CN115346933A - Plastic package structure for improving product cavity in plastic package process and packaging method thereof - Google Patents
Plastic package structure for improving product cavity in plastic package process and packaging method thereof Download PDFInfo
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- CN115346933A CN115346933A CN202210956129.4A CN202210956129A CN115346933A CN 115346933 A CN115346933 A CN 115346933A CN 202210956129 A CN202210956129 A CN 202210956129A CN 115346933 A CN115346933 A CN 115346933A
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- Prior art keywords
- plastic package
- substrate
- plastic
- bump
- product
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- 239000004033 plastic Substances 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 239000005022 packaging material Substances 0.000 claims description 12
- 238000012858 packaging process Methods 0.000 claims description 8
- 238000004088 simulation Methods 0.000 claims description 8
- 238000012795 verification Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000011800 void material Substances 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 6
- 229940125782 compound 2 Drugs 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a plastic package structure for improving product cavities in a plastic package process and a packaging method thereof, and belongs to the technical field of FC product substrate design. According to the plastic package structure for improving the product cavity in the plastic package process, the opening is formed in the middle area of the Bump ball on the substrate, and the area with poor flowability of the plastic package material on the substrate in the plastic package process is selected at the position of the opening, so that air conduction is realized during plastic package, the plastic package material can smoothly fill the Bump balls inside, the problem that the cavity is formed between the bumps due to the fact that the plastic package material cannot completely fill the space below the Bump balls is solved, and the plastic package structure has a good application prospect; in addition, the problem of glue overflow after plastic package materials caused by the opening of the substrate is solved through the special design of the groove on the back surface of the die, and the packaging yield of products is greatly improved.
Description
Technical Field
The invention belongs to the technical field of FC product substrate design, and particularly relates to a plastic package structure for improving product cavities in a plastic package process and a packaging method thereof.
Background
The Bump balls of the Memory FC product are more and more dense, pitch between the Bump balls is small, the thickness of the Bump balls is small, during plastic packaging, the flow speed of epoxy resin (plastic packaging material) on the upper part of a chip is higher than that of the epoxy resin on the lower part of the chip, so that the problem of cavities among the Bump balls is caused, and when reflow soldering is carried out in the subsequent ball planting process or a board is arranged on a client terminal, the abnormity of the cavities of the product and Bump tin-connecting short circuit occurs at high temperature of about 250 ℃, so that the whole product is failed and scrapped; in the plastic package process, the problem of back glue overflow sometimes occurs, which seriously affects the appearance of the product and the welding of the tin spherical solder ball on the back, and leads to the product being scrapped.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a plastic package structure for improving product cavities in the plastic package process and a packaging method thereof, and aims to solve the technical problems that the cavities are prevented from occurring in the plastic package process among Bump balls; the second technical problem to be solved is to prevent the problem of back glue overflow in the plastic packaging process.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
the invention discloses a plastic package structure for improving a product cavity in a plastic package process, which comprises a substrate, an opening, a plastic package material, an FC chip, a Bump ball, a solder ball and a back plastic package groove, wherein the opening is formed in the substrate; the Bump ball is attached to the front surface of the substrate, the FC chip is attached to the Bump ball, and the FC chip is packaged inside the plastic package material; the solder ball is attached to the back surface of the substrate; the plastic packaging structure comprises a substrate, and is characterized in that the substrate is provided with holes penetrating through the front and the back of the substrate, the back plastic packaging groove is attached to the back of the substrate, and the back plastic packaging groove is opposite to the holes.
Further, the position of the opening is located in an area where the molding compound has poor flowability on the front surface of the substrate, and the area with poor flowability is located at 32% ± 1% of the width of the substrate.
Furthermore, the shape of trompil is circular, and the quantity is one, the diameter of trompil is 0.2mm ~ 0.6mm.
Furthermore, bump ball pads are arranged on the front surface of the substrate, and Bump balls are arranged on the Bump ball pads.
Furthermore, a solder ball pad is arranged on the back of the substrate, and the solder ball is arranged on the solder ball pad.
Furthermore, the number of the Bump balls is multiple, and the Bump balls are symmetrically distributed on two sides of the opening.
Furthermore, the number of the solder balls is a plurality, and the solder balls are symmetrically distributed on two sides of the opening.
The invention also discloses a packaging method of the plastic packaging structure for improving the product cavity in the plastic packaging process, which comprises the following steps:
s1: mounting Bump balls on the front surface of the substrate to obtain a substrate product; carrying out analog simulation verification on a substrate product to obtain a point of the plastic package material with the worst circulation on the substrate, and forming a hole at the position of the point of the plastic package material with the worst circulation on the substrate to obtain a perforated substrate;
s2: and finally, packaging the FC chip in the plastic packaging material by using the plastic packaging material to obtain the plastic packaging structure for improving the product cavity in the plastic packaging process.
Compared with the prior art, the invention has the following beneficial effects:
the invention discloses a plastic package structure for improving a product cavity in a plastic package process, wherein an opening is formed in the middle area of a Bump ball on a substrate, and an area with poor flowability of a plastic package material on the substrate in the plastic package process is selected at the position of the opening, so that air conduction is realized during plastic package, the plastic package material can smoothly fill the internal Bump ball, and the problem that the cavity is formed between the bumps because the plastic package material cannot completely fill the space below the Bump ball is solved; in addition, by adopting special-shaped plastic package, the back surface of the die is provided with a back surface plastic package groove corresponding to the position of the opening of the substrate, the plastic package material can overflow to the back surface of the substrate when flowing at high temperature and high pressure and just correspond to the position of the groove, the overflowing plastic package material is completely cured in the back surface plastic package groove part and cannot overflow to other positions of the back surface of the substrate, and the problem of abnormal glue overflowing of the back surface of a product is solved.
The invention also discloses a packaging method for improving the plastic packaging structure of the product cavity in the plastic packaging process, which comprises the steps of firstly determining the point of the substrate product with the worst circulation of the plastic packaging material on the substrate in the plastic packaging process by adopting analog simulation verification, and then designing and perforating at the corresponding point, so that the problem that the plastic packaging material cannot completely fill the space below the Bump ball to cause the product to have the cavity can be accurately solved, and the used analog simulation experiment can accurately obtain the corresponding result; the problem of glue overflow after the plastic package material caused by the opening of the substrate is solved through the special design of the groove on the back of the die, the packaging yield of the product is greatly improved, and the die has a good application prospect.
Drawings
FIG. 1 is a schematic diagram of a plastic packaging process of a product according to the present invention;
FIG. 2 is a schematic front view of a substrate according to the present invention;
FIG. 3 is a schematic backside view of a substrate according to the present invention;
FIG. 4 is a cross-sectional view of a plastic encapsulated structure for improving product voids during plastic encapsulation in accordance with the present invention;
wherein: 1-FC chip; 2-plastic packaging material; 3-Bump balls; 4-a substrate; 5-tin balls; 6-plastic sealing the groove on the back; 7-opening the hole; 8-Bump ball pads; 9-solder ball pads; 10-gold edge; 11-mold flow; 12-the distal edge of the substrate;
FIG. 5 is a flow chart of the plastic package material for simulation verification of the product according to the present invention;
wherein: a-2s plastic package material circulation condition; b-4s plastic packaging material circulation condition; c-6s plastic package material circulation condition.
Detailed Description
In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the accompanying drawings:
fig. 1 is a schematic diagram of a product plastic packaging process, and it can be seen from the diagram that, during plastic packaging, a plastic packaging material 2 flows in from a direction of a gold edge 10 under high temperature and high pressure, at this time, the plastic packaging material with the largest injection pressure has the strongest circulation, flows to a far end side 12 of a substrate at the fastest speed, and reflows from the far end side 12 of the substrate to surround the middle of a Bump ball 3, and due to the fact that the pressure is reduced and the flow speed is reduced in the reflow process, after the circulation in a single Unit is reduced, because the Bump ball 3 is dense, bubbles in a pitch are not removed to cause a cavity, therefore, the invention designs an opening 7 for the substrate at the position, and each substrate in the whole strip is perforated to facilitate air flow circulation, and the plastic packaging material 2 is completely filled.
As shown in fig. 2 to 4, the plastic package structure for improving the product cavity in the plastic package process disclosed by the invention comprises a substrate 4, wherein a plurality of Bump ball pads 8 are arranged on the front surface of the substrate 4, the Bump balls 3 are pasted on the Bump ball pads 8, an FC chip 1 is pasted on the Bump balls 3, when plastic package is carried out, an opening 7 is formed in the area with poor flowability on the front surface of the substrate 4 by a plastic package material 2, then the FC chip 1 is packaged by the plastic package material 2, so that air conduction is realized during plastic package, the internal Bump balls can be smoothly filled by the plastic package material, and the problem that the cavity appears between the bumps because the space below the Bump balls cannot be completely filled by the plastic package material is solved; the back of the substrate 4 is provided with a plurality of solder ball pads 9, and solder balls 5 are pasted on the solder ball pads 9; the back surface of the substrate 4 is subjected to plastic packaging by using special-shaped plastic packaging and adopting the back surface plastic packaging groove 6, and the back surface plastic packaging groove 6 is opposite to the position of the opening 7, so that the problem of abnormal glue overflow of the back surface of a product is solved; the Bump balls 3 are symmetrically distributed on two sides of the opening 7, and the solder balls 5 are symmetrically distributed on two sides of the opening 7.
When the plastic package structure for improving the product cavity in the plastic package process is used for packaging, the method comprises the following steps:
step 1: performing analog simulation verification of a product
As shown in fig. 5a to 5c, the effect of filling the molding compound 2 at different time periods can be seen, and as time goes by, the flow property of the molding compound 2 is best at the place closest to the gold edge 10, and a point where the flow property of the molding compound 2 on the substrate 4 is the worst is confirmed is determined according to a simulation experiment; mounting Bump balls 3 on the front surface of a substrate 4 to obtain a substrate product, confirming a point with the worst circulation of the plastic package material 2 on the substrate 4 through analog simulation verification of the substrate product and the plastic package material 2, and performing design tapping 7 on the substrate at a corresponding position to obtain a tapped substrate; at this time, the position of the opening 7 is 32% +/-1% of the whole width (Y axis) of the product under the substrate 4, the shape of the opening 7 is circular, and the diameter is 0.2 mm-0.6 mm;
step 2: packaging of products
The FC chip packaging method comprises the steps of carrying out surface mounting (pasting at the position of an opening 7) on an FC chip 1 on the front side of a substrate with the opening, then adopting a back plastic package structure 6 to be attached to the back side of the substrate 4, enabling the position of the back plastic package structure 6 to be opposite to the position of the opening 7, and finally packaging the FC chip 1 inside through a plastic package material 2 to obtain the plastic package structure capable of improving the product cavity in the plastic package process.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (8)
1. A plastic package structure for improving a product cavity in a plastic package process is characterized by comprising a substrate (4), an opening (7), a plastic package material (2), an FC chip (1), a Bump ball (3), a solder ball (5) and a back plastic package groove (6); the Bump ball (3) is attached to the front surface of the substrate (4), the FC chip (1) is attached to the Bump ball (3), and the FC chip (1) is packaged inside by the plastic package material (2); the solder balls (5) are attached to the back surface of the substrate (4); be equipped with trompil (7) that run through the front and the back of base plate (4) on base plate (4), back plastic envelope recess (6) are attached at the back of base plate (4), the position of back plastic envelope recess (6) is relative with the position of trompil (7).
2. A plastic package structure for improving product voids during a plastic package process according to claim 1, wherein the position of the opening (7) is located in an area where the molding compound (2) has poor flowability on the front surface of the substrate (4), and the area with poor flowability is located at 32% ± 1% of the width of the substrate (4).
3. A plastic package structure for improving product voids in a plastic package process according to claim 2, wherein the openings (7) are circular and one in number, and the diameter of the openings (7) is 0.2mm to 0.6mm.
4. A plastic package structure for improving product voids in a plastic package process according to claim 1, wherein Bump ball pads (8) are disposed on the front surface of the substrate (4), and the Bump balls (3) are disposed on the Bump ball pads (8).
5. A plastic package structure for improving product void in plastic package process according to claim 4, wherein the back surface of the substrate (4) is provided with solder ball pads (9), and the solder balls (5) are disposed on the solder ball pads (9).
6. A plastic package structure for improving product cavities in a plastic package process according to claim 5, wherein the number of the Bump balls (3) is several, and the several Bump balls (3) are symmetrically distributed on two sides of the opening (7).
7. A plastic package structure for improving product voids during a plastic package process according to claim 5, wherein the number of said solder balls (5) is several, and said several solder balls (5) are symmetrically distributed on both sides of said opening (7).
8. The packaging method for improving the plastic package structure of the product cavity in the plastic package process as claimed in claim 1, comprising the steps of:
s1: mounting Bump balls (3) on the front surface of the substrate (4) to obtain a substrate product; carrying out analog simulation verification on a substrate product to obtain a point of the plastic package material (2) with the worst circulation on the substrate (4), and opening a hole (7) at the position of the point of the plastic package material (2) with the worst circulation on the substrate (4) to obtain a perforated substrate;
s2: the FC packaging structure is characterized in that an FC chip (1) is pasted on the front surface of a perforated substrate, then a back surface plastic packaging structure (6) is attached to the back surface of the substrate (4), the position of the back surface plastic packaging structure (6) is opposite to that of the perforated substrate (7), and finally the FC chip (1) is packaged inside the plastic packaging material (2) through the plastic packaging material (2), so that the plastic packaging structure for improving the product cavity in the plastic packaging process is obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210956129.4A CN115346933A (en) | 2022-08-10 | 2022-08-10 | Plastic package structure for improving product cavity in plastic package process and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210956129.4A CN115346933A (en) | 2022-08-10 | 2022-08-10 | Plastic package structure for improving product cavity in plastic package process and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115346933A true CN115346933A (en) | 2022-11-15 |
Family
ID=83952934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210956129.4A Pending CN115346933A (en) | 2022-08-10 | 2022-08-10 | Plastic package structure for improving product cavity in plastic package process and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115346933A (en) |
-
2022
- 2022-08-10 CN CN202210956129.4A patent/CN115346933A/en active Pending
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