CN115286739A - Preparation method of nanochitin composite 3d printing conductive material - Google Patents
Preparation method of nanochitin composite 3d printing conductive material Download PDFInfo
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- 239000004020 conductor Substances 0.000 title claims abstract description 40
- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 229920002101 Chitin Polymers 0.000 claims abstract description 42
- 239000003381 stabilizer Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 235000011837 pasties Nutrition 0.000 claims description 35
- 238000003756 stirring Methods 0.000 claims description 35
- 239000003960 organic solvent Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 15
- 239000003431 cross linking reagent Substances 0.000 claims description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 12
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- 239000002562 thickening agent Substances 0.000 claims description 10
- 239000004135 Bone phosphate Substances 0.000 claims description 8
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 241000238557 Decapoda Species 0.000 claims description 6
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
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- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- PMUNIMVZCACZBB-UHFFFAOYSA-N 2-hydroxyethylazanium;chloride Chemical compound Cl.NCCO PMUNIMVZCACZBB-UHFFFAOYSA-N 0.000 claims description 3
- 241000238366 Cephalopoda Species 0.000 claims description 3
- 239000004709 Chlorinated polyethylene Substances 0.000 claims description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- VJLOFJZWUDZJBX-UHFFFAOYSA-N bis(2-hydroxyethyl)azanium;chloride Chemical compound [Cl-].OCC[NH2+]CCO VJLOFJZWUDZJBX-UHFFFAOYSA-N 0.000 claims description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 3
- YJOMWQQKPKLUBO-UHFFFAOYSA-L lead(2+);phthalate Chemical compound [Pb+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O YJOMWQQKPKLUBO-UHFFFAOYSA-L 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000001103 potassium chloride Substances 0.000 claims description 3
- 235000011164 potassium chloride Nutrition 0.000 claims description 3
- 239000001488 sodium phosphate Substances 0.000 claims description 3
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000006185 dispersion Substances 0.000 abstract description 3
- 239000000428 dust Substances 0.000 abstract description 3
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- 238000005303 weighing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
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- 239000000126 substance Substances 0.000 description 3
- CYIKHROZRQTQKS-UHFFFAOYSA-M C(C)(=O)[O-].C(C)[Pb+] Chemical compound C(C)(=O)[O-].C(C)[Pb+] CYIKHROZRQTQKS-UHFFFAOYSA-M 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- MSWZFWKMSRAUBD-IVMDWMLBSA-N 2-amino-2-deoxy-D-glucopyranose Chemical compound N[C@H]1C(O)O[C@H](CO)[C@@H](O)[C@@H]1O MSWZFWKMSRAUBD-IVMDWMLBSA-N 0.000 description 1
- 229920001661 Chitosan Polymers 0.000 description 1
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- 241000238424 Crustacea Species 0.000 description 1
- 229920000869 Homopolysaccharide Polymers 0.000 description 1
- OVRNDRQMDRJTHS-UHFFFAOYSA-N N-acelyl-D-glucosamine Natural products CC(=O)NC1C(O)OC(CO)C(O)C1O OVRNDRQMDRJTHS-UHFFFAOYSA-N 0.000 description 1
- OVRNDRQMDRJTHS-FMDGEEDCSA-N N-acetyl-beta-D-glucosamine Chemical compound CC(=O)N[C@H]1[C@H](O)O[C@H](CO)[C@@H](O)[C@@H]1O OVRNDRQMDRJTHS-FMDGEEDCSA-N 0.000 description 1
- MBLBDJOUHNCFQT-LXGUWJNJSA-N N-acetylglucosamine Natural products CC(=O)N[C@@H](C=O)[C@@H](O)[C@H](O)[C@H](O)CO MBLBDJOUHNCFQT-LXGUWJNJSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- MSWZFWKMSRAUBD-UHFFFAOYSA-N beta-D-galactosamine Natural products NC1C(O)OC(CO)C(O)C1O MSWZFWKMSRAUBD-UHFFFAOYSA-N 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 235000013376 functional food Nutrition 0.000 description 1
- 229960002442 glucosamine Drugs 0.000 description 1
- 150000002301 glucosamine derivatives Chemical class 0.000 description 1
- 235000013402 health food Nutrition 0.000 description 1
- 229950006780 n-acetylglucosamine Drugs 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F251/00—Macromolecular compounds obtained by polymerising monomers on to polysaccharides or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L5/00—Compositions of polysaccharides or of their derivatives not provided for in groups C08L1/00 or C08L3/00
- C08L5/08—Chitin; Chondroitin sulfate; Hyaluronic acid; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Composite Materials (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a preparation method of a nano-chitin composite 3d printing conductive material, and relates to the technical field of chitin. The invention can increase the hardness, flexibility and wear resistance of the nanochite composite 3d printing conductive material by adding the polymerizable oligomer, and can also increase the tensile strength and impact resistance, so that the product produced by compounding the nanochite composite 3d printing conductive material can be used, the dispersion among raw materials can be improved by adding the stabilizer, the metering times can be simplified, the metering error probability and the loss caused by the metering error probability can be reduced, the supply and storage of auxiliary materials are simple and convenient, the production and quality management are facilitated, the possibility of producing the product without dust is provided, and the production conditions are improved.
Description
Technical Field
The invention relates to the technical field of chitin, in particular to a preparation method of a nano-chitin composite 3d printing conductive material.
Background
Chitin (chitin), also called chitin, is a structural homopolysaccharide formed by beta-linked polymerization of N-acetylglucosamine, widely exists in shells of crustaceans, shells of insects, cell walls of fungi, and some green algae, and chitin is an important raw material for preparing chitosan and glucosamine series products. Chitin and its derivatives have important application in medicine, chemical industry, health food and other fields, and have wide application prospect. Can be used for preparing soluble chitin and glucosamine, and can be used as additive for cosmetics and functional foods, and for preparing photographic emulsion. The following problems exist in the prior art:
1. when the nano-chitin is compounded in the production process of the 3d printing conductive material, the tensile strength and the impact resistance of the product cannot be improved;
2. when the nanochitin composite 3d printing conductive material is produced and prepared, the strength and the elasticity of the product cannot be improved.
Disclosure of Invention
The invention provides a preparation method of a nanochitin composite 3d printing conductive material, which aims to improve the tensile strength and the impact resistance of the nanochitin composite 3d printing conductive material and solve the problem that the tensile strength and the impact resistance of the nanochitin composite 3d printing conductive material cannot be improved; the other purpose is to solve the problem that the strength and the elasticity of the nano-chitin composite 3d printing conductive material cannot be improved, so that the effect of improving the strength and the elasticity of the nano-chitin composite 3d printing conductive material can be achieved.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the nanochitin composite 3d printing conductive material is prepared from nanochitin, a stabilizer, a thickening agent, a cross-linking agent, a polymerizable oligomer and an organic solution, wherein the weight ratio of the components is as follows:
the technical scheme of the invention is further improved as follows: the stabilizer is one or a mixture of more than two of lead stearate, 2-ethyl lead acetate, tribasic lead stearate, dibasic lead phthalate and tribasic lead maleate.
The technical scheme of the invention is further improved as follows: the thickening agent is one or a mixture of more than two of potassium chloride, ammonium chloride, monoethanolamine chloride, diethanolamine chloride and sodium phosphate.
The technical scheme of the invention is further improved as follows: the cross-linking agent is one or a mixture of more than two of dicumyl peroxide, ethylene-vinyl acetate copolymer, polyethylene, chlorinated polyethylene, tetra-gas phthalic anhydride and hexahydrophthalic anhydride.
The technical scheme of the invention is further improved as follows: the polymerizable oligomer is one or a mixture of more than two of pure acrylate, organosilicon oligomer, light-cured polybutadiene oligomer, polyether acrylate and polyester acrylate.
The invention discloses a preparation method of a nanochitin composite 3d printing conductive material, which comprises the following steps:
s1, taking one of crabs, shrimps, squids, insects and fungi as a raw material to obtain nano chitin, and taking the weight of the mixture ratio for later use;
s2, proportioning the components according to the weight, taking a small amount of organic solvent, mixing the stabilizer and the thickening agent according to the proportion, uniformly stirring, adding the nano-chitin prepared in the S1, and stirring while adding to obtain pasty nano-chitin for later use;
s3, proportioning according to the weight of the components, dissolving the proportioned cross-linking agent by using a proper amount of organic solvent, adding the cross-linking agent into the pasty nanochitine prepared in the S2, and stirring uniformly while adding;
s4, proportioning according to the weight of the components, taking a small amount of organic solvent, dissolving the proportioned polymerizable oligomer, adding the polymerizable oligomer into the pasty nanochitine prepared in the S3, and stirring uniformly while adding;
and S5, stirring the pasty nanochitin prepared in the step S3 for 45-55 minutes at room temperature, adding the residual organic solvent into the stirred pasty nanochitin, and adding copper powder with the average particle size of 60 nanometers into the pasty nanochitin to increase the conductivity.
And S6, heating the pasty nano-chitin obtained by stirring in the step S5 for 70-80min, stirring for 45-55min, naturally standing, and cooling at room temperature to obtain the nano-chitin composite 3d printing conductive material.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the technical progress that:
1. the invention provides a preparation method of a nanochitin composite 3d printing conductive material, which can increase the hardness, flexibility and wear resistance of the nanochitin composite 3d printing conductive material by adding a polymerizable oligomer, and can increase the tensile strength and impact resistance at the same time, so that a product produced by the nanochitin composite 3d printing conductive material can be used, the dispersion among raw materials can be improved by adding a stabilizer, the metering times can be simplified, the metering error probability and the loss caused by the metering errors are reduced, the supply and storage of auxiliary materials are simple and convenient, the production and quality management are facilitated, the possibility of producing the product without dust is provided, and the production conditions are improved.
2. The invention provides a preparation method of a nanochitin composite 3d printing conductive material, which can enable the thickening effect to be obvious by adding a thickening agent, can enable the molecular structure strength of a high polymer material to be increased by adding a cross-linking agent, is not easy to break, and can increase the elasticity, so that the cross-linking agent generates chemical bonds among linear molecules, the linear molecules are mutually connected to form a net structure, and the strength and the elasticity of a product are improved.
Drawings
FIG. 1 is a schematic flow chart of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
in a first aspect, the present invention provides a nanochitin composite 3d printing conductive material, the nanochitin composite 3d printing conductive material is formed by nanochitin, one or a mixture of two or more of a stabilizer of lead stearate, 2-ethyl lead acetate, lead stearate tribasic, dibasic lead phthalate and tribasic lead maleate, one or a mixture of two or more of a thickener of potassium chloride, ammonium chloride, monoethanolamine chloride, diethanolamine chloride and sodium phosphate, a cross-linking agent of dicumyl peroxide, ethylene-vinyl acetate copolymer, polyethylene, chlorinated polyethylene, one or a mixture of two or more of tetra-gas phthalic anhydride and hexahydrophthalic anhydride, a polymerizable oligomer of one or a mixture of two or more of pure acrylate, organosilicon oligomer, photo-curable polybutadiene oligomer, polyether acrylate and polyester acrylate, and an organic solution, wherein the weight ratio of each component is:
in a second aspect, a preparation method of a nanochitin composite 3d printing conductive material comprises the following steps:
s1, taking one of crabs, shrimps, squids, insects and fungi as a raw material to obtain nano chitin, and taking the weight of the mixture ratio for later use;
s2, proportioning the components according to the weight, taking a small amount of organic solvent, mixing the stabilizer and the thickening agent according to the proportion, uniformly stirring, adding the nano-chitin prepared in the S1, and stirring while adding to obtain pasty nano-chitin for later use;
s3, proportioning according to the weight of the components, dissolving the proportioned cross-linking agent by using a proper amount of organic solvent, adding the cross-linking agent into the pasty nanochitine prepared in the S2, and stirring uniformly while adding;
s4, proportioning according to the weight of the components, taking a small amount of organic solvent, dissolving the proportioned polymerizable oligomer, adding the polymerizable oligomer into the pasty nano-chitin prepared in the S3, and stirring uniformly while adding;
and S5, stirring the pasty nanochitin prepared in the step S3 for 45-55 minutes at room temperature, adding the residual organic solvent into the stirred pasty nanochitin, and adding copper powder with the average particle size of 60 nanometers into the pasty nanochitin to increase the conductivity.
And S6, heating the pasty nano-chitin obtained by stirring in the step S5 for 70-80min, stirring for 45-55min, naturally standing, and cooling at room temperature to obtain the nano-chitin composite 3d printing conductive material.
Example 1
The weight ratio of each component is as follows:
a. accurately weighing 5% lead stearate tribasic and 0.8% ammonium chloride, adding organic solvent, mixing and stirring uniformly, adding the prepared nano chitin, mixing and stirring to obtain pasty nano chitin for later use;
b. accurately weighing 1% dicumyl peroxide, dissolving with organic solvent, and adding into the pasty nanochitin prepared in step a while stirring to form paste;
c. accurately weighing 1.8 percent of pure acrylate, adding the organic solvent again for dissolving, and adding the pure acrylate into the pasty nano-chitin prepared by the step b while stirring uniformly to form a paste;
d. and c, stirring the pasty nanochitine prepared in the step c for 45-55 minutes at room temperature, adding the residual organic solvent into the stirred pasty nanochitine, and adding copper powder with the average particle size of 60 nanometers into the stirred pasty nanochitine to increase the conductivity.
e. And d, heating the pasty nano-chitin obtained by stirring in the step d for 70-80min, stirring for 45-55min, naturally standing, and cooling at room temperature to obtain the nano-chitin composite 3d printing conductive material.
Example 2
The weight ratio of each component is as follows:
a. accurately weighing 6% lead stearate tribasic and 1% ammonium chloride, adding an organic solvent, mixing and stirring uniformly, adding the prepared nano-chitin, mixing and stirring to obtain pasty nano-chitin for later use;
b. accurately weighing 1.5% dicumyl peroxide, dissolving with organic solvent, and adding into the pasty nanochitin prepared in step a while stirring to obtain paste;
c. accurately weighing 2.5% pure acrylate, adding organic solvent again for dissolving, and adding into the pasty nano chitin prepared by the step b while stirring to form a paste;
d. and c, stirring the pasty nanochitine prepared in the step c for 45-55 minutes at room temperature, adding the residual organic solvent into the stirred pasty nanochitine, and adding copper powder with the average particle size of 60 nanometers into the stirred pasty nanochitine to increase the conductivity.
e. And d, heating the pasty nano-chitin obtained by stirring in the step d for 70-80min, stirring for 45-55min, naturally standing, and cooling at room temperature to obtain the nano-chitin composite conductive material for 3d printing.
The working principle of the preparation method of the nanochitin composite 3d printing conductive material is described in detail below.
As shown in fig. 1, the present invention provides a method for preparing a nanochitin composite 3d printing conductive material, which can increase the hardness, flexibility and wear resistance of the nanochitin composite 3d printing conductive material, and increase the tensile strength and impact resistance, so that the product produced by the nanochitin composite 3d printing conductive material can be used, the dispersion among the raw materials can be improved by adding a stabilizer, the metering frequency can be simplified, the probability of metering error and the loss caused by the metering error can be reduced, the supply and storage of auxiliary materials are simple, the production and quality management are facilitated, the possibility of producing products without dust can be provided, the production conditions can be improved, the thickening effect can be obvious by adding a thickener, the molecular structure strength of the polymer material can be increased by adding the crosslinker, the polymer material is not easy to break, and the elasticity can be increased, so that the crosslinker generates chemical bonds among linear molecules, and the linear molecules are connected with each other to form a net structure, thereby improving the strength and elasticity of the product.
The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, modifications or improvements are within the scope of the invention without departing from the spirit of the inventive concept.
Claims (6)
1. A nano-chitin composite 3d printing conductive material is characterized in that: the nano chitin composite 3d printing conductive material is prepared from nano chitin, a stabilizer, a thickening agent, a cross-linking agent, a polymerizable oligomer and an organic solution, wherein the weight ratio of the components is as follows:
the rest is added with organic solvent.
2. The method for preparing the nanochitine composite conductive material for 3d printing according to claim 1, wherein the method comprises the following steps: the stabilizer is one or a mixture of more than two of lead stearate, lead 2-ethyl acetate, lead stearate tribasic, lead phthalate dibasic and lead maleate tribasic.
3. The method for preparing the nanochitin composite conductive material for 3d printing according to claim 1, wherein the nanochitin composite conductive material comprises: the thickening agent is one or a mixture of more than two of potassium chloride, ammonium chloride, monoethanolamine chloride, diethanolamine chloride and sodium phosphate.
4. The method for preparing the nanochitine composite conductive material for 3d printing according to claim 1, wherein the method comprises the following steps: the cross-linking agent is one or a mixture of more than two of dicumyl peroxide, ethylene-vinyl acetate copolymer, polyethylene, chlorinated polyethylene, tetra-gas phthalic anhydride and hexahydrophthalic anhydride.
5. The method for preparing the nanochitin composite conductive material for 3d printing according to claim 1, wherein the nanochitin composite conductive material comprises: the polymerizable oligomer is one or a mixture of more than two of pure acrylate, organic silicon oligomer, light-cured polybutadiene oligomer, polyether acrylate and polyester acrylate.
6. A preparation method of a nanochitin composite 3d printing conductive material is characterized by comprising the following steps: the method comprises the following steps:
s1, taking one of crabs, shrimps, squids, insects and fungi as a raw material to obtain nano chitin, and taking the weight of the mixture ratio for later use;
s2, proportioning the components according to the weight, taking a small amount of organic solvent, mixing the stabilizer and the thickening agent according to the proportion, uniformly stirring, adding the nano-chitin prepared in the S1, and stirring while adding to obtain pasty nano-chitin for later use;
s3, proportioning according to the weight of the components, dissolving the proportioned cross-linking agent by using a proper amount of organic solvent, adding the cross-linking agent into the pasty nanochitine prepared in the S2, and stirring uniformly while adding;
s4, proportioning according to the weight of the components, taking a small amount of organic solvent, dissolving the proportioned polymerizable oligomer, adding the polymerizable oligomer into the pasty nanochitine prepared in the S3, and stirring uniformly while adding;
and S5, stirring the pasty nanochitine prepared in the step S3 at room temperature for 45-55 minutes, adding the residual organic solvent into the stirred pasty nanochitine, and adding copper powder with the average particle size of 60 nanometers into the pasty nanochitine to increase the conductivity.
And S6, heating the pasty nano-chitin obtained by stirring in the step S5 for 70-80min, stirring for 45-55min, naturally standing, and cooling at room temperature to obtain the nano-chitin composite 3d printing conductive material.
Priority Applications (1)
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