CN115287031A - Temperature-resistant and aging-resistant epoxy resin and preparation method thereof - Google Patents
Temperature-resistant and aging-resistant epoxy resin and preparation method thereof Download PDFInfo
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- CN115287031A CN115287031A CN202211224467.5A CN202211224467A CN115287031A CN 115287031 A CN115287031 A CN 115287031A CN 202211224467 A CN202211224467 A CN 202211224467A CN 115287031 A CN115287031 A CN 115287031A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4092—Curing agents not provided for by the groups C08G59/42 - C08G59/66 titanium containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/64—Amino alcohols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/04—Polymer mixtures characterised by other features containing interpenetrating networks
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Abstract
The invention relates to the technical field of materials, in particular to a temperature-resistant and aging-resistant epoxy resin and a preparation method thereof. The temperature-resistant and aging-resistant epoxy resin comprises the following components in parts by mass: epoxy resin polymer, polyethylene glycol, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, phenylaminomethyltrimethoxysilane, isophorone diisocyanate, dibutyltin dilaurate, a curing agent, a diluent and aluminum powder. The epoxy resin adhesive prepared by the invention has excellent thermal stability, water resistance and water repellency, and simultaneously can give consideration to the strength and toughness of the epoxy resin.
Description
Technical Field
The invention relates to the technical field of adhesive materials, in particular to a temperature-resistant and aging-resistant epoxy resin and a preparation method thereof.
Background
The epoxy resin adhesive is a structural adhesive which is widely applied, and has high bonding strength and excellent chemical resistance. However, the common epoxy resin adhesive has poor thermal aging resistance and is not suitable for long-term use in environments with high temperature and strong light. The improvement of heat resistance of epoxy resins is generally achieved by incorporating heat-resistant structural units, such as phenyl groups, in the epoxy segment; increasing the crosslinking density of the system, such as by incorporating multifunctional epoxy resins. In addition, the heat-resistant performance of the epoxy resin can also be improved by adding a heat-resistant inorganic component or an inorganic filler.
However, with the demand of social development, people have more and more requirements on the performance and efficacy of epoxy resin, and therefore, the development of the epoxy resin with the effects of temperature resistance and aging resistance is a demand to be solved urgently at present.
Disclosure of Invention
In order to realize the purpose of preparing the temperature-resistant and aging-resistant epoxy resin, the invention provides the temperature-resistant and aging-resistant epoxy resin and a preparation method thereof; by adopting the technical scheme provided by the invention, the epoxy resin can be prepared and obtained, and the epoxy resin has excellent thermal stability, water resistance and water repellency and can simultaneously take the strength and toughness of the epoxy resin into consideration.
On one hand, the invention provides a temperature-resistant and aging-resistant epoxy resin, which comprises the following components in parts by mass: epoxy resin polymer, polyethylene glycol, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, phenylaminomethyltrimethoxysilane, isophorone diisocyanate, dibutyltin dilaurate, a curing agent, a diluent and aluminum powder.
Preferably, the epoxy resin of the present invention comprises: 100 parts of epoxy resin polymer, 1-3 parts of polyethylene glycol, 1-3 parts of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 1-3 parts of phenylaminomethyltrimethoxysilane, 10-15 parts of isophorone diisocyanate, 8-12 parts of dibutyltin dilaurate, 8-12 parts of curing agent, 15-20 parts of diluent and 2-5 parts of aluminum powder.
Preferably, the preparation method of the curing agent comprises the following steps: adding n-propanol into iminodiethanol, mixing, and then adding titanate TC-114 for reaction to obtain the curing agent.
Preferably, the preparation method of the curing agent comprises the following steps: adding n-propanol into iminodiethanol, stirring uniformly, adding titanate TC-114, heating to 85-92 ℃ to react for 50-200 min, and then removing n-propanol to obtain the curing agent.
Preferably, the preparation method of the curing agent comprises the following steps: adding n-propanol into iminodiethanol, starting stirring, stirring for 0.1-1 hour at the rotating speed of 500-2500 rpm, adding titanate TC-114, heating to 85-92 ℃, reacting for 50-200 min, and removing propanol to obtain the curing agent.
Preferably, the rotating speed is 500-2000 r/min, 800-2000 r/min, 1000-2000 r/min, 1500-2000 r/min and the like; the stirring time is 0.2-1 hour, 0.3-1 hour, 0.4-1 hour, 0.5-1 hour and 0.6-1 hour; the temperature rise is 86-91 ℃, 87-90 ℃, 88-90 ℃ and the like; the reaction time is 60-180 min, 80-180 min, 100-180min, 120-150min and the like.
Preferably, the ratio of iminodiethanol: the mass ratio of titanate TC-114 is (2-3): (1-2), (2.5-3): (1.5-2), (2-2.5): (1.5-2) or (2-3): (1.5-2).
Preferably, the mass ratio of the iminodiethanol, titanate TC-114 and n-propanol is 1: (5-10), 1: (6-9), 1: (5-8) or 1: (6-8).
Preferably, the epoxy resin polymer consists of epoxy resin E-51 and epoxy resin AG-80.
Preferably, the mass ratio of the epoxy resin E-51 to the epoxy resin AG-80 is (2-4): 1, (2.5-4): 1. (3-4): 1 or (2-3.5:): 1.
preferably, the polyethylene glycol is polyethylene glycol 400. The dosage of the polyethylene glycol is 1.5-3 parts, 1.5-2.5 parts, 1.5-2 parts, 2-3 parts and the like.
Preferably, the N- (2-aminoethyl) -3-aminopropyltrimethoxysilane is used in an amount of 1.5-3 parts, 1.5-2.5 parts, 1.5-2 parts, 2-3 parts and the like.
Preferably, the use amount of the phenylaminomethyltrimethoxysilane is 1.5-3 parts, 1.5-2.5 parts, 1.5-2 parts, 2-3 parts and the like.
Preferably, the mass ratio of the N- (2-aminoethyl) -3-aminopropyltrimethoxysilane to the phenylaminomethyltrimethoxysilane is (1-3): 1. (1.5-3): 1. (2-3): 1. (2.5-3): 1. (1-2.5): 1, etc.
Preferably, the amount of the isophorone diisocyanate is 8-15 parts, 8-13 parts, 9-15 parts, 10-12 parts and the like.
Preferably, the dibutyltin dilaurate is used in an amount of 9-12 parts, 10-12 parts, 8-10 parts, 10-12 parts, or the like.
Preferably, the curing agent is used in an amount of 8.5-11.5 parts, 9-11 parts, 10-12 parts, etc.
Preferably, the diluent is used in an amount of 16-20 parts, 17-20 parts, 18-20 parts, 15-18 parts, 16-18 parts, or the like. The diluent is at least one of toluene, xylene, acetone, butanone and ethyl acetate.
Preferably, the aluminum powder is used in an amount of 2-4.5 parts, 2-4 parts, 2-3.5 parts, 2-3 parts, 3-5 parts, 4-5 parts. Further preferably, the particle size of the aluminum powder is 0.01-50 microns, 0.01-30 microns, 0.05-10 microns, 0.05-1 micron or the like.
In another aspect. The invention provides a preparation method of the epoxy resin, which comprises the following steps: (1) Mixing polyethylene glycol, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and phenylaminomethyltrimethoxysilane, and stirring uniformly; (2) Heating the mixture obtained in the step (1), and then adding isophorone diisocyanate to react to obtain a reactant A; (3) Heating the reactant A, adding an epoxy resin polymer, dibutyltin dilaurate and a diluent for reaction, and obtaining a reactant product B after the reaction is finished; (4) And adding a curing agent into the reactant B, stirring and mixing to obtain the temperature-resistant and aging-resistant epoxy resin.
Preferably, the stirring speed in the step (1) is 500-2000 r/min, 800-2000 r/min, 1000-2000 r/min, 1500-2000 r/min and the like; the stirring time is 0.2-1 hour, 0.3-1 hour, 0.4-1 hour, 0.5-1 hour and 0.6-1 hour.
Preferably, the temperature rise in the step (2) is 70-80 ℃, 72-80 ℃, 74-80 ℃, 70-88 ℃ or 70-86 ℃ and the like; the reaction time is 0.5-5 hours, 1-4 hours, 1.5-4 hours, 2-4 hours, 3-4 hours, or the like.
Preferably, the heating temperature in the step (3) is 85-95 ℃, 87-95 ℃, 88-95 ℃, 90-95 ℃, 85-92 ℃ or 85-90 ℃ and the like; the reaction time is 1-5 hours, 1.5-4 hours, 2-4 hours, 3-4 hours, or the like.
Preferably, the stirring speed in the step (4) is 500-2000 r/min, 800-2000 r/min, 1000-2000 r/min, 1500-2000 r/min and the like; the stirring time is 0.2-1 hour, 0.3-1 hour, 0.4-1 hour, 0.5-1 hour and 0.6-1 hour.
Has the advantages that:
the epoxy resin of the embodiments 1-4 of the invention has better thermal stability, the temperature of the melting initial point is about 365 ℃, even at the high temperature of 800 ℃, a large amount of resin residual ash is still remained, and the epoxy resin prepared by the invention has good temperature resistance effect.
In the epoxy resin system, the curing agent has great influence on the thermal stability of the epoxy resin, and when the curing agent is prepared, the iminodiethanol and the titanate TC-114 are compounded to generate a synergistic effect so as to increase the thermal stability of the curing agent on the epoxy resin. Iminodiethanol is used in the present invention: the mass ratio of titanate TC-114 is (2-3): the epoxy resin obtained in (1-2) is excellent in thermal stability.
The invention selects proper proportion of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and phenylaminomethyltrimethoxysilane to endow the resin with better heat stability effect, and mainly uses the silane modified polyurethane to react with epoxy resin to obtain a cross-linked interpenetrating network structure so as to increase the integral compactness of the resin and improve the heat resistance of the resin.
According to the invention, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, phenylaminomethyltrimethoxysilane and a proper mass ratio of the N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and the phenylaminomethyltrimethoxysilane influence the contact angle and the water absorption of the resin to a great extent, so that the resin disclosed by the invention has excellent water resistance. The invention creatively utilizes the novel curing agent, can increase the compactness of the resin, thereby influencing the water-resistant effect of the resin.
The epoxy resin is selected to be composed of the epoxy resin E-51 and the epoxy resin AG-80 in a mass ratio of (2-4): 1, the obtained resin is good in strength and toughness, and compared with the epoxy resin prepared from other epoxy resin polymers, the obtained epoxy resin has obvious advantages in resin strength and toughness increase.
The invention relates to the mutual compounding of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and phenylaminomethyltrimethoxysilane and the preparation of a curing agent, which selects iminodiethanol: the mass ratio of titanate TC-114 is (2-3): (1-2) the epoxy resin of the present invention has an unexpected increase in both strength and toughness compared to others.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments and examples, and the advantages and various effects of the present invention will be more clearly apparent therefrom. It will be understood by those skilled in the art that these specific embodiments and examples are for the purpose of illustrating the invention and are not to be construed as limiting the invention.
Throughout the specification, unless otherwise specifically noted, terms used herein should be understood as having meanings as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. If there is a conflict, the present specification will control.
Unless otherwise specifically indicated, various raw materials, reagents, instruments, equipment and the like used in the present invention may be commercially available or may be prepared by existing methods.
The epoxy resin components and the amounts thereof (parts by mass) of the epoxy resin components of the examples and comparative examples of the present invention are as follows:
table 1: examples and comparative examples epoxy resin compositions
Curing agents of examples 1-4 and comparative examples 1-6 above were prepared, the ratio of iminodiethanol: n-propanol: the mass ratio of titanate TC-114 is: 2.5:1.5, the mass of iminodiethanol, titanate TC-114 and the mass ratio to n-propanol is 1:8.
While the curing agent used in comparative example 7 above was iminodiethanol; the curing agent in comparative example 7 above was titanate TC-114.
In preparing the curing agent in comparative example 9 above, the ratio of iminodiethanol: the mass ratio of titanate TC-114 is: 5:1, the mass of iminodiethanol, titanate TC-114, and the mass to n-propanol ratio is 1:8.
In preparing the curing agent in comparative example 10 above, the ratio of iminodiethanol: the mass ratio of titanate TC-114 is: 1:2, the mass of iminodiethanol, titanate TC-114, and the mass to n-propanol ratio is 1:8.
The curing agents of examples 1 to 4 and comparative examples 1 to 6 and 9 to 10 were prepared as follows: adding n-propanol into iminodiethanol, starting stirring, stirring for 0.5 hour at the rotating speed of 1000 r/min, adding titanate TC-114, heating to 90 ℃ for reaction for 140 min, and removing propanol to obtain the curing agent.
The preparation methods of the epoxy resins in the above examples 1 to 4 and comparative examples 1 to 10 are as follows: (1) Mixing polyethylene glycol, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and phenylaminomethyltrimethoxysilane, stirring at 1000 rpm for 0.5 hour, and stirring uniformly; (2) Heating the mixture obtained in the step (1) to 78 ℃, and then adding isophorone diisocyanate to react for 3 hours to obtain a reactant A; (3) Heating the reactant A to 92 ℃, adding an epoxy resin polymer, dibutyltin dilaurate and a diluent to react for 3.5 hours, and obtaining a reactant product B after the reaction is finished; (4) And adding a curing agent into the reaction product B, stirring for 0.5 hour at the rotating speed of 1500 rpm, and uniformly stirring and mixing to obtain the temperature-resistant and aging-resistant epoxy resin.
The epoxy resins of examples 1-4 and comparative examples 1-10 were cured at 120 ℃ for 5 hours.
And (3) performance testing:
thermal stability: the thermal stability of the resin is characterized by thermal gravimetric analysis, specifically: the cured epoxy resin sample is placed at 60 ml-min -1 Under nitrogen purge at 10 ℃ C. Min -1 The heating rate of (a) was tested at 25-800 ℃. The test results are shown in table 2 below.
Table 2: thermal stability analysis
As can be seen from the contents in Table 2, the epoxy resins of examples 1 to 4 of the present invention have good thermal stability, the melting initial temperature is about 365 ℃, even at a high temperature of 800 ℃, a large amount of resin residual ash is still remained, and the epoxy resins prepared by the present invention have good temperature resistance. The curing agent has great influence on the thermal stability of the epoxy resin, and the iminodiethanol and the titanate TC-114 are compounded to generate a synergistic effect so as to increase the thermal stability of the curing agent on the epoxy resin. Iminodiethanol is used in the present invention: the mass ratio of titanate TC-114 is (2-3): the epoxy resin obtained in (1-2) is excellent in thermal stability. The invention selects proper proportion of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and phenylaminomethyltrimethoxysilane to endow the resin with better thermal stability effect, and mainly uses the silane modified polyurethane to react with epoxy resin to obtain a cross-linked interpenetrating network structure so as to increase the integral compactness of the resin, thereby improving the heat resistance of the resin.
And (3) testing the water resistance: the water resistance properties are characterized by water absorption and contact angle. In the water absorption test, the sample strip is soaked and weighed according to the standard of the GB/T1034-1998 plastic water absorption test method, and then the water absorption is calculated. And (4) testing the contact angle, and measuring by using a JC2000D1 type contact angle measuring instrument. The test results are given in table 3 below.
Table 3: water resistance test
As can be seen from table 3, the resin of the present invention has a high contact angle and a low water absorption, and the resin of the present invention has excellent water resistance. According to the invention, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, phenylaminomethyltrimethoxysilane and a proper mass ratio of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and phenylaminomethyltrimethoxysilane are selected, so that the contact angle and the water absorption of the resin are influenced to a large extent, and the resin provided by the invention has excellent water resistance. Furthermore, the invention creatively utilizes a novel curing agent, which can increase the compactness of the resin, thereby influencing the water-resistant effect of the resin.
Mechanical properties: the mechanical properties are characterized by room temperature shear strength, high temperature shear strength and elongation at break. The room temperature shear strength is tested according to the GB 7124-2008-adhesive tensile shear strength test method; the high-temperature shear strength is tested according to the GJB 444-88-adhesive high-temperature tensile shear strength test method; and the elongation at break is tested by the tensile breaking method of the GB/T2567-2008 resin casting body. The test results are shown in Table 4.
Table 4: mechanical Property test
As can be seen from the contents in Table 3, the resin of the present invention has high room temperature shear strength, high temperature shear strength and elongation at break, and the resin of the present invention has both strength and toughness. The epoxy resin selected by the invention consists of the epoxy resin E-51 and the epoxy resin AG-80 in a mass ratio of (2-4): 1, the obtained resin has better strength and toughness, and compared with other resin polymers, the epoxy resin selected by the invention has obvious advantages of increasing the strength and toughness of the resin. In addition, the mutual compounding of the N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and the phenylaminomethyltrimethoxysilane and the preparation of the curing agent are carried out by selecting iminodiethanol: the mass ratio of titanate TC-114 is (2-3): (1-2) the epoxy resin of the present invention has an unexpected increase in both strength and toughness compared to other epoxy resins.
Finally, it should be further noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The temperature-resistant and aging-resistant epoxy resin is characterized by comprising the following components in parts by mass: 100 parts of epoxy resin polymer, 1-3 parts of polyethylene glycol, 1-3 parts of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 1-3 parts of phenylaminomethyltrimethoxysilane, 10-15 parts of isophorone diisocyanate, 8-12 parts of dibutyltin dilaurate, 8-12 parts of curing agent, 15-20 parts of diluent and 2-5 parts of aluminum powder;
the diluent is at least one of toluene, xylene, acetone, butanone and ethyl acetate;
the mass ratio of the N- (2-aminoethyl) -3-aminopropyltrimethoxysilane to the phenylaminomethyltrimethoxysilane is (1-3): 1;
the preparation method of the curing agent comprises the following steps: adding n-propanol into iminodiethanol, stirring uniformly, adding titanate TC-114, heating to 85-92 ℃ to react for 50-200 min, and then removing n-propanol to obtain the curing agent.
2. The temperature-resistant, aging-resistant epoxy resin of claim 1, wherein the epoxy polymer is comprised of epoxy E-51 and epoxy AG-80.
3. The temperature-resistant and aging-resistant epoxy resin as claimed in claim 2, wherein the mass ratio of the epoxy resin E-51 to the epoxy resin AG-80 is (2-4): 1.
4. The temperature-resistant, aging-resistant epoxy resin according to claim 1, wherein the ratio of iminodiethanol: the mass ratio of titanate TC-114 is (2-3): (1-2).
5. The temperature-resistant and aging-resistant epoxy resin according to claim 1, wherein the mass ratio of the N- (2-aminoethyl) -3-aminopropyltrimethoxysilane to the phenylaminomethyltrimethoxysilane is (1.5-2.5): 1.
6. the method for preparing the temperature-resistant and aging-resistant epoxy resin according to any one of claims 1 to 5, wherein the method comprises the following steps:
(1) Uniformly stirring polyethylene glycol, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and phenylaminomethyltrimethoxysilane;
(2) Heating the mixture obtained in the step (1) to 70-80 ℃, and then adding isophorone diisocyanate to react for 0.5-5 hours to obtain a reactant A;
(3) Heating the reactant A to 85-95 ℃, adding an epoxy resin polymer, dibutyltin dilaurate and a diluent, and reacting for 1-5 hours to obtain a reactant product B after the reaction is finished;
(4) And adding a curing agent into the reaction product B, stirring and mixing to obtain the temperature-resistant and aging-resistant epoxy resin.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116536020A (en) * | 2023-06-13 | 2023-08-04 | 天津泊荣石油科技发展有限公司 | Primer for seawater pipeline repair adhesive tape and application thereof |
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| CN116536020B (en) * | 2023-06-13 | 2023-10-27 | 天津泊荣石油科技发展有限公司 | Primer for seawater pipeline repair adhesive tape and application thereof |
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