CN115230245A - Heat-insulation card-protecting film and preparation method thereof - Google Patents
Heat-insulation card-protecting film and preparation method thereof Download PDFInfo
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- CN115230245A CN115230245A CN202210726458.XA CN202210726458A CN115230245A CN 115230245 A CN115230245 A CN 115230245A CN 202210726458 A CN202210726458 A CN 202210726458A CN 115230245 A CN115230245 A CN 115230245A
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- 238000009413 insulation Methods 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 194
- 239000004698 Polyethylene Substances 0.000 claims abstract description 41
- 229920000573 polyethylene Polymers 0.000 claims abstract description 41
- 239000004831 Hot glue Substances 0.000 claims abstract description 40
- 229920001577 copolymer Polymers 0.000 claims abstract description 40
- -1 polyethylene Polymers 0.000 claims abstract description 40
- 229920006267 polyester film Polymers 0.000 claims abstract description 30
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000001816 cooling Methods 0.000 claims description 14
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 238000003490 calendering Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000009966 trimming Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract description 9
- 238000005299 abrasion Methods 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
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- 230000007774 longterm Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000005266 casting Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The application provides a heat-insulation card-protecting film and a preparation method thereof, and belongs to the technical field of card-protecting films. This thermal-insulated card protecting membrane comprises BOPET polyester film layer, polyethylene film layer and EVA vinyl acetate copolymer rete in proper order, the ladder groove has been seted up respectively to the relative both sides limit of EVA vinyl acetate copolymer rete lateral surface, ladder inslot wall all scribbles hot melt adhesive layer A, all be equipped with the portion of borduring on the hot melt adhesive layer A. This application is convenient for consolidate the laminating at the card membrane border of protecting of treating protection architecture two sides through the cooperation in package portion and ladder groove, has solved traditional card membrane of protecting and has lacked the problem along reinforced structure, has reduced because the probability that the viscidity weakens the time of treating that the protection architecture is protected and shortens that leads to between the two-layer card membrane edge of protecting.
Description
Technical Field
The application relates to the field of card protection films, in particular to a heat insulation card protection film and a preparation method thereof.
Background
The card protecting film, also called as film, belongs to high grade sheet packing material and is widely used in the sealing and protection of various sheet materials, such as ID card, historical data, photograph and picture.
The card protecting film in the related technology is formed by sequentially compounding a BOPET polyester film layer, a polyethylene film layer and an EVA vinyl acetate copolymer film layer, wherein the BOPET polyester film layer has the characteristics of strong heat insulation property, high strength, good rigidity, transparency, high glossiness and the like; the EVA vinyl acetate copolymer film layer mainly has water resistance and corrosion resistance, so that the assembled card protecting film has structural strength, water resistance and corrosion resistance.
When the aforesaid protects card membrane of structure like this uses, need coat the adhesive with two BOPET polyester film layers and laminate on the two sides of treating the protection architecture, can lack the border reinforced structure owing to the card membrane of treating the protection architecture two sides is being glued, and the long-term adhesive property of using of adhesive can correspondingly weaken simultaneously, makes the time of treating the protection architecture protection to be protected to shorten indirectly.
Disclosure of Invention
In order to make up for the defects, the application provides the heat-insulation card-protecting film and the preparation method thereof, aiming at solving the problem that the traditional card-protecting film lacks an edge reinforcing structure and improving the protective performance of the card-protecting film on a to-be-protected structure to a certain extent.
The embodiment of the application provides a thermal-insulated card-protecting film comprises BOPET polyester film layer, polyethylene film layer and EVA vinyl acetate copolymer rete in proper order, the ladder groove has been seted up respectively to the relative both sides limit of EVA vinyl acetate copolymer rete lateral surface, ladder inslot wall all scribbles hot melt adhesive layer A, all be equipped with the contained portion on the hot melt adhesive layer A.
In a specific embodiment, each of the edge wrapping portions comprises an abrasion-resistant layer and a hot melt adhesive layer B coated on the inner surface of the abrasion-resistant layer, and the hot melt adhesive layer B is adhered to the corresponding hot melt adhesive layer A so as to fix the abrasion-resistant layer at the stepped groove.
In a specific embodiment, two double-sided release paper layers are adhered to the inner wall of each wear-resistant layer through the corresponding hot melt adhesive layer B, wherein after the upper double-sided release paper layer is removed, the wear-resistant layer is fixed to the upper side wall of the BOPET polyester film layer, the upper polyethylene film layer and the EVA vinyl acetate copolymer film layer, after the lower double-sided release paper layer is removed, the wear-resistant layer is fixed to the lower side wall of the BOPET polyester film layer, the lower polyethylene film layer and the EVA vinyl acetate copolymer film layer, and after the middle double-sided release paper layer is removed, the wear-resistant layer is adhered to the side wall of the material to be protected.
In a specific embodiment, the abrasion-resistant layer and the EVA-vinyl acetate copolymer film are adhered to form a same plane, and the abrasion-resistant layer and the EVA-vinyl acetate copolymer film are adhered to form a same plane.
In a specific embodiment, the wear layer is a U-shaped silicone glass resin layer having a thickness of 0.4 to 1.5mm.
A preparation method of a heat insulation card protection film comprises the heat insulation card protection film and the following steps:
s1, bidirectionally pulling up a BOPET polyester substrate to prepare a BOPET polyester film layer;
s2, enabling a polyethylene melt to flow out of the BOPET polyester film layer in the step S1 through a mold, cooling, stretching, calendaring and compound trimming through a roller to form a polyethylene film layer attached to the BOPET polyester film layer;
s3, placing the polyethylene film layer obtained in the step S2 on a mold, enabling two side edges of the polyethylene film layer to be attached to two side walls of the bottom in the mold, enabling EVA vinyl acetate copolymer melt to flow out of the polyethylene film layer through the mold, cooling, stretching, calendering and compositely trimming through a roller to form an EVA vinyl acetate copolymer film layer attached to the polyethylene film layer, and enabling the step groove to be formed through the assistance of the mold;
s4, repeating the three steps to prepare another card protecting film consisting of a BOPET polyester film layer, a polyethylene film layer and an EVA vinyl acetate copolymer film layer, wherein the card protecting film also comprises the stepped groove;
s5, coating hot melt adhesive layers A on the inner walls of the stepped grooves formed on the two side edges of the EVA vinyl acetate copolymer film layer in the step S3;
s6, coating a hot melt adhesive layer B on the inner wall of the wear-resistant layer and attaching the double-sided release paper layer 530;
and S7, laminating the inner side surface of the double-sided release paper layer with the hot melt adhesive layer A to complete the preparation of the heat insulation card protection film.
In a specific embodiment, the temperature of the polyethylene melt in the step S2 is 315-325 ℃, and the temperature of the surface of the cooling roller is 38-44 ℃; the temperature of the EVA vinyl acetate copolymer melt in the step S3 is 175-210 ℃, and the surface temperature of the cooling roller is controlled to be 25-36 ℃.
In a specific embodiment, the surface of the cooling roller in the step S3 is provided with diamond-shaped lattice raised grains.
In a specific embodiment, L-shaped plates with separated openings are connected to the two sides of the inner wall of the mold in step S3 above the polyethylene film layer, and the L-shaped plates facilitate the configuration of the stepped groove.
In a specific embodiment, the gluing operation of the hot melt adhesive layer a in the step S5 and the gluing operation of the hot melt adhesive layer B in the step S6 are performed by using a glue applicator.
The beneficial effect of this application:
the card protecting film edges of the two sides of the structure to be protected are convenient to laminate and are reinforced through the matching of the edge wrapping part and the stepped groove, the problem that the traditional card protecting film lacks of an edge reinforcing structure is solved, and the probability that the time of protecting the structure to be protected is shortened due to weakening of the bonding property between the edges of the two layers of card protecting films is reduced.
Drawings
In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic structural view of a thermal insulation card-protecting film provided by an embodiment of the present application;
FIG. 2 is an enlarged view of FIG. 1 at A according to an embodiment of the present disclosure;
fig. 3 is a schematic structural view of a wrapping portion according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a mold according to an embodiment of the present disclosure.
In the figure: 100-BOPET polyester film layer; a 200-polyethylene film layer; 300-EVA vinyl acetate copolymer film layer; 310-a stepped groove; 400-hot melt adhesive layer A; 500-edge wrapping; 510-a wear resistant layer; 520-hot melt adhesive layer B; 530-double-sided release paper layer; 600-mold.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Referring to fig. 1-3, the present application provides a thermal insulation card-protecting film, which sequentially comprises a BOPET polyester film layer 100, a polyethylene film layer 200, and an EVA vinyl acetate copolymer film layer 300, wherein stepped grooves 310 are respectively formed on two opposite side edges of the outer side surface of the EVA vinyl acetate copolymer film layer 300, inner walls of the stepped grooves 310 are coated with a hot melt adhesive layer a400, and the hot melt adhesive layer a400 is provided with a wrapping portion 500. The card protecting film edges attached to two sides of the structure to be protected are reinforced conveniently through the matching of the edge wrapping part 500 and the stepped groove 310.
The edge wrapping portions 500 respectively comprise an abrasion-resistant layer 510 and a hot melt adhesive layer B520 coated on the inner surface of the abrasion-resistant layer, and the hot melt adhesive layer B520 is adhered to the corresponding hot melt adhesive layer A400 so as to fix the abrasion-resistant layer 510 at the stepped groove 310. Wherein, utilize the bonding of hot melt adhesive layer B520 and hot melt adhesive layer A400 can make wearing layer 510 cladding in two ladder grooves 310 departments that correspond, carry out the border parcel with two-layer card protecting membrane, it consolidates to equal to two-layer card protecting membrane border position promptly, reduce originally and lead to inside treat the probability that the protection structure received the damage prematurely because long-term use bonding dynamics weakens between the card protecting membrane of both sides, intangibly also reduced and protected between the card membranous layer structure because the not good situation that takes place the turn-up of composite effect.
The inner wall of each wear-resistant layer 510 is adhered with two sections of double-sided release paper layers 530 through corresponding hot melt adhesive layers B520, after the upper-section double-sided release paper layer 530 is removed, the wear-resistant layer 510 can be fixed with the side walls of the upper BOPET polyester film layer 100, the polyethylene film layer 200 and the EVA vinyl acetate copolymer film layer 300, after the lower-section double-sided release paper layer 530 is removed, the wear-resistant layer 510 can be fixed with the side walls of the lower BOPET polyester film layer 100, the polyethylene film layer 200 and the EVA vinyl acetate copolymer film layer 300, and after the middle-section double-sided release paper layer 530 is removed, the wear-resistant layer 510 can be adhered with the side wall of the material to be protected. The design of the double-sided release paper layer 530 can reduce the probability that the hot melt adhesive layer a400 coated on the card protection film is damaged by premature contamination when the card protection film is not used.
The wear-resistant layer 510 is flush with the same surface of the EVA vinyl acetate copolymer film 300 after the two are bonded. This provides a more aesthetically pleasing combination of the abrasion-resistant layer 510 and the EVA vinyl acetate copolymer film layer 300.
The wear-resistant layer 510 is a U-shaped silicone glass resin layer with a thickness of 0.4-1.5mm.
Referring to fig. 1-4, a method for preparing a thermal insulation card-protecting film includes the steps of:
s1, the BOPET polyester substrate is subjected to bidirectional pulling to prepare the BOPET polyester film layer 100.
The BOPET polyester base material is stretched in a two-way stretching mode specifically comprising drying PET resin → extruding casting sheet → longitudinal stretching of thick sheet → transverse stretching.
S2, enabling the polyethylene melt to flow out of the BOPET polyester film layer 100 in the step S1 through a die, cooling, stretching, calendering and compositely trimming through a roller to form a polyethylene film layer 200 attached to the BOPET polyester film layer.
S3, the polyethylene film layer 200 obtained in the step S2 is placed on a mold 600, two side edges of the polyethylene film layer 200 are attached to two side walls of the bottom in the mold, then EVA vinyl acetate copolymer melt flows out of the polyethylene film layer 200 through the mold, the EVA vinyl acetate copolymer melt is cooled, stretched, calendered and subjected to composite trimming through a roller, an EVA vinyl acetate copolymer film layer 300 attached to the polyethylene film layer 200 is formed, and meanwhile the stepped groove 310 is formed through assistance of the mold 600.
The temperature of the polyethylene melt in the step S2 is 315-325 ℃, and the surface temperature of the cooling roller is 38-44 ℃; the temperature of the EVA vinyl acetate copolymer melt in the step S3 is 175-210 ℃, and the surface temperature of the cooling roller is controlled to be 25-36 ℃.
And a diamond-shaped lattice raised grain is arranged on the surface of the cooling roller in the step S3. The design of the protruding grains of the rhombic lattices can enable the grains of the card protecting film pressed out to be marks capable of identifying the thickness, the model and the size of the card protecting film, so that the card protecting film is easy to identify.
L-shaped plates having separate openings are connected to both sides of the inner wall of the mold 600 above the polyethylene film layer 200 in step S3, and the L-shaped plates contribute to the construction of the stepped groove 310. The stepped groove 310 is formed in the inner cavity of the mold 600 more easily by setting the L-shaped plate, so that the better card protection film combination of the subsequent edge covering part 500 is facilitated.
And S4, repeating the three steps to prepare another card protection film consisting of the BOPET polyester film layer 100, the polyethylene film layer 200 and the EVA vinyl acetate copolymer film layer 300, and also containing the stepped groove 310.
S5, coating hot melt adhesive layers A400 on the inner walls of the stepped grooves 310 formed on the two side edges of the EVA vinyl acetate copolymer film layer 300 in the step S3.
S6, coating a hot melt adhesive layer B520 on the inner wall of the wear-resistant layer 510 and attaching a double-sided release paper layer 530.
The gluing operation of the hot melt adhesive layer a400 in the step S5 and the gluing operation of the hot melt adhesive layer B520 in the step S6 both adopt a glue applicator operation.
S7, the inner side face of the double-sided release paper layer 530 is attached to the hot melt adhesive layer A400, and then the preparation of the heat insulation card protection film can be completed.
When in use:
after the double-sided release paper layers 530 at the lower sections of the two wear-resistant layers 510 are uncovered, the wear-resistant layers 510 can be fixed with the side walls of the upper BOPET polyester film layer 100, the polyethylene film layer 200 and the EVA vinyl acetate copolymer film layer 300, the adhesive is coated on the outer surface of the upper BOPET polyester film layer 100 at the moment, a structure to be protected is placed, the adhesive is coated on the outer surface of the BOPET polyester film layer 100 in the card protection film to be prepared, the upper card protection film is attached to the upper surface of the structure to be protected, and after the double-sided release paper layers 530 at the upper sections of the two wear-resistant layers 510 are uncovered, the side walls of the upper BOPET polyester film layer 100, the polyethylene film layer 200 and the EVA vinyl acetate copolymer film layer 300 in the upper card protection film are attached to the wear-resistant layers 510, so that the traditional card protection film is reinforced, and the structure required to be protected by the card protection film is indirectly protected.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a thermal-insulated card protecting film comprises BOPET polyester film layer, polyethylene film layer and EVA vinyl acetate copolymer rete in proper order, its characterized in that, the ladder groove has been seted up respectively to the relative both sides limit of EVA vinyl acetate copolymer rete lateral surface, ladder inslot wall all scribbles hot melt adhesive layer A, all be equipped with package limit portion on the hot melt adhesive layer A.
2. The heat insulation card protection film according to claim 1, wherein each of the edge covering portions comprises a wear-resistant layer and a hot melt adhesive layer B coated on an inner surface of the wear-resistant layer, and the hot melt adhesive layer B is adhered to the corresponding hot melt adhesive layer A so as to fix the wear-resistant layer at the stepped groove.
3. The thermal insulation card-protecting film according to claim 2, wherein two double-sided release paper layers are adhered to the inner wall of each wear-resistant layer through the corresponding hot melt adhesive layer B, wherein the upper double-sided release paper layer is removed to fix the wear-resistant layer to the upper side walls of the BOPET polyester film layer, the polyethylene film layer and the EVA vinyl acetate copolymer film layer, and the lower double-sided release paper layer is removed to fix the wear-resistant layer to the lower side walls of the BOPET polyester film layer, the polyethylene film layer and the EVA vinyl acetate copolymer film layer.
4. The thermal insulation card-protecting film according to claim 3, wherein the wear-resistant layer and the EVA-vinyl acetate copolymer film are adhered on the same plane.
5. The thermal insulation card-protecting film according to claim 4, wherein the wear-resistant layer is a U-shaped silicone glass resin layer with a thickness of 0.4-1.5mm.
6. The preparation method of the heat-insulation card-protecting film is characterized by comprising the following steps
The thermal card-protecting film as claimed in any one of claims 1 to 5, and the steps of:
s1, bidirectionally pulling up a BOPET polyester substrate to prepare a BOPET polyester film layer;
s2, enabling the polyethylene melt to flow out of the BOPET polyester film layer in the step S1 through a die, cooling, stretching, calendering and compositely trimming through a roller to form a polyethylene film layer attached to the BOPET polyester film layer;
s3, placing the polyethylene film layer obtained in the step S2 on a mold, enabling two side edges of the polyethylene film layer to be attached to two side walls of the bottom in the mold, enabling EVA vinyl acetate copolymer melt to flow out of the polyethylene film layer through the mold, cooling, stretching, calendering and compound trimming through a roller to form an EVA vinyl acetate copolymer film layer attached to the polyethylene film layer, and enabling the stepped groove to be formed through assistance of the mold;
s4, repeating the three steps to prepare another card protection film consisting of a BOPET polyester film layer, a polyethylene film layer and an EVA vinyl acetate copolymer film layer, wherein the card protection film also comprises the stepped groove;
s5, coating hot melt adhesive layers A on the inner walls of the stepped grooves formed on the two side edges of the EVA vinyl acetate copolymer film layer in the step S3;
s6, coating a hot melt adhesive layer B on the inner wall of the wear-resistant layer and attaching a double-sided release paper layer;
and S7, laminating the inner side surface of the double-sided release paper layer with the hot melt adhesive layer A to complete the preparation of the heat insulation card protection film.
7. The method for preparing the heat-insulating card-protecting film according to claim 6, wherein the temperature of the polyethylene melt in the step S2 is 315-325 ℃, and the surface temperature of the cooling roller is 38-44 ℃; the temperature of the EVA vinyl acetate copolymer melt in the step S3 is 175-210 ℃, and the surface temperature of the cooling roller is controlled to be 25-36 ℃.
8. The method for preparing the thermal insulation card protecting film according to claim 7, wherein the surface of the cooling roller in the step S3 is provided with diamond-shaped lattice raised grains.
9. The method as claimed in claim 8, wherein L-shaped plates with separate openings are connected to both sides of the inner wall of the mold above the polyethylene film layer in step S3, and the L-shaped plates are used to facilitate the formation of the stepped groove.
10. The method for preparing a thermal insulation card-protecting film according to claim 9, wherein the gluing operation of the hot melt adhesive layer a in the step S5 and the gluing operation of the hot melt adhesive layer B in the step S6 are both performed by a gluing machine.
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| CN202210726458.XA CN115230245A (en) | 2022-06-23 | 2022-06-23 | Heat-insulation card-protecting film and preparation method thereof |
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| CN202210726458.XA CN115230245A (en) | 2022-06-23 | 2022-06-23 | Heat-insulation card-protecting film and preparation method thereof |
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