CN115238484A - Board-level assembly service life prediction method and device, computer equipment and storage medium - Google Patents

Board-level assembly service life prediction method and device, computer equipment and storage medium Download PDF

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CN115238484A
CN115238484A CN202210807809.XA CN202210807809A CN115238484A CN 115238484 A CN115238484 A CN 115238484A CN 202210807809 A CN202210807809 A CN 202210807809A CN 115238484 A CN115238484 A CN 115238484A
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reliability
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时林林
周斌
陈思
俞鹏飞
黄云
路国光
周振威
何世烈
刘俊斌
孟苓辉
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China Electronic Product Reliability and Environmental Testing Research Institute
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Abstract

The application relates to a board level assembly service life prediction method, a device, computer equipment, a storage medium and a computer program product, wherein a reliability function of a board level assembly and importance factors of all units in the board level assembly are obtained, the sharing reliability numerical value of each unit can be determined according to the importance factors and preset reliability numerical values, the unit service life of each unit in the board level assembly is further calculated, the board level assembly service life of the board level assembly is predicted according to the unit service life of each unit, service life evaluation of electronic components of different types can be adapted, corresponding unit reliability is distributed according to the importance degree of components forming the board level assembly, and the complexity of a service life evaluation process can be reduced while the service life evaluation accuracy is ensured.

Description

Board-level assembly service life prediction method and device, computer equipment and storage medium
Technical Field
The present application relates to the field of reliability of electronic components, and in particular, to a method and an apparatus for predicting a lifetime of a board-level component, a computer device, a storage medium, and a computer program product.
Background
The development of the random information science and technology has the advantages that the application range of electronic products in the fields of military products and civil products is wider and wider, and the methods for evaluating the service life of the electronic products can be divided into two categories: a life evaluation method for weak links and other types of life evaluation methods.
Common methods of life assessment include: reliability test-based life distribution calculation, a temperature cycle stress enhancement method, a distribution spacing-based fault Prediction and Health Management (PHM) life assessment method, failure physics-based prediction, and the like.
However, in the conventional method, the service life evaluation of the electronic component is usually performed only for a specific electronic component, and the evaluation process is complicated.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a method, an apparatus, a computer device, a computer-readable storage medium, and a computer program product for predicting the lifetime of a board-level assembly, which can simply and efficiently evaluate the lifetime of various electronic components.
In a first aspect, the present application provides a method for predicting a lifetime of a board-level component, the method including:
acquiring a reliability function and a preset reliability value of the board-level assembly;
acquiring importance factors of each unit in the board-level assembly;
determining the sharing reliability value of each unit according to the importance factor and the preset reliability value;
calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit;
and predicting the service life of the board-level assembly according to the unit service life of each unit.
In one embodiment, the obtaining the reliability function of the board-level component includes:
obtaining a failure model and failure mechanisms of the board-level assembly;
determining a target failure mechanism of each unit according to the failure model and each failure mechanism;
and determining the reliability function of the board-level assembly according to the target failure mechanism of each unit.
In one embodiment, the determining the reliability function of the board-level component according to the target failure mechanism of each unit includes:
determining a first reliability function of each unit according to a target failure mechanism;
acquiring a failure distribution function of a target failure mechanism;
and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
In one embodiment, the obtaining the importance factor of each unit in the board-level component includes:
the importance factor of each unit is determined according to the importance of each unit constituting the board-level component.
In one embodiment, the calculating the cell life of each cell according to the reliability function and the sharing reliability value of each cell includes:
determining a unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and a preset reliability value;
and calculating the unit service life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
In one embodiment, the predicting the board-level component lifetime of the board-level component according to the unit lifetime of each unit includes:
and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.
In one embodiment, the method further comprises:
at least one of the average life and the median life of each cell is calculated.
In a second aspect, the present application further provides a device for predicting a lifetime of a board level assembly, where the device includes:
the reliability function acquisition module is used for acquiring a reliability function and a preset reliability value of the board-level assembly;
the importance factor acquisition module is used for acquiring importance factors of all units in the board-level assembly;
the sharing reliability determining module is used for obtaining the sharing reliability value of each unit according to the importance factor and the preset reliability value;
the unit life calculating module is used for calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit;
and the board-level assembly service life prediction module is used for predicting the service life of each unit according to the reliability function and the sharing reliability value of each unit.
In a third aspect, the application also provides a computer device. The computer device comprises a memory storing a computer program and a processor implementing the method steps in any of the embodiments of the first aspect when executing the computer program.
In a fourth aspect, the present application further provides a computer-readable storage medium. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the method steps of any of the embodiments of the first aspect.
In a fifth aspect, the present application further provides a computer program product. Computer program product comprising a computer program which, when executed by a processor, performs the method steps in any of the embodiments of the first aspect.
According to the board-level assembly service life prediction method, the board-level assembly service life prediction device, the computer equipment, the storage medium and the computer program product, the reliability function of the board-level assembly and the importance factor of each unit in the board-level assembly are obtained, the sharing reliability value of each unit can be determined according to the importance factor and the preset reliability value, the unit service life of each unit in the board-level assembly is further calculated, the board-level assembly service life of the board-level assembly is predicted according to the unit service life of each unit, service life evaluation of electronic components of different types can be adapted, corresponding unit reliability is distributed according to the importance degree of components forming the board-level assembly, and the complexity of a service life evaluation process can be reduced while the service life evaluation accuracy is guaranteed.
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FIG. 1 is a diagram of an exemplary implementation of a board level component life prediction method;
FIG. 2 is a flow diagram that illustrates a method for predicting lifetime of a board-level component, according to one embodiment;
FIG. 3 is a schematic flow chart of the step S201 in the embodiment shown in FIG. 2;
FIG. 4 is a schematic flow chart of step S303 in the embodiment shown in FIG. 3;
FIG. 5 is a schematic flow chart of a method for predicting the lifetime of a board-level device according to another embodiment;
FIG. 6 is a flow diagram illustrating a method for assessing lifetime of board level components in one embodiment;
FIG. 7 is a diagram illustrating calculation of the contribution to the reliability level of each device in the embodiment shown in FIG. 6;
FIG. 8 is a block diagram of an embodiment of a board level component lifetime prediction apparatus;
FIG. 9 is a diagram illustrating an internal structure of a computer device according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
It will be understood that the terms "first," "second," and the like as used herein may be used herein to describe various data, but the data is not limited by these terms. These terms are only used to distinguish one datum from another. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. It will be further understood that the terms "comprises/comprising," "includes" or "including," or "having," etc., specify the presence of stated features, integers, steps, operations, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.
The board-level component life prediction method provided by the embodiment of the present application may be applied to a computer device, where the computer device may be any type of device, for example, a terminal device, or various personal computers, laptops, tablets, wearable devices, servers, and the like, and the type of the computer device is not limited in the embodiment of the present application. As shown in FIG. 1, a schematic diagram of an internal structure of a computer device is provided, and the processor of FIG. 1 is used for providing computing and control capabilities. The memory comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database is used for relevant data of the reliability evaluation process of the structure. The network interface is used for communicating with other external devices through network connection. The computer program is executed by a processor to implement a board level component life prediction method.
In one embodiment, as shown in fig. 2, a board level component life prediction method is provided, the method comprising the steps of:
s201: and acquiring a reliability function and a preset reliability value of the board-level assembly.
The board-level assembly refers to a board-level structure of an electronic component, and the reliability function is used for representing failure distribution of the board-level assembly. The failure nature of the electronic product is caused by the failure of a device level, so the service life distribution of a board level assembly of the electronic product is closely related to the failure of a device structure forming the board level assembly, and the reliability function of the board level assembly is obtained by establishing the reliability function of each structure in the board level assembly, combining the structure or device information of the board level assembly, connection composition information and the like. For example, assuming a system of board-level components consisting of a total of N devices/structures, considering the connection manner of the serial system, the expression of the reliability function of the board-level components is:
Figure BDA0003738952790000051
in the formula, R s (t) represents the reliability function of the board level assembly, R i (t) represents the reliability function of device i. The predetermined reliability value is R 0 Then there is R s (t)＝R 0 。
S202: and acquiring the importance factor of each unit in the board-level assembly.
The importance factor represents the importance of each component constituting the board-level module. In practical application, the reliability of the board level assembly is distributed to each device according to the importance of the device, and the importance factor of each component of the board level assembly can be set to be delta i (i =1,2, \8230; \8230N), and the value range of the importance factor is limited to delta i ∈(0,1]。
S203: and determining the sharing reliability value of each unit according to the importance factor and the preset reliability value.
Wherein the sharing is reliableThe reliability value is the reliability shared by each unit in the board-level component under the condition that the reliability of the board-level component is in the preset reliability value. In practical applications, the basic reliability level of each component is generally defined as R * ，R * For a base quantity used to measure the reliability assigned to each device constituting a board-level assembly, the reliability of device i is expressed as R i ＝δ i R * In combination with the reliability function expression of the board level components, there are:
Figure BDA0003738952790000052
thus, the base reliability level R of device i * Can be expressed as:
Figure BDA0003738952790000053
reliability of the components at board level is R s (t)＝R 0 Under the condition of (1), the sharing reliability value of the device i is as follows:
Figure BDA0003738952790000054
if the importance of each device is equal, i.e. delta i And [ identical to ] 1, the sharing reliability value of the device i is: r is i ＝(R 0 ) 1/N 。
S204: and calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit.
According to the reliability value shared by each device on the premise of the preset reliability of the board-level assembly, the reliability functions of three types of failure distribution are reversely solved by combining the failure distribution (such as exponential distribution, logarithmic normal distribution and Weibull distribution) obeyed by each device on the premise of knowing the reliability of each device.
Wherein, the analytical solutions of exponential distribution and Weibull distribution, and the solution of lognormal distributionThe solution can be converted to a standard normal distribution calculation. For the condition that the device is invalid and follows exponential distribution, the exponential distribution parameter is lambda, and the reliability is R i The reliable life of (c) is calculated as follows:
Figure BDA0003738952790000061
for the condition that the device is failed and follows Weibull distribution, the scale parameter and the shape parameter are eta and m respectively, and the reliability is R i The reliable life of (c) is calculated as follows:
Figure BDA0003738952790000062
for the condition that the device failure obeys the lognormal distribution, the mean and standard deviation parameters are respectively mu and sigma, the distribution function of the standard normal distribution is recorded as phi, and the reliability is R i The reliable life of (c) is calculated as follows:
Figure BDA0003738952790000063
according to the formula, the reliability life of each unit on each board level assembly under the respective sharing reliability value can be calculated, and the reliability life is recorded as:
Figure BDA0003738952790000064
indicating the shared reliability level R of the ith device on the board level assembly i Reliable life time.
S205: and predicting the service life of the board-level assembly according to the unit service life of each unit.
In practical application, a conservative modeling strategy is adopted, and the unit life of each unit forming the board-level assembly can be defined as the lower limit value of the unit life of the board-level assembly at a specified reliability level R 0 The service life of the board-level assembly obtained by the method is calculated by the following formula:
Figure BDA0003738952790000071
wherein:
Figure BDA0003738952790000072
according to the method for predicting the service life of the board-level assembly, the reliability function of the board-level assembly and the importance factor of each unit in the board-level assembly are obtained, the sharing reliability value of each unit can be determined according to the importance factor and the preset reliability value, the unit service life of each unit in the board-level assembly is further calculated, the service life of the board-level assembly is predicted according to the unit service life of each unit, the method can adapt to service life evaluation of electronic components of different types, corresponding unit reliability is distributed according to the importance degree of components forming the board-level assembly, and the complexity of a service life evaluation process can be reduced while the accuracy of service life evaluation is guaranteed.
In one embodiment, as shown in fig. 3, the obtaining the reliability function of the board-level component includes the following steps:
s301: and acquiring a failure model of the board-level assembly and failure mechanisms.
The electronic component failure physical model comprises failure physical models of different mechanisms such as chip failure, thermal fatigue, vibration fatigue, high-temperature degradation, packaging failure and the like. Chip failure refers to loss of chip function; the thermal fatigue means that the electronic components are damaged due to fatigue caused by the repeated change of the environmental temperature and the repeated change of the thermal stress; vibration fatigue refers to structural damage to electronic components caused by vibration; high temperature degradation refers to performance degradation due to excessive ambient temperature; package failure refers to device failure caused by overstress or wear. In practical application, a corresponding failure physical model can be configured for each device/structure of the board-level assembly in a manual setting or automatic search matching mode, the failure time distribution matched by each failure model is specified, and parameters and distribution parameters of the failure physical model are set.
S302: and determining the target failure mechanism of each unit according to the failure model and each failure mechanism.
Wherein, each device/structure of the board level assembly may have multiple failure mechanisms at the same time, the failure time of different failure mechanisms has different distributions, and the common failure distributions are: exponential distribution, lognormal distribution, and weibull distribution. Under the condition of different failure mechanisms, the service lives of the board-level components are different, and the failure mechanism main failure mechanism corresponding to the minimum service life value, namely the target failure mechanism, is taken.
S303: and determining the reliability function of the board-level assembly according to the target failure mechanism of each unit.
Wherein, the failure distribution function of the target failure mechanism is taken as the failure distribution function of each unit and is marked as F i (t), the reliability function of device i is denoted as R i (t)＝1-F i (t), the reliability function of the board level assembly is expressed as:
Figure BDA0003738952790000081
in the embodiment, the target failure mechanism of each unit is determined by obtaining the failure model and each failure mechanism of the board-level assembly, and then the reliability function of the board-level assembly is determined according to the target failure mechanism of each unit, so that the mapping relation of the service life distribution of the board-level assembly can be established based on the service life distribution data of the device level, and the complexity of the service life evaluation process is reduced.
In one embodiment, as shown in fig. 4, the determining the reliability function of the board-level assembly according to the target failure mechanism of each unit includes the following steps:
s401: a first reliability function of each cell is determined based on the target failure mechanism.
Wherein, the failure distribution function of the target failure mechanism is taken as the failure distribution function of each unit and is marked as F i (t), the first reliability function for each cell can be expressed as: r i (t)＝1-F i (t)，
S402: and acquiring a failure distribution function of the target failure mechanism.
Among them, common failure distributions are: exponential distribution, lognormal distribution, and weibull distribution.
S403: and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
Wherein, the failure distribution of the single device/structure can be any one of exponential distribution, weibull distribution or lognormal distribution, so that the reliability function R of the built board-level assembly s (t) is the product of the reliability functions of any combination of the three failure distribution forms. For example, a board level assembly of 5 devices, the failure time distribution of 5 devices is shown in table 1 below:
TABLE 1
Figure BDA0003738952790000082
Figure BDA0003738952790000091
For the board-level assembly composed of the above 5 devices, when combined in a serial manner, the reliability function is:
Figure BDA0003738952790000092
wherein t represents the failure time, and the remaining parameters have the meanings shown in Table 1 above.
In the embodiment, the reliability function of the board-level assembly is established by obtaining the failure distribution function of the target failure mechanism and determining the first reliability function of each unit according to the target failure mechanism, so that the mapping relation of the service life distribution of the board-level assembly can be established based on the service life distribution data of the device level, and the complexity of the service life evaluation process is reduced.
In an embodiment, the obtaining the importance factor of each unit in the board-level component includes: the importance factor of each unit is determined according to the importance of each unit constituting the board-level component.
Wherein, the reliability of the board level assembly is distributed to each device according to the importance of the device, and the importance factor of each component of the board level assembly can be set as delta i (i =1,2, \8230; \8230N), and the value range of the importance factor is limited to delta i ∈(0,1]。
In the above embodiment, the importance factor of each unit is determined according to the importance of each unit constituting the board level assembly, and the reliable life of each unit under the corresponding sharing reliability can be calculated, so that the life of the board level assembly is obtained, and the complexity of the life evaluation process can be reduced while the accuracy of the life evaluation is ensured.
In an embodiment, the calculating the lifetime of each cell according to the reliability function and the sharing reliability value of each cell includes: determining a unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and a preset reliability value; and calculating the unit life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
According to the reliability value shared by each device on the premise of presetting reliability of the board-level assembly, failure distribution (such as exponential distribution, lognormal distribution and Weibull distribution) obeyed by each device is combined, and on the premise of knowing the reliability of each device, the reliability functions of the three failure distributions are reversely solved, so that the unit life of each unit can be calculated.
In the above embodiment, the unit reliability function of each unit is determined according to the reliability function, the sharing reliability value of each unit and the preset reliability value, the unit life of each unit is calculated by combining the failure distribution function of the target failure mechanism, and the life of the board-level assembly is further obtained.
In one embodiment, the predicting the lifetime of the board-level component according to the unit lifetime of each unit includes: and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.
The unit life of each unit constituting the board-level assembly can be defined as the reliable life of the board-level assembly under a specified reliability level by adopting a conservative modeling strategy.
In the above embodiment, the minimum value of the unit life of each unit is obtained as the board-level assembly life of the board-level assembly, so that the accuracy of the life evaluation can be ensured, and the life of the board-level assembly is determined by the unit life of each unit, so that the life evaluation process can be simplified, and the complexity of the life evaluation can be reduced.
In one embodiment, the board-level component life prediction method further includes: at least one of the average life and the median life of each cell is calculated.
Wherein when R is 0 When the value is set to 0.5, the reliability life at this time is the median life, that is:
Figure BDA0003738952790000101
according to the type of failure distribution of each unit and the target failure mechanism, the mathematical expected value of the target failure mechanism is taken as the average life of each unit, and then the average life of the target failure mechanism of each unit is respectively recorded as:
Figure BDA0003738952790000102
taking the minimum value of the average lifetime as the average lifetime of the board-level components, i.e. the Mean Time Between Failures (MTBF), can be expressed as:
Figure BDA0003738952790000103
in the above embodiment, the accuracy of the life evaluation can be ensured by calculating the average life or the median life of each unit, and the life evaluation requirements of various electronic components are met.
In one embodiment, as shown in fig. 5, a board level component life prediction method is provided, the method comprising the steps of:
s1: and acquiring a failure model of the board-level assembly and failure mechanisms.
S2: and determining the target failure mechanism of each unit according to the failure model and each failure mechanism.
S3: and determining a first reliability function of each unit according to the target failure mechanism.
S4: and acquiring a failure distribution function of the target failure mechanism.
S5: and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
S6: and acquiring a preset reliability value of the board-level assembly.
S7: the importance factor of each unit is determined according to the importance of each unit constituting the board-level component.
S8: and determining the sharing reliability value of each unit according to the importance factor and the preset reliability value.
S9: and determining the unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and a preset reliability value.
S10: and calculating the unit life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
S11: and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.
S12: at least one of the average life and the median life of each cell is calculated.
In the above embodiment, by obtaining the reliability function of the board level assembly and the importance factor of each unit in the board level assembly, the sharing reliability value of each unit can be determined according to the importance factor and the preset reliability value, so as to calculate the unit life of each unit in the board level assembly, and predict the board level assembly life of the board level assembly according to the unit life of each unit, which can adapt to the life evaluation of electronic components of different types, and allocate the corresponding unit reliability according to the importance of the components constituting the board level assembly, so that the complexity of the life evaluation process can be reduced while the accuracy of the life evaluation is ensured.
It should be understood that, although the steps in the flowcharts related to the embodiments described above are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a part of the steps in the flowcharts related to the embodiments described above may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the execution order of the steps or stages is not necessarily sequential, but may be rotated or alternated with other steps or at least a part of the steps or stages in other steps.
In one embodiment, a method for evaluating the lifetime of a board-level component based on reliability factor sharing is provided, and the method is represented by a flow chart shown in fig. 6 and comprises the following steps:
(1) Failure model and failure distribution configuration: and configuring a corresponding failure physical model for each device/structure of the board-level assembly by adopting a manual setting or automatic searching matching mode and the like according to the board-level assembly constitution information, simultaneously appointing failure time distribution matched with each failure model, and setting parameters and distribution parameters of the failure physical model.
(2) Confirming the distribution of main mechanisms of the device: each device/structure of a board level assembly may have multiple failure mechanisms simultaneously, with different distributions of failure times for the different failure mechanisms, three common failure distributions being: exponential distribution, lognormal distribution, and weibull distribution.
(3) Establishing a board level assembly reliability function: the failure distribution of the single device/structure can be any one of exponential distribution, weibull distribution or lognormal distribution, so that the reliability function R of the board-level assembly is established s (t) is the product of reliability functions of any combination of the three failure distribution forms, and R is known according to the form of the reliability function of exponential distribution, weibull distribution or lognormal distribution s (t) is a non-elementary function with a varying limit integral.
(4) Setting the reliability level of the board-level assembly: calculating the reliability life of the board-level assembly requires specifying the reliability value R of the board-level assembly s (t)＝R 0 . After the value is specified, the reliability life of the device can be obtained by solving the reliability function reversely.
(5) Calculating a sharing value of the reliability level of each device of the board-level assembly: and setting the importance factors of all components of the board-level assembly by adopting a manual or automatic batch setting mode for the established board-level assembly, and calculating the sharing value of the reliability level of all the components of the board-level assembly according to the weight value setting of the importance factors. Fig. 7 shows a schematic diagram of calculation of the contribution values of the reliability levels of the respective devices.
(6) Calculating the reliable service life of the device based on the sharing reliability: on the premise that the reliability of each device is known, the reliability functions of the three failure distributions are solved reversely.
(7) And (3) calculating the reliable service life of the board-level assembly based on reliability factor sharing: and taking the reliable life of all effective failure points of the devices/structures forming the board-level assembly under the respective sharing reliability level as a lower limit value, and defining the reliable life of the board-level assembly under the designated reliability level.
(8) Calculating the bit life of the board-level assembly: the calculation of the bit life in the board level assembly only requires setting a preset reliability level to 0.5.
(9) Calculation of board level assembly MTBF: after the failure main mechanism of the device/structure is confirmed, the average life of the failure time of each device is calculated by using the mathematical expected value of the main failure mechanism distribution of each device, and the minimum value of the average life of each device is used as the average life of the board-level assembly.
Through the steps, the service life evaluation of the board-level assembly based on the reliability factor sharing solution can be completed. According to the method, under the condition that the components/structures of the board-level components are distributed randomly, the reliable service life and the median service life under any reliability can be calculated, and meanwhile, the MTBF approximate value of the board-level components can be calculated.
Based on the same inventive concept, the embodiment of the application also provides a board-level assembly service life prediction device for implementing the board-level assembly service life prediction method. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so specific limitations in one or more embodiments of the board-level device lifetime prediction apparatus provided below can be referred to the limitations of the board-level device lifetime prediction method in the above, and details are not described here.
In one embodiment, as shown in fig. 8, there is provided a board level component life prediction apparatus, including: the reliability function obtaining module 10, the importance factor obtaining module 20, the sharing reliability determining module 30, the unit life calculating module 40 and the board-level component life predicting module 50, wherein:
a reliability function obtaining module 10, configured to obtain a reliability function of the board level component and a preset reliability value;
an importance factor obtaining module 20, configured to obtain importance factors of units in the board-level component;
a sharing reliability determining module 30, configured to obtain a sharing reliability value of each unit according to the importance factor and a preset reliability value;
a unit life calculating module 40, configured to calculate a unit life of each unit according to the reliability function and the sharing reliability value of each unit;
and a board level component life prediction module 50 for predicting the unit life of each unit according to the reliability function and the shared reliability value of each unit.
In one embodiment, there is provided a board level component life prediction apparatus, and the reliability function obtaining module includes: the device comprises a failure information acquisition unit, a target mechanism determination unit and a reliability function determination unit, wherein:
the failure information acquisition unit is used for acquiring failure models and failure mechanisms of the board-level assemblies;
the target mechanism determining unit is used for determining the target failure mechanism of each unit according to the failure model and each failure mechanism;
and the reliability function determining unit is used for determining the reliability function of the board-level assembly according to the target failure mechanism of each unit.
In one embodiment, there is provided a board-level component life prediction apparatus, wherein the reliability function determination unit includes: a first reliability determining subunit, a failure distribution acquiring subunit and a reliability function establishing subunit, wherein:
the first reliability determining subunit is used for determining a first reliability function of each unit according to the target failure mechanism;
the failure distribution acquisition subunit is used for acquiring a failure distribution function of a target failure mechanism;
and the reliability function establishing subunit is used for establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
In an embodiment, a board level component life prediction apparatus is provided, and the importance factor acquiring module is further configured to determine an importance factor of each unit according to the importance of each unit constituting the board level component.
In one embodiment, there is provided a board-level component life prediction apparatus, wherein the unit life calculation module includes: a unit reliability function determination unit and a unit life calculation unit, wherein:
the unit reliability function determining unit is used for determining the unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and the preset reliability value;
and the unit life calculating unit is used for calculating the unit life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
In one embodiment, a board-level component life prediction apparatus is provided, and the board-level component life prediction module is further configured to obtain a minimum value of the unit life of each unit as a board-level component life of the board-level component.
In one embodiment, a board-level component life prediction device is provided, and the board-level component life prediction module is further configured to calculate at least one of an average life and a median life of each unit.
The modules in the board-level component life prediction device can be wholly or partially implemented by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent of a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 9. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless communication can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by a processor to implement a board level component life prediction method.
Those skilled in the art will appreciate that the architecture shown in fig. 9 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory and a processor, the memory having a computer program stored therein, the processor implementing the following steps when executing the computer program: acquiring a reliability function and a preset reliability value of the board-level assembly; acquiring importance factors of each unit in the board-level assembly; determining sharing reliability values of all units according to the importance factor and a preset reliability value; calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit; and predicting the service life of the board-level assembly according to the unit service life of each unit.
In one embodiment, the obtaining of the reliability function of the board level component, involved in the execution of the computer program by the processor, comprises the steps of: acquiring a failure model and failure mechanisms of the board-level assembly; determining a target failure mechanism of each unit according to the failure model and each failure mechanism; and determining the reliability function of the board-level assembly according to the target failure mechanism of each unit.
In one embodiment, determining the reliability function of the board level components based on the target failure mechanism of each unit involved in the execution of the computer program by the processor comprises the steps of: determining a first reliability function of each unit according to a target failure mechanism; acquiring a failure distribution function of a target failure mechanism; and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
In one embodiment, the obtaining of importance factors for units in a board level assembly involved in the execution of the computer program by the processor comprises the steps of: the importance factor of each unit is determined according to the importance of each unit constituting the board-level assembly.
In one embodiment, the processor, in executing the computer program, is configured to calculate the lifetime of each cell based on the reliability function and the assigned reliability value for each cell, including the steps of: determining a unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and a preset reliability value; and calculating the unit service life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
In one embodiment, predicting board level component life for a board level component based on unit life of units involved in execution of a computer program by a processor comprises the steps of: and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.
In one embodiment, execution of the computer program by the processor further implements the steps of: at least one of the average life and the median life of each cell is calculated.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of: acquiring a reliability function and a preset reliability value of the board-level assembly; acquiring importance factors of each unit in the board-level assembly; determining sharing reliability values of all units according to the importance factor and a preset reliability value; calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit; and predicting the service life of the board-level assembly according to the unit service life of each unit.
In one embodiment, the computer program, when executed by a processor, is directed to obtaining a reliability function for a board level component, comprising the steps of: acquiring a failure model and failure mechanisms of the board-level assembly; determining a target failure mechanism of each unit according to the failure model and each failure mechanism; and determining the reliability function of the board-level assembly according to the target failure mechanism of each unit.
In one embodiment, the computer program, when executed by the processor, involves determining a reliability function for the board level assembly based on the target failure mechanism for each cell, comprising the steps of: determining a first reliability function of each unit according to a target failure mechanism; acquiring a failure distribution function of a target failure mechanism; and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
In one embodiment, the computer program, when executed by the processor, is directed to obtaining importance factors for units in the board level assembly, comprising the steps of: the importance factor of each unit is determined according to the importance of each unit constituting the board-level component.
In one embodiment, the computer program, when executed by the processor, is directed to calculating a cell life for each cell based on the reliability function and the shared reliability value for each cell, comprising the steps of: determining a unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and a preset reliability value; and calculating the unit service life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
In one embodiment, a computer program, when executed by a processor, relates to predicting board level component life for a board level component based on unit life of units, comprising the steps of: and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.
In one embodiment, the computer program when executed by the processor further performs the steps of: at least one of the average lifetime and the median lifetime of each cell is calculated.
In one embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, performs the steps of:
acquiring a reliability function and a preset reliability value of the board-level assembly; acquiring importance factors of each unit in the board-level assembly; determining sharing reliability values of all units according to the importance factor and a preset reliability value; calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit; and predicting the service life of the board-level assembly according to the unit service life of each unit.
In one embodiment, the computer program, when executed by a processor, is directed to obtaining a reliability function for a board level component, comprising the steps of: acquiring a failure model and failure mechanisms of the board-level assembly; determining a target failure mechanism of each unit according to the failure model and each failure mechanism; and determining the reliability function of the board-level assembly according to the target failure mechanism of each unit.
In one embodiment, the computer program, when executed by a processor, involves determining a reliability function for a board level assembly based on a target failure mechanism for each unit, comprising the steps of: determining a first reliability function of each unit according to a target failure mechanism; acquiring a failure distribution function of a target failure mechanism; and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
In one embodiment, the computer program, when executed by a processor, is directed to obtaining importance factors for units in a board level assembly, comprising the steps of: the importance factor of each unit is determined according to the importance of each unit constituting the board-level component.
In one embodiment, the computer program, when executed by the processor, is directed to calculating a cell life for each cell based on the reliability function and the assigned reliability value for each cell, comprising the steps of: determining a unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and a preset reliability value; and calculating the unit life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
In one embodiment, a computer program, when executed by a processor, relates to predicting board level component life for a board level component based on unit life of units, comprising the steps of: and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.
In one embodiment, the computer program when executed by the processor further performs the steps of: at least one of the average life and the median life of each cell is calculated.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high-density embedded nonvolatile Memory, resistive Random Access Memory (ReRAM), magnetic Random Access Memory (MRAM), ferroelectric Random Access Memory (FRAM), phase Change Memory (PCM), graphene Memory, and the like. Volatile Memory can include Random Access Memory (RAM), external cache Memory, and the like. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others. The databases referred to in various embodiments provided herein may include at least one of relational and non-relational databases. The non-relational database may include, but is not limited to, a block chain based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing based data processing logic devices, etc., without limitation.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. A board level component life prediction method, the method comprising:
acquiring a reliability function and a preset reliability value of the board-level assembly;
acquiring importance factors of each unit in the board-level assembly;
determining a sharing reliability value of each unit according to the importance factor and the preset reliability value;
calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit;
predicting a board level assembly life of the board level assembly based on the unit life of each of the units.
2. The method of claim 1, wherein obtaining a reliability function for board level components comprises:
acquiring a failure model and failure mechanisms of the board-level assembly;
determining a target failure mechanism of each unit according to the failure model and each failure mechanism;
determining a reliability function for the board level assembly based on the target failure mechanism for each of the cells.
3. The method of claim 2, wherein determining a reliability function for a board level assembly based on the target failure mechanism for each of the cells comprises:
determining a first reliability function of each unit according to the target failure mechanism;
acquiring a failure distribution function of the target failure mechanism;
and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.
4. The method of claim 1, wherein obtaining importance factors of units in the board level assembly comprises:
determining an importance factor of each of the units constituting the board level assembly according to the importance of each of the units.
5. The method of any of claims 1 to 4, wherein said calculating a cell life of each of said cells from said reliability function and a shared reliability value of each of said cells comprises:
determining a unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and the preset reliability value;
and calculating the unit service life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.
6. The method of any of claims 1 to 5, wherein predicting board level assembly life for the board level assembly based on unit life of each of the units comprises:
and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.
7. The method of claim 1, further comprising:
at least one of the average life, the median life, of each of the cells is calculated.
8. A board level component life prediction apparatus, the apparatus comprising:
the reliability function acquisition module is used for acquiring a reliability function and a preset reliability value of the board-level assembly;
the importance factor acquisition module is used for acquiring importance factors of all units in the board-level assembly;
a sharing reliability determining module, configured to obtain a sharing reliability value of each unit according to the importance factor and the preset reliability value;
a unit life calculating module, configured to calculate a unit life of each unit according to the reliability function and the sharing reliability value of each unit;
and the board-level assembly service life prediction module is used for predicting the service life of each unit according to the reliability function and the sharing reliability value of each unit.
9. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor, when executing the computer program, implements the steps of the method of any of claims 1 to 7.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 7.
CN202210807809.XA 2022-07-11 2022-07-11 Board-level assembly service life prediction method and device, computer equipment and storage medium Pending CN115238484A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116401876A (en) * 2023-04-11 2023-07-07 上海华大九天信息科技有限公司 Semiconductor device service life estimation method based on multiple degradation effect model
CN116401875A (en) * 2023-04-11 2023-07-07 上海华大九天信息科技有限公司 Method for estimating service life of semiconductor device containing multiple degradation effects

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116401876A (en) * 2023-04-11 2023-07-07 上海华大九天信息科技有限公司 Semiconductor device service life estimation method based on multiple degradation effect model
CN116401875A (en) * 2023-04-11 2023-07-07 上海华大九天信息科技有限公司 Method for estimating service life of semiconductor device containing multiple degradation effects
CN116401876B (en) * 2023-04-11 2024-08-23 上海华大九天信息科技有限公司 Semiconductor device service life estimation method based on multiple degradation effect model
CN116401875B (en) * 2023-04-11 2024-09-27 上海华大九天信息科技有限公司 Method for estimating service life of semiconductor device containing multiple degradation effects

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