CN115258139A - Airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle - Google Patents
Airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle Download PDFInfo
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- CN115258139A CN115258139A CN202210552618.3A CN202210552618A CN115258139A CN 115258139 A CN115258139 A CN 115258139A CN 202210552618 A CN202210552618 A CN 202210552618A CN 115258139 A CN115258139 A CN 115258139A
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- semiconductor laser
- aerial vehicle
- unmanned aerial
- transverse plate
- obstacle clearing
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000013016 damping Methods 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 7
- 230000004888 barrier function Effects 0.000 claims abstract description 6
- 230000033001 locomotion Effects 0.000 claims description 7
- 239000003351 stiffener Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 13
- 230000009467 reduction Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C27/00—Rotorcraft; Rotors peculiar thereto
- B64C27/04—Helicopters
- B64C27/08—Helicopters with two or more rotors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D47/00—Equipment not otherwise provided for
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/06—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
- F16F15/067—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only wound springs
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
- H02G1/02—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for overhead lines or cables
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Acoustics & Sound (AREA)
- Lasers (AREA)
Abstract
The invention relates to an airborne semiconductor laser obstacle clearing device of a multi-rotor unmanned aerial vehicle, which comprises a machine body, a support, an obstacle clearing device, a moving device and a damping mechanism, wherein the obstacle clearing device comprises a semiconductor laser, the semiconductor laser is arranged on the moving device, the moving device is arranged on a lower transverse plate, and the damping mechanism is arranged on the inner surface of the moving device; the invention has the advantages that: send laser through semiconductor laser and clear up the thing of hanging that wafts on to splint transmission line, because semiconductor laser's small, longe-lived characteristics, consequently great reduction the weight of whole device, be convenient for many rotor unmanned aerial vehicle carry it to better to hanging thing of wafing on the transmission line fix a position and clear up, the problem of the long-range heavy inconvenient problem of carrying of barrier technique of ground laser that the clearance of having solved unmanned aerial vehicle flame projecting technique to hanging thing that wafts on the overhead transmission line causes the conflagration easily and has.
Description
Technical Field
The invention relates to an airborne semiconductor laser obstacle clearing device of a multi-rotor unmanned aerial vehicle.
Background
The overhead transmission line is erected on the ground and is a power line insulated by insulators and air. Because the overhead transmission line is exposed in the atmospheric environment and in the climate mode mainly in the monsoon climate in China, the transmission lines in various regions often have the situation that various floating foreign matters are used as hanging objects to wind and hang the wires particularly under severe weather conditions such as typhoons, and the hanging of the foreign matters in the transmission lines is one of the important factors causing the tripping of the transmission lines.
In recent years, with the continuous reinforcing of comprehensive national force, constantly realize breaking through the innovation in laser high-tech field, the online technological development of removing obstacles of transmission line is rapid, it clears away the hanging thing of transmission line mountain through unmanned aerial vehicle technique of spouting fire and the long-range barrier technique of ground laser, but unmanned aerial vehicle technique of spouting fire is convenient and fast though, very easily cause the conflagration, there is certain potential safety hazard, and the device of the long-range barrier technique of laser on ground is too bulky, can not in time follow unmanned aerial vehicle's system of patrolling and examining and carry out synchronous motion, need many people to cooperate on moving, high labor strength, consequently, it is not high to cause the efficiency of removing obstacles.
Disclosure of Invention
The invention aims to provide an airborne semiconductor laser obstacle clearing device of a multi-rotor unmanned aerial vehicle, which can effectively reduce the weight of the whole device, thereby realizing synchronous movement with the unmanned aerial vehicle.
In order to solve the technical problems, the invention is realized by the following technical scheme: the airborne semiconductor laser obstacle clearing device of the multi-rotor unmanned aerial vehicle comprises a machine body, a support, an obstacle clearing device, a moving device and a damping mechanism, wherein the machine body comprises a high-definition camera, the support comprises an upper transverse plate, a lower transverse plate and a connecting piece arranged between the upper transverse plate and the lower transverse plate, and the lower surface of the machine body is fixedly installed on the upper surface of the upper transverse plate; the device of removing obstacles includes semiconductor laser, semiconductor laser sets up on mobile device, mobile device sets up and is used for driving semiconductor laser and removes under on the diaphragm, and semiconductor laser is used for cleaing away what high definition digtal camera caught floats and hangs the thing, damper sets up mobile device's internal surface is right the removal of removing obstacles device carries out the shock attenuation.
Preferably, the moving device comprises a fixed frame movably connected to the lower transverse plate and a driving assembly used for driving the fixed frame to move on the lower transverse plate, the driving assembly is arranged on the lower transverse plate, and the outer surface of the semiconductor laser is fixedly installed on the inner wall of the fixed frame.
Preferably, drive assembly includes screw rod, motor and thread bush, screw rod and motor all set up on the diaphragm down, the thread bush sets up on the screw rod, all be equipped with a conical gear on motor and the screw rod, two conical gear meshing cooperations, the mount sets up on the thread bush.
Preferably, a groove is formed in the lower transverse plate, the two ends of the screw rod are fixedly installed on the inner wall of the groove through first bearings respectively, the outer surface of the threaded sleeve is connected with the inner wall of the groove in a sliding mode, a supporting block for fixing the motor is arranged on the lower transverse plate and is close to the inner surface of the groove, and a limit switch is fixedly installed on the inner wall of the groove.
Preferably, be close to recess internal surface both sides respectively fixed mounting have a limiting plate on the diaphragm down, the spout has been seted up to a side surface of limiting plate, be equipped with on the mount with spout matched with arch, a plurality of fixed slots have been seted up to the inner wall of spout, the inner wall of fixed slot has the ball through second bearing fixed mounting, the surface and the arch of ball offset.
Preferably, the two ends of the limiting plate are respectively fixedly sleeved with a cushion pad.
Preferably, damper includes first backup pad, second backup pad and damping spring, one side of first backup pad is connected with semiconductor laser's external fixed surface, second backup pad fixed connection is at the internal surface of mount, fixedly connected with bracing piece on the first backup pad, damping spring sets up on the bracing piece, and damping spring's one end offsets with first backup pad, and damping spring's the other end offsets with the second backup pad, the draw-in groove has been seted up to the internal surface of mount, the one end of bracing piece run through behind the second backup pad with the inner wall slip joint of draw-in groove.
Preferably, the inner wall fixedly connected with buffer block of draw-in groove, the other end and the buffer block sliding connection of bracing piece.
Preferably, the lower surface of the upper transverse plate is provided with a laser power supply connected with the semiconductor laser.
Preferably, the connecting piece includes a reinforcing bar section supporting the upper transverse plate, a fixing rod section fixed on the lower transverse plate, and a connecting rod arranged between the reinforcing bar and the fixing rod, and the connecting piece is of an integrated structure.
In conclusion, the invention has the advantages that: through the device of removing obstacles that sets up, because the device of removing obstacles sets up semiconductor laser to, send laser through semiconductor laser and clear up hanging thing that wafts on the clamp block transmission line, because semiconductor laser's small, longe-lived characteristics, consequently great reduction the weight of whole device, be convenient for many rotor unmanned aerial vehicle carry it, thereby better fix a position and clear up hanging thing that wafts on the transmission line, the problem of the maintenance that unmanned aerial vehicle flaming technique wafts hanging thing on the overhead transmission line causes the conflagration easily and the long-range inconvenient problem of carrying of ground laser long-range obstacle removal technique, secondly, set up semiconductor laser on the mobile device, can realize semiconductor laser free movement on the diaphragm down, can fix a position hanging thing that wafts on the transmission line, be convenient for clear up hanging thing that wafts, improve cleaning efficiency, damper's setting, when mobile device drives semiconductor laser and mobile device's vibrations, thereby reach the effect that reduces vibrations, finally, set up the diaphragm with the support, connecting piece that sets up between upper and lower diaphragm, the connecting piece that the support sets up between the organism, when the mobile device drives semiconductor laser and the organism and the device is independent space of removing obstacles, the device of removing obstacles, the organism can not form the device, when the organism, the whole device of removing obstacles, the organism, the device, the space of removing obstacles is compact and the device, the device of the organism can not be realized the mutual interference.
Drawings
The invention will be further described with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of an airborne semiconductor laser obstacle clearing device of a multi-rotor unmanned aerial vehicle, which is disclosed by the invention;
FIG. 2 is a schematic view of the structure of the stent of the present invention;
FIG. 3 is a schematic diagram of the laser power supply of the present invention on a support;
FIG. 4 is a schematic structural diagram of the fixing frame of the present invention on the mobile device;
FIG. 5 is a schematic view of the structure of the lower cross plate of the present invention;
FIG. 6 is a schematic structural diagram of a limiting plate according to the present invention;
FIG. 7 is a schematic structural view of the fixing frame of the present invention;
fig. 8 is a schematic structural view of the damping mechanism in the fixing frame according to the present invention.
Reference numerals:
the laser device comprises a machine body 1, a support 2, an upper transverse plate 21, a lower transverse plate 22, a connecting piece 23, a laser power supply 3, a semiconductor laser 31, a fixing frame 4, a groove 401, a screw 402, a conical gear 403, a supporting block 404, a motor 405, a thread bushing 406, a limit switch 407, a limit plate 408, a chute 409, a fixing groove 410, a ball 411, a cushion 412, a first supporting plate 5, a second supporting plate 51, a supporting rod 52, a damping spring 53, a clamping groove 54 and a buffer block 55.
Detailed Description
As shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8, an airborne semiconductor laser obstacle clearing device for a multi-rotor unmanned aerial vehicle comprises a machine body 1, a support 2, an obstacle clearing device, a moving device and a damping mechanism, wherein the machine body 1 comprises a high-definition camera, the support 2 comprises an upper transverse plate 21, a lower transverse plate 22 and a connecting piece 23 arranged between the upper transverse plate 21 and the lower transverse plate 22, and the lower surface of the machine body 1 is fixedly installed on the upper surface of the upper transverse plate 21; the device of removing obstacles includes semiconductor laser 31, semiconductor laser 31 sets up on mobile device, mobile device sets up and is used for driving semiconductor laser 31 and removes under on diaphragm 22, and semiconductor laser 31 is used for cleaing away the thing of hanging that wafts that high definition digtal camera caught, damper sets up mobile device's internal surface is right the removal of the device of removing obstacles carries out the shock attenuation.
Through the device of removing obstacles that sets up, because the device of removing obstacles sets up semiconductor laser 31, send laser through semiconductor laser 31 and clear up hanging thing on the clamp splice transmission line that wafts, because semiconductor laser 31's small, longe-lived characteristics, consequently great reduction the weight of whole device, it carries to it to be convenient for many rotor unmanned aerial vehicle, thereby better fix a position and clear up hanging thing on the transmission line, the problem of the long-range inconvenient carrying of the long-range barrier technique of ground laser that causes the conflagration easily of the clearance of hanging thing on the overhead transmission line of unmanned aerial vehicle flaming technique is solved, secondly, set up semiconductor laser 31 on mobile device, can realize semiconductor laser 31 free removal on diaphragm 22 down, can fix a position hanging thing on the transmission line, semiconductor laser 31 is convenient for clear up hanging thing, improve cleaning efficiency, damper's setting, when mobile device drives semiconductor laser 31 and mobile device's vibrations and pass through damper, thereby reach the effect that reduces semiconductor laser 31 at last, set up 2 to hanging thing, the stability of setting up 2 and the whole organism of the clearance between the diaphragm 22 and the organism is improved when mobile device drives semiconductor laser 31 and the organism and the clearance is not compact, the whole organism is realized the mutual clearance of diaphragm structure 1, the clearance of diaphragm 22, the clearance device, when the organism, the organism is not 2, the organism is realized mutual stability of the mutual interference between the organism, the organism is realized.
The mobile device includes swing joint mount 4 on diaphragm 22 down to and be used for driving the drive assembly of mount 4 activity on diaphragm 22 down, drive assembly sets up on diaphragm 22 down, semiconductor laser 31's surface fixed mounting is in the inner wall of mount 4 moves about on diaphragm 22 down through drive assembly drive mount 4, can realize the automatically move of mount 4, and mount 4 can play the function of fixed stay to semiconductor laser 31, guarantees to remove the stability of in-process mount 4.
The driving assembly comprises a screw 402, a motor 405 and a threaded sleeve 406, the screw 402 and the motor 405 are both arranged on the lower cross plate 22, the thread sleeve 406 is arranged on the screw rod 402, the motor 405 and the screw rod 402 are respectively provided with a conical gear 403, the two conical gears 403 are meshed and matched, the fixing frame 4 is disposed on the threaded sleeve 406, in this embodiment, one of the bevel gears 403 is driven to rotate by the rotation of the motor 405, then drives another bevel gear 403 to rotate to drive the screw rod 402 to rotate, the rotation of the screw rod 402 drives the threaded sleeve 406 to move on the screw rod 402, the movement of the threaded sleeve 406 drives the fixed frame 4 to move, the whole structure is compact, the driving effect is good, secondly, due to the meshing transmission of the bevel gear 403, the stability of the rotation of the screw 402 can be ensured, the lower transverse plate 22 is provided with a groove 401, two ends of the screw 402 are respectively and fixedly arranged on the inner wall of the groove 401 through a first bearing, the outer surface of the threaded sleeve 406 is in sliding clamping connection with the inner wall of the groove 401, a supporting block 404 for fixing the motor 405 is arranged on the lower transverse plate 22 close to the inner surface of the groove 401, the inner wall of the groove 401 is fixedly provided with a limit switch 407, the rotation of the screw 402 is connected with the inner wall of the groove 401 through a first bearing, the rotation stability of the screw 402 can be increased, the supporting block 404 can play a role of fixing and supporting the motor 405, the outer surface of the thread sleeve 406 is clamped with the inner wall of the groove 401 in a sliding manner, the straightness of the thread sleeve 406 during movement can be ensured, secondly, the limit switch 407 is arranged, when the threaded sleeve 406 moves to be contacted with the limit switch 407, the limit switch 407 controls the motor 405 to stop running, thereby driving the semiconductor laser 31 to stop moving, and further limiting the movement of the semiconductor laser 31.
Be close to recess 401 internal surface both sides respectively fixed mounting has limiting plate 408 on the diaphragm 22 down, spout 409 has been seted up to a side surface of limiting plate 408, be equipped with on mount 4 with spout 409 matched with protruding, a plurality of fixed slots 410 have been seted up to the inner wall of spout 409, the inner wall of fixed slot 410 has ball 411 through second bearing fixed mounting, ball 411's surface offsets with protruding, and two limiting plates 408 pass through fastening bolt fixed mounting on diaphragm 22 down, and the removal of mount 4 drives the arch of mount 4 both sides and moves on limiting plate 408 along spout 409, and ball 411 in the fixed slot 410 and the bellied outer surface contact in mount 4 both sides reduce the protruding friction in with the spout 409 in mount 4 both sides, reduce the loss of mount 4, the fixed cover has been connected blotter 412 respectively at the both ends of limiting plate 408, and blotter 412 avoids mount 4 quick travel on limiting plate 408 to lead to mount 4 and the inner wall of spout to collide, and slow down the impact force that produces when removing mount 4 simultaneously.
Damper includes first backup pad 5, second backup pad 51 and damping spring 53, one side of first backup pad 5 and semiconductor laser 31's fixed surface are connected, second backup pad 51 fixed connection is at the internal surface of mount 4, fixedly connected with bracing piece 52 on first backup pad 5, damping spring 53 sets up on bracing piece 52, and damping spring 53's one end offsets with first backup pad 5, and damping spring 53's the other end offsets with second backup pad 51, draw-in groove 54 has been seted up to the internal surface of mount 4, the one end of bracing piece 52 run through behind second backup pad 51 with the inner wall slip joint of draw-in groove 54, in this embodiment, semiconductor laser 31 shakes at the removal in-process production and drives first backup pad 5 and rock, and rocking of first backup pad 5 makes damping spring 53 take place the deformation and produce elasticity, and rocking of first backup pad 5 drives bracing piece 52 and reciprocates along the inner wall of second backup pad 51 and the inner wall of draw-in groove 54 respectively simultaneously, the inner wall fixed connection of draw-in groove 54 has buffer block 55, the other end and buffer block 55 sliding connection of bracing piece 52, because the bracing piece 52 removes in this embodiment, buffer block 55 that the extrusion produced when buffer block 55, buffer block 55 prevents to collide the direct shock absorber 4.
Go up diaphragm 21's lower surface and be equipped with the laser instrument power 3 that links to each other with semiconductor laser 31, in this embodiment, laser instrument power 3 provides power 3 for semiconductor laser 31, is convenient for semiconductor laser 31 output laser to hanging the thing that wafts on the transmission line is clear away, connecting piece 23 includes the stiffener of diaphragm 21 in one section support, one section dead lever of fixing on diaphragm 22 down, and the connecting rod of setting between stiffener and dead lever, just connecting piece 23 formula structure as an organic whole can simplify the mounting process of connecting piece 23, improves the installation intensity of connecting piece 23, secondly, the stiffener can play certain supporting role to last diaphragm 21, can guarantee the plane degree of diaphragm 21 installation, and the connecting rod can set up different structures according to the installation demand of difference, makes it adapt to different installation demands.
The above description is only an embodiment of the present invention, but the technical features of the present invention are not limited thereto, and any changes or modifications within the technical field of the present invention by those skilled in the art are covered by the claims of the present invention.
Claims (10)
1. The utility model provides a many rotor unmanned aerial vehicle machine carries semiconductor laser device of removing obstacles, includes organism and support, the organism includes high definition digtal camera, its characterized in that: the obstacle clearing device comprises a machine body and is characterized by further comprising an obstacle clearing device, a moving device and a damping mechanism, wherein the support comprises an upper transverse plate, a lower transverse plate and a connecting piece arranged between the upper transverse plate and the lower transverse plate, and the lower surface of the machine body is fixedly arranged on the upper surface of the upper transverse plate; the barrier removing device comprises a semiconductor laser, the semiconductor laser is arranged on a moving device, the moving device is arranged on a lower transverse plate and used for driving the semiconductor laser to move, the semiconductor laser is used for removing floating hanging objects captured by a high-definition camera, and a damping mechanism is arranged on the inner surface of the moving device and is used for damping the movement of the barrier removing device.
2. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 1, characterized in that: the mobile device comprises a fixed frame movably connected to the lower transverse plate and a driving assembly used for driving the fixed frame to move on the lower transverse plate, the driving assembly is arranged on the lower transverse plate, and the outer surface of the semiconductor laser is fixedly mounted on the inner wall of the fixed frame.
3. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 2, characterized in that: the driving assembly comprises a screw rod, a motor and a thread sleeve, the screw rod and the motor are both arranged on the lower transverse plate, the thread sleeve is arranged on the screw rod, the motor and the screw rod are both provided with a conical gear, the two conical gears are meshed and matched, and the fixing frame is arranged on the thread sleeve.
4. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 3, characterized in that: the lower transverse plate is provided with a groove, two ends of the screw rod are fixedly arranged on the inner wall of the groove through first bearings respectively, the outer surface of the threaded sleeve is connected with the inner wall of the groove in a sliding and clamping mode, a supporting block for fixing the motor is arranged on the lower transverse plate and is close to the inner surface of the groove, and a limit switch is fixedly arranged on the inner wall of the groove.
5. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 4, wherein: be close to recess internal surface both sides respectively fixed mounting have a limiting plate on the diaphragm down, the spout has been seted up to a side surface of limiting plate, be equipped with on the mount with spout matched with arch, a plurality of fixed slots have been seted up to the inner wall of spout, the inner wall of fixed slot has the ball through second bearing fixed mounting, the surface and the arch of ball offset.
6. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 5, wherein: and cushion pads are fixedly sleeved at two ends of the limiting plate respectively.
7. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 2, characterized in that: damper includes first backup pad, second backup pad and damping spring, one side of first backup pad is connected with the external fixed surface of semiconductor laser, second backup pad fixed connection is at the internal surface of mount, fixedly connected with bracing piece on the first backup pad, damping spring sets up on the bracing piece, and damping spring's one end offsets with first backup pad, and damping spring's the other end offsets with the second backup pad, the draw-in groove has been seted up to the internal surface of mount, the one end of bracing piece run through behind the second backup pad with the inner wall slip joint of draw-in groove.
8. The airborne semiconductor laser obstacle clearing device for multi-rotor unmanned aerial vehicle of claim 7, wherein: the inner wall fixedly connected with buffer block of draw-in groove, the other end and the buffer block sliding connection of bracing piece.
9. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 1, characterized in that: and a laser power supply connected with the semiconductor laser is arranged on the lower surface of the upper transverse plate.
10. The airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle of claim 1, characterized in that: the connecting piece includes one section stiffener that supports the diaphragm, one section dead lever of fixing on diaphragm down to and the connecting rod of setting between stiffener and dead lever, just connecting piece formula structure as an organic whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210552618.3A CN115258139A (en) | 2022-05-19 | 2022-05-19 | Airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210552618.3A CN115258139A (en) | 2022-05-19 | 2022-05-19 | Airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle |
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| CN115258139A true CN115258139A (en) | 2022-11-01 |
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| CN202210552618.3A Pending CN115258139A (en) | 2022-05-19 | 2022-05-19 | Airborne semiconductor laser obstacle clearing device of multi-rotor unmanned aerial vehicle |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117388366A (en) * | 2023-12-11 | 2024-01-12 | 国网浙江省电力有限公司宁波供电公司 | Laser positioning device for power transmission line detection |
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2022
- 2022-05-19 CN CN202210552618.3A patent/CN115258139A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117388366A (en) * | 2023-12-11 | 2024-01-12 | 国网浙江省电力有限公司宁波供电公司 | Laser positioning device for power transmission line detection |
| CN117388366B (en) * | 2023-12-11 | 2024-04-09 | 国网浙江省电力有限公司宁波供电公司 | Laser positioning device for power transmission line detection |
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