CN115238484A - Board-level component life prediction method, device, computer equipment and storage medium - Google Patents

Abstract

The application relates to a board level assembly service life prediction method, a device, computer equipment, a storage medium and a computer program product, wherein a reliability function of a board level assembly and importance factors of all units in the board level assembly are obtained, the sharing reliability numerical value of each unit can be determined according to the importance factors and preset reliability numerical values, the unit service life of each unit in the board level assembly is further calculated, the board level assembly service life of the board level assembly is predicted according to the unit service life of each unit, service life evaluation of electronic components of different types can be adapted, corresponding unit reliability is distributed according to the importance degree of components forming the board level assembly, and the complexity of a service life evaluation process can be reduced while the service life evaluation accuracy is ensured.

Description

Board-level component life prediction method, device, computer equipment and storage medium

technical field

The present application relates to the field of reliability of electronic components, and in particular, to a method, device, computer equipment, storage medium and computer program product for predicting the life of a board-level component.

Background technique

With the development of random information science and technology, the application scope of electronic products in the fields of military and civilian products is more and more extensive. The methods of life evaluation for electronic products can be divided into two categories: life evaluation methods for weak links and other types of life evaluation. method.

Common life evaluation methods include: life distribution calculation based on reliability test, temperature cycle enhanced stress method, fault prediction and health management (Prognostics Health Management, PHM) life evaluation method based on distribution spacing, prediction based on failure physics, etc.

However, the life evaluation of electronic components in the traditional method can only be carried out for specific electronic components, and the evaluation process is relatively complicated.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide a board-level component life prediction method, apparatus, computer equipment, computer-readable storage medium and computer program product that can simply and efficiently evaluate the life of various electronic components.

In a first aspect, the present application provides a method for predicting the life of a board-level component, the method comprising:

Obtain reliability functions and preset reliability values of board-level components;

Obtain the importance factor of each unit in the board-level component;

Determine the shared reliability value of each unit according to the importance factor and the preset reliability value;

Calculate the unit life of each unit according to the reliability function and the shared reliability value of each unit;

The board-level assembly life of the board-level assembly is predicted based on the unit life of each unit.

In one embodiment, the above-mentioned obtaining the reliability function of the board-level component includes:

Obtain failure models and failure mechanisms of board-level components;

Determine the target failure mechanism of each unit according to the failure model and each failure mechanism;

Determine the reliability function of the board-level assembly based on the target failure mechanism of each unit.

In one embodiment, the above-mentioned determination of the reliability function of the board-level component according to the target failure mechanism of each unit includes:

Determine the first reliability function of each unit according to the target failure mechanism;

Obtain the failure distribution function of the target failure mechanism;

The reliability function of the board-level component is established according to the first reliability function and the failure distribution function.

In one embodiment, the above-mentioned acquisition of the importance factor of each unit in the board-level component includes:

The importance factor of each unit is determined according to the importance of each unit constituting the board-level assembly.

In one embodiment, the above calculation of the unit life of each unit according to the reliability function and the shared reliability value of each unit includes:

Determine the unit reliability function of each unit according to the reliability function, the shared reliability value of each unit and the preset reliability value;

The unit life of each unit is calculated according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

In one embodiment, the above-mentioned predicting the board-level component life of the board-level component according to the unit life of each unit includes:

The minimum value of the unit life of each unit is obtained as the board-level component life of the board-level component.

In one embodiment, the method further includes:

At least one of the average life and the median life of each unit is calculated.

In a second aspect, the present application also provides a device for predicting the life of a board-level component, the device comprising:

The reliability function acquisition module is used to acquire the reliability function and preset reliability value of the board-level component;

The importance factor acquisition module is used to acquire the importance factor of each unit in the board-level assembly;

The shared reliability determination module is used to obtain the shared reliability value of each unit according to the importance factor and the preset reliability value;

The unit life calculation module is used to calculate the unit life of each unit according to the reliability function and the shared reliability value of each unit;

The board-level component life prediction module is used to predict the unit life of each unit according to the reliability function and the shared reliability value of each unit.

In a third aspect, the present application also provides a computer device. The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the method steps in any one of the embodiments of the first aspect when the processor executes the computer program.

In a fourth aspect, the present application also provides a computer-readable storage medium. A computer-readable storage medium on which a computer program is stored, and when the computer program is executed by a processor, implements the method steps in any one of the embodiments of the first aspect.

In a fifth aspect, the present application also provides a computer program product. A computer program product, comprising a computer program that, when executed by a processor, implements the method steps in any one of the embodiments of the first aspect.

The above-mentioned board-level component life prediction method, apparatus, computer equipment, storage medium and computer program product, by obtaining the reliability function of the board-level component and the importance factor of each unit in the board-level component, according to the importance factor and preset reliability The numerical value can determine the shared reliability value of each unit, and then calculate the unit life of each unit in the board-level component, and predict the board-level component life of the board-level component according to the unit life of each unit, which can adapt to the life of different types of electronic components Evaluation, and assigning the corresponding unit reliability according to the importance of the components constituting the board-level component, can reduce the complexity of the life evaluation process while ensuring the accuracy of the life evaluation.

Description of drawings

FIG. 1 is an application environment diagram of a method for predicting the life of a board-level component in one embodiment;

FIG. 2 is a schematic flowchart of a method for predicting the life of a board-level component in one embodiment;

3 is a schematic flowchart of step S201 in the embodiment shown in FIG. 2;

FIG. 4 is a schematic flowchart of step S303 in the embodiment shown in FIG. 3;

5 is a schematic flowchart of a method for predicting the life of a board-level component in another embodiment;

6 is a schematic flowchart of a method for evaluating the life of a board-level component in one embodiment;

FIG. 7 is a schematic diagram of calculating the shared value of the reliability level of each device in the embodiment shown in FIG. 6;

8 is a structural block diagram of an apparatus for predicting the life of a board-level component in one embodiment;

Figure 9 is a diagram of the internal structure of a computer device in one embodiment.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various data, but these data are not limited by these terms. These terms are only used to distinguish the first data from another. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the present application are for the purpose of describing particular embodiments only, and are not intended to limit the present application. It should also be understood that the terms "comprising/comprising" or "having" etc. designate the presence of stated features, integers, steps, operations or combinations thereof, but do not preclude the presence or addition of one or more other features, integers , steps, operations, or the possibility of their combination. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.

The method for predicting the life of a board-level component provided in this embodiment of the present application may be applied to computer equipment, and the computer equipment may be any type of equipment, for example, a terminal equipment, or various personal computers, notebook computers, tablet computers, and wearable devices. , server, etc., the embodiment of this application does not limit the type of computer equipment. As shown in FIG. 1 , a schematic diagram of the internal structure of a computer device is provided, and the processor in FIG. 1 is used to provide computing and control capabilities. The memory includes non-volatile storage media, internal memory. The nonvolatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the execution of the operating system and computer programs in the non-volatile storage medium. The database is used for data related to the reliability assessment process of the structure. The network interface is used to communicate with other external devices through a network connection. The computer program, when executed by a processor, implements a board-level component lifetime prediction method.

In one embodiment, as shown in FIG. 2, a method for predicting the life of a board-level component is provided, and the method includes the following steps:

S201: Obtain a reliability function and a preset reliability value of the board-level component.

Among them, board-level components refer to the board-level structure of electronic components, and the reliability function is used to represent the failure distribution of board-level components. The essence of electronic product failure is caused by device-level failure. Therefore, the life distribution of electronic product board-level components is closely related to the failure of the device structure that constitutes the board-level component. By establishing the reliability function of each structure in the board-level component, combined with the board-level component The structure or device information and connection composition information, etc., to obtain the reliability function of board-level components. For example, assuming a system composed of a total of N devices/structures for board-level components, considering the connection method of the series system, the expression of the reliability function of board-level components is:

In the formula, R _s (t) represents the reliability function of board-level components, and R _i (t) represents the reliability function of device i. The preset reliability value is R ₀ , then R _s (t)=R ₀ .

S202: Obtain the importance factor of each unit in the board-level component.

Among them, the importance factor represents the importance of each component constituting the board-level component. In practical applications, the reliability of board-level components is assigned to each device according to the importance of the device, and the importance factor of each component of the board-level component can be set as δ _i (i=1,2,...N), And the value range of the importance factor is limited to δ _i ∈(0,1].

S203: Determine the shared reliability value of each unit according to the importance factor and the preset reliability value.

Wherein, the shared reliability value is the reliability shared by each unit in the board-level assembly when the reliability of the board-level assembly is at the preset reliability value. In practical applications, the basic reliability level of each component is usually defined as R ^* , R ^* is a basic quantity used to measure the assigned reliability of each device constituting a board-level component, and the reliability of device i is expressed as R _i = δ _i R ^* , combined with the reliability function expression of board-level components, there are:

Therefore, the base reliability level R ^* of device i can be expressed as:

When the reliability of the board-level component is R _s (t) = R ₀ , the shared reliability value of the device i is:

If the importance of each device is equal, that is, δ _i ≡ 1, the shared reliability value of device i is: R _i =(R ₀ ) ^1/N .

S204: Calculate the unit life of each unit according to the reliability function and the shared reliability value of each unit.

Among them, according to the reliability value shared by each device under the premise of the preset reliability of board-level components, combined with the failure distribution (such as exponential distribution, lognormal distribution, Weibull distribution) obeyed by each device, in On the premise that the reliability of each device is known, the reliability functions of the three failure distributions are solved inversely.

Among them, exponential distribution and Weibull distribution have analytical solutions, and the solution of lognormal distribution can be converted into standard normal distribution calculation. For the case where the device failure follows an exponential distribution, the exponential distribution parameter is λ, and the reliability life of the reliability is R _i is calculated according to the following formula:

For the case where the device failure follows the Weibull distribution, the scale parameter and shape parameter are η and m, respectively, and the reliability life with the reliability R _i is calculated according to the following formula:

For the case where the device failure follows a log-normal distribution, the mean and standard deviation parameters are μ and σ, respectively, and the distribution function of the standard normal distribution is denoted as Φ, then the reliability life with reliability R _i is calculated according to the following formula:

表示板级组件上第i个器件在分担的可靠性水平R_i下的可靠寿命。According to the above formula, the reliability life of each unit on each board-level component under its respective shared reliability value can be obtained, which is recorded as:

Represents the reliable lifetime of the _i -th device on the board-level component under the shared reliability level Ri.

S205: Predict the board-level component life of the board-level component according to the unit life of each unit.

Among them, in practical applications, a conservative modeling strategy is adopted, and the lower limit of the unit life of each unit constituting the board-level component can be taken, which is defined as the reliable life of the board-level component at the specified reliability level R ₀ , thus The formula for calculating the life of the board-level components is:

in:

In the above-mentioned board-level component life prediction method, by obtaining the reliability function of the board-level component and the importance factor of each unit in the board-level component, the shared reliability value of each unit can be determined according to the importance factor and the preset reliability value, Then calculate the unit life of each unit in the board level component, and predict the board level component life of the board level component according to the unit life of each unit, which can adapt to the life evaluation of different types of electronic components, and according to the important components of the board level component device. The corresponding unit reliability is assigned to the degree, which can reduce the complexity of the life evaluation process while ensuring the accuracy of the life evaluation.

In one embodiment, as shown in FIG. 3 , the above-mentioned obtaining the reliability function of the board-level component includes the following steps:

S301: Obtain failure models and failure mechanisms of board-level components.

Among them, the failure physical model of electronic components includes failure physical models of different mechanisms such as chip failure, thermal fatigue, vibration fatigue, high temperature degradation, and packaging failure. Chip failure refers to the loss of chip function; thermal fatigue refers to the repeated changes in ambient temperature and repeated changes in thermal stress, thereby causing fatigue damage to electronic components; vibration fatigue refers to structural damage to electronic components caused by vibration; high temperature degradation Refers to performance degradation due to excessive ambient temperature; package failure refers to device failure due to overstress or wear. In practical applications, manual settings or automatic search matching can be used to configure the corresponding failure physical model for each device/structure of the board-level component, and at the same time specify the failure time distribution matched by each failure model, and set the failure physical model. parameters and assignment parameters.

S302: Determine the target failure mechanism of each unit according to the failure model and each failure mechanism.

Among them, each device/structure of a board-level component may have multiple failure mechanisms at the same time, and the failure times of different failure mechanisms have different distributions. Common failure distributions are: exponential distribution, log-normal distribution and Weibull distribution. In the case of different failure mechanisms, the life of the board-level components is different, and the main failure mechanism of the failure mechanism corresponding to the minimum life value is taken, that is, the target failure mechanism.

S303: Determine the reliability function of the board-level component according to the target failure mechanism of each unit.

Among them, take the failure distribution function of the target failure mechanism as the failure distribution function of each unit, denoted as F _i (t), then the reliability function of device i is denoted as R _i (t)=1-Fi ₍ t), and the plate The reliability function of the level component is expressed as:

In the above embodiment, the target failure mechanism of each unit is determined by acquiring the failure model of the board-level component and each failure mechanism, and then the reliability function of the board-level component is determined according to the target failure mechanism of each unit, which can be based on the life of the device level. The distribution data establishes the mapping relationship of the life distribution of the board-level components, reducing the complexity of the life evaluation process.

In one embodiment, as shown in FIG. 4 , the above-mentioned determination of the reliability function of the board-level component according to the target failure mechanism of each unit includes the following steps:

S401: Determine the first reliability function of each unit according to the target failure mechanism.

Among them, taking the failure distribution function of the target failure mechanism as the failure distribution function of each unit, denoted as F _i (t), the first reliability function of each unit can be expressed as: R _i (t)=1-Fi ₍ t),

S402: Obtain the failure distribution function of the target failure mechanism.

Among them, the common failure distributions are: exponential distribution, lognormal distribution and Weibull distribution.

S403: Establish a reliability function of the board-level component according to the first reliability function and the failure distribution function.

Among them, the failure distribution of a single device/structure may be any one of exponential distribution, Weibull distribution or log-normal distribution, so the established reliability function R _s (t) of board-level components is three failure distributions Product of reliability functions for any combination of forms. For example, for a board-level assembly consisting of 5 devices, the failure time distribution of the 5 devices is shown in Table 1 below:

Table 1

For the board-level components composed of the above five devices, when they are combined in series, the reliability function is:

In the formula, t represents the failure time, and the meanings of the other parameters are shown in Table 1 above.

In the above embodiment, by obtaining the failure distribution function of the target failure mechanism, and determining the first reliability function of each unit according to the target failure mechanism, the reliability function of the board-level component is established, and the board can be established based on the device-level life distribution data. The mapping relationship of the life distribution of the grade components reduces the complexity of the life evaluation process.

In one embodiment, obtaining the importance factor of each unit in the board-level assembly includes: determining the importance factor of each unit according to the importance of each unit constituting the board-level component.

Among them, the reliability of the board-level components is assigned to each device according to the importance of the components, and the importance factor of each component of the board-level component can be set as δ _i (i=1,2,...N), and the importance degree The value range of the factor is limited to δ _i ∈(0,1].

In the above embodiment, the importance factor of each unit is determined according to the importance of each unit constituting the board-level assembly, and the reliable life of each unit under the corresponding shared reliability can be calculated, and then the life of the board-level assembly can be obtained. While improving the accuracy of life evaluation, the complexity of the life evaluation process is reduced.

In one embodiment, calculating the unit life of each unit according to the reliability function and the shared reliability value of each unit includes: determining the unit life of each unit according to the reliability function, the shared reliability value of each unit, and the preset reliability value. Unit reliability function: Calculate the unit life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

Among them, according to the reliability value shared by each device under the premise of the preset reliability of board-level components, combined with the failure distribution (such as exponential distribution, lognormal distribution, Weibull distribution) obeyed by each device, in Under the premise that the reliability of each device is known, the unit life of each unit can be calculated by inversely solving the reliability functions of the three failure distributions.

In the above embodiment, the unit reliability function of each unit is determined according to the reliability function, the shared reliability value of each unit, and the preset reliability value, and the unit life of each unit is calculated in combination with the failure distribution function of the target failure mechanism, and then the unit life is obtained. The life of board-level components can reduce the complexity of the life evaluation process while ensuring the accuracy of life evaluation.

In one embodiment, predicting the board-level component life of the board-level component according to the unit life of each unit includes: obtaining a minimum value of the unit life of each unit as the board-level component life of the board-level component.

Among them, by adopting a conservative modeling strategy, the lower limit of the unit life of each unit constituting the board-level component can be taken and defined as the reliable life of the board-level component under the specified reliability level.

In the above embodiment, by obtaining the minimum value of the unit life of each unit as the board-level component life of the board-level component, the accuracy of the life evaluation can be ensured, and the life of the board-level component is determined by the unit life of each unit, which can simplify the life evaluation. process, reducing the complexity of life assessment.

In one embodiment, the above-mentioned method for predicting the life of a board-level component further includes: calculating at least one of an average life and a median life of each unit.

根据各单元失效分布的类型以及目标失效机理，将目标失效机理的数学期望值作为个单元的平均寿命，则各单元目标失效机理的平均寿命分别记作：

将平均寿命的最小值作为板级组件平均寿命即平均无故障工作时间(Mean Time BetweenFailure，MTBF)，可表示为：Among them, when R ₀ is set to 0.5, the reliability life at this time is the median life, namely:

According to the type of failure distribution of each unit and the target failure mechanism, the mathematical expectation value of the target failure mechanism is taken as the average life of each unit, and the average life of each unit target failure mechanism is respectively recorded as:

The minimum value of the average lifespan is taken as the average lifespan of board-level components, that is, the mean time between failures (MTBF), which can be expressed as:

In the above embodiment, by calculating the average life or median life of each unit, the accuracy of life evaluation can be ensured, and the life evaluation requirements of various electronic components can be met.

In one embodiment, as shown in FIG. 5 , a method for predicting the life of a board-level component is provided, and the method includes the following steps:

S1: Obtain failure models and failure mechanisms of board-level components.

S2: Determine the target failure mechanism of each unit according to the failure model and each failure mechanism.

S3: Determine the first reliability function of each unit according to the target failure mechanism.

S4: Obtain the failure distribution function of the target failure mechanism.

S5: Establish a reliability function of the board-level component according to the first reliability function and the failure distribution function.

S6: Obtain the preset reliability value of the board-level component.

S7: Determine the importance factor of each unit according to the importance of each unit constituting the board-level assembly.

S8: Determine the shared reliability value of each unit according to the importance factor and the preset reliability value.

S9: Determine the unit reliability function of each unit according to the reliability function, the shared reliability value of each unit, and the preset reliability value.

S10: Calculate the unit life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

S11: Obtain the minimum value of the unit lifetime of each unit as the board-level component lifetime of the board-level component.

S12: Calculate at least one of the average life and the median life of each unit.

In the above embodiment, by obtaining the reliability function of the board-level component and the importance factor of each unit in the board-level component, the shared reliability value of each unit can be determined according to the importance factor and the preset reliability value, and then the board-level component can be calculated. The unit life of each unit in the module, and the board-level component life of the board-level component is predicted according to the unit life of each unit, which can adapt to the life evaluation of different types of electronic components, and allocate corresponding components according to the importance of the board-level components. Unit reliability can reduce the complexity of the life evaluation process while ensuring the accuracy of life evaluation.

It should be understood that, although the steps in the flowcharts involved in the above embodiments are sequentially displayed according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, the execution of these steps is not strictly limited to the order, and these steps may be performed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but may be performed at different times The execution order of these steps or phases is not necessarily sequential, but may be performed alternately or alternately with other steps or at least a part of the steps or phases in the other steps.

In one embodiment, a board-level component life assessment method based on reliability factor sharing is provided. The flow chart of the method is shown in FIG. 6 , and the method includes the following steps:

(1) Failure model and failure distribution configuration: According to the board-level component composition information, manual setting or automatic search and matching are used to configure the corresponding failure physical model for each component/structure of the board-level component, and at the same time specify the matching failure model. Failure time distribution, and setting the parameters of the failure physics model and assigning parameters.

(2) Confirmation of device main mechanism distribution: each device/structure of board-level components may have multiple failure mechanisms at the same time, and the failure time of different failure mechanisms has different distributions. Three common failure distributions are: exponential distribution, logarithmic distribution Normal and Weibull distributions.

(3) Establish the reliability function of board-level components: the failure distribution of a single device/structure may be any one of exponential distribution, Weibull distribution or log-normal distribution, so the established reliability function R of board-level components _s (t) is the product of reliability functions of any combination of the three failure distribution forms. According to the reliability functions of exponential distribution, Weibull distribution or log-normal distribution, R _s (t) is a variable limit Nonelementary functions of integrals.

(4) Setting the reliability level of the board-level components: To calculate the reliability life of the board-level components, it is necessary to specify the reliability value R _s (t)=R ₀ of the board-level components. When this value is specified, its reliability life can be obtained by inversely solving the reliability function.

(5) Calculate the shared value of the reliability level of each component of the board-level component: adopt the manual or automatic batch setting method for the established board-level component, and set the importance factor of each component of the board-level component, according to the weight value of the importance factor. Set and calculate the shared value of the reliability level of each component of the board-level component. Figure 7 shows a schematic diagram of the calculation of the shared value of the reliability level of each device.

(6) Calculation of device reliability life based on shared reliability: On the premise that the reliability of each device is known, the reliability functions of the three failure distributions are reversely solved.

(7) Calculation of the reliable life of board-level components based on the sharing of reliability factors: Take the lower limit of the reliable life of all the effective failure points of the components/structures constituting the board-level component under their respective shared reliability levels, and define it as the board-level component the reliability life at the specified reliability level.

(8) Calculation of the median life of board-level components: The calculation of the median life of board-level components only needs to set the preset reliability level to 0.5.

(9) Calculation of MTBF of board-level components: After the main failure mechanism of the device/structure is confirmed, the mathematical expectation value of the main failure mechanism distribution of each device is used to calculate the average life of each device failure time, and the minimum value of the average life of each device is calculated. as the average lifetime of board-level components.

Through the above steps, the life evaluation of the board-level components based on the reliability factor sharing solution can be completed. This method can calculate the reliable life and median life under any reliability for board-level components whose constituent devices/structures obey any distribution, and can also calculate the approximate value of MTBF of board-level components.

Based on the same inventive concept, an embodiment of the present application further provides a board-level component life prediction apparatus for implementing the above-mentioned board-level component life prediction method. The solution to the problem provided by the device is similar to the solution described in the above method, so the specific limitations in one or more embodiments of the device for predicting the life of a board-level component provided below can be referred to above for the board-level component The limitations of the life prediction method are not repeated here.

In one embodiment, as shown in FIG. 8 , a board-level component life prediction device is provided, including: a reliability function acquisition module 10 , an importance factor acquisition module 20 , a shared reliability determination module 30 , and a unit life calculation module 40 and a board level component life prediction module 50, wherein:

The reliability function obtaining module 10 is used for obtaining the reliability function and the preset reliability value of the board-level component;

The importance factor acquiring module 20 is used to acquire the importance factor of each unit in the board-level assembly;

The shared reliability determination module 30, configured to obtain the shared reliability value of each unit according to the importance factor and the preset reliability value;

The unit life calculation module 40 is used for calculating the unit life of each unit according to the reliability function and the shared reliability value of each unit;

The board-level component life prediction module 50 is used to predict the unit life of each unit according to the reliability function and the shared reliability value of each unit.

In one embodiment, a device for predicting the life of a board-level component is provided, and the above-mentioned reliability function acquisition module includes: a failure information acquisition unit, a target mechanism determination unit, and a reliability function determination unit, wherein:

The failure information acquisition unit is used to obtain the failure model of the board-level component and each failure mechanism;

The target mechanism determination unit is used to determine the target failure mechanism of each unit according to the failure model and each failure mechanism;

The reliability function determination unit is used to determine the reliability function of the board-level component according to the target failure mechanism of each unit.

In one embodiment, an apparatus for predicting the life of a board-level component is provided, and the above-mentioned reliability function determination unit includes: a first reliability determination subunit, a failure distribution acquisition subunit, and a reliability function establishment subunit, wherein:

a first reliability determination subunit, used for determining the first reliability function of each unit according to the target failure mechanism;

The failure distribution obtaining subunit is used to obtain the failure distribution function of the target failure mechanism;

The reliability function establishment subunit is used for establishing the reliability function of the board-level component according to the first reliability function and the failure distribution function.

In one embodiment, a device for predicting the life of a board-level component is provided, and the above-mentioned importance factor obtaining module is further configured to determine the importance factor of each unit according to the importance of each unit constituting the board-level component.

In one embodiment, a device for predicting the life of a board-level component is provided, and the above-mentioned unit life calculation module includes: a unit reliability function determination unit and a unit life calculation unit, wherein:

a unit reliability function determination unit, configured to determine the unit reliability function of each unit according to the reliability function, the shared reliability value of each unit and the preset reliability value;

The unit life calculation unit is used to calculate the unit life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

In one embodiment, a device for predicting the life of a board-level component is provided, and the above-mentioned board-level component life prediction module is further configured to obtain the minimum unit life of each unit as the board-level component life of the board-level component.

In one embodiment, an apparatus for predicting the life of a board-level component is provided, and the above-mentioned board-level component life prediction module is further configured to calculate at least one of an average life and a median life of each unit.

Each module in the above-mentioned device for predicting the life of a board-level component can be implemented in whole or in part by software, hardware, and combinations thereof. The above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or stored in the memory in the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

In one embodiment, a computer device is provided, and the computer device may be a terminal, and its internal structure diagram may be as shown in FIG. 9 . The computer equipment includes a processor, memory, a communication interface, a display screen, and an input device connected by a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium, an internal memory. The nonvolatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the execution of the operating system and computer programs in the non-volatile storage medium. The communication interface of the computer equipment is used for wired or wireless communication with an external terminal, and the wireless communication can be realized by WIFI, mobile cellular network, NFC (Near Field Communication) or other technologies. The computer program, when executed by a processor, implements a board-level component lifetime prediction method.

Those skilled in the art can understand that the structure shown in FIG. 9 is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer equipment to which the solution of the present application is applied. Include more or fewer components than shown in the figures, or combine certain components, or have a different arrangement of components.

In one embodiment, a computer device is provided, including a memory and a processor, a computer program is stored in the memory, and the processor implements the following steps when executing the computer program: acquiring a reliability function of a board-level component and a preset reliability value; obtain the importance factor of each unit in the board-level assembly; determine the shared reliability value of each unit according to the importance factor and the preset reliability value; calculate the unit of each unit according to the reliability function and the shared reliability value of each unit Life; predicts the board-level component life of the board-level component based on the unit life of each unit.

In one embodiment, obtaining the reliability function of the board-level component involved in the execution of the computer program by the processor includes the following steps: obtaining a failure model and each failure mechanism of the board-level component; determining the reliability of each unit according to the failure model and each failure mechanism Target failure mechanism; the reliability function of board-level components is determined according to the target failure mechanism of each unit.

In one embodiment, determining the reliability function of the board-level component according to the target failure mechanism of each unit involved when the processor executes the computer program includes the following steps: determining the first reliability function of each unit according to the target failure mechanism; obtaining the target The failure distribution function of the failure mechanism; the reliability function of the board-level component is established according to the first reliability function and the failure distribution function.

In one embodiment, obtaining the importance factor of each unit in the board-level assembly involved in executing the computer program by the processor includes the following steps: determining the importance factor of each unit according to the importance of each unit constituting the board-level component.

In one embodiment, calculating the unit life of each unit according to the reliability function and the shared reliability value of each unit involved in the execution of the computer program by the processor includes the following steps: according to the reliability function, the shared reliability value of each unit, and The unit reliability function of each unit is determined by the preset reliability value; the unit life of each unit is calculated according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

In one embodiment, when the processor executes the computer program, predicting the board-level component life of the board-level component according to the unit life of each unit includes the following steps: obtaining a minimum value of the unit life of each unit as the board-level component of the board-level component component life.

In one embodiment, the processor executes the computer program to further implement the following steps: calculating at least one of the average lifespan and the median lifespan of each unit.

In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: acquiring a reliability function and a preset reliability value of a board-level component; acquiring The importance factor of each unit in the board-level assembly; the shared reliability value of each unit is determined according to the importance factor and the preset reliability value; the unit life of each unit is calculated according to the reliability function and the shared reliability value of each unit; according to The unit lifetime of each unit predicts the board level component lifetime of the board level component.

In one embodiment, obtaining the reliability function of the board-level component involved in the execution of the computer program by the processor includes the following steps: obtaining a failure model of the board-level component and each failure mechanism; determining each unit according to the failure model and each failure mechanism The target failure mechanism of each unit is determined; the reliability function of the board-level assembly is determined according to the target failure mechanism of each unit.

In one embodiment, determining the reliability function of the board-level component according to the target failure mechanism of each unit involved when the computer program is executed by the processor includes the following steps: determining the first reliability function of each unit according to the target failure mechanism; obtaining The failure distribution function of the target failure mechanism; the reliability function of the board-level component is established according to the first reliability function and the failure distribution function.

In one embodiment, obtaining the importance factor of each unit in the board-level assembly involved when the computer program is executed by the processor includes the following steps: determining the importance factor of each unit according to the importance of each unit constituting the board-level component.

In one embodiment, the calculation of the unit life of each unit according to the reliability function and the shared reliability value of each unit involved when the computer program is executed by the processor includes the following steps: according to the reliability function, the shared reliability value of each unit The unit reliability function of each unit is determined by the preset reliability value; the unit life of each unit is calculated according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

In one embodiment, when the computer program is executed by the processor, predicting the board-level component life of the board-level component according to the unit life of each unit includes the following steps: obtaining the minimum value of the unit life of each unit as the board of the board-level component grade component life.

In one embodiment, the computer program further implements the following steps when executed by the processor: calculating at least one of the average lifespan and the median lifespan of each unit.

In one embodiment, a computer program product is provided, comprising a computer program that, when executed by a processor, implements the following steps:

Obtain the reliability function and preset reliability value of the board-level component; obtain the importance factor of each unit in the board-level component; determine the shared reliability value of each unit according to the importance factor and the preset reliability value; according to the reliability function and the shared reliability value of each unit to calculate the unit life of each unit; predict the board-level component life of the board-level component according to the unit life of each unit.

In one embodiment, obtaining the reliability function of the board-level component involved in the execution of the computer program by the processor includes the following steps: obtaining a failure model of the board-level component and each failure mechanism; determining each unit according to the failure model and each failure mechanism The target failure mechanism of each unit is determined; the reliability function of the board-level assembly is determined according to the target failure mechanism of each unit.

In one embodiment, determining the reliability function of the board-level component according to the target failure mechanism of each unit involved when the computer program is executed by the processor includes the following steps: determining the first reliability function of each unit according to the target failure mechanism; obtaining The failure distribution function of the target failure mechanism; the reliability function of the board-level component is established according to the first reliability function and the failure distribution function.

In one embodiment, obtaining the importance factor of each unit in the board-level assembly involved when the computer program is executed by the processor includes the following steps: determining the importance factor of each unit according to the importance of each unit constituting the board-level component.

In one embodiment, the calculation of the unit life of each unit according to the reliability function and the shared reliability value of each unit involved when the computer program is executed by the processor includes the following steps: according to the reliability function, the shared reliability value of each unit The unit reliability function of each unit is determined by the preset reliability value; the unit life of each unit is calculated according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

In one embodiment, when the computer program is executed by the processor, predicting the board-level component life of the board-level component according to the unit life of each unit includes the following steps: obtaining the minimum value of the unit life of each unit as the board of the board-level component grade component life.

In one embodiment, the computer program further implements the following steps when executed by the processor: calculating at least one of the average lifespan and the median lifespan of each unit.

Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be implemented by instructing relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage In the medium, when the computer program is executed, it may include the processes of the above-mentioned method embodiments. Wherein, any reference to a memory, a database or other media used in the various embodiments provided in this application may include at least one of a non-volatile memory and a volatile memory. Non-volatile memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetic variable memory (Magnetoresistive Random Memory) Access Memory (MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (PCM), graphene memory, and the like. Volatile memory may include random access memory (Random Access Memory, RAM) or external cache memory, and the like. As an illustration and not a limitation, the RAM can be in various forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM). The database involved in the various embodiments provided in this application may include at least one of a relational database and a non-relational database. The non-relational database may include a blockchain-based distributed database, etc., but is not limited thereto. The processors involved in the various embodiments provided in this application may be general-purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, data processing logic devices based on quantum computing, etc., and are not limited to this.

The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features It is considered to be the range described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent of the present application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the present application should be determined by the appended claims.

Claims (10)

1. A board level component life prediction method, the method comprising:

acquiring a reliability function and a preset reliability value of the board-level assembly;

acquiring importance factors of each unit in the board-level assembly;

determining a sharing reliability value of each unit according to the importance factor and the preset reliability value;

calculating the unit life of each unit according to the reliability function and the sharing reliability value of each unit;

predicting a board level assembly life of the board level assembly based on the unit life of each of the units.

2. The method of claim 1, wherein obtaining a reliability function for board level components comprises:

acquiring a failure model and failure mechanisms of the board-level assembly;

determining a target failure mechanism of each unit according to the failure model and each failure mechanism;

determining a reliability function for the board level assembly based on the target failure mechanism for each of the cells.

3. The method of claim 2, wherein determining a reliability function for a board level assembly based on the target failure mechanism for each of the cells comprises:

determining a first reliability function of each unit according to the target failure mechanism;

acquiring a failure distribution function of the target failure mechanism;

and establishing a reliability function of the board-level assembly according to the first reliability function and the failure distribution function.

4. The method of claim 1, wherein obtaining importance factors of units in the board level assembly comprises:

determining an importance factor of each of the units constituting the board level assembly according to the importance of each of the units.

5. The method of any of claims 1 to 4, wherein said calculating a cell life of each of said cells from said reliability function and a shared reliability value of each of said cells comprises:

determining a unit reliability function of each unit according to the reliability function, the sharing reliability value of each unit and the preset reliability value;

and calculating the unit service life of each unit according to the unit reliability function of each unit and the failure distribution function of the target failure mechanism.

6. The method of any of claims 1 to 5, wherein predicting board level assembly life for the board level assembly based on unit life of each of the units comprises:

and acquiring the minimum value of the unit life of each unit as the board-level assembly life of the board-level assembly.

7. The method of claim 1, further comprising:

at least one of the average life, the median life, of each of the cells is calculated.

8. A board level component life prediction apparatus, the apparatus comprising:

the reliability function acquisition module is used for acquiring a reliability function and a preset reliability value of the board-level assembly;

the importance factor acquisition module is used for acquiring importance factors of all units in the board-level assembly;

a sharing reliability determining module, configured to obtain a sharing reliability value of each unit according to the importance factor and the preset reliability value;

a unit life calculating module, configured to calculate a unit life of each unit according to the reliability function and the sharing reliability value of each unit;

and the board-level assembly service life prediction module is used for predicting the service life of each unit according to the reliability function and the sharing reliability value of each unit.

9. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor, when executing the computer program, implements the steps of the method of any of claims 1 to 7.

10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 7.

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