CN115232601A - Preparation and application of semiconductor type organic silicon OCA optical cement - Google Patents
Preparation and application of semiconductor type organic silicon OCA optical cement Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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Abstract
The invention discloses a preparation method and application of semiconductor type organic silicon OCA optical cement, belonging to the technical field of OCA optical cement, comprising silicone rubber, silicone oil, silicone resin, a cross-linking agent, a catalyst, a conductive agent, an antioxidant, an ultraviolet absorbent, an organic solvent and a stabilizer, wherein the components in parts by weight of the raw materials are as follows: 30-70 parts of silicon rubber, 20-50 parts of silicon oil, 5-30 parts of silicon resin, 0-10 parts of a cross-linking agent, 0-5 parts of a catalyst, 0-10 parts of a conductive agent, 2-6 parts of an antioxidant, 2-6 parts of an ultraviolet absorbent, 2-6 parts of an organic solvent and 2-6 parts of a stabilizer, wherein the silicon rubber is one or more of methyl silicone rubber, vinyl silicone oil, methyl phenyl silicon rubber, methyl vinyl silicon rubber and methyl vinyl phenyl silicon rubber, and the silicon oil is one or more of methyl silicone oil, methyl vinyl silicon oil and methyl vinyl phenyl silicon oil.
Description
Technical Field
The invention belongs to the technical field of OCA (optical clear adhesive) optical cement, and particularly relates to preparation and application of a semiconductor type organic silicon OCA optical cement.
Background
In recent years, with the rapid development of the electronic screen industry, people have higher and higher requirements on display screens, which also promotes the need for further optimization of bonding materials such as adhesives. The traditional optical cement generally requires that the touch screen is tightly attached to the panel, so that dust, water vapor and the like can enter everywhere. Meanwhile, the optical performance is good, so that the image display effect of screen reflection is good. With the further expansion of the market of large-size display screens, the environments of the use ends of the display screens are more diversified originally. In addition to the conventional common use environment, the use environments of high temperature, high humidity, ultra-low temperature, ultraviolet rays and the like which are not friendly to the display screen are increasing. In addition, the normal use of the display screen in high altitude or low pressure environment is also considered as an important research direction.
Currently, OCA optical adhesives can be classified into acrylate optical adhesives, epoxy resin optical adhesives, polyurethane optical adhesives, and organic silicon resin optical adhesives according to the types of resins. Compared with other resins, the organic silicon resin has the advantages of better weather resistance, yellowing resistance, aging resistance and the like, so that the organic silicon resin can be applied to various severe use environments. Especially, the contrast ratio under strong light irradiation can be increased, the visibility and the display performance inside and outside the door can be improved, a better display effect can be provided, and the application in outdoor products can be favorably realized. On the other hand, silicone OCAs currently have poor adhesion strength and peel strength much lower than the rest of the resins.
Disclosure of Invention
The invention aims to solve the problems in the prior art and discloses preparation and application of a semiconductor type organic silicon OCA optical adhesive. Meanwhile, the preparation method is easy to operate and has good market application prospect.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor type organic silicon OCA optical cement comprises silicon rubber, silicon oil, silicon resin, a cross-linking agent, a catalyst, a conductive agent, an antioxidant, an ultraviolet absorbent, an organic solvent and a stabilizer, and the components in parts by weight of the raw materials are as follows: 30-70 parts of silicon rubber, 20-50 parts of silicone oil, 5-30 parts of silicone resin, 0-10 parts of a cross-linking agent, 0-5 parts of a catalyst, 0-10 parts of a conductive agent, 2-6 parts of an antioxidant, 2-6 parts of an ultraviolet absorbent, 2-6 parts of an organic solvent and 2-6 parts of a stabilizer.
Preferably, the silicone rubber is one or more of methyl silicone rubber, vinyl silicone oil, methyl phenyl silicone rubber, methyl vinyl silicone rubber and methyl vinyl phenyl silicone rubber.
Preferably, the silicone oil is one or more of methyl silicone oil, methyl vinyl silicone oil and methyl vinyl phenyl silicone oil.
Preferably, the silicone resin is one or more of methyl silicone resin, phenyl silicone resin, methyl phenyl silicone resin and methyl vinyl silicone resin.
Preferably, the cross-linking agent is one or more of 0.01% methyl hydrogen silicone oil, 0.05% methyl hydrogen silicone oil, 0.18% methyl hydrogen silicone oil and 0.5% methyl hydrogen silicone oil.
Preferably, the catalyst is a platinum catalyst.
Preferably, the conductive agent is one or more of carbon nanotubes and an antistatic agent N-103X.
Preferably, the antioxidant is one or more of methyl silicone or phytosterol, and the ultraviolet absorbent is one or more of phenyl ortho-hydroxybenzoate or 2, 4-dihydroxy benzophenone.
Preferably, the organic solvent is at least one selected from the group consisting of methanol, ethanol, toluene, ethyl acetate and butyl acetate, and the stabilizer is di-n-octyltin dilaurate.
Preparation and application of semiconductor type organic silicon OCA optical cement comprise the following steps:
step one, weighing the raw materials in parts by weight, except for the catalyst, mixing all the raw materials and uniformly stirring. Then adding a catalyst, mixing and stirring again to uniformly disperse the catalyst, filtering the mixture for three times by using a 100-mesh stainless steel filter screen, and defoaming to obtain precoated slurry;
coating the precoating slurry on a heavy release film, coating in a scraper type coating mode, and thermally curing the precoating slurry after the precoating slurry is uniformly diffused, wherein the thermal curing time is 2-10min, and the thermal curing temperature is 80-150 ℃ to obtain an optical adhesive primary product;
and step three, covering a layer of light release film on the primary optical adhesive product to obtain the semiconductor type organic silicon OCA optical adhesive.
Compared with the prior art, the invention has the technical effects and advantages that:
(1) The invention utilizes a conductive material to modify organosilicon OCA, and particularly utilizes the conductive property of a carbon nano-tube and the conductive property of an antistatic liquid to modify insulated organosilicon OCA into semiconductor type organosilicon OCA.
(2) The invention breaks through the conventional use of acrylic ester as a basic raw material, and uses silicon rubber, silicon resin and silicon oil as the basic raw material, and because of the inherent characteristics of polysiloxane, the light transmittance of OCA is greatly improved, the ageing resistance is enhanced, the yellowing resistance is improved, and the flexibility is greatly improved.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail by referring to the following examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The OCA optical cement is prepared by a thermal curing mode, precoated slurry is coated on a heavy release film, and the light release film is coated after high-temperature curing to form a BAB type interlayer structure. Wherein from last to being light from type membrane, organosilicon OCA optical cement, heavily from type membrane down in proper order, uncover when using and from type membrane and can laminate.
Example 1
A semiconductor type organic silicon OCA optical cement comprises the following components in parts by weight:
60 parts of silicon rubber
30 portions of silicone oil
20 parts of silicone resin
3 portions of cross-linking agent
Catalyst 0.5 part
0 part of conductive agent
Antioxidant 2 parts
2 portions of ultraviolet absorbent
2 portions of organic solvent
2 portions of stabilizer
The preparation and application of the semiconductor type organic silicon OCA optical cement comprise the following steps:
(1) Weighing the raw materials in parts by weight, mixing all the raw materials except the catalyst, and uniformly stirring. Then adding the catalyst, mixing and stirring again to disperse the catalyst uniformly, filtering the mixture for three times by using a 100-mesh stainless steel filter screen, and defoaming to obtain pre-coating slurry;
(2) Coating the coating slurry on a heavy release film, coating in a scraper type coating mode, and thermally curing the pre-coating slurry after the pre-coating slurry is uniformly diffused (the thermal curing time is 2-10min, and the thermal curing temperature is 80-150 ℃) to obtain an optical adhesive primary product;
(3) And then covering a layer of light release film on the primary optical adhesive product to obtain the semiconductor type organic silicon OCA optical adhesive.
Example 2
A semiconductor type organic silicon OCA optical cement comprises the following components in parts by weight:
60 parts of silicon rubber
30 portions of silicone oil
20 parts of silicone resin
3 portions of cross-linking agent
Catalyst 0.5 part
3 parts of conductive agent
Antioxidant 4 parts
Ultraviolet absorber 4 parts
4 portions of organic solvent
4 portions of stabilizer
The preparation and the application of the semiconductor type organic silicon OCA optical cement comprise the following steps:
(1) Weighing the raw materials in parts by weight, mixing all the raw materials except the catalyst, and uniformly stirring. Then adding the catalyst, mixing and stirring again to disperse the catalyst uniformly, filtering the mixture for three times by using a 100-mesh stainless steel filter screen, and defoaming to obtain pre-coating slurry;
(2) Coating the coating slurry on a heavy release film, coating in a scraper type coating mode, and thermally curing the pre-coating slurry after the pre-coating slurry is uniformly diffused (the thermal curing time is 2-10min, and the thermal curing temperature is 80-150 ℃) to obtain an optical adhesive primary product;
(3) And then covering a layer of light release film on the primary optical adhesive product to obtain the semiconductor type organic silicon OCA optical adhesive.
Example 3
A semiconductor type organic silicon OCA optical cement comprises the following components in parts by weight:
60 parts of silicon rubber
30 portions of silicone oil
20 parts of silicone resin
3 portions of cross-linking agent
Catalyst 0.5 part
6 portions of conductive agent
Antioxidant 5 parts
5 portions of ultraviolet absorbent
5 parts of organic solvent
5 portions of stabilizer
The preparation and the application of the semiconductor type organic silicon OCA optical cement comprise the following steps:
(1) Weighing the raw materials in parts by weight, mixing all the raw materials except the catalyst, and uniformly stirring. Then adding the catalyst, mixing and stirring again to disperse the catalyst uniformly, filtering the mixture for three times by using a 100-mesh stainless steel filter screen, and defoaming to obtain pre-coating slurry;
(2) Coating the coating slurry on a heavy release film, coating in a scraper type coating mode, and thermally curing the pre-coating slurry after the pre-coating slurry is uniformly diffused (the thermal curing time is 2-10min, and the thermal curing temperature is 80-150 ℃) to obtain an optical adhesive primary product;
(3) And then covering a layer of light release film on the optical adhesive primary product to obtain the semiconductor type organic silicon OCA optical adhesive.
Example 4
A semiconductor type organic silicon OCA optical cement comprises the following components in parts by weight:
60 parts of silicon rubber
30 parts of silicone oil
20 parts of silicone resin
3 portions of cross-linking agent
Catalyst 0.5 part
9 portions of conductive agent
6 portions of antioxidant
6 portions of ultraviolet absorbent
6 portions of organic solvent
6 portions of stabilizer
The preparation and the application of the semiconductor type organic silicon OCA optical cement comprise the following steps:
(1) Weighing the raw materials in parts by weight, mixing all the raw materials except the catalyst, and uniformly stirring. Then adding the catalyst, mixing and stirring again to disperse the catalyst uniformly, filtering the mixture for three times by using a 100-mesh stainless steel filter screen, and defoaming to obtain pre-coating slurry;
(2) Coating the coating slurry on a heavy release film, coating in a scraper type coating mode, and thermally curing the pre-coating slurry after the pre-coating slurry is uniformly diffused (the thermal curing time is 2-10min, and the thermal curing temperature is 80-150 ℃) to obtain an optical adhesive primary product;
(3) And then covering a layer of light release film on the primary optical adhesive product to obtain the semiconductor type organic silicon OCA optical adhesive.
Comparative example 1
A semiconductor type organic silicon OCA optical cement comprises the following components in parts by weight:
60 parts of silicon rubber
0 part of silicone oil
20 parts of silicone resin
3 portions of cross-linking agent
Catalyst 0.5 part
9 portions of conductive agent
Antioxidant 3 parts
Ultraviolet absorber 3 parts
3 parts of organic solvent
3 portions of stabilizer
The preparation and application of the semiconductor type organic silicon OCA optical cement comprise the following steps:
(1) Weighing the raw materials in parts by weight, mixing all the raw materials except the catalyst, and uniformly stirring. Then adding the catalyst, mixing and stirring again to disperse the catalyst uniformly, filtering the mixture for three times by using a 100-mesh stainless steel filter screen, and defoaming to obtain pre-coating slurry;
(2) Coating the coating slurry on a heavy release film, coating in a scraper type coating mode, and thermally curing the pre-coating slurry after the pre-coating slurry is uniformly diffused (the thermal curing time is 2-10min, and the thermal curing temperature is 80-150 ℃) to obtain an optical adhesive primary product;
(3) And then covering a layer of light release film on the primary optical adhesive product to obtain the semiconductor type organic silicon OCA optical adhesive.
The OCA optical cement obtained in each of the above examples was tested as follows:
1. transmittance, haze and refractive index measurements:
performance testing | Comparative example 1 | Example 1 | Example 2 | Example 3 | Example 4 |
Light transmittance (%) | 95 | 95 | 95 | 95 | 97 |
Haze (%) | 0.26 | 0.28 | 0.26 | 0.26 | 0.22 |
Refractive index | 1.408 | 1.402 | 1.404 | 1.404 | 1.410 |
2. And (3) testing surface resistivity:
3. and (3) dielectric constant test:
as can be seen from the test results of examples 1 to 4 and comparative example 1, the OCA of the present invention has the following characteristics:
the light transmittance of the OCA optical cement is more than or equal to 95%, the haze value is less than or equal to 0.30%, and the refractive index is more than or equal to 1.40. The invention modifies OCA with insulator property into OCA with semiconductor property, which expands the application field.
It is noted that, herein, relational terms such as one and two are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A semiconductor type organic silicon OCA optical cement is characterized in that: the conductive silicone rubber comprises silicone rubber, silicone oil, silicone resin, a cross-linking agent, a catalyst, a conductive agent, an antioxidant, an ultraviolet absorbent, an organic solvent and a stabilizer, and the components in parts by weight of the raw materials are as follows: 30-70 parts of silicon rubber, 20-50 parts of silicone oil, 5-30 parts of silicone resin, 0-10 parts of a cross-linking agent, 0-5 parts of a catalyst, 0-10 parts of a conductive agent, 2-6 parts of an antioxidant, 2-6 parts of an ultraviolet absorbent, 2-6 parts of an organic solvent and 2-6 parts of a stabilizer.
2. The semiconductor-type silicone OCA optical cement according to claim 1, characterized in that: the silicone rubber is one or more of methyl silicone rubber, vinyl silicone oil, methyl phenyl silicone rubber, methyl vinyl silicone rubber and methyl vinyl phenyl silicone rubber.
3. The semiconductor-type silicone OCA optical cement according to claim 1, characterized in that: the silicone oil is one or more of methyl silicone oil, methyl vinyl silicone oil and methyl vinyl phenyl silicone oil.
4. The semiconductor-type silicone OCA optical cement according to claim 1, characterized in that: the silicone resin is one or more of methyl silicone resin, phenyl silicone resin, methyl phenyl silicone resin and methyl vinyl silicone resin.
5. The semiconductor-type silicone OCA optical adhesive according to claim 1, characterized in that: the cross-linking agent is one or more of 0.01 percent of methyl hydrogen-containing silicone oil, 0.05 percent of methyl hydrogen-containing silicone oil, 0.18 percent of methyl hydrogen-containing silicone oil and 0.5 percent of methyl hydrogen-containing silicone oil.
6. The semiconductor-type silicone OCA optical cement according to claim 1, characterized in that: the catalyst is a platinum catalyst.
7. The semiconductor-type silicone OCA optical cement according to claim 1, characterized in that: the conductive agent is one or more of carbon nano-tubes and an antistatic agent N-103X.
8. The semiconductor-type silicone OCA optical adhesive according to claim 1, characterized in that: the antioxidant is one or more of methyl silicone or plant sterol, and the ultraviolet absorbent is one or more of phenyl ortho-hydroxybenzoate or 2, 4-dihydroxy benzophenone.
9. The semiconductor-type silicone OCA optical cement according to claim 1, characterized in that: the organic solvent is selected from one or more of methanol, ethanol, toluene, ethyl acetate or butyl acetate, and the stabilizer is di-n-octyl tin dilaurate.
10. Preparation and application of the semiconductor-type organic silicon OCA optical cement as described in any one of claims 1-9, characterized by comprising the following steps:
weighing the raw materials in parts by weight, mixing and uniformly stirring all the raw materials except a catalyst, then adding the catalyst, mixing and stirring again to uniformly disperse the catalyst, filtering the mixture for three times by using a 100-mesh stainless steel filter screen, and defoaming the mixture to obtain pre-coating slurry;
coating the pre-coating slurry on a heavy release film, coating in a scraper type coating mode, and thermally curing the pre-coating slurry after the pre-coating slurry is uniformly diffused, wherein the thermal curing time is 2-10min, and the thermal curing temperature is set to be 0-150 ℃ to obtain an optical adhesive primary product;
and step three, covering a layer of light release film on the primary optical adhesive product to obtain the semiconductor type organic silicon OCA optical adhesive.
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