CN115216270A - Novel normal-temperature curing silicone rubber sealant and application thereof - Google Patents
Novel normal-temperature curing silicone rubber sealant and application thereof Download PDFInfo
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- CN115216270A CN115216270A CN202211074691.0A CN202211074691A CN115216270A CN 115216270 A CN115216270 A CN 115216270A CN 202211074691 A CN202211074691 A CN 202211074691A CN 115216270 A CN115216270 A CN 115216270A
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- 239000000565 sealant Substances 0.000 title claims abstract description 40
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 21
- 239000004945 silicone rubber Substances 0.000 title claims abstract description 21
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 41
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 31
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 30
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 30
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 29
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 21
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- OEOIWYCWCDBOPA-UHFFFAOYSA-N 6-methyl-heptanoic acid Chemical compound CC(C)CCCCC(O)=O OEOIWYCWCDBOPA-UHFFFAOYSA-N 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 5
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 claims description 5
- 229910003450 rhodium oxide Inorganic materials 0.000 claims description 5
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000035484 reaction time Effects 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 2
- 238000010276 construction Methods 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 20
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002329 infrared spectrum Methods 0.000 description 5
- 238000004073 vulcanization Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910002808 Si–O–Si Inorganic materials 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229940008099 dimethicone Drugs 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229960003328 benzoyl peroxide Drugs 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000016507 interphase Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G15/00—Cable fittings
- H02G15/02—Cable terminations
- H02G15/04—Cable-end sealings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
The invention discloses a novel normal-temperature curing silicone rubber sealant and application thereof. The sealant consists of a main body adhesive and a curing agent, wherein the mass ratio of the main body adhesive to the curing agent is 10: (1-3); the main body adhesive is acetoxy-terminated vinyl polydimethylsiloxane, and the curing agent is composed of methyl silicone oil and copper sulfate pentahydrate, wherein the mass ratio of the methyl silicone oil to the copper sulfate pentahydrate is (3-4): 1. The sealant has excellent aging resistance, can be durable for a long time, is not influenced by construction environment, and can be quickly cured in arid regions. Meanwhile, no matter how thick the poured thickness is, the inside and the outside are vulcanized synchronously, and the curing time is short. In addition, the invention can visually judge whether the sealing part is solidified or not through the change of the color, thereby facilitating the subsequent construction on site.
Description
Technical Field
The invention belongs to the field of sealing and moisture prevention of a secondary system of a transformer substation, and particularly relates to a novel normal-temperature curing silicone rubber sealant and application thereof.
Background
The moisture-proof sealing is an important technical means for ensuring the operation safety of the secondary system of the transformer substation. If the secondary cable of the transformer substation is used for manufacturing a cable head on the spot, the insulating layer of the core wire is often cut or abraded, and in a humid environment, moisture can invade the surface of the core wire from the damaged insulating layer, so that interphase short circuit or fault grounding of the cable is caused, and the normal operation of secondary equipment is influenced. The field is mostly sealed by adopting the modes of insulating tape winding or sealing mud wrapping and the like, and the insulating tape has a common sealing effect, is easy to fall off and is not durable. The sealing mud falls off due to the reasons of dry cracking and the like after being used for a period of time, and part of the sealing mud absorbs moisture and promotes the corrosion and short circuit of the wire core. Therefore, it is necessary to improve the existing moisture-proof sealing method to ensure the safe and reliable operation of the power grid equipment.
The sealant which can be cured at normal temperature is a feasible means for damp-proof sealing of the secondary system of the transformer substation. At present, the normal-temperature curing sealant mainly comprises: room temperature vulcanized silicone rubber and epoxy resin. Room temperature vulcanized silicone Rubber (RTV) is a kind of organic polymer material with certain elasticity and good insulation, is pasty or liquid, when the RTV contacts with moisture in the air, hydroxyl or acetoxyl in molecules and water generate addition reaction, chain molecules of the original two-dimensional structure are interwoven into a three-dimensional mesh joint, the macroscopic expression of the RTV is colloid curing, and the cured RTV can block the intrusion of moisture and plays a role in moisture-proof sealing. Because the curing reaction needs the participation of moisture in the air, the curing of the RTV is greatly influenced by the ambient humidity, and the field construction and the sealing quality of the RTV are often influenced because the RTV is not cured for a long time in dry areas such as the north. When the coating is too thick, the interior RTV is not exposed to moisture in the air, and its curing time is also extended and affects the coating quality. In addition, RTV has a problem of aging, and the surface of RTV is cracked and pulverized after being used for 2 to 3 years on site, resulting in poor durability. Epoxy resin is fast in curing and ageing-resistant, but epoxy resin has the defects of being brittle and fragile, very firm in bonding, extremely difficult to remove after curing and not beneficial to cable maintenance.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a novel normal temperature curing silicone rubber sealant which is aging resistant, fast in curing and erosion resistant, and an application thereof.
In order to achieve the purpose, the invention provides the following technical scheme:
the novel normal-temperature curing silicone rubber sealant provided by the invention comprises a main body rubber and a curing agent, wherein the mass ratio of the main body rubber to the curing agent is 10: (1-3); the main body glue is acetoxyl-terminated vinyl polydimethylsiloxane, and the structural formula of the main body glue is as follows:
wherein n is an arbitrary integer from 7 to 10, and m is an arbitrary integer from 1 to 3;
the curing agent consists of methyl silicone oil and copper sulfate pentahydrate, wherein the mass ratio of the methyl silicone oil to the copper sulfate pentahydrate is (3-4) to 1.
Preferably, the preparation method of the acetoxy-terminated vinyl polydimethylsiloxane comprises the following steps:
1) Mixing vinyl polydimethylsiloxane and epoxybutane according to a ratio, adding rhodium oxide as a catalyst, and stirring to react at a set temperature to obtain hydroxyl-terminated vinyl polydimethylsiloxane; the synthetic route is as follows:
2) Uniformly mixing the hydroxyl-terminated vinyl polydimethylsiloxane prepared in the step 1) with methyltriethoxysilane according to a ratio, heating to a set temperature, adding bismuth isooctanoate as a catalyst, uniformly mixing, and stirring at a constant temperature for reaction to obtain acetoxy-terminated vinyl polydimethylsiloxane; the synthetic route is as follows:
preferably, in the step 1), the mass portions of the vinyl polydimethylsiloxane, the epoxy butane and the rhodium oxide are 40 to 45 parts, 10 to 16 parts and 0.02 to 0.05 part respectively; the temperature is set to be 140-150 ℃, and the reaction time is 2-4 h.
Preferably, in the step 2), 15 to 20 parts by weight of hydroxyl-terminated vinyl polydimethylsiloxane, 5 to 8 parts by weight of methyltriethoxysilane and 0.01 to 0.05 part by weight of bismuth isooctanoate are calculated; setting the temperature at 120-130 deg.c and the reaction time at 3-5 hr.
Preferably, the preparation method of the curing agent comprises the following steps: grinding the copper sulfate pentahydrate solid particles into powder, adding the methyl silicone oil according to the mass ratio, and uniformly mixing to obtain the curing agent.
The novel normal-temperature cured silicone rubber sealant is applied to the field of secondary system sealing and moisture prevention of transformer substations.
Preferably, the main body rubber and the curing agent are uniformly mixed according to the mass ratio, and then the mixture is coated and wrapped on the surface of the secondary cable head to be sealed.
The principle of the invention is as follows: the main body glue and the curing agent are mixed uniformly according to the proportion and poured on the surface of a secondary cable head to be sealed, and crystal water of copper sulfate pentahydrate in the curing agent and acetoxyl group (-O-C (= O) -CH) in molecules of the main body glue 3 ) An addition reaction occurs to interweave dispersed chain-shaped acetoxy-terminated vinyl polydimethylsiloxane molecules into a net structure, and the process is called room temperature vulcanization, and macroscopically shows that the sealant is gradually cured and formed. With the progress of the vulcanization reaction, the crystal water in the copper sulfate pentahydrate is gradually consumed, the copper sulfate pentahydrate is converted into anhydrous copper sulfate, and the sealant is changed from light blue to white. Whether the sealant is cured or not can be judged through the color change of the sealant. The reaction process is as follows:
the invention has the beneficial effects that: (1) The invention adopts the acetoxyl group end-capped vinyl polydimethylsiloxane as the main body adhesive, has the sealing and insulating properties of the conventional room temperature vulcanized silicone rubber, and can resist the oxidative corrosion of oxygen and the like in the environment due to the introduction of vinyl in the molecule, so the invention has more excellent aging resistance and can be durable for a long time. (2) The invention adopts a curing agent containing crystal water for curing the sealant at normal temperature, and the conventional room temperature vulcanized silicone rubber is subjected to vulcanization reaction by absorbing moisture in the air. Therefore, the invention is not influenced by construction environment and can be quickly cured in dry areas. Meanwhile, moisture in the environment does not need to be slowly diffused into the sealant for re-curing, so that the curing time is greatly shortened, and the curing is more uniform and thorough. In past engineering practice, the complete curing time of conventional room temperature vulcanized silicone rubber is at least 24 hours, and once the sprayed thickness is too thick, the internal curing time is further prolonged. The sealant and the sealing method of the invention have the advantages that the inside and the outside are vulcanized synchronously no matter how thick the poured thickness is, and the curing time is about 4-6 h. (3) According to the invention, the blue copper sulfate pentahydrate added in the curing agent is converted into anhydrous copper sulfate after a vulcanization reaction, the original blue color is converted into colorless, whether the sealing part is cured can be visually judged through the change of the color, and the subsequent construction on site is facilitated. (4) According to the invention, the methyl silicone oil is added into the curing agent, so that the sealant has good hydrophobicity, the cured sealing part has good hydrophobicity, the erosion of rainwater on the secondary cable head is prevented, and the methyl silicone oil in the sealant can continuously diffuse outwards from the inside and has good hydrophobic mobility.
Drawings
FIG. 1 is an infrared spectrum of hydroxyl terminated vinyl polydimethylsiloxane;
FIG. 2 is an infrared spectrum of acetoxy-terminated vinyl polydimethylsiloxane;
FIG. 3 is a comparison of sealing effect of the sealant with conventional RTV coating in different proportions;
FIG. 4 is a photograph of the application of the sealant of the present invention to a construction site.
Detailed Description
The invention is further illustrated by the following examples. The examples of the present invention are intended to illustrate the invention and not to limit the invention.
Example 1 preparation of hydroxy-terminated vinyl Dimethicone (where n is 8 and m is 1)
40g of vinyl polydimethylsiloxane, 13g of butylene oxide and 0.02g of rhodium oxide are mixed in a beaker and stirred for 10min by a magnetic stirrer at the rotating speed of 120r/min. And transferring the uniformly stirred mixed solution into a reaction kettle from a beaker, heating to 150 ℃, reacting for 3 hours, and cooling to obtain the hydroxyl-terminated vinyl polydimethylsiloxane. The synthetic route is as follows:
taking 3g of the reaction product, standing in humid air for 24h, curing, and performing Fourier infrared spectrum test with a German Brookfield Tensor37 type Fourier infrared spectrometer in a spectrum scanning range of 600-4000cm -1 Spectral resolution of 4cm -1 The number of scans was 32. The infrared spectrum of the reaction product is shown in figure 1, and the spectrum has obvious-OH, C = C, si-CH 3 、Si-O-Si、Si-(CH 3 ) 2 The absorption peak of the characteristic group, thus indicating that the above synthesis reaction gives a hydroxyl-terminated vinyl polydimethylsiloxane.
Example 2 preparation of acetoxy terminated vinyl Dimethicone
Taking 50g of hydroxyl-terminated vinyl polydimethylsiloxane and 17g of methyltriethoxysilane, uniformly mixing by using a magnetic stirrer, transferring into a reaction kettle, adding 0.1g of bismuth isooctanoate, uniformly mixing, heating to 125 ℃, and reacting for 4 hours to obtain the acetoxy-terminated vinyl polydimethylsiloxane.
3g of the above reaction product was subjected to Fourier transform infrared spectroscopy, and the curing and test apparatus and conditions of the sample were the same as those in example 1. The infrared spectrogram is shown in FIG. 2, except C = C, si-CH 3 、Si-O-Si、Si-(CH 3 ) 2 Outside the characteristic group, at 1743cm -1 And 1276cm -1 Absorption peaks of C = O and C-O groups, respectively, are acetoxy (-O-C (= O) -CH 3 ) Characteristic absorption of (c). The infrared spectrum result shows that the acetoxyl-terminated vinyl polydimethylsiloxane is prepared by the reaction.
Example 3
Preparation of the curing agent: taking 4g of methyl silicone oil and 1g of blue vitriol, grinding blue vitriol solid particles into powder, and sieving with a 1500-mesh sieve. Methyl silicone oil and powdered copper sulfate pentahydrate are mixed, and the mixture is continuously ground into paste until blue color is uniformly distributed.
Example 4
The main body adhesive prepared in example 2 and the curing agent prepared in example 3 are fully mixed according to the mass ratio of 10. To test the sealing effect of the sealant, the wrapped core portion was immersed in 3% NaCl solution. FIG. 3 is a comparison of corrosion on the surface of copper wire sealed by the mixed sealant and the conventional RTV coating in three proportions after being soaked for 6 months. As can be seen by comparison, the surface of the copper wire sealed by the conventional RTV has black corrosion traces, and the sealing effect is general. By adopting the sealant, the surface of the copper wire has no obvious corrosion trace, and the sealing effect of the three mixing ratios is superior to that of the conventional RTV coating.
Example 5
The sealant mixed in the three proportions in the example 4 is taken and cured at room temperature, the physical and electrical properties of the sealant are detected according to a test method of DL/T627-2018 'Normal temperature cured Silicone rubber antifouling flashover coating for insulator', and the comparison condition with the conventional RTV is shown in Table 1. The comparison result shows that the physical property, the electrical property and the mechanical property of the sealant adopted by the invention are superior to those of the conventional RTV coating in all aspects, and the standard requirement is met.
TABLE 1 Performance test results for sealants of different proportions and conventional RTV coatings
| Performance of | Conventional RTV | 10:1 | 10:2 | 10:3 | Standard required value |
| Superficial dry time, min | 41.3 | 27.6 | 20.5 | 18.7 | ≤45 |
| Hydrophobicity | HC2 | HC1 | HC1 | HC1 | HC1-HC2 |
| Dielectric strength, kV/mm | 18.6 | 20.5 | 21.1 | 20.9 | ≥18 |
| Adhesive force, MPa | 3.02 | 4.31 | 4.29 | 4.42 | ≥3 |
| Elongation at break,% | 307.5 | 479.3 | 437.6 | 453.4 | ≥200 |
Example 6
Fig. 4 is a photograph of a sealant in example 4, wherein the sealant is prepared by mixing a main body sealant and a curing agent according to a mass ratio of 10.
Claims (9)
1. The novel normal-temperature curing silicone rubber sealant comprises a main body rubber and a curing agent, wherein the mass ratio of the main body rubber to the curing agent is 10: (1-3); the main body glue is acetoxyl-terminated vinyl polydimethylsiloxane, and the structural formula of the main body glue is as follows:
wherein n is any integer from 7 to 10, and m is any integer from 1 to 3;
the curing agent consists of methyl silicone oil and copper sulfate pentahydrate, wherein the mass ratio of the methyl silicone oil to the copper sulfate pentahydrate is (3-4) to 1.
2. The novel normal temperature curing silicone rubber sealant as claimed in claim 1, wherein the preparation method of the acetoxy-terminated vinyl polydimethylsiloxane comprises the following steps:
1) Mixing vinyl polydimethylsiloxane and epoxybutane according to a ratio, adding rhodium oxide as a catalyst, and stirring to react at a set temperature to obtain hydroxyl-terminated vinyl polydimethylsiloxane; the synthetic route is as follows:
2) Uniformly mixing the hydroxyl-terminated vinyl polydimethylsiloxane prepared in the step 1) with methyltriethoxysilane according to a ratio, heating to a set temperature, adding bismuth isooctanoate as a catalyst, uniformly mixing, and stirring at a constant temperature for reaction to obtain acetoxy-terminated vinyl polydimethylsiloxane; the synthetic route is as follows:
3. the novel normal-temperature-curing silicone rubber sealant as claimed in claim 2, wherein in step 1), by mass, 40-45 parts of vinyl polydimethylsiloxane, 10-16 parts of butylene oxide and 0.02-0.05 part of rhodium oxide are added.
4. The novel normal-temperature curing silicone rubber sealant as claimed in claim 2, wherein in step 1), the set temperature is 140-150 ℃ and the reaction time is 2-4 h.
5. The novel normal-temperature curing silicone rubber sealant as claimed in claim 2, wherein in step 2), 15-20 parts by weight of hydroxyl-terminated vinyl polydimethylsiloxane, 5-8 parts by weight of methyltriethoxysilane, and 0.01-0.05 part by weight of bismuth isooctanoate are added.
6. The novel normal temperature curing silicone rubber sealant as claimed in claim 2, wherein in step 2), the set temperature is 120-130 ℃ and the reaction time is 3-5 h.
7. The novel normal-temperature curing silicone rubber sealant as claimed in claim 1, wherein the preparation method of the curing agent comprises the following steps: grinding the copper sulfate pentahydrate solid particles into powder, adding the methyl silicone oil according to the mass ratio, and uniformly mixing to obtain the curing agent.
8. The application of the novel normal-temperature curing silicone rubber sealant as claimed in claim 1 in the field of sealing and moisture proofing of secondary systems of substations.
9. Use according to claim 8, characterized in that it comprises the following steps: and uniformly mixing the main body adhesive and the curing agent according to the mass ratio, and coating and wrapping the main body adhesive and the curing agent on the surface of the secondary cable head to be sealed.
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| CN202211074691.0A CN115216270A (en) | 2022-09-01 | 2022-09-01 | Novel normal-temperature curing silicone rubber sealant and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115404042A (en) * | 2022-08-31 | 2022-11-29 | 国网湖南省电力有限公司 | Method for dampproof sealing of secondary cable head |
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| CN115404042A (en) * | 2022-08-31 | 2022-11-29 | 国网湖南省电力有限公司 | Method for dampproof sealing of secondary cable head |
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