CN115302095A

CN115302095A - Method for removing electroplating process wire by laser

Info

Publication number: CN115302095A
Application number: CN202210882489.4A
Authority: CN
Inventors: 屈元鹏
Original assignee: Dct Tianjin Technology Development Co ltd
Current assignee: Dct Tianjin Technology Development Co ltd
Priority date: 2022-07-26
Filing date: 2022-07-26
Publication date: 2022-11-08

Abstract

The invention discloses a method for removing an electroplating process wire by using laser, which comprises the following steps: designing a reasonable half-cut laser processing path and a reasonable blanching laser processing path according to the state of the electroplated wire in the prior art; step (2), according to a half-cut laser path, the metal layer is just cut at the two ends of the process lead by laser, and the lower substrate is basically not damaged; and (3) according to the hot laser processing path, heating the process conductor by using the heat effect of the laser so as to reduce the binding force with the substrate, and simultaneously separating the process conductor from the substrate along with certain positive pressure air blowing or/and negative pressure air suction. The method does not need the traditional manual picking to remove the process wire, does not need secondary etching, does not need a protective material coating process, and can directly strip and remove the process wire by adopting laser; the method has the advantages of accurate positioning, no burr at the edge, no side etching, good consistency, high processing efficiency, low cost, simple operation and low requirement on the skill of staff.

Description

Method for removing electroplating process wire by using laser

Technical Field

The invention relates to the field of electronic circuit laser manufacturing, in particular to a method for removing a plating process wire by using laser.

Background

In the electroplating industry (electroplating refers to conventional electroplating with current and with a cathode and an anode, and does not include electroless plating of the chemical plating type), different components have different surface property requirements. All parts of some components need plating characteristics, and then the whole electroplating is carried out. Some parts of some components need plating characteristics, and some parts need substrate characteristics, namely selective plating. In selective plating, if the area to be plated is continuous and in a current network, and the current network can be easily connected to the cathode clamping point, the selective plating can be easily connected to the cathode for plating. However, if the areas where coating properties are desired are discontinuous, have many networks inside, and a significant number of networks are not available for connection to the cathode pinch point, then two solutions to this situation are common, one is to perform bulk plating and then selectively etch, and the other is to connect all the networks together with process wires and then converge to the cathode pinch point. Obviously, the first method requires more plating metal and high cost if it is a noble metal, while the second method requires less plating metal and reduces plating time, but brings another problem that the process wires connecting the network need to be removed after plating. The method for removing the process lead in the early stage is to manually pick the process lead by a knife, but the method has low efficiency, consumes a large amount of staff, is easy to cause various scratches by manual operation, cannot accurately remove the root of the graph end of the process lead, and has low yield and poor product consistency for precise elements. Later, partial manufacturers remove process wires by using a secondary etching method, mainly some PCB manufacturers, dry film-pasting, exposing, developing and secondary etching are carried out on products subjected to selective gold plating (including gold plug gold plating), the consistency of the method is improved, if the batch is large enough, the efficiency is improved by a little compared with manual work, but the method is equivalent to a double-sided board which is manufactured twice, the cost is high, the positioning of the root parts of the pattern ends of different process wires is inaccurate due to the expansion and shrinkage problem of a base material or a film, the side surface of corrosion is uneven due to the side etching problem, and the finished parts can be damaged due to the fact that a long process flow is added, so that the method still cannot meet the requirements of some products with high requirements, or the yield is too low (such as a high-frequency microwave board and the like); in addition, the secondary etching mode does not accord with the green environmental protection idea advocated by the state because the processing process uses chemical liquid medicines of different procedures such as development, etching, stripping and the like. The FPC manufacturer usually chooses to add one step of punching the process leads, but this method leaves a portion of the process leads on the product.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a method for removing an electroplating process lead by using laser, which does not need the traditional manual picking for removing the process lead, does not need secondary etching, does not need a protective material coating process, can directly strip and remove the process lead by using laser, is completely dry for treatment, is environment-friendly, does not have a chemical liquid process, does not have the process of manually picking the process lead, and avoids manual damage. The method has the advantages of accurate positioning, no burr and side corrosion on the edge, good consistency, high processing efficiency and low cost; the method is suitable for small-batch production and is more suitable for large-batch factories; and the operation is simple, and the requirement on the skills of the staff is low.

A method for removing a plating process wire by using laser comprises the following specific steps:

(1) Designing a half-cut laser processing path and a blanching laser processing path according to the state of the plated wire in the prior art;

(2) Performing half-cutting processing on the head end and the tail end of the process wire through the half-cutting laser path in the step (1), so that the metal layer of the process wire is separated from the surrounding metal layers, and the damage to the lower substrate is reduced;

(3) According to the hot-stamping laser processing path, the heat effect of the laser is utilized to heat up the process wire so as to reduce the binding force with the substrate, and the process wire is separated from the substrate along with positive pressure blowing or/and negative pressure suction.

Preferably, in the laser processing path design stage in the step (1), the single process wire which is not crossed is automatically decomposed by software according to the overall distribution of the process wire, and the precise end half-cut processing path and the rough end half-cut processing path of the single process wire are defined according to the characteristics of the head end and the tail end of the single process wire and the required processing precision; and then generating the following three blanching laser paths on the single process wire according to the characteristics of the single process wire: a. a single line blanching laser path from the precision end to the coarse end; b. a single line blanching laser path from the coarse end to the coarse end; c. and a double-line hot stamping laser path from the precise ends of the two ends to the middle position of the process wire in the length direction.

Preferably, the position of the precision end half-cut processing path generated in the step (1) is characterized in that a middle point of a connecting line of a formal metal pattern of a product to be processed and a process wire intersection moves to a process wire direction for a certain distance, and the certain distance is half of the diameter of a light spot, or any value from 0 light spot diameter to 10 light spot diameters; the length of the product is characterized in that the length of the connecting line of the formal metal pattern of the product to be processed and the intersection point of the process wire is subtracted by the reduction amount of etching, and then the radius length of an R angle formed after etching is respectively increased at the two ends; the reduction of etching and the radius of the R corner need to determine the numerical range according to the thickness of the metal layer and the process capability of the etched line body; when the intersection connecting line is a straight line and is vertical to the process conducting wire, the length of the intersection connecting line of the formal metal pattern of the product to be processed and the process conducting wire is the width of the process conducting wire.

Preferably, the rough end half-cut processing path generated in the step (1) is characterized in that the rough end half-cut processing path is not displayed on a final product graph after the process lead is removed, and the half-cut laser processing path is outside the outline of the product or in the middle of a through-cut inner groove or large hole; the length of the wire is characterized in that two ends of the wire are respectively extended by a certain length after crossing with a single process wire, and the certain length is any value within 0-10 mm.

Preferably, if the hot stamping laser processing path generated in the step (1) is in a type from a precision end to a rough end, the position characteristic of the precision end is that the midpoint of the precision end half-cut laser processing path moves a certain distance towards the process wire direction, and the certain distance is a half spot diameter or any value within 0-0.5 mm; the position characteristic of the rough end is that the middle point of the rough end half-cut laser path moves a certain distance towards the direction of the precise end, namely the negative direction, or away from the direction of the precise end, namely the positive direction, and the certain distance is any value within minus 0.2-100 mm.

Preferably, if the blanching laser processing path generated in the step (1) is of a type from a rough end to a rough end, the two rough ends are characterized in that the midpoint of the rough end half-cut laser processing path moves towards the midpoint of the length of the process wire, namely, a negative direction or away from the midpoint, namely, a positive direction, by a certain distance, and the certain distance is any value within negative 0.2-100 mm.

Preferably, the hot stamping laser processing path generated in the step (1) is two hot stamping laser processing paths if the hot stamping laser processing path is of a type from a precision end to a precision end, and the two hot stamping laser processing paths start from the respective precision ends and end along the center line of the process wire to a certain position in the middle of the process wire in the length direction; the two precise ends are both characterized in that the middle point of the half-cut laser path of each precise end moves a certain distance towards the process wire direction, and the certain distance is half of the diameter of a light spot or any value within 0-0.5 mm; the end points of the two blanching laser paths are that the left and the right of the midpoint of the length direction of the middle line of the process lead are respectively at a certain distance, or the left and the right of a certain point of the middle line moving back and forth by a certain length are respectively at a certain distance; the left and the right are respectively at a certain distance, so that the two hot ironing paths do not intersect, and the certain distance is a light spot diameter or any value within 0-1 mm; the certain length means that the lengths of the two hot pressing paths can be unequal and actually range from 0 to any value in the length of the process lead, and if the length of the two hot pressing paths is 0 or the length of the process lead, the two hot pressing paths are actually a hot pressing laser path; the connecting line of a section of length of the tail end and the head end of the two hot stamping laser paths is a continuous straight line or a broken line with a certain break angle towards the two outer sides; the certain length is any value within 0-10mm, the certain bevel angle, and the vertical length of the edge of the process wire with the two end points closest to each other after the bevel angle is any value within 0.25-0.5 times of the width of the process wire.

Preferably, in the step (2), a half-cutting processing stage of the head end and the tail end of the process lead is carried out, especially for the processing of the precise end, the laser temperature needs to be controlled to be low, so that the laser penetrates through the process lead without burning through the base material; the low temperature refers to the process of cutting the upper layer metal and is carried out at a low temperature; according to the characteristics of materials, selecting lower wavelength, lower pulse width, lower duty ratio, higher pause time and lower power output by the laser; the lower wavelength range is any value within 1064nm-0nm, the lower pulse width range is any value within 100ns-10fs, the lower duty cycle range is any value within 0.5% -0.1ppm, the higher intermittent time range is any value within 0-10s, and the lower power range is any value within 0.05-100W; the laser penetrates through the process wire without burning through the substrate, which means that the metal layer on the upper layer needs to be cut completely, and the substrate on the lower layer is not cut too much, so that the damage of the substrate is reduced; the method is characterized in that a proper light source needs to be selected according to the characteristics of a material to be processed, a proper process needs to be selected according to the characteristics that the absorption rate of an upper metal layer is high and the absorption rate of a lower base material layer is low, for example, the low-power multi-pass half-cutting is adopted, and when the base material layer is cut, a laser machine acquires the change of the cutting speed, so that the power is reduced or the processing is stopped.

Preferably, in the step (2), a half-cutting processing stage of the head end and the tail end of the process lead is carried out, and the positioning mode is characterized in that the positioning points designed in advance in the step (1) are used for integral positioning, and the half-cutting path generated in the step (1) is used for whole-plate continuous processing; or integrally positioning by using the positioning points designed in advance in the step (1), and then secondarily positioning each single process wire; the positioning sequence is that firstly, the path position of the fine end is determined, and the rough end automatically follows; the fine end is positioned for human eyes or for equipment edge finding positioning; in the edge searching and positioning of the equipment, the CCD of the equipment automatically searches the boundary of the metal and the base material according to the difference of the colors of the metal and the base material, finds the initial head and tail points of a cutting path of the precise end according to two boundary lines of a process wire and two intersection points of a straight line or a curve of a boundary of a product graph, then prolongs the initial head and tail points to the second head and tail points according to the R angular radius of two actually measured ends after a certain correction amount, and then translates the current whole path to the direction of the process wire by a certain distance by taking a middle point as a reference as a half-cutting path of the actually processed fine end, wherein the certain correction amount of the R angular radius is any value from-0.5R angular radius to +0.5R angular radius, and the middle point translates to the direction of the process wire by a certain distance to be a half light spot diameter or any value within 0-0.5 mm; the calculation process is automatically completed by the device driver software.

Preferably, in the step (3), the laser hot-stamping processing stage is mainly characterized in that the laser temperature needs to be controlled to be high temperature, so that the process wire is heated by the laser without melting the process wire and the base material; the high temperature refers to that the thermal effect of laser is utilized in the aspects of selection of a laser and selection of process parameters, and the laser parameters are selected according to the characteristics of materials, and comprises the following steps: longer wavelength, larger pulse width, higher duty cycle, stronger power, etc.; the higher wavelength is any value in the range of 355nm-10640nm, the longer pulse width is any value in the range of 10ps-10 mus, the higher duty cycle is any value in the range of 1ppm-100%, and the stronger power is any value in the range of 0.1W-1000W; the process wire and the base material are not melted, which means that the metal layer is heated and expanded after absorbing heat, but can not be melted, so the power density of the heating laser is selected according to the type and the thickness of the material, and the metal layer is heated to the maximum extent to increase the expansion tension, and can not be melted and softened to lose the tension.

Preferably, in the step (3), in the blanching laser processing stage, the size of the spot diameter of the laser is close to the width of the process wire; this approach is in the range of 0.5 to 1.2 times any value of process wire width; the too small diameter of the light spot can cause uneven heating in the width direction of the process wire, and the expansion tension is restrained; the too large diameter of the light spot can cause the substrate materials at the two sides of the process lead to be damaged by baking; and for the process wires with different widths, the process wires are manually or automatically adjusted to be the adaptive light spot diameters by equipment.

The method for removing the electroplating process lead by using the laser has the advantages and the technical effects that:

1. the precision is high, the processing precision of the precision end is usually within 10 μm, the CCD with high resolution is equipped, 5 μm is easy to achieve, and the precision can be continuously improved along with the improvement of the hardware precision in the future. The increased precision allows many high frequency, high speed products to be produced from being unproductive.

2. The yields is high, and laser beam machining's uniformity is good, in case the first piece is qualified that draws a design, the uniformity of follow-up processing product is very high to the yields is high, is superior to the uncertainty of artifical hand picking, also is superior to the uncertainty that unstability such as the temperature of each process liquid medicine, pressure, concentration led to the fact in the secondary etching.

3. The efficiency is high, and the process wire for laser removal is short in process flow because the process wire works on one or two continuous devices, and is different from long process flows of film sticking, plate aligning, exposure, development, etching, film removing and the like of a secondary etching process, so that the overall efficiency is high, and certainly, the efficiency is higher than that of manual picking.

4. The cost is low, and the comprehensive cost of the laser de-processing lead is low because the yield of the laser de-processing lead is high, the processing efficiency is high, and the process flow is short.

5. Compared with secondary etching, the laser process wire has no large amount of acid and alkali liquid treatment process, is beneficial to improving the working environment of workers, and conforms to the concept of national green development.

6. The operation difficulty is reduced, and both manual picking and secondary etching have more skill requirements on operators, such as control of a plurality of process parameters such as a picking method, direction and force, temperature and pressure of secondary etching liquid medicine, control of process transfer, a method of reworking defective products and the like. However, the original processing data of the laser de-processing lead is automatically generated by the Circ mu itCAM software, the positioning cutting in the processing process is automatically performed by laser equipment, the interference places of line operators are few, and the requirement on the skills of the operators is low.

Drawings

FIG. 1 is a schematic diagram of a conventional surface gold-plated microwave circuit board and process wire distribution

FIG. 2, half-cut and hot laser machining paths calculated by the Circ μ itCAM software. Since the calculated laser path and the original pattern have a position overlapping each other, the original data is displayed in a contour line

FIG. 3, detail enlargement of area A, precision end to coarse end type single process wire

FIG. 4, detail enlargement of area B, is broken down into three individual process wires, two of precision end to coarse end type and one of coarse end to coarse end type

FIG. 5, detail enlargement of area C, precision end to precision end type, double blanch path

FIG. 6, laser machining of area A by half-cut

FIG. 7, laser machining for blanching region A

FIG. 8, the whole laser process for removing all the process wires is completed, and the total 12 places are from precise to rough type, 3 places are from rough to rough type, and 1 place is from precise to precise type

FIG. 9, distribution of process wires after gold plating of FR4 plate gold plug

FIG. 10, automatically calculated by the Circuit μ itCAM software, is the half-cut laser path and the blanching laser path. To facilitate the visualization of the laser path, the contour line display for the process line

FIG. 11, detail enlargement of area D

FIG. 12, laser machining of area D by half-cut

FIG. 13, laser machining for blanching region D

FIG. 14, overall all laser ablation Process wire processing complete

Detailed Description

For a further understanding of the contents, features and effects of the present invention, reference will now be made to the following examples, which are to be considered in conjunction with the accompanying drawings. It should be noted that the present embodiment is illustrative, not restrictive, and the scope of the invention should not be limited thereby.

The invention discloses a method for removing a plating process wire by using laser, which is illustrated as follows: integral positioning holes 1 (four in total); a peripheral conductive band 2 (which can be a copper structure paved among single PCS in a multi-jointed board and finally connected with a cathode clamping point); a product outer contour line 3; the product inner contour 4 (the final product is of annular construction); a product conductive pattern 5 (comprising a circular ring, a square block and a non-connected rectangular strip in the middle); a through-cut inner groove 6 (the final product is cut away, indicated as 7 in the figure); a process wire 7 (the periphery of the process wire is provided with a conductive tape lead-in port at the total 4 positions in the figure); a precision end half-cut path 8 (slightly longer than the process wire width); a coarse end half-cut path 9 (which may be longer than the process wire width); a blanching laser path 10 (from the precision end to the rough end); the coarse end of the right single process wire is half-cut 11 (coinciding with the edge portion of the vertical process wire); a precision end half-cut path 12 for a single process wire on the left; a vertical rough to rough process line half cut path 13 (only one); precision end to precision end process wire 14; a double blanch laser path 15 (from both ends to the middle); an upper precision end half-cut path 16; a heat insulation isolation strip 17 after the precision end half-cutting processing; the rough end is half-cut into the processed heat insulation isolating strip 18; the process wire 19 after heat insulation from the head to the tail; FR4 product gold finger 20.

The invention relates to a method for removing a plating process wire by using laser, which comprises the following steps of: step (1), designing a reasonable half-cut laser processing path and a reasonable blanching laser processing path according to the state of the electroplated wire in the prior art; step (2), according to a half-cut laser path, the metal layer is just cut at the two ends of the process wire by laser, and meanwhile, the lower substrate is basically not damaged; and (3) according to the hot laser processing path, heating the process conductor by using the heat effect of the laser so as to reduce the binding force with the substrate, and simultaneously separating the process conductor from the substrate along with certain positive pressure air blowing or/and negative pressure air suction.

In the present invention, the half-cut means a depth setting processing mode in which the metal layer is cut without completely cutting through, and does not mean that the accurate processing depth is 50% of the total depth of the material.

The detailed steps are as follows:

and (1) designing a reasonable half-cut laser processing path and a reasonable blanching laser processing path according to the state of the electroplated process wire.

Two definitions are firstly made, and the half-cut laser processing refers to a cutting process of cutting the metal on the surface layer along the width direction at two ends of the process wire by using the cutting function of laser with proper laser parameters and simultaneously not damaging or not substantially damaging the bottom substrate. The path of the half-cut laser processing process is the half-cut laser processing path. The hot-stamping laser processing refers to a process of heating from one end to the other end along a process wire by using the heat effect of laser with proper parameters on the process wire with two disconnected ends after the half-cut laser processing, and the route of the hot-stamping processing operation is a hot-stamping laser path.

The path generation of the process is automatically generated on a PCB file with original process wires on a piece of PCB auxiliary manufacturing software (Circuit CAM).

The process lead is usually a metal pattern with one end connected with the product and the other end connected with the cathode clamping point, the metal pattern end connected with the product is generally higher in position, depth, length, appearance and the like, the end connected with the cathode clamping point is usually not in the finished product, and the finished product is finally milled in appearance or is removed when an inner groove is milled and a large hole is drilled, so that various requirements on the end are not high. Thus, as defined by this patent, the end of the metal pattern required for the process connection product is referred to as the fine end, and the end that is milled away or less desired is referred to as the coarse end.

A slightly more complex selectively plated product, whose overall process line is usually also networked and interdigitated, the circuitous cam software can automatically divide the interdigitated overall process line into individual process lines that are not interdigitated, and automatically configure the half-cut laser path of the fine end and the half-cut laser path of the coarse end according to the definition of the fine end and the coarse end, and automatically configure the hot-stamping laser path in the direction from the fine end to the coarse end or from the fine ends of both ends to the middle.

The half-cut laser path position of the precision end is positioned at the root part of the intersection of the process conducting wire and the pattern metal and moves a certain distance towards the direction of the process conducting wire, wherein the moving distance is half spot diameter theoretically, but the moving distance is also adjusted according to the product precision requirement and the equipment positioning capacity, and the moving distance is usually between 0 spot diameter and 10 spot diameters. The length of the precision end half-cut laser path is the length of the R corner radius formed after the etching is respectively added at the two ends after the reduction amount of the etching is subtracted from the connecting line length of the intersection point of the formal metal pattern and the process wire of the product to be processed. The amount of etch reduction and the radius of the R-corner herein may be determined to be within a substantially accurate range based on the thickness of the metal layer and the process capability of etching the line body. In a special case, if the intersection connecting line is a straight line and is perpendicular to the process conductor, the length of the intersection connecting line is the width of the process conductor. The semi-cut laser path of the precision end can be directly used by a path automatically generated by the circuitous CAM software, or the path automatically generated by the circuitous CAM software can be used as an approximate position, a new precision end semi-cut laser path is generated by CCD secondary edge-seeking positioning of equipment on the basis of approximate positioning, or the head and tail points of the original path are corrected to form a corrected precision end semi-cut laser path.

The half-cut laser path of the rough end is positioned outside the product outline, or in an internal through-cut groove or a non-metallized hole, namely a part to be removed, so that only a metal layer of a process lead is cut, whether a lower substrate is damaged or not is not greatly influenced, the upper end and the lower end are cut to be slightly influenced, the position precision requirement is lower, and the rough end is usually wider than the width of the process lead, for example, 1.1-1.5 times, so that the rough end is convenient to fall off. The rough end does not need to seek edge positioning, and only needs to use the path automatically generated by the Circuit CAM software.

The hot stamping laser path is a straight line which is equidistant or nearly equidistant from the upper side and the lower side of the strip-shaped process wire, the purpose of the nearly equidistant is to ensure that the whole process wire is completely heated, if one side is heated by a large amount and the other side is heated by a small amount or is not heated, the condition that the side with small amount of heat is not dropped and the side with large amount of heat is possibly subjected to hot stamping and color change can be caused. The processing direction of the hot stamping laser path runs from the precise end to the rough end, because the hot stamping laser is different and gradually increased in the process of walking from a starting end to an ending end, the starting end is completely heated and is constantly emitted by the laser beam, after the starting end receives energy constantly emitted by the laser beam, one part of the heated metal is used for heating the metal right below the laser beam, and the other part of the heated metal is transmitted to the ending end. In addition, the precision end of the blanching path, i.e., the beginning, is typically not separated by a distance, such as in the range of half a spot diameter to 0.5mm, from the midpoint of the precision end half-cut path, because if the blanching path and precision end half-cut path intersect, the energy at the intersection must be greater than the energy of the half-cut laser, which may cause discoloration of the graphic metal or discoloration along with the underlying substrate. The rough end of the blanching laser path may be joined with a half-cut path of the rough end, and the joining may be more easily broken off.

A single process wire, segmented by the circuitous cam, is typically precision-terminated on one end and coarse-terminated on the other, which is the most conventional form; there are also two ends, both rough, which is the easiest to machine; and two ends of the two hot ironing paths are both precise ends, and at the moment, a double-hot ironing path mode is adopted, specifically, the two hot ironing paths start from the two precise ends respectively and end at the middle position, but the tail ends of the two hot ironing paths are not superposed but need to be separated by a certain distance, or a turning head is made to the outer sides of the two hot ironing paths in advance, so that the mode can avoid the condition that the two hot ironing paths are jointed to scald the base material. A single hot stamping path may also be used if the length of the individual process wire is not very long, the energy stored is not very large, or the material to be processed has good heat resistance, and the quality of the finish end is also very precise.

And (2) performing head and tail end half-cutting processing on the process lead through the half-cutting laser path in the step (1), so that the metal layer of the process lead is separated from the surrounding metal layer, and simultaneously, the lower substrate is not damaged or basically not damaged.

The purpose of step (2) is to thermally isolate a single process wire to be processed from surrounding metal, and simultaneously meet the requirements that the size of a metal pattern retained by a component is accurate, the edge is smooth, and a base material is not damaged basically or meets the requirements.

From the general consensus in the laser industry at present, the effect of laser on materials is divided into two categories: photothermal effect and photochemical effect.

The photothermal effect refers to the phenomenon that after the material is irradiated by light, photon energy interacts with crystal lattices, vibration is intensified, temperature is increased, and the property of the material is changed due to the change of the temperature. For example, detectors such as thermistors and thermocouples utilizing a photothermal effect include three-state changes of a gas phase and a liquid phase caused by the photothermal effect, and changes of hardness, odor, light transmittance, and the like caused by the photothermal effect. The photothermal effect mainly acts on intermolecular van der waals forces.

Photochemical effects refer to the phenomenon of permanent chemical changes caused by the interaction of light with matter, the primary process being primarily a chemical bond within a molecule. Bond energy of different chemical bonds within a molecule is differentWhen encountering photons with close energy, the chemical bonds can be opened to decompose large molecules into small fragment atoms or ions, ion group state, such as organic large molecules into C and C ₂ 、C ₃ 、CH、C ₂ H ₂ And so on. The extent of the action of the photochemical effect is mainly related to the wavelength of the laser and the substance to be acted upon. The photons emitted by the lasers with different wavelengths have different electron volt energies, for example, the electron volt of infrared light at 1064nm is 1.17, the electron volt of green light at 532nm is 2.34, the electron volt of ultraviolet light at 355nm is 3.51, and the photon energy of deep ultraviolet laser light at 266nm is 4.68. While the chemical bonds contained in different substances are different, the following table is a table of bond energies of common chemical bonds.

TABLE 1 bond energy table of common chemical bonds.

It is generally considered that laser emitting photons with energy close to or greater than a chemical bond in a molecule of a substance to be acted on can open the chemical bond to break the molecule into small fragments, because the process acts directly on interatomic force rather than intermolecular force, instead of breaking lattice separation by molecular vibration caused by thermal effect, chemical bond separation is opened directly, so that pure photochemical effect is generally considered to have no or little thermal effect, and laser processing using photochemical effect is also called cold processing. As can be seen from the above table, the 1064nm laser with a photon energy of 1.17 ev has no chemical bonds that can be opened directly, while the green light with a photon energy of 2.34 ev has few chemical bonds that can be opened directly, so it is generally accepted that green and infrared lasers are thermal processes for most materials, for 355nm ultraviolet light, the photon energy is 3.51 electron volts, which can directly open a great number of chemical bonds, especially C-C, C-O, C-P, C-S, O-O, N-O, P-H, S-H and other chemical bonds with high proportion in nature. More chemical bonds are opened by deep ultraviolet laser energy of 4.68 ev. The laser cold working of a certain substance does not need to open all chemical bonds, the chemical bonds among atoms are like ropes with different thicknesses among atoms, and molecules are converted into ions or ion groups and are cut off as long as a part of the thinner ropes are opened. Cold working thus generally refers to laser working in the ultraviolet or deep ultraviolet. The cold working has the advantages of small working interface, small influence on the periphery and the lower layer, and slight oxidation blackening or discoloration.

The laser has two important characteristic parameters, one is the wavelength mentioned above, and the other is the pulse width, which is the duration of a pulse of laser light emitted by the laser. The shorter the pulse time of the laser the smaller the thermal effect with the close duty cycle, which is a macroscopic reason. There is also a microscopic reason, which is generally explained by relaxation times in the industry. By relaxation time is herein understood the time taken for an atom to revert from a high energy state to an equilibrium state upon absorption of the laser photon energy, including the atom longitudinal equilibrium time and the spin equilibrium time. The atoms have a certain state point within one period of relaxation time, which is the highest heat transfer efficiency to the surrounding atoms, and the state point may be characterized as being closest to the surrounding atoms (the shortest bond length and the highest bond energy), or being at an angle of an electromagnetic field (for example, 90 degrees), or being the highest overlap of electron clouds, and in short, this state must exist in each relaxation period, but if the pulse width time of the laser is less than the relaxation time of the material, it is possible that the atom does not reach this state after receiving a photon, or if a part of the pulse does not allow the atom to reach the ideal heat transfer state, the energy transfer efficiency of these pulses is low, and the thermal effect is reduced. It has been studied that the relaxation time of most substances is between about 100 femtoseconds and 10 picoseconds, and from this data, the thermal effect is reduced if the laser pulse time is less than 10 picoseconds, and from the practical experience of the industry, it has also been verified that the picosecond or femtosecond laser thermal effect is much smaller than that of continuous pulse or millisecond QCW or nanosecond long pulse width lasers.

By combining the two points, the process wire half-cutting processing process selects an ultraviolet or deep ultraviolet laser with short pulse width and wavelength less than 355nm as much as possible in the aspect of laser selection, because the process wire half-cutting processing is to cut the metal layer, the cut interface of the metal layer is not oxidized to change color as much as possible, and simultaneously, the lower substrate is not damaged or carbonized to change color as much as possible. The laser attempts to select a light source with high metal absorption and low substrate absorption, while at the same time being relatively inexpensive in combination with the requirements of the product being processed. For example, the requirements for metal layer cutting are not very high for some digital flexible printed circuit boards with PI base materials, but the PI at the bottom layer is very thin, and a low-power infrared pulse laser is adopted, because infrared light PI is basically not absorbed, the base materials are not damaged after the metal layer is cut. For example, when a metal layer is half-cut, the ultraviolet picosecond absorption rate is high, and ultraviolet nanoseconds can be processed, but the ultraviolet picosecond of the substrate is easy to cut through, and the ultraviolet nanoseconds are basically not absorbed, so that the material is suitable for half-cut processing by using the ultraviolet nanoseconds.

In process selection, the half-cut process may use a low power multi-pass mode, or the pause between two passes may be increased in a multi-pass process. The chip removal mode is a great difference between laser cutting and traditional mechanical drilling and milling, the traditional drilling and milling processes are active chip removal, synchronous active chip removal is performed while processing is performed, the laser processing is passive chip removal, high-power infrared laser processing metal is blown and chip removal after being completely melted, the shortwave ultra-fast laser depends on natural volatilization of ion gas (volatilization speed can be increased to a certain degree after means such as blowing and air suction are increased), the more ion gas is accumulated above a processing interface, photons can be absorbed in advance, the effective use efficiency of the laser is reduced, the carbonization proportion of the ion gas is higher and higher, the insulation performance and the appearance quality of carbon particles are increased when the carbon particles fall around a processing surface, the less ion gas generated by each processing is beneficial to rapid discharge, the chip removal time is increased when the intermittence between two times is increased, and the full exposure of the processing surface to the laser is facilitated. Certainly, some materials such as high-temperature metal have strong oxidation resistance and can be processed in high power, but the materials are processed in low power when reaching the bottom of the metal layer, so that the lower-layer base material is prevented from being damaged greatly.

In the mode of location, treat that the processing article is fixed well on the laser machine mesa at first, according to the positioning accuracy requirement of product, or according to the path overall positioning processing that the circuit CAM generated, whole continuous processing is once accomplished, perhaps with the data overall positioning back of circuit CAM, the accurate end accurate positioning of each single technology wire, process one by one. The accurate positioning means that the CCD automatically searches the boundary of the metal and the substrate according to the color difference of the metal and the substrate, and simultaneously, the software calculates the position and the length of the accurate end cutting path. The requirement of the rough end is not high, and the original circuit CAM data is generally used for processing.

And (3) according to the hot laser processing path, heating the process lead by using the heat effect of the laser so as to reduce the bonding force with the substrate, and simultaneously separating the process lead from the substrate along with certain positive pressure air blowing or/and negative pressure air suction.

The hot stamping laser processing uses the heat effect of laser, and the metal strip on the surface layer of the process lead can be separated from the lower insulating base material under the heating condition, and the reasons are as follows: 1, the coefficient of thermal expansion of metal is usually larger than that of the insulating substrate (e.g., the coefficient of thermal expansion of commonly used FR4 is between 10-15 ppm/deg.c, and the coefficient of thermal expansion of commonly used copper is 17-20 ppm/deg.c); 2, the temperature rise of the metal after being heated is generally higher than that of the insulating base material (for example, the thermal conductivity of most insulating materials is between 0.12 and 0.35W/m.K, while copper has excellent thermal conductivity of 390 to 420W/m.K., so that most energy is absorbed by the copper layer and is converted into heat energy when the surface of the copper metal layer is irradiated with laser, the temperature of copper rises rapidly, while the heat transfer of the insulating material is slower, and the temperature rises more slowly); 3, the periphery of the metal layer after half-cutting is not bound, the metal layer can freely extend under thermal expansion, and a small substrate vertical to the lower surface of the metal layer has certain temperature rise, but is difficult to expand and contract due to the limitation of the surrounding and lower unheated substrates during expansion; 4, an adhesive layer with a certain thickness is usually arranged between the metal layer and the insulating base material, the temperature of the hot stamping laser in the process of irradiating the metal layer usually reaches about 200 ℃ instantly, the Tg temperature of the common adhesive is mostly below 100 ℃ (for example, the temperature of the common acrylic adhesive is 40-70 ℃), even if some products do not have an adhesive layer between the metal layer and the lower organic insulating layer, the vitrification temperature of the organic insulating layer is usually lower than 200 ℃ (for example, the Tg temperature of epoxy resin in a rigid plate is usually 120-180 ℃), because the adhesive between the metal layer and the lower organic medium layer or the upper resin of the medium layer can be softened to a certain degree under the irradiation of the hot stamping laser, the adhesive force is reduced, the constraint of the thermal expansion of the metal layer is smaller, and the metal layer is easier to separate from the medium layer; and 5, when the metal layer and the dielectric layer are separated or semi-separated, blowing and/or sucking with certain pressure are assisted, so that the strip-shaped metal layer can be rapidly stripped from the lower substrate.

The selection of the laser used for the blanching laser is that the thermal effect is high. In terms of wavelength, infrared light and visible light (for example, green light) are preferable. Long pulse widths are preferred over short pulse widths from a pulse width perspective, and there is also a feature where the laser duty cycle is smaller for short pulse widths. For example, an infrared fiber with a pulse width of 100ns is usually around 40K with a duty cycle of 0.4%, while a green disc laser with a pulse width of 10ps is usually around 400K with a duty cycle of 0.0004%, and the thermal effects of short pulse widths and small duty cycles are more difficult to accumulate on metals. It is well understood that after the first 10 picosecond pulse is applied to the metal, the next 10 picosecond pulse is applied after 25000 10 picoseconds, and the heat of the previous 10 picosecond pulse is evaporated. Therefore, in practical applications, infrared light or green light with a pulse width of nanosecond level is generally selected as a laser type for hot stamping, and nanosecond ultraviolet light can also be used, but is matched with certain process conditions.

From the process point of view, the purpose of hot stamping laser processing is to make the metal layer of the process wire expand in a heat absorption mode rather than melt in a heat absorption mode, so that the power density of the heat absorption has a proper interval, the power density is too high, local melting is possible, and too low temperature rise is too low, so that expansion tension is too low. In order to control the power density, it is important to control reasonable power percentage, processing speed, actual spot diameter, etc. processing parameters after the laser (wavelength, pulse width, total power, etc.) is selected. The control of actual facula diameter is through beam expanding lens multiplying power, field lens focus and processing defocus integrated control such as volume, and there is a core point to be the width that actual facula diameter will be close to the technology wire here, is heated evenly often in whole width direction in the course of working like this, conveniently breaks away from the substrate. The approach is that the range is 0.5 to 1.1 times of the width of the process wire, and the process wire is too small and uneven to be heated and too large, so that the base materials at two sides are easy to be burnt. The parameters are also adjusted to use different spot diameters for different widths of process lines.

The positioning of the blanching laser processing follows the positioning of the half-cut laser. If the hot stamping laser processing and the half-cut laser processing are not processed on the same equipment, the positioning correction data of the actual half-cut laser processing needs to be transmitted to the hot stamping laser processing equipment.

In general, the core characteristic of the laser removing electroplating process wire is a cold character and a hot character. The head-to-tail half-cutting process of the metal wire is focused on cold machining, cold laser sources, cold air guns for assistance, low-power intermittent machining and the like, the metal layer is cut completely, and meanwhile, the lower-layer base material is not damaged or basically not damaged. The hot-stamping process of the metal wire is heavy in hot-stamping without melting, expansion tension is increased by heat, and metal cannot be melted.

In conclusion, the laser removing process wire of the method finishes sequential stripping of the metal strips from the base material just in the cold and hot alternation and relaxation mutual exclusion.

In order to more clearly illustrate the embodiments of the present invention, several examples are provided below:

example 1

A method for removing a process lead of a PTFE microwave gold-plated circuit board by laser. The pattern requirement of the microwave board is high because the microwave board is not a simple conductive function but a wave guide function, the pattern precision has obvious nonlinear influence on frequency deviation, power attenuation, wave guide speed, filtering precision and the like, and the influence is larger when the frequency is higher.

The processing steps of this embodiment are:

step one, adding a process wire in an engineering part according to the requirement of a PCB file to generate a jointed board file, and outputting drawings, programs and the like for production of each process.

And step two, the production line body firstly carries out the processes of drilling, hole metallization electroplating, dry film pasting on the front surface and the back surface, plate alignment, exposure, development, etching and the like, and the processing of the conductive pattern is completed.

And step three, electroplating soft gold on the front side and the back side by using a process wire according to process requirements. See figure one.

And step four, dividing the process wires into single process wires by using the Circuit CAM software according to the distribution state of the process wires, and generating a reasonable half-cut laser processing path and a reasonable blanching laser processing path. See figure two.

And fifthly, fixing the gold-plated product on a double-head laser processing system well, integrally positioning by using four-corner positioning holes, accurately positioning each precise end by using a CCD (charge coupled device) and by means of the edge-finding positioning function of equipment driving software, and then half-cutting the precise end and the rough end of each single process wire by using an ultraviolet picosecond laser head. The semi-cutting processing of the precise end and the rough end can be immediately carried out after one precise end is positioned, and the whole processing can also be carried out after all the precise ends are positioned, and is related to a positioning correction mode of equipment driving software. Fig. six shows the most common precision end-to-coarse end type single process wire half-cut laser machining state, with the single process wire to be removed isolated from the surrounding metal. In order to ensure the processing quality of the half-cut bottom and improve the efficiency, the processing of the precision end adopts a mode of firstly high power and then low power.

The processing parameters of the precision end are as follows:

front section:

wavelength of light

Pulse width

Spot diameter

Power of

Frequency of

Speed of processing

Number of working operations

355nm

10ps

20μm

15w

400KHz

400mm/s

2 times (one time)

Rear section

Wavelength of light

Pulse width

Spot diameter

Power of

Frequency of

Speed of processing

Number of working operations

355nm

10ps

20μm

3w

400KHz

800mm/s

2 times (one time)

The machining parameters of the rough end are as follows:

wavelength of light

Pulse width

Spot diameter

Power of

Frequency of

Speed of processing

Number of working operations

355nm

10ps

20μm

15w

400KHz

100mm/s

1 time of

And step six, after the process conducting wire is cut in half, an infrared nanosecond fiber laser is used for hot-stamping path processing, and under the coordination of air blowing and air suction, the single process conducting wire is stripped from the base material one by one and stored in a dust collection tray of a dust collector from an air suction opening. The seventh diagram shows the most common situation after the hot-stamping laser processing of the single process wire from the precision end to the rough end, the single process wire to be removed falls off from the substrate, and the conductive structure outside the outline may be left partially. Figure eight shows the entire product after removal of a single process wire.

Machining parameters of blanching laser

And seventhly, sequentially carrying out internal groove through cutting processing (the product has 7 positions), internal contour line processing and external contour line processing according to the full flow requirement of the product, thereby finishing the full-process processing of the whole product.

Example 2

And (3) laser removal of the process wire after gold plating of the traditional FR4 plate gold plug. The FR4 sheet metal gold plug is plated with gold, also called gold-plated finger, and is usually plated with cobalt gold, so as to make the plug have oxidation resistance and wear resistance, and simultaneously reduce the contact resistance of the plug and the socket. This product does not have very high requirements for the dimensions of the metal layer (not the milled dimensions), but rather for the appearance, since the plug is mostly external.

The processing steps of this embodiment are:

And step two, the production line body completes all the working procedures before nickel and gold electroplating according to the process requirements.

And step three, completing nickel-gold electroplating at the plug by utilizing a gold-plating process wire. See figure nine.

And step four, dividing the part in the process wire network outline into single process wires by using the Circuit CAM software, and generating a reasonable half-cut laser processing path and a reasonable blanching laser processing path. And as shown in the figure ten, the rough end half-cut path software judges that the rough end half-cut path software is on the same straight line, and automatically generates an integral path, so that the laser skipping and the switch delay are reduced, and the processing efficiency is improved. Fig. eleven is an enlarged view of a part of the detail.

And step five, fixing the gold-plated product on an ultraviolet nanosecond laser machine well, integrally positioning by using four-corner positioning holes, and half-cutting the precise end and the rough end of each single process wire one by using an ultraviolet nanosecond laser head. Fig. twelve shows the state after one of the fingers (precision end to coarse end type) has been half-cut laser machined, with the individual process wires to be removed and the surrounding metal isolation.

The processing parameters of the precision end are as follows:

wavelength of light

Pulse width

Spot diameter

Power of

Frequency of

Speed of processing

Number of working operations

355nm

20ns

20μm

15w

30KHz

400mm/s

2 times (one time)

The machining parameters of the rough end are as follows:

wavelength of light

Pulse width

Spot diameter

Power of

Frequency of

Speed of processing

Number of working operations

355nm

20ns

20μm

30w

30KHz

100mm/s

1 time of

And step six, after the process wire is half-cut, still using an ultraviolet nanosecond laser to change parameters for hot path processing. Fig. thirteen shows the state after the single finger has removed the process wire. Figure fourteen shows the entire product after removal of a single process wire.

Machining parameters of hot stamping laser

And seventhly, sequentially performing subsequent character printing, appearance processing and the like according to the full-process requirements of the product.

Finally, the invention adopts mature products and mature technical means in the prior art.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. A method for removing a plating process wire by using laser is characterized by comprising the following specific steps:

(1) Designing a half-cut laser processing path and a blanching laser processing path according to the state of the wire in the prior art after electroplating;

(2) Performing half-cutting processing on the head end and the tail end of the process lead through the half-cutting laser path in the step one to separate the metal layer of the process lead from the surrounding metal layer, so as to reduce the damage of the lower substrate;

2. The method for removing a plating process wire by laser according to claim 1, wherein: in the laser processing path design stage in the step (1), the single process conducting wire without crossing is automatically decomposed by software according to the overall distribution of the process conducting wire, and a precise end half-cut processing path and a rough end half-cut processing path of the single process conducting wire are defined according to the characteristics of the head end and the tail end of the single process conducting wire and the required processing precision; and then generating the following three blanching laser paths on a single process wire according to the characteristics of the single process wire: a. a single line blanching laser path from the precision end to the coarse end; b. a single line blanching laser path from the coarse end to the coarse end; c. and a double-line blanching laser path from the precise ends of the two ends to the middle position of the process wire in the length direction.

3. A method of laser ablating plated process lines according to claim 2, wherein: the position of the precision end half-cutting processing path generated in the step (1) is characterized in that a middle point of a connecting line of a formal metal pattern of a product to be processed and a process lead intersection moves to a process lead direction for a certain distance, and the certain distance is half of the diameter of a light spot, or any value from 0 light spot diameter to 10 light spot diameters; the length of the product is characterized in that the length of the connecting line of the formal metal pattern of the product to be processed and the intersection point of the process wire is subtracted by the reduction amount of etching, and then the radius length of an R angle formed after etching is respectively increased at the two ends; the reduction amount of etching and the radius of the R corner need to determine a numerical range according to the thickness of the metal layer and the technological capability of etching the line body; and when the intersection connecting line is a straight line and is vertical to the process conductor, the length of the intersection connecting line of the formal metal pattern of the product to be processed and the process conductor is the width of the process conductor.

4. The method of claim 2, wherein the laser ablation of the plating process line comprises: the rough end half-cut processing path generated in the step (1) is characterized in that the rough end half-cut processing path is not displayed on a final product graph after the process lead is removed, and the half-cut laser processing path is outside the outline of the product or in the middle of a through-cut inner groove or large hole; the length of the wire is characterized in that two ends of the wire are respectively extended by a certain length after crossing with a single process wire, and the certain length is any value within 0-10 mm.

5. A method of laser ablating plated process lines according to claim 2, wherein: if the hot stamping laser processing path generated in the step (1) is in a type from a precise end to a rough end, the position characteristic of the precise end is that the middle point of the precise end half-cut laser processing path moves a certain distance towards the direction of the process wire, and the certain distance is half of the diameter of a light spot or any value within 0-0.5 mm; the position characteristic of the rough end is that the middle point of the rough end half-cut laser path moves a certain distance towards the direction of the precise end, namely the negative direction, or away from the direction of the precise end, namely the positive direction, and the certain distance is any value within minus 0.2-100 mm.

6. A method of laser ablating plated process lines according to claim 2, wherein: if the blanching laser processing path generated in the step (1) is in a type from a rough end to a rough end, the position characteristics of the two rough ends are that the midpoint of the rough end half-cutting laser processing path moves a certain distance towards the midpoint direction of the length of the process wire, namely the negative direction, or away from the midpoint direction, namely the positive direction, and the certain distance is any value within minus 0.2-100 mm.

7. A method of laser ablating plated process lines according to claim 2, wherein: if the hot stamping laser processing path generated in the step (1) is of a type from a precision end to a precision end, the generated hot stamping laser processing paths are two, and the two paths start from the respective precision ends and end from the center line of the process lead to a certain position in the middle of the length direction of the process lead; the position characteristics of the two precision ends are that the middle point of the semi-cutting laser path of each precision end moves a certain distance towards the process wire direction, and the certain distance is half of the diameter of a light spot or any value within 0-0.5 mm; the end points of the two blanching laser paths are that the left and the right of the midpoint of the length direction of the middle line of the process lead are respectively at a certain distance, or the left and the right of a certain point of the middle line moving back and forth by a certain length are respectively at a certain distance; the left and the right are respectively at certain distances, so that the two blanching paths do not intersect, and the certain distance is a light spot diameter or any numerical value within 0-1 mm; the certain length means that the lengths of the two hot pressing paths can be unequal and actually range from 0 to any value in the length of the process lead, and if the length of the two hot pressing paths is 0 or the length of the process lead, the two hot pressing paths are actually a hot pressing laser path; the connecting line of a section of length of the tail end and the head end of the two hot stamping laser paths is a continuous straight line or a broken line with a certain break angle towards the two outer sides; the certain length is any value within 0-10mm, the certain folding angle, and the vertical length of the edge of the process conducting wire, which is closest to the two end points after the folding angle, is any value within 0.25-0.5 times of the width of the process conducting wire.

8. The method of claim 1, wherein the step of removing the plating process line comprises: in the step (2), the half-cutting processing stage of the head end and the tail end of the process lead is carried out, particularly for the processing of a precise end, the laser temperature needs to be controlled to be low, so that the laser penetrates through the process lead without burning through the base material; the low temperature refers to the process of cutting the upper layer metal and is carried out at a low temperature; according to the characteristics of materials, selecting lower wavelength, lower pulse width, lower duty ratio, higher pause time and lower power output by the laser; the lower wavelength range is any value within 1064nm-0nm, the lower pulse width range is any value within 100ns-10fs, the lower duty cycle range is any value within 0.5% -0.1ppm, the higher intermittent time range is any value within 0-10s, and the lower power range is any value within 0.05-100W; the laser penetrates through the process wire without burning through the substrate, which means that the metal layer on the upper layer is required to be cut through, and the substrate on the lower layer is not over-cut, so that the damage of the substrate is reduced; the method is characterized in that a proper light source needs to be selected according to the characteristics of a material to be processed, a proper process needs to be selected according to the characteristics that the absorption rate of an upper metal layer is high and the absorption rate of a lower substrate is low, for example, a low-power multi-pass half-cut is adopted, and when the substrate layer is cut, a laser machine acquires the change of the cutting speed, so that the power is reduced or the processing is stopped.

9. The method of claim 1, wherein the step of removing the plating process line comprises: in the step (2), a half-cutting processing stage of the head end and the tail end of the process wire is carried out, and the positioning mode is characterized in that positioning points designed in advance in the step (1) are used for integral positioning, and the half-cutting path generated in the step (1) is used for whole-plate continuous processing; or integrally positioning by using the positioning points designed in advance in the step (1), and then secondarily positioning each single process wire; the positioning sequence is that firstly, the path position of the fine end is determined, and the rough end automatically follows; the positioning of the fine end is human eye positioning or equipment edge searching positioning; in the edge searching and positioning process of the equipment, the CCD of the equipment automatically searches the boundary of metal and a base material according to the color difference of the metal and the base material, finds the initial head and tail points of a cutting path of a precise end according to two boundary straight lines of a process wire and two intersection points of a straight line or a curve of a boundary of a product graph, then prolongs the initial head and tail points to the second head and tail points according to the R angular radius of two actually measured ends after certain correction, then translates the current whole path to the direction of the process wire by a certain distance by taking a middle point as a reference as a half-cutting path of the actually processed fine end, wherein the certain correction of the R angular radius is any value from-0.5R angular radius to +0.5R angular radius, and the middle point translates to the direction of the process wire by a certain distance to be a half light spot diameter or any value within 0-0.5 mm; the calculation process is automatically completed by the device driver software.

10. The method of claim 1, wherein the step of removing the plating process line comprises: in the step (3), the blanching laser processing stage is mainly characterized in that the laser temperature needs to be controlled to be high so that the laser heats the process wire and does not melt the process wire and the base material; the high temperature refers to that the thermal effect of laser is utilized in the aspects of selection of a laser and selection of process parameters, and the laser parameters are selected according to the characteristics of materials, and comprises the following steps: longer wavelength, larger pulse width, higher duty cycle, stronger power, etc.; the higher wavelength is any value in the range of 355nm-10640nm, the longer pulse width is any value in the range of 10ps-10 mus, the higher duty cycle is any value in the range of 1ppm-100%, and the stronger power is any value in the range of 0.1W-1000W; the process wire and the base material are not melted, which means that the metal layer is heated and expanded after absorbing heat, but can not be melted, so the power density of the heating laser is selected according to the type and the thickness of the material, and the metal layer is heated to the maximum extent to increase the expansion tension, and can not be melted and softened to lose the tension.

11. The method for removing a plating process wire by laser according to claim 1, wherein: in the step (3), in the stage of hot stamping laser processing, the size of the spot diameter of the laser is close to the width of the process wire; this approach is in the range of 0.5 to 1.2 times any value of process wire width; too small spot diameter can cause uneven heating in the width direction of the process wire, and expansion tension is restrained; the too large diameter of the light spot can cause the substrate materials at the two sides of the process lead to be damaged by baking; and for process wires with different widths, the process wires are adjusted to the adaptive spot diameter manually or automatically by equipment.