CN115265032A - Low-temperature heat transfer cold shield and vertical test Dewar - Google Patents
Low-temperature heat transfer cold shield and vertical test Dewar Download PDFInfo
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- CN115265032A CN115265032A CN202211205151.1A CN202211205151A CN115265032A CN 115265032 A CN115265032 A CN 115265032A CN 202211205151 A CN202211205151 A CN 202211205151A CN 115265032 A CN115265032 A CN 115265032A
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- heat sink
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- transition ring
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
- F25D3/10—Devices using other cold materials; Devices using cold-storage bodies using liquefied gases, e.g. liquid air
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/12—Measuring magnetic properties of articles or specimens of solids or fluids
- G01R33/1238—Measuring superconductive properties
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- Condensed Matter Physics & Semiconductors (AREA)
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- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a low-temperature heat transfer cold shield and a vertical test Dewar.A structure of the low-temperature heat transfer cold shield comprises a heat sink transition ring which is sleeved on the outer surface of an inner cavity cylinder, and an indium filler is arranged between the inner surface of the heat sink transition ring and the outer surface of the inner cavity cylinder; the heat sink is sleeved at the lower part of the heat sink transition ring and is connected with the heat sink transition ring; and the reinforcing piece is connected with the outer surface of the inner cavity cylinder body, is arranged below the heat sink and is connected with the heat sink. The low-temperature heat transfer cold shield and the vertical test Dewar can solve the problems that the contact rate of the existing connection mode of the heat sink transition ring and the inner cavity cylinder is low and the cold shield cannot be sufficiently supported.
Description
Technical Field
The application relates to the technical field of low-temperature superconducting tests, in particular to a low-temperature heat transfer cold shield and a vertical test Dewar.
Background
The low-temperature heat transfer cold shield is a key device for maintaining the characteristics of a 4.5K helium fluid medium for low-temperature superconduction, and is used as a transition area for dividing different temperature zones.
Because of the limitation of material characteristics, the current inner cavity barrel is manufactured by 304 nonmagnetic stainless steel rolling circle and welding, the heat sink transition ring is manufactured by copper material rolling circle and welding, and the rolled heat sink transition ring is connected with the rolled inner cavity barrel by welding. However, this manufacturing process has the following disadvantages: the inner cavity cylinder and the heat sink transition ring are made of different materials, so that the inner cavity cylinder and the heat sink transition ring can be connected only in a silver brazing welding mode, and the welding defect is that the strength of a welding area is low, and sufficient support for a cold shield cannot be guaranteed; in addition, allowable tolerance exists in the processing and manufacturing process, so that after the inner cavity cylinder and the heat sink transition ring are rounded, the requirement of sufficient surface contact rate between the outer surface of the inner cavity cylinder and the inner surface of the heat sink transition ring cannot be ensured.
Disclosure of Invention
In view of this, an object of the present application is to provide a low-temperature heat transfer cold shield and a vertical testing dewar, which are used to solve the problems that the contact rate of the connection mode between the existing heat sink transition ring and the inner cavity cylinder is low and the cold shield cannot be supported sufficiently.
According to a first aspect of the present invention there is provided a low temperature heat transfer cold shield, wherein the cold shield comprises: the heat sink transition ring is sleeved on the outer surface of the inner cavity barrel, and indium filler is arranged between the inner surface of the heat sink transition ring and the outer surface of the inner cavity barrel; the heat sink is sleeved at the lower part of the heat sink transition ring and is connected with the heat sink transition ring; and the reinforcing piece is connected with the outer surface of the inner cavity cylinder body, is arranged below the heat sink and is connected with the heat sink.
Preferably, the inner surface of the heat sink transition ring is provided with an annular groove, the indium filler is an indium wire, the indium wire is embedded in the annular groove, and the diameter of the indium wire is greater than the depth of the annular groove.
Preferably, the number of the annular grooves is multiple, indium wires are arranged in each annular groove, and the annular grooves are uniformly distributed along the axial direction of the heat sink transition ring.
Preferably, the cross section of the annular groove is square.
Preferably, the annular groove has a trapezoidal cross section.
Preferably, the lower part of the heat sink transition ring is formed with a step surface, the width of the step surface is equal to the thickness of the heat sink, and the heat sink is sleeved on the step surface.
Preferably, the shape of the reinforcing piece is annular, and the reinforcing piece is sleeved on the inner cavity cylinder.
Preferably, the reinforcing member is provided with a plurality of bolt holes along the circumferential direction, the heat sink is provided with a matching hole corresponding to the bolt holes, and the reinforcing member is connected with the heat sink through a bolt.
Preferably, the reinforcing member and the inner cavity cylinder are made of the same material, and the reinforcing member and the inner cavity cylinder are welded with each other.
According to a second aspect of the present invention there is provided a vertical test dewar comprising an inner chamber cylinder and a cold, low temperature heat transfer shield as described above mounted to the inner chamber cylinder.
According to the low-temperature heat transfer cold screen and the vertical test Dewar provided by the embodiment of the invention, the indium filler in the low-temperature heat transfer cold screen can fill the gap between the inner surface of the heat sink transition ring and the outer surface of the inner cavity barrel due to the soft and changeability of the indium filler, so that the contact area between the heat sink transition ring and the inner cavity barrel is increased, the reinforcing piece can support the heat sink and the heat sink transition ring positioned above the heat sink from the lower part, and the whole cold screen is supported, so that the problems that the contact rate of the existing connection mode of the heat sink transition ring and the inner cavity barrel is low and the cold screen cannot be sufficiently supported can be effectively solved.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic view of a low temperature heat transfer cold shield according to the present invention mounted to an inner chamber cylinder.
FIG. 2 is a sectional view of the low temperature heat transfer cold shield according to the present invention mounted to the inner chamber cylinder.
FIG. 3 is a schematic view of a portion of a cryogenic heat transfer cold shield according to the present invention mounted to an inner chamber cylinder.
Fig. 4 is a partial structural schematic view of the low-temperature heat transfer cold shield according to the invention.
Reference numerals: 1-a heat sink transition ring; 11-an annular groove; 12-step surface; 2-heat sink; 3-a reinforcement; 31-a bolt; 32-a nut; 4-indium wire; 5-a cylinder with an inner cavity; 6-low temperature heat transfer cold shield; 61-indium wire cross-sectional diameter; 62-groove width; 63-groove depth; 64-slot pitch; 641-half slot pitch.
Detailed Description
The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, devices, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and/or systems described herein will be apparent to those skilled in the art in view of the disclosure of the present application. For example, the order of operations described herein is merely an example, which is not limited to the order set forth herein, but rather, variations may be made in addition to operations which must occur in a particular order, which will be apparent upon understanding the disclosure of the present application. Moreover, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.
The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and/or systems described herein that will be apparent after understanding the disclosure of the present application.
Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on," "connected to," coupled to, "over," or "overlying" another element, it may be directly "on," "connected to," coupled to, "over," or "overlying" the other element, or one or more other elements may be present therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to," directly coupled to, "directly over" or "directly overlying" another element, there may be no intervening elements present.
As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more of the items.
Although terms such as "first", "second", and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first member, component, region, layer or section discussed in the examples described herein could be termed a second member, component, region, layer or section without departing from the teachings of the examples.
For ease of description, spatial relationship terms such as "above 8230 \8230; above", "upper", "above 8230 \8230; below" and "lower" may be used herein to describe the relationship of one element to another element as shown in the figures. Such spatial relationship terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to other elements would then be oriented "below" or "lower" relative to the other elements. Thus, the terms "over 8230 \ 8230;" above "include both orientations" over 8230; \8230; "over 8230;" under 8230; "depending on the spatial orientation of the device. The device may also be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein should be interpreted accordingly.
The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular forms also are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, quantities, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and/or combinations thereof.
Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, may be expected. Thus, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.
As shown in fig. 1 to 4, according to a first aspect of the present invention, there is provided a low temperature heat transfer cold shield 6, which comprises a heat sink transition ring 1, a heat sink 2 and a stiffener 3.
In the following description, a specific structure of the above components of the low temperature heat transfer cold shield 6 and a connection relationship of the above components will be specifically described with reference to fig. 1 to 4.
As shown in fig. 1 to 4, in an embodiment, the heat sink transition ring 1 is configured to fit over the outer surface of the inner cavity cylinder 5, and may be located at a position above the middle of the inner cavity cylinder 5. And an indium filler can be arranged between the inner surface of the heat sink transition ring 1 and the outer surface of the inner cavity cylinder 5. The heat sink 2 can be sleeved on the lower part of the heat sink transition ring 1 and is fixedly connected with the heat sink transition ring 1. The reinforcing member 3 is fixed on the outer surface of the inner cavity cylinder 5, and can be positioned below the heat sink 2 and fixedly connected with the heat sink 2 to support the whole structure of the low-temperature heat transfer cold screen 6.
Preferably, as shown in fig. 1-4, in an embodiment, the heat sink transition ring 1 may be formed as an annular member having a larger dimension along the axial direction of the inner cavity cylinder 5 and a smaller dimension along the radial direction of the inner cavity cylinder 5. The inner diameter of the heat sink transition ring 1 may be equal to the outer diameter of the inner cavity cylinder 5, but due to the factors such as shape tolerance, there is still a gap between the inner surface of the heat sink transition ring 1 and the outer surface of the inner cavity cylinder 5. Therefore, the inner surface of the heat sink transition ring 1 can be provided with the annular groove 11, and the indium filler is placed in the annular groove 11, so that the indium deformed by pressure is filled in the gap between the inner surface of the heat sink transition ring 1 and the outer surface of the inner cavity cylinder 5 by utilizing the physical characteristic that the indium material is low in hardness and easy to deform, and the surface contact rate of the heat sink transition ring 1 and the inner cavity cylinder 5 is increased, thereby improving the heat transfer effect of the heat sink transition ring 1 and the inner cavity cylinder 5.
Specifically, as shown in fig. 1 to 4, in the embodiment, the number of the annular grooves 11 may be plural. The annular grooves 11 may be formed in the inner surface of the heat sink transition ring 1 and coaxial with the heat sink transition ring 1, and are uniformly arranged along the axial direction of the heat sink transition ring 1, and the annular grooves 11 are all arranged in parallel. The indium filler may be indium wire 4. In particular, the indium wire 4 may enclose a ring shape as shown in the embodiments. The diameter of the ring surrounded by the indium wire 4 can be equal to the diameter of the annular groove 11, so that the ring surrounded by the indium wire 4 can be just embedded into the annular groove 11, the diameter of the indium wire 4 can be larger than the depth of the annular groove 11, namely, part of the indium wire 4 still exposes out of the annular groove 11 after being embedded into the annular groove 11, the indium wire 4 can overflow out of the annular groove 11 after being extruded and deformed, and the indium wire is filled in the surrounding gap, so that the surface contact rate of the heat sink transition ring 1 and the inner cavity cylinder 5 is increased. The indium wires 4 can be arranged in the annular grooves 11, so that the indium wires 4 can completely fill gaps at various positions between the heat sink transition ring 1 and the inner cavity cylinder 5.
Preferably, in an embodiment, the heat sink transition ring 1 may be made of copper material or aluminum material. As shown in fig. 4, adjacent annular grooves 11 may be spaced apart by a distance of 64 slots, and the distance between the uppermost annular groove 11 of the heatsink transition ring 1 and the top surface of the heatsink transition ring 1 may be a half slot spacing 641, i.e., a half slot spacing 64.
Further, preferably, as shown in fig. 1 to 4, in an embodiment, the cross section of the annular groove 11 may be square, that is, the shape of the groove of the annular groove 11 may be square, so that the difficulty of machining the inner surface of the heat sink transition ring 1 may be reduced, and the square groove is easy to cut and form, so that the machining cost may be reduced.
Preferably, in another embodiment, the cross section of the annular groove 11 may be trapezoidal, that is, the shape of the groove of the annular groove 11 may be trapezoidal, which is more advantageous for the installation of the indium wire 4, so that the indium wire 4 can be better embedded in the groove, and the opening direction of the trapezoid has a guiding effect, which can guide the filling direction of the indium wire 4 after deformation to some extent.
As shown in fig. 4, in the example, the filling ratio of the indium wire 4 was calculated as follows:
the diameter 61 of the section of the indium wire is Dmm; size of annular groove 11: the groove width 62 is am, and the groove depth 63 is bmm; the allowable processing gap between the outer surface of the inner cavity cylinder 5 and the inner surface of the heat sink transition ring 1 is cmm; the slot pitch 64 is dmm;
the cross-sectional area S1= Π x (Dmm/2) of the indium wire 4 has been selected from the original apparatus;
groove cross-sectional area S2= groove width 62x groove depth 63= ammxbmmm = abmm;
a gap area S3= cmm × dmm = cdmm between the outer surface of the inner cavity cylinder 5 and the inner surface of the heat sink transition ring 1;
filling ratio of indium wire 4%: (S1-S2)/S3%;
filling ratio of indium wire 4:
| diameter D of indium wire cross section | 3mm | 3mm | 3mm |
| Cross-sectional area S1 of indium wire | 7 .1 |
7 .1 |
7 .1 |
| Width of groove a | 3mm | 3mm | 3mm |
| Depth of |
1 .5 |
1 .5 mm | 1mm |
| Cross-sectional area S2 of the |
4 .5 |
4.5 |
3 |
| Groove clearance c | 0 .3 mm | 0.3 mm | 0.4 mm |
| |
1 1 mm | 10 |
1 1 mm |
| Area of |
3 .3 |
3 |
4.4 |
| Filling ratio of indium wire% | 7 8.8 ％ | 86.7 ％ | 93.2 ％ |
Since the machining process capability of different companies may be different in practical situations, the size of the gap between the outer surface of the inner cavity cylinder 5 and the inner surface of the heat sink transition ring 1 and the size of the annular groove 11 are not limited herein, and an appropriate machining process may be selected in combination with the actual machining level.
Preferably, as shown in fig. 1 to 4, in an embodiment, the heat sink 2 may be formed as an annular member having a larger radial dimension along the inner cavity cylinder 5 and a smaller axial dimension along the inner cavity cylinder 5. The heat sink 2 may be sleeved on the lower portion of the heat sink transition ring 1, and is welded and fixed with the heat sink transition ring 1. Heatsink 2 may be used for a temperature range of 50K-80K, with heatsink 2 preferably being an 80K heatsink. Specifically, as shown in fig. 3, in an embodiment, a stepped surface 12 may be formed at a lower portion of the heat sink transition ring 1, that is, an annular stepped portion with a constant inner diameter size and a reduced outer diameter size is formed at a bottom portion of the heat sink transition ring 1, and the stepped surface 12 is an annular outer surface of the annular stepped portion. Further, preferably, the width of the stepped surface 12 may be equal to the thickness of the heat sink 2 (i.e., the size of the stepped surface 12 is equal to the size of the heat sink 2 in the axial direction of the inner cavity barrel 5), and the inner diameter of the heat sink 2 is equal to the size of the outer diameter of the annular step portion, so that the heat sink 2 can be properly sleeved on the stepped surface 12.
Furthermore, in an embodiment, the heat sink transition ring 1 and the heat sink 2 may be integrally formed, that is, both may be formed by machining a whole blank, so that incomplete contact between the heat sink transition ring 1 and the heat sink 2 due to improper fit relationship may be avoided.
Preferably, as shown in fig. 1 to 3, in an embodiment, the reinforcing member 3 may have a ring shape. The reinforcement 3 can likewise be formed as an annular element with a larger radial dimension along the interior cylinder 5 and a smaller axial dimension along the interior cylinder 5. The thickness of the stiffener 3 may be smaller than that of the heat sink 2, and the outer diameter of the stiffener 3 may have a size smaller than that of the heat sink 2. Further, the reinforcing member 3 and the inner chamber cylinder 5 may be made of the same material, i.e., both may be made of 304 nonmagnetic stainless steel. The inner diameter of the reinforcement 3 may be equal to the outer diameter of the inner chamber cylinder 5, and the inner surface of the reinforcement 3 is welded to the outer surface of the inner chamber cylinder 5, thereby fixing the reinforcement 3 to the outer surface of the inner chamber cylinder 5. The upper surface of the reinforcing member 3 can abut against the bottom surface of the heat sink 2 and the bottom surface of the heat sink transition ring 1 to support the low-temperature heat transfer cold shield 6 integrally.
Preferably, as shown in fig. 1 to 3, in an embodiment, the reinforcement 3 and the heat sink 2 may be connected by bolts 31. Specifically, a plurality of bolt holes may be uniformly formed in the plate surface of the reinforcement 3 in the circumferential direction, the heat sink 2 may have a fitting hole at a position corresponding to each of the bolt holes, and the reinforcement 3 and the heat sink 2 are fixed by bolts 31 and nuts 32. Bolts 31 equal in number to the bolt holes are inserted through the bolt holes and the fitting holes corresponding to the positions of the bolt holes, respectively, and the bolts 31 are fastened by nuts 32, whereby the reinforcing member 3 and the heat sink 2 are fixed.
However, without being limited thereto, the reinforcement is formed in a ring shape only as a preferable case in the embodiment, and the reinforcement may be formed in other cases as long as the support function of the reinforcement can be achieved, for example, the reinforcement is a plurality of bar-shaped reinforcing ribs protruding in the radial direction of the inner cavity cylinder, the end portions of the bar-shaped reinforcing ribs are welded to the outer surface of the inner cavity cylinder, and the bar-shaped reinforcing ribs are uniformly distributed on the outer surface of the inner cavity cylinder in the circumferential direction and are fixedly connected to the heat sink respectively by bolts, so that the support function of the reinforcement can be achieved as well.
Furthermore, according to a second aspect of the present invention, there is provided a vertical test dewar comprising an inner chamber cylinder, which may be the inner chamber cylinder 5 in the above-described embodiment, and a low temperature heat transfer cold shield, which may be the low temperature heat transfer cold shield 6 in the above-described embodiment, as well as the above-described low temperature heat transfer cold shield, the low temperature heat transfer cold shield 6 being mounted to the inner chamber cylinder 5.
In the actual use process, the indium wire 4 is arranged between the heat sink transition ring 1 of the low-temperature heat transfer cold shield 6 and the inner cavity cylinder 5 and used as a filler, and the indium wire 4 fills the gap between the heat sink transition ring 1 and the inner cavity cylinder 5 after being compressed and deformed, so that the surface contact rate of the heat sink transition ring 1 and the inner cavity cylinder 5 is increased, and the heat transfer effect is improved. And the reinforcing member 3 can be welded and fixed with the inner cavity cylinder 5, and the welding strength is enough to support the heat sink transition ring 1 and the heat sink 2 above the reinforcing member, so that the low-temperature heat transfer cold shield 6 is effectively supported integrally.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present application, and are used for illustrating the technical solutions of the present application, but not limiting the same, and the scope of the present application is not limited thereto, and although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still make modifications or changes to the embodiments described in the foregoing embodiments, or make equivalent substitutions for some features, within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present application and are intended to be covered by the appended claims. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A low temperature heat transfer cold shield for installation in the inner chamber cylinder of a vertical test dewar, said low temperature heat transfer cold shield comprising:
the heat sink transition ring is sleeved on the outer surface of the inner cavity cylinder, and indium filler is arranged between the inner surface of the heat sink transition ring and the outer surface of the inner cavity cylinder;
the heat sink is sleeved at the lower part of the heat sink transition ring and is connected with the heat sink transition ring; and
the reinforcing piece is connected with the outer surface of the inner cavity cylinder, is arranged below the heat sink and is connected with the heat sink.
2. The cold shield for low-temperature heat transfer according to claim 1, wherein an annular groove is formed in the inner surface of the heat sink transition ring, the indium filler is indium wire, the indium wire is embedded in the annular groove, and the diameter of the indium wire is larger than the depth of the annular groove.
3. The cold shield for low-temperature heat transfer according to claim 2, wherein the number of the annular grooves is multiple, indium wires are arranged in each annular groove, and the annular grooves are uniformly distributed along the axial direction of the heat sink transition ring.
4. A cold shield according to claim 3, wherein the cross-section of the annular groove is square.
5. A cold shield according to claim 3, wherein the cross-section of the annular groove is trapezoidal.
6. The cold shield for low-temperature heat transfer according to claim 1, wherein a stepped surface is formed at the lower part of the heat sink transition ring, the width of the stepped surface is equal to the thickness of the heat sink, and the heat sink is sleeved on the stepped surface.
7. A cold shield according to claim 1, wherein said reinforcing member is annular in shape, said reinforcing member being sleeved on said inner chamber cylinder.
8. The cold shield for low-temperature heat transfer according to claim 7, wherein the reinforcing member is provided with a plurality of bolt holes along the circumferential direction, the heat sink is provided with matching holes corresponding to the positions of the bolt holes, and the reinforcing member is connected with the heat sink through bolts.
9. The cold shield according to any of claims 1 to 8, wherein the reinforcement and the inner chamber cylinder are made of the same material and are welded to each other.
10. A vertical test dewar comprising an inner chamber cylinder and the low temperature heat transfer cold shield of any one of claims 1 to 9 mounted thereto.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211205151.1A CN115265032B (en) | 2022-09-30 | 2022-09-30 | Low-temperature heat transfer cold shield and vertical test Dewar |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211205151.1A CN115265032B (en) | 2022-09-30 | 2022-09-30 | Low-temperature heat transfer cold shield and vertical test Dewar |
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| CN115265032B CN115265032B (en) | 2022-12-13 |
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|---|---|---|---|---|
| JPH05275231A (en) * | 1992-03-27 | 1993-10-22 | Mitsubishi Electric Corp | Superconductive magnet and its assembling method |
| CN1820885A (en) * | 2006-03-24 | 2006-08-23 | 中国科学院上海技术物理研究所 | Vacuum seal welding method for window and optic window of low temperature metal Dewar |
| CN101540206A (en) * | 2009-04-15 | 2009-09-23 | 中国科学院物理研究所 | External compression type low-thermoresistance separable heat sinking structure |
| CN102435321A (en) * | 2011-11-10 | 2012-05-02 | 中国科学院上海技术物理研究所 | High-compatibility multifunctional testing Dewar for split type Dewar heat load test |
| CN104200950A (en) * | 2014-09-19 | 2014-12-10 | 西安聚能超导磁体科技有限公司 | Conduction-cooled superconducting magnet refrigerating machine structure and mounting and dismounting method thereof |
| CN106960713A (en) * | 2017-03-23 | 2017-07-18 | 杭州图锐科技有限公司 | A kind of refrigeration machine for superconducting magnet it is jacket structured and its install, method for dismounting |
| CN212511917U (en) * | 2020-05-15 | 2021-02-09 | 宁波高思超导技术有限公司 | Mounting structure of liquid helium-free superconducting magnet refrigerator |
-
2022
- 2022-09-30 CN CN202211205151.1A patent/CN115265032B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275231A (en) * | 1992-03-27 | 1993-10-22 | Mitsubishi Electric Corp | Superconductive magnet and its assembling method |
| CN1820885A (en) * | 2006-03-24 | 2006-08-23 | 中国科学院上海技术物理研究所 | Vacuum seal welding method for window and optic window of low temperature metal Dewar |
| CN101540206A (en) * | 2009-04-15 | 2009-09-23 | 中国科学院物理研究所 | External compression type low-thermoresistance separable heat sinking structure |
| CN102435321A (en) * | 2011-11-10 | 2012-05-02 | 中国科学院上海技术物理研究所 | High-compatibility multifunctional testing Dewar for split type Dewar heat load test |
| CN104200950A (en) * | 2014-09-19 | 2014-12-10 | 西安聚能超导磁体科技有限公司 | Conduction-cooled superconducting magnet refrigerating machine structure and mounting and dismounting method thereof |
| CN106960713A (en) * | 2017-03-23 | 2017-07-18 | 杭州图锐科技有限公司 | A kind of refrigeration machine for superconducting magnet it is jacket structured and its install, method for dismounting |
| CN212511917U (en) * | 2020-05-15 | 2021-02-09 | 宁波高思超导技术有限公司 | Mounting structure of liquid helium-free superconducting magnet refrigerator |
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| CN115265032B (en) | 2022-12-13 |
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