CN115274522A - Upset centre gripping formula chip packaging mechanism - Google Patents
Upset centre gripping formula chip packaging mechanism Download PDFInfo
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- CN115274522A CN115274522A CN202210947266.1A CN202210947266A CN115274522A CN 115274522 A CN115274522 A CN 115274522A CN 202210947266 A CN202210947266 A CN 202210947266A CN 115274522 A CN115274522 A CN 115274522A
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- limiting
- plate
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- sliding
- limiting frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a turnover clamping type chip packaging mechanism which comprises a packaging body and an upper top plate, wherein the upper top plate is positioned at the upper end of the packaging body, the interior of the packaging body is connected with a limiting frame in a sliding manner, the front end of the limiting frame is connected with a limiting plate, and the rear end of the limiting frame is fixedly provided with a connecting plate; a sliding plate is connected inside the connecting plate in a sliding manner, and a push column is fixedly arranged at the front end of the sliding plate; the limiting device comprises a limiting frame, a plurality of limiting springs, a plurality of supporting columns and a plurality of through grooves, wherein the limiting columns and the supporting columns are arranged on two sides of the inner surface of the limiting frame respectively; the invention is used for solving the technical problems of poor flexibility and stability when chips with different specifications are packaged in the existing scheme.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a turnover clamping type chip packaging mechanism.
Background
Fig. 1 shows a conventional flip-clamp chip packaging mechanism, which can only package chips of a single specification and cannot dynamically package chips of different specifications when operating, so that the chips can be flexibly adjusted while being stably packaged.
Disclosure of Invention
The invention aims to provide a turnover clamping type chip packaging mechanism, which solves the following technical problems: how to solve the not good technical problem of flexibility and stability when different specification chips encapsulate in the current scheme.
The purpose of the invention can be realized by the following technical scheme:
a turnover clamping type chip packaging mechanism comprises a packaging body and an upper top plate, wherein the upper top plate is positioned at the upper end of the packaging body, a limiting frame is slidably connected inside the packaging body, the front end of the limiting frame is connected with a limiting plate, and a connecting plate is fixedly installed at the rear end of the limiting frame; a sliding plate is connected inside the connecting plate in a sliding manner, and a push column is fixedly arranged at the front end of the sliding plate;
the limiting device comprises a limiting frame, a plurality of limiting springs, a plurality of supporting columns and a plurality of through grooves, wherein the limiting columns and the supporting columns are arranged on two sides of the inner surface of the limiting frame respectively;
the lower position inside the limiting plate is rotatably connected with a rotating column, two sides of the limiting plate are fixedly provided with fixing rings, and the rear ends of the fixing rings are provided with connecting springs; spacing post can rotate through spacing spring, and the cooperation support column can carry out the centre gripping to the chip of different specifications, and spacing post and support column can be spacing to the chip from both sides, and the limiting plate passes through the cooperation of rotary column and coupling spring, can carry on spacingly to the chip from the place ahead, stability when effectively having improved the chip encapsulation.
The invention has the further technical improvements that: the limiting plate is connected with the limiting frame through the rotary column and the connecting spring, a plurality of fixing plates are fixedly mounted at the lower end of the packaging body, and a plurality of partition plates are slidably connected between the adjacent fixing plates.
The invention has further technical improvements that: the packaging structure comprises a packaging body and is characterized in that a storage cavity and a first flow guide groove are formed in the packaging body, the first flow guide groove is located below the storage cavity, a plurality of first flow guide holes communicated with the first flow guide groove are formed in the upper surface of the storage cavity, and an arc-shaped first flow distribution plate is arranged in the first flow guide groove.
The invention has further technical improvements that: the rear end of the upper top plate is fixedly provided with a drawing plate, the front end of the upper top plate is provided with a second diversion groove, the lower surface of the upper top plate is provided with a plurality of second diversion holes communicated with the second diversion groove, and an arc-shaped second diversion plate is arranged inside the second diversion groove.
The invention has further technical improvements that: the both sides of encapsulation body upper end are all fixed mounting to be used for going up the gliding upper chute of roof, go up the both sides of roof lower extreme all be provided with the first spout of upper chute assorted.
The invention has the further technical improvements that: the both sides of spacing frame all fixed mounting have the sideslip post, and the both sides of packaging body internal surface all are provided with the second spout with sideslip post looks adaptation.
The invention has further technical improvements that: the push column is positioned between the limiting column and the support column, and the rear end of the sliding plate is fixedly provided with a push plate.
The invention has further technical improvements that: the lower end of one side of the limiting column far away from the packaging body is arc-shaped, and the inner surface of the connecting plate is fixedly connected with a limiting pad in a gluing mode.
The invention has further technical improvements that: a separation groove is arranged among the plurality of separation plates.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the chip packaging device, the limiting frame is used in a matched mode through the limiting column, the supporting column and the limiting plate, chips of different specifications can be limited, the limiting column can rotate through the limiting spring, the chips of different specifications can be clamped through the supporting column in a matched mode, the limiting plate can limit the chips from the front through the matching of the rotating column and the connecting spring, and the stability of the chips during packaging is effectively improved.
2. On the other hand, the limit frame is matched with the push plate and the push column for use, so that chips with different specifications can be adjusted, the push column is pushed by the push plate and the slide plate, so that the positions of the chips with different specifications in the limit frame can be flexibly adjusted, and the flexibility of the chips during packaging is effectively improved; after the packaging body is turned over, the positions of the separation grooves can be adjusted to conduct electricity to the chip more flexibly by adjusting the positions of the separation plates on the fixing plates.
3. In other aspects of the disclosure, the first diversion groove is used in cooperation with the first diversion plate and the first diversion hole, and the first diversion plate can divide heat in the first diversion groove so as to better dissipate heat from the lower part; the second diversion groove is matched with the second diversion plate and the second diversion holes, and the second diversion plate can separate heat in the second diversion groove so as to dissipate heat better from the upper side.
Drawings
The invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of the prior art.
Fig. 2 is a perspective view of the connection between the package body and the position-limiting frame according to the present invention.
Fig. 3 is a structural view of the package body after the upper top plate is separated from the package body.
Fig. 4 is an enlarged view of the invention at a in fig. 3.
Fig. 5 is a partial perspective view of the connection of the spacing post and the spacing spring in the present invention.
FIG. 6 is a perspective view of the connection of the push plate and the push post of the present invention.
Fig. 7 is a partial perspective view of the limiting plate of the invention.
In the figure: 100. a package body; 101. a first diversion trench; 102. a first flow guide hole; 103. an upper sliding column; 104. a fixing plate; 105. a partition plate; 200. an upper top plate; 201. drawing the plate; 202. a second guiding gutter; 300. a limiting frame; 301. a limiting column; 302. a support column; 303. a limiting spring; 304. pushing a plate; 305. pushing the column; 306. a slide plate; 400. a limiting plate; 401. a fixing ring; 402. a connecting spring; 403. turning the column; 500. a connecting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 2 to 7, the present invention is an inverted clamping type chip packaging mechanism, including a packaging body 100 and an upper top plate 200, wherein the upper top plate 200 is located at an upper end of the packaging body 100, the interior of the packaging body 100 is slidably connected with a limiting frame 300, a limiting plate 400 is connected to a front end of the limiting frame 300, the limiting plate 400 is used for limiting a chip from the front, and a connecting plate 500 is fixedly mounted at a rear end of the limiting frame 300; the sliding plate 306 is connected to the inside of the connecting plate 500 in a sliding manner, the limiting pad is fixed to the inner surface of the connecting plate 500 in an adhesive joint mode and used for increasing the friction force between the sliding plate 306 and the connecting plate 500, so that the stability of the sliding plate 306 in the connecting plate 500 is improved, the push column 305 is fixedly installed at the front end of the sliding plate 306, the push plate 304 is fixedly installed at the rear end of the sliding plate 306, the sliding plate 306 is pushed by the push plate 304 to move back and forth in the connecting plate 500, and the push column 305 is driven to move back and forth; the pushing column 305 can flexibly adjust the positions of chips with different specifications in the limiting frame 300 by pushing the pushing plate 304 and the sliding plate 306, so that the flexibility of chip packaging is effectively improved;
the two sides of the inner surface of the limiting frame 300 are both provided with a limiting column 301 and a supporting column 302, the limiting column 301 is positioned above the supporting column 302, the pushing column 305 is positioned between the limiting column 301 and the supporting column 302, the two sides of the inner surface of the limiting frame 300 are also provided with through grooves, a plurality of limiting springs 303 are connected between the limiting column 301 and the through grooves, the lower end of one side, away from the packaging body 100, of the limiting column 301 is arc-shaped, the limiting column 301 is elastically connected with the limiting frame 300 through the plurality of limiting springs 303, the supporting column 302 is fixedly connected with the limiting frame 300, the limiting column 301 can rotate through the limiting springs 303, chips of different specifications can be clamped by matching with the supporting column 302, the limiting column 301 and the supporting column 302 can limit the chips from two sides, and the stability of the chips during packaging is effectively improved;
the lower position inside the limiting plate 400 is rotatably connected with a rotary post 403, two sides of the limiting plate 400 are fixedly provided with fixing rings 401, the rear end of each fixing ring 401 is provided with a connecting spring 402, the limiting plate 400 is connected with the limiting frame 300 through the rotary post 403 and the connecting springs 402, when the limiting plate 400 rotates outwards through the rotary post 403, the rotating angle of the limiting plate 400 is limited through the connecting springs 402, and the limiting plate 400 can be driven to return to the original position through the connecting springs 402, so that the limiting plate 400 can better limit and adjust the chip from the front;
a containing cavity and a first diversion trench 101 are arranged inside the packaging body 100, the first diversion trench 101 is positioned below the containing cavity, a plurality of first diversion holes 102 communicated with the first diversion trench 101 are formed in the upper surface of the containing cavity, an arc-shaped first diversion plate is arranged inside the first diversion trench 101, the first diversion plate divides the first diversion trench 101 into three parts, and heat in the first diversion trench 101 can be separated so as to be better dissipated from the lower part;
the rear end of the upper top plate 200 is fixedly provided with a drawing plate 201, the drawing plate 201 is convenient for moving the upper top plate 200 back and forth, the front end of the upper top plate 200 is provided with a second guide groove 202, the lower surface of the upper top plate 200 is provided with a plurality of second guide holes communicated with the second guide groove 202, an arc-shaped second flow dividing plate is arranged inside the second guide groove 202, the second flow dividing plate also divides the second guide groove 202 into three parts, and the heat in the second guide groove 202 can be divided so as to better dissipate heat from the upper part;
the upper sliding columns 103 for the upper top plate 200 to slide are fixedly mounted on two sides of the upper end of the packaging body 100, and the first sliding grooves matched with the upper sliding columns 103 are formed in two sides of the lower end of the upper top plate 200; the upper top plate 200 moves back and forth at the upper end of the package body 100 through the upper sliding post 103 and the first sliding groove;
side sliding columns are fixedly mounted on two sides of the limiting frame 300, second sliding grooves matched with the side sliding columns are formed in two sides of the inner surface of the packaging body 100, and the limiting frame 300 moves back and forth in the packaging body 100 through the side sliding columns and the second sliding grooves;
the lower end of the package body 100 is fixedly provided with a plurality of fixing plates 104, a plurality of partition plates 105 are connected between the adjacent fixing plates 104 in a sliding manner, the plurality of partition plates 105 are fixedly connected, and partition grooves are formed among the plurality of partition plates 105; the side surfaces of the adjacent fixing plates 104 are provided with third sliding grooves, third sliding columns matched with the third sliding grooves are fixedly mounted on two sides of the partition plates 105, the package body 100 is turned over, the lower end of the package body 100 faces upwards, the positions of the partition grooves are adjusted by sliding of the partition plates 105, and chips of different specifications are more flexibly conducted by adjusting the positions of the partition grooves.
The working principle of the invention is as follows:
when a chip is placed in the package body 100, a pushing force is applied to the pushing plate 304, so that the pushing plate 304 moves from front to back until the pushing plate 304 contacts with the rear end of the connecting plate 500 and pushes the connecting plate 500 to move forward, the limiting frame 300 moves forward on the package body 100 through the pushing of the connecting plate 500, the limiting plate 400 turns outwards through a pulling force, the limiting plate 400 rotates outwards through the rotating column 403, the connecting springs 402 stretch and limit the rotation of the limiting plate 400, one end of the chip is horizontally pushed between the limiting column 301 and the supporting column 302, the chip is continuously pushed until the chip is completely stored in the limiting frame 300, the pushing column 305 is pushed to the rear end of the limiting frame 300, and after the pulling force of the limiting plate 400 is lost, the limiting plate 400 is restored to the original position through the contraction of the connecting springs 402 and is limited for the chip from the front; when chips of different specifications enter the space between the limiting column 301 and the supporting column 302, the chip with larger thickness generates a thrust force on the limiting column 301, so that the limiting column 301 rotates obliquely upwards, the rotation of the limiting column 301 is limited by the contraction of the plurality of limiting springs 303, and the stability and flexibility of the chips of different specifications during packaging can be effectively improved;
pulling connecting plate 500 backward until limiting frame 300 is completely accommodated in packaging body 100, pulling upper top plate 200 backward by drawing plate 201, completely displaying the inner end of packaging body 100, adjusting the position of the chip on packaging body 100 by pushing column 305 and sliding plate 306, pushing sliding plate 306 to drive pushing column 305 to move back and forth, pushing column 305 to push the chip to move forward on limiting frame 300, turning packaging body 100 over, making the lower end of packaging body 100 up, and adjusting the position of the separation groove to conduct electricity to the chip.
In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through two or more elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (9)
1. A turnover clamping type chip packaging mechanism comprises a packaging body (100) and an upper top plate (200), and is characterized in that the interior of the packaging body (100) is connected with a limiting frame (300) in a sliding manner, the front end of the limiting frame (300) is connected with a limiting plate (400), and the rear end of the limiting frame (300) is fixedly provided with a connecting plate (500); a sliding plate (306) is connected inside the connecting plate (500) in a sliding manner, and a push column (305) is fixedly installed at the front end of the sliding plate (306);
both sides of the inner surface of the limiting frame (300) are provided with a limiting column (301) and a supporting column (302), the limiting column (301) is positioned above the supporting column (302), both sides of the inner surface of the limiting frame (300) are also provided with through grooves, and a plurality of limiting springs (303) are connected between the limiting column (301) and the through grooves;
the lower position of limiting plate (400) inside rotates and is connected with rotary column (403), the equal fixed mounting in both sides of limiting plate (400) has solid fixed ring (401), and coupling spring (402) are installed to the rear end of solid fixed ring (401).
2. The flip-chip clamping type chip packaging mechanism according to claim 1, wherein the position-limiting plate (400) is connected to the position-limiting frame (300) through a rotation column (403) and a connection spring (402), a plurality of fixing plates (104) are fixedly mounted at the lower end of the package body (100), and a plurality of separation plates (105) are slidably connected between adjacent fixing plates (104).
3. The flip-chip clamping mechanism of claim 1, wherein the package body (100) has a receiving cavity and a first guiding groove (101), the first guiding groove (101) is located below the receiving cavity, the upper surface of the receiving cavity has a plurality of first guiding holes (102) communicating with the first guiding groove (101), and the first guiding groove (101) has an arc-shaped first splitter plate.
4. The flip-chip clamping mechanism according to claim 1, wherein a pulling plate (201) is fixedly mounted at a rear end of the upper top plate (200), a second guiding groove (202) is disposed at a front end of the upper top plate (200), a plurality of second guiding holes communicated with the second guiding groove (202) are disposed on a lower surface of the upper top plate (200), and an arc-shaped second flow dividing plate is disposed inside the second guiding groove (202).
5. A flip-clip-type chip packaging mechanism according to claim 1, wherein the upper posts (103) for sliding the upper top plate (200) are fixedly mounted on both sides of the upper end of the package body (100), and the first sliding grooves matched with the upper posts (103) are disposed on both sides of the lower end of the upper top plate (200).
6. The flip-chip clamping type chip packaging mechanism according to claim 1, wherein side sliding posts are fixedly mounted on both sides of the limiting frame (300), and second sliding grooves adapted to the side sliding posts are disposed on both sides of the inner surface of the packaging body (100).
7. A flip-chip clamping mechanism according to claim 1, wherein the push rod (305) is located between the position-limiting post (301) and the supporting post (302), and the rear end of the sliding plate (306) is fixedly mounted with the push plate (304).
8. The flip-chip clamping type chip packaging mechanism as claimed in claim 1, wherein the lower end of the side of the limiting column (301) away from the package body (100) is arc-shaped, and the inner surface of the connecting plate (500) is fixed with a limiting pad by glue.
9. A flip-clip-on chip packaging mechanism according to claim 2, wherein a plurality of separation plates (105) have separation grooves therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210947266.1A CN115274522A (en) | 2022-08-09 | 2022-08-09 | Upset centre gripping formula chip packaging mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210947266.1A CN115274522A (en) | 2022-08-09 | 2022-08-09 | Upset centre gripping formula chip packaging mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115274522A true CN115274522A (en) | 2022-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210947266.1A Pending CN115274522A (en) | 2022-08-09 | 2022-08-09 | Upset centre gripping formula chip packaging mechanism |
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| Country | Link |
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| CN (1) | CN115274522A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779496A (en) * | 2023-08-21 | 2023-09-19 | 成都汉芯国科集成技术有限公司 | 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips |
-
2022
- 2022-08-09 CN CN202210947266.1A patent/CN115274522A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779496A (en) * | 2023-08-21 | 2023-09-19 | 成都汉芯国科集成技术有限公司 | 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips |
| CN116779496B (en) * | 2023-08-21 | 2023-12-26 | 成都汉芯国科集成技术有限公司 | 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips |
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