CN115260705A - Reactor epoxy resin insulation layer crack repair material and preparation method thereof - Google Patents
Reactor epoxy resin insulation layer crack repair material and preparation method thereof Download PDFInfo
- Publication number
- CN115260705A CN115260705A CN202210634353.1A CN202210634353A CN115260705A CN 115260705 A CN115260705 A CN 115260705A CN 202210634353 A CN202210634353 A CN 202210634353A CN 115260705 A CN115260705 A CN 115260705A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- parts
- reactor
- boron nitride
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The invention discloses a reactor epoxy resin insulating layer crack repairing material which comprises, by weight, 30-40 parts of epoxy resin, 30-40 parts of an epoxy resin curing agent, 10-20 parts of an epoxy resin diluent, 0.6-1 part of an accelerator, 5-30 parts of flaky boron nitride and 0.5-1 part of a carbon nano tube. The invention also discloses a preparation method of the crack repairing material for the epoxy resin insulating layer of the reactor. According to the invention, the flaky boron nitride has excellent heat-conducting property, the insulating property can be improved, the functionalized multi-walled carbon nanotubes can cooperatively form a phonon channel, the heat-conducting property of the material is improved, and the functionalized multi-walled carbon nanotubes and the base material form covalent bonding to improve the mechanical and interphase bonding capability of the material. The thinner can increase the fluidity of the material, ensure that the repairing material can enter tiny cracks for repairing, and has wide application prospect in the insulation repairing of the dry-type reactor which has huge storage and adopts the epoxy resin as the main insulation.
Description
Technical Field
The invention relates to the field of new materials, in particular to a crack repairing material for an epoxy resin insulating layer of a reactor and a preparation method thereof.
Background
With the rapid increase of global electricity consumption, the requirements of the power utilization end on the stability and the electric energy quality of a power grid are increased day by day, and various reactors widely installed in the power grid are key equipment for inhibiting the fluctuation of the power grid and maintaining the fault voltage of a bus; in an extra-high voltage direct current transmission project, the saturable reactor plays an important role in normal on-off of the converter valve. Currently, epoxy resin is generally used for integral casting in insulation design of a reactor to meet the requirement of equipment on insulation, but epoxy resin has low thermal conductivity (0.19 W.m)-1K-1) Limited thermal management capability, which tends to result in heat build-up. Meanwhile, a large amount of impact current enables the reactor winding to be under the action of frequent and large electromagnetic force, and then the electromagnetic force is transmitted to the epoxy resin insulating layer. Therefore, the epoxy resin insulating layer is aged and cracked in the using process, and further insulation failure occurs.
The insulation fault of the insulating layer of one large reactor can be caused and the large reactor can quit operation due to the crack, and new equipment is replaced, so that additional expenses are brought to power enterprises. The prior art is to improve the thermal conductivity of insulation and further reduce the damage caused by thermal expansion of the insulation and prolong the service life of epoxy resin by improving the mechanical property of polymer materials. However, the attention of technicians is always paid to repairing cracked epoxy insulation under the condition of ensuring that the basic performance of the insulation layer of the reactor is not affected.
Disclosure of Invention
Based on the technical problems that the existing insulating layer crack repairing material is insufficient in insulation, interface combination condition and heat conduction performance, and the cracked epoxy resin insulating layer is difficult to repair without damage or prolong the service life, the invention provides the reactor epoxy resin insulating layer crack repairing material and the preparation method thereof.
In order to solve the technical problem, the invention provides a reactor epoxy resin insulating layer crack repairing material which comprises, by weight, 30-40 parts of epoxy resin curing agent, 10-20 parts of epoxy resin diluent, 0.6-1 part of accelerator, 5-30 parts of flaky boron nitride and 0.5-1 part of carbon nano tube.
In a further technical scheme, the carbon nano tube is a surface functionalized multi-wall carbon nano tube.
In a further technical scheme, the carbon nano tube is a multi-wall carbon nano tube grafted with a functional group after surface functionalization treatment.
In a further technical scheme, the particle size of the flaky boron nitride is 5-25 μm, and the flaky boron nitride is obtained by stripping corresponding particle size h-BN.
In a further technical scheme, the epoxy resin is bisphenol A epoxy resin E51 or bisphenol A epoxy resin E44.
In a further embodiment, the epoxy resin diluent is AGE (C12-14 alkyl glycidyl ether) or BGE (butyl glycidyl ether).
In order to solve the technical problem, the invention also provides a preparation method of the crack repairing material for the epoxy resin insulating layer of the reactor, which comprises the following steps:
a. selecting 30-40 parts by weight of epoxy resin, 30-40 parts by weight of epoxy resin curing agent, 10-20 parts by weight of epoxy resin diluent, 0.6-1 part by weight of accelerator, 5-30 parts by weight of flaky boron nitride and 0.5-1 part by weight of carbon nano tube as preparation raw materials, selecting 1-2 parts by weight of solvent, adding the carbon nano tube and the flaky boron nitride into the solvent, and performing ultrasonic treatment for more than 30 minutes to uniformly disperse the carbon nano tube and the flaky boron nitride to obtain a filler solution;
b. premixing epoxy resin, an epoxy resin curing agent and an accelerator according to a preset proportion to obtain a resin base material;
c. adding the filler solution into a resin base material, stirring to uniformly disperse the filler solution in the resin base material, and degassing to obtain the repair material.
In a further technical scheme, in the step a, the solvent is one of acetone, isopropanol or absolute ethyl alcohol.
In a further technical scheme, in the step c, the stirring speed of the filler solution after being added into the resin base material is 200-500 r/min for 1-1.5 hours; finally, the speed is increased to 1500 rpm for 5 minutes.
In a further technical scheme, in the step c, the degassing is carried out by heating to 60 ℃ in a vacuum environment, standing for 20-30 minutes, repeating twice and cooling to room temperature to obtain the repair material.
The invention has the beneficial effects that:
a. compared with the prior art, the repair material for the epoxy resin insulating layer of the reactor provided by the invention takes the epoxy resin as a matrix and takes two materials with different scales, namely the flaky boron nitride and the carbon nano tube, as fillers. The boron nitride has excellent heat conducting performance and insulating capacity, the multi-walled carbon nano tube can form a phonon channel and has great enhancement effect on the mechanical property of epoxy resin and the bonding performance of an interface, and the multi-walled carbon nano tube can form a multi-site and multi-dimensional heat transfer channel between the sheet-shaped boron nitride. After the surface of the multi-walled carbon nanotube is modified, functional groups such as epoxy groups or amino groups are connected, so that the crosslinking degree of the carbon nanotube and a resin substrate can be increased, and the mechanical property is improved; meanwhile, the carbon nano tube and the resin substrate are covalently bonded through the functional group, so that the difference of phonon spectrums of the carbon nano tube and the resin substrate is reduced, the scattering of phonons is reduced, the interface thermal resistance is further reduced, and the heat conduction performance of the repair material is improved.
b. The epoxy resin diluent is added, so that the resin base material and the filler with high volume fraction still have strong fluidity after being fully mixed, can be quickly degassed, and can penetrate into tiny cracks of the epoxy resin insulating layer of the reactor to be cured after the cracks are filled, and the insulating layer can be repaired. And the existence of the epoxy resin diluent can also react with functional groups on the surface of the carbon nano tube, so that the crosslinking density is improved, and the mechanical property is improved.
c. Experiments prove that the particle size of the flaky boron nitride is 5-25 mu m, the multi-walled carbon nano tube needs to be subjected to ultrasonic treatment to unwind and cut off, and the performance is excellent when the surface functional group is AGE, BGE or amino. The boron nitride material with the specific grain diameter is selected mainly because the flaky boron nitride with the size has better crystal form, the heat conductivity of the repair material can be improved better, in addition, the hexagonal boron nitride with the grain diameter is easier to strip, and the yield of the flaky boron nitride is higher. The multi-walled carbon nanotube is adopted because the multi-walled carbon nanotube has more nanotube branches, and is more significant for the construction of a heat conduction channel and the improvement of the mechanical properties of all parts of the resin base material. And AGE, BGE and amino are selected as surface functional groups, so that the surface functional groups are more tightly combined with the base material, and meanwhile, the carbon nano tubes and the crack surface of the reactor insulating layer have better interphase combination capability, and the crack repairing capability is optimized.
d. Compared with the prior art, the preparation method of the repair material for the epoxy resin insulating layer of the reactor, provided by the invention, changes the adding sequence of the filler in the preparation process, firstly utilizes the solvent to uniformly disperse the filler in the liquid phase, and then adds the filler into the resin base material, so that the dispersion effect of the filler is improved, and the improvement of the overall mechanical performance and the construction of the heat conducting network are facilitated.
Drawings
FIG. 1 is a schematic diagram of example 1 and comparative examples 1, 2 and 3 of the present invention;
FIG. 2 is a schematic view of a repair interface between example 1 of the present invention and comparative examples 1, 2 and 3;
FIG. 3 is a graph comparing the thermal conductivity of examples 1 and 2 of the present invention with comparative examples 1, 2 and 3;
FIG. 4 is a graph comparing the insulation performance of example 1 of the present invention with comparative examples 1, 2, and 3;
FIG. 5 is a graph comparing the dielectric loss performance of examples 1 and 2 of the present invention with that of comparative examples 1, 2 and 3;
FIG. 6 is a perspective view of the liquid nitrogen cooled brittle fracture in example 1 of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In the following examples, the epoxy resin, the curing agent and the accelerator are the types commonly used in the art, specifically: bisphenol A type E51 epoxy resin, methyltetrahydrophthalic anhydride (curing agent), 2,4,6-tris (dimethylaminomethyl) phenol (accelerator).
Example 1:
the embodiment provides a reactor epoxy resin insulating layer repairing material, which comprises, by mass, 40 parts of epoxy resin, 10 parts of epoxy resin diluent, 40 parts of curing agent, 1 part of accelerator, 10 parts of flaky boron nitride and 0.5 part of carbon nanotubes.
The preparation method comprises the following steps:
(1) weighing each filler and 1.5 parts of acetone according to a formula, adding the fillers into the acetone, and carrying out ultrasonic treatment for 1 hour to obtain a filler solution;
(2) premixing epoxy resin, a curing agent and an accelerator according to a proportion to obtain a resin base material;
(3) adding a filler solution into a resin base material, stirring for 1.5 hours at 500r/min to uniformly disperse the filler solution in the resin base material, putting the resin base material into a vacuum environment, and degassing for 30 minutes at 60 ℃ to obtain a liquid repair material;
(4) pouring the obtained repairing material into a mold, paving a polyimide film (serving as an epoxy resin insulating layer needing to be repaired in actual use) below the mold, placing the mold in an environment with the temperature of 120 ℃ for heat preservation for 4 hours, cooling to room temperature, and removing the polyimide film to obtain a repairing interface of the sample of the repairing material.
Example 2:
the embodiment provides a reactor epoxy resin insulating layer repairing material, which comprises, by mass, 40 parts of epoxy resin, 10 parts of epoxy resin diluent, 40 parts of curing agent, 1 part of accelerator, 30 parts of flaky boron nitride and 0.5 part of carbon nano tube.
The preparation method comprises the following steps:
(1) weighing each filler and 1.5 parts of acetone according to a formula, adding the filler into the acetone, and carrying out ultrasonic treatment for 1 hour to obtain a filler solution;
(2) premixing epoxy resin, a curing agent and an accelerator according to a proportion to obtain a resin base material;
(3) adding a filler solution into a resin base material, stirring for 1.5 hours at 500r/min to uniformly disperse the filler solution in the resin base material, placing the resin base material in a vacuum environment, and degassing for 30 minutes at 60 ℃ to obtain a liquid repair material;
(4) pouring the obtained repairing material into a mold, paving a polyimide film (serving as an epoxy resin insulating layer needing to be repaired in actual use) below the mold, placing the mold in an environment with the temperature of 120 ℃ for heat preservation for 4 hours, cooling to room temperature, and removing the polyimide film to obtain a repairing interface of the sample of the repairing material.
Comparative example 1 (without filler):
the comparative example provides a common resin material, and the raw materials of the common resin material comprise, by mass, 40 parts of epoxy resin, 10 parts of epoxy resin diluent, 40 parts of curing agent and 1 part of accelerator.
The preparation method of the resin material specifically comprises the following steps:
(1) premixing epoxy resin, a curing agent and an accelerant in proportion to obtain a resin base material;
(2) stirring for 1.5 hours at 500r/min to fully mix the resin base materials, putting the resin base materials into a vacuum environment, and degassing for 30 minutes at 60 ℃ to obtain a liquid repairing material;
(3) pouring the obtained repairing material into a mold, paving a polyimide film (serving as an epoxy resin insulating layer needing to be repaired in actual use) below the mold, placing the mold in an environment with the temperature of 120 ℃ for heat preservation for 4 hours, cooling to room temperature, and removing the polyimide film to obtain a repairing interface of the resin material sample.
Comparative example 2 (no carbon nanotubes):
the comparative example provides a common resin material, and the raw materials of the common resin material comprise, by mass, 40 parts of epoxy resin, 10 parts of epoxy resin diluent, 40 parts of curing agent, 1 part of accelerator and 10 parts of flaky boron nitride.
The preparation method of the resin material specifically comprises the following steps:
(1) weighing each filler and 1.5 parts of acetone according to a formula, adding the fillers into the acetone, and carrying out ultrasonic treatment for 1 hour to obtain a filler solution;
(2) premixing epoxy resin, a curing agent and an accelerator according to a proportion to obtain a resin base material;
(3) adding a filler solution into a resin base material, stirring for 1.5 hours at 500r/min to uniformly disperse the filler solution in the resin base material, putting the resin base material into a vacuum environment, and degassing for 30 minutes at 60 ℃ to obtain a liquid repair material;
(4) pouring the obtained repairing material into a mold, paving a polyimide film (serving as an epoxy resin insulating layer needing to be repaired in actual use) below the mold, placing the mold in an environment with the temperature of 120 ℃ for heat preservation for 4 hours, cooling to room temperature, and removing the polyimide film to obtain a repairing interface of the resin material sample.
Comparative example 3 (no boron nitride):
the comparative example provides a common resin material, and the raw materials of the common resin material comprise, by mass, 40 parts of epoxy resin, 10 parts of epoxy resin diluent, 40 parts of curing agent, 1 part of accelerator and 0.5 part of carbon nano tube.
The preparation method of the resin material specifically comprises the following steps:
(1) weighing each filler and 1.5 parts of acetone according to a formula, adding the fillers into the acetone, and carrying out ultrasonic treatment for 1 hour to obtain a filler solution;
(2) premixing epoxy resin, a curing agent and an accelerator according to a proportion to obtain a resin base material;
(3) adding a filler solution into a resin base material, stirring for 1.5 hours at 500r/min to uniformly disperse the filler solution in the resin base material, putting the resin base material into a vacuum environment, and degassing for 30 minutes at 60 ℃ to obtain a liquid repair material;
(4) pouring the obtained repairing material into a mold, paving a polyimide film (serving as an epoxy resin insulating layer needing to be repaired in actual use) below the mold, placing the mold in an environment with the temperature of 120 ℃ for heat preservation for 4 hours, cooling to room temperature, and removing the polyimide film to obtain a repairing interface of the resin material sample.
The appearance and performance of the materials prepared in examples 1 and 2 and comparative examples 1 to 3 were tested, and the specific test methods and test results were as follows:
(1) Appearance:
the pictures of the resin material obtained in example 1 and comparative examples 1 to 3 of the present invention are shown in FIGS. 1 and 2. As can be seen from fig. 1, the cured repair material is consistent with the appearance of the epoxy resin insulation material, and is consistent with the appearance of the insulation layer of the dry reactor after being polished. As can be seen from FIG. 2, after the repairing material is cured on the scraped film, the interface of the film is uncovered, and large and small stripe marks appear, which indicates that the repairing material better penetrates into the gap and can play a better role in the interface bonding and repairing of the gap.
(2) Thermal conductivity:
the thermal conductivity of the resin material was measured by a heat flow method, and the measurement results are shown in fig. 3.
The thermal conductivity of examples 1, 2 is very significantly improved compared to the comparative examples. Under the condition of a lower doping proportion, the micron-sized sheet boron nitride and the nanometer-sized multi-walled carbon nanotubes act synergistically, on the premise of ensuring the fluidity, a multi-scale phonon channel is constructed, and the phonon scattering is further reduced by covalent bonding brought by surface functionalization, so that the thermal conductivity of the material is respectively improved by 67.49% and 91.60% compared with the case that the filler is added independently (comparative example 2 and comparative example 3). The effectiveness of internal filler multi-scale matching in improving the heat conduction performance is proved.
(3) Resistivity of
The ac resistivity of the sample material was measured, and the measurement results are shown in fig. 4.
After the filler is doped, the resistivity of the example is reduced because the carbon nanotube itself has excellent conductivity, which results in the reduction of the insulation performance (comparative example 3), but the filling of boron nitride can increase the insulation level of the sample (comparative example 2), and thus the excellent insulation performance is still achieved in the case of the filler mixed with the carbon nanotube.
(4) Dielectric loss
The dielectric loss angle Tan delta of the material sample wafer is tested, the detection result is shown in fig. 5, and the dielectric loss of the material is small as a whole and lower than 0.02, the material is a low-dielectric-loss material and has good performance.
(5) Microstructure of cross section
The sample was treated with liquid nitrogen and then brittle, and the cross-sectional structure was observed by SEM as shown in fig. 6. It can be seen that the lamellar boron nitride is well embedded in the resin substrate.
The above embodiments only express specific embodiments of the present invention, and the description is specific and detailed, but not to be understood as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. The crack repairing material for the epoxy resin insulating layer of the reactor is characterized by comprising, by weight, 30-40 parts of epoxy resin, 30-40 parts of an epoxy resin curing agent, 10-20 parts of an epoxy resin diluent, 0.6-1 part of an accelerator, 5-30 parts of flaky boron nitride and 0.5-1 part of a carbon nano tube.
2. The reactor epoxy resin insulation layer crack repair material as set forth in claim 1, wherein the carbon nanotubes are surface-functionalized multi-walled carbon nanotubes.
3. The reactor epoxy resin insulation layer crack repairing material according to claim 1 or 2, wherein the carbon nanotubes are multi-walled carbon nanotubes with functionalized groups grafted thereto after surface functionalization treatment.
4. The reactor epoxy resin insulation layer crack repairing material as set forth in claim 1, wherein the flaky boron nitride has a particle size of 5-25 μm and is obtained by peeling off a corresponding particle size h-BN.
5. The reactor epoxy resin insulation layer crack repair material according to claim 1, wherein the epoxy resin is bisphenol a epoxy resin E51 or bisphenol a epoxy resin E44.
6. The crack repairing material for the insulating layer of the reactor epoxy resin as claimed in claim 1, wherein the epoxy resin diluent is AGE (C12-14 alkyl glycidyl ether) or BGE (butyl glycidyl ether).
7. The preparation method of the crack repairing material for the epoxy resin insulating layer of the reactor according to claim 1, characterized by comprising the following steps:
a. selecting 30-40 parts by weight of epoxy resin, 30-40 parts by weight of epoxy resin curing agent, 10-20 parts by weight of epoxy resin diluent, 0.6-1 part by weight of accelerator, 5-30 parts by weight of flaky boron nitride and 0.5-1 part by weight of carbon nano tube as preparation raw materials, selecting 1-2 parts by weight of solvent, adding the carbon nano tube and the flaky boron nitride into the solvent, and performing ultrasonic treatment for more than 30 minutes to uniformly disperse the carbon nano tube and the flaky boron nitride to obtain a filler solution;
b. premixing epoxy resin, an epoxy resin curing agent and an accelerant according to a preset proportion to obtain a resin base material;
c. adding the filler solution into a resin base material, stirring to uniformly disperse the filler solution in the resin base material, and degassing to obtain the repair material.
8. The preparation method of the crack repairing material for the epoxy resin insulation layer of the reactor according to claim 7, wherein in the step a, the solvent is one of acetone, isopropanol or absolute ethyl alcohol.
9. The preparation method of the crack repairing material for the epoxy resin insulating layer of the reactor according to claim 7, wherein in the step c, the stirring speed of the filler solution added into the resin base material is 200-500 rpm for 1-1.5 hours; finally, the speed is increased to 1500 rpm for 5 minutes.
10. The preparation method of the crack repairing material for the epoxy resin insulating layer of the reactor according to claim 7, wherein in the step c, the degassing is performed by heating to 60 ℃ in a vacuum environment, standing for 20-30 minutes, repeating the heating twice and then cooling to room temperature to obtain the repairing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210634353.1A CN115260705A (en) | 2022-06-07 | 2022-06-07 | Reactor epoxy resin insulation layer crack repair material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210634353.1A CN115260705A (en) | 2022-06-07 | 2022-06-07 | Reactor epoxy resin insulation layer crack repair material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115260705A true CN115260705A (en) | 2022-11-01 |
Family
ID=83758835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210634353.1A Pending CN115260705A (en) | 2022-06-07 | 2022-06-07 | Reactor epoxy resin insulation layer crack repair material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115260705A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115926379A (en) * | 2022-12-20 | 2023-04-07 | 江南大学 | Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof |
| CN117209962A (en) * | 2023-10-07 | 2023-12-12 | 四川大学 | Epoxy resin composite material and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016086587A1 (en) * | 2014-12-04 | 2016-06-09 | 中国科学院过程工程研究所 | Thermally conductive and insulating epoxy resin composition and preparation method therefor and use thereof |
| CN105778427A (en) * | 2016-05-20 | 2016-07-20 | 安徽大学 | Method for synergistically modifying epoxy resin through nitride-carbon nano tube nanocomposite |
| CN105778152A (en) * | 2016-04-05 | 2016-07-20 | 惠州学院 | Method for modifying carbon nanotube, modified carbon nanotube and epoxy resin composite material and preparation method thereof |
| JP2017082091A (en) * | 2015-10-28 | 2017-05-18 | デンカ株式会社 | Epoxy resin composition, epoxy resin sheet and metal base circuit board using the same |
| CN112778703A (en) * | 2021-01-06 | 2021-05-11 | 沈阳航空航天大学 | High-toughness and heat-conducting epoxy resin composite material and preparation method thereof |
-
2022
- 2022-06-07 CN CN202210634353.1A patent/CN115260705A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016086587A1 (en) * | 2014-12-04 | 2016-06-09 | 中国科学院过程工程研究所 | Thermally conductive and insulating epoxy resin composition and preparation method therefor and use thereof |
| JP2017082091A (en) * | 2015-10-28 | 2017-05-18 | デンカ株式会社 | Epoxy resin composition, epoxy resin sheet and metal base circuit board using the same |
| CN105778152A (en) * | 2016-04-05 | 2016-07-20 | 惠州学院 | Method for modifying carbon nanotube, modified carbon nanotube and epoxy resin composite material and preparation method thereof |
| CN105778427A (en) * | 2016-05-20 | 2016-07-20 | 安徽大学 | Method for synergistically modifying epoxy resin through nitride-carbon nano tube nanocomposite |
| CN112778703A (en) * | 2021-01-06 | 2021-05-11 | 沈阳航空航天大学 | High-toughness and heat-conducting epoxy resin composite material and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115926379A (en) * | 2022-12-20 | 2023-04-07 | 江南大学 | Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof |
| CN117209962A (en) * | 2023-10-07 | 2023-12-12 | 四川大学 | Epoxy resin composite material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115260705A (en) | Reactor epoxy resin insulation layer crack repair material and preparation method thereof | |
| Bian et al. | The synergistic effects of the micro-BN and nano-Al2O3 in micro-nano composites on enhancing the thermal conductivity for insulating epoxy resin | |
| CN110951254A (en) | Boron nitride composite high-thermal-conductivity insulating polymer composite material and preparation method thereof | |
| CN110791102A (en) | Silicone rubber pad with high heat conductivity coefficient and preparation method thereof | |
| CN112812740B (en) | Double-component high-thermal-conductivity self-leveling pouring sealant and preparation method and application thereof | |
| CN113337126A (en) | Heat-conducting insulating silicon rubber and preparation method and application thereof | |
| CN114426757B (en) | Resin material and preparation method thereof | |
| CN109836777B (en) | Epoxy resin-based composite insulating material and preparation method thereof | |
| Yin et al. | Synergistic enhancement of arc ablation resistance and mechanical properties of epoxy resin insulation | |
| CN106349648A (en) | Resin-base nonlinear composite material for low temperature environment and preparation method of resin-base nonlinear composite material | |
| CN110527254B (en) | Epoxy composite material and preparation method thereof | |
| Zhang et al. | High‐temperature resistance and excellent electrical insulation in epoxy resin blends | |
| CN114539783A (en) | High-thermal-conductivity high-insulation gasket and preparation method thereof | |
| CN114350110A (en) | Nano-grade filler and liquid rubber co-modified epoxy composite material and preparation method thereof | |
| Liu et al. | Semi-conductive buffer layer for the conductor-insulator interface of HVDC GIS/GIL | |
| CN114836007B (en) | High-heat-conductivity resin insulating material and preparation method thereof | |
| Zhao et al. | Filler Size Effect on Tuning Electrical, Mechanical, and Thermal Properties of Field Grading Composites | |
| Saman et al. | Partial Discharge and Breakdown Strength Characteristics of Cross-Linked Polyethylene/SiO 2 Nanocomposites | |
| Zhang et al. | Investigations on the electrical performances of CuNPs/BN/EPDM composites | |
| CN112646315A (en) | Epoxy resin nano composite insulating material with low temperature coefficient of electrical conductivity and preparation method thereof | |
| Wang et al. | The thermal conductivity and electrical properties of EP composite with different size BN | |
| CN110473680A (en) | A kind of nanometer of BN particle high thermal conductivity silicon rubber compound insulator and its preparation process | |
| Li et al. | Thermally conductive polymer composites for high voltage insulation | |
| CN117476270B (en) | Epoxy composite material capable of accurately regulating nonlinear conductivity and preparation method thereof | |
| CN117603555B (en) | High-heat-conductivity high-toughness epoxy resin composite material and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |