CN115318762A - Laser cleaning method and cleaning device for complex structure surface - Google Patents
Laser cleaning method and cleaning device for complex structure surface Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
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Abstract
The invention discloses a laser cleaning method and a cleaning device for a complex structure surface, wherein the method comprises the steps of workpiece surface pretreatment; debugging equipment, determining a cleaning area, determining the initial positions of measurement and cleaning, and matching a working environment to set measurement parameters of a profile measurement system; surveying and mapping contour parameters of a cleaning area; setting equipment cleaning parameters; cleaning the workpiece and the like. The cleaning device comprises a moving carrier, a profile measuring system, a laser cleaning system, a controller and an operating system, wherein the moving carrier drives the profile measuring system and the laser cleaning system to scan line by line along the surface of a workpiece simultaneously. Has the advantages that: the invention can accurately measure the profile data of the workpiece, formulate the cleaning route, finish accurate cleaning according to the accuracy of the measured data and reduce the times of repeated cleaning. The cleaning range is kept within the focal length of the laser, the comprehensive cleaning operation of the workpiece is guaranteed while the workpiece matrix is not damaged, and the cleaning precision and efficiency are improved.
Description
Technical Field
The invention relates to a cleaning device and a cleaning method, in particular to a laser cleaning method and a cleaning device for a complex structure surface, and belongs to the technical field of laser cleaning.
Background
In the traditional cleaning industry, various cleaning modes are provided, and most of the cleaning modes are cleaning by using chemical agents and mechanical methods. After 2020 years that the requirements of environmental protection regulations in China are more and more strict and people's environmental protection and safety awareness are increasingly strengthened, the types of chemicals which can be used in industrial production and cleaning become less and less. How to find a cleaner and non-damaging cleaning method is a problem which has to be considered. Laser cleaning has the characteristics of no grinding, no contact, no thermal effect, suitability for objects made of various materials and the like, and is considered to be the most reliable and effective solution. Meanwhile, the laser cleaning can solve the problem which cannot be solved by adopting the traditional cleaning mode.
In the ship manufacturing industry, the laser cleaning technology is a novel surface treatment method, has the advantages of small damage to base materials, small harm to human bodies, environmental friendliness and the like, and has a good application prospect.
In the field of ship manufacturing, a large-sized structural part such as a ship body is formed by welding a plurality of workpieces such as small-sized ship steel plates. Due to the fact that the structures of the workpieces forming the ship body are various, the surface of the cleaned area is not only in a plane form, but also in an irregular welding seam at the welding position of each workpiece, the surface of the cleaned area is more in a superposition mode, a staggered mode, a curved mode and the like, and the laser cleaning effect is difficult to keep consistent. The internal structure of the ship body is narrow, particularly in a cabin area, various structural components, equipment and pipe fittings are arranged in a staggered mode, and high requirements are placed on the consistency of the cleaning quality of some limited areas.
For cleaning the complex surfaces and irregular welding seams of the marine workpieces, a handheld laser cleaning machine is usually adopted, the cleaning effect can be ensured by observing the distance of a laser focus by naked eyes, but when the structure and the shape of the workpieces are different greatly, the accuracy of a manual calibration method is poor, and the cleaning efficiency is low.
At present, the mechanical arm and the laser cleaning head are matched, so that the cleaning of workpieces and limited areas with complex structural surfaces can be realized. However, the height difference and the surface curvature of the surface of the complex structure are measured manually through the graduated scale and some simple tools, and then the measured data are compiled and then are led into the control system to operate the manipulator for cleaning, so that the problems of large error, low accuracy and the like exist, and the quality and the efficiency of laser cleaning are seriously influenced.
Disclosure of Invention
The invention aims to: the invention aims to provide a laser cleaning method and a cleaning device for a complex structure surface, aiming at the problems of unstable laser cleaning quality and low efficiency in the prior art. According to the invention, by measuring the profile data of the complex structural surface, the cleaning focal length of the laser cleaning system is adjusted in real time according to the profile data, and the precise positioning of the manipulator is matched, so that the high-efficiency and high-quality laser cleaning of the complex structural surfaces such as special workpieces and limited areas is realized, and the method has the outstanding advantages of flexibility, convenience, accurate positioning, high removal precision, high efficiency and the like.
The technical scheme is as follows: a laser cleaning method for a complex structure surface comprises the following steps:
firstly, pretreating the surface of a workpiece to remove substances easy to fall off from the surface;
step two, debugging equipment, namely determining a cleaning area, determining the initial position of measurement and cleaning, and setting measurement parameters of a profile measurement system by matching with a working environment;
surveying and mapping contour parameters of the cleaning area, measuring overall morphology parameters in the cleaning area through a contour measuring system, and storing the overall morphology parameters in a database;
setting equipment cleaning parameters, determining optimal matching of measurement data and paths, planning an optimal laser cleaning path track, and determining parameters of cleaning laser according to the contour of a workpiece;
and fifthly, cleaning the workpiece, starting the cleaning equipment, and cooperatively controlling each system unit of the cleaning equipment to clean the workpiece according to the equipment parameters.
The invention can accurately measure the profile data of the workpiece, reasonably formulate the cleaning route of the restrictive area, finish the accurate cleaning of the cleaning route of the restrictive area according to the accuracy of the measured data and reduce the repeated cleaning times. The cleaning range is kept within the focal length of the laser, the comprehensive cleaning operation of the workpiece is guaranteed while the workpiece base body is not damaged, and the cleaning precision and efficiency are improved.
Preferably, in order to complete data acquisition, after the equipment debugging is completed in the second step, the area needing to be cleaned and the initial position of measurement and cleaning are determined, and data acquisition is performed in a coordinate system mode; the length of a measuring laser line emitted by a line laser sensor is taken as an X axis, the moving direction of the measuring laser line is taken as a Y axis, the height data of the surface of the workpiece is taken as a Z axis, and the initial position is taken as the origin of a set coordinate system. And setting measurement parameters of the profile measurement system by matching a coordinate system with a working environment.
Preferably, in order to facilitate the storage of the measured profile parameters, the profile parameters of the cleaning area in the third step are measured by taking the length of the measuring laser line as an X axis, the moving direction of the measuring laser line as a Y axis, the height data of the surface of the workpiece as a Z axis, and the profile measurement data are stored as (X, Y, Z);
the distance d between the acquisition points on the X axis from the origin and the distance s between the longitudinal sampling points in the Y axis in unit time;
the initial position is stored as (0, h) 11 ) The coordinates of the point on the nth contour line are ((n-1) d, (n-1) s, h) nn )，
Wherein h is 11 Measuring the height of the point workpiece for the initial position contour line, h nn And finally measuring the height of the point workpiece for the nth contour line.
Preferably, in order to obtain an accurate three-dimensional profile curve, the profile measuring system comprises a line laser sensor, a photoelectric detector, a converging lens and an imaging lens, wherein the line laser sensor emits measuring laser, the measuring laser vertically enters the surface of a workpiece through the converging lens, enters the photoelectric detector through the imaging lens after diffuse reflection, and when the workpiece moves and the surface incident light changes, the photoelectric detector receives the movement of a reflected light spot and then detects profile data;
when measuring the profile, the positions of the line laser sensor, the photodetector and the lens are all fixed values, d 1 And d 2 Respectively an object distance and an image distance, alpha is an included angle between two diffuse reflection light paths, theta is an included angle between an incident light axis and an imaging light axis,
is the included angle between the optical axis of the imaging objective lens and the photoelectric detector, and h is the moving distance of the light spot on the photoelectric detector; the measured workpiece height can be expressed as:
the position coordinate value stored in the database is
A three-dimensional profile curve is formed.
Preferably, in order to optimally match the coordinates of the profile data obtained by measurement with the laser cleaning path, the optimal matching method of the measurement data and the path comprises the following steps:
setting the initial point of the cleaning laser beam to coincide with the initial position of the profile measuring system;
setting the transverse moving distance of the cleaning laser beam in unit time to be the same as the unit time measuring distance stored by the profile measuring system;
the initial position of the cleaning laser beam is set to (0, Z) 11 ) The coordinates of the cleaning laser beam position on the nth profile are ((n-1) d, (n-1) s, Z) nn )；
Preferably, for further optimization of the laser cleaning path, the method for determining the parameters of the cleaning laser according to the workpiece profile comprises:
setting the focal depth of a cleaning laser beam as D; the focus point of the cleaning laser beam at the initial position of each contour line is positioned on the surface of the cleaning workpiece;
on the nth contour line, if | h nn -h n1 |<D/2, wherein h n1 For the nth profile line starting with the height of the workpiece at the measurement point, all positions of the cleaning laser beam on the profile line are set to ((n-1) d, (n-1) s, Z) n1 ) (ii) a At the moment, the height on the contour line meets the focal depth, and the position of the cleaning laser beam on the Z axis does not need to be changed;
on the nth contour line, if | h nn -h n1 |>D/2, wherein h n1 The height of the workpiece at the initial measuring point of the nth contour line is measured, the height on the contour line is greater than the focal depth, and the position of the cleaning laser beam on the Z axis needs to be changed; let N = [ (h) nn -h n1 )/D/2](wherein [ [ 2 ] ])]To be rounded), the position of the cleaning laser beam on this contour line is set to ((n-1) d, (n-1) s, Z) n1 +N*D/2)；
The values in the Z-axis direction of the cleaning laser beam are:
preferably, in order to further improve the precision of cleaning and measurement, the first step to the fifth step are complete measurement and cleaning processes; and after the first cleaning is finished, repeating the steps from the third step to the fifth step according to the precision requirement of the required cleaning and measurement, and finishing the step-by-step cleaning of the complex structure on the surface of the workpiece.
A cleaning device for realizing a laser cleaning method of a complex structural surface comprises a moving carrier, a profile measuring system, a laser cleaning system, a controller and an operating system, wherein the profile measuring system and the laser cleaning system are respectively arranged on the moving carrier, and the moving carrier drives the profile measuring system and the laser cleaning system to simultaneously scan line by line along the surface of a workpiece;
the measuring laser line emitted by the profile measuring system is superposed with the indicating light of the laser cleaning system;
the controller is connected with the moving carrier, the contour measuring system and the laser cleaning system through the communication interface;
the operating system is connected with the controller, and the operating system acquires the measurement data through the controller and sets the cleaning parameters at the same time.
The method can accurately measure the profile data of the workpiece, reasonably formulate the cleaning route of the restricted area, finish the accurate cleaning of the cleaning route of the restricted area according to the accuracy of the measured data, and reduce the times of repeated cleaning. The cleaning range is kept within the focal length of the laser, the comprehensive cleaning operation of the workpiece is guaranteed while the workpiece matrix is not damaged, and the cleaning precision and efficiency are improved.
Preferably, in order to obtain an accurate three-dimensional profile curve, the profile measuring system comprises a line laser sensor, a photoelectric detector, a converging lens and an imaging lens, wherein the line laser sensor emits measuring laser, the measuring laser vertically enters the surface of a workpiece through the converging lens, enters the photoelectric detector through the imaging lens after being subjected to diffuse reflection, and when the workpiece moves and the surface incident light changes, the photoelectric detector receives a reflected light spot and detects profile data after moving.
Preferably, in order to obtain higher precision and simultaneously distinguish the measuring laser line from the indicating light, the measuring laser line emitted by the profile measuring system has a blue light with a wavelength of 360 to 480 nanometers; the wavelength of the indicating light of the laser cleaning system is 632 nanometers red light.
Preferably, in order to meet the cleaning modes of different requirements, the laser cleaning system 3 emits cleaning laser with wavelength of 1064 nm or 532 nm.
Has the beneficial effects that: the method can accurately measure the profile data of the workpiece, reasonably formulate the cleaning route of the restricted area, finish the accurate cleaning of the cleaning route of the restricted area according to the accuracy of the measured data, and reduce the times of repeated cleaning. The cleaning range is kept within the focal length of the laser, the comprehensive cleaning operation of the workpiece is guaranteed while the workpiece base body is not damaged, and the cleaning precision and efficiency are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a flow chart of the cleaning method of the present invention;
FIG. 2 is a schematic view of the cleaning apparatus of the present invention;
FIG. 3 is a schematic view of a profile measuring assembly of the present invention
FIG. 4 is a schematic view of a contour coordinate system according to the present invention;
FIG. 5 is a schematic diagram of path planning according to the present invention;
FIG. 6 is a graph of a profile measurement experiment according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1, a laser cleaning method for a complex structure surface includes the following steps:
firstly, pretreating the surface of a workpiece to remove substances which easily fall off from the surface;
the workpiece is preprocessed before it is subjected to data measurement. And stripping substances such as substances which are easy to strip off the surface of the workpiece by using a high-pressure air blowing device such as an air compressor and the like, so that the measurement error is reduced.
Step two, debugging equipment, determining a cleaning area, determining the initial positions of measurement and cleaning, and matching a working environment to set measurement parameters of the profile measurement system;
surveying and mapping contour parameters of the cleaning area, measuring overall morphology parameters in the cleaning area through a contour measuring system, and storing the overall morphology parameters in a database;
setting equipment cleaning parameters, determining optimal matching of measurement data and paths, planning an optimal laser cleaning path track, and determining parameters of cleaning laser according to the contour of a workpiece;
and fifthly, cleaning the workpiece, starting the cleaning equipment, and cooperatively controlling each system unit of the cleaning equipment to clean the workpiece according to the equipment parameters.
The invention can accurately measure the profile data of the workpiece, reasonably formulate the cleaning route of the restrictive area, finish the accurate cleaning of the cleaning route of the restrictive area according to the accuracy of the measured data and reduce the repeated cleaning times. The cleaning range is kept within the focal length of the laser, the comprehensive cleaning operation of the workpiece is guaranteed while the workpiece base body is not damaged, and the cleaning precision and efficiency are improved.
The method and apparatus for cleaning a complex structured surface will be further described with reference to fig. 1. As shown in fig. 2, a cleaning device for implementing a laser cleaning method for a complex structural surface includes a manipulator 1, a profile measuring system 2, a laser cleaning system 3, a controller 4 and an operating system 5, wherein the profile measuring system 2 and the laser cleaning system 3 are respectively installed on the manipulator 1, and the manipulator 1 drives the profile measuring system 2 and the laser cleaning system 3 to scan line by line along the surface of a workpiece;
the measuring laser line 6 emitted by the profile measuring system 2 is superposed with the indicating light 7 of the laser cleaning system 3;
the controller 4 is connected with the manipulator 1, the profile measuring system 2 and the laser cleaning system 3 through communication interfaces;
the operating system 5 is connected with the controller 4, and the operating system 5 acquires measurement data through the controller 4 and sets cleaning parameters.
The invention can accurately measure the profile data of the workpiece, reasonably formulate the cleaning route of the restrictive area, finish the accurate cleaning of the cleaning route of the restrictive area according to the accuracy of the measured data and reduce the repeated cleaning times. The cleaning range is kept within the focal length of the laser, the comprehensive cleaning operation of the workpiece is guaranteed while the workpiece matrix is not damaged, and the cleaning precision and efficiency are improved.
As shown in fig. 3, in order to obtain an accurate three-dimensional profile curve, the profile measuring system 2 includes a line laser sensor 8, a photodetector 9, a converging lens 10 and an imaging lens 11, the line laser sensor 8 emits measuring laser, which is perpendicularly incident to the surface of a workpiece through the converging lens 10, and enters the photodetector 9 through the imaging lens 11 after being diffusely reflected, and when the workpiece moves and the incident light on the surface changes, the photodetector 9 receives the reflected light spot and moves to detect profile data. When the manipulator 1 moves in the measuring process and incident light on the surface of a workpiece changes, the photoelectric detector 9 receives reflected light and detects profile data through light spot movement. The data is received and calculated by the controller 4, and the path of the cleaning laser beam is adjusted according to the judgment model.
The line test laser 8 emits blue measurement laser lines 6, the blue measurement laser lines are incident to the surface of the workpiece through the convergent lens 10, when the surface of the workpiece moves and the height changes, an image point of a light spot on a receiving surface of the photoelectric detector 9 correspondingly moves, and surface profile data of the workpiece can be measured through the movement of the light spot.
In order to ensure high efficiency of data measurement, the line laser sensor 8 is used as a test laser emitting tool, and can simultaneously measure the profiles on one line.
In order to obtain higher precision and distinguish the measuring laser line from the indicating light at the same time, the measuring laser line 6 emitted by the profile measuring system 1 has the blue light with the wavelength of 360-480 nanometers; the wavelength of the indicating light 7 of the laser cleaning system 3 is 632 nm red light.
In order to meet the cleaning modes of different requirements, the laser cleaning system 3 emits cleaning laser with the wavelength of 1064 nm or 532 nm.
As shown in fig. 4, to complete data acquisition, after the device debugging in step two is completed, the area to be cleaned and the initial position of measurement and cleaning are determined, and data acquisition is performed in a coordinate system manner; the length of a measuring laser line emitted by a line laser sensor is taken as an X axis, the moving direction of the measuring laser line is taken as a Y axis, the height data of the surface of the workpiece is taken as a Z axis, and the initial position is taken as the origin of a set coordinate system. And setting measurement parameters of the profile measurement system by matching a coordinate system with a working environment.
The distance of each laser point is a fixed value, and the line laser spacing can be changed to be 2 mm to 10 mm according to the measurement accuracy.
The movement distance of the manipulator 1 along the Y-axis can be set according to the measurement and cleaning accuracy, with the parameter distance being 1 mm to 2 mm.
In order to store the measured profile parameters conveniently, the length of the measuring laser line is taken as an X axis, the moving direction of the measuring laser line is taken as a Y axis, the height data of the surface of the workpiece is taken as a Z axis, and the profile measuring data is stored as (X, Y, Z);
the distance d between every two acquisition points on the X axis from the origin, and the distance s between the longitudinal sampling points in the Y axis within unit time;
the initial position is stored as (0, h) 11 ) I.e. the first laser point measurement coordinate on the first line; the three-dimensional coordinates of the measurement points on the first contour line are stored as ((n-1) d,0, h) 1n ) I.e. the coordinates of the first line laser spot; the coordinates of the point on the nth contour line are ((n-1) d, (n-1) s, h) nn ) I.e. the measured coordinates of each laser spot after the movement.
As shown in fig. 3, in order to obtain an accurate three-dimensional profile curve, the profile measuring system 2 includes a line laser sensor 8, a photodetector 9, a converging lens 10 and an imaging lens 11, the line laser sensor 8 emits measuring laser, which is perpendicularly incident on the surface of a workpiece through the converging lens 10, and enters the photodetector 9 through the imaging lens 11 after being diffusely reflected, and when the workpiece moves and the incident light on the surface changes, the photodetector 9 receives the movement of the reflected light spot and detects profile data.
When measuring the profile, the positions of the line laser sensor 8, the photodetector 9, the condensing lens 10, and the imaging lens 11 are all fixed values, d 1 And d 2 Respectively an object distance and an image distance, alpha is an included angle between two diffuse reflection light paths, theta is an included angle between an incident light axis and an imaging light axis,
is the included angle between the optical axis of the imaging objective lens and the photoelectric detector, and h is the moving distance of the light spot on the photoelectric detector; the measured workpiece height can be expressed as:
the position coordinate value stored in the database is
A three-dimensional profile curve is formed.
Fig. 6 shows a measurement experimental diagram of a complex surface workpiece, in which a surface profile is formed by point coordinates on a line laser. And 3, obtaining a data profile by the measuring method in the step 3, wherein the laser line in the profile data diagram is an X axis, and the height data of the surface of the workpiece is a Z axis.
In order to optimally match the measured profile data coordinates with the laser cleaning path, the method for optimally matching the measured data with the path comprises the following steps:
setting the initial point of the cleaning laser beam to coincide with the initial position of the profile measuring system;
setting the transverse moving distance of the cleaning laser beam in unit time to be the same as the unit time measuring distance stored by the profile measuring system;
the initial position of the cleaning laser beam is set to (0, Z) 11 ) The coordinates of the cleaning laser beam position on the nth profile are ((n-1) d, (n-1) s, Z) nn )；
Setting the position of a mechanical arm 1 at the initial position of each contour line to ensure that the focus point of a laser cleaning system 3 is positioned on the surface of the material to be cleaned, wherein the initial position coordinate of each contour line is (0, (n-1) s, Z n1 ). In order to simplify the moving steps of the laser cleaning robot 1, the laser cleaning path is optimized.
As shown in FIG. 5, data point X on each laser line is plotted 1 To X n And the laser is set to be analyzed one by one, and if the height difference of two adjacent laser points is less than half of the focal depth, the cleaning path of the laser does not need to be changed. If the height difference between two adjacent laser points is greater than half of the focal depth, the focal point of the laser needs to be controlled to be positioned on the surface of the workpiece through the up-and-down movement of the manipulator.
For further optimization of the laser cleaning path, the method for determining the parameters of the cleaning laser according to the workpiece contour comprises the following steps:
setting the focal depth of the cleaning laser beam as D; the focus point of the cleaning laser beam at the initial position of each contour line is positioned on the surface of the cleaning workpiece;
on the nth contour line, if | h nn -h n1 |<D/2, wherein h n1 For the nth profile line starting to measure the height of the workpiece at the point, all positions of the cleaning laser beam on the profile line are set to ((n-1) d, (n-1) s, Z n1 ) (ii) a At the moment, the height on the contour line meets the focal depth, and the position of the cleaning laser beam on the Z axis does not need to be changed; f
On the nth contour line, if | h nn -h n1 |>D/2, wherein h n1 The height of the workpiece at the initial measuring point of the nth contour line is greater than the focal depth, and the position of the cleaning laser beam on the Z axis needs to be changed; let N = [ (h) nn -h n1 )/D/2](wherein [, ]]To be rounded), the position of the cleaning laser beam on this contour line is set to ((n-1) d, (n-1) s, Z) n1 +N*D/2)；
The values of the cleaning laser beam in the Z-axis direction are as follows:
by such path optimization, the complex path of the manipulator 1 in adjusting the focal length, and the steps and time of the optimized laser cleaning are reduced. And compiling the path after the optimization method to finish providing the numerical control language recognized by the manipulator 1.
The fifth step: and ensuring that the laser focus is positioned at the height of the measured outline coordinate origin of the workpiece when cleaning is started. And transmitting the parameters required by laser cleaning and the data after path optimization to a controller of the manipulator 1 through numerical control compiling, and carrying out accurate positioning on the cleaning workpiece through the manipulator 1. The laser used for laser cleaning adopts a large focal depth laser head so as to reduce unnecessary movement of the manipulator 1 in the cleaning process and optimize the laser cleaning path of the manipulator 1.
In order to further improve the precision of cleaning and measurement, the first step to the fifth step are complete measurement and cleaning processes; and after the first cleaning is finished, repeating the steps from the third step to the fifth step according to the precision requirement of the required cleaning and measurement, and finishing the step-by-step cleaning of the complex structure on the surface of the workpiece.
Through the technical scheme, the method can accurately measure the profile data of the workpiece, reasonably formulate the cleaning route of the restrictive area, finish the accurate cleaning of the cleaning route of the restrictive area according to the accuracy of the measured data, and reduce the repeated cleaning times. The cleaning range is kept within the focal length of the laser, the comprehensive cleaning operation of the workpiece is guaranteed while the workpiece base body is not damaged, and the cleaning precision and efficiency are improved.
In the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed in the embodiment corresponds to the method disclosed in the embodiment, so that the description is simple, and the relevant points can be referred to the description of the method part.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A laser cleaning method for a complex structure surface is characterized by comprising the following steps:
firstly, pretreating the surface of a workpiece to remove substances which easily fall off from the surface;
step two, debugging equipment, namely determining a cleaning area, determining the initial position of measurement and cleaning, and setting measurement parameters of a profile measurement system by matching with a working environment;
surveying and mapping contour parameters of the cleaning area, measuring overall morphology parameters in the cleaning area through a contour measuring system, and storing the overall morphology parameters in a database;
setting equipment cleaning parameters, determining optimal matching of measurement data and paths, planning an optimal laser cleaning path track, and determining parameters of cleaning laser according to the contour of a workpiece;
and fifthly, cleaning the workpiece, starting the cleaning equipment, and cooperatively controlling each system unit of the cleaning equipment to clean the workpiece according to the equipment parameters.
2. The laser cleaning method for the complex structural surface according to claim 1, characterized in that: after the equipment debugging is completed in the second step, determining an area needing to be cleaned and an initial position for measuring and cleaning, and acquiring data in a coordinate system mode; the length of a measuring laser line emitted by a line laser sensor is taken as an X axis, the moving direction of the measuring laser line is taken as a Y axis, the height data of the surface of the workpiece is taken as a Z axis, and the initial position is taken as the origin of a set coordinate system.
3. The laser cleaning method for the complex structural surface according to claim 2, characterized in that: in the third step, the contour parameters of the cleaning area are measured by taking the length of the measured laser line as an X axis, the moving direction of the measured laser line as a Y axis, the height data of the surface of the workpiece as a Z axis and the contour measurement data as (X, Y, Z);
the distance d between every two acquisition points on the X axis from the origin, and the distance s between the longitudinal sampling points in the Y axis within unit time;
the initial position is stored as (0, h) 11 ) The coordinates of the point on the nth contour line are ((n-1) d, (n-1) s, h) nn )，
Wherein h is 11 Measuring the height of the point workpiece for the initial position contour line, h nn And finally measuring the height of the point workpiece for the nth contour line.
4. The laser cleaning method for the complex-structured surface according to claim 3, characterized in that: the contour measuring system comprises a line laser sensor, a photoelectric detector, a converging lens and an imaging lens, wherein the line laser sensor emits measuring laser, the measuring laser vertically enters the surface of a workpiece through the converging lens, enters the photoelectric detector through the imaging lens after being subjected to diffuse reflection, and when the workpiece moves and the incident light on the surface changes, the photoelectric detector receives the movement of a reflected light spot and then detects contour data;
when measuring the profile, the positions of the line laser sensor, the photodetector and the lens are all fixed values, d 1 And d 2 Respectively an object distance and an image distance, alpha is an included angle between two diffuse reflection light paths, theta is an included angle between an incident light axis and an imaging light axis,
is the included angle between the optical axis of the imaging objective lens and the photoelectric detector, and h is the moving distance of the light spot on the photoelectric detector; the measured workpiece height can be expressed as:
the position coordinate value stored in the database is
A three-dimensional profile curve is formed.
5. The laser cleaning method for the complex structural surface, according to claim 4, is characterized in that the optimal matching method for the measurement data and the path is as follows:
setting the initial point of the cleaning laser beam to coincide with the initial position of the profile measuring system;
setting the transverse moving distance of the cleaning laser beam in unit time to be the same as the unit time measuring distance stored by the profile measuring system;
the initial position of the cleaning laser beam is set to (0, Z) 11 ) The coordinates of the cleaning laser beam position on the nth profile are ((n-1) d, (n-1) s, z) nn )。
6. The laser cleaning method for the complex structural surface, according to claim 4, is characterized in that the method for determining the parameters of the cleaning laser according to the workpiece outline is as follows:
setting the focal depth of the cleaning laser beam as D; the focus point of the cleaning laser beam at the initial position of each contour line is positioned on the surface of the cleaning workpiece;
on the nth contour line, if | h nn -h n1 |<D/2, wherein h n1 For the nth profile line starting to measure the height of the workpiece at the point, all positions of the cleaning laser beam on the profile line are set to ((n-1) d, (n-1) s, Z n1 ) (ii) a At the moment, the height on the contour line meets the focal depth, and the position of the cleaning laser beam on the Z axis does not need to be changed;
on the nth contour line, if | h nn -h n1 |>D/2, wherein h n1 The height of the workpiece at the initial measuring point of the nth contour line is greater than the focal depth, and the position of the cleaning laser beam on the Z axis needs to be changed; let N = [ (h) nn -h n1 )/D/2](wherein [, ]]To be rounded), the position of the cleaning laser beam on this contour line is set to ((n-1) d, (n-1) s, Z) n1 +N*D/2)；
The values of the cleaning laser beam in the Z-axis direction are as follows:
7. the laser cleaning method for the complex-structured surface according to claim 1, characterized in that: step one to five are complete measurement and cleaning processes; and after the first cleaning is finished, repeating the steps from the third step to the fifth step according to the precision requirement of the required cleaning and measurement, and finishing the step-by-step cleaning of the complex structure on the surface of the workpiece.
8. A cleaning apparatus for implementing the laser cleaning method of a complex-structured surface according to claim 1, characterized in that: the device comprises a moving carrier (1), a profile measuring system (2), a laser cleaning system (3), a controller (4) and an operating system (5), wherein the profile measuring system (2) and the laser cleaning system (3) are respectively arranged on the moving carrier (1), and the moving carrier (1) drives the profile measuring system (2) and the laser cleaning system (3) to simultaneously scan line by line along the surface of a workpiece;
a measuring laser line (6) emitted by the profile measuring system (2) is superposed with an indicating light (7) of the laser cleaning system (3);
the controller (4) is connected with the motion carrier (1), the contour measuring system (2) and the laser cleaning system (3) through communication interfaces;
the operating system (5) is connected with the controller (4), and the operating system (5) acquires the measurement data through the controller (4) and sets the cleaning parameters at the same time.
9. The cleaning apparatus for a laser cleaning method of a complex-structured surface according to claim 8, characterized in that: the contour measuring system (2) comprises a line laser sensor (8), a photoelectric detector (9), a converging lens (10) and an imaging lens (11), wherein the line laser sensor (8) emits measuring laser, the measuring laser vertically enters the surface of a workpiece through the converging lens (10), enters the photoelectric detector (9) through the imaging lens (11) after diffuse reflection, and when the workpiece moves and surface incident light changes, the photoelectric detector (9) receives a reflected light spot and detects contour data after the reflected light spot moves.
10. The cleaning apparatus for a laser cleaning method of a surface with a complicated structure according to claim 8, characterized in that: the measuring laser line (6) emitted by the profile measuring system (1) has a blue light wavelength of 360 to 480 nanometers; the wavelength of the indicating light (7) of the laser cleaning system (3) is 632 nm red light; the laser cleaning system (3) emits cleaning laser with wavelength of 1064 nm or 532 nm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116213371A (en) * | 2023-04-12 | 2023-06-06 | 武汉金顿激光科技有限公司 | Semi-automatic laser cleaning method and system |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060102601A1 (en) * | 2004-11-12 | 2006-05-18 | The Regents Of The University Of California | Feedback controlled laser machining system |
| CN103900489A (en) * | 2014-03-11 | 2014-07-02 | 苏州江奥光电科技有限公司 | Linear laser scanning three-dimensional contour measuring method and device |
| CN205518834U (en) * | 2016-02-01 | 2016-08-31 | 龚传波 | Laser washing device |
| US20180059248A1 (en) * | 2016-05-18 | 2018-03-01 | James Thomas O'Keeffe | Dynamically steered laser range finder |
| CN109433745A (en) * | 2019-01-07 | 2019-03-08 | 哈尔滨工业大学 | Large-scale component Diode laser linear light spot laser cleaning method |
| CN111420938A (en) * | 2020-04-28 | 2020-07-17 | 株洲国创轨道科技有限公司 | Intelligent laser cleaning method and device for multiple laser heads |
| CN111760849A (en) * | 2020-05-18 | 2020-10-13 | 武汉翔明激光科技有限公司 | Laser cleaning equipment and focus keeping method thereof |
| CN113546921A (en) * | 2021-07-26 | 2021-10-26 | 贵州电网有限责任公司 | Robot and method for cleaning, derusting and passivating laser metal parts |
| CN214645168U (en) * | 2021-09-17 | 2021-11-09 | 山东豪迈机械科技股份有限公司 | Mould cleaning equipment |
| CN114018174A (en) * | 2021-11-05 | 2022-02-08 | 上海科技大学 | Complex curved surface profile measuring system |
| CN114231728A (en) * | 2021-12-02 | 2022-03-25 | 集美大学 | Device and method for strengthening curved surface part by laser impact on surface layer |
-
2022
- 2022-09-14 CN CN202211115267.6A patent/CN115318762A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060102601A1 (en) * | 2004-11-12 | 2006-05-18 | The Regents Of The University Of California | Feedback controlled laser machining system |
| CN103900489A (en) * | 2014-03-11 | 2014-07-02 | 苏州江奥光电科技有限公司 | Linear laser scanning three-dimensional contour measuring method and device |
| CN205518834U (en) * | 2016-02-01 | 2016-08-31 | 龚传波 | Laser washing device |
| US20180059248A1 (en) * | 2016-05-18 | 2018-03-01 | James Thomas O'Keeffe | Dynamically steered laser range finder |
| CN109433745A (en) * | 2019-01-07 | 2019-03-08 | 哈尔滨工业大学 | Large-scale component Diode laser linear light spot laser cleaning method |
| CN111420938A (en) * | 2020-04-28 | 2020-07-17 | 株洲国创轨道科技有限公司 | Intelligent laser cleaning method and device for multiple laser heads |
| CN111760849A (en) * | 2020-05-18 | 2020-10-13 | 武汉翔明激光科技有限公司 | Laser cleaning equipment and focus keeping method thereof |
| CN113546921A (en) * | 2021-07-26 | 2021-10-26 | 贵州电网有限责任公司 | Robot and method for cleaning, derusting and passivating laser metal parts |
| CN214645168U (en) * | 2021-09-17 | 2021-11-09 | 山东豪迈机械科技股份有限公司 | Mould cleaning equipment |
| CN114018174A (en) * | 2021-11-05 | 2022-02-08 | 上海科技大学 | Complex curved surface profile measuring system |
| CN114231728A (en) * | 2021-12-02 | 2022-03-25 | 集美大学 | Device and method for strengthening curved surface part by laser impact on surface layer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116213371A (en) * | 2023-04-12 | 2023-06-06 | 武汉金顿激光科技有限公司 | Semi-automatic laser cleaning method and system |
| CN116213371B (en) * | 2023-04-12 | 2023-10-31 | 武汉金顿激光科技有限公司 | Semi-automatic laser cleaning method and system |
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