CN115291923A - Hot repair method, system, device and readable storage medium for application program - Google Patents
Hot repair method, system, device and readable storage medium for application program Download PDFInfo
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- CN115291923A CN115291923A CN202210934739.4A CN202210934739A CN115291923A CN 115291923 A CN115291923 A CN 115291923A CN 202210934739 A CN202210934739 A CN 202210934739A CN 115291923 A CN115291923 A CN 115291923A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/65—Updates
- G06F8/656—Updates while running
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/65—Updates
- G06F8/658—Incremental updates; Differential updates
Abstract
The application discloses a hot repair method, a hot repair system, a hot repair device and a readable storage medium of an application program. The hot repair method of the application program comprises the following steps: a terminal acquires a patch package of an application program to be repaired, wherein the patch package comprises a class file of a target application program subclass corresponding to the application program to be repaired; loading a class file of the subclass of the target application program by using a class loader; and registering the target application program subclass as an object corresponding to the class identifier corresponding to the application program to be repaired. By the scheme, a scene that the class to be repaired does not realize a certain declaration interface is avoided, and complexity of reference processing in various frameworks caused by subsequent calls to the repair logic or method is reduced.
Description
Technical Field
The present application relates to the field of computer technologies, and in particular, to a method, a system, a device, and a readable storage medium for hot-fix of an application.
Background
The problem of the online problem (bug) of the production environment is always a problem that system research and development and operation and maintenance personnel are very painful, some industries are sensitive to application, such as financial industry and game service, service supply can not be stopped for one month or longer, or versions cannot be reissued due to management and control, but who cannot guarantee that no problem exists in the online logic percentage, so that the bug needs to be repaired online without stopping the service, and the continuity and stability of the service are realized.
The existing technical ways for repairing bug on line in the industry mainly include two types: one is to use the java agent technology (a technology which is attached to java application program and can make relevant change to the byte code thereof), and to use the relevant api interface of the instrument to directly reload the classes to be repaired during the operation, the defect of the mode lies in that a non-existent dependent class can not be added, and the number of the realization interfaces, the types of the interfaces, the method access symbols, the number of the fields and the method signature of the repair class and the class to be repaired must be completely consistent; the other method is to reload the repair class of the original class, and the disadvantage of this method is that the class to be repaired and the repair class must be the implementation class of a certain declaration interface, otherwise, after reloading the repair class, the original class cannot receive the newly loaded repair class, because the JVM (Java virtual machine) considers that the classes before and after repair are not the same, when the repair method is called again, reflection and other methods are combined for processing, the implementation complexity in various frames is increased, and the situation that the class to be repaired does not implement a certain declaration interface is common in the existing engineering code.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a hot repair method, a hot repair system, a hot repair device and a readable storage medium for an application program, which can avoid a scenario that a class to be repaired does not implement a certain declaration interface, and reduce complexity of reference processing in various frameworks caused by subsequent calls to repair logic or methods.
In order to solve the above problem, a first aspect of the present application provides a method for hot repair of an application program, where the method for hot repair of an application program includes: the method comprises the steps that a terminal obtains a patch package of an application program to be repaired, wherein the patch package comprises a class file of a target application program subclass corresponding to the application program to be repaired; loading a class file of the subclass of the target application program by using a class loader; and registering the target application program subclass as an object corresponding to the class identifier corresponding to the application program to be repaired.
Wherein, the loading the class file of the subclass of the target application program by using the class loader comprises: and loading the class file of the subclass of the target application program into the JVM through the class loader.
Wherein the registering the target application subclass as the object corresponding to the class identifier corresponding to the application to be repaired includes: registering the target application program subclass to a spring container, and replacing an object corresponding to the class identifier corresponding to the application program to be repaired in the spring container with the target application program subclass.
The application program to be repaired is a Controller type or a Mapper type; the registering the target application program subclass to a spring container, and replacing an object corresponding to the class identifier corresponding to the application program to be repaired in the spring container with the target application program subclass includes: registering the target application subclass into a child container of the spring container; and replacing the object corresponding to the class identifier corresponding to the application program to be repaired in the child container with the target application program child class.
Wherein, the application program to be repaired is a Controller type; replacing the object corresponding to the class identifier corresponding to the application to be repaired in the child container with the target application subclass includes: and registering the target application program subclass in RequestMapingInfoHandlerMapping, wherein the RequestMapingInfoHandlerMapping records the mapping relation between the target application program subclass and the class identifier corresponding to the application program to be repaired.
The application program to be repaired is a Mapper type; replacing the object corresponding to the class identifier corresponding to the application to be repaired in the child container with the target application subclass includes: and registering the target application program subclass in Configuration, wherein the Configuration records the mapping relation between the target application program subclass and the class identifier corresponding to the application program to be repaired.
In order to solve the above problem, a second aspect of the present application provides a thermal repair system for an application program, where the thermal repair system for the application program includes a plurality of terminals and a distributed repair platform connected to each of the terminals; the distributed repairing platform is used for acquiring class files of target application program subclasses corresponding to the application programs to be repaired and distributing the class files of the target application program subclasses to each terminal; the terminal is configured to obtain a class file of the subclass of the target application program, and perform thermal repair on the application program to be repaired by using the thermal repair method for the application program of the first aspect.
The distributed repair platform comprises a file acquisition unit, a safety check unit, a storage unit and a communication circuit which are connected with one another; the file acquisition unit is used for automatically pulling the class file of the target application program subclass corresponding to the application program to be repaired according to the class identifier of the application program to be repaired; the safety checking unit is used for checking a safety mechanism of the class file of the subclass of the target application program; the storage unit is used for storing the class file of the target application program subclass after the safety mechanism passes the verification; the communication circuit is used for distributing the class files of the target application subclasses to each terminal.
To solve the above problem, a third aspect of the present application provides an electronic device, which includes a processor and a memory connected to each other; the memory is configured to store program instructions, and the processor is configured to execute the program instructions to implement the thermal remediation method for the application program of the first aspect.
To solve the above problem, a fourth aspect of the present application provides a computer-readable storage medium having stored thereon program instructions that, when executed by a processor, implement the thermal remediation method for the application program of the first aspect.
The invention has the beneficial effects that: different from the situation in the prior art, in the application program hot repair method, the terminal obtains the patch package of the application program to be repaired, the patch package includes the class file of the target application program subclass corresponding to the application program to be repaired, then the class loader is used for loading the class file of the target application program subclass, and the target application program subclass is registered as the object corresponding to the class identifier corresponding to the application program to be repaired. The class loader is used for loading the class file of the target application program subclass corresponding to the application program to be repaired, namely, the subclass of the class to be repaired is realized, so that the logic or the method to be repaired is adjusted on the subclass of the class to be repaired, and then the class file is loaded again.
Drawings
FIG. 1 is a flowchart illustrating an embodiment of a method for hot-fix of an application program according to the present application;
FIG. 2 is a block diagram of an embodiment of a hot repair system for an application of the present application;
FIG. 3 is a schematic diagram of an embodiment of a distributed repair platform in the thermal repair system of the application of FIG. 2;
FIG. 4 is a schematic view of a workflow of a thermal remediation system for an application in an application scenario of the present application;
FIG. 5 is a schematic structural diagram of an embodiment of an electronic device of the present application;
FIG. 6 is a schematic structural diagram of an embodiment of a computer-readable storage medium of the present application.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the drawings.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The terms "system" and "network" are often used interchangeably herein. The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
Referring to fig. 1, fig. 1 is a flowchart illustrating an embodiment of a hot repair method for an application program according to the present disclosure. The hot repair method for the application program in the embodiment includes the following steps:
step S11: the method comprises the steps that a terminal obtains a patch package of an application program to be repaired, wherein the patch package comprises class files of a target application program subclass corresponding to the application program to be repaired.
Specifically, the application to be repaired is installed in the terminal, and the terminal may be a mobile phone, a computer, or other electronic devices with a computing function. The terminal has a networking function, can receive the patch and repair the bug problem of the program through the patch.
Step S12: and loading the class file of the subclass of the target application program by using a class loader.
Step S13: and registering the target application program subclass as an object corresponding to the class identifier corresponding to the application program to be repaired.
In the existing scheme, when there is a problem with a method in a certain class, for example, there is a problem with class a, a developer first considers that a solution is to rewrite a class a and then replace the original class a, but this is problematic in that for the same class loader (class loader), once a class a is loaded by the start in the JVM, it is not allowed to load a class a again, that is, the same class loader cannot be reloaded; for this, two class loaders may be used, where one class loader loads the original a-class, then there is a repaired a-class, and another class loader loads the repaired a-class, but after loading out, when calling the repaired a-class, the reference of the repaired a-class needs to be taken, and when the reference of the repaired a-class is taken, the two a-classes are considered as two a-classes loaded by the two class loaders, and the two a-classes are different; that is to say, since the JAVA security mechanism considers that even though the same class is loaded between different class loaders, the classes loaded by the different class loaders cannot be considered as the same class, which means that the same class loaded by the different class loaders cannot be directly assigned or turned strongly, in the scheme of the present application, a class file of a target application subclass corresponding to an application to be repaired is generated and loaded, that is, a subclass of an a-class is generated and loaded with respect to a problematic a-class, so that the reference of the subclass of the a-class is taken when the subclass of the a-class is called, at this time, the subclass of the a-class and the subclass of the a-class can be considered as the same type, so that the repaired object can be accepted through the original class to be repaired as a bridge, and the call of the method of the repaired object can be conveniently completed.
According to the scheme, the class loader is used for loading the class file of the target application program subclass corresponding to the application program to be repaired, namely the subclass of the class to be repaired is realized, so that the logic or the method to be repaired is adjusted on the subclass of the class to be repaired, and then the class file is loaded again.
In an embodiment, the step S12 specifically includes: and loading the class file of the target application program subclass into the JVM through the class loader. Specifically, a class loader can load a class file of a subclass of a target application into the JVM, and then the JVM has such an object therein.
In an embodiment, the step S13 specifically includes: registering the target application program subclass to a spring container, and replacing an object corresponding to the class identifier corresponding to the application program to be repaired in the spring container with the target application program subclass.
Specifically, the method of the present application may be directed to a spring-type framework, where a container is located inside the spring-type framework, and each service or each function object is placed in the spring container after being initialized. For example, an application to be repaired is running an a object, one method of which has a problem, so a subclass of a, namely a b object, can be generated, and then the method with the problem can be repaired; then, during loading, the subclass of a may be loaded into the JVM, and then the object corresponding to the name identified by the object a is replaced with the newly loaded object b from the spring container, that is, the object corresponding to the class identifier corresponding to the application to be repaired in the spring container is replaced with the target application subclass.
Further, the application to be repaired is in a Controller class or a Mapper class. The step of registering the target application subclass in a spring container, and replacing the object corresponding to the class identifier corresponding to the application to be repaired in the spring container with the target application subclass may specifically include: registering the target application subclass into a child container of the spring container; and replacing the object corresponding to the class identifier corresponding to the application program to be repaired in the child container with the target application program child class. Specifically, the spring container at the uppermost layer has child containers, and for the controller layer frame or the Mapper layer frame, the controller layer object and the Mapper layer object are registered in the child containers, and for other common classes to be repaired, they are directly registered in the spring container at the uppermost layer.
When the application to be repaired is in the Controller class, the step of replacing the object corresponding to the class identifier corresponding to the application to be repaired in the sub-container with the target application subclass specifically includes: and registering the target application program subclass in RequestMapingInfoHandlerMapping, wherein the RequestMapingInfoHandlerMapping records the mapping relation between the target application program subclass and the class identifier corresponding to the application program to be repaired.
Specifically, when the application to be repaired is a Controller class, the Controller object is analyzed to obtain a url-Method object to the requestmappinginfohandler mapping for the Controller layer framework, the Controller object is a class to be repaired, the url-Method object is a subclass of the class to be repaired, the class identifier corresponding to the class to be repaired has a mapping relationship, all classes of the Controller layer are registered in the requestmappinginfohandler mapping, and therefore after the subclass of the class to be repaired is generated, the content of the registration table of the requestmappinginfohandler mapping can be updated, and the mapping relationship between the originally registered class to be repaired and the corresponding class identifier is registered as the mapping relationship between the subclass of the class to be repaired and the class identifier, so that the Controller object after being thermally repaired can be called according to the class identifier.
When the application program to be repaired is a Mapper class, the step of replacing the object corresponding to the class identifier corresponding to the application program to be repaired in the child container with the target application program subclass specifically includes: and registering the target application program subclass in Configuration, wherein the Configuration records the mapping relation between the target application program subclass and the class identifier corresponding to the application program to be repaired.
Specifically, when the application program to be repaired is a Mapper class, the Mybatis framework constructs a proxy object for the Mapper layer, and the method of calling the Mapper layer object each time actually obtains a corresponding mappedstatus object from Configuration, and based on this principle, updates registration information about the Mapper object to be repaired in Configuration, and registers a mapping relationship between the originally registered Mapper object to be repaired and a corresponding class identifier as a mapping relationship between a subclass of the class to be repaired and the class identifier, so that the Mapper object after thermal repair can be called according to the class identifier, and the purpose of thermal repair is achieved.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a thermal repair system of an application program according to the present application. The thermal repair system 20 of the application program in this embodiment includes a plurality of terminals 200 and a distributed repair platform 202 connected to each of the terminals 200; the distributed repair platform 202 is configured to obtain a class file of a target application subclass corresponding to an application to be repaired, and distribute the class file of the target application subclass to each terminal 200; the terminal 200 is configured to obtain a class file of the subclass of the target application program, and perform thermal repair on the application program to be repaired by using any one of the above thermal repair methods for the application program.
It can be understood that, after a production environment problem is found in the use process of the terminal 200, the bug can be repaired online, specifically, after the application program to be repaired is obtained, the class file of the target application program subclass corresponding to the application program to be repaired can be compiled online, and then the class file of the target application program subclass is placed on the distributed repair platform 202; then the distributed repair platform 202 pushes the class files of the compiled subclasses of the target application programs to all online terminals 200; after the terminal 200 acquires the class file of the subclass of the target application program, the application program to be repaired can be thermally repaired by using any one of the above-mentioned thermal repairing methods.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a distributed repair platform in the thermal repair system of the application program of fig. 2. In one embodiment, the distributed repair platform 202 includes a file acquisition unit 2021, a security verification unit 2022, a storage unit 2023, and a communication circuit 2024, which are connected to each other; the file acquiring unit 2021 is configured to automatically pull the class file of the target application subclass corresponding to the application to be repaired according to the class identifier of the application to be repaired; the security verification unit 2022 is configured to perform security mechanism verification on the class file of the target application subclass; the storage unit 2023 is configured to store the class file of the target application subclass after the security mechanism passes the verification; the communication circuit 2024 is configured to distribute class files of the subclasses of the target applications to each of the terminals 200.
Referring to fig. 2 to 4, fig. 4 is a schematic diagram of a workflow of a thermal repair system of an application program in an application scenario of the present application, specifically, after a production environment problem is found in a process of using a terminal 200, a developer has source codes on hand, and thus after determining an application program to be repaired, the source codes can be directly modified on line to repair bugs by means of recurrence and debugging, and then class files of target application program subclasses corresponding to the application program to be repaired are compiled; therefore, the file acquiring unit 2021 of the distributed repair platform 202 may automatically pull the class file of the subclass of the target application program according to the class identifier of the application program to be repaired, and the security verifying unit 2022 may perform security mechanism verification on the class file of the subclass of the target application program, and after the security mechanism verification is passed, the class file of the subclass of the target application program may be encrypted, compressed, and uploaded to the distributed repair platform 202; then, the distributed repair platform 202 may distribute the class file of the subclass of the target application program to each terminal 200 through the communication circuit 2024; after acquiring the class file of the target application subclass, the terminal 200 may execute any one of the above-mentioned hot repair methods for the application to be repaired by using the respective repair program hardware (hotfix) to perform hot repair on the application to be repaired. The hot repair system 20 of the application program of the present application has a wide range of components that can be repaired, for example, the method body and the method signature can be modified, and the method/class member attribute can be deleted and added; in addition, the system stability is good, compared with a java agent mode that the whole layer of the JVM is directly modified, the hot repair system 20 of the application program only affects the local range of repair, and the influence range is controllable when unknown problems occur; according to the application program thermal restoration method, the class to be restored is taken as the bridge, the restored subclass can directly call the restored method, the limitation condition of silent and open interfaces of the class to be restored is avoided, and the complexity of problems such as citation dependence is reduced; in addition, the application program thermal repair system 20 can automatically issue the repair code, and can add a security check mechanism to check the class file of the target application program subclass, so that the security problem caused by the thermal repair function can be avoided.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of an electronic device according to the present application. The electronic device 50 in the present embodiment includes a processor 502 and a memory 501 connected to each other; the memory 501 is used for storing program instructions, and the processor 502 is used for executing the program instructions stored in the memory 501 to implement the steps of any of the above-described embodiments of the thermal remediation method for an application. In one particular implementation scenario, electronic device 50 may include, but is not limited to: microcomputer, server.
In particular, the processor 502 is configured to control itself and the memory 501 to implement the steps of any of the above-described embodiments of the method for thermal remediation of an application program. Processor 502 may also be referred to as a CPU (Central Processing Unit). The processor 502 may be an integrated circuit chip having signal processing capabilities. The Processor 502 may also be a general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. Additionally, the processor 502 may be implemented collectively by an integrated circuit chip.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of a computer-readable storage medium according to the present application. The computer readable storage medium 60 of the present application has stored thereon program instructions 600, which program instructions 600, when executed by a processor, implement the steps in any of the above-described embodiments of the method for thermal remediation of an application program.
The computer-readable storage medium 60 may be a medium that can store the program instructions 600, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, or may be a server that stores the program instructions 600, and the server can send the stored program instructions 600 to other devices for operation, or can self-operate the stored program instructions 600.
In the several embodiments provided in the present application, it should be understood that the disclosed method, apparatus, and device may be implemented in other ways. For example, the above-described apparatus and device embodiments are merely illustrative, and for example, a division of a module or a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit may be implemented in the form of hardware, or may also be implemented in the form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application, which are essential or contributing to the prior art, or all or part of the technical solutions may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) or a processor (processor) to execute all or part of the steps of the methods of the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Claims (10)
1. A method for application program hot repair is characterized in that the method for application program hot repair comprises the following steps:
the method comprises the steps that a terminal obtains a patch package of an application program to be repaired, wherein the patch package comprises a class file of a target application program subclass corresponding to the application program to be repaired;
loading a class file of the subclass of the target application program by using a class loader;
and registering the target application program subclass as an object corresponding to the class identifier corresponding to the application program to be repaired.
2. The method according to claim 1, wherein the loading the class file of the subclass of the target application by using the class loader comprises:
and loading the class file of the target application program subclass into the JVM through the class loader.
3. The method according to claim 1, wherein the registering the target application subclass as the object corresponding to the class identifier corresponding to the application to be repaired includes:
and registering the target application program subclass to a spring container, and replacing an object corresponding to the class identifier corresponding to the application program to be repaired in the spring container with the target application program subclass.
4. The method for hot-fix of an application according to claim 3, wherein the application to be fixed is of a Controller class or a Mapper class;
the registering the target application program subclass to a spring container, and replacing an object corresponding to the class identifier corresponding to the application program to be repaired in the spring container with the target application program subclass includes:
registering the target application subclass into a child container of the spring container;
and replacing the object corresponding to the class identifier corresponding to the application program to be repaired in the child container with the target application program child class.
5. The method for hot-fix of an application according to claim 4, wherein the application to be fixed is of a Controller class; replacing the object corresponding to the class identifier corresponding to the application to be repaired in the child container with the target application subclass includes:
and registering the target application program subclass in RequestMapingInfoHandlerMapping, wherein the RequestMapingInfoHandlerMapping records the mapping relation between the target application program subclass and the class identifier corresponding to the application program to be repaired.
6. The method according to claim 4, wherein the application to be repaired is of Mapper class; replacing the object corresponding to the class identifier corresponding to the application program to be repaired in the child container with the target application program child class includes:
and registering the target application program subclass in Configuration, wherein the Configuration records the mapping relation between the target application program subclass and the class identifier corresponding to the application program to be repaired.
7. The system for the thermal restoration of the application program is characterized by comprising a plurality of terminals and a distributed restoration platform connected with each terminal;
the distributed repairing platform is used for acquiring class files of target application program subclasses corresponding to the application programs to be repaired and distributing the class files of the target application program subclasses to each terminal;
the terminal is configured to obtain a class file of the target application subclass, and perform a thermal repair on the application to be repaired by using the thermal repair method for the application according to any one of claims 1 to 6.
8. The system of claim 7, wherein the distributed repair platform comprises a file acquisition unit, a security check unit, a storage unit, and a communication circuit connected to each other;
the file acquisition unit is used for automatically pulling the class file of the target application program subclass corresponding to the application program to be repaired according to the class identifier of the application program to be repaired;
the safety checking unit is used for checking a safety mechanism of the class file of the subclass of the target application program;
the storage unit is used for storing the class files of the subclasses of the target application programs after the safety mechanism is verified;
the communication circuit is used for distributing class files of the subclasses of the target application programs to each terminal.
9. An electronic device, characterized in that the electronic device comprises a processor and a memory connected to each other;
the memory is for storing program instructions, and the processor is for executing the program instructions to implement a method of thermal remediation of an application program as claimed in any of claims 1-6.
10. A computer readable storage medium having stored thereon program instructions, which when executed by a processor implement the method of thermal remediation of an application program as claimed in any one of claims 1 to 6.
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| CN202210934739.4A CN115291923A (en) | 2022-08-04 | 2022-08-04 | Hot repair method, system, device and readable storage medium for application program |
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| CN202210934739.4A CN115291923A (en) | 2022-08-04 | 2022-08-04 | Hot repair method, system, device and readable storage medium for application program |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115617379A (en) * | 2022-12-19 | 2023-01-17 | 成都数默科技有限公司 | Java application vulnerability repairing method based on Java agent hot update |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115617379A (en) * | 2022-12-19 | 2023-01-17 | 成都数默科技有限公司 | Java application vulnerability repairing method based on Java agent hot update |
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