CN115352163A - Production process of flexible intelligent high-barrier flexible package with information identification function - Google Patents
Production process of flexible intelligent high-barrier flexible package with information identification function Download PDFInfo
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- CN115352163A CN115352163A CN202211059215.1A CN202211059215A CN115352163A CN 115352163 A CN115352163 A CN 115352163A CN 202211059215 A CN202211059215 A CN 202211059215A CN 115352163 A CN115352163 A CN 115352163A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 230000004888 barrier function Effects 0.000 claims abstract description 52
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 49
- 239000010410 layer Substances 0.000 claims abstract description 47
- 238000007639 printing Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000001301 oxygen Substances 0.000 claims abstract description 22
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 22
- 238000013329 compounding Methods 0.000 claims abstract description 21
- 239000012793 heat-sealing layer Substances 0.000 claims abstract description 14
- 230000009471 action Effects 0.000 claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 238000005096 rolling process Methods 0.000 claims abstract description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 69
- 238000000034 method Methods 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 239000012752 auxiliary agent Substances 0.000 claims description 14
- 239000003086 colorant Substances 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 13
- 239000004743 Polypropylene Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000003960 organic solvent Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 10
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 9
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 7
- 239000012159 carrier gas Substances 0.000 claims description 7
- 239000001307 helium Substances 0.000 claims description 7
- 229910052734 helium Inorganic materials 0.000 claims description 7
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000009832 plasma treatment Methods 0.000 claims description 7
- 239000012495 reaction gas Substances 0.000 claims description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- 229920006233 biaxially oriented polyamide Polymers 0.000 claims description 6
- 238000003851 corona treatment Methods 0.000 claims description 6
- 239000002274 desiccant Substances 0.000 claims description 6
- 238000007646 gravure printing Methods 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 6
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 6
- 239000011976 maleic acid Substances 0.000 claims description 6
- 239000012860 organic pigment Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000004014 plasticizer Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 6
- 229920000180 alkyd Polymers 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 4
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- 238000000071 blow moulding Methods 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- VIPCDVWYAADTGR-UHFFFAOYSA-N trimethyl(methylsilyl)silane Chemical compound C[SiH2][Si](C)(C)C VIPCDVWYAADTGR-UHFFFAOYSA-N 0.000 claims description 3
- 229920006254 polymer film Polymers 0.000 claims description 2
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 230000035699 permeability Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 150000003961 organosilicon compounds Chemical class 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000002052 molecular layer Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 235000013305 food Nutrition 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 2
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 238000009450 smart packaging Methods 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7244—Oxygen barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2553/00—Packaging equipment or accessories not otherwise provided for
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/80—Packaging reuse or recycling, e.g. of multilayer packaging
Abstract
The invention discloses a production process of a flexible intelligent high-barrier flexible package with an information identification function, belonging to the technical field of packaging and comprising the following steps: (1) preparing a high-barrier material; (2) preparing a high-barrier film of the electronic tag; (3) image-text printing: on the printing layer, completing the printing of the packaging information by reasonably composing the image-text part; (4) compounding: the silicon oxide film layer with high barrier property and the function of the electronic label is compounded with the printing layer and the heat sealing layer into a film roll with qualified quality under the action of the adhesive and the cured adhesive layer; (5) rolling: rolling the produced finished product; (6) bag making: and (5) making the rolled product into a bag according to the required specification. The silicon oxide high-barrier film has good bending resistance and ultrahigh oxygen and moisture resistance, and the RFID label not only provides convenience for sellers but also can feed back product related information to consumers in a good working environment of the high-barrier film.
Description
Technical Field
The invention belongs to the technical field of packaging, and particularly relates to a production process of a flexible intelligent high-barrier flexible package with an information identification function.
Background
Currently, high barrier materials are widely used on the market, for example: EVOH co-extruded films, aluminum-plated films, aluminum-plastic films, alumina films, and the like. They all suffer from certain drawbacks. EVOH coextruded films are difficult to use under high humidity conditions and are therefore difficult to cook; the aluminum-plated film and the aluminum-plastic film have poor transparency, cannot be used for microwave heating, and are difficult to recycle due to the use of a metal plating layer; the aluminum oxide film is not resistant to rubbing and is difficult to meet the requirements of liquid packaging. The silicon oxide film is monopolized by foreign countries, and the import cost is high. The concept of intelligent packaging is mentioned at home for a long time, but the use range is very small, and the intelligent packaging can only be used in publicity of some goods in foreign countries, and the reasons include high cost, slow popularization and the like.
At present, a great deal of research proves that the silicon oxide high-barrier film has excellent performance which is difficult to replace other materials, has high barrier property and high transparency, can be used for microwave heating, ensures wide use surfaces with good rubbing resistance, and can be recycled together with a PET (polyethylene terephthalate) base material, thereby being very environment-friendly.
The RFID tag technology is also called a radio frequency signal tag reading technology, and is widely applied to the fields of commodity tags, logistics packaging and the like because of large applicable space, many times of repeated writing and many simultaneous reading when transmitting information. However, the RFID tag has some defects due to strict requirements on the application environment, and when the humidity is high, the accuracy of information transmission is reduced, thereby causing the problem of application defects; the packaging material of the circuit should not contain metal, otherwise the label will fail. These two reasons are the main factors limiting the application of RFID tags.
Along with the improvement of living standard, people prefer to pay attention to the quality problem of commodities, and in the field of foods, the storage conditions and shelf dates of the commodities are paid attention to so as to evaluate the state of products, which is a living idea advocated by the internet of things technology. The high-barrier technology and the RFID technology complement each other on the basis of the requirement, the high-barrier performance guarantees the product quality and the accuracy of the RFID information technology, and the electronic tag is responsible for recording the working process and feeding back the working process to consumers.
Disclosure of Invention
In view of the above, the present invention provides a production process of a flexible intelligent high-barrier flexible package with an information identification function, which aims at the defects of the prior art.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the production process of the flexible intelligent high-barrier flexible package with the information identification function comprises the following steps:
(1) Preparing a high-barrier material: depositing silicon oxide on the surface of a substrate by using a PECVD (plasma enhanced chemical vapor deposition) process to obtain a high-barrier film;
(2) Preparing the high-barrier film of the electronic tag: combining the electronic tag with the high barrier film, adding the electronic tag on the basis of the high barrier film, and performing interlayer packaging to enable the RFID tag to be positioned between the high barrier film and the common film; the common film is PE or PP, and plays a role of a heat sealing layer, so that the film is made into a bag;
(3) Printing pictures and texts: on the printing layer, completing the printing of the packaging information by reasonably composing the image-text part;
(4) Compounding: the silicon oxide film layer with high barrier property and realizing the function of the electronic tag is compounded into a qualified film roll with the printing layer and the heat sealing layer under the action of the adhesive and the action of the cured adhesive layer;
(5) Rolling: rolling the produced finished product;
(6) Bag making: and (5) making the rolled product into a bag according to the required specification.
Further, in the step (1), the silicon oxide film deposited by the PECVD method is formed by depositing a coating film on the substrate by using an organosilicon compound such as liquid hexamethyldisiloxane or tetramethyldisilane or gaseous silane as a raw material, helium as a carrier gas, and oxygen as a reaction gas, and reacting active molecules, radicals, and ions generated by plasma treatment with each other.
Further, the base material is PET, PA, PE or PP, and the thickness is 12-15 μm.
Further, the printing layer is a BOPA or BOPP or BOPET film, and the thickness is 12-18 μm.
Further, in the step (3), the image-text part of the package is formed by gravure printing of ink, and the ink comprises the following raw materials in percentage by mass: 31 to 36 percent of resin, 25 percent of colorant, 0.9 percent of auxiliary agent and 47 to 52 percent of organic solvent; the resin is one or more of pentaerythritol rosin ester, alkyd resin, rosin modified phenolic resin, polyacid gum resin and maleic acid grinding resin, the colorant is an organic pigment with the particle size of less than 5 mu m, the auxiliary agent comprises a plasticizer and a drying agent, and the organic solvent is one or more of ethyl acetate, ethyl acetate and isopropanol.
Further, after the surface of a printing polymer film with the thickness of 12-18 mu m is subjected to corona treatment, the dyne value reaches more than 38, and after graphic and text information is printed on the surface of the film, the prepared ink is printed on a specific area; the preparation method of the ink comprises the following steps: and adding the resin into a solvent, adding the colorant and the auxiliary agent after the resin is completely dissolved, and stirring to form the temperature color-changing ink.
Further, in the step (4), the adhesive layer is formed by curing the adhesive with polyurethane as a dry base and ethyl acetate, ethyl acetate and the like as a solvent, wherein the solid content of the adhesive is about 40-60%.
Furthermore, the material of the heat-sealing layer is PP or PE, the film is formed by casting or blow molding, the thickness of the film is 65-75 μm, the heat-sealing condition is 130-150 ℃, and the heat-sealing strength is 40-50N/15mm.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a production process of a flexible intelligent high-barrier flexible package with an information identification function, which aims to solve the problems that the performance of a current domestic high-barrier membrane is not perfect enough and the application range of RFID is narrow, ensures the extremely low oxygen and water vapor transmission rate of the silicon oxide high-barrier membrane by a chemical deposition method, and has high transparency, rubbing resistance and metal resistance; under the good working environment of a high-barrier film system, the RFID label not only provides convenience for sellers, but also can feed back product related information to consumers.
The silicon oxide high-barrier film prepared by the invention has the thickness of 15-18 mu m, the light transmittance is more than or equal to 88 percent, and the oxygen transmission rate is less than 0.5cm 3 /(m 2 * 24h) Water vapor transmission rate of less than 0.5cm 3 /(m 2 * 24h) The boiling resistant temperature is 80-120 ℃, and the effective resistance times to the rubbing test is 40 times; the high barrier film has extremely high barrier property to steam, oxygen and other small molecule gases, can prevent the dissipation of flavor in food to the maximum extent, and the RFID electronic tag is more stable and accurate due to good barrier property; in addition, the silicon oxide film is also an environment-friendly material, and the recyclability of the silicon oxide film can meet the requirement of environmental protection.
According to the silicon oxide high-barrier package, the RFID circuit is directly added on the silicon oxide high-barrier film, and the silicon oxide high-barrier film has good bending resistance and ultrahigh oxygen and moisture resistance. The silicon oxide high-barrier film does not contain metal components, so that the combination of the silicon oxide film and a circuit can exert the optimal performance in the aspects of humidity protection and metal resistance protection; the silicon oxide high-barrier packaging adopts a PECVD method, realizes good flexibility of a coating, provides good basic conditions for positioning an electronic tag, and the excellent physical properties can ensure that the barrier property is reduced by no more than 15% in the subsequent compounding and bag making procedures.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the description of the embodiments of the invention given above, are within the scope of protection of the invention.
Example 1
A production process of a flexible intelligent high-barrier flexible package with an information identification function comprises the following steps:
step (1): the preparation of the high-barrier material uses a PECVD process to deposit silicon oxide on the surface of a substrate to obtain a high-barrier film;
the method is characterized in that liquid organosilicon compound Hexamethyldisiloxane (HMDSO) is used as a raw material, helium is used as a carrier gas, oxygen is used as a reaction gas, active molecules, atomic groups and ions generated by plasma treatment react with one another to form a uniform and transparent SiOx molecular layer, so that the water and oxygen permeability of a PET material (12 mu m) is remarkably reduced. The permeability of the film to oxygen is reduced to 0.5cm 3 /m 2 24h.0.1MPa or less, the permeability to water vapor is reduced to 0.5cm 3 /m 2 24h.0.1MPa or less. The haze was increased by 0.2% relative to the untreated PET substrate, the light transmittance was 88%, the haze was 0.7%, and the thickness of the PET high barrier layer was 15 μm.
Step (2): the preparation of the high barrier film of the electronic tag combines the electronic tag with the high barrier film, and on the basis of the high barrier film, the electronic tag is added and interlayer packaging is carried out, so that the RFID tag is positioned between the high barrier film and the PE film;
the frequency band used by the RFID electronic tag part is 915MHz, the RFID electronic tag part is directly attached to the silicon oxide high-barrier film in a plastic package mode, the thickness of the high-barrier film with the RFID identification part is 62-73 micrometers, and the RFID electronic tag part has excellent flexibility and yield limit; the silicon oxide high-barrier material of the plastic-packaged electronic tag can resist kneading for less than 40 times, in the process, a circuit and a chip are not damaged, and meanwhile, the barrier property of the high-barrier layer is reduced by no more than 15%; in the compounding process, the composite film can be compounded through a dry compounding or solvent-free compounding process, the peel strength is not less than 1.5N/15mm, and the integrity of the electronic tag and the overall high barrier property of the composite film can be ensured.
And (3): the pictures and texts are printed on the printing layer, and the printing of the packaging information is completed through reasonable typesetting of the picture and text parts;
carrying out corona treatment on a BOPA film with the thickness of 12 microns until the surface dyne value reaches 39, printing pattern information on the surface of the BOPA film, and printing the prepared ink on a specific area;
the packaging graphic part is formed by gravure printing of ink, and the ink is prepared from the following raw materials in percentage by mass: the content of resin (pentaerythritol rosin ester and maleic acid grinding resin) is 31 percent, the content of colorant (organic pigment with the particle size of less than 5 mu m) is 25 percent, the content of auxiliary agent (plasticizer and drying agent) is 0.9 percent, and the content of organic solvent (ethyl acetate and ethyl acetate) is 47 percent;
the preparation method of the ink comprises the following steps: adding the resin into an organic solvent, adding the colorant and the auxiliary agent after the resin is completely dissolved, grinding and stirring to finally form the temperature color-changing ink; the ink had a solids content of 50% and a kinematic viscosity of 25cSt.
And (4): compounding a silicon oxide film layer with high barrier property for realizing the function of the electronic tag, and compounding the silicon oxide film layer, the printing layer and the heat sealing layer into a film roll with qualified quality under the action of an adhesive and the action of a cured adhesive layer;
the adhesive layer is formed by coating adhesive between the printed film layer and the silicon oxide high barrier layer, and is formed by curing adhesive with solid content of 40-60% and acrylic copolymer as dry base and ethyl acetate, etc. as solvent, and the coating weight is 5g/m 2 The dry basis weight of the adhesive is 2.5g/m 2 ；
The heat sealing layer is formed by blow molding of a PP material, the thickness is 65 mu m, the heat sealing condition is 130-150 ℃, and the peel strength after heat sealing is 40-50N/15mm;
and (5): rolling the produced finished product;
and (6): and (4) bag making, namely making the rolled product into a bag according to the required specification.
Example 2
A production process of a flexible intelligent high-barrier flexible package with an information identification function comprises the following steps:
step (1): the preparation of the high-barrier material uses a PECVD process to deposit silicon oxide on the surface of a substrate to obtain a high-barrier film;
liquid organosilicon compound tetramethyl disilane (TMDSO) is used as a raw material, helium is used as a carrier gas, oxygen is used as a reaction gas, and active molecules, atomic groups and ions generated by plasma treatment react with one another to form a uniform and transparent SiOx molecular layer, so that the water and oxygen transmission of a PA material (14 mu m) is remarkably reduced. The permeability of the film to oxygen is reduced to 0.49cm 3 /m 2 24h.0.1MPa or less, the permeability to water vapor is reduced to 0.49cm 3 /m 2 24h.0.1MPa or less; the haze was increased by 0.3% relative to the untreated PA substrate, the light transmittance was 89%, the haze was 0.7%, and the thickness of the PA high barrier layer was 17 μm.
Step (2): the preparation of the high barrier film of the electronic tag combines the electronic tag with the high barrier film, and on the basis of the high barrier film, the electronic tag is added and interlayer packaging is carried out, so that the RFID tag is positioned between the high barrier film and the PP film;
and (3): the pictures and texts are printed on the printing layer, and the printing of the packaging information is completed through reasonable typesetting of the picture and text parts;
carrying out corona treatment on a BOPET film with the thickness of 14 mu m until the surface dyne value reaches 39, printing the graphic and text information on the surface of the BOPET film, and then printing the prepared ink on a specific area;
the packaging graphic part is formed by gravure printing of ink, and the ink is prepared from the following raw materials in percentage by mass: 33 percent of resin (alkyd resin and maleic acid grinding resin), 25 percent of colorant (organic pigment with the particle size of less than 5 mu m), 0.9 percent of auxiliary agent (plasticizer and drying agent) and 49 percent of organic solvent (ethyl acetate, ethyl acetate and isopropanol);
the preparation method of the ink comprises the following steps: adding the resin into an organic solvent, adding the colorant and the auxiliary agent after the resin is completely dissolved, grinding and stirring to finally form the temperature color-changing ink; the ink had a solids content of 50% and a kinematic viscosity of 25cSt.
And (4): compounding a silicon oxide film layer with high barrier property for realizing the function of the electronic tag, and compounding the silicon oxide film layer, the printing layer and the heat sealing layer into a film roll with qualified quality under the action of an adhesive and the action of a cured adhesive layer;
the adhesive layer is formed by coating an adhesive between a printed film layer and a silicon oxide high barrier layer, and is formed by curing the adhesive with solid content of 40-60% and coating weight of 5.5g/m between layers by taking polyurethane as a dry basis and ethyl acetate, ethyl acetate and the like as solvents 2 The dry basis weight of the adhesive is 2.5g/m 2 ；
The heat sealing layer is formed by casting a PP material, the thickness is 70 mu m, the heat sealing condition is 130-150 ℃, and the peel strength after heat sealing is 40-50N/15mm;
and (5): rolling the produced finished product;
and (6): and (4) bag making, namely making the rolled product into a bag according to the required specification.
Example 3
A production process of a flexible intelligent high-barrier flexible package with an information identification function comprises the following steps:
step (1): the preparation of the high-barrier material uses a PECVD process to deposit silicon oxide on the surface of a substrate to obtain a high-barrier film;
gaseous silane is used as a raw material, helium is used as a carrier gas, oxygen is used as a reaction gas, and active molecules, atomic groups and ions generated by plasma treatment react with one another to form a uniform and transparent SiOx molecular layer, so that the water and oxygen permeability of a PE material (15 mu m) is remarkably reduced. The permeability of the film to oxygen is reduced to 0.48 cm 3 /m 2 24h.0.1MPa or less, and the water vapor permeability is reduced to 0.49cm 3 /m 2 24h.0.1MPa or less; the haze was increased by 0.3% relative to the untreated PA substrate, the light transmittance was 90%, the haze was 0.7%, and the PA high barrier layer had a thickness of 18 μm.
Step (2): the preparation of the high barrier film of the electronic tag combines the electronic tag with the high barrier film, and on the basis of the high barrier film, the electronic tag is added and interlayer packaging is carried out, so that the RFID tag is positioned between the high barrier film and the PE film;
the frequency band used by the RFID electronic tag part is 915MHz, the RFID electronic tag part is directly attached to the silicon oxide high-barrier film in a plastic package mode, the thickness of the high-barrier film with the RFID identification part is 62-73 micrometers, and the RFID electronic tag part has excellent flexibility and yield limit; the silicon oxide high-barrier material of the plastic-packaged electronic tag can resist kneading for less than 40 times, in the process, a circuit and a chip are not damaged, and meanwhile, the barrier property of the high-barrier layer is reduced by no more than 15%; in the compounding process, the compound can be carried out by a dry compounding or solvent-free compounding process, the peel strength is not less than 1.5N/15mm, and the integrity of the electronic tag and the overall high barrier property of the compound film can be ensured.
The production method of the plastic-packaged RFID high-barrier film comprises the following steps: the coil is etched to have the functions of inducing current, storing information and reading information, and then the coil and the high-barrier film are positioned to enable the coil to have the adhesive force of not less than 1.5N/15mm on the high-barrier film.
And (3): the pictures and texts are printed on the printing layer, and the printing of the packaging information is completed through reasonable typesetting of the picture and text parts;
carrying out corona treatment on a BOPP film with the thickness of 16 mu m until the surface dyne value reaches 39, printing the graphic information on the surface of the BOPP film, and printing the prepared ink on a specific area;
the packaging graphic part is formed by gravure printing of ink, and the ink is prepared from the following raw materials in percentage by mass: the resin (rosin modified phenolic resin, alkyd resin and maleic acid grinding resin) content is 35%, the colorant (organic pigment with particle size below 5 μm) content is 25%, the auxiliary agent (plasticizer and drying agent) content is 0.9%, and the organic solvent (ethyl acetate, ethyl acetate and isopropanol) content is 50%;
the preparation method of the ink comprises the following steps: adding the resin into an organic solvent, adding the colorant and the auxiliary agent after the resin is completely dissolved, grinding and stirring to finally form the temperature color-changing ink; the ink had a solids content of 50% and a kinematic viscosity of 25cSt.
And (4): compounding a silicon oxide film layer with high barrier property for realizing the function of the electronic tag, and compounding the silicon oxide film layer, the printing layer and the heat sealing layer into a film roll with qualified quality under the action of an adhesive and the action of a cured adhesive layer;
the adhesive layer is formed by coating an adhesive between the printed film layer and the silicon oxide high barrier layer, and is formed by curing the adhesive with polyurethane as a dry base and ethyl acetate, ethyl acetate and the like as solvents and with the solid content of about 40-60%, wherein the coating weight is 5.5g/m 2 The dry basis weight of the adhesive is 2.8g/m 2 ；
The heat sealing layer is formed by casting a PP material, the thickness is 70 mu m, the heat sealing condition is 130-150 ℃, and the peel strength after heat sealing is 40-50N/15mm;
and (5): rolling the produced finished product;
and (6): and (4) bag making, namely making the rolled product into a bag according to the required specification.
Example 4
A production process of a flexible intelligent high-barrier flexible package with an information identification function comprises the following steps:
step (1): the preparation of the high-barrier material uses a PECVD process to deposit silicon oxide on the surface of a substrate to obtain a high-barrier film;
the liquid organosilicon compound Hexamethyldisiloxane (HMDSO) is used as a raw material, helium is used as a carrier gas, oxygen is used as a reaction gas, and active molecules, atomic groups and ions generated by plasma treatment react with one another to form a uniform and transparent SiOx molecular layer, so that the water and oxygen transmission of a PP material (15 mu m) is remarkably reduced. The permeability of the film to oxygen is reduced to 0.49cm 3 /m 2 24h.0.1MPa or less, and the water vapor permeability is reduced to 0.49cm 3 /m 2 24h.0.1MPa or less; the haze is increased by 0.3% relative to the untreated PA substrate, the light transmittance is 90%, the haze is 0.7%, and the thickness of the PA high barrier layer is 18 μm.
Step (2): the preparation of the high barrier film of the electronic tag combines the electronic tag with the high barrier film, and on the basis of the high barrier film, the electronic tag is added and interlayer packaging is carried out, so that the RFID tag is positioned between the high barrier film and the PP film;
the frequency band used by the RFID electronic tag part is 915MHz, the RFID electronic tag part is directly attached to the silicon oxide high-barrier film in a plastic package mode, the thickness of the high-barrier film with the RFID identification part is 62-73 micrometers, and the RFID electronic tag part has excellent flexibility and yield limit; the silicon oxide high-barrier material of the plastic-packaged electronic tag can resist kneading for less than 40 times, in the process, a circuit and a chip are not damaged, and meanwhile, the barrier property of the high-barrier layer is not reduced by more than 15%; in the compounding process, the compound can be carried out by a dry compounding or solvent-free compounding process, the peel strength is not less than 1.5N/15mm, and the integrity of the electronic tag and the overall high barrier property of the compound film can be ensured.
The production method of the plastic-packaged RFID high-barrier film comprises the following steps: the coil is etched to have the functions of inducing current, storing information and reading information, and then the coil and the high-barrier film are positioned to enable the coil to have the adhesive force of not less than 1.5N/15mm on the high-barrier film.
And (3): the pictures and texts are printed on the printing layer, and the printing of the packaging information is completed through reasonable typesetting of the picture and text parts;
carrying out corona treatment on a BOPA film with the thickness of 18 mu m until the surface dyne value reaches 40, printing the graphic and text information on the surface of the BOPA film, and then printing the prepared ink on a specific area;
the packaging graphic part is formed by gravure printing of ink, and the ink is prepared from the following raw materials in percentage by mass: the resin (rosin modified phenolic resin, alkyd resin and maleic acid grinding resin) content is 36%, the colorant (organic pigment with particle size below 5 μm) is 25%, the auxiliary agent (plasticizer and drying agent) is 0.9%, and the organic solvent (ethyl acetate, ethyl acetate and isopropanol) is 52%;
the preparation method of the ink comprises the following steps: adding the resin into an organic solvent, adding the colorant and the auxiliary agent after the resin is completely dissolved, grinding and stirring to finally form the temperature color-changing ink; the ink had a solids content of 50% and a kinematic viscosity of 25cSt.
And (4): compounding a silicon oxide film layer with high barrier property and realizing the function of the electronic tag, and compounding the silicon oxide film layer, the printing layer and the heat sealing layer into a qualified film roll under the action of an adhesive and the action of a cured adhesive layer;
the adhesive layer is formed by coating an adhesive between a printed film layer and a silicon oxide high barrier layer, and is formed by curing the adhesive with solid content of 40-60% and coating weight of 6g/m between layers by taking polyurethane as a dry basis and ethyl acetate, ethyl acetate and the like as solvents 2 The dry basis weight of the adhesive is 3g/m 2 ；
The heat sealing layer is formed by casting a PP material, the thickness is 70 mu m, the heat sealing condition is 130-150 ℃, and the peel strength after heat sealing is 40-50N/15mm;
and (5): rolling the produced finished product;
and (6): and (4) bag making, namely making the rolled product into a bag according to the required specification.
Experiment and results
The performance test of the high barrier films with information identification function produced in examples 1, 2, 3 and 4 showed the following table:
table 1:
organosilicon compounds such as liquid Hexamethyldisiloxane (HMDSO), tetramethyldisiloxane (TMDSO) and the like or gaseous silane are used as raw materials, helium is used as a carrier gas, oxygen is used as a reaction gas, active molecules, atomic groups and ions generated by plasma treatment react with each other, and a coating film is generated by deposition on a base material. The thickness of the silicon oxide high-barrier film is 15-18 μm, and the light transmittance is highMore than or equal to 88 percent, and the oxygen transmission rate is less than 0.5cm 3 /m 2 24h.0.1MPa, water vapor transmission rate < 0.5cm 3 /m 2 24h.0.1MPa, steaming-resistant temperature of 80-120 deg.C, and effective resistance times of 40 times in kneading experiment. The high barrier film has extremely high barrier property to steam, oxygen and other small molecule gases, can prevent the fragrance in food from dissipating to the maximum extent, and in addition, the silicon oxide film is also an environment-friendly material, and the silicon oxide film is easy to recycle and meets the requirement of environmental protection.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. The production process of the flexible intelligent high-barrier flexible package with the information identification function is characterized by comprising the following steps of:
(1) Preparing a high-barrier material: depositing silicon oxide on the surface of a substrate by using a PECVD process to obtain a high-barrier film;
(2) Preparing the high-barrier film of the electronic tag: combining the electronic tag with the high barrier film, adding the electronic tag on the basis of the high barrier film, and performing interlayer packaging to enable the RFID tag to be positioned between the high barrier film and the common film;
(3) Printing pictures and texts: on the printing layer, completing the printing of the packaging information by reasonably composing the image-text part;
(4) Compounding: the silicon oxide film layer with high barrier property and realizing the function of the electronic tag is compounded into a qualified film roll with the printing layer and the heat sealing layer under the action of the adhesive and the action of the cured adhesive layer;
(5) Rolling: rolling the produced finished product;
(6) Bag making: and (5) making the rolled product into a bag according to the required specification.
2. The process for producing a flexible intelligent high-barrier flexible package with information identification function according to claim 1, wherein the process comprises the following steps: in the step (1), the silicon oxide film deposited by using the PECVD method is formed by taking liquid hexamethyldisiloxane, tetramethyldisilane organic silicon compound or gaseous silane as a raw material, helium as a carrier gas and oxygen as a reaction gas, and active molecules, atomic groups and ions generated by plasma treatment react with one another to deposit a coating film on a substrate.
3. The process for producing the flexible intelligent high-barrier flexible package with the information identification function according to claim 2, wherein the process comprises the following steps: the base material is PET, PA, PE or PP, and the thickness is 12-15 μm.
4. The process for producing a flexible intelligent high-barrier flexible package with information identification function according to claim 3, wherein the process comprises the following steps: the printing layer is a BOPA or BOPP or BOPET film, and the thickness of the printing layer is 12-18 mu m.
5. The process for producing a flexible intelligent high-barrier flexible package with information identification function according to claim 4, wherein the process comprises the following steps: in the step (3), the packaging image-text part is formed by gravure printing of ink, and the ink comprises the following raw materials in percentage by mass: 31 to 36 percent of resin, 25 percent of colorant, 0.9 percent of auxiliary agent and 47 to 52 percent of organic solvent; the resin is one or more of pentaerythritol rosin ester, alkyd resin, rosin modified phenolic resin, polyacid gum resin and maleic acid grinding resin, the colorant is an organic pigment with the particle size of less than 5 mu m, the auxiliary agent comprises a plasticizer and a drying agent, and the organic solvent is one or more of ethyl acetate, ethyl acetate and isopropanol.
6. The process for producing a flexible intelligent high-barrier flexible package with information identification function according to claim 5, wherein the process comprises the following steps: after the surface of a printing polymer film with the thickness of 12-18 mu m is subjected to corona treatment, the dyne value reaches more than 38, and after graphic and text information is printed on the surface of the film, the configured ink is printed in a specific area; the preparation method of the ink comprises the following steps: and adding the resin into a solvent, adding the colorant and the auxiliary agent after the resin is completely dissolved, and stirring to form the temperature color-changing ink.
7. The process for producing a flexible intelligent high-barrier flexible package with information identification function according to claim 6, wherein the process comprises the following steps: in the step (4), the adhesive layer is formed by curing the adhesive with solid content of about 40-60% by taking polyurethane as a dry basis and ethyl acetate, ethyl acetate and the like as solvents between the layers.
8. The process for producing the flexible intelligent high-barrier flexible package with the information identification function according to claim 7, wherein the process comprises the following steps: the material of the heat-sealing layer is PP or PE, the film is formed by casting or blow molding, the thickness of the film is 65-75 mu m, the heat-sealing condition is 130-150 ℃, and the heat-sealing strength is 40-50N/15mm.
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