CN115334263B - A silicon pixel detector readout system and method - Google Patents
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Abstract
Description
技术领域technical field
本发明涉及半导体探测器技术领域,特别是关于一种硅像素探测器读出系统及方法。The invention relates to the technical field of semiconductor detectors, in particular to a silicon pixel detector readout system and method.
背景技术Background technique
在构建像素探测器的过程中,最大的挑战之一是设计出合适的具有数千个电子通道的像素芯片。像素芯片包括有规则排列的像素阵列单元,像素芯片上的电路通过击中信息传输至每一像素芯片的底部,再传输至芯片外部。每一像素电路必须提供传感器电荷的低噪声放大、击中识别和合适的读出方法,必须保证模拟和数字有明确的阈值和有足够的速度。因此,数字读出方法必须处理更高的数据量,必须更快的将数据传输出去。One of the biggest challenges in building a pixel detector is designing a suitable pixel chip with thousands of electron channels. The pixel chip includes regularly arranged pixel array units, and the circuit on the pixel chip is transmitted to the bottom of each pixel chip by hitting information, and then transmitted to the outside of the chip. Each pixel circuit must provide low-noise amplification of the sensor charge, hit recognition and a suitable readout method. Both analog and digital must have well-defined thresholds and sufficient speed. Therefore, digital readout methods must handle higher data volumes and must transmit data faster.
然而,现有技术中的硅像素探测器读出系统、方法只可同时读取被击中像素地址和时间信息,或者只可读取能量信息,甚至只可读取能量模拟信号,无法处理更高的数据量。However, the silicon pixel detector readout system and method in the prior art can only read the address and time information of the hit pixel at the same time, or only read the energy information, or even read the energy analog signal, and cannot handle more high data volume.
发明内容Contents of the invention
针对上述问题,本发明的目的是提供一种能够快速读出硅像素探测器能量、时间和位置信息的硅像素探测器读出系统及方法。In view of the above problems, the purpose of the present invention is to provide a silicon pixel detector readout system and method capable of quickly reading out the energy, time and position information of the silicon pixel detector.
为实现上述目的,本发明采取以下技术方案:一方面,提供一种硅像素探测器读出系统,包括由M行N列的若干像素单元组成的像素阵列;In order to achieve the above object, the present invention adopts the following technical solutions: On the one hand, a silicon pixel detector readout system is provided, including a pixel array composed of several pixel units in M rows and N columns;
所述像素阵列中的每两列所述像素单元组成对应的双列像素模块,相邻的n个所述双列像素模块组成对应的超级列像素模块,若干所述超级列像素模块组成对应的列区块像素模块;所述像素阵列中的若干所述像素单元组成对应的像素集模块,其中,n≤N;Every two columns of pixel units in the pixel array form a corresponding dual-column pixel module, adjacent n double-column pixel modules form a corresponding super-column pixel module, and several super-column pixel modules form a corresponding A column block pixel module; several pixel units in the pixel array form a corresponding pixel set module, where n≤N;
每一所述像素单元内均设置有模拟信号处理电路,用于当所述像素单元被粒子击中时获取入射粒子产生的电信号,并产生对应的击中标志位信号;Each pixel unit is provided with an analog signal processing circuit, which is used to obtain the electrical signal generated by the incident particle when the pixel unit is hit by the particle, and generate a corresponding hit flag signal;
每一所述像素集模块均设置有时间数字转换电路,用于测量对应所述像素集模块击中的时间信息,并根据对应所述像素集模块内所有的击中标志位信号,产生像素集击中标志位信号;Each of the pixel set modules is provided with a time-to-digital conversion circuit, which is used to measure the time information corresponding to the hit of the pixel set module, and generate a pixel set according to all hit flag signals in the corresponding pixel set module hit flag signal;
每一所述超级列像素模块均设置有超级列控制器,用于根据对应所述超级列像素模块中所有的像素集击中标志位信号,产生读出击中标志位信号;根据对应所述超级列像素模块中所有的电信号,产生能量信号;以及存储所有有效读出击中标志位信号对应的所有有效像素集击中标志位信号对应的所述像素集模块的数据;Each of the super column pixel modules is provided with a super column controller, which is used to generate a readout hit flag bit signal according to the hit flag bit signals corresponding to all pixel sets in the super column pixel module; according to the corresponding super column pixel module All electrical signals in the column pixel module generate energy signals; and store all effective pixel sets corresponding to the hit flag signal corresponding to all effective readouts and hit the data of the pixel set module corresponding to the flag signal;
每一所述列区块像素模块均设置有列区块控制器,用于读出并存储每一所述超级列控制器内存储的数据;Each of the column block pixel modules is provided with a column block controller for reading and storing the data stored in each of the super column controllers;
读出控制器,用于读出每一所述列区块控制器内存储的数据。The readout controller is used to read out the data stored in each column block controller.
进一步地,每一所述像素集模块均包括s×s个像素单元,s≤n。Further, each pixel set module includes s×s pixel units, s≤n.
进一步地,每一所述模拟信号处理电路均包括:Further, each of the analog signal processing circuits includes:
CMOS像素传感器,用于当所述像素单元被粒子击中时,获取入射粒子产生的电信号;A CMOS pixel sensor, used to acquire the electrical signal generated by the incident particle when the pixel unit is hit by the particle;
放大电路,用于对所述CMOS像素传感器获取的电信号进行放大;an amplification circuit, configured to amplify the electrical signal obtained by the CMOS pixel sensor;
比较器,用于对放大后的电信号进行阈值鉴别,当电信号大于所述比较器阈值时产生击中标志位信号;A comparator, configured to perform threshold discrimination on the amplified electrical signal, and generate a hit flag signal when the electrical signal is greater than the threshold of the comparator;
能量输出电路,用于输出放大后的电信号至对应所述超级列控制器,以及输出产生的击中标志位信号至对应所述时间数字转换电路;The energy output circuit is used to output the amplified electrical signal to the corresponding super-column controller, and output the generated hit flag signal to the corresponding time-to-digital conversion circuit;
数字信号处理及存储器,用于存储击中所述像素单元的位置信息和对应所述能量输出电路输出的电信号。The digital signal processing and memory are used to store the position information of hitting the pixel unit and the electrical signal corresponding to the output of the energy output circuit.
进一步地,所述时间数字转换电路对对应所述像素集模块内所有所述像素单元的击中标志位信号进行OR运算,产生像素集击中标志位信号。Further, the time-to-digital conversion circuit performs an OR operation on the hit flag signals corresponding to all the pixel units in the pixel set module to generate a pixel set hit flag signal.
进一步地,每一所述超级列控制器均包括:Further, each super column controller includes:
超级列读出器,用于对对应所述超级列像素模块中产生的所有像素集击中标志位信号进行OR运算,产生读出击中标志位信号;The super column reader is used to perform an OR operation on all the pixel set hit flag signals corresponding to the super column pixel module to generate a readout hit flag signal;
所述超级列读出器还用于当读出击中标志位信号有效时,依次扫描每一像素集击中标志位信号是否有效,当像素集击中标志位信号有效时,则输出该所述像素集模块中每一所述像素单元的放大后的电信号;The super column reader is also used to sequentially scan whether the hit flag signal of each pixel set is valid when the read hit flag signal is valid, and output the said hit flag signal when the pixel set hit flag signal is valid. an amplified electrical signal of each pixel unit in the pixel set module;
区域模数转换器,用于基于所述超级列读出器的控制,根据有效像素集击中标志位信号对应的每一所述像素单元的放大后的电信号,产生数字能量信号;The area analog-to-digital converter is used to generate a digital energy signal based on the control of the super column reader, according to the amplified electrical signal of each pixel unit corresponding to the effective pixel set hit flag signal;
第一先进先出存储器,用于存储读出命中信号有效时,对应的所有有效像素集击中标志位信号对应的所述像素集模块中第一个所述像素单元的地址、该所述像素集模块的时间信息以及该所述像素集模块内所有所述像素单元的数字能量信号。The first first-in-first-out memory is used to store the address of the first pixel unit in the pixel set module corresponding to the corresponding all effective pixel set hit flag signals when the read hit signal is valid, the pixel The time information of the set module and the digital energy signals of all the pixel units in the pixel set module.
进一步地,每一所述列区块控制器均包括:Further, each column block controller includes:
令牌环读出控制模块,用于采用令牌环读出的方式,将所述列区块像素模块中所有所述超级列控制器内存储的数据读出;The token ring readout control module is used to read out the data stored in all the super column controllers in the column block pixel module by means of token ring readout;
第二先进先出存储器,用于存储所述令牌环读出控制模块读出的数据。The second FIFO memory is used for storing the data read by the token ring read control module.
进一步地,所述读出控制器读出各所述列区块控制器内存储的数据采用令牌环读出的方式。Further, the readout controller reads out the data stored in each of the column block controllers in a manner of token ring readout.
另一方面,提供一种硅像素探测器读出方法,包括:In another aspect, a silicon pixel detector readout method is provided, comprising:
设置上述硅像素探测器读出系统;Setting the above-mentioned silicon pixel detector readout system;
当某一像素单元被粒子击中时,该像素单元内的模拟信号处理电路获取入射粒子产生的电信号,并产生击中标志位信号;When a certain pixel unit is hit by a particle, the analog signal processing circuit in the pixel unit acquires the electrical signal generated by the incident particle and generates a hit flag signal;
该像素单元对应的像素集模块中,时间数字转换电路根据对应像素集模块内所有的击中标志位信号,产生像素集击中标志位信号;In the pixel set module corresponding to the pixel unit, the time-to-digital conversion circuit generates a pixel set hit flag signal according to all hit flag signals in the corresponding pixel set module;
该像素集模块对应的超级列像素模块中,超级列控制器根据对应超级列像素模块中产生的所有像素集击中标志位信号,产生有效的读出击中标志位信号;In the super column pixel module corresponding to the pixel set module, the super column controller generates an effective readout hit flag signal according to all pixel set hit flag signals generated in the corresponding super column pixel module;
当读出击中标志位信号有效时,该像素集模块对应的超级列像素模块中,超级列控制器根据对应超级列像素模块中所有像素单元测量的电信号,产生能量信号,并存储所有有效像素集击中标志位信号对应的所述像素集模块的数据;When the read hit flag bit signal is valid, in the super column pixel module corresponding to the pixel set module, the super column controller generates an energy signal according to the electrical signals measured by all pixel units in the corresponding super column pixel module, and stores all effective pixels Set the data of the pixel set module corresponding to the hit flag bit signal;
该像素集模块对应的列区块像素模块中,列区块控制器读出并存储每一超级列控制器内存储的数据;In the column block pixel module corresponding to the pixel set module, the column block controller reads and stores the data stored in each super column controller;
读出控制器读出所有列区块控制器内存储的数据,并传输至外部。The readout controller reads out all the data stored in the column block controller and transmits them to the outside.
进一步地,所述当某一像素单元被粒子击中时,该像素单元内的模拟信号处理电路获取入射粒子产生的电信号,并产生击中标志位信号,包括:Further, when a certain pixel unit is hit by a particle, the analog signal processing circuit in the pixel unit acquires the electrical signal generated by the incident particle, and generates a hit flag signal, including:
当某一像素单元被粒子击中时,该像素单元内模拟信号处理电路的CMOS像素传感器获取入射粒子产生的电信号;When a certain pixel unit is hit by a particle, the CMOS pixel sensor of the analog signal processing circuit in the pixel unit acquires the electrical signal generated by the incident particle;
放大电路对CMOS像素传感器获取的电信号进行放大;The amplification circuit amplifies the electrical signal obtained by the CMOS pixel sensor;
比较器对放大后的电信号进行阈值鉴别,当电信号大于比较器阈值时产生击中标志位信号;The comparator performs threshold discrimination on the amplified electrical signal, and generates a hit flag signal when the electrical signal is greater than the threshold of the comparator;
能量输出电路输出放大后的电信号至对应超级列控制器,并输出产生的击中标志位信号至时间数字转换电路;The energy output circuit outputs the amplified electrical signal to the corresponding super column controller, and outputs the generated hit flag signal to the time-to-digital conversion circuit;
数字信号处理及存储器存储击中像素单元的位置信息和对应能量输出电路输出的电信号,并将存储的信息通过读出构架判选传输至芯片外部。The digital signal processing and memory store the position information of the hit pixel unit and the electrical signal output by the corresponding energy output circuit, and transmit the stored information to the outside of the chip through the readout frame selection.
进一步地,所述当读出击中标志位信号有效时,该像素集模块对应的超级列像素模块中,超级列控制器根据对应超级列像素模块中所有像素单元测量的电信号,产生能量信号,并存储所有有效像素集击中标志位信号对应的所述像素集模块的数据,包括:Further, when the read hit flag signal is valid, in the super column pixel module corresponding to the pixel set module, the super column controller generates an energy signal according to the electrical signals measured by all pixel units in the corresponding super column pixel module, And store the data of the pixel set module corresponding to all effective pixel set hit flag signals, including:
当读出击中标志位信号有效时,该像素集模块对应的超级列像素模块中,超级列控制器依次扫描对应的每一像素集击中标志位信号是否有效,若像素集击中标志位信号有效,则将该像素集模块中每一像素单元的放大后的电信号输出至区域模数转换器,并控制区域模数转换器开始采样;When the read hit flag signal is valid, in the super column pixel module corresponding to the pixel set module, the super column controller sequentially scans whether the corresponding pixel set hit flag signal is valid, if the pixel set hit flag signal If it is valid, the amplified electrical signal of each pixel unit in the pixel set module is output to the regional analog-to-digital converter, and the regional analog-to-digital converter is controlled to start sampling;
区域模数转换器基于超级列读出器的控制,根据有效像素集击中标志位信号对应的每一像素单元的放大后的电信号,产生数字能量信号;The area analog-to-digital converter is based on the control of the super column reader, and generates a digital energy signal according to the amplified electrical signal of each pixel unit corresponding to the effective pixel set hitting the flag signal;
第一先进先出存储器存储读出命中信号有效时,对应的所有有效像素集击中标志位信号对应的像素集模块中第一个像素单元的地址、该像素集模块的时间信息以及该像素集模块内所有像素单元的数字能量信号。The first FIFO memory stores the address of the first pixel unit in the pixel set module corresponding to the corresponding effective pixel set hit signal when the readout hit signal is valid, the time information of the pixel set module, and the pixel set The digital energy signal of all pixel units in the module.
本发明由于采取以上技术方案,其具有以下优点:The present invention has the following advantages due to the adoption of the above technical scheme:
1、本发明中由于设置有时间数字转换电路和超级列控制器,通过时间数字转换电路产生像素集击中标志位信号,通过超级列控制器根据像素集击中标志位信号产生读出命中信号,产生的读出命中信号用于控制是否进行扫描,以及其中的区域模数转换器是否开启,能够有效降低区域模数转换器带来的功耗,提高时间测量的精度。1. In the present invention, since the time-to-digital conversion circuit and the super column controller are provided, the time-to-digital conversion circuit generates the pixel set hit flag signal, and the super column controller generates the readout hit signal according to the pixel set hit flag signal , the generated readout hit signal is used to control whether to scan, and whether to turn on the regional analog-to-digital converter, which can effectively reduce the power consumption brought by the regional analog-digital converter and improve the accuracy of time measurement.
2、因为在单位像素单元中总线信号占用的面积更少,所以本发明像素阵列中的像素单元按照列进行分组,更具有优势。2. Because the area occupied by the bus signal in the unit pixel unit is less, the pixel units in the pixel array of the present invention are grouped by columns, which is more advantageous.
3、本发明中当产生有效的读出击中标志位信号时,才通过超级列读出器对像素集击中标志位信号进行逐一检查,可以有效的减少读出像素的数量。3. In the present invention, when an effective readout hit flag signal is generated, the pixel set hit flag signal is checked one by one by the super column reader, which can effectively reduce the number of read pixels.
4、本发明中的列区块控制器和读出控制器均采用令牌环读出的方式读出数据,可以提高读出速度。4. Both the column block controller and the readout controller in the present invention use token ring readout to read out data, which can increase the readout speed.
5、本发明中对像素阵列进行像素集模块、超级列像素模块和列区块像素模块的分区,能够逐步检测和筛选有效信息,提高有效数据量的传输。5. In the present invention, the pixel array is divided into pixel set modules, super column pixel modules and column block pixel modules, which can gradually detect and screen effective information and improve the transmission of effective data volume.
6、本发明中设置有超级列控制器,不仅可以在读出击中标志位信号有效时再开启区域模数转换器,从而有效降低区域模数转换器带来的功耗,而且可以筛选有效击中像素集,明确读出有效击中的位置、时间、能量信号。6. The present invention is provided with a super-column controller, which can not only turn on the regional analog-to-digital converter when the read hit flag signal is valid, thereby effectively reducing the power consumption brought by the regional analog-to-digital converter, but also can screen effective hits. Pixel set, unambiguously read out the position, time, and energy signal of a valid hit.
7、本发明可同时兼顾读出硅像素探测器能量、时间和位置(像素地址)数字化信息。7. The present invention can simultaneously read out the digitized information of silicon pixel detector energy, time and position (pixel address).
综上所述,本发明可以广泛应用于半导体探测器技术领域中。In summary, the present invention can be widely applied in the technical field of semiconductor detectors.
附图说明Description of drawings
通过阅读下文优选实施方式的详细描述,各种其他的优点和益处对于本领域普通技术人员将变得清楚明了。附图仅用于示出优选实施方式的目的,而并不认为是对本发明的限制。在整个附图中,用相同的附图标记表示相同的部件。在附图中:Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiment. The drawings are only for the purpose of illustrating a preferred embodiment and are not to be considered as limiting the invention. Throughout the drawings, the same reference numerals are used to refer to the same parts. In the attached picture:
图1是本发明一实施例提供的读出系统结构示意图;Fig. 1 is a schematic structural diagram of a readout system provided by an embodiment of the present invention;
图2是本发明一实施例提供的模拟信号处理电路的信号处理过程示意图;2 is a schematic diagram of a signal processing process of an analog signal processing circuit provided by an embodiment of the present invention;
图3是本发明一实施例提供的读出具体实现过程示意图;Fig. 3 is a schematic diagram of a specific implementation process of reading provided by an embodiment of the present invention;
图4是本发明一实施例提供的芯片级读出方式示意图。FIG. 4 is a schematic diagram of a chip-level readout method provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面将参照附图更详细地描述本发明的示例性实施方式。虽然附图中显示了本发明的示例性实施方式,然而应当理解,可以以各种形式实现本发明而不应被这里阐述的实施方式所限制。相反,提供这些实施方式是为了能够更透彻地理解本发明,并且能够将本发明的范围完整地传达给本领域的技术人员。Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present invention, and to fully convey the scope of the present invention to those skilled in the art.
应理解的是,文中使用的术语仅出于描述特定示例实施方式的目的,而无意于进行限制。除非上下文另外明确地指出,否则如文中使用的单数形式“一”、“一个”以及“所述”也可以表示包括复数形式。术语“包括”、“包含”、“含有”以及“具有”是包含性的,并且因此指明所陈述的特征、步骤、操作、元件和/或部件的存在,但并不排除存在或者添加一个或多个其它特征、步骤、操作、元件、部件、和/或它们的组合。文中描述的方法步骤、过程、以及操作不解释为必须要求它们以所描述或说明的特定顺序执行,除非明确指出执行顺序。还应当理解,可以使用另外或者替代的步骤。It should be understood that the terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may also be meant to include the plural forms unless the context clearly dictates otherwise. The terms "comprising", "comprising", "containing" and "having" are inclusive and thus indicate the presence of stated features, steps, operations, elements and/or parts but do not exclude the presence or addition of one or Various other features, steps, operations, elements, components, and/or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless an order of performance is specifically indicated. It should also be understood that additional or alternative steps may be used.
尽管可以在文中使用术语第一、第二、第三等来描述多个元件、部件、区域、层和/或部段,但是,这些元件、部件、区域、层和/或部段不应被这些术语所限制。这些术语可以仅用来将一个元件、部件、区域、层或部段与另一区域、层或部段区分开。除非上下文明确地指出,否则诸如“第一”、“第二”之类的术语以及其它数字术语在文中使用时并不暗示顺序或者次序。因此,以下讨论的第一元件、部件、区域、层或部段在不脱离示例实施方式的教导的情况下可以被称作第二元件、部件、区域、层或部段。Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be referred to as These terms are limited. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
为了便于描述,可以在文中使用空间相对关系术语来描述如图中示出的一个元件或者特征相对于另一元件或者特征的关系,这些相对关系术语例如为“内部”、“外部”、“内侧”、“外侧”、“下面”、“上面”等。这种空间相对关系术语意于包括除图中描绘的方位之外的在使用或者操作中装置的不同方位。For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature as shown in the figures with respect to another element or feature, such as "inner", "outer", "inner". ", "Outside", "Below", "Above", etc. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
由于粒子物理实验的实验需求,前端电路和探测器信号处理电路始终与控制读出逻辑紧密联系在一起。前端电路得到的命中信息必须由控制电路和芯片外围的读出电路进一步传输处理。读出的方法在很大程度上取决于目标应用。在粒子物理的应用中需要更详细的信息,必须提供所有命中的位置,通常还有时间和相应的脉冲幅度。合适的读出方法的选择主要取决于可用的芯片和可接受的命中损失。本发明实施例提供的硅像素探测器读出系统及方法,能够快速读出命中信号的有效信息,包括能量、时间和位置信息,同时也对电路其他模块的低功耗性能进行相应的考虑。尽管现有的像素芯片使用不同的几何形状、读出原理和模拟电路,但在设计的主要部分中,有几个模块的构建和特性是相似的。每一像素单元均包含一个模拟信号处理电路,且在大多数情况下包含用于测量和读取测量数据的数字逻辑。Due to the experimental requirements of particle physics experiments, the front-end circuit and detector signal processing circuit are always closely connected with the control readout logic. The hit information obtained by the front-end circuit must be further transmitted and processed by the control circuit and the readout circuit on the periphery of the chip. The method of readout depends largely on the target application. In applications in particle physics where more detailed information is required, the locations of all hits must be provided, often also times and corresponding pulse amplitudes. The choice of a suitable readout method depends primarily on the available chips and the acceptable hit loss. The silicon pixel detector readout system and method provided by the embodiments of the present invention can quickly read out the effective information of the hit signal, including energy, time and position information, and also consider the low power consumption performance of other modules of the circuit. Although existing pixel chips use different geometries, readout principles, and analog circuits, there are several blocks that are similar in build and characteristics in the main part of the design. Each pixel cell contains an analog signal processing circuit and in most cases digital logic for measuring and reading the measured data.
实施例1Example 1
如图1所示,本实施例提供一种硅像素探测器读出系统,包括像素阵列1,其中,像素阵列1是由M行N列的若干像素单元11组成。As shown in FIG. 1 , this embodiment provides a silicon pixel detector readout system, including a pixel array 1 , wherein the pixel array 1 is composed of
像素阵列1中的每两列像素单元11组成对应的双列(Double Columns,DCol)像素模块2,以便在像素单元11之间共享电路并减少数字和模拟部分之间的串扰。相邻的n(n≤N)个双列像素模块2组成对应的超级列(Super Colum)像素模块3,若干超级列像素模块3组成对应的列区块像素模块4(Column Block)。每s×s(s≤n)个像素单元11组成对应的像素集模块5(Cluster)。Every two columns of
如图1和图3所示,该硅像素探测器读出系统还包括模拟信号处理电路、时间数字转换电路6(Time to Digital Converter,TDC)、超级列控制器7(Super ColumnController,SCC)、列区块控制器8(Column Block Controller,CBC)和读出控制器9(Readout Controller)。As shown in Figures 1 and 3, the silicon pixel detector readout system also includes an analog signal processing circuit, a time-to-digital conversion circuit 6 (Time to Digital Converter, TDC), a super column controller 7 (Super Column Controller, SCC), Column Block Controller 8 (Column Block Controller, CBC) and Readout Controller 9 (Readout Controller).
每一像素单元11内均设置有模拟信号处理电路,模拟信号处理电路用于当像素单元11被粒子击中时获取入射粒子产生的电信号,并产生对应的击中标志位信号(hitflag)。Each
每一像素集模块5均设置有时间数字转换电路6,时间数字转换电路6用于测量对应像素集模块5击中的时间信息,并对对应像素集模块5内所有像素单元11的击中标志位信号进行OR运算,产生像素集击中标志位信号(Cluster Hit),并将像素集击中标志位信号作为时间数字转换电路6的起始信号。Each pixel set
每一超级列像素模块3均设置有超级列控制器7(SCC),每一超级列控制器7均分别连接对应超级列像素模块3内各像素集模块5的时间数字转换电路6,用于对对应超级列像素模块3中产生的所有像素集击中标志位信号进行OR运算,产生读出击中标志位信号(readout hit);根据对应超级列像素模块3中所有像素单元11测量的电信号,产生能量信号;以及存储所有有效读出击中标志位信号对应的所有有效像素集击中标志位信号对应的像素集模块5中第一个像素单元11的地址、该像素集模块5的时间信息以及该像素集模块5内所有像素单元11的能量信号。Each super
每一列区块像素模块4均设置有列区块控制器8(CBC),每一列区块控制器8分别连接对应列区块像素模块4内每一超级列像素模块3的超级列控制器7,列区块控制器8用于采用令牌环读出的方式,读出并存储每一超级列控制器7内存储的数据。Each column
读出控制器9分别连接每一列区块控制器8,读出控制器9用于采用令牌环读出的方式,读出每一列区块控制器8内存储的数据,并传输至外部。The readout controller 9 is respectively connected to each column block controller 8, and the readout controller 9 is used to read out the data stored in each column block controller 8 by means of token ring readout, and transmit the data to the outside.
在一个优选的实施例中,像素阵列1中的像素单元11按列分组,即,控制信号以及输出数据流垂直路由。因为在像素单元11中总线信号占用的面积更少的原则,所以采用本实施例的基于列的公式更具有优势。In a preferred embodiment, the
在一个优选的实施例中,如图2所示,每一模拟信号处理电路均包括CMOS像素传感器12、放大电路13、比较器14、能量输出电路15和数字信号处理及存储器16。In a preferred embodiment, as shown in FIG. 2 , each analog signal processing circuit includes a CMOS pixel sensor 12 , an
CMOS像素传感器12用于当像素单元11被粒子击中时,获取入射粒子产生的电信号。The CMOS pixel sensor 12 is used to acquire the electrical signal generated by the incident particle when the
放大电路13用于对CMOS像素传感器12获取的电信号进行放大。The
比较器14用于对放大后的电信号进行阈值鉴别,当电信号大于比较器14阈值时,产生击中标志位信号,当击中标志位信号为1时即为有效,为0时即为无效。The comparator 14 is used to carry out threshold value identification on the amplified electrical signal. When the electrical signal is greater than the threshold value of the comparator 14, a hit flag signal is generated. When the hit flag signal is 1, it is valid, and when it is 0, it is invalid.
能量输出电路15用于输出放大后的电信号至对应超级列控制器7,以及输出产生的击中标志位信号至对应时间数字转换电路6。The
数字信号处理及存储器16用于存储击中像素单元11的位置信息和对应能量输出电路15输出的电信号,并将存储的信息通过读出构架判选传输至芯片外部。The digital signal processing and memory 16 is used to store the position information of the
在一个优选的实施例中,如图3所示,每一超级列控制器7均包括超级列读出器71(Super Column Reader,SCR)、区域模数转换器72(Regional ADC)和第一先进先出存储器73。In a preferred embodiment, as shown in Figure 3, each
超级列读出器71用于对对应超级列像素模块3中时间数字转换电路6产生的所有像素集击中标志位信号进行OR运算,产生读出击中标志位信号。The
超级列读出器71还用于当读出击中标志位信号有效时,从上到下依次扫描对应的每一像素集击中标志位信号是否有效(为1时即为有效,为0时即为无效),若像素集击中标志位信号无效,则跳过该像素集模块5至下一像素集模块5;若像素集击中标志位信号有效,则将该像素集模块5中每一像素单元11的放大后的电信号输出至区域模数转换器72,并控制区域模数转换器72开始采样,以有效降低区域模数转换器72带来的功耗。The
区域模数转换器72用于基于超级列读出器71的控制,根据有效像素集击中标志位信号对应的每一像素单元11的放大后的电信号,产生代表能量的幅值信号,即数字能量信号。The area analog-to-
第一先进先出存储器73用于存储读出命中信号有效时,对应的所有有效像素集击中标志位信号对应的像素集模块5中第一个像素单元11(即图3中左上角的像素单元11)的地址、该像素集模块5的时间信息以及该像素集模块5内所有像素单元11的数字能量信号。The
在一个优选的实施例中,如图4所示,每一列区块控制器8均包括令牌环读出控制模块81和第二先进先出存储器82。In a preferred embodiment, as shown in FIG. 4 , each block controller 8 includes a token ring readout control module 81 and a second FIFO memory 82 .
令牌环读出控制模块81用于采用令牌环读出的方式,将列区块像素模块4中所有超级列控制器7内第一先进先出存储器73中存储的数据读出。The token ring readout control module 81 is used to read out the data stored in the
第二先进先出存储器82用于存储令牌环读出控制模块81读出的数据,以提高每一列区块像素模块4的读出速度。The second FIFO memory 82 is used to store the data read out by the token ring readout control module 81 to increase the readout speed of the
具体地,读出击中标志位信号的产生过程为:Specifically, the generation process of reading out the hit flag signal is:
如图2所示,通过模拟信号处理电路的比较器14产生击中标志位信号,当击中标志位信号为1时即为有效,为0时即为无效,像素集模块5中所有像素单元11各自输出各自对应的击中标志位信号,这些击中标志位信号无论为0还是为1均输入至对应时间数字转换电路6进行OR运算产生像素集击中标志位信号,同理,当像素集击中标志位信号为1时即为有效,为0时即为无效。如图3所示,每一像素集模块5输出各自对应的像素集击中标志位信号,这些像素集击中标志位信号无论为0还是为1均输入至对应超级列控制器7进行OR运算产生读出击中标志位信号,当读出击中标志位信号为1时即为有效,为0时即为无效。As shown in Figure 2, the comparator 14 of the analog signal processing circuit generates the hit flag signal, when the hit flag signal is 1, it is valid, and when it is 0, it is invalid, and all pixel units in the pixel set
实施例2Example 2
本实施例提供一种硅像素探测器读出方法,包括以下步骤:This embodiment provides a silicon pixel detector readout method, including the following steps:
1)设置实施例1的硅像素探测器读出系统。1) Set up the silicon pixel detector readout system of Embodiment 1.
2)当某一像素单元11被粒子击中时,该像素单元11内的模拟信号处理电路获取入射粒子产生的电信号,并产生击中标志位信号,具体为:2) When a
2.1)当某一像素单元11被粒子击中时,该像素单元11内模拟信号处理电路的CMOS像素传感器12获取入射粒子产生的电信号。2.1) When a
2.2)该像素单元11内模拟信号处理电路的放大电路13对CMOS像素传感器12获取的电信号进行放大。2.2) The
2.3)该像素单元11内模拟信号处理电路的比较器14对放大后的电信号进行阈值鉴别,当电信号大于比较器14阈值时产生击中标志位信号,当击中标志位信号为1时即为有效,为0时即为无效。2.3) The comparator 14 of the analog signal processing circuit in the
2.4)该像素单元11内模拟信号处理电路的能量输出电路15输出放大后的电信号至对应超级列控制器7,并输出产生的击中标志位信号至时间数字转换电路6。2.4) The
2.5)该像素单元11内模拟信号处理电路的数字信号处理及存储器16存储击中像素单元11的位置信息和对应能量输出电路15输出的电信号,并将存储的信息通过读出构架判选传输至芯片外部。2.5) The digital signal processing of the analog signal processing circuit in the
3)该像素单元11对应的像素集模块5中,时间数字转换电路6对对应像素集模块5内所有像素单元11的击中标志位信号进行OR运算,产生像素集击中标志位信号,并将像素集击中标志位信号作为时间数字转换电路6的起始信号。3) In the pixel set
4)该像素集模块5对应的超级列像素模块3中,超级列控制器7对应超级列像素模块3中产生的所有像素集击中标志位信号进行OR运算,产生有效的读出击中标志位信号。4) In the super
具体地,该像素集模块5对应的超级列像素模块3中超级列读出器71,对对应超级列像素模块3中时间数字转换电路6产生的所有像素集击中标志位信号进行OR运算,产生读出击中标志位信号,当读出击中标志位信号为1时即为有效,为0时即为无效。Specifically, the
5)当读出击中标志位信号有效时,该像素集模块5对应的超级列像素模块3中,超级列控制器7根据对应超级列像素模块3中所有像素单元11测量的电信号,产生能量信号,并存储有效的读出击中标志位信号对应的所有有效像素集击中标志位信号对应的像素集模块5中第一个像素单元11的地址、该像素集模块5的时间信息以及该像素集模块5内所有像素单元11的能量信号,具体为:5) When the read hit flag bit signal is valid, in the super
5.1)当读出击中标志位信号有效时,该像素集模块5对应的超级列像素模块3中,超级列控制器7从上到下依次扫描对应的每一像素集击中标志位信号是否有效,若像素集击中标志位信号无效,则跳过该像素集模块5至下一像素集模块5;若像素集击中标志位信号有效,则将该像素集模块5中每一像素单元11的放大后的电信号输出至区域模数转换器72,并控制区域模数转换器72开始采样。5.1) When the read hit flag signal is valid, in the super
5.2)区域模数转换器72基于超级列读出器71的控制,根据有效像素集击中标志位信号对应的每一像素单元11的放大后的电信号,产生代表能量的幅值信号,即数字能量信号。5.2) The area analog-to-
5.3)第一先进先出存储器73存储读出命中信号有效时,对应的所有有效像素集击中标志位信号对应的像素集模块5中第一个像素单元11的地址、该像素集模块5的时间信息以及该像素集模块5内所有像素单元11的数字能量信号。5.3) The first first-in-first-
6)该像素集模块5对应的列区块像素模块4中,列区块控制器8采用令牌环读出的方式,读出并存储每一超级列控制器7内存储的数据。6) In the column
7)读出控制器9采用令牌环读出的方式,读出所有列区块控制器8内存储的数据,并传输至外部。7) The readout controller 9 reads out all the data stored in the column block controller 8 by means of token ring readout, and transmits them to the outside.
上述各实施例仅用于说明本发明,其中各部件的结构、连接方式和制作工艺等都是可以有所变化的,凡是在本发明技术方案的基础上进行的等同变换和改进,均不应排除在本发明的保护范围之外。The above-mentioned embodiments are only used to illustrate the present invention, wherein the structure, connection mode and manufacturing process of each component can be changed to some extent, and any equivalent transformation and improvement carried out on the basis of the technical solution of the present invention should not excluded from the protection scope of the present invention.
Claims (9)
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