CN115302039A

CN115302039A - Brazing positioning device

Info

Publication number: CN115302039A
Application number: CN202210957105.0A
Authority: CN
Inventors: 肖鹏; 王明军; 徐俊; 文军
Original assignee: Guangdong Huazhixin Electronic Technology Co ltd
Current assignee: Guangdong Huazhixin Electronic Technology Co ltd
Priority date: 2022-08-10
Filing date: 2022-08-10
Publication date: 2022-11-08
Anticipated expiration: 2042-08-10
Also published as: CN115302039B

Abstract

The application relates to a brazing positioning device, which comprises a base plate, a first boss and a plurality of second bosses. The bottom plate is provided with a containing groove, and the side wall of the containing groove is provided with two first positioning surfaces which are used for being in positioning fit with the frame body of the lead frame along two sides of the first direction and two second positioning surfaces which are used for being in positioning fit with the frame body along two sides of the second direction. The first boss is arranged at the bottom of the accommodating groove and is used for being matched with the inner hole of the ceramic ring in a positioning mode. The second bosses are arranged at the bottom of the accommodating groove, and are provided with two third positioning surfaces which are used for being in positioning fit with the heat sink block along two sides of the first direction and two fourth positioning surfaces which are used for being in positioning fit with the heat sink block along two sides of the second direction. All the second bosses are arranged on the peripheral side of the first bosses at intervals so as to avoid the fins of the lead frame. The brazing positioning device is high in positioning accuracy, and can prevent all parts in the ceramic tube shell from shifting in the brazing process so as to ensure the quality of finished products.

Description

Brazing positioning device

Technical Field

The application relates to the technical field of ceramic tube shell brazing, in particular to a brazing positioning device.

Background

The ceramic tube shell mainly comprises a heat sinking block at the bottom, a ceramic ring in the middle and a lead frame at the top. In the related technology, the heat sink block and the ceramic ring, and the ceramic ring and the lead frame are fixedly connected by brazing. Specifically, the three parts are arranged in a brazing positioning device, welding materials are arranged at the welding positions between the heat sinking block and the ceramic ring and between the ceramic ring and the lead frame, and the brazing positioning device is placed in a chain furnace for brazing molding. However, the positioning accuracy of the existing brazing positioning device is low, and individual parts in the ceramic tube shell can be displaced in the brazing process, so that a cold joint or a solder overflows to a core area, and the quality of a finished product is influenced.

Disclosure of Invention

Therefore, a brazing positioning device with high positioning accuracy is needed to be provided, and displacement of each part in the ceramic tube shell in the brazing process can be avoided, so that the quality of a finished product is ensured.

According to an aspect of the present application, an embodiment of the present application provides a brazing positioning device, which is used for positioning a lead frame, a ceramic ring, and a heat sink block of a ceramic package during a brazing process, where the lead frame includes a frame body and a plurality of fins connected to an inner side of the frame body, the brazing positioning device includes:

the bottom plate is provided with a containing groove for containing the ceramic tube shell; the side wall of the accommodating groove is provided with two first positioning surfaces which are used for being in positioning fit with two sides of the frame body of the lead frame along a first direction, and two second positioning surfaces which are used for being in positioning fit with two sides of the frame body along a second direction;

the first boss is arranged at the bottom of the accommodating groove; the first boss is used for positioning and matching with an inner hole of the ceramic ring; and

the second bosses are arranged at the bottom of the accommodating groove; two third positioning surfaces which are used for being in positioning fit with two sides of the heat sinking block along the first direction and two fourth positioning surfaces which are used for being in positioning fit with two sides of the heat sinking block along the second direction are arranged on the second boss;

all the second bosses are arranged on the peripheral side of the first bosses at intervals so as to avoid the fins of the lead frame;

the first direction and the second direction are perpendicular to each other.

In one embodiment, the brazing positioning device further comprises a pressure plate;

when the ceramic tube shell is arranged in the accommodating groove, the pressing plate is used for pressing and covering the heat sinking block.

In one embodiment, the pressure plate is configured to be capable of mutually engaging with the base plate.

In one embodiment, the pressure plate is provided with a suction pipeline;

when the pressing plate and the bottom plate are mutually clamped, the air exhaust pipeline is communicated with the accommodating groove, so that the accommodating groove can perform negative pressure extraction by means of the air exhaust pipeline.

In one embodiment, the pressure plate is provided with a vent hole;

when the pressing plate and the bottom plate are mutually clamped, the vent hole is communicated with the accommodating groove, so that the air pressure in the accommodating groove can be kept consistent with the external air pressure of the brazing positioning device.

In one embodiment, the brazing positioning device further comprises a third boss arranged on one side of the pressure plate close to the bottom plate;

the ceramic tube shell is arranged in the accommodating groove, and when the pressing plate and the bottom plate are mutually clamped, the third boss can be pressed on the heat sink block.

In one embodiment, the brazing positioning device further comprises a fourth boss;

the fourth boss is arranged at the bottom of the accommodating groove, and the fourth boss is configured to limit the fin when the lead frame is arranged at the bottom of the accommodating groove.

In one embodiment, the second boss comprises an angular positioning boss;

the angle positioning boss is provided with a third positioning surface and a fourth positioning surface which are perpendicular to each other.

In one embodiment, the second boss comprises an edge locating boss;

the third positioning surface or the fourth positioning surface is formed on the edge positioning boss.

The brazing positioning device at least comprises a bottom plate, a first boss and a second boss, and the ceramic tube shell is arranged in the brazing positioning device in the following operation: the lead frame is arranged at the bottom of the accommodating groove, the first positioning surface and the second positioning surface on the side wall of the accommodating groove are used for positioning the frame body of the lead frame in the first direction and the second direction, and the plurality of second bosses arranged at intervals can be kept away from the fins of the lead frame. And arranging solder at the welding position between the lead frame and the ceramic ring, and arranging the ceramic ring at the top of the fin of the lead frame, so that the inner hole of the ceramic ring is sleeved outside the first boss to position the ceramic ring in the first direction and the second direction. And the solder is arranged at the welding position between the ceramic ring and the heat sink block, the heat sink block is arranged at the top of the ceramic ring, and the heat sink block is positioned in the first direction and the second direction through the third positioning surface and the fourth positioning surface on the second boss. Therefore, all the parts of the ceramic tube shell are effectively positioned in the first direction and the second direction, and the phenomenon that the displacement causes the false welding or the solder overflows to the core area in the brazing process is avoided, so that the quality of finished products is ensured.

Drawings

FIG. 1 is a schematic view of a brazing positioning apparatus according to an embodiment of the present application;

FIG. 2 is a schematic structural view of a ceramic envelope;

FIG. 3 is a schematic structural view of a ceramic package disposed on the brazing positioning device shown in FIG. 1;

FIG. 4 is a schematic view of a brazing positioning device in another embodiment of the present application;

FIG. 5 is a schematic view of a pressure plate of the brazing positioning device shown in FIG. 4;

FIG. 6 is a schematic view of a portion of a brazing positioning device in yet another embodiment of the present application;

FIG. 7 is a schematic view of a platen according to yet another embodiment of the present application;

FIG. 8 is a schematic view of the assembly of the base plate and the pressure plate according to another embodiment of the present application.

Description of reference numerals:

10. a brazing positioning device;

11. a base plate; 111. a containing groove; 112. a first positioning surface; 113. a second positioning surface; 114. a first avoidance surface; 115. a second avoidance surface; 116. a first chamfer; 12. a first boss; 13. a second boss; 13a, an angle positioning boss; 13b, positioning a boss at the edge; 131. a third positioning surface; 132. a fourth positioning surface; 14. pressing a plate; 141. a second chamfer; 15. a connector; 16. a third boss; 17. a fourth boss; 17a, a middle boss; 17b, a bevel edge boss;

20. a ceramic envelope;

21. a lead frame; 211. a frame body; 212. a fin; 212a, a middle short fin; 212b, hypotenuse long fins; 22. a ceramic ring; 23. heat sinking the block; 24. a core region.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiment in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and therefore the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The ceramic tube shell mainly comprises a heat sinking block at the bottom, a ceramic ring in the middle and a lead frame at the top, wherein the heat sinking block and the ceramic ring form a core area for arranging a chip, the heat sinking block is used for dissipating heat of the chip, and the lead frame is used for electrically connecting the chip with an external lead. In the related technology, the heat sink block and the ceramic ring, and the ceramic ring and the lead frame are fixedly connected by brazing. During brazing, the solder is usually placed in a sandwiched manner, that is, the solder is disposed between two base materials stacked up and down along the gravity direction, and during the process of melting the solder, the upper base material may sink down, and due to different deposition speeds in different directions, if the base materials are not positioned in the horizontal direction, the positions of the upper base material and the lower base material may be shifted.

At present, the brazing method for the ceramic tube shell mainly comprises a secondary welding method and a primary welding method. In the secondary welding method, the ceramic ring and the lead frame are welded together to form a semi-finished product, and then the semi-finished product and the heat sink block are welded together to obtain the ceramic tube shell. The secondary welding method needs to pass through a chain furnace twice in the brazing process, time and labor are wasted, and the welding flux between the ceramic ring and the lead frame is repeatedly heated and cooled to easily cause mechanical fatigue.

In the one-time welding method, a heat sinking block, a ceramic ring and a lead frame are sequentially arranged in a brazing positioning device from bottom to top, welding materials are arranged at the welding positions between the heat sinking block and the ceramic ring and between the ceramic ring and the lead frame, and the brazing positioning device is placed in a chain furnace for brazing and forming. Therefore, the brazing forming can be realized only through one-time chain furnace, the time and the labor are saved, and the mechanical fatigue caused by repeated heating and cooling can be avoided. However, the brazing positioning device used in the existing one-time welding method has low positioning accuracy, and individual components in the ceramic package can shift during the brazing process, so that a cold joint or a solder overflows to a core area, and the quality of a finished product is affected.

To the problem that exists among the above-mentioned correlation technique, this application embodiment provides a positioner that brazes that positioning accuracy is high, can avoid each part in the ceramic tube shell to take place to shift in the brazing process to guarantee finished product quality.

FIG. 1 is a schematic view of a brazing positioning apparatus according to an embodiment of the present application; fig. 2 shows a schematic structural view of a ceramic envelope; fig. 3 shows a schematic view of a ceramic envelope disposed in the brazing positioning device of fig. 1.

In some embodiments, referring to fig. 1 to 3, the present application provides a soldering positioning apparatus 10 for positioning a lead frame 21, a ceramic ring 22 and a heat sink 23 of a ceramic package 20 during a soldering process, wherein the lead frame 21 includes a frame body 211 and a plurality of fins 212 connected to an inner side of the frame body 211. The brazing positioning device 10 includes a base plate 11, a first boss 12 and a plurality of second bosses 13. The bottom plate 11 is provided with a receiving groove 111 for receiving the ceramic package 20, and the side wall of the receiving groove 111 is provided with two first positioning surfaces 112 for positioning and matching with the two sides of the frame body 211 of the lead frame 21 along the first direction (x direction in the figure) and two second positioning surfaces 113 for positioning and matching with the two sides of the frame body 211 along the second direction (y direction in the figure). The first boss 12 is disposed at the bottom of the receiving groove 111, and the first boss 12 is used for positioning and matching with the inner hole of the ceramic ring 22. The plurality of second bosses 13 are disposed at the bottom of the accommodating groove 111, and the second bosses 13 are provided with two third positioning surfaces 131 for positioning and matching with the two sides of the heat sink block 23 along the first direction, and two fourth positioning surfaces 132 for positioning and matching with the two sides of the heat sink block 23 along the second direction. All the second bosses 13 are arranged on the peripheral side of the first bosses 12 at intervals so as to be spaced apart from the plurality of fins 212 of the lead frame 21. The first direction and the second direction are perpendicular to each other.

In particular, during the use of the ceramic package 20 after the soldering is completed, referring to fig. 2, the lead frame 21, the ceramic ring 22 and the heat sink block 23 are stacked from top to bottom along the gravity direction (z direction in the drawing), that is, the ceramic ring 22 is located on top of the heat sink block 23, the lead frame 21 is located on top of the ceramic ring 22, and the core area 24 formed by the heat sink block 23 and the ceramic ring 22 is opened upward. When the ceramic package 20 is disposed in the soldering positioning apparatus 10, referring to fig. 3, the lead frame 21, the ceramic ring 22 and the heat sink block 23 are stacked from bottom to top along the gravity direction, that is, the ceramic ring 22 is located on the top of the lead frame 21, the heat sink block 23 is located on the top of the ceramic ring 22, and the core area 24 formed by the heat sink block 23 and the ceramic ring 22 is open downward. Optionally, the first direction, the second direction and the direction of gravity are perpendicular to each other.

The operation of placing the ceramic envelope 20 in the brazing positioning device 10 is as follows: the lead frame 21 is disposed at the bottom of the receiving groove 111, the frame body 211 of the lead frame 21 is positioned in the first direction and the second direction by the first positioning surface 112 and the second positioning surface 113 on the side wall of the receiving groove 111, and the plurality of second bosses 13 disposed at intervals can be away from the fins 212 of the lead frame 21. Solder is provided at the solder joint between the lead frame 21 and the ceramic ring 22, the ceramic ring 22 is provided on the top of the fin 212 of the lead frame 21, and the inner hole of the ceramic ring 22 is fitted outside the first boss 12 to position the ceramic ring 22 in the first direction and the second direction. Solder is provided at the solder joint between the ceramic ring 22 and the heat sink block 23, the heat sink block 23 is provided on the top of the ceramic ring 22, and the heat sink block 23 is positioned in the first direction and the second direction by the third positioning surface 131 and the fourth positioning surface 132 on the second boss 13. Thus, each part of the ceramic tube shell 20 is effectively positioned in the first direction and the second direction, and the phenomenon that the solder joint or the solder overflows to the core area 24 due to displacement in the brazing process is avoided, so that the quality of finished products is ensured.

In addition, when the ceramic package 20 is disposed in the brazing positioning device 10, the lead frame 21, the ceramic ring 22 and the heat sink block 23 are stacked from bottom to top along the direction of gravity, the heat sink block 23 with the largest weight is disposed at the topmost end, and during the melting process of the solder between the lead frame 21 and the ceramic ring 22 and the solder between the ceramic ring 22 and the heat sink block 23, the self-gravity of the heat sink block 23 helps to achieve the compaction of the weld joint, thereby helping to improve the quality of the weld joint and reduce the usage amount of the solder joint. The inner hole of the ceramic ring 22 is sleeved outside the first boss 12, that is, the first boss 12 is arranged in the core region 24, which helps to prevent the solder from overflowing to the core region 24, and further ensures the quality of the finished product.

In some embodiments, referring to fig. 1, the side wall of the receiving groove 111 is provided with two first positioning surfaces 112 facing each other along a first direction, the two first positioning surfaces 112 are respectively used for positioning and matching with two opposite sides of the frame body 211 of the lead frame 21 along the first direction, and the first positioning surfaces 112 are perpendicular to the first direction. The side wall of the receiving groove 111 is further provided with two second positioning surfaces 113 facing each other along the second direction, the two second positioning surfaces 113 are respectively used for positioning and matching with two sides of the frame body 211 of the lead frame 21 facing each other along the second direction, and the second positioning surfaces 113 are perpendicular to the second direction. Alternatively, the first positioning surface 112 may be configured as an integral surface or may be formed by a plurality of discrete surfaces coplanar with each other, which is not limited in the present application. The second positioning surface 113 is similar to the first positioning surface, and will not be described herein.

In the embodiment illustrated in fig. 1, and with reference to fig. 1-3, the first locating surface 112 is formed by a plurality of diverging surfaces that are coplanar with one another, with a first relief surface 114 formed between adjacent diverging surfaces. The second positioning surface 113 is formed of a plurality of diverging surfaces coplanar with each other, and a second escape surface 115 is formed between adjacent diverging surfaces. Referring to fig. 1 and 3, when the lead frame 21 is disposed at the bottom of the receiving groove 111, two opposite sides of the frame body 211 along the first direction are respectively in contact with the two first positioning surfaces 112 and spaced from the first avoiding surface 114, and two opposite sides of the frame body 211 along the second direction are respectively in contact with the two second positioning surfaces 113 and spaced from the second avoiding surface 115. In some manufacturing processes of the lead frame 21, such as a metal etching process, burrs are likely to remain on the outer side of the frame body 211 to cause local surface irregularities. The arrangement shown in fig. 1 can avoid the burrs outside the frame 211 by the first avoiding surface 114 and the second avoiding surface 115, and avoid the burrs from affecting the positioning of the lead frame 21 in the first direction and the second direction, so that the manufacturing requirement for the lead frame 21 can be reduced, and the manufacturing cost can be reduced.

In some embodiments, with reference to fig. 1, two third positioning surfaces 131 facing each other along the first direction are disposed on the second boss 13, the two third positioning surfaces 131 are respectively used for positioning and matching with two opposite sides of the heat sink block 23 along the first direction, and the third positioning surfaces 131 are perpendicular to the first direction. The second boss 13 is further provided with two fourth positioning surfaces 132 facing each other along the second direction, the two fourth positioning surfaces 132 are respectively used for positioning and matching with two sides of the heat sink block 23 facing each other along the second direction, and the fourth positioning surfaces 132 are perpendicular to the second direction. Alternatively, the third positioning surface 131 may be configured as an integral surface formed on one of the second bosses 13, or may be formed by a plurality of dispersion surfaces coplanar with each other, and each dispersion surface is formed on a plurality of second bosses 13, which is not limited in this application. The fourth positioning surface 132 is similar to the first positioning surface, and will not be described herein.

In some embodiments, the second boss 13 includes an angular positioning boss 13a, and the angular positioning boss 13a is formed with a third positioning surface 131 and a fourth positioning surface 132 perpendicular to each other. When the heat sink block 23 is disposed on the top of the positioned ceramic ring 22, the corner positioning bosses 13a can be clamped at the outer corners of the heat sink block 23, so that one side of the heat sink block 23 in the first direction and one side of the heat sink block 23 in the second direction are both positioned. The number and the relative position relationship of the angular positioning bosses 13a can be set according to actual needs, which is not limited in the present application.

In some embodiments, the second boss 13 includes an edge positioning boss 13b, and the edge positioning boss 13b has a third positioning surface 131 or a fourth positioning surface 132 formed thereon. When the heat sink block 23 is disposed on the top of the positioned ceramic ring 22, the side positioning boss 13b can abut against the outer side of the heat sink block 23, so that the heat sink block 23 is positioned on one side in the first direction or one side in the second direction. The number and the relative position relationship of the side positioning bosses 13b can be set according to actual needs, which is not limited in the present application.

In the embodiment shown in fig. 1, referring to fig. 1 to 3, the lead frame 21 includes a frame body 211 and a plurality of intermediate short fins 212a connected to two opposite sides of the frame body 211 in the first direction. The second boss 13 includes two angle positioning bosses 13a and two edge positioning bosses 13b, the two angle positioning bosses 13a are disposed on one side of the first boss 12 along the first direction, and the two angle positioning bosses 13a are disposed at intervals along the second direction. Two limit location bosss 13b set up in the opposite side of first boss 12 along the first direction, and two limit location bosss 13b set up along the second direction interval. The third positioning surface 131 perpendicular to the first direction is formed on the side positioning boss 13 b.

Thus, the two corner positioning bosses 13a can position one side of the heat sink block 23 in the first direction and two sides of the heat sink block 23 in the second direction, and the two side positioning bosses 13b can position the other side of the heat sink block 23 in the first direction, so that the heat sink blocks 23 can be completely positioned by the second bosses 13 in the first direction and the second direction. Meanwhile, the middle short fin 212a connected to one side of the frame body 211 along the first direction is located between the two corner positioning bosses 13a, and the middle short fin 212a connected to the other side of the frame body 211 along the first direction is located between the two side positioning bosses 13b, so as to achieve avoiding of the second bosses 13 and the fins 212.

FIG. 4 shows a schematic view of a brazing positioning device in another embodiment of the present application; FIG. 5 is a schematic view of the pressure plate of the brazing positioning device shown in FIG. 4.

In some embodiments, referring to fig. 4 and 5, the brazing positioning device 10 further includes a pressing plate 14, and the pressing plate 14 is used for pressing the heat sink block 23 when the ceramic shell 20 is disposed in the accommodating groove 111. In this way, during the melting process of the solder between the lead frame 21 and the ceramic ring 22 and the solder between the ceramic ring 22 and the heat sink block 23, the gravity of the heat sink block 23 and the pressure plate 14 jointly realize the compaction of the welding seam, thereby further improving the quality of the welding seam and reducing the consumption of the solder. Alternatively, the bottom plate 11 and the pressure plate 14 may be made of graphite.

In some embodiments, the pressure plate 14 is configured to be capable of interengaging with the base plate 11. In this way, in the conveying process of feeding the brazing positioning device 10 into the chain furnace or taking the brazing positioning device 10 out of the chain furnace, and in the process of brazing the brazing positioning device 10 in the chain furnace, the pressing plate 14 and the bottom plate 11 can be kept relatively fixed, so that the ceramic tube shell 20 arranged in the accommodating groove 111 is protected, and external interference is avoided. As an alternative embodiment, referring to fig. 1 and 5, the outer side of the bottom plate 11 is provided with a step structure, the pressing plate 14 is provided with a cavity matched with the step structure on the bottom plate 11, and when the step structure is arranged in the cavity, the pressing plate 14 and the bottom plate 11 are mutually clamped.

In some embodiments, the platen 14 is provided with suction lines (not shown). When the pressing plate 14 and the bottom plate 11 are engaged with each other, the air pumping pipeline is communicated with the accommodating groove 111, so that the accommodating groove 111 can pump negative pressure by means of the air pumping pipeline. When the receiving groove 111 is pumped with negative pressure, the inlet of the air pumping pipeline is communicated with the receiving groove 111, the outlet of the air pumping pipeline is communicated with the air pumping port of the negative pressure pumping device (not shown) outside the brazing positioning device 10, and the negative pressure pumping device is started to pump negative pressure into the receiving groove 111. Thus, the air pressure in the accommodating groove 111 is smaller than the external atmospheric pressure, a pressure difference is formed between the upper side and the lower side of the pressure plate 14, and the pressure plate 14 applies clamping force to the solder between the lead frame 21 and the ceramic ring 22 and the solder between the ceramic ring 22 and the heat sink block 23 under the action of the pressure difference, so that the solder is prevented from shifting in the conveying process of the brazing positioning device 10 sent into the chain furnace, and the quality of a finished product is ensured. Optionally, the brazing positioning device 10 further includes a connector 15 disposed on the pressure plate 14, and the pressure plate 14 is connected to the negative pressure pumping device by the connector 15, so that the outlet of the suction pipeline is communicated with the suction opening of the negative pressure pumping device.

In some embodiments, the platen 14 is provided with vent holes (not shown). When the pressing plate 14 and the bottom plate 11 are engaged with each other, the vent hole communicates with the accommodating groove 111, so that the air pressure in the accommodating groove 111 can be kept consistent with the external air pressure of the brazing positioning device 10. In the process of performing brazing molding on the brazing positioning device 10 in the chain furnace, the gas in the accommodating groove 111 is heated to expand, and part of the gas escapes to the outside of the brazing positioning device 10 due to volume expansion. After the brazing forming is finished, the gas in the accommodating groove 111 is cooled and contracted, and the gas outside the brazing positioning device 10 can be timely supplemented into the accommodating groove 111 through the vent hole, so that the air pressure in the accommodating groove 111 is consistent with the external atmospheric pressure, and an operator can conveniently separate the pressing plate 14 from the bottom plate 11 to take out the brazed ceramic tube shell 20.

In some embodiments, referring to FIG. 5, the brazing positioning device 10 further includes a third boss 16 disposed on a side of the pressure plate 14 adjacent to the base plate 11. The ceramic package 20 is disposed in the receiving groove 111, and when the pressing plate 14 and the bottom plate 11 are engaged with each other, the third protrusion 16 can press on the heat sink 23. It will be appreciated that when the platen 14 is configured to engage the base plate 11, the width and length of the platen 14 are generally close to the base plate 11, and the maximum contact area between the platen 14 and the heat sink block 23 is limited by the width and length of the heat sink block 23. Therefore, in order to improve the contact stability between the heat sink block 23 and the pressure plate 14, only the surface flatness of the third boss 16 needs to be improved, and the overall flatness of the pressure plate 14 on the side close to the bottom plate 11 does not need to be improved, which is helpful for reducing the processing difficulty of the brazing positioning device 10, thereby reducing the manufacturing cost.

In some embodiments, with continued reference to fig. 1 to 3, the soldering positioning apparatus 10 further includes a fourth boss 17, the fourth boss 17 is disposed at the bottom of the receiving slot 111, and the fourth boss 17 is configured to limit the position of the fin 212 when the lead frame 21 is disposed at the bottom of the receiving slot 111. In some manufacturing processes of the lead frame 21, such as a metal etching process, the fins 212 are easily warped relative to the frame. When the lead frame 21 is assembled with the bottom plate 11, the fin 212 with an excessively large position deviation due to the warping deformation interferes with the fourth boss 17, so that the lead frame 21 cannot be smoothly arranged at the bottom of the accommodating groove 111, and an operator can judge that the lead frame 21 does not meet the precision requirement and use the next lead frame 21 for assembly. Therefore, the lead frames 21 can be screened by the fourth bosses 17, and the lead frames 21 which do not meet the precision requirement are prevented from being applied to the ceramic tube shell 20, so that the quality of finished products is ensured. The structure, number, and position of the fourth bosses 17 need to be set according to the number and position of the fins 212 in the lead frame 21, which is not limited in the present application.

In the embodiment shown in fig. 1, referring to fig. 1 to 3, the lead frame 21 includes a frame body 211, and four middle short fins 212a and two hypotenuse long fins 212b connected to the inner side of the frame body 211, wherein two middle short fins 212a are connected to one side of the frame body 211 in the first direction, and the other two middle short fins 212a are connected to the other side of the frame body 211 in the first direction. The two diagonal long fins 212b are connected to one side of the frame body 211 in the first direction, and are located on both sides of the two intermediate short fins 212a connected to the one side in the second direction. The fourth boss 17 includes two middle bosses 17a and two oblique-side bosses 17b. One of the middle bosses 17a is disposed between the two corner positioning bosses 13a, the other middle boss 17a is disposed between the two side positioning bosses 13b, and the two oblique side bosses 17b are disposed on two opposite sides of the two side positioning bosses 13b along the second direction.

Thus, when the lead frame 21 is disposed at the bottom of the accommodating groove 111, the edge positioning boss 13b and the adjacent oblique edge boss 17b can limit the oblique long fin 212b, the edge positioning boss 13b and the adjacent middle boss 17a can limit the middle short fin 212a connected to one side of the frame body 211 along the first direction, the corner positioning boss 13a and the adjacent middle boss 17a can limit the middle short fin 212a connected to the other side of the frame body 211 along the first direction, so as to screen the lead frame 21 of the specification shown in fig. 2, and avoid the lead frame 21 which does not meet the precision requirement being applied to the ceramic package 20, thereby ensuring the quality of the finished product.

FIG. 6 is a schematic view showing a part of a brazing positioning device in still another embodiment of the present application; FIG. 7 shows a schematic view of a platen according to yet another embodiment of the present application; FIG. 8 is a schematic view showing the assembly of the base plate and the pressure plate according to still another embodiment of the present application.

It is understood that in some embodiments of the present application, referring to fig. 1 to 5, only one receiving groove 111 is provided on the bottom plate 11 of one brazing positioning device 10, and accordingly, only one lead frame 21, ceramic ring 22 and heat sink 23 of one ceramic package 20 can be positioned in each chain furnace. In other embodiments of the present application, referring to fig. 6, the bottom plate 11 is provided with a plurality of receiving grooves 111. The bottom of each receiving groove 111 is provided with a first boss 12 and a plurality of second bosses 13. Thus, a plurality of ceramic tube shells 20 can be positioned by feeding the chain furnace each time, so that the production efficiency is improved.

Furthermore, a plurality of third bosses 16 are disposed on a side of the pressing plate 14 close to the bottom plate 11, a plurality of ceramic tube cases 20 are disposed in the plurality of accommodating grooves 111 of the bottom plate 11, and when the pressing plate 14 and the bottom plate 11 are engaged with each other, each third boss 16 can press on the corresponding heat sink block 23. So, need not to improve the whole roughness that clamp plate 14 is close to bottom plate 11 one side, only need set up a plurality of third bosss 16 to guarantee the surface smoothness of each third boss 16, can improve the contact stability of heat sink 23 with clamp plate 14, guaranteed finished product quality when reducing manufacturing cost.

In some embodiments, referring to fig. 6 to 8, the bottom plate 11 is provided with a first chamfer 116, the pressing plate 14 is provided with a second chamfer 141, when the pressing plate 14 and the bottom plate 11 are engaged with each other, the first chamfer 116 corresponds to the second chamfer 141 in position, and the first chamfer 116 and the second chamfer 141 are different in size. In this way, after the brazing positioning device 10 is taken out of the chain furnace, the operator can separate the bottom plate 11 and the pressing plate 14 by applying a force to the bottom plate and the pressing plate by the first chamfer 116 and the second chamfer 141, thereby taking out the ceramic envelope 20 after the brazing is completed.

In summary, the brazing positioning device 10 provided by the embodiment of the present application includes a bottom plate 11, a first boss 12, a second boss 13, a pressing plate 14, a connector 15, a third boss 16, and a fourth boss 17. The bottom plate 11 is provided with a receiving groove 111 for receiving the ceramic case 20. The side wall of the receiving groove 111 can position the frame body 211 of the lead frame 21, the first bosses 12 can position the ceramic ring 22, the second bosses 13 can position the heat sink block 23, and the second bosses 13 arranged at intervals can be spaced from the fins 212 of the lead frame 21. The connector 15 is used to connect the pressure plate 14 to a negative pressure pumping device so that the pressure plate 14 can clamp the solder to prevent the solder from shifting during the transportation process. The third boss 16 is used for pressing and covering the heat sink block 23 when the pressure plate 14 and the bottom plate 11 are mutually clamped, so that the contact stability of the heat sink block 23 and the pressure plate 14 is ensured, and the manufacturing cost is reduced. The fourth boss 17 is used for limiting the fin 212 when the lead frame 21 is disposed at the bottom of the accommodating groove 111, so as to screen the lead frame 21, thereby ensuring the quality of a finished product. The brazing positioning device 10 can effectively position each component of the ceramic tube shell 20 in the first direction and the second direction, and avoid the phenomenon that the displacement is caused in the brazing process to cause the false welding or the solder to overflow to the core area 24, thereby ensuring the quality of finished products.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of this patent shall be subject to the appended claims.

Claims

1. The utility model provides a positioner that brazes for lead frame, ceramic ring and the heat sink piece to ceramic cartridge are fixed a position at the brazing in-process, the lead frame include the framework with connect in a plurality of fins of framework inboard, its characterized in that, positioner that brazes includes:

all the second bosses are arranged on the peripheral side of the first bosses at intervals so as to be away from the plurality of fins of the lead frame;

the first direction and the second direction are perpendicular to each other.

2. The brazing positioning device of claim 1, further comprising a pressure plate;

3. The brazing positioning device of claim 2, wherein the pressure plate is configured to be capable of inter-engaging with the base plate.

4. The brazing positioning device according to claim 3, wherein the pressure plate is provided with a suction line;

5. The brazing positioning device of claim 3, wherein the pressure plate is provided with a vent hole;

6. The brazing positioning device according to claim 3, further comprising a third boss disposed on a side of the pressure plate adjacent to the base plate;

7. The brazing positioning device according to any one of claims 1 to 6, further comprising a third boss arranged on one side of the pressure plate close to the base plate;

8. The brazing positioning device of any one of claims 1 to 6, further comprising a fourth boss;

9. The brazing positioning device of any one of claims 1 to 6, wherein the second boss comprises an angular positioning boss;

10. The brazing positioning device of any one of claims 1 to 6, wherein the second boss comprises an edge positioning boss;