CN115300983A - Electroplating effluent filter equipment that gives up admittedly - Google Patents

Abstract

The invention discloses an electroplating wastewater solid waste filtering device, which comprises a wastewater collecting pool and a wastewater overflow pool, wherein a first isolation net is arranged in the wastewater collecting pool, an opening is arranged at the side of the wastewater collecting pool below the first isolation net and can be communicated with the wastewater collecting pool and the wastewater overflow pool, a second isolation net is arranged at the opening, and a discharge pipe is also arranged in the wastewater overflow pool.

Description

A solid waste filter device for electroplating wastewater

technical field

The invention relates to a solid waste filtering device for electroplating wastewater.

Background technique

At present, the electroplating industry, whether it is ring line electroplating or driving arm electroplating, will generate a large amount of wastewater and contain a large amount of solid waste, such as: filter wastewater, filter cleaning wastewater, electroplating tank cleaning wastewater, electroplating line aisle wastewater and other cleaning wastewater and many more. The basic and commonly used waste discharge method directly discharges waste water into the company's internal waste water treatment center through underground ditch or pipelines, and then concentrates treatment. However, there are several problems in this way of sewage discharge: 1. Because the waste water contains solid waste of different sizes, there is a hidden danger of clogging the waste drainage ditch or pipeline, which is very serious; 2. Because the waste water and solid waste are not separated , which brings a lot of trouble to the company's internal wastewater treatment center and increases the treatment cost; 3. If the wastewater left in the underground ditch or pipeline has not been discharged for a long time, it may nourish mosquitoes or smelly gas, which will have a certain impact on the environment; 4. When the waste water is discharged, it needs to be washed with a large amount of clean water, resulting in a waste of water resources.

Contents of the invention

In order to solve the above technical problems, the object of the present invention is to provide a solid waste filtering device for electroplating wastewater.

The present invention is realized through the following technical solutions:

An electroplating waste water solid waste filtering device, comprising a waste water collection pool and a waste water overflow pool, a first isolation net is arranged in the waste water collection pool, and an opening is arranged on the side of the waste water collection pool below the first isolation net, and the opening can The waste water collection pool is connected with the waste water overflow pool, the second isolation net is arranged at the opening, and the waste water overflow pool is also provided with a discharge pipe.

In the embodiment of the present invention, it also includes a liquid level sensor and a first water pump that are matched and connected. The liquid level sensor is arranged in the waste water overflow tank, and the first water pump is connected with the discharge pipe.

In the embodiment of the present invention, a cover plate is also included, and the cover plate is arranged at the upper opening of the waste water overflow tank.

In the embodiment of the present invention, it also includes a matched clean water inlet pipe and a water inlet valve, and the water outlet end of the clean water inlet pipe can be connected with the waste water collection tank.

In the embodiment of the present invention, it also includes a matching electroplating tank and a filter, the filter is connected to the electroplating tank through the water inlet pipe and the outlet pipe, the filter is connected to the waste water collection tank through the sewage pipe, and the filter The filter core of the machine can be connected with the water outlet end of the clear water inlet pipe.

In the embodiment of the present invention, the water outlet end of the fresh water inlet pipe and the water outlet end of the sewage discharge pipe are located at the upper end of the first isolation net.

In the embodiment of the present invention, a water receiving tank is provided beside the electroplating tank, and a drain is provided at the bottom of the water receiving tank, and the drain is connected to a waste water collection tank.

In the embodiment of the present invention, the drain port is located above the opening.

In the embodiment of the present invention, the filter is arranged above the water receiving tank.

In the embodiment of the present invention, it also includes a connecting pipe that is mated and connected with the second water pump, one end of the connecting pipe is mated and connected with the electroplating tank, and the other end of the connecting pipe is mated and connected with the waste water collection tank.

An electroplating wastewater solid waste filtering device of the present invention has the following beneficial effects: the solid waste of electroplating wastewater is realized by using a wastewater collection pool, a wastewater overflow pool, two water pumps, two isolation nets with different apertures, a liquid level sensor, etc. Waste separation, avoiding the risk of underground ditch or pipeline blockage, avoiding environmental problems caused by liquid storage, reducing the burden on sewage treatment centers, and saving water resources, etc., not only reduce the burden on the enterprise's internal wastewater treatment centers, but also improve the environment on the electroplating tank.

Description of drawings

In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention , for those skilled in the art, other drawings can also be obtained based on these drawings without creative work.

Fig. 1 is a schematic diagram of the present invention.

Fig. 2 is a second schematic diagram of the present invention.

Fig. 3 is the third schematic diagram of the present invention.

Fig. 4 is a schematic diagram 4 of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "under" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

With reference to the accompanying drawings of the description, a solid waste filtration device for electroplating wastewater includes a wastewater collection tank 10 and a wastewater overflow tank 20. A first isolation net 31 is arranged in the wastewater collection tank. Preferably, a support is provided in the wastewater collection tank. Part 12, the first isolation net is received on the support member, and an opening 11 is arranged on the side of the waste water collection pool under the first isolation net, and the opening can communicate with the waste water collection pool and the waste water overflow pool, and the opening is provided with a second Two isolation nets 32, the waste water overflow tank is also provided with a discharge pipe 41. In use of the present invention, the waste water flows into the waste water collection tank, and first passes through the filtration of the first isolation net to filter the large particle solids, and then passes through The second isolation net is filtered again, and then flows into the wastewater overflow pool, in which the solid-liquid separation of the electroplating wastewater is realized, and finally the wastewater in the wastewater overflow pool is discharged to the sewage treatment center (not drawn in the figure ) for treatment, the discharge process can be carried out using normal water pumps.

Specifically: it also includes a liquid level sensor 42 and a first water pump 43 that are matched and connected. The liquid level sensor is arranged in the waste water overflow tank, and the first water pump is connected with the discharge pipe. When the water level of the flow pool is high (wastewater overflow pool near overflow), the liquid level sensor sends a signal to the controller (not drawn in the figure), and the controller will send an instruction to let the first water pump work to drain the waste water from overflowing. The waste water in the flow pool is discharged to the sewage treatment center.

Further, it also includes a cover plate 21, which is arranged at the upper opening of the waste water overflow tank, so as to prevent debris from falling into the waste water overflow tank. Preferably, the above-mentioned liquid level sensor is set at the cover plate .

Preferably, it also includes a matched clear water inlet pipe 51 and a water inlet valve 52, the outlet end of the clear water inlet pipe can be connected with the waste water collection tank, and the water inlet valve can control whether the clear water inlet pipe is discharged. During use, the filter includes pumps, filter elements and other components. When cleaning the filter element, the filter element can be disassembled from the filter, and then the filter element is connected with the clean water inlet pipe. The preferred filter element is tubular, and the hollow part is the water outlet. end, the outer periphery is the water inlet end, the filter element is set in the hollow part, and the clean water inlet pipe passes through the water. Through the principle of hair flushing, the solid particles attached to the surface of the filter element are washed out and fall into the waste water collection tank, and then the reinstalled filter element is installed. Go back to the filter.

Still further, it also includes a matching electroplating tank 61 and a filter 62, the filter is connected to the electroplating tank through a water inlet pipe 63 and an outlet pipe 64, and the filter is connected to a waste water collection tank through a sewage discharge pipe 65. The filter element of the filter can be connected with the water outlet end of the clean water inlet pipe, and the filter filters the water in the electrolytic cell through the water inlet end, and the filtered water flows back into the electrolytic cell through the outlet pipe, and the waste water flows through the sewage pipe. Wastewater collection tank for solid-liquid separation treatment. The water outlet end of the clean water inlet pipe and the water outlet end of the sewage pipe are located at the upper end of the first isolation net. In the present invention, all waste water that needs to be separated from solid and liquid when entering the waste water collection tank first passes through the first isolation net and then passes through the second isolation net. Two isolation nets filter, and the aperture of the first isolation net is greater than the aperture of the second isolation net simultaneously, preferably, the aperture of the first isolation net is: 6-10mm, preferably can be 6mm, 8mm, 10mm, the second isolation net The aperture of the net is: 0.8-1.5mm, preferably 0.8mm, 1mm, 1.2mm.

In use of the present invention, a water receiving tank 70 is arranged on the side of the electroplating tank. When the electroplating tank is in operation, waste water will splash out, and the splashed waste water will be caught by the water receiving tank, and a water outlet is provided at the bottom of the water receiving tank. 71. The outlet is connected to the waste water collection tank, and the waste water in the water receiving tank enters the waste water collection tank through the outlet flow channel for solid-liquid separation. The drain port is located above the opening.

With reference to the accompanying drawings in the specification, the filter is arranged above the water receiving tank.

In a preferred embodiment, the present invention also includes a connecting pipe 81 and a second water pump 82 that are matingly connected, one end of the connecting pipe is matingly connected to the electroplating tank, and the other end of the connecting pipe is matingly connected to the waste water collection tank, When it is necessary to clean the electroplating tank, all the wastewater (including solid impurities) in the electroplating tank is pumped into the wastewater collection tank through the connecting pipe and the second water pump for solid-liquid separation.

The invention utilizes waste water collection pool, waste water overflow pool, water pump, and isolation nets with different pore diameters for solid waste separation to realize the separation of solid waste from electroplating waste water, avoiding the risk of clogged ditch or pipeline blockage, avoiding environmental problems caused by liquid storage, Reduce the burden on the sewage treatment center, save water resources and so on. In the present invention, the pools containing waste water are all made of acid and alkali resistant materials to increase the service life of the pools; the overflow pools need to be equipped with cover plates to avoid falling of sundries.

In use of the present invention, the wastewater discharge of the filter and the wastewater discharge of the water receiving tank are directly connected to the wastewater collection tank without personnel intervention; the wastewater collection tank is equipped with a separate clean water inlet pipe, and the wastewater is also directly connected to the filter element when cleaning the filter element. After entering the pool, the waste liquid for cleaning the electroplating tank needs to be pumped into the waste water collection pool by using the second water pump alone; there is a first isolation net for filtering large particles of solid waste on the waste water collection pool, which can filter most of the solid waste; There is a second isolation net for filtering small particles of solid waste on the side, which can filter most of the remaining solid waste, and the remaining fine solid waste does not need to be taken into account; the waste water filtered by the two isolation nets directly overflows to the waste water overflow tank; when the waste water When the liquid level sensor of the overflow tank comes out, the controller starts, and the first water pump starts to operate, pumping the waste water separated from solid waste to the waste water treatment center; at the same time, the two isolation nets need to be cleaned regularly to keep the overflow smooth.

The foregoing description shows and describes preferred embodiments of the present invention, and as previously stated, it is to be understood that the present invention is not limited to the form disclosed herein and should not be construed as excluding other embodiments but may be applied to various other embodiments. Combinations, modifications and circumstances, and can be modified within the scope of the inventive concept described herein, by the above teachings or by skill or knowledge in the relevant field. However, changes and changes made by those skilled in the art do not depart from the spirit and scope of the present invention, and should all be within the protection scope of the appended claims of the present invention.

Claims (10)

1. An electroplating wastewater solid waste filtering device, comprising a waste water collection tank and a waste water overflow tank, characterized in that, the first isolation net is arranged in the waste water collection tank, and the waste water collection tank next to the first isolation net is arranged An opening, the opening can communicate with the waste water collection pool and the waste water overflow pool, the second isolation net is arranged at the opening, and the waste water overflow pool is also provided with a discharge pipe. 2. A solid waste filtering device for electroplating wastewater according to claim 1, further comprising a liquid level sensor and a first water pump that are matched and connected, the liquid level sensor is arranged in a waste water overflow pool, and the first water pump A water pump is cooperatively connected with the discharge pipe. 3 . The electroplating wastewater solid waste filtering device according to claim 2 , further comprising a cover plate, and the cover plate is arranged at the upper opening of the wastewater overflow pool. 4 . 4. A kind of solid waste filtering device for electroplating wastewater according to any one of claims 1-3, characterized in that, it also includes a matched clean water inlet pipe and a water inlet valve, and the water outlet end of the clean water inlet pipe can be connected with waste water The collection pool is mated to the connection. 5. A kind of electroplating waste water solid waste filtering device according to claim 4, is characterized in that, also comprises the electroplating tank and filter that match, and described filter is connected with electroplating tank through water inlet pipe, outlet pipe, and the The filter is connected with the waste water collection tank through the sewage pipe, and the filter element of the filter can be connected with the water outlet of the clean water inlet pipe. 6 . The solid waste filtering device for electroplating wastewater according to claim 5 , wherein the water outlet end of the clear water inlet pipe and the water outlet end of the sewage discharge pipe are located at the upper end of the first isolation net. 7 . 7. A kind of solid waste filtering device for electroplating wastewater according to claim 6, characterized in that, a water receiving tank is arranged beside the electroplating tank, and a water outlet is arranged at the bottom of the water receiving tank, and the water outlet is connected with the waste water collection The pool is connected. 8 . The solid waste filtering device for electroplating wastewater according to claim 7 , wherein the outlet is located above the opening. 9 . 9 . The electroplating wastewater solid waste filtering device according to claim 8 , wherein the filter is arranged above the water receiving tank. 10 . 10. A solid waste filtering device for electroplating wastewater according to claim 9, characterized in that it also includes a connecting pipe and a second water pump that are mated and connected, one end of the connecting pipe is mated and connected to the electroplating tank, and the connecting pipe The other end is connected with the waste water collection tank.

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