CN115274755A - Display panel, preparation method thereof and display device - Google Patents

Display panel, preparation method thereof and display device Download PDF

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Publication number
CN115274755A
CN115274755A CN202210732432.6A CN202210732432A CN115274755A CN 115274755 A CN115274755 A CN 115274755A CN 202210732432 A CN202210732432 A CN 202210732432A CN 115274755 A CN115274755 A CN 115274755A
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China
Prior art keywords
light
emitting diode
driving board
light emitting
light resistance
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CN202210732432.6A
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Chinese (zh)
Inventor
陈书志
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Shanghai Wingtech Electronic Technology Co Ltd
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Shanghai Wingtech Electronic Technology Co Ltd
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Priority to CN202210732432.6A priority Critical patent/CN115274755A/en
Priority to PCT/CN2022/115204 priority patent/WO2023245861A1/en
Publication of CN115274755A publication Critical patent/CN115274755A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Abstract

The invention discloses a display panel, a preparation method thereof and a display device.A light resistance material is coated on one side of a driving board, which is provided with light emitting diode chips, and covers the light emitting diode chips; exposing and etching the photoresist material to divide the photoresist material into a plurality of photoresist units, wherein the plurality of photoresist units correspond to the plurality of light-emitting diode chips one by one; and shaping the light resistance unit so that the outer surface of the light resistance unit is in a convex arc shape and is used for converging light rays emitted by the corresponding light emitting diode chip. The display panel obtained by the preparation method can directly form a light resistance unit for converging light on the driving plate, and the light condensation effect is improved.

Description

Display panel, preparation method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
Micro LED display device can have the problem that the light-emitting is too diverged when showing, leads to wide-angle light luminance too high, and central light luminance is lower to need to increase drive voltage in order to increase Micro LED's whole luminance, promote Micro LED display device's central luminance, but also corresponding increase along with drive voltage's increase cost.
In order to solve the problems, a condensing lens can be additionally arranged on the light emitting side of the micro LED, and the large-angle light of the micro LED is concentrated to the center through the condensing lens so as to increase the central brightness of the micro LED display device. However, the condensing lenses in the related art are spaced from the Micro LEDs, and the thickness of the spacing is large, which affects the condensing effect.
Disclosure of Invention
The embodiment of the invention discloses a display panel, a preparation method thereof and a display device, wherein a light resistance unit for converging light rays can be directly arranged on a driving plate, so that the light condensation effect is improved.
In order to achieve the above object, in a first aspect, the present invention discloses a method for manufacturing a display panel, the method comprising the steps of:
providing a light-emitting substrate, wherein the light-emitting substrate comprises a driving board and a plurality of light-emitting diode chips arranged on one side of the driving board;
coating a photoresist material on one side of the driving plate, which is provided with the light-emitting diode chips, wherein the photoresist material covers the light-emitting diode chips;
exposing and etching the light resistance material to divide the light resistance material into a plurality of light resistance units, wherein the light resistance units correspond to the light emitting diode chips one by one, and the light resistance units cover the corresponding light emitting diode chips;
and shaping the light resistance unit to enable the outer surface of the light resistance unit to be in a convex arc shape for converging light rays emitted by the corresponding light emitting diode chip.
As an optional implementation manner, in an embodiment of the first aspect of the present application, shaping the light blocking unit so that an outer surface of the light blocking unit is in a convex arc-shaped arrangement includes:
and baking the photoresist unit.
As an alternative embodiment, in an embodiment of the first aspect of the present application, the preparation method further comprises:
after baking the light resistance units, carrying out plasma etching on the light resistance units to reduce the size of the light resistance units, and disconnecting the adjacent light resistance units.
As an optional implementation manner, in an embodiment of the first aspect of the present application, after the photoresist unit is shaped, a reflective layer is formed on a side of the driving board where the light emitting diode chip is disposed, and the reflective layer is attached to an outer periphery of at least one of the photoresist units.
As an optional implementation manner, in an embodiment of the first aspect of the present application, forming a reflective layer on a side of the driving board where the light emitting diode chip is disposed includes:
a mask plate is arranged on one side, away from the driving plate, of the light resistance unit;
and plating a reflecting material on one side of the driving board, which is provided with the light emitting diode chip, in an evaporation mode to form the reflecting layer.
As an optional implementation manner, in an embodiment of the first aspect of the present application, in a direction from the driving board to the light emitting diode chip, a distance from a side of the reflection layer facing away from the driving board to the driving board is less than or equal to a distance from a side of the light emitting diode chip facing away from the driving board to the driving board.
In a second aspect, the present invention discloses a display panel, comprising:
the LED light source comprises a light emitting substrate, a light emitting substrate and a light source, wherein the light emitting substrate comprises a driving board and a plurality of LED chips arranged on one side of the driving board;
the light resistance units are arranged on one side, provided with the light emitting diode chips, of the driving plate and formed by exposing and etching a light resistance material, the light resistance units are baked to form a convex arc-shaped outer surface, the light resistance units cover at least one light emitting diode chip, and the light resistance units are used for converging light rays emitted by the corresponding light emitting diode chips.
As an optional implementation manner, in an embodiment of the first aspect of the present application, adjacent light blocking units are disposed at intervals.
As an optional implementation manner, in an embodiment of the first aspect of the present application, a reflective layer is formed on a side of the driving board where the light emitting diode chip is disposed, and the reflective layer is attached to an outer periphery of at least one of the light blocking units.
In a third aspect, the present invention discloses a display device comprising a display panel produced by the production method according to the first aspect; alternatively, the first and second electrodes may be,
the display device comprises a display panel as described in the second aspect above.
Compared with the prior art, the invention has the beneficial effects that:
according to the display panel and the preparation method and the display device thereof provided by the embodiment of the invention, the light resistance material is coated on one side of the driving board, which is provided with the light emitting diode chips, and part of the light resistance material between the adjacent light emitting diode chips is exposed and etched, so that the light resistance material is divided into the light resistance units, and then the light resistance units are shaped, the outer surfaces of the light resistance units are in the convex arc arrangement, and therefore, light rays emitted by the light emitting diode chips can be converged by the light resistance units. Because the light resistance unit is directly arranged on the driving board and covers the periphery of the light emitting diode chip, the light resistance unit and the light emitting diode chip are not provided with intervals of other materials, the convergence of light rays with larger angles of the light emitting diode chip is favorably realized, the light condensation effect is improved, the thickness of the display panel is favorably controlled, and the light and thin design of the display device is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 2 is a flowchart of step S6 in the first embodiment of the present application;
fig. 3 is a schematic structural diagram illustrating steps of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a display panel disclosed in the second embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of the display panel of FIG. 4 along the direction I-I;
fig. 6 is a schematic structural diagram of a display device disclosed in the third embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Moreover, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific type and configuration may or may not be the same), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.
Example one
Referring to fig. 1 to fig. 3, a method for manufacturing a display screen according to an embodiment of the present invention includes the following steps:
s1: and providing a light-emitting substrate, wherein the light-emitting substrate comprises a driving board and a plurality of light-emitting diode chips arranged on one side of the driving board.
As shown in fig. 3 (a), in step S1, a light emitting substrate is provided, and the light emitting substrate includes a driving board 101 and a plurality of light emitting diode chips 102 disposed on one side of the driving board 101. The driving board 101 may include a substrate 1011 and a driving circuit 1012 formed on the substrate 1011, and optionally, the light emitting diode may be a Mini LED with a size of 100 μm or more, or a micro LED with a size of less than 100 μm. The plurality of light emitting diodes may be spaced apart from each other and disposed in an array on one side of the driving board 101, such that the driving circuit 1012 is located between the light emitting diodes and the substrate 1011, and the driving circuit 1012 is electrically connected to electrodes of the plurality of light emitting diodes, such that the plurality of light emitting diode chips 102 can be driven by the driving circuit 1012 to emit light.
S2: and coating a photoresist material on one side of the driving board, which is provided with the light-emitting diode chips, wherein the photoresist material covers the plurality of light-emitting diode chips.
As shown in fig. 3 (b), a photoresist 113 is applied to the side of the driving board 101 where the light emitting diode chip 102 is provided. It can be understood that the photoresist 113 covers the led chip 102, which means that the photoresist 113 covers the front light-emitting surface of the led chip 102 in the Z direction as shown in fig. 3 (b), and a plurality of side light-emitting surfaces in the direction perpendicular to the Z direction. The photoresist 113 in this application may be a positive photoresist 113 or a negative photoresist 113, and may be specifically adjusted according to actual situations, which is not limited herein. The characteristics of the positive photoresist 113 are: the portions irradiated with light are dissolved in the developer, and the portions not irradiated with light are not dissolved in the developer. The negative photoresist 113 has the opposite characteristic in that the portion irradiated with light is not dissolved in the developer, and the portion not irradiated with light is dissolved in the developer.
S3: and exposing and etching the photoresist material to divide the photoresist material into a plurality of photoresist units, wherein the photoresist units correspond to the light-emitting diode chips one by one, and the corresponding light-emitting diode chips are covered by the photoresist units.
As shown in fig. 3 (c), the photoresist 113 is divided into a plurality of photoresist units 103, and the plurality of photoresist units 103 cover the led chips 102 that uniquely correspond thereto. For example, when the photoresist 113 is a negative photoresist 113, such as a negative photosensitive Polyimide (PI), a light shielding plate with a plurality of openings corresponding to the plurality of light emitting diodes is disposed above the photoresist 113, and a light source is disposed on a side of the light shielding plate away from the photoresist 113, the light source irradiates the photoresist 113 through the openings of the light shielding plate, and after the light source and the light shielding plate are removed, the photoresist 113 is developed and etched to divide the photoresist 113 into a plurality of photoresist units 103. It is understood that the photoresist unit 103 may be a block structure after exposure and etching if the opening is a square hole, and the photoresist unit 103 may be a cylinder structure after exposure and etching if the opening is a circular hole.
Since the photoresist unit 103 formed after exposure and development is required to cover the corresponding led chip 102, when the light shielding plate is used for shielding, the projection of the opening on the driving board 101 should cover the projection of the led chip 102 on the driving board 101. If the dimension of the led chip 102 from the driving board 101 to the led chip 102 is defined as height, the diameter of the opening is larger than the dimension of the led chip 102 in the length and width directions when the opening is a circular opening, and the distance between two adjacent openings can be determined according to the thickness of the applied photoresist 113, the shape of the opening, and the distance between the led chips 102.
S4: and shaping the light resistance unit to enable the outer surface of the light resistance unit to be in a raised arc shape for converging light rays emitted by the corresponding light emitting diode chip.
Further, step S4 may include: and baking the photoresist unit. Wherein the baking temperature can be 140-200 ℃, and the baking time can be 20-60 min, so as to shape the light resistance unit, and the outer surface of the light resistance unit is in a convex arc shape and is used for converging light rays emitted by the corresponding light emitting diode chip.
As shown in fig. 3 (d), the light blocking unit 103 is shaped to have a convex arc-shaped outer surface, so as to converge the light emitted from the led chip 102 wrapped in the light blocking unit 103. It can be understood that, since the photoresist unit 103 melts during the baking process, the outer surface of the photoresist unit 103 can be in a convex arc shape under the influence of surface tension, so as to achieve the purpose of shaping the photoresist unit 103. Illustratively, the baking temperature may be 140 ℃, 150 ℃, 160 ℃, 180 ℃ or 200 ℃ and the baking time may be 20min, 30min, 40min, 50min or 60min. It should be noted that, since one light resistance unit 103 only covers one corresponding light emitting diode chip 102, the shape and size of the light resistance unit 103 are better controlled, which is beneficial to mastering the baking time and baking temperature required by melting of the light resistance unit 103, and is beneficial to obtaining the light resistance unit 103 with an arc outer surface with a similar shape, and controlling the size and bending degree of the light resistance unit 103 after subsequent shaping, so as to fully converge the large-angle light of each light emitting diode chip 102, improve the light condensation effect and light utilization rate, and avoid that the outer surface is too gentle after the light resistance unit 103 is subjected to subsequent shaping treatment, or the thickness of the light resistance unit 103 in the direction from the driving board 101 to the light emitting diode is too large after shaping, which is not beneficial to the light and thin design of the display device.
Specifically, the curvature of the outer surface of the light blocking unit 103 may be adjusted according to actual conditions.
Further, the thickness L1 of the photoresist 113 applied to the driving board 101 along the direction from the driving board 101 to the led chip 102 is 10 μm to 20 μm. For example, the direction from the driving board 101 to the light emitting diode chip 102 may be as shown in the Z direction in fig. 3 (b), and the thickness L1 of the photoresist 113 applied to the driving board 101 may be 10 μm, 12 μm, 15 μm, 17 μm, 19 μm, or 20 μm. As described above, the micro leds have smaller sizes, and the pitch between the micro leds of the high pixel density display device is smaller, if the thickness of the coated photoresist 113 is too large, the photoresist 113 between two adjacent led chips 102 that can be removed by exposure and etching processes is less, the formed photoresist unit 103 is too thick, and when further baking and shaping are performed to make the photoresist unit form a convex arc-shaped outer surface, the joint between two adjacent photoresist units is too thick, which results in too gentle outer surface of the shaped photoresist unit 103, affecting the light condensing effect, and the required baking time is increased, increasing the complexity of the shaping. If the thickness of the applied photoresist material 113 is too small, the photoresist unit 103 formed after the exposure and etching process is too thin, and the light-emitting diode chip 102 cannot be completely covered after the baking process, so that part of the light cannot be converged by the photoresist unit 103, and the central brightness of the light-emitting diode chip 102 cannot reach an ideal state. Therefore, the thickness of the coated photoresist 113 is limited in the embodiment, so that the photoresist unit 103 after the subsequent exposure and etching processes has a suitable volume, which is beneficial for the outer surface of the photoresist unit 103 after the shaping process to present a desired arc shape, and the photoresist unit 103 can completely cover the led chip 102, so as to sufficiently collect the light emitted by the led chip 102.
Of course, in other embodiments, step S4 may also include: on the mould lid that will be equipped with the arc wall of a plurality of indents was located the photoresistance unit 103 after the exposure etching, a plurality of arc walls and a plurality of photoresistance units 103 one-to-one, mould high temperature melting photoresistance unit 103 was close to towards drive plate 101 gradually for the surface of photoresistance unit 103 forms the protruding arc surface with the arc wall assorted of mould, thereby realizes moulding to photoresistance unit 103.
On the basis of shaping the light resistance unit through baking treatment, the preparation method of the display screen can further comprise the following steps:
s5: the photoresist units are plasma etched to reduce the size of the photoresist units, and adjacent photoresist units are disconnected.
Considering that adjacent photoresist units 103 may be connected after being baked, and when the connection position of the photoresist units 103 is thicker in the direction from the driving board 101 to the led chip 102, mutual interference between light rays emitted by the adjacent led chips 102 is easily caused, especially when the led chips 102 are micro led chips, the distance between the adjacent led chips 102 is relatively smaller, if it is required to ensure that the baked photoresist units 103 completely cover the led chips 102, the probability that the baked photoresist units 103 are connected together is higher, and in order to make the adjacent photoresist units 103 disconnected, in this embodiment, the photoresist units 103 are further subjected to plasma etching treatment on the basis of steps S1 to S4, as shown in fig. 3 (e), the size of the baked photoresist units 103 is reduced by plasma etching, so that the adjacent photoresist units 103 are disconnected, and at the same time, the thickness of the photoresist units 103 in the direction from the driving board 101 to the led chips 102 is favorably reduced, and the thickness of the display panel is further reduced, thereby realizing a thin and thin design of the display device. For example, the photoresist unit 103 may be dry etched by oxygen plasma, so that the outer surface of the photoresist unit 103 is still in a convex arc shape, and the size of the photoresist unit is reduced, thereby disconnecting two adjacent photoresist units 103.
Further, after the photoresist unit 103 is plasma etched, the outer surface of the photoresist unit 103 is hemispherical. When the outer surface of the light blocking unit 103 is hemispherical, the light converging effect of the light emitted from the led chip 102 is the best, and of course, the outer surface of the light blocking unit 103 may also be shown as an arc surface of a portion of a sphere with a smaller volume cut by a plane perpendicular to the diameter of the sphere.
Moreover, as far as possible, the projection of the light emitting diode chip 102 on the driving board 101 covers the center position of the projection of the light resistance unit 103 on the driving board 101, so that when the light emitted from the front light emitting surface of the light emitting diode chip 102 is emitted out of the light resistance unit 103, the light can be approximately perpendicular to the driving board 101, and when the display panel is installed and applied to a display device, a user can see a picture more clearly when the display panel is directly displayed.
S6: and a reflecting layer is formed on one side of the driving board, which is provided with the light emitting diode chip, and is attached to the periphery of the at least one light resistance unit.
As shown in fig. 3 (f), the reflective layer 104 is attached to the outer periphery of the plurality of photoresist units 103. It can be understood that the reflective layer 104 is attached to the periphery of the light blocking unit 103, but the position of the light blocking unit 103 corresponding to the front light-emitting surface of the led chip 102 is not blocked by the reflective layer 104, so as to ensure that the central light of the led chip 102 can be emitted to the external environment from the position. Because the reflective layer 104 is disposed around the periphery of the light blocking unit 103 and attached to the light blocking unit 103, the reflective layer 104 is matched with the light blocking unit 103, and the surface of the reflective layer 104 facing the light emitting diode chip 102 is an inward-concave arc surface, so that when the large-angle light emitted by the light emitting diode chip 102 is transmitted to the reflective layer 104 at the periphery of the light emitting diode chip, the large-angle light can be emitted from the light blocking unit 103 at a position corresponding to the middle part after being reflected by the reflective layer 104, that is, the large-angle light is further converged, and the light condensing effect is improved.
Further, as shown in fig. 2, step S6 may include the steps of:
s60: a mask plate is arranged on one side, away from the driving plate, of the light resistance unit;
s61: and the reflecting material is plated and attached to one side, provided with the light emitting diode chip, of the driving plate in an evaporation mode to form a reflecting layer.
Through steps S60 and S61, a metal material having a high reflection characteristic (e.g., chrome, aluminum, silver) can be plated on the driving board 101 to form the reflection layer 104 on the driving board 101, so that the light emitted from the led chip 102 to the reflection layer 104 is reflected as much as possible by the reflection layer 104, thereby improving the utilization rate of the high-angle light and the light condensing effect. It is understood that the time and temperature of evaporation can be adjusted according to actual conditions, and are not specifically limited herein.
Specifically, considering that if the thickness of the reflective layer 104 formed by plating is too large, the light-emitting angle of the led chip 102 is easily blocked, and the central brightness of the led chip 102 is too large, in this embodiment, the structure of the reflective layer 104 is further defined, so that the distance L2 from the side of the reflective layer 104 away from the driving board 101 to the driving board 101 is less than or equal to the distance L3 from the side of the led chip 102 away from the driving board 101 to the driving board 101 in the direction from the driving board 101 to the led chip 102, that is, the reflective layer 104 only covers the side light-emitting surface of the led chip 102, so as to reflect the large-angle light emitted by the led chip 102, and prevent the light emitted by the light-emitting surface of the led chip 102 from being blocked by the reflective layer 104.
Of course, in other embodiments, the reflective layer 104 in step S6 can also be formed by coating or sputtering. The specific implementation mode can be adjusted according to actual requirements.
In summary, in the display panel provided in the first embodiment, the plurality of photoresist units 103 having the convex arc-shaped outer surface are directly formed on the driving board 101, so that the light emitted by the light-emitting diode chips 102 wrapped by the photoresist units 103 is converged, and the central brightness of the light-emitting diode chips 102 is increased. Because there is no space between the light resistance unit 103 and the light emitting diode chip 102 for other materials, compared with the way of spacing arrangement in the prior art, the light emitting diode chip 102 can be converged at a larger angle, the light gathering effect can be improved, and one or more layers of materials spaced between the light emitting diode chip 102 and the light resistance unit 103 can be omitted, thereby facilitating the control of the thickness of the display panel and realizing the light and thin design of the display device. On the basis, the light resistance units 103 are arranged at intervals to reduce the interference of the large-angle light rays emitted by the adjacent light emitting diode chips 102 to each other, and the reflection layer is arranged on the periphery of the light resistance units 103 to further converge the large-angle light rays of the light emitting diode chips 102.
Example two
Referring to fig. 4 and fig. 5, a second embodiment of the present invention discloses a display screen 100, where the display screen 100 can be applied to a display device. Specifically, the display screen 100 includes a light emitting substrate and a plurality of photoresist units 103. The light emitting substrate includes a driving board 101 and a plurality of light emitting diode chips 102 disposed on one side of the driving board 101. The plurality of light resistance units 103 are arranged on one side, provided with the light emitting diode chips 102, of the driving board 101, the outer surfaces of the plurality of light resistance units 103 are arranged in a convex arc shape, the plurality of light resistance units 103 correspond to the plurality of light emitting diode chips 102 one by one, the light resistance units 103 cover the corresponding light emitting diode chips 102, and the light resistance units 103 are used for converging light rays emitted by the corresponding light emitting diode chips 102.
The driving board 101 may include a substrate 1011 and a driving circuit 1012 formed on the substrate, and the light emitting diode may be a Mini LED with a size of 100 μm or more, or a micro LED with a size of less than 100 μm. The plurality of light emitting diodes may be spaced apart from each other and disposed in an array on one side of the driving board 101, such that the driving circuit 1012 is located between the light emitting diodes and the substrate 1011, and the driving circuit 1012 is electrically connected to electrodes of the plurality of light emitting diodes, such that the plurality of light emitting diode chips 102 can be driven by the driving circuit 1012 to emit light.
In the display panel provided by the second embodiment, the plurality of photoresist units 103 with the convex arc-shaped outer surfaces are directly formed on the driving board 101, so that the light emitted by the light-emitting diode chips 102 wrapped by the photoresist units 103 is converged, so as to increase the central brightness of the light-emitting diode chips 102. Because there is no space between the light resistance unit 103 and the light emitting diode chip 102 for other materials, compared with the way of spacing arrangement in the prior art, the light emitting diode chip 102 can be converged at a larger angle, the light gathering effect can be improved, and one or more layers of materials spaced between the light emitting diode chip 102 and the light resistance unit 103 can be omitted, thereby facilitating the control of the thickness of the display panel and realizing the light and thin design of the display device.
Further, the light blocking units 103 are disposed at intervals. Illustratively, the size of the light resistance unit 103 can be reduced by performing plasma etching on the light resistance unit 103, so that when the light resistance unit 103 completely covers the led chip 102, two adjacent light resistance units 103 are disposed at intervals, thereby preventing light emitted by the led chip 102 from interfering with each other due to the connection between the two adjacent light resistance units 103, and further converging light of the led chip 102 with a larger angle, so as to improve the utilization rate of the light.
Specifically, the photoresist units 103 are plasma etched to form a semi-spherical outer surface of the photoresist units 103 after the photoresist units 103 are spaced apart.
Further, a reflective layer 104 is formed on the side of the driving board 101 where the led chip 102 is disposed, and the reflective layer 104 is attached to the periphery of the at least one photoresist unit 103. By forming the reflection layer 104 on the periphery of the light resistance unit 103, when the large-angle light emitted by the light emitting diode chip 102 is transmitted to the reflection layer 104 on the periphery thereof, the light can be emitted from the position of the light resistance unit 103 relative to the middle part after being reflected by the reflection layer 104, that is, the large-angle light is further converged, and the light condensation effect is improved. Illustratively, the reflective layer 104 may be formed by evaporation as described above.
Specifically, in the direction from the driving board 101 to the light emitting diode chip 102, a distance L2 from the side of the reflection layer 104 facing away from the driving board 101 to the driving board 101 is less than or equal to a distance L3 from the side of the light emitting diode chip 102 facing away from the driving board 101 to the driving board 101. For example, the direction from the driving board 101 to the led chip 102 may be as shown in the Z direction in fig. 3, and the distance L2 from the side of the led chip 102 away from the driving board 101 to the driving board 101 may be the thickness of the led chip 102, that is, the distance from the front light emitting surface of the led chip 102 to the driving board 101, at this time, if the distance L3 from the side of the led chip 102 away from the driving board 101 to the driving board 101 is 10 μm, the distance L2 from the side of the reflective layer 104 away from the driving board 101 to the driving board 101 may be 5 μm, 7 μm, 9 μm or 10 μm. By limiting the relationship between the distance L2 from the side of the reflection layer 104 departing from the driving board 101 to the driving board 101 and the distance L3 from the side of the light emitting diode chip 102 departing from the driving board 101 to the driving board 101, the reflection layer 104 does not exceed the light emitting diode chip 102 in the direction from the driving board 101 to the light emitting diode chip 102, so that the phenomenon that the reflection layer 104 excessively blocks the light emitting range of the light emitting diode chip 102 is avoided, the phenomenon that excessive light is excessively concentrated after being reflected by the reflection layer 104 is avoided, and the central brightness of the light emitting diode chip 102 is controlled, so that a user does not feel uncomfortable when using the LED lamp.
EXAMPLE III
Referring to fig. 6, a third embodiment of the present invention discloses a display device 1, and fig. 6 is a schematic structural diagram of a notebook computer using the display device 1, specifically, the display device 1 includes the display panel. It is understood that the display device 1 includes, but is not limited to, a mobile phone, a tablet computer, an electronic reader, a notebook computer, a network television, a wearable device, and other devices with a display function. Because the display device 1 has the display panel, the display device 1 also has all technical effects of the display panel, that is, the convergence of light rays with a larger angle of the light emitting diode chip of the display panel is facilitated, the light condensation effect is improved, and the central brightness of the light emitting diode chip is enhanced. Meanwhile, the light resistance units correspond to the light emitting diode chips one to one and are directly arranged on the driving board of the light emitting diode chips, so that the thickness of the display panel can be controlled, and the light and thin design of the display device 1 can be realized.
The display panel, the manufacturing method thereof, and the display device disclosed in the embodiments of the present invention are described in detail above, and the principle and the embodiment of the present invention are explained in this document by applying specific examples, and the description of the embodiments above is only used to help understanding the display panel, the manufacturing method thereof, the display device, and the core concept thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. A preparation method of a display panel is characterized by comprising the following steps:
providing a light-emitting substrate, wherein the light-emitting substrate comprises a driving board and a plurality of light-emitting diode chips arranged on one side of the driving board;
coating a photoresist material on one side of the driving board, where the light-emitting diode chips are arranged, wherein the photoresist material covers the light-emitting diode chips;
exposing and etching the light resistance material to divide the light resistance material into a plurality of light resistance units, wherein the light resistance units correspond to the light emitting diode chips one by one, and the light resistance units cover the corresponding light emitting diode chips;
and shaping the light resistance unit to enable the outer surface of the light resistance unit to be in a convex arc shape for converging light rays emitted by the corresponding light emitting diode chip.
2. The method as claimed in claim 1, wherein shaping the photoresist unit to form a convex arc-shaped outer surface of the photoresist unit comprises:
and baking the photoresist unit.
3. The method of manufacturing according to claim 2, further comprising:
after baking the light resistance units, carrying out plasma etching on the light resistance units to reduce the size of the light resistance units, and disconnecting the adjacent light resistance units.
4. The method of manufacturing according to claim 1, further comprising:
after the light resistance units are shaped, a reflecting layer is formed on one side, provided with the light emitting diode chip, of the driving board, and the reflecting layer is attached to the periphery of at least one light resistance unit.
5. The manufacturing method according to claim 4, wherein forming a reflective layer on a side of the driving board on which the light emitting diode chip is provided includes:
a mask plate is arranged on one side, away from the driving plate, of the light resistance unit;
and plating a reflecting material on one side of the driving board, which is provided with the light emitting diode chip, in an evaporation mode to form the reflecting layer.
6. The preparation method of claim 4, wherein in the direction from the driving board to the LED chips, the distance from one side of the reflecting layer, which faces away from the driving board, to the driving board is less than or equal to the distance from one side of the LED chips, which faces away from the driving board, to the driving board.
7. A display panel, comprising:
the LED light source comprises a light emitting substrate, a light emitting substrate and a light source, wherein the light emitting substrate comprises a driving board and a plurality of LED chips arranged on one side of the driving board;
the light resistance units are arranged on one side, provided with the light emitting diode chips, of the driving board and formed by exposing and etching light resistance materials, the light resistance units are baked to form a convex arc-shaped outer surface, the light resistance units cover at least one light emitting diode chip and are used for gathering light rays emitted by the corresponding light emitting diode chip.
8. The display panel according to claim 7, wherein adjacent light blocking units are arranged at intervals.
9. The display panel of claim 8, wherein a reflective layer is formed on a side of the driving board where the light emitting diode chip is disposed, and the reflective layer is attached to a periphery of at least one of the light blocking units.
10. A display device comprising a display panel produced by the production method according to any one of claims 1 to 6; alternatively, the first and second liquid crystal display panels may be,
the display device comprising the display panel according to any one of claims 7 to 9.
CN202210732432.6A 2022-06-23 2022-06-23 Display panel, preparation method thereof and display device Pending CN115274755A (en)

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