CN115319095A - Powder injection molding method and device for electronic alloy material - Google Patents

Powder injection molding method and device for electronic alloy material Download PDF

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Publication number
CN115319095A
CN115319095A CN202211254618.1A CN202211254618A CN115319095A CN 115319095 A CN115319095 A CN 115319095A CN 202211254618 A CN202211254618 A CN 202211254618A CN 115319095 A CN115319095 A CN 115319095A
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China
Prior art keywords
mixing
dripping
ball
combined
tank
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CN202211254618.1A
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Chinese (zh)
Inventor
郭凡美
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Nantong Xiangfang Electromechanical Technology Co ltd
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Nantong Xiangfang Electromechanical Technology Co ltd
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Priority to CN202211254618.1A priority Critical patent/CN115319095A/en
Publication of CN115319095A publication Critical patent/CN115319095A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/22Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
    • B22F3/225Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12Metallic powder containing non-metallic particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14Treatment of metallic powder

Abstract

The invention discloses a method for injection molding of dispersed copper powder, which comprises the following specific steps of mixing copper powder with A1 2 O 3 Adding the mixture into a ball milling tank, and carrying out ball milling to obtain a middle ball grinding material; adding a mixture of ethylene-vinyl acetate copolymer and polypropylene in a molten state into the intermediate ball grinding material in batches for multiple times in a dripping mode, and cooling and uniformly stirring at a low speed to form a combined ball material; heating and mixing the combined ball material at a gradient temperature, and adding paraffin, stearic acid, low-density polyethylene and high-density polyethylene when the temperature is in a corresponding gradient; stirring uniformly at 150 ℃, and then cooling to room temperature to obtain a molding feed; and (4) putting the molding feed into an injection machine for injection molding. The preparation device of the composite material comprises a device,the automatic adhesive dripping and pouring device comprises an outer tank body, a cover body and a dripping and pouring mechanism arranged at the top in the outer tank body, wherein the bottom of the dripping and pouring mechanism is connected with a mixing mechanism, a conveying pipe for inputting adhesive to the mixing mechanism is arranged on the outer tank body, the amount of the adhesive is effectively controlled, and the size deformation in the subsequent sintering process is greatly reduced.

Description

Powder injection molding method and device for electronic alloy material
Technical Field
The invention relates to the technical field of technical powder injection, in particular to a powder injection molding method and device for an electronic alloy material.
Background
The metal powder injection molding is to drive powder molding by utilizing the good fluidity of a binder, remove the binder, and densify a blank sample through sintering.
The bonding of the powder and the binder has three possible conditions, the binder is too little to cause high viscosity and difficult molding, when the content of the binder is reduced to a certain degree, the feeding viscosity is infinite, and pores are generated in the mixture; too much binder is disadvantageous because too much binder on the one hand easily causes separation of powder and binder during injection, which causes uneven composition of a molded blank, and on the other hand causes greater dimensional shrinkage during sintering, which causes dimensional control problems.
Disclosure of Invention
Therefore, the invention provides a powder injection molding method and a powder injection molding device for electronic alloy materials, which are used for solving the problems that the content of synchronous display of the existing multimedia teaching system is extremely limited, and the synchronous display and comparison of various teaching contents cannot be met.
In order to achieve the above object, an embodiment of the present invention provides the following:
in one aspect of the present invention, a powder injection molding method of an electronic alloy material is provided, which comprises the following specific steps:
s100, mixing copper powder and 1.2wt% of A1 2 O 3 Adding the mixture into a ball milling tank, and carrying out ball milling for 5 hours to obtain a middle ball grinding material;
s200, adjusting the temperature of a ball milling tank to 90 ℃, dripping a mixture of ethylene-vinyl acetate copolymer and polypropylene into the ball milling tank through a plurality of dripping heads, continuously and uniformly stirring at a low speed in the dripping process, and cooling to room temperature after finishing dripping in one unit time to obtain an intermediate mixed ball material;
s300, sieving powder which is not combined from the middle mixed ball material through a screen with a fixed aperture, and repeating S200 on the sieved powder which is not combined until the middle mixed ball material forms the combined ball material;
s400, heating and mixing the combined ball material at gradient temperatures of 80 ℃, 90 ℃, 110 ℃, 130 ℃ and 150 ℃, and correspondingly adding paraffin, 2.5wt% of stearic acid, 0.5wt% of stearic acid, low-density polyethylene and high-density polyethylene when the ball-milling raw material reaches the corresponding temperature;
evenly stirring the mixture for 1 hour at 150 ℃, and then cooling the mixture to room temperature to obtain a forming feed;
and S500, placing the molding feed into an injection machine for injection molding.
As a preferable scheme of the invention, in S200, after finishing dripping and stirring for a unit time, raising the temperature to 90 ℃, and making an internal environment change with alternating positive and negative pressures in a tank body containing the middle ball grinding material;
wherein the pressure keeping time of the positive pressure and the negative pressure in the ball milling tank is 20min to 30min.
As a preferable scheme of the present invention, in S400, a specific method for obtaining the molding feed is as follows:
s401, after the temperature of the combined ball material is heated to 80 ℃, adding paraffin wax, rapidly heating to 90 ℃ in a rapid stirring state, adding 2.5 percent by weight of stearic acid, and then stirring at a medium speed;
s402, continuously heating the mixture of the combined ball material, the paraffin and the stearic acid to 110 ℃, changing the stirring state into a low speed, establishing a seepage state for the mixture of the combined ball material, the paraffin and the stearic acid through a seepage net, and adding 0.5wt% of stearic acid in the seepage state;
s403, when seepage of the seepage net is not obvious or does not flow out completely, removing the seepage net, adding low-density polyethylene when heating to 130 ℃, and adding high-density polyethylene when heating to 150 ℃.
In a preferred embodiment of the present invention, in S402, the permeable net is always located at the bottom of the container for performing the step S400, and in S402, the height of the permeable net is raised to make the container located at the bottom of the permeable net to form a cavity, and the mixture of paraffin and stearic acid penetrates through the permeable net under the action of gravity or external force to form a fluid state combining the ball, the paraffin and the mixture of stearic acid.
The invention provides a dispersion copper powder injection molding device which comprises an outer tank body, a cover body and a dripping casting mechanism arranged at the inner top of the outer tank body, wherein the bottom of the dripping casting mechanism is connected with a mixing mechanism, a material conveying pipe for inputting a binder to the mixing mechanism is arranged on the outer tank body, intermediate raw materials obtained by ball-milling copper powder and aluminum oxide powder through the dripping casting mechanism are subjected to pre-combination treatment to form combined particles, and the mixing mechanism is used for receiving the combined particles discharged by the dripping casting mechanism and mixing the combined particles and the binder at a temperature which changes in a gradient manner.
As a preferred scheme of the invention, the drip-casting mechanism comprises an inner tank body arranged at the inner top of the outer tank body and a drip-casting pipe network arranged on the cover body, the drip-casting pipe network is arranged on the cover body through a sleeve, a rotating shaft is sleeved in the sleeve, a stirring paddle is arranged at the tail end of the rotating shaft extending to the inner tank body, pumping devices for conveying powder at the bottom of the inner tank body to the top of the inner tank body are arranged at two sides of the inner tank body, a resonance system is arranged on the surface of the inner tank body, and the bottom of the inner tank body is connected with the mixing mechanism through a circular truncated cone pipe with a valve.
As a preferable scheme of the invention, the mixing mechanism comprises a mixing tank body, a penetration screen arranged in the mixing tank body and a driving device for driving the penetration screen to move up and down in the mixing tank body, a temperature control system for heating is arranged in the inner wall of the mixing tank body, and the material conveying pipes are uniformly distributed at the connecting part of the circular truncated cone pipe and the mixing tank body.
As a preferable scheme of the present invention, the driving device includes a motor located at the bottom of the mixing tank, a screw stirring paddle is disposed at the end of an output shaft of the motor extending to the top of the penetration screen, the penetration screen is mounted on the output shaft through a threaded sleeve, and a threaded section spirally matched with the threaded sleeve is disposed on the output shaft.
The embodiment of the invention has the following advantages:
according to the invention, two sets of binder systems are utilized, alumina and copper powder are combined into combined particles, as the combined particles are bonded in a dripping mode and are coated on the surface through a secondary binder, the bonded particles can form a bonded main body of the combined particles without too much binder, as long as the powder part contacts the binder, the primary binder is uniformly distributed in the combined particles after being stirred, and the secondary binder only needs to form a coating layer on the surface of the combined particles, so that the use of the binder is greatly reduced, the binder can actively form 'filling gaps' of the combined particles, as the primary binder and the secondary binder are different in forming systems, the gasification points of the primary binder and the secondary binder are also different in a degreasing process in the later period, and the primary binder and the secondary binder can be removed step by step through temperature control, so that the later degreasing is greatly facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a flow chart of the method of the present invention.
FIG. 2 is a schematic view of the structure of the outer tank of the present invention;
fig. 3 is a schematic structural view of the connection between the output shaft and the threaded sleeve of the present invention.
In the figure:
1-an outer tank body; 2-a cover body; 3-drip casting mechanism; 5-thread bushing; 4-a mixing mechanism; 6-a conveying pipe; 7-inner tank body; 8-dripping a pipe network; 9-a sleeve; 10-a rotating shaft; 11-a stirring paddle; 12-a circular truncated cone tube; 13-a drive device; 14-a motor; 15-an output shaft; 16-a stirring propeller; 17-a pumping device; 18-a thread segment; 401-mixing the tank body; 402-permeable screen.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the present invention provides a method for injection molding of dispersed copper powder, comprising the following steps:
s100, mixing copper powder and 1.2wt% of A1 2 O 3 Adding the mixture into a ball milling tank, and carrying out ball milling for 5 hours to obtain a middle ball grinding material;
s200, adding a mixture of ethylene-vinyl acetate copolymer and polypropylene in a molten state into the intermediate ball grinding material in batches for multiple times in a drip casting mode, and uniformly stirring at a low speed to form a combined ball material;
s300, heating and mixing the combined ball material at gradient temperatures of 80 ℃, 90 ℃, 110 ℃, 130 ℃ and 150 ℃, and correspondingly adding paraffin, 2.5wt% of stearic acid, 0.5wt% of stearic acid, low-density polyethylene and high-density polyethylene when the ball-milling raw material reaches the corresponding temperature;
evenly stirring the mixture for 1 hour at 150 ℃, and then cooling the mixture to room temperature to obtain a forming feed;
s400, the molding feed is placed into an injection machine for injection molding.
The refinement of the powder is helpful to the improvement of the powder activity and the reduction of sintering defects, but also causes the technical problems of low degreasing speed, large sintering shrinkage and the like, the preparation cost of the fine powder is high, and the fine powder is easy to oxidize in the air and even spontaneously combust in the long-time ball milling process.
In the invention and the existing alumina dispersion copper powder injection molding, after full ball milling, the mixture of ethylene-vinyl acetate copolymer and polypropylene is used to form primary binder, the primary binder is dripped into the alumina and copper powder in a dripping mode, and bonded combined particles are obtained in a stirring mode, and the combined particles can combine the alumina and copper powder into larger particles to form a primary combined state of alumina dispersion copper.
The mixture of ethylene-vinyl acetate copolymer and polypropylene is used for forming the primary adhesive in a dripping mode, so that the primary adhesive can uniformly adhere alumina powder and copper powder to the surface of the primary adhesive, and the alumina powder and the copper powder are further extruded and formed into combined particles in a stirring mode, and the primary adhesive is distributed in the combined particles as a connecting body of the combined particles.
And then, secondary binders of paraffin, stearic acid, high-density polyethylene and low-density polyethylene are used for carrying out secondary combination on the combined particles, in the combination process, the stearic acid coats a layer on the surfaces of the combined particles again, and the flowability generated by the paraffin added firstly is combined, so that a coating system of the primary connecting agent coated by the secondary connecting agent is achieved, the agglomeration effect of the combined particles is greatly eliminated, and the combined particles and the binders are distributed uniformly in the feeding process.
Because the bonding of the bonding particles is carried out in a dripping mode and the surface is coated by the secondary adhesive, the bonding of the bonding particles can form a bonding main body of the bonding particles without too much adhesive, as long as the powder part contacts with the adhesive, the primary adhesive forms the bonding main body and is uniformly distributed in the bonding particles after being stirred, and the secondary adhesive only needs to form a coating layer on the surface of the bonding particles, thereby greatly reducing the use of the adhesive.
Further, the binder can be made to actively form "filled gaps" that bind the particles.
Because the formation systems of the primary adhesive and the secondary connecting agent are different, the gasification points of the primary adhesive and the secondary connecting agent are different in the later degreasing process, and the primary adhesive and the secondary connecting agent can be removed step by controlling the temperature, so that the later degreasing is greatly facilitated.
Further, the particle size of the binding particles can be determined by controlling the diameter of the drip-cast liquid of the drip-cast pipe network.
In S200, the specific method for pouring the ethylene-vinyl acetate copolymer into the middle ball grinding material in a drop casting mode for multiple times in batches and stirring at a low speed to obtain the combined ball material comprises the following steps:
s201, adjusting the temperature of a ball milling tank to 90 ℃, dripping a mixture of ethylene-vinyl acetate copolymer and polypropylene into the ball milling tank through a plurality of dripping heads, continuously and uniformly stirring at a low speed in the dripping process, and cooling to room temperature after finishing dripping in one unit time to obtain an intermediate mixed ball material;
s202, screening out powder which is not combined from the middle mixed ball material through a screen with a fixed aperture, and repeating the step S201 on the screened powder which is not combined until the middle mixed ball material forms the combined ball material.
The invention is based on the idea that the binder actively forms "filling gaps" which bind the particles:
in S201, after dripping and stirring are completed for one unit time, the temperature is raised to 90 ℃, and the internal environment change with positive pressure and negative pressure alternation is made in a tank body containing the middle ball grinding material, and the hot melting temperature of the mixture of the ethylene-vinyl acetate copolymer and the polypropylene for forming the primary adhesive is about 88 ℃;
wherein the pressure keeping time of the positive pressure and the negative pressure in the ball milling tank is 20min to 30min.
By applying negative pressure to the can, the adhesive expands under the negative pressure and further expands and infiltrates the "filled interstices" of the bonded particles.
By applying positive pressure to the can body, the powder of the bonded particles which further expands and infiltrates the "filled interstices" of the bonded particles polymerizes further together, allowing further uniform distribution of the binder while reducing the volume of the bonded particles, with less shrinkage size variation of the green compact during subsequent sintering.
In S300, the specific method for obtaining the molding feed comprises the following steps:
s301, after the temperature of the combined ball material is heated to 80 ℃, adding paraffin wax, rapidly heating to 90 ℃ in a rapid stirring state, adding 2.5 percent by weight of stearic acid, and then stirring at a medium speed;
s302, continuously heating the mixture of the combined ball material, the paraffin and the stearic acid to 110 ℃, changing the stirring state into a low speed, establishing a seepage state for the mixture of the combined ball material, the paraffin and the stearic acid through a seepage net, and adding 0.5wt% of stearic acid in the seepage state;
s303, when seepage of the permeable net is not obvious or does not flow out completely, the permeable net is removed, the permeable net is heated to 130 ℃ and added with low-density polyethylene, and the permeable net is heated to 150 ℃ and added with high-density polyethylene.
In the secondary binder system, paraffin raw materials are cheap, the melting point is low, the lubricating property and the fluidity at low temperature can be provided, the primary binder and the secondary binder have good intersolubility, the decomposition temperature of the primary binder and the secondary binder is different, the distribution and the removal are facilitated, and the requirement of blank shape retention in the thermal degreasing process is met.
In the present invention, the higher melting primary binder is still able to maintain the combined shape of the combined particles when the secondary linking agent is removed.
In S302, the penetration net is always arranged at the bottom in the container for implementing the step S300, in the step S302, the height of the penetration net is raised, so that the container is arranged at the bottom of the penetration net to form a cavity, and the mixture of the paraffin and the stearic acid penetrates through the penetration net under the action of gravity or external force to form a seepage state of the mixture of the ball material, the paraffin and the stearic acid.
As shown in fig. 2 and 3, the invention provides a molding device for the above-mentioned dispersed copper powder injection molding method, comprising an outer tank 1, a cover 2 and a dripping mechanism 3 arranged at the top inside the outer tank 1, wherein the bottom of the dripping mechanism 3 is connected with a mixing mechanism 4, the outer tank 1 is provided with a material conveying pipe 6 for inputting a binder to the mixing mechanism 4, intermediate raw materials obtained by ball milling copper powder and aluminum oxide powder through the dripping mechanism 3 are pre-combined to form combined particles, and the mixing mechanism 4 is used for receiving the combined particles discharged by the dripping mechanism 3 and mixing the combined particles and the binder at a temperature which changes in a gradient manner.
The dripping and watering mechanism 3 comprises an inner tank body 7 arranged at the inner top of the outer tank body 1 and a dripping and watering pipe network 8 arranged on the cover body 2, the dripping and watering pipe network 8 is arranged on the cover body 2 through a sleeve 9, a rotating shaft 10 is sleeved in the sleeve 9 and is driven to rotate by an external motor, the rotating shaft 10 extends to the tail end of the inner tank body 7 and is provided with a stirring paddle 11, two sides of the inner tank body 7 are provided with pumping devices 17 for conveying powder at the bottom of the inner tank body 7 to the top of the inner tank body 7, the surface of the inner tank body 7 is provided with a resonance system, and the bottom of the inner tank body 7 is connected with a mixing mechanism 4 through a circular truncated cone pipe 12 with a valve.
The mixing mechanism 4 comprises a mixing tank 401, a penetration screen 402 arranged in the mixing tank 401 and a driving device 13 for driving the penetration screen 402 to move up and down in the mixing tank 401, a temperature control system for heating is arranged in the inner wall of the mixing tank 401, and the material conveying pipes 6 are uniformly distributed at the connecting part of the circular truncated cone pipe 12 and the mixing tank 401.
The driving device 13 comprises a motor 14 positioned at the bottom of the mixing tank 401, a screw stirring paddle 16 is arranged at the tail end of an output shaft 15 of the motor 14 extending to the top of the penetration screen 402, the penetration screen 402 is installed on the output shaft 15 through a threaded sleeve 5, and a threaded section 18 in threaded fit with the threaded sleeve 5 is arranged on the output shaft 15.
In the present invention, forward rotation of the motor 14 causes the threaded section 18 of the output shaft 15 to threadingly engage the threaded sleeve 5 and, during continued rotation of the motor 14, the position of the osmotic screen 402 is raised until the threaded section 18 is disengaged from the threaded sleeve 5 and rotationally engaged with the output shaft 15.
Reverse rotation of the motor 14 causes the threaded section 18 on the output shaft 15 to re-thread with the threaded sleeve 5 and, during continued rotation of the motor 14, the position of the osmotic screen 402 is lowered until the threaded section 18 is disengaged from the threaded sleeve 5 and rotationally coupled to the output shaft 15, and the osmotic screen 402 returns to its original position.
Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements may be made based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims (8)

1. A powder injection molding method of an electronic alloy material is characterized by comprising the following specific steps:
s100, mixing copper powder and 1.2wt% of A1 2 O 3 Adding the mixture into a ball milling tank, and carrying out ball milling for 5 hours to obtain a middle ball grinding material;
s200, adjusting the temperature of a ball milling tank to 90 ℃, dripping a mixture of ethylene-vinyl acetate copolymer and polypropylene into the ball milling tank through a plurality of dripping heads, continuously and uniformly stirring at a low speed in the dripping process, and cooling to room temperature after finishing dripping for one unit time to obtain an intermediate mixed ball material;
s300, sieving powder which is not combined from the middle mixed ball material through a screen with a fixed aperture, and repeating S200 on the sieved powder which is not combined until the middle mixed ball material forms the combined ball material;
s400, heating and mixing the combined ball material at gradient temperatures of 80 ℃, 90 ℃, 110 ℃, 130 ℃ and 150 ℃, and correspondingly adding paraffin, 2.5wt% of stearic acid, 0.5wt% of stearic acid, low-density polyethylene and high-density polyethylene when the ball-milling raw material reaches the corresponding temperature;
uniformly stirring for 1 hour at 150 ℃, and then cooling to room temperature to obtain a molding feed;
and S500, placing the molding feed into an injection machine for injection molding.
2. The powder injection molding method of an electronic alloy material according to claim 1, wherein in S200, after completing the dropping and stirring for one unit time, the temperature is raised to 90 ℃, and an internal environment change with alternating positive and negative pressures is made in a tank containing the middle ball abrasive;
wherein the pressure keeping time of the positive pressure and the negative pressure in the ball milling tank is 20min to 30min.
3. The powder injection molding method of an electronic alloy material as claimed in claim 1, wherein in S400, the specific method of obtaining the molding feed is:
s401, after the temperature of the combined ball material is heated to 80 ℃, adding paraffin wax, rapidly heating to 90 ℃ in a rapid stirring state, adding 2.5 percent by weight of stearic acid, and then stirring at a medium speed;
s402, continuously heating the mixture of the combined ball material, the paraffin and the stearic acid to 110 ℃, changing the stirring state into a low speed, establishing a seepage state for the mixture of the combined ball material, the paraffin and the stearic acid through a seepage net, and adding 0.5wt% of stearic acid in the seepage state;
s403, when seepage of the seepage net is not obvious or does not flow out completely, removing the seepage net, adding low-density polyethylene when heating to 130 ℃, and adding high-density polyethylene when heating to 150 ℃.
4. The method of claim 3, wherein the infiltration net is always located at the bottom of the container where the step S400 is performed in S402, and the infiltration net is raised to a height so that a cavity is formed at the bottom of the infiltration net in the container, and the mixture of paraffin and stearic acid penetrates through the infiltration net under gravity or external force to form a fluid state in which the mixture of paraffin and stearic acid is combined with the pellets and the mixture of paraffin and stearic acid.
5. A forming device for the injection forming method of dispersed copper powder according to any one of claims 1 to 4, characterized by comprising an outer tank body (1), a cover body (2) and a dripping and pouring mechanism (3) arranged at the inner top of the outer tank body (1), wherein the bottom of the dripping and pouring mechanism (3) is connected with a mixing mechanism (4), a material conveying pipe (6) for conveying a binder to the mixing mechanism (4) is arranged on the outer tank body (1), intermediate raw materials obtained after ball milling of copper powder and aluminum oxide powder are subjected to pre-combination treatment through the dripping and pouring mechanism (3) to form combined particles, and the mixing mechanism (4) is used for receiving the combined particles discharged by the dripping and pouring mechanism (3) and mixing the combined particles and the binder at a temperature which changes in a gradient manner.
6. The injection molding device for the dispersed copper powder as claimed in claim 5, wherein the drip-watering mechanism (3) comprises an inner tank (7) mounted at the inner top of the outer tank (1) and a drip-watering pipe network (8) mounted on the cover (2), the drip-watering pipe network (8) is mounted on the cover (2) through a sleeve (9), a rotating shaft (10) is sleeved in the sleeve (9), a stirring paddle (11) is mounted at the end of the rotating shaft (10) extending to the inner tank (7), pumping devices (17) for conveying the powder at the bottom of the inner tank (7) to the top of the inner tank (7) are arranged at two sides of the inner tank (7), a resonance system is arranged on the surface of the inner tank (7), and the bottom of the inner tank (7) is connected with the mixing mechanism (4) through a circular truncated cone tube (12) with a valve.
7. The injection molding device for the dispersed copper powder as claimed in claim 6, wherein the mixing mechanism (4) comprises a mixing tank (401), a permeable screen (402) disposed in the mixing tank (401) and a driving device (13) for driving the permeable screen (402) to move up and down in the mixing tank (401), a temperature control system for heating is disposed in the inner wall of the mixing tank (401), and the material conveying pipes (6) are uniformly distributed at the connection position of the circular truncated cone pipe (12) and the mixing tank (401).
8. The injection molding device for dispersed copper powder as claimed in claim 7, wherein the driving device (13) comprises a motor (14) located at the bottom of the mixing tank (401), a screw stirring paddle (16) is arranged at the end of an output shaft (15) of the motor (14) extending to the top of the penetration screen (402), the penetration screen (402) is mounted on the output shaft (15) through a threaded sleeve (5), and a threaded section (18) in threaded fit with the threaded sleeve (5) is arranged on the output shaft (15).
CN202211254618.1A 2022-10-13 2022-10-13 Powder injection molding method and device for electronic alloy material Pending CN115319095A (en)

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Publication number Priority date Publication date Assignee Title
CN102943185A (en) * 2012-12-04 2013-02-27 湖南大学 Preparation method of aluminum oxide dispersion-strengthened copper
CN104668565A (en) * 2015-01-04 2015-06-03 东莞劲胜精密组件股份有限公司 Powder injection molding feedstock preparing method and powder injection molding method
CN108554210A (en) * 2018-05-10 2018-09-21 遵义中铂硬质合金有限责任公司 Metal powder and bonding agent kneading device

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