CN115305050A - Adhesive addition type organic silicon composition and preparation method thereof - Google Patents
Adhesive addition type organic silicon composition and preparation method thereof Download PDFInfo
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- CN115305050A CN115305050A CN202211075029.7A CN202211075029A CN115305050A CN 115305050 A CN115305050 A CN 115305050A CN 202211075029 A CN202211075029 A CN 202211075029A CN 115305050 A CN115305050 A CN 115305050A
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- Prior art keywords
- silicone oil
- tackifier
- vinyl
- hydrogen
- gamma
- Prior art date
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- Pending
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- 239000000203 mixture Substances 0.000 title claims abstract description 61
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 44
- 239000000853 adhesive Substances 0.000 title claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 29
- 239000010703 silicon Substances 0.000 title claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 229920002545 silicone oil Polymers 0.000 claims abstract description 57
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 45
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 43
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000001257 hydrogen Substances 0.000 claims abstract description 28
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 28
- -1 methacryloxy group Chemical group 0.000 claims abstract description 24
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000007822 coupling agent Substances 0.000 claims abstract description 20
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 17
- 239000003054 catalyst Substances 0.000 claims abstract description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000003112 inhibitor Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 230000004048 modification Effects 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 4
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 claims description 4
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004114 Ammonium polyphosphate Substances 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 239000006004 Quartz sand Substances 0.000 claims description 2
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 claims description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000000378 calcium silicate Substances 0.000 claims description 2
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 2
- 239000013522 chelant Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- SOGIFFQYRAXTDR-UHFFFAOYSA-N diethoxy(methyl)silane Chemical compound CCO[SiH](C)OCC SOGIFFQYRAXTDR-UHFFFAOYSA-N 0.000 claims description 2
- ASGKDLGXPOIMTM-UHFFFAOYSA-N diethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OCC)OCC)CCC2OC21 ASGKDLGXPOIMTM-UHFFFAOYSA-N 0.000 claims description 2
- WOUUFVMQNDKHSY-UHFFFAOYSA-N dimethoxy(methyl)silane Chemical compound CO[SiH](C)OC WOUUFVMQNDKHSY-UHFFFAOYSA-N 0.000 claims description 2
- SLQTWNAJXFHMHM-UHFFFAOYSA-N dimethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OC)OC)CCC2OC21 SLQTWNAJXFHMHM-UHFFFAOYSA-N 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 2
- 239000001095 magnesium carbonate Substances 0.000 claims description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 claims description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 claims description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- 229910000010 zinc carbonate Inorganic materials 0.000 claims description 2
- 239000011667 zinc carbonate Substances 0.000 claims description 2
- 235000004416 zinc carbonate Nutrition 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 239000005909 Kieselgur Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 abstract description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 229910000077 silane Inorganic materials 0.000 abstract description 5
- 229920003023 plastic Polymers 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 4
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000007259 addition reaction Methods 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000005595 acetylacetonate group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- UWNADWZGEHDQAB-UHFFFAOYSA-N 2,5-dimethylhexane Chemical group CC(C)CCC(C)C UWNADWZGEHDQAB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000013006 addition curing Methods 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical group OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000006069 physical mixture Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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Abstract
The invention discloses an adhesive addition type organic silicon composition and a preparation method thereof, the composition comprises vinyl silicone oil, hydrogen-containing silicone oil, a platinum catalyst, a tackifier, an auxiliary tackifier, an inhibitor and a filler, wherein the tackifier is selected from at least two tackifiers from D1-D3, the tackifier comprises D1, D1 is an oligomer of vinyl trialkoxy silane, D2 is an epoxy group coupling agent or/and an oligomer thereof, D3 is a methacryloxy group coupling agent or/and an oligomer thereof, and the auxiliary tackifier is a titanate coupling agent. The invention uses vinyl trialkoxy silane oligomer and silane coupling agent containing polar groups such as epoxy group or methacryloxy group and/or oligomer thereof and titanate coupling agent in a matching way, can obtain good bonding effect on the surfaces of metal and plastic, and the used tackifier is industrial product, relatively easy to obtain, pollution-free in preparation process and good in safety.
Description
Technical Field
The invention relates to the technical field of organic silicon bonding and pouring sealant, and relates to an adhesive addition type organic silicon composition.
Background
The addition curing type organic silicon has the characteristics of high and low temperature resistance, aging resistance, low shrinkage, deep curing, excellent electrical insulation and the like, and is widely applied to the fields of moisture protection, insulation sealing, shock prevention and isolation and the like of electronic components and industrial equipment.
However, the cured product thereof has low molecular polarity and poor adhesion to other materials, and when damaged by external force, it is almost completely peeled from the substrate, which affects the use thereof. Therefore, the industry has been improving the adhesion by improving the formulation, so that the application is more stable and reliable.
The improvement method is mainly to add a plurality of polar group-containing organic silicon tackifiers in the formula so as to improve the bonding performance. However, the effect of thickening is very limited by simply adding different types of low-molecular coupling agents to the formulation in a physical mixture. The preferred method is to add a self-synthesized adhesion promoter with a specific molecular structure to the formulation. The molecular structure of the tackifier comprises double bonds or hydrosilyl on one hand, and can participate in addition reaction to form chemical bonds with the main chain of the silicone rubber molecule; on the other hand, one or more of polar groups such as epoxy group, amino group, (meth) acryloxy group, isocyanate group, borate group, alkoxy group and the like can form chemical bonds or hydrogen bonds with the base material directly or after reaction. Thus, firm chemical crosslinking is formed between the cured silicone rubber main chain and the base material through the tackifier, so that the adhesion and the sealing performance are greatly improved. Meanwhile, the tackifier is still an organic silicon material, has good compatibility with a formula system, is stable to store, and does not bring other adverse effects.
For a long time, a plurality of tackifiers are synthesized by the technicians in the field and added into the formula of addition type organic silica gel or encapsulation materials so as to improve the adhesion and the sealing property of materials such as metal, plastic and the like and obtain certain effect. Such as: CN102898972A and CN102994004A are prepared by heating and non-aqueous condensing monomers such as hydroxyl-containing acrylate or hydroxyl-containing allyl ether and the like and alkoxy silane coupling agents such as epoxy group, acryloxy group and the like under the catalysis of titanate, and purifying by dealcoholization under reduced pressure to prepare the tackifier; CN108239284A is prepared by performing hydrolytic condensation on vinyl alkoxy silane and coupling agents such as epoxy group and acryloxy alkoxy silane in a solvent/water mixture under the catalysis of acid, and then performing purification steps such as neutralization, liquid separation, water washing, drying, reduced pressure reduction and low pressure reduction to prepare a tackifier; CN107674608A and CN111484620A are prepared by reacting dihydric alcohol acrylate containing carbon-carbon double bond, vinyl coupling agent and/or allyl glycidyl ether with hydrogen-containing silicone oil or D4 H Performing catalytic addition by a platinum complex, adsorbing to remove platinum, and performing reduced pressure reduction and purification to obtain the tackifier; CN104531003A is to perform ester exchange between boric acid ester and active hydroxyl compound containing unsaturated bond, remove low and purify to obtain the tackifier containing boron and unsaturated bond.
The molecular structure of the tackifier contains one or more polar groups except alkoxy, such as epoxy group, (methyl) acryloxy group and the like, besides unsaturated bonds or silicon-hydrogen bonds which can participate in main chain addition reaction, and plays a certain role in improving the adhesiveness and the sealing property of the addition type silicone rubber on the surfaces of different metals and plastics. However, the synthesis process of the tackifiers is still complex, waste water and waste gas are generated, and certain environmental protection and safety problems exist.
Therefore, the development of the adhesive addition type organic silicon composition which has simple synthesis process, low cost and environment-friendly and safe preparation process is of great practical significance.
Disclosure of Invention
Because the prior art has the defects, the invention provides the adhesive addition type organic silicon composition which has the advantages of simple synthesis process, low cost and environment-friendly and safe preparation process, and aims to solve the problems of complex process, harsh reaction conditions (mostly comprising the steps of heating, separating, reducing pressure and the like, and using a large amount of solvents, drying agents and adsorbents) and environment-friendly and potential safety hazards in the preparation process of the existing addition curing type organic silicon tackifier.
In order to achieve the purpose, the invention provides the following technical scheme:
an adhesive addition silicone composition comprising the following components:
A. vinyl silicone oil;
B. hydrogen-containing silicone oil;
C. a platinum catalyst;
D. a tackifier selected from at least two tackifiers selected from the following D1 to D3 and including D1;
d1 is an oligomer of vinyl trialkoxysilane, and the structural formula of the oligomer is as follows:
in the formula (1), R represents a saturated aliphatic alkyl group;
d2 is an epoxy-based coupling agent or/and an oligomer thereof; d3 is a methacryloxy coupling agent or/and an oligomer thereof;
wherein D is a composition, a tackifier for imparting adhesion to different substrates to the adhesive addition type silicone composition;
E. the auxiliary tackifier is a titanate coupling agent, and can further enhance the adhesive force of the cured organic silicon composition;
F. inhibitors (addition reaction inhibitors for adjusting the pot life, curing speed of the silicone composition);
G. fillers (fillers added to give specific properties to the silicone composition).
The adhesive addition type organic silicon composition has the advantages of reasonable formula, good adhesive property, environment-friendly and safe preparation process and mild preparation process conditions.
As a preferable technical scheme:
the above adhesive addition type silicone composition, wherein the vinyl silicone oil is a polysiloxane containing a carbon-carbon double bond capable of participating in an addition reaction in a molecular structure, and is at least one selected from a terminal vinyl silicone oil, a side vinyl silicone oil and a terminal vinyl silicone oil;
the mass percentage content of vinyl bonded with silicon atoms in the vinyl silicone oil is 0.01-2%;
the vinyl silicone oil has a viscosity of 10 to 1000000mpa.s at 23 ℃, which is measured using a Brookfield rotational viscometer (the same below), and is too low or too high, resulting in inconvenience in handling and deterioration in performance;
the hydrogen-containing silicone oil is polysiloxane with a molecular structure containing SiH groups capable of participating in addition reaction, and is selected from at least one of terminal hydrogen-containing silicone oil, side hydrogen-containing silicone oil and terminal hydrogen-containing silicone oil;
the mass percentage content of hydrogen radical directly bonded with silicon atom in the hydrogen-containing silicone oil is 0.01-3%;
the viscosity of the hydrogen-containing silicone oil at 23 ℃ is 0.5-10000mPa.s;
the platinum catalyst is selected from at least one of chloroplatinic acid, alcohol modifications of chloroplatinic acid, platinum-vinylsiloxane complexes, platinum-alkynyl complexes, and platinum-carbonyl complexes.
The above adhesive addition type silicone composition wherein the vinyl silicone oil has a viscosity of 50 to 200000mpa.s at 23 ℃;
the mass percentage content of vinyl bonded with silicon atoms in the vinyl silicone oil is 0.1-1%;
the viscosity of the hydrogen-containing silicone oil at 23 ℃ is 1-1000mPa.s;
the mass percentage content of hydrogen radical directly bonded with silicon atom in the hydrogen-containing silicone oil is 0.1-1.5%;
the platinum catalyst is a Karster catalyst.
An adhesive addition silicone composition as described above, wherein R is methyl, ethyl, propyl, or isopropyl; for convenience of use, D1 is preferably an oligomer which is liquid at room temperature, and these oligomers may be commercially available, for example: VMM-010 (Gelest corporation), dynasylan6490 (Wingand corporation), SG-Si 6490 (dajing eosin), JH-VP10 (Han of Hubei), etc.;
d2 is at least one selected from gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropyltriethoxysilane, gamma-glycidoxypropyl (methyl) dimethoxysilane, gamma-glycidoxypropyl (methyl) diethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltriethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyl (methyl) dimethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyl (methyl) diethoxysilane or oligomers thereof; the market products can be KBM-403 (Xinshichi chemical), KBE-403 (Xinshichi chemical), JH-O186 (the Han of Hubei), JH-O187 (the Han of Hubei) and the like; examples of commercially available oligomers thereof include KR-516 (shin-Etsu chemical), KR-517 (shin-Etsu chemical), CG-560M (Jiangxi Chenguang);
d3 is at least one selected from gamma-methacryloxypropyltrimethoxysilane, gamma-methacryloxypropyltriethoxysilane, gamma-methacryloxypropyl (meth) dimethoxysilane, gamma-methacryloxypropyl (meth) diethoxysilane, gamma-acryloxypropyltrimethoxysilane, gamma-acryloxypropyl (meth) dimethoxysilane, gamma-acryloxypropyltriethoxysilane, gamma-acryloxypropyl (meth) diethoxysilane or oligomers thereof; the market products can be KBM-503 (the modern chemistry), KBE-503 (the modern chemistry), KBM-5103 (the modern chemistry), JH-O174 (the Han of the North of a lake), JH-O1741 (the Han of the North of a lake), JH-O176 (the Han of the North of a lake), and the like; as commercially available products, there are mentioned KR-513 (Tanzhichemistry), JH-OP1705 (Heizhan, hubei), and the like;
the auxiliary tackifier is at least one of alkyl titanate or/and titanium chelate, such as tetraethyl titanate, tetrapropyl titanate, tetrabutyl titanate, tetraisopropyl titanate, dibutyl bis (acetoacetato) titanate, diisobutyl bis (acetoacetato) titanate, diisopropyl bis (acetoacetato) titanate, bis (acetylacetonato) ethoxyisopropoxy titanate, bis (acetylacetonato) isobutoxyisopropoxy titanate, bis (acetylacetonato) diisopropyl titanate and the like;
the inhibitor is selected from at least one of alkynol, maleate and polyvinyl polysiloxane, such as 1-ethynylcyclohexanol, 3-methyl-1-butyn-3-ol, monoethyl maleate, allyl maleate, diallyl maleate, tetramethyltetravinylcyclotetrasiloxane, etc., preferably tetramethyltetravinylcyclotetrasiloxane;
the filler is at least one selected from calcium carbonate, magnesium carbonate, zinc carbonate, barium sulfate, quartz sand, diatomite, aluminum silicate, calcium silicate, talc (the filler is low in cost), aluminum hydroxide, magnesium hydroxide, zinc borate, ammonium polyphosphate (the composition is good in flame retardance), aluminum oxide, zinc oxide, boron nitride, aluminum nitride, silicon carbide (the composition is good in heat conductivity) and silicon dioxide (specifically, fumed silica subjected to surface treatment by hexamethyldisilazane, precipitated silica, fumed silica without surface treatment, precipitated silica and the like, and the composition is high in mechanical strength).
The adhesive addition type silicone composition as described above, wherein the platinum in the platinum catalyst accounts for 0.1 to 100ppm of the total mass of the adhesive addition type silicone composition;
the addition amount of the tackifier accounts for 0.01-10% of the mass of the vinyl silicone oil;
the addition amount of the auxiliary tackifier accounts for 0.01-20% of the mass of the tackifier;
the addition amount of the inhibitor accounts for 0-10% of the mass of the vinyl silicone oil;
the addition amount of the filler accounts for 0-90% of the total mass of the adhesive addition type organosilicon composition;
in the addition type organosilicon composition, the ratio of the mole number of SiH groups contained in the hydrogen-containing silicone oil to the sum of the mole number of the silicon alkenyl groups contained in the vinyl silicone oil and the mole number of the silicon alkenyl groups contained in the tackifier is 0.1-3.
The adhesive addition type organic silicon composition is characterized in that platinum in the platinum catalyst accounts for 0.5-50 ppm of the total mass of the adhesive addition type organic silicon composition;
the addition amount of the tackifier accounts for 0.5-5% of the mass of the vinyl silicone oil; the addition amount is too small, the caking property is influenced, the addition amount is too large, and the physical and mechanical properties after curing are poor; when D is an arbitrary combination selected from D1 and D2 to D3, the ratio of each is not particularly limited, but is preferably 5% or more, particularly preferably 10% or more, by mass of D;
the addition amount of the auxiliary tackifier accounts for 0.1-10% of the mass of the tackifier;
the addition amount of the inhibitor accounts for 0.1-5% of the mass of the vinyl silicone oil;
the adding amount of the filler accounts for 10-70% of the total mass of the adhesive addition type organic silicon composition;
the ratio of the mole number of SiH groups contained in the hydrogen-containing silicone oil to the sum of the mole number of the silicon alkenyl groups contained in the vinyl silicone oil and the mole number of the silicon alkenyl groups contained in the tackifier is 0.5-2.
Other components of the adhesive addition type silicone composition of the present invention are, in addition to the above components a to G, the following other components which may be added as necessary as long as the object of the present invention is not impaired: metal oxides and metal hydroxides added for the purpose of improving heat resistance; dimethicone added for adjusting fluidity; various pigments added for coloring, and the like. Toluene, xylene, petroleum ether, and the like may also be added to the composition for specific uses by dissolving the composition in an organic solvent.
An adhesive addition silicone composition as described above is a two-component composition, the first component includes a, C and does not contain B, and the second component includes a, B and does not contain C.
An adhesive addition silicone composition as described above, the weight ratio of the first component to the second component being between 1.
An adhesive addition silicone composition as described above, the weight ratio of the first component to the second component being between 1.
The invention also provides a method for preparing the adhesive addition type organic silicon composition, which comprises the steps of respectively uniformly mixing a first component and a second component in a planetary stirrer or/and a high-speed dispersion machine, removing bubbles in vacuum, and respectively packaging to obtain the finished product of the adhesive addition type organic silicon composition, wherein the first component comprises A and C and does not contain B, and the second component comprises A and B and does not contain C.
Before use, the first component and the second component are mixed evenly by hand or a known mixing device, applied to an object to be bonded or encapsulated, and cured according to a set process, so that the bonding or encapsulation of the object is completed. The material of the object may be metal such as aluminum, copper, stainless steel, etc., or polymer such as ABS, PBT, etc.
The above technical solutions are only one possible technical solution of the present invention, the protection scope of the present invention is not limited thereto, and those skilled in the art can reasonably adjust the specific designs according to actual needs.
The invention has the following advantages or beneficial effects:
the invention uses vinyl trialkoxy silane oligomer and silane coupling agent containing polar groups such as epoxy group or (methyl) acryloxy and the like or/and oligomer thereof and titanate coupling agent in a matching way, can obtain good bonding effect on the surfaces of metal and plastic, and can greatly reduce the problems of environmental protection, safety and the like brought by the process of automatically synthesizing the tackifier on a small scale because the coupling agent or the oligomer thereof is mostly industrial products and is relatively easy to obtain.
Detailed Description
The present invention will be further described with reference to specific examples, but the present invention is not limited thereto.
All parts in the following examples are by weight.
A: vinyl-terminated silicone oil having a viscosity of 1000mPa.s at 23 ℃;
b: side hydrogen-containing silicone oil with hydrogen content of 0.4%;
c: a Kaster catalyst with a Pt content of 3000 ppm;
d: a tackifier;
d1: an oligomer of vinyltrimethoxysilane, having a vinyl content of 23%;
d2: an epoxy-containing coupling agent or oligomer thereof;
d2-1: gamma-glycidoxypropyltrimethoxysilane;
d2-2: oligomers of gamma-glycidoxypropyltrimethoxysilane;
d3: a methacryloxy group-containing coupling agent or an oligomer thereof;
d3-1: gamma-methacryloxypropyltrimethoxysilane;
d3-2: oligomers of gamma-methacryloxypropyltrimethoxysilane;
as tackifier D, the following ingredients were used in the comparative examples:
d4: vinyl trimethoxysilane;
e: auxiliary tackifier: bis (acetylacetonate) ethoxyisopropoxy titanate;
f: inhibitor (b): tetramethyltetravinylcyclotetrasiloxane;
g: aluminum hydroxide with a median particle size of 5 μm;
example 1
A method for preparing an adhesive addition type silicone composition is as follows:
adding 40 parts of A and 60 parts of G into a planetary stirrer, stirring at room temperature for 60min, adding 3 parts of C, stirring for 10min, adding 0.3 part of E, and stirring in vacuum for 10min to obtain a first component;
adding 30 parts of A, 10 parts of B and 1 part of F into a planetary stirrer, stirring at room temperature for 10min, adding 60 parts of G, stirring at room temperature for 60min, adding 2 parts of D1, 0.5 part of D2-1 and 0.5 part of D3-1, and stirring under vacuum for 10min to obtain a second component.
Examples 2 to 4 and comparative examples 1 to 2
The preparation method is basically the same as that of example 1, except for the formulation, which is specifically shown in table 1.
TABLE 1
The adhesion tests were carried out on the products obtained in the above examples and comparative examples, as follows:
cutting the material used in the test into a test piece of 100mm 25mm 2mm, uniformly mixing a first component and a second component according to the mass ratio of =1:
and (3) optimization: failure interfaces were all cohesive failure
Good: the failure interface is mainly cohesive failure and is peeled off at a small part
Difference: the failure interface was either mostly or completely debonded.
The results of evaluating the adhesion of the products obtained in the above examples and comparative examples are shown in Table 2
TABLE 2
As can be seen from table 2, the adhesion to aluminum, stainless steel, ABS, PBT can be significantly improved by using a combination adhesion promoter of an oligomer of vinyltrimethoxysilane, an epoxy-containing coupling agent or an oligomer thereof, and a methacryloxy-containing coupling agent or an oligomer thereof. Comparing example 1 with comparative example 1, it can be seen that the adhesive effect is poor without the auxiliary tackifier E; comparing example 1 with comparative example 2, it can be seen that the adhesive effect is deteriorated when vinyltrimethoxysilane coupling agent is used instead of the oligomer.
Although the invention does not provide corresponding examples of all the components disclosed in the invention, the substitution of the materials with similar properties to the components in the formula can be realized, namely, the equivalent substitution of the raw materials of the product of the invention, the addition of auxiliary components, the selection of specific modes and the like are all within the protection scope and the disclosure scope of the invention. It should be understood by those skilled in the art that the above embodiments may be combined with the prior art to realize the modifications, and the detailed description is omitted here. Such variations do not affect the essence of the present invention and are not described herein.
The above description is that of the preferred embodiment of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, in which case a detailed description is not to be understood as being practiced in a manner that is common in the art; those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or modify equivalent embodiments to equivalent variations, without departing from the spirit of the invention, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (10)
1. An adhesive addition silicone composition characterized by: comprises the following components:
A. vinyl silicone oil;
B. hydrogen-containing silicone oil;
C. a platinum catalyst;
D. a tackifier selected from at least two of the following D1 to D3 and including D1;
d1 is an oligomer of vinyl trialkoxysilane, and the structural formula of the oligomer is as follows:
in the formula (1), R represents a saturated aliphatic alkyl group;
d2 is an epoxy-based coupling agent or/and an oligomer thereof; d3 is a methacryloxy coupling agent or/and an oligomer thereof;
E. the auxiliary tackifier is a titanate coupling agent;
F. an inhibitor;
G. and (4) filling.
2. The adhesive addition type silicone composition according to claim 1, wherein the vinyl silicone oil is at least one selected from the group consisting of terminal vinyl silicone oil, side vinyl silicone oil, and terminal vinyl silicone oil;
the mass percentage content of vinyl bonded with silicon atoms in the vinyl silicone oil is 0.01-2%;
the viscosity of the vinyl silicone oil at 23 ℃ is 10-1000000mPa.s;
the hydrogen-containing silicone oil is selected from at least one of terminal hydrogen-containing silicone oil, side hydrogen-containing silicone oil and terminal hydrogen-containing silicone oil;
the mass percentage content of hydrogen radical directly bonded with silicon atom in the hydrogen-containing silicone oil is 0.01-3%;
the viscosity of the hydrogen-containing silicone oil at 23 ℃ is 0.5-10000mPa.s;
the platinum catalyst is selected from at least one of chloroplatinic acid, alcohol modifications of chloroplatinic acid, platinum-vinylsiloxane complexes, platinum-alkynyl complexes, and platinum-carbonyl complexes.
3. The adhesive addition type silicone composition according to claim 2, wherein the vinyl silicone oil has a viscosity of 50 to 200000mpa.s at 23 ℃;
the mass percentage content of vinyl bonded with silicon atoms in the vinyl silicone oil is 0.1-1%;
the viscosity of the hydrogen-containing silicone oil at 23 ℃ is 1-1000mPa.s;
the mass percentage content of hydrogen radical directly bonded with silicon atom in the hydrogen-containing silicone oil is 0.1-1.5%;
the platinum catalyst is a Karster catalyst.
4. The adhesive addition silicone composition according to claim 1, wherein R is a methyl group, an ethyl group, a propyl group, or an isopropyl group;
d2 is at least one selected from gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropyltriethoxysilane, gamma-glycidoxypropyl (methyl) dimethoxysilane, gamma-glycidoxypropyl (methyl) diethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltriethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyl (methyl) dimethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyl (methyl) diethoxysilane or oligomers thereof;
d3 is at least one selected from gamma-methacryloxypropyltrimethoxysilane, gamma-methacryloxypropyltriethoxysilane, gamma-methacryloxypropyl (meth) dimethoxysilane, gamma-methacryloxypropyl (meth) diethoxysilane, gamma-acryloxypropyltrimethoxysilane, gamma-acryloxypropyl (meth) dimethoxysilane, gamma-acryloxypropyltriethoxysilane, gamma-acryloxypropyl (meth) diethoxysilane, or oligomers thereof;
the auxiliary tackifier is alkyl titanate or/and titanium chelate;
the inhibitor is selected from at least one of alkynol, maleate and polyvinyl polysiloxane;
the filler is at least one selected from the group consisting of calcium carbonate, magnesium carbonate, zinc carbonate, barium sulfate, quartz sand, diatomaceous earth, aluminum silicate, calcium silicate, talc, aluminum hydroxide, magnesium hydroxide, zinc borate, ammonium polyphosphate, alumina, zinc oxide, boron nitride, aluminum nitride, silicon carbide and silica.
5. The adhesive addition silicone composition according to claim 1, wherein the platinum catalyst comprises 0.1 to 100ppm of platinum based on the total mass of the adhesive addition silicone composition;
the addition amount of the tackifier accounts for 0.01-10% of the mass of the vinyl silicone oil;
the addition amount of the auxiliary tackifier accounts for 0.01-20% of the mass of the tackifier;
the addition amount of the inhibitor accounts for 0-10% of the mass of the vinyl silicone oil;
the addition amount of the filler accounts for 0-90% of the total mass of the adhesive addition type organosilicon composition;
in the addition type organosilicon composition, the ratio of the mole number of SiH groups contained in the hydrogen-containing silicone oil to the sum of the mole number of the silicon alkenyl groups contained in the vinyl silicone oil and the mole number of the silicon alkenyl groups contained in the tackifier is 0.1-3.
6. The adhesive addition silicone composition according to claim 5, wherein the platinum catalyst comprises platinum in an amount of 0.5 to 50ppm based on the total mass of the adhesive addition silicone composition;
the addition amount of the tackifier accounts for 0.5-5% of the mass of the vinyl silicone oil;
the addition amount of the auxiliary tackifier accounts for 0.1-10% of the mass of the tackifier;
the addition amount of the inhibitor accounts for 0.1-5% of the mass of the vinyl silicone oil;
the addition amount of the filler accounts for 10-70% of the total mass of the adhesive addition type organosilicon composition;
in the addition type organosilicon composition, the ratio of the mole number of SiH groups contained in the hydrogen-containing silicone oil to the sum of the mole number of the silicon alkenyl groups contained in the vinyl silicone oil and the mole number of the silicon alkenyl groups contained in the tackifier is 0.5-2.
7. The adhesive addition silicone composition according to claim 1, wherein the composition is a two-component composition, the first component comprises A, C and is free of B, and the second component comprises A, B and is free of C.
8. The adhesive addition silicone composition according to claim 7, wherein the weight ratio of the first component to the second component is between 1.
9. The adhesive addition silicone composition according to claim 8, wherein the weight ratio of the first component to the second component is between 1.
10. The process for preparing an adhesive addition type silicone composition according to any one of claims 1 to 9, wherein a first component and a second component are uniformly mixed in a planetary mixer or/and a high-speed disperser, and then are subjected to vacuum bubble removal and then are packaged respectively to obtain the finished adhesive addition type silicone composition, wherein the first component comprises A and C and does not contain B, and the second component comprises A and B and does not contain C.
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