CN115287608A - Device and method for preparing S-shaped structure thermal barrier coating - Google Patents
Device and method for preparing S-shaped structure thermal barrier coating Download PDFInfo
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- CN115287608A CN115287608A CN202211027231.2A CN202211027231A CN115287608A CN 115287608 A CN115287608 A CN 115287608A CN 202211027231 A CN202211027231 A CN 202211027231A CN 115287608 A CN115287608 A CN 115287608A
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000012720 thermal barrier coating Substances 0.000 title claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 77
- 238000000576 coating method Methods 0.000 claims abstract description 53
- 239000011248 coating agent Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 238000000151 deposition Methods 0.000 claims abstract description 30
- 230000008020 evaporation Effects 0.000 claims abstract description 24
- 238000001704 evaporation Methods 0.000 claims abstract description 24
- 230000033001 locomotion Effects 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims abstract description 14
- 230000008021 deposition Effects 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000010894 electron beam technology Methods 0.000 claims description 13
- 229910010293 ceramic material Inorganic materials 0.000 claims description 7
- 238000005488 sandblasting Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 abstract description 8
- 239000000919 ceramic Substances 0.000 description 7
- 238000005422 blasting Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005328 electron beam physical vapour deposition Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000006004 Quartz sand Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
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Abstract
The invention relates to a device and a method for preparing a thermal barrier coating with an S-shaped structure, which comprises the following steps: arranging at least two crucibles with the substance to be evaporated in the chamber; arranging the treated substrate above the crucibles containing the evaporant, and enabling the substrate to be positioned between the adjacent crucibles; starting a movement mechanism to enable the base material to generate autorotation movement in the chamber; alternately controlling the evaporation state of the to-be-evaporated material in each crucible and the rotation direction of the base material, depositing a coating, and repeating the process for a plurality of times until the thickness of the coating meets the requirement; the invention is provided with two evaporation source deposition coatings at fixed positions, and realizes the preparation of the thermal barrier coating with the low-thermal-conductivity S-shaped structure by alternately controlling the evaporation time of each evaporation source.
Description
Technical Field
The invention belongs to the technical field of thermal barrier coatings of high-temperature components, is particularly suitable for the technical field of preparation of thermal barrier coatings of turbine blades of engines, and particularly relates to a device and a method for preparing a thermal barrier coating with an S-shaped structure.
Background
Thermal barrier coatings generally refer to thermal barrier coatings applied to a substrate surface that form a temperature gradient between the environment and the substrate. The main function is to protect the base body from being eroded by high-temperature fuel gas, thereby achieving the purposes of improving the working temperature of the base body and prolonging the working life. The thermal barrier coating prepared by the traditional electron beam physical vapor deposition technology is a columnar crystal structure, and the structure has high stress tolerance, so that the thermal shock resistance of the coating can be improved, and the coating can keep a long service life under thermal shock. The S-shaped structure thermal barrier coating is a coating structure corresponding to the traditional columnar crystal structure thermal barrier coating, and means that the growth direction of columnar crystals is periodically controlled in the growth process of the coating to form the S-shaped structure thermal barrier coating. The currently common method for preparing the thermal barrier coating with the S-shaped structure is to swing the base material in the process of depositing the coating, control the base material and an evaporation source to form a certain angle, and change the growth direction of the coating, so as to prepare the thermal barrier coating with the S-shaped structure.
The currently common method for preparing the thermal barrier coating with the S-shaped structure is to swing the base material in the process of depositing the coating, control the base material and an evaporation source to form a certain angle, change the growth direction of the coating and prepare the thermal barrier coating with the S-shaped structure. This approach can present two problems: 1) The transmission structure is complex, the manufacturing cost of the tool is increased, and the reliability at high temperature is not enough. 2) The base material is in a swinging state, the position of the space is not fixed, the requirement on a base material heating method is high, and the base material is not beneficial to uniformly heating. Therefore, a simple, low-cost and easy-to-implement method for preparing the S-shaped thermal barrier coating is needed.
Disclosure of Invention
The invention mainly aims at the problems and provides a device and a method for preparing a thermal barrier coating with an S-shaped structure, and aims to prepare the thermal barrier coating with the S-shaped structure by a simple, low-cost and easily-realized method.
In order to achieve the purpose, the invention provides a method for preparing a thermal barrier coating with an S-shaped structure, which comprises the following steps:
arranging at least two crucibles assembled with the substance to be evaporated in the chamber;
arranging the treated substrate above the crucibles containing the evaporant, and enabling the substrate to be positioned between the adjacent crucibles;
starting a movement mechanism to enable the base material to generate autorotation movement in the chamber;
and alternately controlling the evaporation state of the to-be-evaporated material in each crucible and the rotation direction of the base material, depositing the coating, and repeating the process for a plurality of times until the thickness of the coating meets the requirement.
Further, the step of disposing the treated substrate above the crucibles containing the evaporant, and positioning the substrate between adjacent crucibles further comprises:
the number of the crucibles filled with the material to be evaporated is two groups;
and enabling half of the distance between the centers of the two groups of crucibles to be not more than the vertical distance between the two groups of crucibles and the base material.
Further, the step of alternately controlling the evaporation state of the material to be evaporated and the rotation direction of the substrate in the crucible comprises:
bombarding one crucible by an electron gun to enable the electron beam current in the crucible to rise, converting the substance to be evaporated in the crucible from a melting state to an evaporation state, driving the substrate to rotate by a motion mechanism, and beginning to deposit a coating;
and after the coating deposition time T is started, reducing the electron beam current in the crucible to restore the to-be-evaporated object in the crucible to a molten state from the evaporation state, bombarding the other crucible by using an electron gun to raise the electron beam current in the crucible, converting the to-be-evaporated object in the crucible from the molten state to the evaporation state, changing the rotation direction of the base material by using a motion mechanism, and continuously depositing the coating.
Further, before the deposition of the coating, the method also comprises the step of heating the base material to enable the surface temperature of the base material to reach 900-1000 ℃.
Further, before the deposition of the coating, the method also comprises the step of heating at least two groups of crucibles containing the to-be-evaporated materials, so that the to-be-evaporated materials in the crucibles are heated to be in a molten state.
Further, before the deposition of the coating, the method also comprises the steps of closing a chamber door and vacuumizing the chamber.
Further, the substance to be evaporated in the crucible is one or more of ceramic materials.
Further, the step of treating the substrate comprises: and carrying out sand blasting treatment on the surface of the base material, and cleaning the surface of the base material.
In order to achieve the above object, the present invention further provides an apparatus for preparing a thermal barrier coating with an S-shaped structure, the apparatus comprising a chamber, wherein:
the crucible comprises at least two groups of crucibles, wherein the crucibles are used for placing the substances to be evaporated, and the substances to be evaporated are the same in material or different in material or the same in partial material;
a moving part for driving the substrate to rotate in the chamber;
at least two electron guns or one high-speed deflection electron gun for bombarding the crucible with the matter to be evaporated.
Further, a heating component for heating the substrate is arranged in the cavity.
The technical scheme of the invention has the following advantages: the geometrical relationship between the two crucibles and the base material is utilized to naturally form a coating deposition angle, and the S-shaped thermal barrier coating is deposited on the surface of the base material by alternately controlling the evaporation state of the ceramic material in the crucibles and the rotation direction of the base material. The scheme only relates to a simple geometric relation, does not use a complex transmission tool, is safe and reliable, does not increase the equipment cost, has the same motion form of the base material as the traditional process, has no special requirement on the heating mode of the base material, is favorable for the deposition quality of the coating, and has better performance of the obtained coating and lower process cost.
Drawings
FIG. 1 is a flow chart of a method for preparing a thermal barrier coating having an S-shaped structure according to the present invention.
FIG. 2 is a schematic structural view of a S-shaped thermal barrier coating according to the present invention.
FIG. 3 is a schematic top view of the thermal barrier coating with S-shaped structure according to the present invention.
FIG. 4 is a histogram of a scanning electron micrograph of a cross section of a coating prepared using the method.
Fig. 5 is a graph comparing thermal conductivity of an S-structured YSZ coating with a conventional structured YSZ coating.
In the figure: 1. an electron gun; 2. a, a crucible; 3. b, a crucible; 4. a substrate; 5. a moving part; 10. an electron beam.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Base material
As described above, some embodiments of the present invention provide a method of forming a thermal barrier coating or repairing a thermal barrier coating having a temperature gradient on a substrate. Any suitable substrate may be used, for example, a metal or metal alloy. In some cases, the substrate comprises steel, iron, copper. In one embodiment, the substrate is a high precision machined hot end component of an engine, such as an engine turbine blade.
Whether the coating is prepared or repaired on a substrate, the substrate may need to be previously cleaned and prepared. The surface of the substrate often contains a number of imperfections. It is therefore desirable to prepare clean surfaces by mechanical blasting (mechanical blasting) to remove imperfections such as oxides, scale, pits, tool marks, etc.
In one embodiment, the substrate surface may be prepared by grit blasting, e.g., such a surface may be prepared by mechanical grit blasting, by compressed air grit blasting, or the like. Conventional blasting agents such as copper ore, quartz sand, silicon carbide, iron sand, sea sand, etc. may be used. The spray material is sprayed onto the surface of the base material to be treated at high speed, so that the appearance or shape of the surface of the base material is changed.
Coating material (i.e. evaporant of the present application)
The coating material deposited onto the substrate surface to form the thermal barrier coating having a temperature gradient may be any suitable ceramic material. In some embodiments, the coating material comprises one or more of silica, alumina, sodium oxide, lithium oxide, zirconate, yttria stabilized zirconia, and the like.
Formation of thermal barrier coating
The substrate and the material to be evaporated can be heated by any method suitable for the purpose for which heating is desired. For example, in some embodiments, the substrate is heated by heating elements such as a heating tube, a furnace, an induction coil, or by an electron gun before being rotated; in one embodiment, the material to be evaporated can be brought into an evaporated state by an electron gun, and if necessary, the material to be evaporated can be heated in advance by the electron gun into a molten state before being brought into an evaporated state.
The technical solution of the present disclosure will be described below by taking the evaporant, the substrate and a method for preparing the S-shaped thermal barrier coating disclosed in the present application as examples, and it should be noted that the sequence of the following steps S100 to S400 is not limited to the order of the steps.
As shown in fig. 1, the present embodiment provides a method for preparing a thermal barrier coating with an S-shaped structure, which includes the following steps:
s100: arranging at least two crucibles with the substance to be evaporated in the chamber;
s200: arranging the treated substrate above the crucibles containing the evaporant, and enabling the substrate to be positioned between the adjacent crucibles;
s300: starting a movement mechanism to enable the base material to generate autorotation movement in the chamber;
s400: and alternately controlling the evaporation state of the to-be-evaporated material in each crucible and the rotation direction of the base material, depositing the coating, and repeating the process for a plurality of times until the thickness of the coating meets the requirement.
The method for preparing the thermal barrier coating with the S-shaped structure comprises the steps of crucible spacing, crucible-to-part distance, part surface treatment, part heating temperature, alternate control of an evaporation process and the like, and takes two groups of crucibles as an example, the method specifically comprises the following steps: the distance L between the centers of the two crucibles is 600 mm-900 mm; the vertical distance H between the crucible and the part is 300-450 mm; when the thermal barrier coating with the S-shaped structure is required to be prepared, half of the center distance L between the two crucibles is not more than the vertical distance H between the crucibles and the part, namely L/2 is not more than H.
And carrying out sand blasting treatment on the surface of the base material, cleaning the surface of the base material, fixing the base material on a rotary transmission rod, and conveying the base material to the upper part between the two crucibles. Heating the base material to 900-1000 deg.c.
The ceramic materials in the two crucibles are heated to a molten state by two electron guns respectively heating the materials to be evaporated, i.e., the ceramic materials (yttria stabilized zirconia (YSZ), zirconate, etc.) in the crucibles.
And (3) raising the electron beam current of one crucible to boil and evaporate the ceramic in the crucible, rotating the substrate at the rotation speed of 10-20 revolutions per minute, starting to deposit the coating, after depositing for 1-3 minutes, lowering the electron beam current of the crucible to restore the ceramic in the crucible to a molten state, rapidly raising the electron beam current of the other crucible to boil and evaporate the ceramic in the crucible, and simultaneously changing the rotation direction of the part at the rotation speed of 10-20 revolutions per minute, continuously depositing the coating, and depositing for 1-3 minutes. The above process is repeated several times until the coating thickness meets the requirements.
And after the deposition of the coating is finished, closing the electron gun, cooling the base material along with the furnace, taking out the base material when the temperature of the base material is reduced to be below 100 ℃, and obtaining the thermal barrier coating with the uniform S-shaped structure on the surface of the base material.
In the above described embodiment the two guns can be replaced by a single high speed deflectable gun.
Preferably, before the deposition of the coating, the method further comprises closing a chamber door and vacuumizing the chamber.
The preparation method of the embodiment has a simple structure, only relates to simple geometric relations, does not use complex transmission tools, is safe and reliable, and does not increase the equipment cost. The motion form of the base material is the same as that of the traditional process, the heating method of the base material is not changed, the thermal conductivity of the prepared coating is low, and the prepared coating is shown in figure 5, is a simple and effective preparation method of the thermal barrier coating with the S-shaped structure, and can be widely applied to preparation of thermal barrier coatings of hot end components of engines.
The evaporation material, the substrate and the apparatus for preparing a thermal barrier coating with an S-shaped structure disclosed in the present application will be described as examples.
According to an example of the present disclosure, an apparatus for preparing a thermal barrier coating having an S-shaped structure as shown in fig. 1-5 may include a chamber forming an entirety or a portion of an external appearance thereof, the chamber being provided with at least two sets of crucibles, moving members, at least two electron guns, or one high-speed deflectable electron gun, wherein at least two sets of crucibles are used for placing an evaporation object having the same material or different materials or partially the same material, and the moving members are used for driving a substrate to rotate in the chamber; at least two electron guns or one high-speed deflection electron gun for bombarding the crucible with the matter to be evaporated.
The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings:
referring to FIGS. 2 and 3, in this example, the distance L between the centers of the A crucible 2 and the B crucible 3 is 600mm, and the vertical distance H between the A crucible 2 and the B crucible 3 and the substrate is 350mm.
The surface of the base material 4 is subjected to sand blasting treatment, and after the surface of the base material 4 is cleaned, the base material 4 is fixed on a rotation transmission rod (i.e., a moving part 5) and is conveyed to the upper part between the two crucibles.
The substrate 4 is heated to a surface temperature of 900 ℃.
The ceramic material in both crucibles is heated to a molten state by heating the ceramic, which is the material to be evaporated, in the crucibles by means of the electron gun 1.
And (3) raising the electron beam 10 current of the crucible A2 to boil and evaporate the ceramic in the crucible A2, simultaneously rotating the substrate 4 anticlockwise at a rotation speed of 10 revolutions per minute, starting to deposit the coating, after depositing for 1 minute, lowering the electron beam 10 current of the crucible A2 to restore the ceramic in the crucible A2 to a melting state, rapidly raising the electron beam 10 current of the crucible B3 to boil and evaporate the ceramic in the crucible B3, simultaneously changing the rotation direction of the substrate 4 to a clockwise direction at a rotation speed of 10 revolutions per minute, continuously depositing the coating, and depositing for 1 minute. The above process was repeated 8 times to obtain a coating thickness of about 90 μm.
And after the deposition of the coating is finished, closing the electron gun 1, cooling the substrate 4 along with the furnace, taking out the substrate when the temperature of the substrate 4 is reduced to be below 100 ℃, and obtaining the S-shaped thermal barrier coating on the surface of the substrate 4, wherein the organization structure of the S-shaped thermal barrier coating is shown in figure 4.
Compared with the prior art, the preparation method has the advantages that the two evaporation source deposition coatings with the fixed positions are arranged, the evaporation time of each evaporation source is controlled alternately, the preparation of the thermal barrier coating with the low-thermal-conductivity S-shaped structure is realized, the tool structure is simpler, the preparation method can be realized on the traditional electron beam physical vapor deposition equipment, no special requirement is required on the heating mode of the base material, the deposition quality of the coating is facilitated, the performance of the obtained coating is better, and the process cost is lower.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A method for preparing a thermal barrier coating with an S-shaped structure is characterized by comprising the following steps:
arranging at least two crucibles with the substance to be evaporated in the chamber;
arranging the treated substrate above the crucibles containing the evaporant, and enabling the substrate to be positioned between the adjacent crucibles;
starting a movement mechanism to enable the base material to generate autorotation movement in the chamber;
and alternately controlling the evaporation state of the to-be-evaporated material in each crucible and the rotation direction of the base material, depositing the coating, and repeating the process for a plurality of times until the thickness of the coating meets the requirement.
2. The method of claim 1, wherein disposing the treated substrate over the crucibles containing the evaporant and positioning the substrate between adjacent crucibles further comprises:
the number of the crucibles filled with the material to be evaporated is two groups;
and enabling half of the distance between the centers of the two groups of crucibles to be not more than the vertical distance between the two groups of crucibles and the substrate.
3. The method of claim 1, wherein the step of alternately controlling the evaporation state of the material to be evaporated and the spin direction of the substrate comprises:
bombarding one crucible by an electron gun to enable the electron beam current in the crucible to rise, converting the substance to be evaporated in the crucible from a melting state to an evaporation state, driving the substrate to rotate by a motion mechanism, and beginning to deposit a coating;
and after the coating deposition time T is started, reducing the electron beam current in the crucible to restore the to-be-evaporated object in the crucible to a molten state from the evaporation state, bombarding the other crucible by using an electron gun to raise the electron beam current in the crucible, converting the to-be-evaporated object in the crucible from the molten state to the evaporation state, changing the rotation direction of the base material by using a motion mechanism, and continuously depositing the coating.
4. The method of claim 1, further comprising heating the substrate to a temperature of 900 to 1000 degrees Celsius prior to depositing the coating.
5. The method of claim 1, further comprising heating the at least two crucibles containing the material to be evaporated to melt the material to be evaporated prior to depositing the coating.
6. The method of claim 1, further comprising closing a chamber door and evacuating the chamber prior to depositing the coating.
7. The method of claim 1, wherein the material to be evaporated in the crucible is one or more of a ceramic material.
8. The method of claim 1, wherein the step of treating the substrate comprises: and carrying out sand blasting treatment on the surface of the base material, and cleaning the surface of the base material.
9. An apparatus for preparing a thermal barrier coating having an S-shaped configuration, the apparatus comprising a chamber, the chamber having disposed therein:
the crucible comprises at least two groups of crucibles, wherein the crucibles are used for placing objects to be evaporated, and the materials of the objects to be evaporated are the same or different or partially the same;
a moving part for driving the substrate to rotate in the chamber;
at least two electron guns or one high-speed deflection electron gun for bombarding the crucible with the matter to be evaporated.
10. The apparatus of claim 9, wherein a heating element is disposed within the chamber for heating the substrate.
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| CN104831240A (en) * | 2015-04-09 | 2015-08-12 | 北京航空航天大学 | Apparatus and method for preparing nano multilayer hard coating |
| CN110863179A (en) * | 2019-11-27 | 2020-03-06 | 中国航空制造技术研究院 | Electron beam physical vapor deposition method for uniformly depositing thermal barrier coating in large area |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104831240A (en) * | 2015-04-09 | 2015-08-12 | 北京航空航天大学 | Apparatus and method for preparing nano multilayer hard coating |
| CN110863179A (en) * | 2019-11-27 | 2020-03-06 | 中国航空制造技术研究院 | Electron beam physical vapor deposition method for uniformly depositing thermal barrier coating in large area |
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