CN115315065A - Electrostatic discharge device - Google Patents
Electrostatic discharge device Download PDFInfo
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- CN115315065A CN115315065A CN202210916483.4A CN202210916483A CN115315065A CN 115315065 A CN115315065 A CN 115315065A CN 202210916483 A CN202210916483 A CN 202210916483A CN 115315065 A CN115315065 A CN 115315065A
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- electrostatic discharge
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- electronic component
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- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000002184 metal Substances 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 14
- 239000007769 metal material Substances 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 abstract description 10
- 238000010168 coupling process Methods 0.000 abstract description 10
- 238000005859 coupling reaction Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 description 21
- 230000003068 static effect Effects 0.000 description 21
- 239000010410 layer Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
The present application relates to an electrostatic discharge device. The device comprises: the method comprises the following steps: a substrate including at least one electronic component thereon; the electrostatic discharge unit comprises at least one electrostatic discharge component, the electrostatic discharge component is arranged close to the electronic component and extends from a first direction, and the first direction comprises a direction from close to the substrate to far away from the substrate; the substrate storage unit comprises at least one box body, and the substrate is placed in the box body. The electrostatic discharge is carried out by forming a voltage difference between the electrostatic discharge assembly and the box body, and the problems that in the prior art, a capacitive coupling path of electrostatic discharge is uncontrollable and a PCB is easily damaged are solved.
Description
Technical Field
The present disclosure relates to electronic device manufacturing technologies, and particularly to an electrostatic discharge device.
Background
A Printed Circuit Board (PCB) is an important electronic component. Electrostatic Discharge (ESD) is performed on a PCB to prevent Electrostatic damage to electronic components on the PCB. However, because ESD can be implemented through a conductive path and also can be implemented through capacitive coupling, the releasing manner is difficult to control, and it is difficult to ensure that static electricity does not affect electronic components on the PCB by performing static electricity releasing through capacitive coupling. At present, electronic components on a PCB are mainly protected by a chassis shielding manner, but capacitive coupling of static electricity is still difficult to avoid by the manner, and meanwhile, the method is low in applicability for holes and gaps of non-financial chassis and metal chassis.
Disclosure of Invention
Therefore, the electrostatic discharge device is provided, and the problems that capacitive coupling paths of ESD are uncontrollable and PCB is easily damaged in the prior art are solved.
In one aspect, there is provided an electrostatic discharge device including:
a substrate including at least one electronic component thereon;
the electrostatic discharge unit comprises at least one electrostatic discharge component, the electrostatic discharge component is arranged close to the electronic component and extends from a first direction, and the first direction comprises a direction from being close to the substrate to being far away from the substrate;
the substrate storage unit comprises at least one box body, and the substrate is placed in the box body.
In one embodiment, when the case is made of a non-metallic material, the substrate includes a metal layer including a first region and a second region, and the electronic component is disposed in the second region, wherein the first region is coated with an insulating material.
In one embodiment, when the box body is made of a metal material, the substrate comprises a metal layer at a position corresponding to the substrate in the slot of the box body, the metal layer comprises a first area and a second area, the electronic component is arranged in the second area, and the first area is coated with an insulating material.
In one embodiment, the length of the electrostatic discharge assembly in the first direction is smaller than the distance between the electrostatic discharge assembly and the box body.
In one embodiment, the diameter of the electrostatic discharge assembly decreases along the first direction.
In one embodiment, the electrostatic discharge assembly comprises a conical shape.
In one embodiment, the second region coincides with a geometric center of the electronic component.
In one embodiment, the shape of the second region comprises one of: rectangular and circular.
In one embodiment, the second region comprises one or more sub-regions, each of which coincides with a geometric center of a corresponding electronic component.
In one embodiment, two adjacent electrostatic discharge assemblies are disposed at equal intervals in the direction perpendicular to the first direction.
Above-mentioned electrostatic discharge device, through set up the electrostatic discharge subassembly on the base plate, the electrostatic discharge subassembly is close to electronic component to this electronic component extends by the direction of being close to the base plate to keeping away from the base plate, puts the base plate in the box simultaneously, makes the electrostatic energy discharge through the electrostatic discharge subassembly, thereby solves among the prior art capacitive coupling path uncontrollable of ESD, easily causes the problem of damage to PCB.
Drawings
FIG. 1 is a schematic diagram of an exemplary electrostatic discharge apparatus;
FIG. 2 is a schematic diagram of another embodiment of an electrostatic discharge device;
FIG. 3 is a schematic diagram of a printed circuit board according to an embodiment.
Description of reference numerals:
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
The structure, proportion, size and the like shown in the drawings are only used for matching with the content disclosed in the specification, so that the person skilled in the art can understand and read the description, and the description is not used for limiting the limit condition of the implementation of the invention, so the method has no technical essence, and any structural modification, proportion relation change or size adjustment still falls within the scope of the technical content disclosed by the invention without affecting the effect and the achievable purpose of the invention.
References in this specification to orientations or positional relationships such as "upper," "lower," "left," "right," "middle," "longitudinal," "lateral," "horizontal," "inner," "outer," "radial," "circumferential," and the like are based on the orientations or positional relationships illustrated in the drawings and are intended to simplify the description, rather than to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Static electricity generated in the PCB is liable to damage electronic components on the PCB, and thus it is necessary to discharge the static electricity in a certain manner. However, the electrostatic discharge may be implemented by a conductive path or a capacitive coupling, and it is difficult to clearly select a specific implementation manner during the electrostatic discharge, so that the electrostatic discharge may be performed by the conductive path and the capacitive coupling. However, capacitive coupling is difficult to ensure that static electricity is fully discharged, and thus, there is still a possibility that static electricity may damage electronic components of the PCB. For this, the electrostatic discharge component may be disposed on the PCB at a position close to the electronic component, and the PCB may be placed in the case to achieve the electrostatic discharge.
In one embodiment, as shown in fig. 1, there is provided an electrostatic discharge apparatus including:
a substrate 12, the substrate 12 including at least one electronic component 21 thereon;
the electrostatic discharge unit comprises at least one electrostatic discharge component 11, the electrostatic discharge component 11 is arranged close to the electronic component 21 and extends from a first direction, wherein the first direction comprises a direction from being close to the substrate 12 to being far away from the substrate 12;
and a substrate storage unit including at least one case 13, the substrate 12 being placed in the case 13.
In the above apparatus, static electricity is discharged from the static electricity discharge unit 11 provided on the substrate 12. Illustratively, a substrate 12, the substrate 12 including at least one electronic component 21 thereon; the electrostatic discharge unit comprises at least one electrostatic discharge component 11, the electrostatic discharge component 11 is arranged close to the electronic component 21 and extends from a first direction, wherein the first direction comprises a direction from being close to the substrate 12 to being far away from the substrate 12; the substrate storage unit includes at least one box 13, the substrate 12 is placed in the box 13, for example, the box 13 may be made of a metal material, when electrostatic energy enters the box 13, a potential difference may be formed between the box 13 and the substrate 12, and since the substrate 12 is too close to the box 13 or the overlapping area is too large, the coupling effect between the box 13 and the substrate 12 is strong, and the coupling capacitance existing between the box 13 and the substrate 12 introduces the electrostatic energy into the substrate 12, thereby affecting the working performance of the substrate 12. In this embodiment, the electrostatic discharge module 11 is disposed near the electronic module 21, and the electrostatic discharge module 11 extends from near the substrate 12 to far from the substrate 12, and the substrate 12 on which the electrostatic discharge module 11 is disposed is placed in the box 13.
In another embodiment, as shown in fig. 2, there is provided an electrostatic discharge device including:
a substrate 12, the substrate 12 including at least one electronic component 21 thereon;
the electrostatic discharge unit comprises at least one electrostatic discharge component 11, the electrostatic discharge component 11 is arranged close to the electronic component 21 and extends from a first direction, wherein the first direction comprises a direction from being close to the substrate 12 to being far away from the substrate 12;
and a substrate storage unit including at least one case 13, the substrate 12 being placed in the case 13.
Illustratively, a substrate 12, the substrate 12 including at least one electronic component 21 thereon; the electrostatic discharge unit comprises at least one electrostatic discharge component 11, wherein the electrostatic discharge component 11 is arranged close to the electronic component 21 and extends from a first direction, and the first direction comprises a direction from being close to the substrate 12 to being far away from the substrate 12; the substrate storage unit includes at least one box 13, the substrate 12 is placed in the box 13, for example, considering the case that there are single-sided board and double-sided board in the PCB, when the PCB is single-sided board, the electrostatic discharge assembly 11 may be disposed on one side of the substrate 12 where the electronic assembly 21 is placed, and when the PCB is double-sided board, the electrostatic discharge assembly 11 may be disposed on both sides of the substrate 12, further avoiding the electronic assembly 21 on the substrate 12 from being damaged by static electricity. The electrostatic discharge module 11 shown in fig. 2 is disposed at a symmetrical position on both surfaces of the PCB, but the placement of the electrostatic discharge module 11 is not particularly limited, and the placement of the electrostatic discharge module 11 mainly depends on the position of the electronic module 21 on the substrate 12, and the electrostatic discharge module 11 may be disposed at a position close to the electronic module 21. The electronic component 21 may be a general electronic component or a sensitive component, and the sensitive component refers to an electronic component that is sensitive to static electricity, and in this embodiment, is mainly disposed near the sensitive component. Preferably, the electrostatic discharge assemblies 11 may be disposed equidistantly around the sensitive component so that electrostatic discharge may be better performed.
In one embodiment, as shown in fig. 3, there is provided an electrostatic discharge device, when the case 13 is made of a non-metallic material, the substrate 12 includes a metal layer including a first region 22 and a second region, and the electronic component 21 is disposed in the second region 23, wherein the first region 22 is coated with an insulating material.
Illustratively, when the case 13 is made of a non-metal material, the substrate 12 includes a metal layer, the metal layer includes a first region 22 and a second region 23, and the electronic component 21 is disposed in the second region 23, wherein the first region 22 is coated with an insulating material, for example, the case 13 may be made of a metal material or a non-metal material, and when the case 13 is made of a non-metal material, it is difficult to achieve electrostatic discharge by the electrostatic discharge component 11 forming a voltage difference with the surface of the case 13. In the design and manufacturing process of the PCB, the metal layer of the substrate 12 can be coated with an insulating material to prevent the problems of short circuit and the like caused by mistake, but the surface of the PCB is insulated, static electricity cannot be led into a grounding point through the surface of the PCB, and only electronic components on the surface layer of the PCB can be dissipated, so that the system function is influenced. Therefore, in order to better perform electrostatic discharge, the metal layer of the substrate 12 may be divided into two regions, the first region 22 is coated with an insulating material, the second region 23 is not coated with an insulating material, the electronic component 21 is disposed in the second region 23, static electricity is attracted to the surface of the second region 23, and the static electricity is discharged through the second region 23. Further, for better protection of the electronic component 21, the geometric centers of the second region 23 and the electronic component 21 may coincide, and the shape of the second region 23 may be rectangular or circular, and is not particularly limited herein.
In another embodiment, when the box body is made of a metal material, the substrate comprises a metal layer at a position corresponding to the substrate of the slot of the box body, the metal layer comprises a first area and a second area, and the electronic component is arranged in the second area, wherein the first area is coated with an insulating material.
Illustratively, when the case 13 is made of a metal material, there may be a case where there is a gap in the case where the case 13 is not sealed, in this case, static electricity is discharged by a voltage difference between the static electricity discharging component 11 and the case 13, and the static electricity cannot be completely discharged, and therefore, static electricity can also be discharged by not coating an insulating material on the second region 23, and in the design and manufacturing process of the PCB, problems such as a short circuit due to a wrong touch can be prevented by coating an insulating material on the metal layer of the substrate 12, but this may cause insulation on the surface of the PCB, and static electricity cannot be introduced into a ground point through the surface of the PCB, and can only be dissipated through electronic components on the surface of the PCB, which may affect system functions. Therefore, in order to better perform electrostatic discharge, the metal layer of the substrate 12 may be divided into two regions, the first region 22 is coated with an insulating material, the second region 23 is not coated with an insulating material, the electronic component 21 is disposed in the second region 23, static electricity is attracted to the surface of the second region 23, and the static electricity is discharged through the second region 23. Further, for better protection of the electronic component 21, the geometric centers of the second region 23 and the electronic component 21 may coincide, and the shape of the second region 23 may be rectangular or circular, and is not particularly limited herein.
In one embodiment, an electrostatic discharge device is provided, wherein the length of the electrostatic discharge assembly in the first direction is smaller than the distance between the electrostatic discharge assembly and the box body.
Illustratively, the length of the electrostatic discharge assembly in the first direction is smaller than the distance between the electrostatic discharge assembly and the box 13, for example, in order to form a voltage difference between the electrostatic discharge assembly 11 and the box 13, the length of the electrostatic discharge assembly 11 in the first direction is smaller than the distance between the electrostatic discharge assembly 11 and the box 13, so that a certain gap exists between the electrostatic discharge assembly 11 and the box 13.
In one embodiment, an electrostatic discharge apparatus is provided, wherein a diameter of the electrostatic discharge assembly decreases from a larger diameter to a smaller diameter along a first direction, and the electrostatic discharge assembly comprises a conical shape.
Illustratively, the diameter of the electrostatic discharge assembly is decreased along a first direction, for example, the diameter of the electrostatic discharge assembly 11 is decreased along the first direction, the electrostatic discharge assembly includes a conical shape, and the electrostatic discharge assembly 11 may be a conical shape or another electrostatic discharge assembly 11 having a pointed shape, and the purpose of the present invention is mainly to form a strong voltage difference with the box 13, so as to cause a point discharge effect. According to the principle of attraction of positive and negative charges, the electrostatic discharge assembly 11 generates charges with a polarity opposite to that of the charges on the surface of the box 13, and at this time, the voltage difference between the electrostatic discharge assembly 11 and the box 13 may cause air breakdown to neutralize the charges on the surface of the original box 13, thereby preventing the electronic assembly 21 on the substrate 12 from being affected by electrostatic discharge.
In one embodiment, there is provided an electrostatic discharge device, the second region coinciding with a geometric center of the electronic component, the second region having a shape comprising one of: rectangular and circular.
Illustratively, the second region coincides with a geometric center of the electronic component, and the shape of the second region includes one of: rectangular and circular shapes, for example, in order to better protect the electronic component 21 from electrostatic interference in all directions, the geometric centers of the second region 23 and the electronic component 21 may coincide, and the shape of the second region 23 may be a rectangular or circular shape, which is not particularly limited herein.
In one embodiment, there is provided an electrostatic discharge device, wherein the second region comprises one or more sub-regions, and the one or more sub-regions respectively coincide with the geometric centers of the corresponding electronic components.
Illustratively, the second region includes one or more sub-regions, and the one or more sub-regions respectively coincide with the geometric centers of the corresponding electronic components, for example, considering that there may be a plurality of electronic components 21 on the substrate 12, the second region 22 may include a plurality of sub-regions, and the number of sub-regions may be set according to the number of electronic components 21, that is, a sub-region is set at each electronic component 21, and the geometric center of the sub-region coincides with the geometric center of the corresponding electronic component 21, and the shape of the sub-region may be a rectangle or a circle.
In one embodiment, an electrostatic discharge device is provided, and two adjacent electrostatic discharge assemblies are arranged at equal intervals in the first direction.
Illustratively, two adjacent electrostatic discharge assemblies are disposed at equal intervals in the direction perpendicular to the first direction, for example, two adjacent electrostatic discharge assemblies 11 may be disposed at equal intervals in the direction perpendicular to the first direction, so as to better form a voltage difference between the electrostatic discharge assemblies and the box body for electrostatic discharge.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An electrostatic discharge apparatus, comprising:
a substrate including at least one electronic component thereon;
the electrostatic discharge unit comprises at least one electrostatic discharge component, the electrostatic discharge component is arranged close to the electronic component and extends from a first direction, and the first direction comprises a direction from being close to the substrate to being far away from the substrate;
the substrate storage unit comprises at least one box body, and the substrate is placed in the box body.
2. The electrostatic discharge apparatus according to claim 1, wherein when the case is made of a non-metallic material, the substrate includes a metal layer including a first region and a second region, the electronic component being disposed in the second region, wherein the first region is coated with an insulating material.
3. The electrostatic discharge apparatus according to claim 1, wherein when the case is made of a metal material, the substrate includes a metal layer at a position corresponding to the substrate in the slot of the case, the metal layer includes a first region and a second region, the electronic component is disposed in the second region, and wherein the first region is coated with an insulating material.
4. The electrostatic discharge device of claim 1, wherein a length of the electrostatic discharge assembly in the first direction is less than a distance between the electrostatic discharge assembly and the housing.
5. The electrostatic discharge apparatus according to claim 1, wherein the diameter of the electrostatic discharge assembly decreases from large to small along the first direction.
6. The electrostatic discharge apparatus of claim 5, wherein the electrostatic discharge assembly comprises a conical shape.
7. The electrostatic discharge apparatus according to claim 2 or 3, wherein the second region coincides with a geometric center of the electronic component.
8. The electrostatic discharge apparatus according to claim 2 or 3, wherein the shape of the second region includes one of: rectangular and circular.
9. The electrostatic discharge apparatus according to claim 2 or 3, wherein the second region includes one or more sub-regions each coinciding with a geometric center of a corresponding electronic component.
10. The electrostatic discharge apparatus according to claim 1, wherein two adjacent electrostatic discharge assemblies are disposed at equal intervals in a direction perpendicular to the first direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210916483.4A CN115315065A (en) | 2022-08-01 | 2022-08-01 | Electrostatic discharge device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210916483.4A CN115315065A (en) | 2022-08-01 | 2022-08-01 | Electrostatic discharge device |
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| CN115315065A true CN115315065A (en) | 2022-11-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210916483.4A Pending CN115315065A (en) | 2022-08-01 | 2022-08-01 | Electrostatic discharge device |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222662A (en) * | 2011-07-01 | 2011-10-19 | 中国科学院微电子研究所 | Packaging structure for electrostatic protection by using point discharge |
| CN203387772U (en) * | 2013-06-28 | 2014-01-08 | 青岛歌尔声学科技有限公司 | Printed circuit board and electronic product |
| CN203761671U (en) * | 2013-11-29 | 2014-08-06 | 乐视致新电子科技（天津）有限公司 | Circuit board with electrostatic protection structure |
| TW201501615A (en) * | 2013-06-26 | 2015-01-01 | Inventec Corp | Electronic device |
| CN106793472A (en) * | 2017-01-20 | 2017-05-31 | 奇酷互联网络科技（深圳）有限公司 | A kind of printed circuit board (PCB) and preparation method thereof |
| CN110854113A (en) * | 2019-10-29 | 2020-02-28 | 武汉华星光电技术有限公司 | Electrostatic protection structure, manufacturing method and array substrate mother board |
| CN211607241U (en) * | 2019-09-06 | 2020-09-29 | 苏州浪潮智能科技有限公司 | Server capable of improving anti-interference capability |
-
2022
- 2022-08-01 CN CN202210916483.4A patent/CN115315065A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222662A (en) * | 2011-07-01 | 2011-10-19 | 中国科学院微电子研究所 | Packaging structure for electrostatic protection by using point discharge |
| TW201501615A (en) * | 2013-06-26 | 2015-01-01 | Inventec Corp | Electronic device |
| CN203387772U (en) * | 2013-06-28 | 2014-01-08 | 青岛歌尔声学科技有限公司 | Printed circuit board and electronic product |
| CN203761671U (en) * | 2013-11-29 | 2014-08-06 | 乐视致新电子科技（天津）有限公司 | Circuit board with electrostatic protection structure |
| CN106793472A (en) * | 2017-01-20 | 2017-05-31 | 奇酷互联网络科技（深圳）有限公司 | A kind of printed circuit board (PCB) and preparation method thereof |
| CN211607241U (en) * | 2019-09-06 | 2020-09-29 | 苏州浪潮智能科技有限公司 | Server capable of improving anti-interference capability |
| CN110854113A (en) * | 2019-10-29 | 2020-02-28 | 武汉华星光电技术有限公司 | Electrostatic protection structure, manufacturing method and array substrate mother board |
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