CN115221686A - Evaluation and optimization method and system for chip embedded type liquid cooling heat sink and heat source - Google Patents
Evaluation and optimization method and system for chip embedded type liquid cooling heat sink and heat source Download PDFInfo
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Abstract
The invention belongs to the technical field of chip heat dissipation, and discloses an evaluation and optimization method and a system for an embedded liquid cooling heat sink and a heat source of a chip, wherein the evaluation and optimization method for the adaptability of the embedded liquid cooling heat sink and the heat source of the chip comprises the following steps: constructing a composite performance index function for quantitatively evaluating the adaptation degree of the heat sink and the heat source; constructing a power dispersion function to evaluate the nonuniformity of the chip power; and aiming at the established composite performance index function and the power dispersion function, performing simulation calculation under two conditions of a uniform heat source and a non-uniform heat source to obtain optimal solution sets of the temperature, the temperature uniformity factor and the pressure drop of the four embedded heat sinks, and designing a heat sink structure and an inlet Reynolds number. The invention selects the micro-channel structure with the best adaptability, and the method can maximally save the pump power consumption under the condition of satisfying the maximum temperature limit and the temperature uniformity limit, thereby not only avoiding insufficient cooling, but also avoiding wasting the cooling capacity and unnecessary cooling.
Description
Technical Field
The invention belongs to the technical field of chip heat dissipation, and particularly relates to an evaluation and optimization method and system for a chip embedded liquid cooling heat sink and a heat source.
Background
At present, embedded liquid cooling is the first-choice solution for heat dissipation of a high-power 3D chip, but the problems of too high pressure drop, uneven temperature distribution of a cooling surface and the like exist, and the cooling capacity and the pump power consumption of a liquid cooling heat sink should be comprehensively considered. Improvements are needed to achieve an accurate match between the heat sink cooling capacity and the heat source heat dissipation requirements.
Through the above analysis, the problems and defects of the prior art are as follows:
(1) In the prior art, aiming at chips with different heat loads, a micro-channel structure with the best adaptability is not selected, and the pumping power consumption cannot be saved to the maximum extent under the condition that the limitation of the highest temperature and the limitation of the temperature uniformity cannot be met.
(2) The prior art can neither avoid insufficient cooling nor waste cooling capacity, unnecessary cooling. So that the cooling effect can not reach the ideal state and can not meet the actual requirement.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides an evaluation and optimization method and a system for a chip embedded liquid cooling heat sink and a heat source, and particularly designs an evaluation and optimization method for the adaptability of the chip embedded liquid cooling heat sink and the heat source.
The invention is realized in this way, a method for evaluating and optimizing the adaptability of a chip embedded liquid cooling heat sink and a heat source comprises the following steps:
constructing a composite performance index function for quantitatively evaluating the adaptation degree of the heat sink and the heat source based on the factors of the highest temperature, the temperature uniformity and the flowing pressure drop of the coolant;
constructing a power dispersion function according to the power distribution of the chip to evaluate the non-uniformity of the chip power; the power distribution of the chip is changed along with different running tasks of the processor;
aiming at the established composite performance index function and the power dispersion function, carrying out simulation calculation under the conditions of a uniform heat source and a non-uniform heat source, and selecting the weight given by the highest temperature difference value to carry out effective evaluation; and obtaining optimal solution sets of the temperature, the temperature uniformity factor and the pressure drop of the four embedded heat sinks by adopting a multi-objective optimization algorithm, and designing a heat sink structure and an inlet Reynolds number which are optimized corresponding to the composite performance index function based on the optimal solution sets and aiming at different engineering application requirements.
Further, in the constructed composite performance index function, the weight factor of the composite performance index function depends on different differences of different strengths of heat loads on cooling capacity requirements and cooling cost requirements.
Further, in the actual operation of the chip, the maximum temperature T max the/K represents the threshold temperature of the chip;
the temperature uniformity factor f T The average temperature is
The actual calculation domain of the temperature uniformity and the average temperature is the hot top surface of the chip. Temperature uniformity factor f T Smaller values indicate more uniform temperature distribution;
the flow pressure drop of the coolant comprises an inlet-outlet pressure drop, the inlet-outlet pressure drop Δ p is the pressure drop caused by energy loss in the flow process, and is defined as:
Δp＝p in -p out ；
in the formula p in And p out Respectively, the average pressure of the inlet and outlet cross sections of the coolant.
Further, the composite performance indicator function includes:
Φ＝1-λ 1 (0.5x T -0.5x f )-λ 2 x P ，
in the formula, x T 、x f And x P The normalized chip maximum temperature, temperature uniformity factor, inlet and outlet pressure drop and lambda 1 And λ 2 Is a weighting factor.
Further, the power dispersion function is:
in the formula, P i Is the average power density of the i-region,
is the average power density, S, of the chip i Is the area of i region, S 0 Is the total area of the chip; when theta is 0, the heat source is a uniform heat source.
Another objective of the present invention is to provide a system for evaluating and optimizing the compatibility between a chip embedded liquid-cooled heat sink and a heat source, comprising:
the composite performance index function building module is used for building a composite performance index function for quantitatively evaluating the adaptability of the heat sink and the heat source for three factors of the highest temperature, the temperature uniformity and the flowing pressure drop of the coolant, and the weight factor of the composite performance index function depends on different differences of heat loads with different strengths on the cooling capacity requirement and the cooling cost requirement;
the power dispersion function building module is used for building a power dispersion function to evaluate the nonuniformity of the chip power, wherein the power distribution of the chip can change along with the difference of running tasks of the processor in the actual work;
the heat sink structure acquisition module is used for carrying out simulation calculation under two conditions of a uniform heat source and a non-uniform heat source aiming at the established composite performance index function and the power dispersion function, and selecting the weight given by the highest temperature difference value for effective evaluation; and a Pareto optimal solution set of temperature, temperature uniformity factors and pressure drop of the four embedded heat sinks is obtained by adopting a multi-objective optimization algorithm, and the optimal design of a heat sink structure and the reynolds number of an inlet corresponding to the maximum composite performance index function are obtained when different engineering application requirements are met.
The invention also aims to provide a heat sink structure designed by utilizing the method for evaluating and optimizing the adaptability of the chip embedded liquid cooling heat sink and a heat source.
Another object of the present invention is to provide a computer device, which includes a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the computer program causes the processor to execute the method for evaluating and optimizing the suitability of the chip-embedded liquid cooling heat sink and the heat source.
Another object of the present invention is to provide a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the processor executes the method for evaluating and optimizing the suitability of the chip-embedded liquid-cooled heat sink and the heat source.
Another objective of the present invention is to provide an information data processing terminal, which is used for implementing the adaptability evaluation and optimization method between the chip embedded liquid cooling heat sink and the heat source.
In combination with the technical solutions and the technical problems to be solved, please analyze the advantages and positive effects of the technical solutions to be protected in the present invention from the following aspects:
first, aiming at the technical problems existing in the prior art and the difficulty in solving the problems, the technical problems to be solved by the technical scheme of the present invention are closely combined with results, data and the like in the research and development process, and some creative technical effects are brought after the problems are solved. The specific description is as follows:
aiming at the problems of overhigh pressure drop, uneven temperature distribution of a cooling surface and the like in the heat dissipation of a high-power 3D chip in the prior art, the cooling capacity and the pump power consumption of the liquid cooling heat sink are comprehensively considered. In order to realize accurate matching of heat sink cooling capacity and heat source heat dissipation requirements, the invention provides and realizes a novel method for evaluating and optimizing adaptability.
Secondly, considering the technical scheme as a whole or from the perspective of products, the technical effect and advantages of the technical scheme to be protected by the invention are specifically described as follows:
aiming at chips with different heat loads, a micro-channel structure with the best adaptability is selected, and the method can maximally save the pump power consumption under the condition of meeting the maximum temperature limit and the temperature uniformity limit, thereby not only avoiding insufficient cooling, but also avoiding the waste of cooling capacity and unnecessary cooling.
Third, as the inventive supplementary proof of the claims of the present invention, the expected profit and commercial value after the conversion of the technical solution of the present invention are:
the embedded liquid cooling is the first choice solution for heat dissipation of high-power chips, and the cooling capacity and the pump consumption power of embedded liquid cooling heat sinks with different structures are greatly different. The technical scheme of the invention realizes the accurate matching of the heat sink cooling capacity and the heat source heat dissipation requirement. A Pareto optimal solution set of four embedded heat sink cooling capacities and cooling costs is obtained by adopting a multi-objective optimization algorithm, and the heat sink structure design and the entrance Reynolds number which enable a composite performance index function to reach the maximum are obtained under different engineering application requirements (weights). In practical engineering application, the technical scheme of the invention realizes comprehensive optimization configuration of cooling capacity and pump power consumption, and can save cooling power consumption on the premise of ensuring good cooling of a heat source.
Drawings
Fig. 1 is a flowchart of a method for evaluating and optimizing the suitability of a chip embedded liquid-cooled heat sink and a heat source according to an embodiment of the present invention;
FIG. 2 shows two power distributions for a chip provided by an embodiment of the present invention; wherein, fig. 2 (a) is the case of uniform distribution of heat source, and fig. 2 (b) is the case of non-uniform distribution of heat source;
FIG. 3 is a diagram of multi-objective optimization-based T provided by an embodiment of the invention max ，f T And Pareto optimal solution set plot for Δ p;
fig. 4 is a geometric block diagram of a heat sink provided by an embodiment of the present invention;
FIG. 5 is a graph of the variation of a composite performance indicator Φ with inlet Reynolds number according to an embodiment of the present disclosure; fig. 5 (a) is a diagram of a change rule of a composite performance index Φ with an inlet reynolds number of a non-uniform heat source with power dispersion Θ = 0.082; fig. 5 (b) a diagram of a change rule of a power dispersion Θ =0.184 of a non-uniform heat source and a composite performance index Φ with an inlet reynolds number; fig. 5 (c) is a diagram showing the change rule of the power dispersion Θ =0.278 of the non-uniform heat source and the composite performance index Φ along with the reynolds number of the inlet; fig. 5 (d) a diagram of the change rule of the composite performance index Φ with the inlet reynolds number for a non-uniform heat source with the power dispersion Θ = 0.389;
FIG. 6 shows multi-objective optimization-based T provided by embodiments of the present invention max ，f T And a Pareto optimal solution set diagram for Δ p.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
1. The embodiments are explained. This section is an illustrative example developed to explain the claims in order to enable those skilled in the art to fully understand how to implement the present invention.
The embodiment of the invention provides a method for evaluating and optimizing the suitability of a chip embedded liquid cooling heat sink and a heat source (the method for evaluating and optimizing the suitability of the embedded liquid cooling heat sink and the heat source), which comprises the following steps:
s101, constructing a composite performance index function for quantitatively evaluating the adaptation degree of the heat sink and the heat source according to three factors of the highest temperature, the temperature uniformity and the flowing pressure drop of the coolant, wherein the weight factor depends on different differences of different heat loads on the requirements of cooling capacity and cooling cost.
S102, in the actual work of the chip, the power distribution of the chip changes along with the difference of the running tasks of the processor, and a power dispersion function is constructed to evaluate the non-uniformity of the chip power (heat load).
S103, aiming at the built heat dissipation models of the four embedded liquid cooling heat sinks, simulation calculation is carried out under two conditions of a uniform heat source and a non-uniform heat source,
in the embodiment of the present invention, fig. 2 shows two power distributions of a chip. Fig. 2 (a) shows the case where the heat source is uniformly distributed, and fig. 2 (b) shows the case where the heat source is non-uniformly distributed.
Selecting the weight given by the highest temperature difference value for effective evaluation;
on the basis of determining the weight in the composite performance index through the cooling effect, a multi-objective optimization algorithm is further adopted to obtain a Pareto optimal solution set of the normalized temperature, temperature uniformity factor and pressure drop of the four embedded heat sinks. Fig. 3 shows Pareto optimal solution sets of the temperature, the temperature uniformity factor and the flow pressure drop of four embedded heat sinks under the condition of a non-uniform heat source with the heat source dispersion degree of 0.389. Different points on the Pareto optimal solution set represent that under the condition of a non-uniform heat source with the heat source dispersion degree of 0.389 and under different weights, the composite performance function achieves the optimal heat sink structure and Reynolds number value. It can be seen from the figure that as the cooling capacity weight increases, the structure corresponding to the optimal point changes from the channel heat sink to the pin-fin heat sink, and the inlet reynolds number gradually increases. By solving the Pareto optimal solution set, the optimal embedded liquid cooling heat sink structure and the inlet Reynolds number can be obtained when different weights (engineering application requirements) are met.
Is different fromAnd when the engineering application is required (weight), the heat sink structure optimal design and the inlet Reynolds number corresponding to the maximum composite performance index function are optimized. The geometrical structures of the heat sink are shown in fig. 4, which shows the geometrical structures of a rectangular channel heat sink (hereinafter referred to as channel heat sink), a square section pin rib array, a circular section pin rib array, a drop-shaped section pin rib array and three pin rib heat sinks. The geometric dimension of the common embedded liquid cooling heat sink is adopted and the comparability is considered, the hydraulic diameter of the liquid flow channel in the four heat sinks is 0.3mm, and the volumes of the solid materials of the four embedded heat sinks are equal and are 9.9 multiplied by 10 -8 m 3 . The length, width and height of the heat sink are 15000 μm, 13000 μm and 1000 μm, respectively, and the heat sink wall thickness is 200 μm. The number of straight channels is 26, and the number of pin rib rows is 25. The table shows the relevant dimensions and parameter relationships of the geometric model. Wherein, the equation of the outline curve of the needle rib with the drop-shaped section is as follows:
in the formula, the value range of theta belongs to [0,2 pi ].
Dimensional parameters of a geometric model
In an embodiment of the present invention, the performance indicators include:
(1) Maximum temperature
During the actual operation of the chip, the maximum temperature T max the/K often represents the threshold temperature of the chip operation, and when the chip temperature exceeds the threshold temperature, the chip will actively reduce the operating frequency to reduceLess heat is generated. The maximum temperature of the chip is reduced, so that the chip can continuously work at a higher frequency, and the working performance of the chip is improved. The lower the maximum temperature, the stronger the cooling capacity of the heat sink is also indicated.
(2) Temperature uniformity factor
The temperature is uniformly distributed, so that the transmission delay of signals in the chip is reduced, and the local warping of the chip caused by thermal stress generated by overlarge temperature gradient is avoided. Temperature uniformity factor f T the/K can describe the uniformity of the temperature distribution on the chip, and is defined by the following formula:
mean temperature
Is defined as:
in the formula, V s /m 3 To calculate the total volume of the domain. Because the uniformity of the temperature distribution on the junction surface of the heat source and the heat sink in the model has more practical significance, the practical calculation domain of the temperature uniformity and the average temperature is the upper surface of the heat sink. Temperature uniformity factor f T Smaller values indicate a more uniform temperature distribution.
(3) Inlet and outlet pressure drop
The inlet-outlet pressure drop Δ p of the coolant is the pressure drop due to energy loss during the flow, and is defined by the following formula:
Δp＝p in -p out ， (3)
in the formula p in And p out Respectively the average pressure of the inlet and outlet cross sections of the coolant. The smaller Δ p, the smaller the energy loss of the coolant flow, meaning the less pump power consumed at the same mass flow rate.
(4) Composite performance index
The maximum temperature and flow pressure drop reflect the cooling capacity and cooling cost of the heat sink, respectively. Meanwhile, temperature uniformity is also an aspect of special attention in practical applications such as cooling of electronic and optoelectronic devices.
In order to fully reflect the convection cooling performance and the cooling cost in the practical engineering problems, the invention comprehensively adopts three factors of the highest temperature, the temperature uniformity and the flowing pressure drop of the coolant to construct a weighted composite performance index function.
Due to the fact that the dimensions of the three elements are different, and the Min-Max standardization method can reflect the proportional relation between corresponding data and the maximum value and the minimum value in the data set, the Min-Max standardization method is beneficial to describing the adaptation degree of the heat sink and the heat source after weighting, and the Min-Max standardization method is adopted to carry out normalization processing on the three elements. In practical application, when the heat load of a chip is high, the priority of heat dissipation requirements is higher than the limit on the pump consumption power consumption, and the heat control aims of preventing heat point burning loss and ensuring temperature uniformity are main heat control targets; when the thermal load of the chip is low, the priority of the heat dissipation requirement is lower than the limit of the pump power consumption, and the reduction of the system power consumption under the safe condition is more important.
Therefore, different differences of the heat loads with different strengths and weaknesses to the cooling capacity requirement and the cooling cost requirement are reflected by the weighting factors. In summary, the weighted composite performance indicator function Φ is constructed as follows:
Φ＝1-λ 1 (0.5x T -0.5x f )-λ 2 x P ， (4)
in the formula, x T Xf and x P The normalized maximum temperature and temperature uniformity factors of the chip, inlet and outlet voltage drop and lambda 1 And λ 2 Is a weighting factor.
The weighted composite performance index function (4) is called an adaptation function; the higher the function value is, the higher the adaptation degree of the heat sink and the heat source is.
(4) Power dispersion
In actual operation, the power distribution of the chip varies with the task of the processor. In order to describe the situation of heat source power distribution, the invention proposes a power dispersion Θ to reflect the characteristics of chip power distribution, which is constructed as follows:
in the formula, P i Is the average power density of the i-region,
is the average power density, S, of the chip i Is the area of the i region, S 0 Is the total area of the chip. When theta is 0, the heat source is a uniform heat source.
The embodiment of the invention also provides a system for evaluating and optimizing the adaptability of the chip embedded liquid cooling heat sink and the heat source, which comprises the following steps:
and the composite performance index function building module is used for building a composite performance index function for quantitatively evaluating the adaptation degree of the heat sink and the heat source according to three factors of the highest temperature, the temperature uniformity and the flowing pressure drop of the coolant, and the weight factor of the composite performance index function depends on different differences of different heat loads with different strengths on the cooling capacity requirement and the cooling cost requirement.
And the power dispersion function building module is used for building a power dispersion function to evaluate the non-uniformity of the chip power (thermal load) when the power distribution of the chip changes along with the difference of the operation tasks of the processor in the actual work of the chip.
The heat sink structure acquisition module is used for carrying out simulation calculation under two conditions of a uniform heat source and a non-uniform heat source aiming at the built heat dissipation models of the four embedded liquid cooling heat sinks, and selecting the weight given by the highest temperature difference value for effective evaluation; and a Pareto optimal solution set of temperature, temperature uniformity factors and pressure drop of the four embedded heat sinks is obtained by adopting a multi-objective optimization algorithm, and the optimal design of a heat sink structure and the reynolds number of an inlet corresponding to the maximum composite performance index function are obtained when different engineering application requirements (weights) are met.
2. Application examples. In order to prove the creativity and the technical value of the technical scheme of the invention, the part is the application example of the technical scheme of the claims on specific products or related technologies.
This example illustrates the application of the present invention to the analysis of precise matching of heat sink heat dissipation capability and chip heat dissipation requirements, with reasonable selection of heat sink structure and heat sink coolant inlet reynolds number. The specific implementation mainly comprises the acquisition of chip power density, the modeling of the existing heat sink structure and the processing of the result data.
In specific implementation, the power distribution of the chip is firstly obtained, and then the temperature distribution and the pressure distribution of the chip under the conditions of different heat sink structures and different Reynolds numbers of the coolant inlets are obtained through a numerical simulation or experiment mode. In specific implementation, the weight is given by combining with the actual engineering requirements, and a composite performance index function comprehensively considering the cooling capacity (temperature and temperature uniformity) and the cooling cost (pressure drop) of the channel is constructed. And carrying out normalization processing on the data and bringing in the composite performance index function to obtain composite performance index function values under the conditions of different heat sink structures and different coolant inlet Reynolds numbers.
Next, further, may be. A Pareto optimal solution set of four embedded heat sink cooling capacities and cooling costs is obtained by adopting a multi-objective optimization algorithm, and the heat sink structural design and the entrance Reynolds number which enable a composite performance index function to reach the maximum are obtained under different engineering application requirements (weights).
The technical scheme of the invention is applied to the analysis of the accurate matching of the heat sink heat dissipation capacity and the chip heat dissipation requirement, and can obtain the optimal selection of the heat sink structure and the Reynolds number of the coolant under different engineering requirements. 3. Evidence of the relevant effects of the examples. The embodiment of the invention achieves some positive effects in the process of research and development or use, and has great advantages compared with the prior art, and the following contents are described by combining data, diagrams and the like in the test process.
Fig. 5 shows the change law of the composite performance index Φ with the inlet reynolds number for the non-uniform heat source with the power of 100W and the power dispersion Θ of 0.082, 0.184, 0.278 and 0.389. The weight values of the composite performance index Φ are shown in table 1. Fig. 5 (a) shows a change rule of a composite performance index Φ with an inlet reynolds number in a non-uniform heat source with power dispersion Θ = 0.082; fig. 5 (b) a non-uniform heat source with power dispersion Θ =0.184, the change rule of the composite performance index Φ with the reynolds number of the inlet; fig. 5 (c) shows the change rule of the power dispersion Θ =0.278 of the non-uniform heat source and the composite performance index Φ with the reynolds number of the inlet; fig. 5 (d) a non-uniform heat source with power dispersion Θ =0.389, and a change rule of a composite performance index Φ with an inlet reynolds number;
from fig. 5 (a) -5 (d), it can be found that, as the power dispersion Θ increases, the change law of Φ of the circular-section pin-rib heat sink and the drop-shaped-section pin-rib heat sink with the reynolds number of the inlet changes from increasing first and then decreasing with the increase of the reynolds number to increasing with the increase of the reynolds number. When the power dispersion theta is 0.389, phi of the rectangular straight channel, the circular-section pin rib heat sink and the drop-shaped-section pin rib heat sink are increased along with the increase of Reynolds number. This is because when the power dispersion Θ is 0.389, the thermal load of the hot spot region is large. The pressure drop loss from increasing the reynolds number is less than the gain from increasing the cooling capacity. The square section pin fin heat sink increases with the Reynolds number, and phi increases first and then decreases. This is due to the pressure drop loss from the square cross-section pin fin heat sink increase reynolds number, which is greater than the gain from the increase in cooling capacity.
Table 1 weight values
And further obtaining a Pareto optimal solution set of the normalized temperature, temperature uniformity factor and pressure drop of the four embedded heat sinks by adopting a multi-objective optimization algorithm. Fig. 6 shows Pareto optimal solution sets of temperature, temperature uniformity factor and flow pressure drop for four embedded heat sinks under non-uniform heat source conditions with heat source dispersion Θ = 0.389. As can be seen from fig. 6, the rectangular cross-section pin-fin heat sink performs best as the weight of the heat sink temperature and temperature uniformity factor increases; the straight channel heat sink performs best when the weight of the pressure drop increases. By solving the Pareto optimal solution set, the optimal embedded liquid cooling heat sink structure and the optimal reynolds number of the inlet can be obtained when different weights (engineering application requirements) are met.
It should be noted that embodiments of the present invention can be realized in hardware, software, or a combination of software and hardware. The hardware portion may be implemented using dedicated logic; the software portions may be stored in a memory and executed by a suitable instruction execution system, such as a microprocessor or specially designed hardware. Those skilled in the art will appreciate that the apparatus and methods described above may be implemented using computer executable instructions and/or embodied in processor control code, such code being provided on a carrier medium such as a disk, CD-or DVD-ROM, programmable memory such as read only memory (firmware), or a data carrier such as an optical or electronic signal carrier, for example. The apparatus and its modules of the present invention may be implemented by hardware circuits such as very large scale integrated circuits or gate arrays, semiconductors such as logic chips, transistors, or programmable hardware devices such as field programmable gate arrays, programmable logic devices, etc., or by software executed by various types of processors, or by a combination of hardware circuits and software, e.g., firmware.
The above description is only for the purpose of illustrating the present invention and the appended claims are not to be construed as limiting the scope of the invention, which is intended to cover all modifications, equivalents and improvements that are within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The method for evaluating and optimizing the adaptability of the chip embedded type liquid cooling heat sink and the heat source is characterized by comprising the following steps of:
constructing a composite performance index function for quantitatively evaluating the adaptation degree of the heat sink and the heat source based on the factors of the highest temperature, the temperature uniformity and the flowing pressure drop of the coolant;
constructing a power dispersion function according to the power distribution of the chip to evaluate the nonuniformity of the chip power; the power distribution of the chip is changed along with different running tasks of the processor;
aiming at the established composite performance index function and the power dispersion function, carrying out simulation calculation under the conditions of a uniform heat source and a non-uniform heat source, and selecting the weight given by the highest temperature difference value for effective evaluation; and obtaining optimal solution sets of the temperature, the temperature uniformity factor and the pressure drop of the four embedded heat sinks by adopting a multi-objective optimization algorithm, and designing a heat sink structure and an inlet Reynolds number which are optimized corresponding to a composite performance index function based on the optimal solution sets and aiming at different engineering application requirements.
2. The method for evaluating and optimizing the compatibility of a chip-embedded liquid-cooled heat sink and a heat source as claimed in claim 1, wherein in the constructed composite performance index function, the weighting factor of the composite performance index function depends on different differences of different heat loads on cooling capacity requirements and cooling cost requirements.
3. The method for evaluating and optimizing the compatibility of a chip embedded liquid-cooled heat sink and a heat source of claim 1, wherein the maximum temperature T is a temperature at which the chip is actually operated max the/K represents the threshold temperature of the chip;
the temperature uniformity factor f T the/K is a function describing the uniformity of the temperature distribution on the chip,average temperature of
Wherein the actual calculation domain of temperature uniformity and average temperature is the hot top surface of the chip. Temperature uniformity factor f T Smaller values indicate more uniform temperature distribution;
the flow pressure drop of the coolant comprises an inlet-outlet pressure drop, the inlet-outlet pressure drop Δ p is the pressure drop caused by energy loss in the flow process, and is defined as:
Δp＝p in -p out ；
in the formula p in And p out Respectively the average pressure of the inlet and outlet cross sections of the coolant.
4. The method of claim 1, wherein the composite performance indicator function comprises:
Φ＝1-λ 1 (0.5x T -0.5x f )-λ 2 x P ，
in the formula, x T 、x f And x P The normalized chip maximum temperature, temperature uniformity factor, inlet and outlet pressure drop and lambda 1 And λ 2 Is a weighting factor.
5. The method for evaluating and optimizing the suitability of a chip embedded liquid-cooled heat sink to a heat source of claim 1, wherein the power dispersion function is:
in the formula, P i Is the average power density of the i-region,
is the average power density, S, of the chip i Is the area of i region, S 0 Is the total area of the chip; when theta is 0, the heat source is a uniform heat source.
6. The suitability evaluation and optimization system for the chip embedded type liquid cooling heat sink and the heat source is characterized by comprising the following steps of:
the composite performance index function building module is used for building a composite performance index function for quantitatively evaluating the adaptability of the heat sink and the heat source for three factors of the highest temperature, the temperature uniformity and the flowing pressure drop of the coolant, and the weight factor of the composite performance index function depends on different differences of heat loads with different strengths on the cooling capacity requirement and the cooling cost requirement;
the power dispersion function building module is used for building a power dispersion function to evaluate the nonuniformity of the chip power, wherein the power distribution of the chip can change along with the difference of running tasks of the processor in the actual work;
the heat sink structure acquisition module is used for carrying out simulation calculation under two conditions of a uniform heat source and a non-uniform heat source aiming at the established composite performance index function and the power dispersion function, and selecting the weight given by the highest temperature difference value for effective evaluation; and a Pareto optimal solution set of temperature, temperature uniformity factors and pressure drop of the four embedded heat sinks is obtained by adopting a multi-objective optimization algorithm, and the optimal design of a heat sink structure and the reynolds number of an inlet corresponding to the maximum composite performance index function are obtained when different engineering application requirements are met.
7. A heat sink structure designed by using the method for evaluating and optimizing the suitability of the chip embedded type liquid cooling heat sink and the heat source according to any one of claims 1 to 5.
8. A computer device comprising a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the method of evaluating and optimizing the suitability of a chip embedded liquid-cooled heat sink to a heat source of any of claims 1-5.
9. A computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to perform the method of evaluating and optimizing the suitability of a chip embedded liquid-cooled heat sink to a heat source of any one of claims 1 to 5.
10. An information data processing terminal, characterized in that the information data processing terminal is used for implementing the adaptability evaluation and optimization method of the chip embedded type liquid cooling heat sink and the heat source according to any one of claims 1 to 5.
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