CN115241636A - Antenna module, manufacturing method thereof and terminal - Google Patents

Abstract

An antenna module, includes circuit board, antenna element and chip packaging spare, antenna element set up in one side of circuit board, the chip packaging spare set up in the opposite side of circuit board and with antenna element is corresponding, the circuit board includes first conductive structure and second conductive structure, antenna element includes third conductive structure, first conductive structure second conductive structure with the coaxial setting of third conductive structure connects gradually, the chip packaging spare passes through first conductive structure second conductive structure with third conductive structure with the antenna element electricity is connected. The transmission path between the antenna unit and the chip package in the antenna module is minimized, and the transmission loss is reduced. The application also provides a preparation method of the antenna module and a terminal applying the antenna module.

Description

Antenna module, manufacturing method thereof and terminal

Technical Field

The present invention relates to the field of communications, and in particular, to an antenna module, a terminal including the antenna module, and a method for manufacturing the antenna module.

Background

In the 5G era, millimeter wave technology is applied to communication modules (terminal devices) on a large scale. When the millimeter wave technology is applied to a terminal device, if a traditional mode of separating an antenna from a chip is adopted, the signal transmission efficiency is low.

Disclosure of Invention

In view of the above, it is desirable to provide an antenna module, a method for manufacturing the same, and a terminal.

An embodiment of the present application provides an antenna module, including circuit board, antenna element and chip package, the antenna element set up in one side of circuit board, the chip package set up in the opposite side of circuit board and with the antenna element is corresponding, the circuit board includes first conductive structure and second conductive structure, the antenna element includes third conductive structure, first conductive structure the second conductive structure with the coaxial setting of third conductive structure connects gradually, the chip package passes through first conductive structure the second conductive structure with the third conductive structure with the antenna element electricity is connected.

Another embodiment of the present application further provides a method for manufacturing an antenna module, including the following steps:

providing a first laminated structure, wherein the first laminated structure comprises a first base material layer, a first conducting layer and a second conducting layer which are arranged on two opposite surfaces of the first base material layer, and a plurality of first conducting structures which penetrate through the first base material layer and are electrically connected with the first conducting layer and the second conducting layer;

providing a second laminated structure, wherein the second laminated structure comprises a second base material layer, a third conducting layer arranged on one surface of the second base material layer and a plurality of second conducting structures penetrating through the second base material layer, part of the second conducting structures are exposed out of the third conducting layer, and the other part of the second conducting structures are electrically connected with the third conducting layer;

providing an antenna unit, wherein the antenna unit comprises a substrate, and a radiation patch and a grounding plate which are arranged on two opposite surfaces of the substrate;

stacking the first laminated structure, the second laminated structure and the antenna unit in sequence, wherein the second substrate covers the second conductive layer, and the ground layer is connected with the second conductive structure exposed out of the third conductive layer;

covering films are respectively arranged on the surface of the third conducting layer, which is far away from the second base material layer, and the surface of the first conducting layer, which is far away from the first base material layer, and part of the covering films are removed to expose the first connecting pad and the third connecting pad;

and mounting the chip package on part of the first connecting pads, arranging a shielding layer on the cover film, and respectively connecting the other part of the first connecting pads and the third connecting pads with the corresponding shielding layer.

Another embodiment of the present application further provides a terminal, where the terminal includes the antenna module.

The antenna module provided by the embodiment of the application integrates the antenna unit, the circuit board and the chip packaging piece, and the antenna unit and the chip packaging piece are electrically connected through the coaxially arranged conductive structure, so that a transmission path between the antenna unit and the chip packaging piece is minimized, and transmission loss is reduced.

Drawings

Fig. 1 is a schematic cross-sectional view of an antenna module according to an embodiment of the present application.

Fig. 2 is a partial cross-sectional view of an antenna module according to another embodiment of the present application.

Fig. 3 is a schematic partial cross-sectional view of an antenna module according to another embodiment of the present application.

Fig. 4 is a partial cross-sectional view of an antenna module according to another embodiment of the present application.

Fig. 5 is a schematic cross-sectional view of a copper-clad plate according to an embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of the copper-clad plate shown in fig. 5 after a blind hole is formed therein.

Fig. 7 is a schematic cross-sectional view of the first conductive structure formed in the blind via of fig. 6.

Fig. 8 is a schematic cross-sectional view after a line is formed on the structure shown in fig. 7.

Fig. 9 is a schematic cross-sectional view of a copper-clad plate according to another embodiment of the present application.

Fig. 10 is a schematic cross-sectional view of the copper-clad plate shown in fig. 9 after a circuit is fabricated thereon.

Fig. 11 is a schematic cross-sectional view of the copper-clad plate shown in fig. 10 after a through-hole is formed therein.

Fig. 12 is a schematic cross-sectional view illustrating the through hole of fig. 11 after a second conductive structure is formed.

Fig. 13 is a schematic cross-sectional view of a copper-clad plate according to another embodiment of the present application.

Fig. 14 is a schematic cross-sectional view of the copper-clad plate shown in fig. 13 after a through hole is formed therein.

Fig. 15 is a schematic cross-sectional view of the third conductive structure formed in the via shown in fig. 14.

Fig. 16 is a schematic cross-sectional view after forming lines on the structure shown in fig. 15.

Fig. 17 is a schematic cross-sectional view of the structure shown in fig. 8, the structure shown in fig. 12, and the structure shown in fig. 16, which are sequentially laminated.

Fig. 18 is a schematic cross-sectional view of the structure of fig. 17 after a cover film is provided thereon.

Fig. 19 is a schematic cross-sectional view of the structure of fig. 18 after a shielding layer and a chip package are provided thereon.

Description of the main elements

Antenna module 100

Circuit board 10

Antenna unit 20

Chip package 30

First conductive layer 11

First base material layer 12

Second conductive layer 13

Second substrate layer 14

Third conductive layer 15

First connection pad 111

Second connecting pad 131

Second conductive structure 141

Cover film 16

Shielding layer 17

Substrate 21

Radiation patch 22

Grounding plate 23

Third conductive structure 211

Solder ball 31

Signal line 132

Power line 133

Third connecting pad 151

First surface 151a

Second surface 151b

First stacked structure 205

First copper-clad plate 200

First copper layer 201

Blind hole 203

Second stacked Structure 305

Second copper-clad plate 300

Second copper layer 301

Vias 302, 402

Third copper-clad plate 400

Third copper layer 401

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1, an antenna module 100 according to an embodiment of the present disclosure includes a circuit board 10, an antenna unit 20, and a chip package 30. The antenna unit 20 is disposed on one side of the circuit board 10, and the chip package 30 is disposed on the other side of the circuit board 10 and corresponds to the antenna unit 20.

The circuit board 10 includes a first conductive layer 11, a first base material layer 12, a second conductive layer 13, a second base material layer 14, and a third conductive layer 15, which are stacked in this order. The first conductive layer 11 includes a plurality of first connection pads 111, the second conductive layer 13 includes a plurality of second connection pads 131, and the first connection pads 111 are electrically connected to the corresponding second connection pads 131 through the first conductive structures 121 penetrating the first substrate layer 12. The first conductive structure 121 may be a conductive hole or a conductive pillar. In this embodiment, the first conductive structure 121 is a conductive hole. The third conductive layer 15 covers a part of the surface of the second substrate layer 14 facing away from the second conductive layer 13. The third conductive layer 15 includes a plurality of third connection pads (not shown). The circuit board 10 further includes a plurality of second conductive structures 141 penetrating through the second substrate layer 14, and one end of each second conductive structure 141 is electrically connected to a corresponding second connection pad 131. The other end of one part of the second conductive structure 141 is exposed outside the second substrate layer 14, and the other end of the other part of the second conductive structure 141 is electrically connected to the corresponding third connecting pad. The second conductive structure 141 may be a conductive hole or a conductive pillar. In this embodiment, the second conductive structure 141 is a conductive pillar.

The material of the first conductive layer 11, the second conductive layer 13, and the third conductive layer 15 is a metal, such as copper. The first substrate layer 12 and the second substrate layer 14 are both flexible substrate layers, and both materials thereof are thermoplastic resins, such as Liquid Crystal Polymer (LCP) or fluorine resin. The first base material layer 12 and the second base material layer 14 have a dielectric constant (Dk) of 2.0 to 3.5 and a dielectric loss (Df) of 0.001 to 0.0035.

Further, the surface of the first conductive layer 11 facing away from the first substrate layer 12 and the surface of the third conductive layer 15 facing away from the second substrate layer 14 are covered with a cover film 16. A portion of the first connection pad 111 is exposed outside the corresponding cover film 16 for electrically connecting other components. The cover film 16 includes an adhesive layer and a cover layer which are stacked. The adhesive layer covers the corresponding first conductive layer 11 or the third conductive layer 15. The adhesive layer is made of common adhesive, and the covering layer is made of PET. The thickness of the cover film 16 is 20 to 40 μm.

Further, the surface of the cover film 16 facing away from the respective first or third conductive layer 11, 15 is covered with a shielding layer 17. The shielding layer 17 is made of a conductive material. In this embodiment, the shielding layer 17 is a conductive cloth. The thickness of the shielding layer 17 is less than 10 μm.

The antenna unit 20 is disposed on the exposed surface of the second substrate layer 14 away from the second conductive layer 13, that is, the antenna unit 20 is disposed on the part of the surface of the second substrate layer 14 away from the second conductive layer 13, which is not covered by the third conductive layer 15. The antenna unit 20 includes a substrate 21, and a radiation patch 22 and a ground plate 23 disposed on opposite surfaces of the substrate 21. The ground plate 23 is attached to the second substrate layer 14, and is connected to a second conductive structure 141 exposed outside the second substrate layer 14. The material of the radiating patch 22 and the ground plate 23 is metal. The radiating patch 22 and the ground plate 23 are electrically connected by a third conductive structure 211 that penetrates the substrate 21. The third conductive structure 211 may be a conductive via, a conductive pillar, or a combination thereof. In this embodiment, the third conductive structure 211 is a conductive hole. The third conductive structure 211, the second conductive structure 141, and the first conductive structure 121 are coaxially disposed.

The substrate 21 is a rigid substrate, and the material thereof includes an insulating material having a low dielectric constant and a low dielectric loss. The insulating material is epoxy resin or hydrocarbon resin containing glass fibers, the dielectric constant of the insulating material is 2.0-3.5, and the dielectric loss of the insulating material is 0.001-0.0035. The substrate 21 is formed of an insulating layer or a multi-layered structure in which insulating layers and conductive layers are alternately stacked.

The chip package 30 is mounted on the first connection pad 111 exposed outside the cover film 16 through a solder ball 31, and is electrically connected to the radiation patch 22 of the antenna unit 20 through the corresponding first conductive structure 121, the second conductive structure 141, and the third conductive structure 211. The chip package 30 is a System In Package (SIP).

Referring to fig. 2, in some embodiments, the second conductive layer 13 further includes a signal line 132 and a power line 133. The signal line 132 is located between two adjacent second connecting pads 131, and is spaced from the second connecting pads 131 by a predetermined distance. The third connecting pads 151 are exposed outside the corresponding cover films 16 and connected to the corresponding shielding layers 17. The other part of the first connection pads 111 is exposed out of the corresponding cover film 16 and connected with the corresponding shielding layer 17. Thus, the two shielding layers 17, the two third connecting pads 151, the two second conductive structures 141, the two second connecting pads 131, the two first conductive structures 121, and the two first connecting pads 111 surround the signal line 132 together to form an external surrounding electromagnetic shielding structure. Neither the first conductive layer 11 nor the third conductive layer 15 includes a signal line, and the signal lines 132 of the circuit board 10 are all located in the second conductive layer 13. The power line 133 is spaced apart from the signal line 132 by a predetermined distance. In some embodiments, a surface of the third connection pad 151 facing away from the second conductive structure 141 is a plane.

Referring to fig. 3, in some embodiments, the power line 133 is located on the first conductive layer 11 or the third conductive layer 15, and the power line 133 and the signal line 132 are staggered from each other in a thickness direction of the circuit board 10. The thickness direction of the circuit board 10 refers to the stacking direction of the first base material layer 12 and the second base material layer 14.

Referring to fig. 4, in some embodiments, the third connecting pad 151 includes a first surface 151a facing away from the second conductive structure 141. A part of the first surface 151a is covered with the cover film 16, and the other part is exposed outside the cover film 16. The exposed portion of the first surface 151a is recessed inward in the thickness direction of the circuit board 10 to form a second surface 151b, and the second surface 151b is connected to the shielding layer 17. In some embodiments, the distance between the second surface 151b and the first surface 151a is 5 to 10 μm.

Referring to fig. 5 to 19, a method for fabricating the above-mentioned packaged circuit structure according to an embodiment of the present invention includes the following steps:

step S1, referring to fig. 8, providing a first stacked structure 205, where the first stacked structure 205 includes a first substrate layer 12, a first conductive layer 11 and a second conductive layer 13 disposed on two opposite surfaces of the first substrate layer 12, and a plurality of first conductive structures 121 penetrating through the first substrate layer 12 and electrically connecting the first conductive layer 11 and the second conductive layer 13.

Specifically, the step S1 includes the steps of:

step S11, please refer to fig. 5, providing a first copper-clad plate 200, wherein the first copper-clad plate 200 includes a first substrate layer 12 and first copper layers 201 disposed on two surfaces of the first substrate layer 12.

Step S12, please refer to fig. 6, drilling is performed on the first copper-clad plate 200 to form a blind hole 203 penetrating through the first substrate layer 12 and the first copper layer 201. In this embodiment, the drilling is performed by a mechanical drilling or laser drilling process.

In step S13, referring to fig. 7, a metal layer is plated on the walls of the blind holes 203 to form the first conductive structures 121.

In step S14, referring to fig. 8, the first conductive layer 11 and the second conductive layer 13 are formed on the two first copper layers 201 by wire-bonding to obtain the first stacked structure 205. In some embodiments, a photolithographic process is used to fabricate lines on the first copper layer 201.

The first conductive layer 11 includes a plurality of first connection pads 111 disposed at intervals. The second conductive layer 13 includes a signal line (not shown) and second connection pads 131 spaced at both sides of the signal line. The first connection pads 111 are electrically connected to the second connection pads 131 through the corresponding first conductive structures 121.

Step S2, please refer to fig. 12, providing a second stacked structure 305, where the second stacked structure 305 includes a second substrate layer 14, a third conductive layer 15 disposed on one surface of the second substrate layer 14, and a plurality of second conductive structures 141 penetrating through the second substrate layer 14, a part of the second conductive structures 141 is exposed outside the third conductive layer 15, and another part of the second conductive structures 141 is electrically connected to the third conductive layer 15.

Specifically, the step S2 includes the steps of:

step S21, please refer to fig. 9, providing a second copper-clad plate 300, where the second copper-clad plate 300 includes a second substrate layer 14 and a second copper layer 301 covering a surface of the second substrate layer 14.

In step S22, referring to fig. 10, a circuit is formed on the second copper layer 301 to form a third conductive layer 15. The third conductive layer 15 includes a plurality of third connection pads 151 disposed at intervals.

In step S23, referring to fig. 11, the second substrate layer 14 is drilled to form a plurality of through holes 302 penetrating through the second substrate layer 14. Wherein the position of a part of the through holes 302 corresponds to the position of the third connection pads 151.

In step S24, referring to fig. 12, the second conductive structure 141 is formed by filling a conductive material into the through hole 302 to obtain the second stacked structure 305.

Step S3, referring to fig. 16, providing an antenna unit 20, where the antenna unit 20 includes the substrate 21, and a radiation patch 22 and a ground plate 23 disposed on two opposite surfaces of the substrate 21.

Specifically, step S3 includes the following steps:

step S31, please refer to fig. 13, providing a third copper-clad plate 400, where the third copper-clad plate 400 includes a substrate 21 and two third copper layers 401 disposed on two surfaces of the substrate 21.

In step S32, please refer to fig. 14, the third copper-clad plate 400 is drilled to form a through hole 402 penetrating through the substrate 21 and the two third copper layers 401.

In step S33, referring to fig. 15, a metal layer is plated on the hole wall of the through hole 402 to form the third conductive structure 211.

In step S34, referring to fig. 16, the two third copper layers 401 are wired to form a radiation patch 22 and a ground plate 23, so as to obtain the antenna unit 20.

Step S4, please refer to fig. 17, wherein the first stacked structure 205, the second stacked structure 305, and the antenna unit 20 are sequentially stacked, wherein the second substrate layer 14 covers the second conductive layer 13, the ground plane 23 is connected to a third connection pad 151 exposed outside the third conductive layer 15, and the third conductive structure 211, the second conductive structure 141, and the first conductive structure 121 are coaxially disposed and sequentially connected.

Step S5, referring to fig. 18, cover films 16 are respectively disposed on the surface of the third conductive layer 15 away from the second substrate layer 14 and the surface of the first conductive layer 11 away from the first substrate layer 12, and a portion of the cover films 16 is removed to expose the first connection pad 111 and the third connection pad 151. One end of one cover film 16 is in contact with the substrate 21.

In some embodiments, portions of the coverfilm 16 are removed by laser cauterization.

In step S6, referring to fig. 19, the chip package 30 is mounted on a portion of the first connection pad 111, and the shielding layer 17 is disposed on the cover film 16. One of the shielding layers 17 covers one of the covering films 16 and is electrically connected to the third connection pad 151, and the other shielding layer 17 covers the other covering film 16 and is electrically connected to the other first connection pad 111.

An embodiment of the present application further provides a terminal, where the terminal may be a mobile phone, a tablet computer, a personal digital assistant, a vehicle-mounted computer, or the like. The terminal includes the antenna module 100, the radiation patch 22 is disposed facing the outside of the terminal, and the circuit board 10 is bendably disposed in a housing of the terminal 500.

In the antenna module 100 provided in the embodiment of the present invention, the antenna unit 20, the circuit board 10, and the chip package 30 are integrated into a whole, and the antenna unit 20 and the chip package 30 are electrically connected through a coaxially disposed conductive structure, so that a transmission path between the antenna unit 20 and the chip package 30 is minimized, thereby reducing transmission loss. In addition, the substrate 21 of the antenna unit 20 is a rigid substrate, and the position of the chip package 30 corresponds to the position of the antenna unit 20, so that the substrate 21 can provide support for the chip package 30, thereby eliminating the need for an additional stiffener. In addition, by disposing the shielding layer 17 on the surface of the cover film 16 facing away from the signal line 132, the thickness between the signal line 132 and the shielding layer 17 is increased without changing the total thickness of the circuit board 10, so that the line width of the signal line 132 can be increased.

Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.

Claims (10)

1. The utility model provides an antenna module, its characterized in that, includes circuit board, antenna element and chip package spare, antenna element set up in one side of circuit board, the chip package spare set up in the opposite side of circuit board and with antenna element is corresponding, the circuit board includes first conductive structure and second conductive structure, antenna element includes the third conductive structure, first conductive structure the second conductive structure with the coaxial setting of third conductive structure connects gradually, the chip package spare passes through first conductive structure the second conductive structure with the third conductive structure with the antenna element electricity is connected.

2. The antenna module of claim 1, wherein the antenna element includes a substrate, and a radiating patch and a ground plate disposed on opposite surfaces of the substrate, the ground plate being in contact with the circuit board, and the third conductive structure extending through the substrate and electrically connecting the radiating patch and the ground plate.

3. The antenna module of claim 2, wherein the circuit board includes a first conductive layer, a first substrate layer, a second conductive layer, a second substrate layer, and a third conductive layer, which are sequentially stacked, the chip package is connected to the first conductive layer, the first conductive structure penetrates the first substrate layer and electrically connects the first conductive layer and the second conductive layer, the second conductive structure penetrates the second substrate layer and electrically connects the second conductive layer and the third conductive layer, the antenna unit and the third conductive layer are located on a same surface of the second substrate layer, and the ground plate is electrically connected to the second conductive structure.

4. The antenna module of claim 3, wherein the second conductive layer comprises a plurality of second connection pads arranged at intervals and a signal line positioned between adjacent connection pads, and the second connection pads are electrically connected with the first conductive layer through the first conductive structure and electrically connected with the third conductive layer through the second conductive structure.

5. The antenna module of claim 4, wherein the circuit board further comprises cover films disposed on the first conductive layer and the third conductive layer, and a shielding layer disposed on the cover films, the first conductive layer includes a plurality of first connection pads disposed at intervals, a portion of the first connection pads are exposed outside the corresponding cover films and connected to the chip package, a surface of another portion of the first connection pads is exposed outside the corresponding cover films and electrically connected to the corresponding shielding layer, another surface of another portion of the first connection pads is electrically connected to the corresponding second connection pads through the first conductive structure, the third conductive layer includes a plurality of third connection pads disposed at intervals, a surface of the third connection pads is exposed outside the corresponding cover films and electrically connected to the corresponding shielding layers, and another surface of the third connection pads is electrically connected to the corresponding second connection pads through the second conductive structure.

6. The antenna module of claim 4, wherein the circuit board further comprises a power cord, the power cord being located in the second conductive layer.

7. The antenna module of claim 4, wherein the circuit board further comprises a power line in the first conductive layer or the third conductive layer, the power line and the signal line being staggered from each other in a thickness direction of the circuit board.

8. The antenna module of claim 3, wherein the first substrate layer and the second substrate layer are both flexible substrate layers, and the substrate is a rigid substrate.

9. A method of manufacturing an antenna module according to any of claims 1-8, comprising the steps of:

providing a first laminated structure, wherein the first laminated structure comprises a first base material layer, a first conducting layer and a second conducting layer which are arranged on two opposite surfaces of the first base material layer, and a plurality of first conducting structures which penetrate through the first base material layer and are electrically connected with the first conducting layer and the second conducting layer;

providing a second laminated structure, wherein the second laminated structure comprises a second base material layer, a third conducting layer arranged on one surface of the second base material layer and a plurality of second conducting structures penetrating through the second base material layer, part of the second conducting structures are exposed out of the third conducting layer, and the other part of the second conducting structures are electrically connected with the third conducting layer;

providing an antenna unit, wherein the antenna unit comprises a substrate, and a radiation patch and a grounding plate which are arranged on two opposite surfaces of the substrate;

stacking the first stacked structure, the second stacked structure and the antenna unit in sequence, wherein the second substrate covers the second conductive layer, and the ground layer is connected with the second conductive structure exposed outside the third conductive layer;

covering films are respectively arranged on the surface of the third conducting layer, which is far away from the second base material layer, and the surface of the first conducting layer, which is far away from the first base material layer, and part of the covering films are removed to expose the first connecting pad and the third connecting pad;

and mounting the chip package on part of the first connecting pads, arranging a shielding layer on the cover film, and respectively connecting the other part of the first connecting pads and the third connecting pads with the corresponding shielding layer.

10. A terminal, characterized in that it comprises an antenna module according to any one of claims 1-8.

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