CN115289974B - Hole site measuring method, hole site measuring device, computer equipment and storage medium - Google Patents
Hole site measuring method, hole site measuring device, computer equipment and storage medium Download PDFInfo
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- CN115289974B CN115289974B CN202211224300.9A CN202211224300A CN115289974B CN 115289974 B CN115289974 B CN 115289974B CN 202211224300 A CN202211224300 A CN 202211224300A CN 115289974 B CN115289974 B CN 115289974B
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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Abstract
The application relates to a hole site measuring method, a hole site measuring device, a computer device and a storage medium, wherein the method comprises the following steps: acquiring a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of the target hole based on the hole position image; performing three-dimensional reconstruction based on prior information corresponding to a single-frame hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points; unifying corresponding three-dimensional data points under respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data; performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain three-dimensional hole site information of the target hole; through the method and the device, the problem that the accuracy of measurement needs to be improved through repeated measurement for many times is solved, and the accuracy of target hole measurement is improved without repeated measurement for many times by utilizing the multi-camera to perform multi-frame iterative fitting under a world coordinate system after three-dimensional reconstruction under respective camera coordinate systems.
Description
Technical Field
The present application relates to the field of three-dimensional scanning technologies, and in particular, to a hole location measurement method and apparatus, a computer device, and a storage medium.
Background
With the continuous development of sensor technology, three-dimensional scanning equipment is widely applied to the automobile and aerospace industries due to the advantages of high precision and high resolution. At present, three-dimensional scanning equipment scans and measures holes based on a visual principle; the three-dimensional scanning equipment needs to be operated to shoot hole site images from different positions, three-dimensional hole site points are obtained based on the overall reconstruction of the laser line, and then the three-dimensional hole site points of a single frame are fitted to obtain three-dimensional hole site information, so that the measurement result is unstable. Therefore, multiple repeated measurements are required to improve the accuracy of the measurement.
For the related art, an effective solution is not provided at present aiming at the problem that the measurement accuracy is improved by repeating the measurement for many times.
Disclosure of Invention
In the embodiment, a hole site measuring method, a hole site measuring device, a computer device and a storage medium are provided to solve the problem that in the related art, repeated measurement is needed for improving the accuracy of measurement.
In a first aspect, there is provided in this embodiment a method of pore site measurement, comprising:
acquiring a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of a target hole based on the hole site image;
performing three-dimensional reconstruction based on the prior information corresponding to the single-frame hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points;
unifying the corresponding three-dimensional data points under the coordinate systems of the cameras to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole.
In some of these embodiments, the determining prior information of the target hole based on the hole site image comprises:
performing feature recognition on the hole site image to obtain the prior information of the target hole;
the prior information comprises parameter information of the target hole, plane information of the target hole and type information of the target hole;
or, the prior information further comprises processing information of the target hole.
In some embodiments, the three-dimensional reconstruction based on the prior information corresponding to a single frame of the hole site image in the respective camera coordinate system to obtain the corresponding three-dimensional data point includes:
constructing a three-dimensional discrete point set according to the parameter information and the type information in the prior information; carrying out reprojection dimensionality reduction on the three-dimensional discrete point set to obtain a two-dimensional sampling point set;
and performing three-dimensional reconstruction on the two-dimensional sampling point set based on parameter information in the prior information to obtain corresponding three-dimensional data points.
In some embodiments, the three-dimensional reconstruction of the two-dimensional sampling point set based on the parameter information in the prior information to obtain a corresponding three-dimensional data point includes:
sampling interpolation is carried out on each sampling point in the two-dimensional sampling point set to obtain sub-pixel edge points;
screening the sub-pixel edge points based on preset angle constraints and preset distance constraints aiming at the sampling points to obtain target two-dimensional pixel points;
and performing three-dimensional reconstruction on the target two-dimensional pixel point based on the parameter information in the prior information to obtain a three-dimensional data point.
In some of these embodiments, the method further comprises:
after a two-dimensional sampling point set is obtained, projecting to an image plane corresponding to the plane information by using the optical center of the camera, and determining a central projection point and an optical center projection point;
setting an angle threshold value by taking the central projection point and the optical center projection point as references to form angle constraint;
and setting a reference distance threshold value by taking the optical center projection point and the sampling points corresponding to the two-dimensional sampling point set as a reference to form distance constraint.
In some embodiments, the performing sampling interpolation on each sampling point in the two-dimensional sampling point set to obtain a sub-pixel edge point includes:
sampling each sampling point in the two-dimensional sampling point set to obtain a sampling sequence;
and interpolating the sampling sequence to obtain sub-pixel edge points.
In some embodiments, the screening the sub-pixel edge points based on a preset angle constraint and a preset distance constraint for the sampling points to obtain a target two-dimensional pixel point includes:
carrying out distortion removal processing on the sub-pixel edge points;
and screening the sub-pixel edge points subjected to distortion removal processing based on preset angle constraint and preset distance constraint aiming at the sampling points, and screening out target two-dimensional pixel points which simultaneously meet the degree constraint and the distance constraint.
In some embodiments, the iteratively fitting the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole includes:
collecting the three-dimensional hole site data of a plurality of single frames to obtain the three-dimensional hole site data of a plurality of frames;
and carrying out iterative fitting on the three-dimensional hole site data of multiple frames by using an iterative fitting algorithm to obtain the three-dimensional hole site information of the target hole.
In a second aspect, there is provided in this embodiment a method of pore site measurement, the method comprising: a first scanning stage and a second scanning stage;
in the first scanning stage, acquiring a plurality of hole site images of target holes synchronously shot by at least two cameras; determining prior information of a target hole based on the hole site image;
in the second scanning stage, performing three-dimensional reconstruction based on the prior information corresponding to the single-frame hole site image in respective camera coordinate systems to obtain corresponding three-dimensional data points;
unifying the corresponding three-dimensional data points under the coordinate systems of the cameras to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole.
In a third aspect, there is provided in this embodiment a hole site measuring device, comprising: the device comprises a scanning module, a three-dimensional reconstruction module, a processing module and a fitting module;
the scanning module is used for synchronously acquiring hole site images of the target hole under respective camera coordinate systems based on at least two cameras; determining prior information of the target hole based on the hole site image;
the three-dimensional reconstruction module is used for performing three-dimensional reconstruction based on the prior information corresponding to the single-frame hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points;
the processing module is used for unifying the corresponding three-dimensional data points under the coordinate systems of the cameras to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and the fitting module is used for performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole.
In a fourth aspect, there is provided in this embodiment a handheld scanning device, comprising: a scanning device having at least two cameras;
the scanning device performs the steps of the hole site measurement method according to the first aspect and the second aspect.
In a fifth aspect, there is provided in this embodiment a tracking scan device, comprising: a scanning device and a tracking device having at least two cameras;
the scanning device is arranged in the field of view of the tracking device;
the scanning device performs the steps of the hole site measuring method according to the first and second aspects under the tracking of the tracking device.
In a sixth aspect, there is provided a computer device in this embodiment, comprising a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the hole location measuring method of the first and second aspects when executing the computer program.
In a seventh aspect, in the present embodiment, there is provided a storage medium having stored thereon a computer program which, when executed by a processor, implements the hole location measuring method according to the first and second aspects.
Compared with the related art, the hole site measuring method, the hole site measuring device, the computer equipment and the storage medium provided in the embodiment synchronously shoot a plurality of hole site images of a target hole by acquiring at least two cameras; determining prior information of the target hole based on the hole position image; carrying out three-dimensional reconstruction based on prior information corresponding to the single-frame hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points; unifying corresponding three-dimensional data points under respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data; carrying out iterative fitting on the three-dimensional hole site data of multiple frames to obtain three-dimensional hole site information of the target hole; the problem that the accuracy of measurement needs to be improved by repeated measurement for many times is solved, and the accuracy of target hole measurement is improved by utilizing the fact that multiple cameras are unified to a world coordinate system for multi-frame iterative fitting after three-dimensional reconstruction under respective camera coordinate systems, and repeated measurement for many times is not needed.
The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below to provide a more concise and understandable description of the application, and features, objects, and advantages of the application.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a block diagram of a hardware structure of a terminal device according to a hole location measurement method provided in an embodiment of the present application;
FIG. 2 is a flowchart of a hole site measurement method according to an embodiment of the present application;
FIG. 3 is a schematic diagram of angle constraints and distance constraints provided by an embodiment of the present application;
FIG. 4 is a schematic flow chart of a hole location measuring method according to a preferred embodiment of the present application;
FIG. 5 is a flowchart of a hole location measuring method according to another embodiment of the present application;
fig. 6 is a block diagram of a hole site measurement apparatus according to an embodiment of the present application.
Detailed Description
For a clearer understanding of the objects, aspects and advantages of the present application, reference is made to the following description and accompanying drawings.
Unless defined otherwise, technical or scientific terms referred to herein shall have the same general meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" and "an" and "the" and similar referents in the context of this application do not denote a limitation of quantity, either in the singular or the plural. The terms "comprises," "comprising," "has," "having," and any variations thereof, as referred to in this application, are intended to cover non-exclusive inclusions; for example, a process, method, and system, article, or apparatus that comprises a list of steps or modules (elements) is not limited to the listed steps or modules, but may include other steps or modules (elements) not listed or inherent to such process, method, article, or apparatus. Reference in this application to "connected," "coupled," and the like is not intended to be limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Reference to "a plurality" in this application means two or more. "and/or" describes an association relationship of associated objects, meaning that three relationships may exist, for example, "A and/or B" may mean: a exists alone, A and B exist simultaneously, and B exists alone. In general, the character "/" indicates a relationship in which the objects associated before and after are an "or". The terms "first," "second," "third," and the like in this application are used for distinguishing between similar items and not necessarily for describing a particular sequential or chronological order.
The method embodiments provided in the present embodiment may be executed in a terminal, a computer, or a similar computing device. For example, the method is executed on a terminal, and fig. 1 is a block diagram of a hardware structure of the terminal of the hole location measurement method according to the embodiment. As shown in fig. 1, the terminal may include one or more processors 102 (only one shown in fig. 1) and a memory 104 for storing data, wherein the processor 102 may include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA. The terminal may also include a transmission device 106 for communication functions and an input-output device 108. It will be understood by those of ordinary skill in the art that the structure shown in fig. 1 is merely an illustration and is not intended to limit the structure of the terminal described above. For example, the terminal may also include more or fewer components than shown in FIG. 1, or have a different configuration than shown in FIG. 1.
The memory 104 may be used to store a computer program, for example, a software program and a module of application software, such as a computer program corresponding to the hole location measuring method in the present embodiment, and the processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, so as to implement the method described above. The memory 104 may include high speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 can further include memory located remotely from the processor 102, which can be connected to the terminal over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The transmission device 106 is used to receive or transmit data via a network. The network described above includes a wireless network provided by a communication provider of the terminal. In one example, the transmission device 106 includes a Network adapter (NIC) that can be connected to other Network devices through a base station to communicate with the internet. In one example, the transmission device 106 may be a Radio Frequency (RF) module, which is used to communicate with the internet in a wireless manner.
In this embodiment, a hole site measuring method is provided, and fig. 2 is a flowchart of the hole site measuring method of this embodiment, as shown in fig. 2, the flowchart includes the following steps:
step S210, acquiring a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of the target hole based on the hole position image;
specifically, the number of the cameras is at least two, and each camera can shoot a plurality of hole site images of the target hole independently, but synchronous shooting needs to be realized. Such as: each camera can be controlled by the same processor to take a picture at the same time. A timer may be built in each camera, and the time of the timer may be synchronized to control each camera to photograph at the same time. In other embodiments, each hole site image may be time-stamped, and whether the hole site image is a hole site image captured synchronously is determined according to the time stamp, which is not illustrated for other implementation manners.
The prior information is determined based on the hole site image, which refers to the experience of the target hole and the information of the initial measurement obtained before the final accurate three-dimensional hole site information is obtained. Such as: the target hole may be scanned by a three-dimensional scanning device having at least two cameras to obtain a priori information of the target hole.
Step S220, performing three-dimensional reconstruction based on prior information corresponding to a single-frame hole position image under respective camera coordinate systems to obtain corresponding three-dimensional data points;
specifically, each camera has a respective camera coordinate system, which is established on the camera. Such as: for two cameras (camera a and camera B); the camera coordinate system of camera a may be: taking the center of the camera A as the origin of a coordinate system, and taking the direction of a camera lens pointing to an object as the Z-axis direction; taking the direction of the center of the camera A pointing to the center of the camera B as the X-axis direction; there is no limitation to the Y-axis direction. In other embodiments, the coordinate system origin and the respective axis directions for the camera coordinate system may not be limited.
For the hole site image obtained by each camera, the prior information corresponding to the hole site image can be three-dimensionally reconstructed frame by frame in respective camera coordinate systems to obtain corresponding three-dimensional data points. Furthermore, the prior information corresponding to the hole location image can be three-dimensionally reconstructed frame by using a monocular reconstruction algorithm, a neural network model and other modes, so that invalid data can be preliminarily filtered, and the precision of the three-dimensional data points can be improved.
Step S230, unifying corresponding three-dimensional data points under respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
specifically, the conversion relation among the cameras can be known through calibration; based on the conversion relation, corresponding three-dimensional data points in the coordinate systems of the cameras can be unified to the world coordinate system to be subjected to single-frame combination processing. That is to say: and combining three-dimensional data points corresponding to the hole site images of the frames corresponding to at least two cameras at the same time into a frame of three-dimensional hole site data under a world coordinate system.
The world coordinate system can be any specified coordinate system; further, the world coordinate system may also be the camera coordinate system of camera a.
Step S240, performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain three-dimensional hole site information of the target hole;
specifically, iterative fitting is performed on the three-dimensional hole site data of multiple frames by adopting a fitting algorithm, so that the three-dimensional hole site information of the target hole is obtained. Generally speaking, in iterative fitting, three-dimensional hole site information of a target hole can be obtained as long as termination conditions of the iterative fitting are met; therefore, the problem that multiple repeated measurements are needed in the related art to improve the accuracy of target hole measurement does not occur. The fitting algorithm includes, but is not limited to, a least square fitting algorithm, an L1 distance fitting algorithm, an interpolation algorithm, and the like, and the comparison is not limited.
In the related art, repeated measurement is needed for many times, three-dimensional scanning equipment is required to be operated to shoot hole site images from different positions in each measurement, three-dimensional hole site points are obtained based on the overall reconstruction of laser lines, then three-dimensional hole site points of a single frame are fitted to obtain three-dimensional hole site information, and the problems that the measurement result is unstable and the accuracy is improved due to the repeated measurement for many times exist.
The method comprises the steps of obtaining a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of the target hole based on the hole position image; invalid data can be preliminarily filtered to obtain reliable and accurate prior information; carrying out independent three-dimensional modeling on prior information corresponding to the hole site image of each frame under respective camera coordinate systems to obtain corresponding three-dimensional data points; and finally, unifying the three-dimensional hole site data of the single frame under a world coordinate system to obtain the three-dimensional hole site data of the single frame, and obtaining an accurate measurement result through one-time measurement, thereby solving the problem that the accuracy is improved by repeated measurement for many times in the related technology.
In some of these embodiments, determining prior information of the target hole based on the hole site image in step S210 includes the steps of:
and carrying out feature identification on the hole position image to obtain prior information of the target hole.
Specifically, the feature recognition includes feature recognition of a laser spot and feature recognition of a mark point, and prior information of the target hole is recognized from a hole site image of the target hole. The priori information comprises parameter information of the target hole, plane information of the target hole and type information of the target hole; or, the prior information also comprises the processing information of the target hole.
The type information of the target hole includes, but is not limited to, a round hole, a square hole, a kidney-shaped hole, and the like. Each type of target hole has corresponding parameter information; such as: the parameter information of the round hole can be a central coordinate, a normal direction, a radius, a sampling angle, sampling point number, sampling points and the like; the parameter information of the kidney-shaped hole may be a center coordinate, a normal direction, a long axis direction or a short axis direction, a width, a height, and the like, which are not examples herein.
The plane information of the target hole can obtain a point normal equation according to a point (a center coordinate, a sampling point, a coordinate on a radius, a coordinate on a long axis or a coordinate on a short axis and the like) in space and a normal direction, and then the point normal equation is converted into a general equation of a plane, so that the plane information can be obtained; no additional use of equipment for measurement is required. In other embodiments, the plane information may be directly specified by the user, without limitation.
The processing information of the target hole includes, but is not limited to, a processing direction (punching direction, boring direction), a thickness of a workpiece in which the target hole is located, a surface state, and the like. The luminous state in the surface state can represent whether the surface of the workpiece is subjected to powder spraying treatment or not.
In some embodiments, the three-dimensional reconstruction based on the prior information corresponding to the single-frame hole site image in the respective camera coordinate system in step S220 to obtain the corresponding three-dimensional data point includes the following steps:
step S221, a three-dimensional discrete point set is constructed according to parameter information and type information in the prior information; carrying out reprojection dimensionality reduction on the three-dimensional discrete point set to obtain a two-dimensional sampling point set;
step S222, performing three-dimensional reconstruction on the two-dimensional sampling point set based on the parameter information in the prior information to obtain a corresponding three-dimensional data point.
Specifically, a three-dimensional discrete point set is constructed according to parameter information and type information in prior information, and for different types of target holes, corresponding parameter information is selected according to the type information, and then the three-dimensional discrete point set is constructed according to the selected parameter information. Such as: for the round hole, the corresponding parameter information includes radius, sampling angle, sampling point and the like; and combining the sampling points on the radius into a three-dimensional discrete point set according to sampling angles. For other types of target holes, a similar approach is used to construct a three-dimensional discrete point set, which is not exemplified here.
Determining a conversion matrix by camera internal parameters, and carrying out reprojection dimensionality reduction on the constructed three-dimensional discrete point set according to the conversion matrix to obtain a two-dimensional sampling point set; i.e. to reduce the three-dimensional points to two-dimensional points. If the type information is a round hole, the two-dimensional sampling point set is two-dimensional points which are distributed in a round shape; if the type information is a square hole, the two-dimensional sampling point set is two-dimensional points distributed in a square shape.
And finally, performing three-dimensional reconstruction on the two-dimensional sampling point set based on parameter information in the prior information to obtain corresponding three-dimensional data points.
In this embodiment, a three-dimensional discrete point set is converted into a two-dimensional sampling point set for processing, so that the processing difficulty is effectively reduced, the processing efficiency is improved, and then the two-dimensional sampling point set is converted into a three-dimensional data point; therefore, resource waste caused by directly taking the three-dimensional discrete point set as a data processing object is avoided.
The lens of a common camera has distortion, and the distortion of the camera is added in the process of re-projection dimensionality reduction. Such as: obtaining a two-dimensional sampling point set by utilizing a reprojection dimension reduction formula;
the expression of the reprojection dimension reduction formula is as follows:
in the formula (I), the compound is shown in the specification,
a two-dimensional sampling point set is obtained;
is a scale factor;
representing the camera's internal reference matrix as distortion;
representing a three-dimensional set of discrete points in a respective camera coordinate system.
In this embodiment, a direction may be specified for each two-dimensional sampling point in the two-dimensional sampling point set, which facilitates subsequent calculation. Generally, the designated sample points point to the center of the circle or point away from the center of the circle.
In some embodiments, the three-dimensional reconstruction of the two-dimensional sampling point set based on the parameter information in the prior information in step S222 to obtain the corresponding three-dimensional data point includes the following steps:
sampling interpolation is carried out on each sampling point in the two-dimensional sampling point set to obtain sub-pixel edge points;
screening the sub-pixel edge points based on preset angle constraints and preset distance constraints aiming at the sampling points to obtain target two-dimensional pixel points;
and performing three-dimensional reconstruction on the target two-dimensional pixel point based on the parameter information in the prior information to obtain a three-dimensional data point.
Firstly, sampling interpolation is carried out on each sampling point in the two-dimensional sampling point set according to a specified direction. Taking a round hole as an example, the following description is given: supposing that 8 sampling points are arranged, sampling points 1-8 (8 space points are sampled in a space circle, and after the 8 space points are subjected to reprojection dimension reduction, 8 two-dimensional sampling points are obtained), each sampling point in the two-dimensional sampling points is subjected to edge crossing sampling by taking the 8 two-dimensional sampling points as a reference and taking the direction of the pointing circle center of the sampling point as a specified direction, a sampling sequence crossing the edge is obtained, and then the sampling sequence is subjected to interpolation, so that sub-pixel edge points are obtained. The sub-pixel edge point is a line segment corresponding to each sampling point. If there are 8 sampling points, there are 8 sub-pixel edge points.
And then, based on preset angle constraints and preset distance constraints aiming at the sampling points, the sub-pixel edge points are screened to obtain effective target two-dimensional pixel points so as to improve the accuracy of the target two-dimensional pixel points.
Wherein the angle constraint is: projecting to an image plane corresponding to the plane information by using the optical center of the camera, and determining a central projection point and an optical center projection point; and setting an angle threshold value by taking the central projection point and the optical center projection point as references to form angle constraint. As shown in fig. 3, the fan-shaped area is the range of the angle constraint. The sampling points in this range are considered valid points, such as: sample points 7 and 8 are temporarily identified as valid and the remaining sample points are identified as invalid points.
Wherein the distance constraint is: and setting a reference distance threshold value by taking the optical center projection point and the sampling point corresponding to the two-dimensional sampling point set as a reference to form distance constraint. The reference distance threshold may be set according to the actual use case. As shown in fig. 3, if the distance from the optical center projection point to the sampling point 7 satisfies the reference distance threshold, the sampling point 7 is considered to be valid. If the distance from the optical center projection point to the sampling point 8 does not satisfy the reference distance threshold, the sampling point 8 is considered invalid.
Through the angle constraint and the distance constraint, only the sampling point 7 is effective for the hole site image of the frame finally; therefore, invalid data can be removed in a large quantity, the subsequent calculation efficiency is greatly improved, and the identification accuracy can be guaranteed.
And finally, performing three-dimensional reconstruction on the target two-dimensional pixel point based on the parameter information in the prior information to obtain a three-dimensional data point.
Wherein, the three-dimensional reconstruction can be monocular three-dimensional reconstruction; the specific process can be as follows:
step S51, creating a reference plane;
wherein, the reference plane can be obtained by selecting points around the target hole for fitting; plane information in the prior information can be directly selected to create a reference plane.
Step S52, projecting the target two-dimensional pixel points based on the reference plane to obtain the depth of each target two-dimensional pixel point and complete the three-dimensional reconstruction of the whole hole;
in step S221, performing reprojection dimensionality reduction on the three-dimensional discrete point set, and obtaining a first transformation matrix between the three-dimensional discrete point set and a plane; performing inverse transformation on the first conversion matrix to obtain a second conversion matrix from the target two-dimensional pixel point to the three-dimensional data point; and multiplying the target two-dimensional pixel point by the second conversion matrix to complete three-dimensional reconstruction.
It should be noted that, the distortion of the camera is added in the process of performing reprojection dimension reduction on the three-dimensional discrete point set to obtain the two-dimensional sampling point set, and then the distortion of the camera needs to be removed in the process of performing three-dimensional reconstruction on the two-dimensional sampling point set based on the parameter information in the prior information to obtain the corresponding three-dimensional data point.
In some embodiments, the method comprises the following steps of screening sub-pixel edge points based on preset angle constraints and preset distance constraints aiming at sampling points to obtain target two-dimensional pixel points:
carrying out distortion removal processing on the edge points of the sub-pixels;
and screening the sub-pixel edge points subjected to distortion removal processing based on preset angle constraints and preset distance constraints aiming at the sampling points, and screening out target two-dimensional pixel points meeting the angle constraints and the distance constraints simultaneously.
Specifically, the addition distortion and the removal distortion are inverse processes to each other, and are not repeated here.
It should be noted that after the data acquired by each camera is processed through the above steps, the three-dimensional hole site data of multiple frames of the cameras are collected and subjected to iterative fitting to obtain the three-dimensional hole site information of the target hole.
In some embodiments, the iteratively fitting the three-dimensional hole site data of multiple frames in step S240 to obtain the three-dimensional hole site information of the target hole includes the following steps:
step S241, collecting the three-dimensional hole site data of a plurality of single frames to obtain multi-frame three-dimensional hole site data;
and step S242, performing iterative fitting on the three-dimensional hole site data of multiple frames by using an iterative fitting algorithm to obtain the three-dimensional hole site information of the target hole.
In this embodiment, three-dimensional hole site data of n single frames are collected together to obtain three-dimensional hole site data of multiple frames; calling an iterative fitting algorithm, and performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain three-dimensional hole site information of the target hole; therefore, the optimal solution is quickly searched, and the efficiency of calculating the three-dimensional hole site information of the target hole is improved.
The present embodiment is described and illustrated below by means of preferred embodiments.
FIG. 4 is a schematic flow chart of the hole site measuring method according to the preferred embodiment.
Take two cameras as an example (left camera and right camera; left camera has a left camera coordinate system and right camera has a right camera coordinate system):
s51, coarse scanning is carried out, and prior information of the target hole is determined. Acquiring a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of the target hole based on the hole site image; the prior information comprises parameter information of the target hole, plane information of the target hole and type information of the target hole; or, the prior information also comprises the processing information of the target hole.
Under the left camera coordinate system, the following steps are performed:
s52, constructing a three-dimensional discrete point set according to parameter information and type information in the prior information;
s53, carrying out reprojection dimensionality reduction on the three-dimensional discrete point set, and adding distortion to obtain a two-dimensional sampling point set;
s54, sampling each sampling point in the two-dimensional sampling point set to obtain a sampling sequence; interpolating the sampling sequence to obtain sub-pixel edge points;
s55, distortion removal processing is carried out on the edge points of the sub-pixels; and screening the sub-pixel edge points subjected to distortion removal processing based on the preset angle constraint and the preset distance constraint aiming at the sampling points, and screening out target two-dimensional pixel points meeting the angle constraint and the distance constraint simultaneously.
And S56, performing monocular three-dimensional reconstruction on the target two-dimensional pixel point based on the parameter information in the prior information to obtain a three-dimensional data point under a left camera coordinate system.
Under the right camera coordinate system, the following steps are performed:
s57, constructing a three-dimensional discrete point set according to parameter information and type information in the prior information;
s58, carrying out reprojection dimensionality reduction on the three-dimensional discrete point set, and adding distortion to obtain a two-dimensional sampling point set;
s59, sampling each sampling point in the two-dimensional sampling point set to obtain a sampling sequence; interpolating the sampling sequence to obtain sub-pixel edge points;
s60, distortion removal processing is carried out on the sub-pixel edge points; and screening the sub-pixel edge points subjected to distortion removal processing based on the preset angle constraint and the preset distance constraint aiming at the sampling points, and screening out target two-dimensional pixel points meeting the angle constraint and the distance constraint simultaneously.
And S61, performing monocular three-dimensional reconstruction on the target two-dimensional pixel point based on parameter information in the prior information to obtain a three-dimensional data point under a right camera coordinate system.
After the steps are executed:
s62, unifying corresponding three-dimensional data points under respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and S63, carrying out iterative fitting on the three-dimensional hole site data of the n frames by using an iterative fitting algorithm to obtain the three-dimensional hole site information of the target hole.
According to the embodiment, the target hole is roughly scanned, the prior information of the target hole is determined, the target hole is precisely scanned in time according to the prior information of the target hole, the three-dimensional hole site information of the hole which is measured stably and accurately is obtained on the premise that the surface of a workpiece is not specially processed and the posture of measuring equipment is strictly required, and measurement of various types of holes is supported.
In the embodiment, a hole site measurement method is also provided. FIG. 5 is a flowchart of another hole site measurement method according to the present embodiment, and as shown in FIG. 5, the flowchart includes a first scanning stage and a second scanning stage; the method comprises the following specific steps:
step S610, in a first scanning stage, acquiring a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of the target hole based on the hole position image;
step S620, in the second scanning stage, three-dimensional reconstruction is carried out on the basis of prior information corresponding to a single-frame hole bit image under respective camera coordinate systems, and corresponding three-dimensional data points are obtained; unifying corresponding three-dimensional data points under respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data; and performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole.
In this embodiment, the whole hole site measurement method is mainly performed in two steps, which are a first scanning stage and a second scanning stage. The first scanning stage may be a coarse scanning stage, which may be considered to perform coarse scanning on a target hole on the workpiece to obtain prior information of the target hole; the second scanning stage may be a fine scanning stage, and it may be considered that the target hole on the workpiece is then subjected to fine scanning to obtain the three-dimensional hole location information of the target hole. An accurate measurement result can be obtained through one-time measurement, and the problem that the accuracy is improved due to repeated measurement in related technologies is solved.
In other embodiments, the specific step division may not be limited in the first and second scan phases. Such as: the steps S210 to S230 are the first scanning stage, and the step S240 is the second scanning stage.
It should be noted that the steps illustrated in the above-described flow diagrams or in the flow diagrams of the figures may be performed in a computer system, such as a set of computer-executable instructions, and that, although a logical order is illustrated in the flow diagrams, in some cases, the steps illustrated or described may be performed in an order different than here.
In this embodiment, a hole position measuring device is further provided, and the device is used to implement the above embodiments and preferred embodiments, which have already been described and will not be described again. The terms "module," "unit," "sub-unit," and the like as used below may implement a combination of software and/or hardware of predetermined functions. Although the means described in the embodiments below are preferably implemented in software, an implementation in hardware or a combination of software and hardware is also possible and contemplated.
FIG. 6 is a block diagram of the hole site measuring apparatus of the present embodiment, and as shown in FIG. 6, the apparatus includes: a scanning module 210, a three-dimensional reconstruction module 220, a processing module 230, and a fitting module 240;
a scanning module 210, configured to synchronously acquire hole site images of a target hole in respective camera coordinate systems based on at least two cameras; determining prior information of the target hole based on the hole position image;
the three-dimensional reconstruction module 220 is configured to perform three-dimensional reconstruction based on prior information corresponding to the single-frame hole bit image in each camera coordinate system to obtain a corresponding three-dimensional data point;
the processing module 230 is configured to unify corresponding three-dimensional data points in the respective camera coordinate systems to a world coordinate system for single-frame merging processing to obtain single-frame three-dimensional hole site data;
and the fitting module 240 is configured to perform iterative fitting on the three-dimensional hole site data of multiple frames to obtain three-dimensional hole site information of the target hole.
By the device, an accurate measurement result can be obtained through one-time measurement, and the problem that the accuracy is improved by repeated measurement in related technologies is solved.
In some embodiments, the scanning module 210 is further configured to perform feature identification on the hole location image to obtain prior information of the target hole;
the prior information comprises parameter information of the target hole, plane information of the target hole and type information of the target hole;
or, the prior information also comprises the processing information of the target hole.
In some embodiments, the three-dimensional reconstruction module 220 is further configured to construct a three-dimensional discrete point set according to the parameter information and the type information in the prior information; carrying out re-projection dimensionality reduction on the three-dimensional discrete point set to obtain a two-dimensional sampling point set;
and performing three-dimensional reconstruction on the two-dimensional sampling point set based on parameter information in the prior information to obtain corresponding three-dimensional data points.
In some embodiments, the three-dimensional reconstruction module 220 is further configured to perform sampling interpolation on each sampling point in the two-dimensional sampling point set to obtain a sub-pixel edge point;
screening the sub-pixel edge points based on preset angle constraints and preset distance constraints aiming at the sampling points to obtain target two-dimensional pixel points;
and performing three-dimensional reconstruction on the target two-dimensional pixel point based on the parameter information in the prior information to obtain a three-dimensional data point.
In some embodiments, on the basis of fig. 6, the method further includes a constraint module:
the constraint module is also used for projecting to an image plane corresponding to the plane information by using the optical center of the camera after obtaining the two-dimensional sampling point set, and determining a central projection point and an optical center projection point;
setting an angle threshold value by taking the central projection point and the optical center projection point as references to form angle constraint;
and setting a reference distance threshold value by taking the optical center projection point and the sampling point corresponding to the two-dimensional sampling point set as a reference to form distance constraint.
In some embodiments, the three-dimensional reconstruction module 220 is further configured to sample each sampling point in the two-dimensional sampling point set to obtain a sampling sequence;
and interpolating the sampling sequence to obtain sub-pixel edge points.
In some embodiments, the three-dimensional reconstruction module 220 is further configured to perform a distortion removal process on the sub-pixel edge points;
and screening the sub-pixel edge points subjected to distortion removal processing based on preset angle constraints and preset distance constraints aiming at the sampling points, and screening out target two-dimensional pixel points meeting the angle constraints and the distance constraints simultaneously.
In some embodiments, the fitting module 240 is further configured to aggregate the three-dimensional hole site data of multiple single frames to obtain three-dimensional hole site data of multiple frames;
and performing iterative fitting on the three-dimensional hole site data of multiple frames by using an iterative fitting algorithm to obtain the three-dimensional hole site information of the target hole.
In this embodiment, there is also provided an aperture position measuring apparatus, which includes a coarse scanning module and a fine scanning module;
the rough scanning module is used for acquiring a plurality of hole site images of the target hole synchronously shot by at least two cameras in a first scanning stage; determining prior information of the target hole based on the hole site image;
the fine scanning module is used for performing three-dimensional reconstruction based on prior information corresponding to the single-frame hole site image under respective camera coordinate systems in a second scanning stage to obtain corresponding three-dimensional data points;
unifying corresponding three-dimensional data points under respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole.
The above modules may be functional modules or program modules, and may be implemented by software or hardware. For a module implemented by hardware, the above modules may be located in the same processor; or the modules can be respectively positioned in different processors in any combination.
There is also provided in this embodiment a computer device comprising a memory having a computer program stored therein and a processor arranged to run the computer program to perform the steps of any of the method embodiments described above.
Optionally, the computer device may further include a transmission device and an input/output device, wherein the transmission device is connected to the processor, and the input/output device is connected to the processor.
Optionally, in this embodiment, the processor may be configured to execute the following steps by a computer program:
s1, acquiring a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of the target hole based on the hole position image;
s2, performing three-dimensional reconstruction based on prior information corresponding to the single-frame hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points;
s3, unifying corresponding three-dimensional data points under respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and S4, performing iterative fitting on the three-dimensional hole site data of the multiple frames to obtain the three-dimensional hole site information of the target hole.
It should be noted that, for specific examples in this embodiment, reference may be made to the examples described in the foregoing embodiment and optional implementation manners, and details are not described in this embodiment again.
In addition, in combination with the hole location measuring method provided in the foregoing embodiment, a storage medium may also be provided in this embodiment. The storage medium having stored thereon a computer program; the computer program, when executed by a processor, implements any of the hole site measurement methods in the above embodiments.
In this embodiment, there is also provided a handheld scanning device having a scanning apparatus with at least two cameras;
a scanning device for performing the steps of any of the above method embodiments.
It should be noted that, for specific examples in this embodiment, reference may be made to the examples described in the foregoing embodiments and optional implementations, and details are not described again in this embodiment.
There is also provided in this embodiment a tracking scanning device, including: a scanning device and a tracking device having at least two cameras;
the scanning device is arranged in the field of view of the tracking device;
and the scanning device executes the steps in any one of the method embodiments under the tracking of the tracking device.
It should be noted that, for specific examples in this embodiment, reference may be made to the examples described in the foregoing embodiments and optional implementations, and details are not described again in this embodiment.
It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to be limiting. All other embodiments, which can be derived by a person skilled in the art from the examples provided herein without inventive step, shall fall within the scope of protection of the present application.
It is obvious that the drawings are only examples or embodiments of the present application, and it is obvious to those skilled in the art that the present application can be applied to other similar cases according to the drawings without creative efforts. Moreover, it should be appreciated that such a development effort might be complex and lengthy, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, and is not intended to limit the present disclosure to the particular forms disclosed herein.
The term "embodiment" is used herein to mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is to be expressly or implicitly understood by one of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the patent protection. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (14)
1. A method of hole site measurement, comprising:
acquiring a plurality of hole site images of a target hole synchronously shot by at least two cameras; determining prior information of a target hole based on the hole site image; the prior information comprises parameter information of the target hole, plane information of the target hole and type information of the target hole;
under respective camera coordinate systems, performing three-dimensional reconstruction based on the prior information corresponding to the single-frame hole site image to obtain corresponding three-dimensional data points;
unifying the corresponding three-dimensional data points under the coordinate systems of the cameras to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and performing iterative fitting on the three-dimensional hole site data of the multiple frames to obtain the three-dimensional hole site information of the target hole.
2. A hole site measurement method according to claim 1, wherein said determining prior information of a target hole based on a hole site image comprises:
carrying out feature recognition on the hole site image to obtain the prior information of the target hole;
or, the prior information further comprises processing information of the target hole.
3. The hole site measurement method of claim 1, wherein the three-dimensional reconstruction based on the prior information corresponding to a single frame of the hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points comprises:
constructing a three-dimensional discrete point set according to the parameter information and the type information in the prior information; carrying out re-projection dimensionality reduction on the three-dimensional discrete point set to obtain a two-dimensional sampling point set;
and performing three-dimensional reconstruction on the two-dimensional sampling point set based on parameter information in the prior information to obtain corresponding three-dimensional data points.
4. A hole site measurement method according to claim 3, wherein said three-dimensionally reconstructing said two-dimensional sampling point set based on parameter information in said prior information to obtain a corresponding three-dimensional data point, comprises:
sampling interpolation is carried out on each sampling point in the two-dimensional sampling point set to obtain sub-pixel edge points;
screening the sub-pixel edge points based on preset angle constraints and preset distance constraints aiming at the sampling points to obtain target two-dimensional pixel points;
and performing three-dimensional reconstruction on the target two-dimensional pixel point based on the parameter information in the prior information to obtain a three-dimensional data point.
5. Hole site measurement method according to claim 3, characterized in that the method further comprises:
after a two-dimensional sampling point set is obtained, projecting to an image plane corresponding to the plane information by using the optical center of the camera, and determining a central projection point and an optical center projection point;
setting an angle threshold value by taking the central projection point and the optical center projection point as a reference to form angle constraint;
and setting a reference distance threshold value by taking the optical center projection point and the corresponding sampling point in the two-dimensional sampling point set as a reference to form distance constraint.
6. The hole site measurement method according to claim 4, wherein said performing sampling interpolation on each sample point in the two-dimensional sample point set to obtain a sub-pixel edge point comprises:
sampling each sampling point in the two-dimensional sampling point set to obtain a sampling sequence;
and interpolating the sampling sequence to obtain sub-pixel edge points.
7. The hole site measurement method according to claim 4, wherein said screening the sub-pixel edge points based on a preset angle constraint and a preset distance constraint for sampling points to obtain a target two-dimensional pixel point comprises:
carrying out distortion removal processing on the sub-pixel edge points;
and screening the sub-pixel edge points subjected to distortion removal processing based on preset angle constraint and preset distance constraint aiming at the sampling points, and screening out target two-dimensional pixel points which simultaneously meet the degree constraint and the distance constraint.
8. The hole site measurement method according to claim 1, wherein said iteratively fitting said three-dimensional hole site data of a plurality of frames to obtain three-dimensional hole site information of said target hole comprises:
collecting the three-dimensional hole site data of a plurality of single frames to obtain the three-dimensional hole site data of a plurality of frames;
and performing iterative fitting on the three-dimensional hole site data of multiple frames by using an iterative fitting algorithm to obtain the three-dimensional hole site information of the target hole.
9. A method of pore site measurement, the method comprising: a first scanning stage and a second scanning stage;
acquiring a plurality of hole site images of the target hole synchronously shot by at least two cameras in the first scanning stage; determining prior information of a target hole based on the hole site image; the prior information comprises parameter information of the target hole, plane information of the target hole and type information of the target hole;
in the second scanning stage, performing three-dimensional reconstruction based on the prior information corresponding to the single-frame hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points;
unifying the corresponding three-dimensional data points under the coordinate systems of the cameras to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole.
10. An aperture site measuring device, comprising: the device comprises a scanning module, a three-dimensional reconstruction module, a processing module and a fitting module;
the scanning module is used for synchronously acquiring hole site images of the target hole under respective camera coordinate systems based on at least two cameras; determining prior information of the target hole based on the hole position image; the prior information comprises parameter information of the target hole, plane information of the target hole and type information of the target hole;
the three-dimensional reconstruction module is used for performing three-dimensional reconstruction based on the prior information corresponding to the single-frame hole site image under respective camera coordinate systems to obtain corresponding three-dimensional data points;
the processing module is used for unifying the corresponding three-dimensional data points under the respective camera coordinate systems to a world coordinate system for single-frame combination processing to obtain single-frame three-dimensional hole site data;
and the fitting module is used for performing iterative fitting on the three-dimensional hole site data of multiple frames to obtain the three-dimensional hole site information of the target hole.
11. A handheld scanning device, comprising: a scanning device having at least two cameras;
the scanning apparatus, performing the steps of the hole site measurement method of any one of claims 1 to 9.
12. A tracking scanning device, comprising: a scanning device and a tracking device having at least two cameras;
the scanning device is arranged in the field of view of the tracking device;
the scanning device, under the tracking of the tracking device, performs the steps of the hole location measuring method of any one of claims 1 to 9.
13. A computer device comprising a memory and a processor, wherein the memory has stored therein a computer program, and wherein the processor is arranged to run the computer program to perform the steps of the hole location measurement method of any one of claims 1 to 9.
14. A computer readable storage medium having stored thereon a computer program, characterized in that the computer program, when being executed by a processor, is adapted to carry out the steps of the hole location measurement method of any of the claims 1 to 9.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108269279B (en) * | 2017-07-17 | 2019-11-08 | 先临三维科技股份有限公司 | Three-dimensional reconstruction method and device based on monocular 3 D scanning system |
| CN108986161B (en) * | 2018-06-19 | 2020-11-10 | 亮风台（上海）信息科技有限公司 | Three-dimensional space coordinate estimation method, device, terminal and storage medium |
| CN109341591A (en) * | 2018-11-12 | 2019-02-15 | 杭州思看科技有限公司 | A kind of edge detection method and system based on handheld three-dimensional scanner |
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| CN109919911B (en) * | 2019-01-26 | 2023-04-07 | 中国海洋大学 | Mobile three-dimensional reconstruction method based on multi-view photometric stereo |
| CN109949899B (en) * | 2019-02-28 | 2021-05-28 | 未艾医疗技术(深圳)有限公司 | Image three-dimensional measurement method, electronic device, storage medium, and program product |
| CN110345877B (en) * | 2019-07-03 | 2020-10-27 | 西安交通大学 | Method for measuring aperture and pitch of tube plate |
| CN112747692A (en) * | 2020-05-15 | 2021-05-04 | 奕目(上海)科技有限公司 | Three-dimensional measurement method and device for precise small hole |
| CN111678459B (en) * | 2020-06-09 | 2021-10-08 | 杭州思看科技有限公司 | Three-dimensional scanning method, three-dimensional scanning system, and computer-readable storage medium |
| CN112381921B (en) * | 2020-10-27 | 2024-07-12 | 新拓三维技术(深圳)有限公司 | Edge reconstruction method and system |
| CN112348958A (en) * | 2020-11-18 | 2021-02-09 | 北京沃东天骏信息技术有限公司 | Method, device and system for acquiring key frame image and three-dimensional reconstruction method |
| CN114119553B (en) * | 2021-11-28 | 2024-05-10 | 长春理工大学 | Binocular vision different-surface round hole detection method taking cross laser as reference |
| CN114638789A (en) * | 2022-03-01 | 2022-06-17 | 新拓三维技术(深圳)有限公司 | Method and system for hole site detection |
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