rod 47 may be provided on the guide portion 40. This is an alternative that is easily imaginable to the skilled person and is intended to be within the scope of the present disclosure.
As shown in fig. 4, the split type universal joint 4 includes a guide portion 40, a fixing portion 42, and a connecting structure 41. All three are made of metal. The fixing portion 42 is provided with a first connecting hole, an elastic ring 48 is arranged in the fixing portion, the first clamping rod 46 of the connecting structure 41 is clamped in the first connecting hole through the elastic ring 48, the lower end of the guide portion 40 is provided with a second connecting hole, the elastic ring 48 is arranged in the second connecting hole, and the second clamping rod 47 of the connecting structure 41 is embedded in the second connecting hole through the elastic ring 48. Due to the arrangement of the elastic ring 48, the split-type universal joint 4 can swing relatively greatly in the hole 10, so that the split-type universal joint can adapt to relatively large non-parallelism between the connecting disc 1 and the base 2, further adapt to the non-flatness of the surface of the wafer 6 better, and polish the surface of the wafer 6 better.
The present invention also has a third embodiment, which is different from the second embodiment in that: the guide part and the connecting structure are connected into a whole. The fixing part is provided with a first connecting hole, an elastic ring is arranged in the fixing part, and the connecting structure is clamped in the first connecting hole of the fixing part by means of the elastic ring. Due to the arrangement of the elastic ring, the polishing head can swing in the pore channel greatly by using a split universal joint, so that the polishing head can adapt to the larger non-parallelism between the connecting disc and the base, and further better adapt to the non-flatness of the surface of a wafer, and the surface of the wafer can be polished better.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.
Claims (10)
1. A split type universal joint for a polishing head, the polishing head having a connection disc (1) and a polishing part, a hole (10) being provided on the connection disc (1), the polishing part having a base (2), characterized in that the split type universal joint comprises:
a guide portion (40) adapted to float up and down within the tunnel (10);
a fixed portion (42) adapted to be fixedly connected with the base (2);
the connecting structure (41) is connected between the guide part (40) and the fixing part (42) and is respectively fixedly connected with the guide part (40) and the fixing part (42), and the guide part (40) is suitable for swinging relative to the fixing part (42) through the connecting structure (41).
2. A split type gimbal for a polishing head as set forth in claim 1, wherein: the connecting structure (41) is a flexible structure, one end of the flexible structure is connected with the guide part (40), and the other end of the flexible structure is connected with the fixing part (42).
3. A split-type gimbal for a polishing head as set forth in claim 2, wherein: one end of the connecting structure (41) is detachably connected with the guide part (40), and the other end of the connecting structure is detachably connected with the fixing part (42).
4. A split type gimbal for a polishing head as set forth in claim 2, wherein: a first connecting hole is formed in the fixing part (42), and one end of the connecting structure (41) is embedded into the first connecting hole and is connected with the first connecting hole through an elastic ring (48);
and/or a second connecting hole is formed in the lower end of the guide part (40), and the other end of the connecting structure (41) is embedded into the second connecting hole and is connected with the second connecting hole through an elastic ring (48).
5. A split type gimbal for a polishing head as set forth in claim 2, wherein: the connecting structure (41) is made of rubber.
6. A split type gimbal for a polishing head as set forth in claim 2, wherein: the outer side of the connecting structure (41) is provided with a dentate bulge (43).
7. A split type joint for a polishing head according to any one of claims 1 to 6, wherein: the guide portion (40) is made of a metal material.
8. A split-type gimbal for a polishing head as set forth in any one of claims 1 to 6, wherein: the fixing portion (42) is made of metal.
9. A split-type gimbal for a polishing head as set forth in claim 1, wherein: the fixing portion (42) and the connecting structure (41) are integrally formed.
10. A polishing apparatus characterized in that: a split-type gimbal for a polishing head comprising any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210424345.4A CN115383622A (en) | 2022-04-20 | 2022-04-20 | Split type universal joint for polishing head and polishing device |
| TW111131285A TWI832386B (en) | 2022-04-20 | 2022-08-19 | Split universal joint and polishing device for polishing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210424345.4A CN115383622A (en) | 2022-04-20 | 2022-04-20 | Split type universal joint for polishing head and polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115383622A true CN115383622A (en) | 2022-11-25 |
Family
ID=84115404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210424345.4A Pending CN115383622A (en) | 2022-04-20 | 2022-04-20 | Split type universal joint for polishing head and polishing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115383622A (en) |
| TW (1) | TWI832386B (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5916015A (en) * | 1997-07-25 | 1999-06-29 | Speedfam Corporation | Wafer carrier for semiconductor wafer polishing machine |
| US6116990A (en) * | 1997-07-25 | 2000-09-12 | Applied Materials, Inc. | Adjustable low profile gimbal system for chemical mechanical polishing |
| US6159079A (en) * | 1998-09-08 | 2000-12-12 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
| US20030068966A1 (en) * | 2001-10-10 | 2003-04-10 | Applied Materials, Inc. | Vibration damping in a carrier head |
| US20030077986A1 (en) * | 2000-06-08 | 2003-04-24 | Speedfam-Ipec Corporation | Front-reference carrier on orbital solid platen |
| CN1447394A (en) * | 2002-03-25 | 2003-10-08 | 联华电子股份有限公司 | Chemical-mechanical grinding head possessing floating obstruct ring |
| US6755723B1 (en) * | 2000-09-29 | 2004-06-29 | Lam Research Corporation | Polishing head assembly |
| US20040142646A1 (en) * | 2000-09-08 | 2004-07-22 | Applied Materials, Inc., A Delaware Corporation | Vibration damping in a chemical mechanical polishing system |
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| US20120149286A1 (en) * | 2010-12-08 | 2012-06-14 | Edmond Arzuman Abrahamians | Wafer polishing apparatus and method |
| JP2014108511A (en) * | 2012-12-04 | 2014-06-12 | Fujikoshi Mach Corp | Wafer polishing head and wafer polishing device |
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| KR101751439B1 (en) * | 2016-05-11 | 2017-06-27 | 주식회사 케이씨텍 | Carrier head of chemical mechanical apparatus |
| US20180071885A1 (en) * | 2015-01-30 | 2018-03-15 | Ebara Corporation | Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body |
| CN211465964U (en) * | 2019-12-31 | 2020-09-11 | 浙江芯晖装备技术有限公司 | Polishing head device and polishing machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113118969A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Bearing head for chemical mechanical polishing |
-
2022
- 2022-04-20 CN CN202210424345.4A patent/CN115383622A/en active Pending
- 2022-08-19 TW TW111131285A patent/TWI832386B/en active
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| US5916015A (en) * | 1997-07-25 | 1999-06-29 | Speedfam Corporation | Wafer carrier for semiconductor wafer polishing machine |
| US6116990A (en) * | 1997-07-25 | 2000-09-12 | Applied Materials, Inc. | Adjustable low profile gimbal system for chemical mechanical polishing |
| US6159079A (en) * | 1998-09-08 | 2000-12-12 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
| US20030077986A1 (en) * | 2000-06-08 | 2003-04-24 | Speedfam-Ipec Corporation | Front-reference carrier on orbital solid platen |
| US20040142646A1 (en) * | 2000-09-08 | 2004-07-22 | Applied Materials, Inc., A Delaware Corporation | Vibration damping in a chemical mechanical polishing system |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI832386B (en) | 2024-02-11 |
| TW202342235A (en) | 2023-11-01 |
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Address after: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Applicant after: Beijing Jingyi Precision Technology Co.,Ltd. Address before: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Applicant before: Beijing ShuoKe precision electronic equipment Co.,Ltd. |
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