CN115321221A

CN115321221A - High-speed compound die cutting process method and equipment for RFID (radio frequency identification) tag

Info

Publication number: CN115321221A
Application number: CN202210968786.0A
Authority: CN
Inventors: 张占平; 郑洋; 刘春华
Original assignee: Changzhou Hadesheng Precision Technology Co ltd
Current assignee: Changzhou Hadesheng Precision Technology Co ltd
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2022-11-11

Abstract

The present disclosure relates to the field of RFID processing technology, and in particular, to a high-speed composite die-cutting process and apparatus for RFID tags, wherein the process comprises the following steps: s10: unreeling, and unreeling the bottom paper roll and the dry inlay roll towards the same direction; s20: compound die cutting, namely attaching the base paper and the dry inlay layer together, and die cutting the dry inlay layer into a set parallel sheet structure; s30: turning over and transferring, namely transferring the flaky dried inlay on the base paper to the base film; s40: compounding the upper layer, namely attaching the upper layer film to the attached base film and the flaky dried inlay arranged on the base film at equal intervals; s50: and (3) cutting the shape of the upper layer film, so that the upper layer film is cut into a sheet structure covering each sheet-shaped dry inlay, the rest upper layer films are rolled and waste-discharged, and the final finished product is rolled. According to the composite die cutting method, the streamlined operation of the RFID tag is realized by the mode of die cutting firstly and then transferring and finally compounding, and the processing efficiency is improved.

Description

High-speed compound die cutting process method and equipment for RFID (radio frequency identification) tag

Technical Field

The disclosure relates to the technical field of RFID (radio frequency identification) processing, in particular to a high-speed compound die-cutting process method and high-speed compound die-cutting equipment for an RFID label.

Background

The RFID tag is also called as a radio frequency tag, and is mainly used in the industrial and commercial automation fields of identification of articles, information acquisition and the like through information in the radio frequency identification tag;

in the related technology known by the inventor, the RFID chip is mostly clamped between the base paper and the surface paper in the RFID tag product, and during specific processing, a roll material (also called a dry inlay roll) of the RFID chip is cut into individual sheet-shaped structures, then the individual sheet-shaped RFID chips are uniformly attached to the base paper at equal intervals, and finally a surface cover film is attached to the upper surface of each RFID chip attached to the base paper, wherein the surface cover film has contents for recording information of the RFID chip;

however, the inventor finds that, in the implementation of the above embodiment, each step of the above process requires manual intervention, and not only needs to glue the bottom of each RFID chip, but also needs to attach a surface cover film on each RFID chip separately, and even if each step involves an organic device, the production efficiency still cannot be improved.

The information disclosed in this background section is only for enhancement of understanding of the general background of the disclosure and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is known to a person skilled in the art.

Disclosure of Invention

In view of at least one of the above technical problems, the present disclosure provides a high-speed composite die-cutting process method and device for RFID tags, which implement line production by die-cutting and then transfer-bonding, so as to improve the processing efficiency of RFID products.

According to a first aspect of the present disclosure, there is provided a high-speed composite die-cutting process method for RFID tags, comprising the following steps:

s10: unreeling, unreeling the base paper roll and the dry inlay roll in the same direction, and gluing one surface of the base paper facing the dry inlay layer in the unreeling process;

s20: compound die cutting, namely attaching the base paper and the dry inlay layer together, die cutting the dry inlay layer into a set parallel sheet structure, and rolling the cut inlay outer frame and the redundant part to discharge waste;

s30: turning over and transferring, namely turning over the die-cut dry inlay and the base paper by 180 degrees, transferring the sheet-shaped dry inlay on the base paper to a bottom film and discharging waste from the base paper, wherein when the transfer is performed, a set equal distance is reserved between every two adjacent sheet-shaped dry inlays, and the bottom film is one layer of the double-layer non-setting adhesive after unreeling;

s40: compounding the upper layer, namely attaching the upper layer film to the pasted bottom film and the flaky dried inlays arranged on the bottom film at equal intervals, wherein the upper layer film is the other layer of the double-layer non-setting adhesive after being unreeled;

s50: and (3) cutting the shape of the upper layer film, so that the upper layer film is cut into a sheet structure covering each sheet-shaped dry inlay, the rest upper layer films are rolled and waste-discharged, and the final finished product is rolled.

In some embodiments of the present disclosure, the base paper is glassine base paper.

In some embodiments of the present disclosure, when unwinding, the dry inlay roll is arranged in at least one row side by side along the width direction of the base paper.

In some embodiments of the present disclosure, when the surface is turned over, there is a speed difference between the traveling speed of the bottom film and the traveling speed of the sheet-shaped dry inlay, so as to realize the equal interval arrangement of the sheet-shaped dry inlays.

In some embodiments of the present disclosure, when the backing paper is turned over, the side edges of the backing paper and the bottom film are provided with identification marks at equal intervals, so as to realize adjustment when the backing paper and the bottom film are arranged at equal intervals.

In some embodiments of the present disclosure, during the turning and transferring, a buffering process is further included at the front section of the transfer of the base paper and the dry inlay to realize the matching of the adjustment and ensure the tensioning of the tape transport.

According to a second aspect of the present disclosure, there is also provided an RFID label high-speed composite die-cutting apparatus, which is applied to the RFID label high-speed composite die-cutting process method according to any one of the first aspects, and includes:

the unwinding assembly comprises a base paper unwinding mechanism, a dry inlay unwinding mechanism and a double-layer adhesive sticker unwinding mechanism;

the die cutting assembly is used for cutting the dry inlay layer in the tape transport which is fed and compounded by the base paper unwinding mechanism and the dry inlay unwinding mechanism into a sheet-shaped structure which is arranged in parallel;

the transfer pasting component is used for transferring the sheet-shaped drying inlay to one layer of the double-layer non-setting adhesive unreeling mechanism at equal intervals;

the composite assembly is used for covering a layer of upper film on the connected sheet-shaped drying inlay layer, and the upper film is the other layer discharged by the double-layer non-setting adhesive unreeling mechanism;

the cutting assembly is used for cutting the upper film to enable the upper film to be a cover film which corresponds to each sheet of the sheet-shaped dry inlay layer and is at equal intervals;

the winding assembly is used for winding a finished product after the cover film is cut;

the waste discharge assembly is used for winding a dry inlay layer after die cutting, winding base paper and winding the upper film after die cutting.

In some embodiments of the present disclosure, the dry inlay unwinding mechanism has at least one set.

In some embodiments of the disclosure, the device further comprises a buffer mechanism, wherein the buffer mechanism comprises two guide rollers and a moving roller which is movably arranged between the two guide rollers along the direction of the perpendicular bisector of the two guide rollers and is used for keeping the tension of the tape.

In some embodiments of the present disclosure, the transfer assembly includes a vacuum roll having vacuuming holes for adsorbing the sheet-like dry inlay on one radial side thereof and attached to the base film on the other radial side thereof.

The beneficial effect of this disclosure does: the method comprises the steps of compounding a dry inlay layer with base paper, cutting the dry inlay layer into parallel sheet structures in a die cutting mode, and turning over and transferring the dry inlay arranged in a sheet shape; (ii) a The film is attached to the bottom film at equal intervals, and the final product is rolled through the covering of the upper film and the cutting of the shape; compared with the prior art, the composite die cutting method realizes the streamlined operation of the RFID tag by the mode of die cutting, transfer pasting and final compounding, and improves the processing efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a flow chart illustrating steps of a high speed composite die cutting process for RFID tags according to an embodiment of the present disclosure;

FIG. 2 is a schematic flow chart of a high-speed composite die-cutting process for RFID tags according to an embodiment of the present disclosure;

FIG. 3 is a process route diagram of a high-speed composite die-cutting process for RFID tags according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of a dry inlay and a base paper for die cutting in an embodiment of the disclosure

FIG. 5 is a schematic structural diagram of a dry inlay during transfer in an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of an RFID tagged article in an embodiment of the disclosure;

FIG. 7 is a schematic diagram of a dual-column version of an RFID tag product according to an embodiment of the present disclosure;

fig. 8 is a front view of an RFID label high speed composite die cutting apparatus in an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

According to the RFID chip roll material processing method, the RFID chip roll material is processed into the sheet materials which are distributed at intervals and are attached with the film through the process of die cutting and then transferring, so that the processing efficiency of the RFID chip is greatly improved;

the high-speed compound die-cutting process method for the RFID label shown in FIG. 1 comprises the following steps:

s10: unreeling, unreeling the base paper roll and the dry inlay roll in the same direction, and gluing one surface of the base paper, which faces the dry inlay layer, in the unreeling process; for easy understanding, please refer to the flowchart in fig. 2 and the process route diagram in fig. 3, when unwinding the base paper and the dry inlay, a conventional drawing roller may be used, during the drawing, in order to prevent the deviation of the running, an existing deviation rectifying device may be used to rectify the deviation, and the glue spreader for gluing the base paper is also a conventional prior art, and will not be described in detail here;

s20: compound die cutting, namely attaching the base paper and the dry inlay layer together, die cutting the dry inlay layer into a set sheet structure in parallel, and rolling the cut inlay outer frame and the redundant part to discharge waste; in the embodiment of the disclosure, the Inlay supplied material product mode is parallel or has a certain distance, the excess part of the product needs to be cut off (the product with the distance needs to cut and discharge the excess waste material in the distance), similar to the cutting in a shape like a Chinese character hui; the compounding refers to that the base paper and the dry inlay layer are adhered together to form a compound layer, then the shape of the dry inlay is cut out in a die cutting mode, and the rest part is discharged in a rolling mode; as shown in fig. 4, the die cutting structure schematic diagram of the base paper and the dry inlay, after die cutting, the upper layer of the dry inlay is arranged in parallel in a sheet shape, and the rest waste materials are discharged by rolling;

s30: turning over and transferring, namely turning over the die-cut dry inlay and the base paper by 180 degrees, transferring the sheet-shaped dry inlay on the base paper to a bottom film and discharging waste from the base paper, wherein when the transfer is performed, equal intervals are set between every two adjacent sheet-shaped dry inlays, and the bottom film is one layer of the double-layer non-setting adhesive after unreeling; as shown in fig. 5, the die-cut sheet-shaped dried inlay and the base paper are turned over 180 degrees, so that the sheet-shaped dried inlay faces downwards, and then the sheet-shaped dried inlay is transferred and pasted on the base film at equal intervals through a transfer and pasting process; it should be noted that, when the transfer is specifically carried out, the transfer roller has a vacuumizing adsorption function, so that the sheet-shaped dry inlay can be transferred and adhered to the bottom film; through the above process, the original juxtaposition or small pitch becomes the discrete form of the final desired equally spaced arrangement.

S40: compounding the upper layer, namely attaching the upper layer film to the pasted bottom film and the flaky dried inlays arranged on the bottom film at equal intervals, wherein the upper layer film is the other layer of the double-layer non-setting adhesive after being unreeled; referring to fig. 3, after the sheet-shaped dry inlay is transferred, the sheet-shaped dry inlay is subjected to film lamination, so that a sandwich form covering the discrete sheet-shaped dry inlay is formed;

s50: and (3) cutting the appearance, namely cutting the appearance of the upper layer film to enable the upper layer film to be cut into a sheet structure covering each sheet-shaped dry inlay, rolling and discharging the rest upper layer film, and rolling the final finished product. The shape cutting is similar to the die cutting in fig. 4, except that when the shape cutting is performed, the upper film is cut, the finally formed material belt is as shown in fig. 6, wherein the rectangle is the upper film after the shape cutting, the dotted line part represents the sheet-shaped dry inlay covered by the upper film, and then the belt is wound, so that the whole processing technology of the RFID tag is completed.

In the embodiment, the dry inlay layer is compounded with the base paper, then the dry inlay layer is cut into the sheet structures which are arranged in parallel in a die cutting mode, and the dry inlay arranged in the sheet shape is turned over and pasted in a rotating mode; (ii) a The film is attached to the bottom film at equal intervals, and the final product is rolled through the covering of the upper film and the cutting of the shape; compared with the related art, the composite die-cutting method realizes the streamlined operation of the RFID tag by a mode of firstly die-cutting and then transferring and finally compounding, and improves the processing efficiency.

On the basis of the above embodiments, in some embodiments of the present disclosure, the material of the base paper is glassine base paper. The glassine base paper is compact and uniform in texture, can be made into release paper through coating, is slightly hard in texture, is particularly suitable for being used as base paper for die cutting, and can ensure that the upper dry inlay is cut off and the base paper is not damaged;

in the embodiment of the disclosure, one row can be processed at a time, and a plurality of rows can also be processed simultaneously, and when unreeling, the dry inlay roll is arranged side by side along the width direction of the base paper by at least one row. As shown in fig. 7, in the embodiment of the present disclosure, the die-cutting blade and other mechanisms may be appropriately deformed to process multiple rows simultaneously, so that the processing efficiency is further improved; it should be noted that the two columns shown in fig. 7 are only examples, and those skilled in the art may set three, four or even more columns as needed, but the processing manner using the above process flow of the present disclosure falls within the scope of the present disclosure.

With reference to fig. 5, in the embodiment of the disclosure, when the surface is turned over, there is a speed difference between the traveling speed of the bottom film and the traveling speed of the sheet-like dry inlay, so as to realize the equal interval arrangement of the sheet-like dry inlays. The advancing speed of the stem inlay refers to the advancing speed before the stem inlay is not attached to the bottom film, and the equal-interval arrangement of the stem inlay is realized through the matching of the speed difference;

in order to realize that the speed difference between the bottom paper and the basement membrane is a fixed value, namely, to ensure the uniformity of the interval of the drying inlay on the basement membrane, when the basement membrane is turned over and pasted, the side edges of the basement membrane and the bottom paper are respectively provided with identification marks (not shown in the figure) at equal intervals so as to realize the adjustment when the basement membrane and the basement membrane are arranged at equal intervals. The marks can be color blocks arranged on the bottom film and on two sides of the bottom paper, and are identified by a color mark sensor or a CCD camera and the like, so that the rotating speed of the traction mechanism is adjusted according to the identification result to reach the matching degree, and the accuracy of inlay transfer can be further ensured;

in the embodiment of the disclosure, when the surface is turned over and the liner is attached, the front section of the base paper and the dry inlay to be attached further comprises a buffering process so as to realize the matching of adjustment and ensure the tensioning of the tape. Referring to the upper left corner of fig. 5, the tensioning of the tape is ensured by the arrangement of the buffer structure, so that the precision and reliability of product processing are improved;

in an embodiment of the present disclosure, an apparatus for implementing the RFID tag high-speed composite die cutting process method is further provided, specifically, the RFID tag high-speed composite die cutting apparatus shown in fig. 8 includes an unwinding assembly 10, a die cutting assembly 20, a transfer assembly 30, a composite assembly 40, a cutting assembly 50, and a winding assembly 60, where:

the unwinding assembly 10 comprises a base paper unwinding mechanism 11, a dry inlay unwinding mechanism 12 and a double-layer non-setting adhesive unwinding mechanism 13; it should be noted that each unwinding mechanism is used for unwinding a corresponding roll material, and in the embodiment of the disclosure, the double-layer adhesive sticker is utilized, so that two layers of films of the double-layer adhesive sticker are simultaneously used for a bottom film and an upper film of a product, the utilization efficiency is improved, and the floor area of equipment is reduced;

the die cutting assembly 20 is used for cutting the dry inlay layer in the tape transport which is fed out and compounded by the base paper unwinding mechanism 11 and the dry inlay unwinding mechanism 12 into a sheet-shaped structure which is arranged in parallel; the die cutting assembly 20 includes common components such as a cutter, a compression roller, a traction roller, a motor, etc., which will not be described in detail herein;

the transfer component 30 is used for transferring the sheet-shaped drying inlay at equal intervals to one layer of the double-layer adhesive sticker unreeling mechanism 13; referring to fig. 5, the transfer assembly 30 has been described in detail above, and the specific structure thereof is the prior art, which is not described herein again; of course, it should also be noted here that the traction mechanism, the deviation correcting mechanism, the glue coating mechanism, and the like in the embodiments of the present disclosure are also common prior art in the field, and detailed description is not repeated here; only one exemplary equipment schematic of the above process configuration is given to facilitate an understanding of the present disclosure;

the composite assembly 40 is used for covering a layer of upper film on the connected sheet-shaped dry inlay layer, and the upper film is the other layer discharged by the double-layer adhesive sticker unreeling mechanism 13;

the cutting assembly 50 is used for cutting the upper film so that the upper film is in a cover film with equal intervals corresponding to each piece of the flaky dry inlay layer;

the winding assembly 60 is used for winding a finished product after the film covering and cutting; and the waste discharge assembly is used for winding the dried inlay layer after die cutting, winding the base paper and winding the upper film after die cutting. In the above embodiment, as shown in fig. 8, two dry inlay unwinding mechanisms 12 and two winding mechanisms are provided, and by this arrangement, two rows of products can be processed synchronously, so as to improve the processing efficiency of the products;

in the embodiment of the present disclosure, please refer to fig. 8, further comprising a buffering mechanism, wherein the buffering mechanism comprises two guide rollers and a moving roller movably arranged between the two guide rollers along the perpendicular bisector direction of the two guide rollers, and is used for keeping the tension of the tape deck. The vertical movement of the movable roller can be driven by an air cylinder, and the tension of the moving belt can be kept within a certain range by ensuring the balance of the pressure of the air cylinder; with continued reference to fig. 8, the transfer assembly 30 of the present disclosure includes a vacuum roll having vacuum holes for absorbing the sheet-like drylaid on one radial side and attaching to the carrier film on the other radial side.

It should be noted that the above-mentioned buffering and transferring mechanism in the embodiment of the present disclosure is only used as an example, and a manufacturing method using the process flow of the present disclosure still falls within the scope of the present disclosure in the prior art.

It will be understood by those skilled in the art that the present disclosure is not limited to the embodiments described above, which are presented solely for purposes of illustrating the principles of the disclosure, and that various changes and modifications may be made to the disclosure without departing from the spirit and scope of the disclosure, which is intended to be covered by the claims. The scope of the disclosure is defined by the appended claims and equivalents thereof.

Claims

1. A high-speed compound die-cutting process method for RFID labels is characterized by comprising the following steps:

s10: unreeling, unreeling the base paper roll and the dry inlay roll in the same direction, and gluing one surface of the base paper, which faces the dry inlay layer, in the unreeling process;

s20: compound die cutting, namely attaching the base paper and the dry inlay layer together, die cutting the dry inlay layer into a set sheet structure in parallel, and rolling the cut inlay outer frame and the redundant part to discharge waste;

s30: turning over and pasting in a rotating way, namely turning the die-cut dried inlays and the base paper for 180 degrees, transferring the flaky dried inlays on the base paper to a base film and discharging waste of the base paper, wherein when the base paper is pasted, equal intervals are set between every two adjacent flaky dried inlays, and the base film is one layer of double-layer adhesive sticker unreeled;

2. The high-speed compound die-cutting process method for the RFID tag as claimed in claim 1, wherein the base paper is glassine base paper.

3. The RFID tag high-speed composite die-cutting process method according to claim 1, wherein the dry inlay roll is arranged in at least one row side by side along the width direction of the base paper when unwinding.

4. The RFID tag high-speed compound die-cutting process method according to claim 1, wherein a speed difference exists between the traveling speed of the base film and the traveling speed of the sheet-like dry inlay when the RFID tag is turned over, so as to realize the equally spaced arrangement of the sheet-like dry inlay.

5. The high-speed compound die-cutting process method for RFID labels as claimed in claim 4, wherein, during the turning and transfer, the side edges of the base paper and the base film are provided with identification marks at equal intervals to realize the adjustment when the base paper and the base film are arranged at equal intervals.

6. The high-speed compound die-cutting process method for RFID labels as claimed in claim 5, wherein during the turning and transfer, a buffering procedure is further included in the front section of the transfer of the base paper and the dry inlay to realize the matching of adjustment and ensure the tension of the tape.

7. An RFID label high-speed compound die-cutting device applied to the RFID label high-speed compound die-cutting process method as claimed in any one of claims 1 to 6, characterized by comprising the following steps:

the composite assembly is used for covering a layer of upper film on the connected sheet-shaped adhesive layer, and the upper film is the other layer discharged by the double-layer adhesive unwinding mechanism;

the winding assembly is used for winding a finished product after the film covering and cutting;

8. The RFID tag high-speed composite die-cutting apparatus according to claim 7, wherein the dry inlay unwinding mechanism has at least one set.

9. The RFID tag high-speed composite die cutting apparatus according to claim 7, further comprising a buffering mechanism, wherein the buffering mechanism comprises two guide rollers and a moving roller movably arranged therebetween along a perpendicular bisector direction of the two guide rollers for maintaining tension of the tape.

10. The RFID label high-speed composite die-cutting apparatus according to claim 7, wherein the transfer assembly includes a vacuum roll having vacuum holes for sucking the sheet-like dry inlay on one radial side thereof and attaching it to the base film on the other radial side thereof.