CN115226326A

CN115226326A - Electronic module

Info

Publication number: CN115226326A
Application number: CN202110410521.4A
Authority: CN
Inventors: 周胜淞
Original assignee: Chicony Electronics Co Ltd
Current assignee: Chicony Electronics Co Ltd
Priority date: 2021-04-16
Filing date: 2021-04-16
Publication date: 2022-10-21

Abstract

The invention provides an electronic module which comprises a circuit board, at least one electronic element, a covering layer and a colloid. At least one electronic element is arranged on the circuit board. The covering layer is provided with a plurality of openings, wherein the covering layer is arranged on the circuit board and covers at least one electronic element. The colloid is combined with the covering layer, wherein the colloid fills the open holes and covers at least one electronic element.

Description

Electronic module

Technical Field

The present invention relates to an electronic module, and more particularly, to an electronic module including a cover layer.

Background

In a conventional camera module (NB camera) for a personal computer, electronic components are arranged on a thin circuit board. Because the thin circuit board has poor bending resistance, the circuit board may be bent by an external force during assembly by an operator, and thus electronic components disposed on the circuit board may be damaged. In addition, it may be affected by electromagnetic waves or static electricity generated by the electronic components or from the surroundings, and thus there is a need for shielding the electronic components.

In order to solve the above problem, in the related art, a metal case is provided to the circuit board and covers the electronic component. The metal shell can improve the bending resistance of the thin circuit board and provide a good shielding effect. However, since the size and shape of the metal case are not easily changed, electronic modules of various sizes and shapes need to be manufactured in a customized manner, resulting in low processing efficiency and poor flexibility. In addition, if there is a rework requirement, when the metal shell is disassembled, the circuit board and the electronic components are easily damaged, resulting in low rework efficiency and yield.

Disclosure of Invention

The invention provides an electronic module which has good bending resistance and shielding effect.

The electronic module comprises a circuit board, at least one electronic element, a covering layer and a colloid, wherein the covering layer can be a net structure containing back glue. At least one electronic element is arranged on the circuit board. The covering layer is provided with a plurality of openings, wherein the covering layer is arranged on the circuit board and covers at least one electronic element in an attaching mode. The colloid is combined between the upper edge and the lower edge of the covering layer and at least one electronic element, wherein the colloid fills the openings and covers the at least one electronic element.

In an embodiment of the invention, the covering layer is a mesh structure.

In an embodiment of the invention, a material of the covering layer is an insulating material.

In an embodiment of the invention, the electronic module further includes a back adhesive, wherein the back adhesive is glued between the circuit board and the cover layer.

In an embodiment of the invention, the electronic module further includes a conductive layer, wherein the conductive layer covers the covering layer and the encapsulant.

In an embodiment of the invention, the circuit board has a grounding portion, and the conductive layer contacts the grounding portion.

In an embodiment of the invention, the electronic module further includes an insulating layer, wherein the insulating layer is located between the colloid and the conductive layer.

In an embodiment of the invention, the electronic module further includes a functional element, wherein the functional element is disposed on the circuit board, and the cover layer has an opening exposing the functional element.

In an embodiment of the invention, the functional element is a light emitting element, an indicator light element or a microphone element.

In an embodiment of the invention, the colloid is a photo-curing adhesive, a thermal curing adhesive or a normal temperature curing adhesive, but the invention is not limited thereto.

In view of the above, in the electronic module of the present invention, the cover layer having the plurality of openings is disposed on the circuit board and covers the electronic component, the sealant is combined with the cover layer, and the sealant fills the openings and covers the electronic component. Therefore, the covering layer and the colloid can effectively improve the bending resistance of the circuit board and prevent the electronic elements arranged on the circuit board from being damaged. In addition, the cover layer is easy to cut, so that the size and shape of the cover layer can be simply changed according to actual requirements. Therefore, the electronic module is high in manufacturing efficiency and good in maneuverability. Moreover, the glue can selectively adjust the formula ratio according to the design or manufacturing process requirements so as to be attached between the covering layer and the electronic element, so that the glue can be easily removed along with the covering layer during reworking. Therefore, the electronic module has good reworking efficiency and qualified rate.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 shows a front view of an electronic module of an embodiment of the invention.

Fig. 2 shows a partial structure of the electronic module of fig. 1.

Fig. 3 isbase:Sub>A cross-sectional view of the electronic module of fig. 1 taken along linebase:Sub>A-base:Sub>A.

Fig. 4 is a partial schematic view of the cover layer of fig. 1.

Fig. 5A to 5C are manufacturing flow charts of the electronic module of fig. 1.

Fig. 6 shows a cross-sectional view of an electronic module of another embodiment of the present invention.

Description of reference numerals:

100. 100A electronic module

110. Circuit board

112. Ground part

120. Electronic component

130. Covering layer

132. Opening holes

138. Opening of the container

140. Colloid

150. Back adhesive

160. Conductive layer

170. Functional element

180. Lens barrel

190. Insulating layer

Detailed Description

Fig. 1 shows a front view of an electronic module of an embodiment of the invention. Fig. 2 shows a partial structure of the electronic module of fig. 1. Referring to fig. 1 and 2, the electronic module 100 of the present embodiment is, for example, a camera module (NB camera) of a personal computer, and includes a circuit board 110, a lens 180, a functional element 170 related to camera functions, and at least one electronic element 120 (fig. 2 shows a plurality of electronic elements). The electronic component 120 is disposed on the circuit board 110. The functional element 170 is, for example, a light emitting element, such as an infrared LED, for supplementing light in an environment with low illumination or even no light source, an indicator light element, such as a white LED, for reminding a user of the state of the electronic module 100, or a microphone element. In other embodiments, the electronic module 100 may be in other forms, and the invention is not limited thereto.

Fig. 3 isbase:Sub>A cross-sectional view of the electronic module of fig. 1 taken along linebase:Sub>A-base:Sub>A. Fig. 4 is a partial schematic view of the overlay of fig. 1. Referring to fig. 2 to fig. 4, the electronic module 100 of the present embodiment further includes a covering layer 130 and a colloid 140. The cover layer 130 has a plurality of openings 132, and the cover layer 130 is disposed on the circuit board 110 and covers the electronic element 120. The adhesive 140 is bonded between the upper and lower edges of the covering layer 130 and the electronic element 120, and the adhesive 140 fills the openings 132 and covers the electronic element 120.

Therefore, the cover layer 130 and the colloid 140 of the embodiment can effectively improve the bending resistance of the circuit board 110, and prevent the electronic element 120 disposed on the circuit board 110 from being damaged. Also, the cover layer 130 is easily cut, so that the cover layer 130 can be simply changed in size and shape according to actual needs. Therefore, when the covering layer 130 is manufactured, the covering layer 130 with a large area can be directly manufactured, and then the cutting is performed according to actual requirements. That is, the cover layer 130 does not need to be customized for electronic modules 100 of various sizes and shapes during manufacture. Therefore, the electronic module 100 of the present embodiment is efficient and flexible. In addition, since the cover layer 130 is easily removed from the circuit board 110, the glue 140 attached to the cover layer 130 can be easily removed from the circuit board 110 along with the cover layer 130 when the cover layer 130 is removed, without damaging the circuit board 110 or the electronic element 120. Therefore, the electronic module 100 of the present embodiment has good rework efficiency and thus maintains the yield after rework.

In the present embodiment, the circuit board 110 is, for example, a thin Printed Circuit Board (PCB). As shown in fig. 1, in the present embodiment, the covering layer 130 has an opening 138, and the opening 138 exposes the functional element 170 and the lens 180.

Referring to fig. 4, in the present embodiment, the covering layer 130 is a mesh structure, and the openings 132 are uniformly distributed throughout the covering layer 130. In other embodiments, the covering layer 130 may have other structures with a plurality of openings 132, which is not limited in the present invention. The density of the openings 132 can be adjusted according to actual requirements. In addition, the material of the cover layer 130 is, for example, an insulating material, and the cover layer 130 with insulating property can isolate the electronic element 120, thereby avoiding the short circuit problem. For example, the cover layer 130 may be a non-woven fabric, or the cover layer 130 may be made of Polyvinyl Chloride (PVC), but the invention is not limited thereto.

In the present embodiment, the colloid 140 can penetrate into the lower portion of the cover layer 130 through the openings 132 in a liquid state. For example, the colloid 140 may be a photo-curing adhesive or a thermosetting adhesive, or may be a normal temperature curing type, a hybrid type, a quick-drying type, a resin, a silica gel, an epoxy adhesive, an acrylic adhesive, etc., and the formula combination of the colloid 140 may be adjusted according to the design and process requirements, which is not limited in the present invention. After the glue 140 fills the openings 132 and the space between the cover layer 130 and the circuit board 110, the glue 140 may be cured by uv irradiation or heating, or may be cured after standing at room temperature for a period of time.

As shown in fig. 2, in the present embodiment, the circuit board 110 has a ground portion 112. The grounding portion 112 is mostly made of a copper layer, a gold layer, or a tin layer. The grounding portion 112 exposed on the surface of the circuit board 110 is, for example, rectangular and surrounds the electronic component 120, but the invention is not limited thereto. As shown in fig. 3, the electronic module 100 further includes a conductive layer 160, and the conductive layer 160 covers the covering layer 130 and the colloid 140. Specifically, the conductive layer 160 covers the covering layer 130 and the colloid 140, and surrounds the covering layer 130 and the colloid 140. The conductive layer 160 contacts the grounding portion 112 from the periphery of the covering layer 130 and the colloid 140, and the conductive layer 160 can shield the electronic element 120 covered therein, thereby preventing the electronic element 120 from being influenced by the surrounding electromagnetic waves or static electricity. In the present embodiment, the conductive layer 160 is made of a material having a conductive property. For example, the conductive layer 160 may be made of conductive paint or conductive adhesive, and is formed on the covering layer 130 and the colloid 140 by spraying. Alternatively, the conductive layer 160 may be made of graphite, which has good thermal conductivity, so as to improve the heat dissipation efficiency of the electronic module 100 and prevent the electronic element 120 from being damaged due to overheating.

The following describes a manufacturing flow of the electronic module 100 of the present embodiment.

Fig. 5A to 5C are manufacturing flow charts of the electronic module of fig. 1. First, as shown in fig. 5A, a circuit board 110 having a grounding portion 112 is provided, and an electronic component 120 is disposed on the circuit board 110. Next, as shown in fig. 5B, the cover layer 130 is cut into a corresponding size and shape according to actual requirements, and the cover layer 130 is disposed on the circuit board 110 to cover the electronic element 120. In the present embodiment, the bottom of the cover layer 130 further includes a back adhesive 150, and the back adhesive 150 is glued between the circuit board 110 and the cover layer 130. The adhesive 150 has viscosity, and the adhesive 150 may be disposed on the bottom of the covering layer 130 in advance. Therefore, the cover layer 130 can be pre-fixed by the back adhesive 150 previously disposed on the bottom of the cover layer 130.

As shown in fig. 5C, the colloid 140 is sprayed on the covering layer 130, and the colloid 140 is penetrated into the lower portion of the covering layer 130 through the openings 132 of the covering layer 130 to cover the electronic element 120. Then, the colloid 140 is irradiated with ultraviolet light or heated, and the colloid 140 becomes a solid state with good bending resistance. Finally, the conductive layer 160 is disposed on the covering layer 130 by, for example, spraying, so that the conductive layer 160 covers the covering layer 130 and the colloid 140 and contacts the grounding portion 112, thereby completing the electronic module 100 shown in fig. 3.

It should be noted that, during the spraying process, a mask (not shown) may be disposed at a position corresponding to the opening 138, so that the functional element 170 and the lens 180 in the opening 138 are not covered by the colloid 140 or the conductive layer 160.

Fig. 6 shows a cross-sectional view of an electronic module according to another embodiment of the invention. Referring to fig. 3 and fig. 6, an electronic module 100A of the present embodiment is similar to the electronic module 100 of fig. 3, and the difference between the two embodiments is that in the present embodiment, the electronic module 100A further includes an insulating layer 190, and the insulating layer 190 is located between the colloid 140 and the conductive layer 160. Thereby, the insulating layer 190 can further isolate the electronic element 120 from the conductive layer 160. Therefore, even if the electronic component 120 is not uniformly covered by the adhesive 140, the electronic component 120 does not contact the conductive layer 160 to cause a short circuit.

In summary, in the electronic module of the present invention, the cover layer having the plurality of openings is disposed on the circuit board and covers the electronic element, the encapsulant is bonded to the cover layer, and the encapsulant fills the openings and covers the electronic element. Therefore, the covering layer and the colloid can effectively improve the bending resistance of the circuit board and prevent the electronic elements arranged on the circuit board from being damaged. In addition, the cover layer is easy to cut, so that the size and shape of the cover layer can be simply changed according to actual requirements. Therefore, the electronic module is high in manufacturing efficiency and good in maneuverability. Moreover, the colloid is attached to the covering layer, so that the colloid can be easily removed along with the covering layer during heavy construction. Therefore, the electronic module has good reworking efficiency and qualified rate. In addition, the conductive layer covers the covering layer and the colloid and contacts the grounding part, so that the conductive layer can shield the electronic element, and the electronic element is prevented from being influenced by surrounding electromagnetic waves or static electricity.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. An electronic module, comprising:

a circuit board;

at least one electronic element configured on the circuit board;

a cover layer having a plurality of openings, wherein the cover layer is disposed on the circuit board and covers the at least one electronic component; and

and the colloid is combined with the covering layer, and the colloid fills the openings and coats the at least one electronic element.

2. The electronic module of claim 1, wherein the cover layer is a mesh structure.

3. The electronic module of claim 1, wherein the cover layer comprises an insulating material.

4. The electronic module of claim 1, further comprising an adhesive backing, wherein the adhesive backing is bonded between the circuit board and the cover layer.

5. The electronic module of claim 1, further comprising a conductive layer, wherein the conductive layer encapsulates the cap layer and the gel.

6. The electronic module of claim 5, wherein the circuit board has a ground, the conductive layer contacting the ground.

7. The electronic module of claim 5, further comprising an insulating layer, wherein the insulating layer is located between the gel and the conductive layer.

8. The electronic module of claim 1, further comprising a functional element, wherein the functional element is disposed on the circuit board, and the cover layer has an opening exposing the functional element.

9. The electronic module of claim 8, wherein the functional element is a light emitting element, an indicator light element, or a microphone element.

10. The electronic module of claim 1, wherein the adhesive is a light-curable adhesive, a heat-curable adhesive, or a room temperature-curable adhesive.