CN115209025A - Camera and high appearance of clapping - Google Patents

Camera and high appearance of clapping Download PDF

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Publication number
CN115209025A
CN115209025A CN202210846850.8A CN202210846850A CN115209025A CN 115209025 A CN115209025 A CN 115209025A CN 202210846850 A CN202210846850 A CN 202210846850A CN 115209025 A CN115209025 A CN 115209025A
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China
Prior art keywords
lens
sensor chip
camera
optical axis
central axis
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CN202210846850.8A
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Chinese (zh)
Inventor
何佳文
范国强
余同权
张龙彬
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Beijing Mysher Technology Co ltd
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Beijing Mysher Technology Co ltd
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Priority to CN202210846850.8A priority Critical patent/CN115209025A/en
Publication of CN115209025A publication Critical patent/CN115209025A/en
Pending legal-status Critical Current

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Abstract

The application provides a camera and a high-speed shooting instrument, wherein the camera comprises a circuit board, a lens mount, a lens and a sensor chip; the circuit board and the lens are respectively connected to two ends of the lens seat; a through hole is arranged in the lens seat, and the sensor chip is arranged in the through hole; the sensor chip is electrically connected with the circuit board; the sensor chip is arranged on one side of the circuit board close to the lens; the light sensing surface of the sensor chip faces the lens; the central axis of the photosensitive surface is parallel to the optical axis of the lens and is arranged in a staggered manner. The central axis of the photosensitive surface of the sensor chip is staggered with the optical axis of the lens, when the central axis of a shot object is staggered with the central axis of the camera, light reflected by the shot object can be projected onto the photosensitive surface of the sensor chip through the refraction of the lens, an image is formed on the sensor chip, the central axis of the photosensitive surface of the sensor chip is parallel to the optical axis of the lens, the shot image cannot be deformed, and the camera can shoot the shot object in an inclined mode.

Description

Camera and high appearance of clapping
Technical Field
The application relates to the technical field of camera shooting, in particular to a camera and a high-speed shooting instrument.
Background
The history of the camera shooting technology can be traced back to the fourth and fifties of the last century, the camera shooting technology is greatly improved along with the continuous development of scientific technology, the camera shooting technology is widely applied to various fields such as monitoring, mobile phones, computers, automobiles and the like, in the future AI artificial intelligence field, a large number of cameras are required to be used as image acquisition equipment, and the cameras are concerned more and more widely.
In the related art, when the object is a planar object, in order to prevent distortion of the captured image, the camera is positioned such that the imaging direction of the camera is perpendicular to the object and the center axis of the camera coincides with the center axis of the object.
However, when the central axis of the object is misaligned with the central axis of the camera, the camera in the related art is used to perform imaging, and the captured image is likely to be deformed, which fails to meet the imaging requirement.
Disclosure of Invention
The embodiment of the application provides a camera and high appearance of shooing to when solving the central axis that is shooed the object and the central axis of camera and having the dislocation, adopt the camera among the correlation technique to shoot, the image of shooing produces the deformation easily, can't satisfy the problem of the demand of shooing.
In a first aspect, an embodiment of the present application provides a camera, including: the device comprises a circuit board, a lens seat, a lens and a sensor chip;
the circuit board and the lens are respectively connected to two ends of the lens seat; a through hole is formed in the lens seat, and the sensor chip is arranged in the through hole;
the sensor chip is electrically connected with the circuit board; the sensor chip is arranged on one side, close to the lens, of the circuit board; the light sensing surface of the sensor chip faces the lens;
the central axis of the photosensitive surface is parallel to the optical axis of the lens and is arranged in a staggered mode.
Optionally, an optical size of the sensor chip is smaller than an optical size of the lens.
Optionally, an optical axis of the lens is disposed through the sensor chip;
or the optical axis of the lens avoids the sensor chip.
Optionally, a field angle of the lens is equal to or greater than 60 degrees.
Optionally, the lens has spherical distortion of 3% or less.
In a second aspect, an embodiment of the present application provides a high-speed scanner, including: a base, a support bar and a camera as described in any of the above;
the supporting rod is arranged on the base, a preset area is arranged on the base, and the preset area is used for placing a shot object;
the camera is installed on the supporting rod and used for shooting the shot object.
Optionally, a central axis of the photosensitive surface, an optical axis of the lens, and a central axis of the object are parallel to each other;
the sensor chip and the shot object are respectively arranged on two sides of the optical axis of the lens.
Optionally, the sensor chip and the object to be shot are arranged in a staggered manner with respect to the optical axis of the lens;
or the optical axis of the lens is respectively arranged by penetrating through the sensor chip and the shot object.
Optionally, a central axis of the photosensitive surface, an optical axis of the lens, and a central axis of the object are parallel to each other;
the sensor chip and the shot object are respectively arranged on the same side of the optical axis of the lens.
Optionally, the sensor chip and the object to be shot are arranged in a staggered manner with respect to the optical axis of the lens;
or the optical axis of the lens is respectively arranged by penetrating through the sensor chip and the shot object.
Aiming at the prior art, the method has the following advantages:
in this embodiment, the camera may include: the circuit board, the lens mount, camera lens and sensor chip, circuit board and camera lens are connected respectively in the both ends of lens mount, the sensor chip sets up in the through-hole of lens mount, the photosurface of sensor chip is towards the camera lens, through setting up the relative position of sensor chip and camera lens in the lens mount, make the central axis of the photosurface of sensor chip and the setting of staggering of optical axis of camera lens, when the central axis of shooing the object exists the dislocation with the central axis of camera lens, can project on the photosurface of sensor chip by the refraction of the camera lens of the light that is shot the object reflection, can form an image on the sensor chip, and, because the central axis of the photosurface of sensor chip is parallel with the optical axis of camera lens, the image of shooing can not produce the deformation, thereby can realize that the camera lens slope is shot the object, the image of shooing can not produce the deformation.
The above description is only an overview of the technical solutions of the present application, and the present application may be implemented in accordance with the content of the description so as to make the technical means of the present application more clearly understood, and the detailed description of the present application will be given below in order to make the above and other objects, features, and advantages of the present application more clearly understood.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a schematic structural diagram of a camera provided in an embodiment of the present application;
fig. 2 is a schematic view of an imaging principle of a camera provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of another camera provided in the embodiment of the present application;
fig. 4 is a schematic structural diagram of a high-speed scanner provided in an embodiment of the present application;
FIG. 5 is a schematic structural diagram of another high-speed scanner provided in the embodiments of the present application;
fig. 6 is a schematic structural diagram of another high-speed scanner provided in the embodiment of the present application;
fig. 7 is a schematic structural diagram of another high-speed scanner provided in an embodiment of the present application.
Reference numerals:
10. a camera; 11. a circuit board; 12. a lens mount; 13. a lens; 14. a sensor chip; 13a, the optical axis of the lens; 14a, the central axis of the photosensitive surface; 20. a base; 201. presetting an area; 30. a support bar; 40. a subject to be photographed; 40a, the central axis of the subject.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Before explaining the camera provided in the embodiment of the present application, an application scenario of the camera provided in the embodiment of the present application is specifically explained:
in general, a camera head is mainly composed of three main components: the image sensor comprises a lens, a sensor chip and a Digital Signal Processor (DSP). The lens is used for leading in natural light to sensor chip, and sensor chip is used for converting light signal into digital signal, and DSP treater is used for carrying out processing operation, code conversion, storage and transmission etc. to digital signal.
In the related art, the camera includes a sensor chip and a lens, the sensor chip is disposed parallel to the lens, and a central axis of a photosensitive surface of the sensor chip coincides with an optical axis of the lens. When the object photographed by the camera is a planar object, for example: shooting a file of A4 paper, or shooting a certificate, or shooting a plane drawing. The shooting direction of the camera is perpendicular to the plane object, and the optical central axis of the camera is overlapped with the central axis of the plane object, so that the situation that the shot image of the plane object is not deformed in the shooting range of the camera can be guaranteed.
The camera in the related art is adopted for shooting, when the central axis of a shot object and the central axis of the camera are staggered, the shot image is easy to deform, the shot image can be in a trapezoidal shape, and in some application scenes of the camera, due to the limitation of the installation position, the optical central axis of the camera cannot be coincided with the central axis of a plane object, so that the camera cannot meet the shooting requirement. In order to guarantee the camera normal use, just need increase the installation space of camera, cause the space that the camera installation occupy great, be unfavorable for the installation and use of camera, even occasion can't install and use a bit. For example, a camera used inside an ATM to photograph a passport must be installed right above or below a document placement area, which occupies a large physical space of the ATM.
Based on the above problem, the embodiment of the application provides a camera and a high shooting instrument, so as to solve the problem that when the central axis of a shot object and the central axis of the camera are misaligned, the camera in the related art is adopted to shoot, a shot image is easy to deform, and the shooting requirement cannot be met.
The following describes in detail a camera provided in the embodiments of the present application with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Referring to fig. 1, a schematic structural diagram of a camera provided in an embodiment of the present application is shown.
As shown in fig. 1, the camera 10 includes: a circuit board 11, a lens mount 12, a lens 13, and a sensor chip 14; the circuit board 11 and the lens 13 are respectively connected to two ends of the lens holder 12; a through hole is arranged in the lens holder 12, and the sensor chip 14 is arranged in the through hole; the sensor chip 14 is electrically connected to the circuit board 11; the sensor chip 14 is disposed on the circuit board 11 on a side close to the lens 13; the light-sensitive surface of the sensor chip 14 faces the lens 13; the central axis 14a of the light-sensing surface of the sensor chip is parallel to the optical axis 13a of the lens and is arranged in a staggered manner.
In the embodiment of the present application, the camera 10 may include: the circuit board 11, the lens mount 12, the lens 13 and the sensor chip 14, the circuit board 11 and the lens 13 are respectively connected to two ends of the lens mount 12, the sensor chip 14 is arranged in the through hole of the lens mount 12, the light-sensitive surface of the sensor chip 14 faces the lens 13, external light is projected to the light-sensitive surface of the sensor chip 14 through the lens 13, imaging can be performed on the sensor chip 14, the central axis 14a of the light-sensitive surface of the sensor chip is parallel to and staggered with the optical axis 13a of the lens by setting the relative position of the sensor chip 14 and the lens 13 in the lens mount 12, the object 40 to be shot can be shot obliquely, and the shot image cannot be deformed; moreover, by adjusting the offset distance between the optical axis 13a of the lens and the central axis 14a of the light-sensing surface of the sensor chip, the inclination angle of the camera 10 for oblique shooting can be adjusted, and different requirements for oblique shooting can be met.
Specifically, the camera in the embodiment of the present application may be used to: the system comprises a high-speed shooting instrument, a wall-mounted real object exhibition stand (also called wall-mounted high-speed shooting instrument), a whiteboard camera, a shooting instrument, a camera and other application scenes, and can be used for other application scenes needing shooting and imaging, and technicians in the field can select the application scenes according to actual needs, and the embodiment of the application is not limited to the application scenes.
Among them, the camera 10 may include: the lens holder comprises a circuit board 11, a lens holder 12, a lens 13 and a sensor chip 14, wherein one end of the lens holder 12 is fixedly connected with the circuit board 11, the lens 13 is fixedly connected with the other end of the lens holder 12, a through hole is formed in the lens holder 12, and the sensor chip 14 is arranged in the through hole of the lens holder 12.
The sensor chip 14 may be fixedly disposed on a side of the circuit board 11 close to the lens 13, and a light-sensing surface is disposed on the sensor chip 14, and the light-sensing surface of the sensor chip 14 faces the lens 13. After being refracted by the lens 13, at least part of the external light can be projected onto the photosensitive surface of the sensor chip 14, so that an image can be formed on the sensor chip 14.
The sensor chip 14 is electrically connected to the circuit board 11, the sensor chip 14 converts the photographed image information into a digital image signal through a photoelectric conversion function, and transmits the digital image signal to the circuit board 11, and the circuit board 11 transmits the digital image signal generated by the sensor chip 14 to an external connection device. The circuit board 11 may be configured to control the sensor chip 14 and transmit a digital image signal, and the specific circuit board 11 may be set according to a requirement, which is not limited in this embodiment of the application.
By setting the relative positions of the sensor chip 14 and the lens 13, the central axis 14a of the light-sensing surface of the sensor chip is parallel to the optical axis 13a of the lens, and the central axis 14a of the light-sensing surface of the sensor chip is offset from the optical axis 13a of the lens, that is, there is a preset offset distance between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens. The offset distance is a distance between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens.
It can be understood that, based on the optical imaging principle, the preset offset distance between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens may be determined according to the relative position of the object to be photographed and the camera, and the specific offset distance setting may be set according to the actual use requirement, which is not limited in the embodiment of the present application.
The sensor chip 14 may be selected from: a Charge Coupled Device (CCD) image sensor or a Complementary Metal-Oxide-Semiconductor (CMOS) image sensor, of course, the sensor chip 14 may also be another type of image sensor, which may be selected by a person skilled in the art according to actual needs, and the embodiment of the present application does not limit the present invention.
The light-sensing surface of the sensor chip 14 is generally a plane or an approximate plane, and the central axis 14a of the light-sensing surface of the sensor chip is a straight line that is perpendicular to the light-sensing surface of the sensor chip 14 and passes through the center of the light-sensing surface.
In this embodiment, the camera 10 may be applied to shoot a planar object, so that the central axis 14a of the light-sensing surface of the sensor chip in the lens holder 12 is staggered from the optical axis 13a of the lens, and based on the optical imaging principle, the planar object having a deviation with the optical axis 13a of the lens may be imaged on the light-sensing surface of the sensor chip 14, thereby realizing oblique shooting of the planar object by the camera 10, and an image obtained by oblique shooting may not be deformed.
It should be noted that the camera 10 provided in the embodiment of the present application may be applied to shoot a planar object, and may also be applied to shoot a non-planar object, which is not limited in the embodiment of the present application.
Referring to fig. 2, a schematic diagram of an imaging principle of the camera 10 provided in the embodiment of the present application is shown.
As shown in fig. 2, taking the object as a planar object, a first inclination angle θ 1 between the sensor chip 14 and the lens 13 in the camera 10 can be calculated according to an offset distance D1 between a central axis 14a of the photosensitive surface of the sensor chip and the optical axis 13a of the lens and a distance L1 between the sensor chip 14 and the lens 13, and the specific calculation formula is as follows:
tanθ1=D1/L1 (1)
where θ 1 is a first inclination angle between the sensor chip 14 and the lens 13, D1 is an offset distance between a central axis 14a of the light-sensing surface of the sensor chip and an optical axis 13a of the lens, and L1 is a distance between the sensor chip 14 and the lens 13.
Accordingly, according to the offset distance D2 between the central axis 40a of the object and the optical axis 13a of the lens and the distance L2 between the object 40 and the lens 13, the second inclination angle θ 2 of the object 40 and the camera 10 can be calculated, and the specific calculation formula is as follows:
tanθ2=d2/L2 (2)
where θ 2 is a second inclination angle of the object 40 and the camera 10, D2 is an offset distance between the central axis 40a of the object and the optical axis 13a of the lens, and L2 is a distance between the object 40 and the lens 13.
Based on the optical imaging principle, the first inclination angle θ 1 is equal to the second inclination angle θ 2, that is:
θ1=θ2 (3)
the object 40 can be within the shooting range of the camera 10, and the camera 10 can shoot the object 40 in an inclined manner without distortion of the shot image.
Specifically, according to the above formulas (1), (2) and (3), specific parameter values of the offset distance D1 between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens, the distance L1 between the sensor chip 14 and the lens 13, the offset distance D2 between the central axis 40a of the object and the optical axis 13a of the lens, and the distance L2 between the object 40 and the lens 13 are adjusted, so that the angle sizes of the first inclination angle θ 1 and the second inclination angle θ 2 are adjusted to meet different inclination shooting requirements, and the camera 10 is not limited by the installation position when being installed and used, thereby improving the applicability of the camera 10.
In some embodiments, the lens 13 of the camera head 10 may include: one of a convex lens, a concave lens or a plane mirror or a combination of at least two of them. It should be noted that a specific lens 13 may be set according to lens parameters of the camera 10, where the lens parameters may include at least one of the following: focal length, depth of field, f-number, etc., of course, those skilled in the art can set the specific lens 13 according to actual needs, and the embodiment of the present application does not limit this.
Optionally, the optical size of the sensor chip 14 is smaller than the optical size of the lens 13.
In the embodiment of the present application, by setting the optical size of the sensor chip 14 and the optical size of the lens 13, since the optical size of the sensor chip 14 is smaller than the optical size of the lens 13, only a part of the light refracted by the lens 13 can be projected onto the photosensitive surface of the sensor chip 14 and imaged on the sensor chip 14, the difference between the optical size of the sensor chip 14 and the optical size of the lens 13 can be adjusted, and the imageable area of the camera 10 can be adjusted.
In the camera 10 according to the embodiment of the present application, the difference between the optical size of the sensor chip 14 and the optical size of the lens 13 can be set according to the size of the oblique shooting angle, and the shot object 40 needing oblique shooting is imaged by using the sensor chip 14, so as to meet the shooting requirements of different oblique angles. Moreover, the difference between the optical size of the sensor chip 14 and the optical size of the lens 13 can be determined according to the inclination angle of the camera for obliquely shooting the object, wherein the larger the inclination angle is, the larger the difference between the optical size of the sensor chip 14 and the optical size of the lens 13 is, and the larger the difference between the optical size of the sensor chip 14 and the optical size of the lens 13 is; otherwise, the difference is smaller.
The optical size of the lens 13 refers to the image plane size of the lens 13, and is used for representing the maximum clear imaging range of the lens 13, and the optical size of the sensor chip 14 refers to the target plane size of the sensor chip 14. The inclination angle is an angle between a line connecting the center of the subject 40 and the center of the lens 13 and the optical axis 13a of the lens.
It should be noted that, those skilled in the art may set the optical sizes of the sensor chip 14 and the lens 13 matched with the shooting scene according to the requirement of actual shooting, and the embodiment of the present application is not limited thereto.
Alternatively, referring to fig. 1 and 3, the optical axis 13a of the lens is disposed through the sensor chip 14; alternatively, the optical axis 13a of the lens is disposed so as to avoid the sensor chip 14.
In the embodiment of the present application, the relative positions of the sensor chip 14 and the lens 13 in the lens mount 12 may be set, so that the optical axis 13a of the lens passes through the sensor chip 14, or the optical axis 13a of the lens avoids the sensor chip 14, thereby meeting the shooting requirements of different inclination angles.
Specifically, the relative positions of the sensor chip 14 and the lens 13 in the lens mount 12 may be set, so that the central axis 14a of the photosensitive surface of the sensor chip is parallel to and staggered from the optical axis 13a of the lens, part of the light collected by the lens 13 may be imaged on the sensor chip 14, and when the camera is used, the object 40 to be photographed may be located in an image-formable area of the camera 10, and since the image-formable area of the camera 10 is staggered from the optical axis of the camera 10, oblique photographing may be implemented.
In some embodiments, as shown in fig. 1, the optical axis 13a of the lens may be set to avoid the sensor chip 14, and the offset distance between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens is relatively large, so as to increase the tilt angle of the tilt shooting of the camera 10.
In some embodiments, as shown in fig. 3, the optical axis 13a of the lens may be arranged to pass through the sensor chip 14, and the offset distance between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens is relatively small, so that the shooting range of the camera 10 can be increased while satisfying the oblique shooting of the camera 10.
It can be understood that the larger the offset distance between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens, the larger the inclination angle at which the camera 10 can be inclined for shooting, and the smaller the shooting range at which the camera 10 can shoot; conversely, the smaller the offset distance between the central axis 14a of the light-sensing surface of the sensor chip and the optical axis 13a of the lens, the smaller the tilt angle at which the camera 10 can tilt and photograph, and the larger the photographing range that the camera 10 can photograph. Therefore, a person skilled in the art can set appropriate positions of the sensor chip 14 and the lens 13 in the lens holder 12 based on the size of the shooting range and the size of the tilt angle of the tilt shooting, which is not limited in the embodiment of the present application.
Optionally, the angle of view of the lens 13 is equal to or greater than 60 degrees.
In the embodiment of the present application, since the inclination angle of oblique shooting needs to be reduced in order to increase the shooting range when the relative position of the sensor chip 14 and the lens 13 in the lens mount 12 is set, the maximum imaging range of the lens 13 can be increased by setting the angle of view of the lens 13 to 60 degrees or more, that is, by using the lens 13 with a larger angle of view, thereby increasing the oblique shooting range of the camera 10.
Specifically, the field angle of the lens 13 may be set to be greater than or equal to 60 degrees, and optionally, the field angle of the lens 13 may be selected from: any value such as 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 85 degrees, 90 degrees, 95 degrees, 100 degrees, 118 degrees, etc., which is not limited in this application.
Optionally, the spherical distortion of the lens 13 is 3% or less. The distortion of the photographed image is reduced, thereby improving the quality of the photographed image of the camera 10.
Spherical distortion, also called barrel distortion or barrel distortion, is the barrel-shaped expansion distortion of the image caused by the physical properties of the lenses and the lens assembly structure. Spherical distortion refers to the degree of barrel distortion of the image of an object made by a lens relative to the object itself.
Specifically, the spherical distortion of the lens 13 may be set as: any numerical value such as 3%, 2.9%, 2.8%, 2.5%, 2%, 1.5%, 1%, 0.8%, 0.5%, etc., which is not limited in the examples of the present application.
Optionally, the lens 13 may be an aspheric lens 13, and by using the aspheric lens 13, the aberration of the lens 13 may be reduced, so as to avoid deformation of the captured image, thereby improving the quality of the captured image of the camera 10. Alternatively, the lens 13 may be an ultra-wide-angle lens 13, and by setting the lens 13 as the ultra-wide-angle lens 13, the field angle of the lens 13 may be increased, the imaging range of the lens 13 is increased, and thus the shooting range of the camera 10 is increased.
Referring to fig. 4, an embodiment of the present application further provides a high-speed shooting apparatus, including: a base 20, a support rod 30 and a camera 10; the supporting rod 30 is arranged on the base 20, a preset area 201 is arranged on the base 20, and the preset area 201 is used for placing the shot object 40; the camera 10 is mounted on the support bar 30, and the camera 10 is used for photographing the object 40.
In the embodiment of the present application, the high-speed scanner may include: base 20, bracing piece 30 and camera 10, bracing piece 30 set up on base 20, and camera 10 sets up on bracing piece 30, and camera 10 is used for shooting the object 40 of being shot of placing preset area 201 on base 20, and wherein, camera 10 includes: the circuit board 11, the lens mount 12, the lens 13 and the sensor chip 14, the circuit board 11 and the lens 13 are respectively connected to two ends of the lens mount 12, the sensor chip 14 is disposed in the through hole of the lens mount 12, the light-sensitive surface of the sensor chip 14 faces the lens 13, the relative position of the sensor chip 14 and the lens 13 in the lens mount 12 is set, the central axis 14a of the light-sensitive surface of the sensor chip is staggered with the optical axis 13a of the lens, when the central axis 40a of the object to be shot is staggered with the central axis of the camera 10, the light reflected by the object to be shot 40 can be projected onto the light-sensitive surface of the sensor chip 14 through the refraction of the lens 13, the image can be formed on the sensor chip 14, and the central axis 14a of the light-sensitive surface of the sensor chip is parallel to the optical axis 13a of the lens, the shot image can not be deformed, so that the camera 10 can shoot the object to be shot 40 obliquely, and the shot image can not be deformed.
Specifically, the high-speed scanner may include: base 20, bracing piece 30 and camera 10, bracing piece 30 sets up on base 20, and camera 10 installs on bracing piece 30, and camera 10 includes: the circuit board 11 can be arranged on the supporting rod 30, one end of the lens 13 is connected with the circuit board 11, the other end of the lens 13 is connected with the lens 13, a through hole is formed in the lens 13, the sensor chip 14 is arranged in the through hole of the lens base 12, the sensor chip 14 is connected with one side, close to the lens 13, of the circuit board 11, the light sensing surface of the sensor chip 14 faces the lens 13, and the central axis 14a of the light sensing surface of the sensor chip is parallel to the optical axis 13a of the lens and is arranged in a staggered mode.
It should be noted that the camera 10 in the high-speed shooting device may include any one of the above-mentioned cameras 10, and the specific structure of the camera 10 may refer to the foregoing content, which is not described again in this embodiment of the application.
Alternatively, referring to fig. 4 and 5, the central axis 14a of the light-sensing surface of the sensor chip, the optical axis 13a of the lens, and the central axis 40a of the object to be photographed are parallel to each other; the sensor chip 14 and the subject 40 are disposed on both sides of the optical axis 13a of the lens.
In the embodiment of the present application, by setting the relative positions of the sensor chip 14, the lens 13 and the object 40 to be photographed in the preset region 201 on the base 20 in the high-speed photographing apparatus, the central axis 14a of the light-sensing surface of the sensor chip, the optical axis 13a of the lens and the central axis 40a of the object to be photographed are parallel to each other, when the object 40 to be photographed is a planar object, the photographed image is not deformed, and the sensor chip 14 and the object 40 to be photographed are respectively disposed on both sides of the optical axis 13a of the lens, so that the light reflected by the object 40 to be photographed is refracted by the lens 13 and then just projected onto the sensor chip 14, thereby realizing the inclined photographing of the camera 10.
Specifically, the lens 13 may be selected from: when the light reflected by the object 40 is refracted by the lens 13 and imaged, the image formed by combining at least two of the plane mirror, the convex lens, and the concave lens includes an inverted image and an upright image according to different imaging conditions. When the formed image is an inverted image, the image and the subject 40 are located on both sides of the lens.
For example, the lens 13 is selected as a convex lens, and when the distance between the object 40 and the convex lens is greater than one focal length of the lens and less than two focal lengths, the image is inverted, and under this condition, the image and the object 40 are located on both sides of the lens. By arranging the sensor chip 14 and the object 40 to be shot on two sides of the optical axis 13a of the lens respectively, the light reflected by the object to be shot is refracted by the lens 13 and then just projected on the sensor chip 14, so that the object 40 to be shot can be shot by the camera 10 in an inclined manner.
It should be noted that the imaging conditions include: the relationship between the distance between the object 40 and the lens 13 and the focal length of the lens 13 can be determined according to the imaging conditions, and the person skilled in the art can set the relationship according to the actual situation, which is not limited in the embodiment of the present application.
Alternatively, referring to fig. 4, the sensor chip 14 and the subject 40 are both disposed offset from the optical axis 13a of the lens.
In the embodiment of the present application, the sensor chip 14 and the object 40 to be shot are respectively disposed on two sides of the optical axis 13a of the lens by setting the sensor chip 14, the lens 13 and the relative position of the object 40 to be shot placed in the preset region 201, and the sensor chip 14 and the object 40 to be shot are both staggered from the optical axis 13a of the lens, so as to increase the inclination angle of the camera 10 for inclined shooting, and meet the shooting requirement of the camera 10 with a larger inclination angle.
It is understood that the above-mentioned inclination angle refers to an included angle between a line connecting the center of the subject 40 and the center of the lens 13 and the optical axis 13a of the lens, and the larger the distance between the central axis 40a of the subject and the optical axis 13a of the lens, the larger the inclination angle.
Alternatively, referring to fig. 5, the optical axes 13a of the lenses are disposed through the sensor chip 14 and the object 40, respectively.
In the embodiment of the present application, the sensor chip 14 and the object 40 to be photographed are respectively disposed on two sides of the optical axis 13a of the lens by setting the relative positions of the sensor chip 14, the lens 13 and the object 40 to be photographed placed in the preset region 201, and the optical axis 13a of the lens passes through the sensor chip 14 and the object 40 to be photographed respectively, so as to increase the photographing range of the camera 10, and meet the photographing requirement for the object 40 to be photographed with a larger size.
It is understood that the subject 40 is a planar subject, and the size of the subject 40 refers to the surface area of the planar subject.
Alternatively, referring to fig. 6 and 7, the central axis 14a of the light-sensing surface of the sensor chip, the optical axis 13a of the lens, and the central axis 40a of the object to be photographed are parallel to each other; the sensor chip 14 and the subject 40 are disposed on the same side of the optical axis 13a of the lens.
In the embodiment of the present application, by setting the relative positions of the sensor chip 14, the lens 13 and the object 40 to be photographed in the preset region 201 on the base 20 in the high-speed photographing apparatus, the central axis 14a of the light-sensing surface of the sensor chip, the optical axis 13a of the lens and the central axis 40a of the object to be photographed are parallel to each other, when the object 40 to be photographed is a planar object, the photographed image is not deformed, and the sensor chip 14 and the object 40 to be photographed are respectively disposed on the same side of the optical axis 13a of the lens, so that the light reflected by the object 40 to be photographed is refracted by the lens 13 and then just projected onto the sensor chip 14, thereby realizing the inclined photographing of the camera 10.
Specifically, the lens 13 may be selected from: when the light reflected by the object 40 is refracted by the lens 13 and then imaged, the image formed by combining at least two of the plane mirror, the convex lens, and the concave lens includes an inverted image and an upright image according to different imaging conditions. When the image is an erect image, the image and the subject 40 are located on the same side of the lens.
For example, the lens 13 is selected as a convex lens, and when the distance between the object 40 and the convex lens is smaller than the focal length of the lens, the image is an upright image, and under this condition, the image and the object 40 are located on the same side of the lens. By arranging the sensor chip 14 and the object 40 to be shot on the same side of the optical axis 13a of the lens, the light reflected by the object to be shot is refracted by the lens 13 and then just projected on the sensor chip 14, so that the object 40 to be shot can be shot by the camera 10 in an inclined manner.
It should be noted that the positional relationship between the object 40 and the formed image may be determined according to the magnitude relationship between the distance between the object 40 and the lens 13 and the focal length of the lens 13, and those skilled in the art may set the positional relationship according to actual situations, which is not limited in the embodiment of the present application.
Alternatively, referring to fig. 6, both the sensor chip 14 and the subject 40 are disposed offset from the optical axis 13a of the lens.
In the embodiment of the present application, the sensor chip 14 and the object to be photographed 40 are respectively disposed on the same side of the optical axis 13a of the lens by setting the relative positions of the sensor chip 14, the lens 13 and the object to be photographed 40 placed in the preset region 201, and the sensor chip 14 and the object to be photographed 40 are both staggered from the optical axis 13a of the lens, so as to increase the inclination angle of the camera 10 for inclined photographing, and meet the photographing requirement of the camera 10 with a larger inclination angle.
It is understood that the above-mentioned inclination angle refers to an angle between the center of the subject 40 and the lens 13 and the optical axis 13a of the lens, and the larger the distance between the central axis 40a of the subject and the optical axis 13a of the lens, the larger the inclination angle.
Alternatively, referring to fig. 7, the optical axes 13a of the lenses are disposed through the sensor chip 14 and the object 40, respectively.
In the embodiment of the present application, the sensor chip 14 and the object 40 to be photographed are respectively disposed on the same side of the optical axis 13a of the lens by setting the relative positions of the sensor chip 14, the lens 13 and the object 40 to be photographed placed in the preset region 201, and the optical axis 13a of the lens passes through the sensor chip 14 and the object 40 to be photographed respectively, so as to increase the photographing range of the camera 10, and meet the photographing requirement for the object 40 to be photographed with a larger size.
It is understood that the subject 40 is a planar subject, and the size of the subject 40 refers to the surface area of the planar subject.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments. For embodiments of the apparatus, the electronic device, the computer-readable storage medium, and the computer program product containing instructions, which are substantially similar to the method embodiments, the description is relatively simple, and reference may be made to some descriptions of the method embodiments for relevant points.
The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims (10)

1. A camera, comprising: the circuit board, the lens mount, the lens and the sensor chip;
the circuit board and the lens are respectively connected to two ends of the lens seat; a through hole is formed in the lens mount, and the sensor chip is arranged in the through hole;
the sensor chip is electrically connected with the circuit board; the sensor chip is arranged on one side, close to the lens, of the circuit board; the light sensing surface of the sensor chip faces the lens;
the central axis of the photosensitive surface is parallel to the optical axis of the lens and is arranged in a staggered mode.
2. The camera of claim 1, wherein an optical size of the sensor chip is smaller than an optical size of the lens.
3. The camera head according to claim 1, wherein an optical axis of the lens is disposed through the sensor chip;
or the optical axis of the lens avoids the sensor chip.
4. The camera of claim 1, wherein a field angle of the lens is equal to or greater than 60 degrees.
5. The camera of claim 1, wherein the spherical distortion of the lens is less than or equal to 3%.
6. A high speed scanner, comprising: a base, a support bar, and the camera head of any one of claims 1 to 5;
the supporting rod is arranged on the base, a preset area is arranged on the base, and the preset area is used for placing a shot object;
the camera is installed on the supporting rod and used for shooting the shot object.
7. The high-speed scanner according to claim 6, wherein a central axis of the photosensitive surface, an optical axis of the lens, and a central axis of the subject are parallel to each other;
the sensor chip and the shot object are respectively arranged on two sides of the optical axis of the lens.
8. The high-speed scanner according to claim 7, wherein the sensor chip and the object are disposed to be offset from an optical axis of the lens;
or the optical axis of the lens is respectively arranged by penetrating through the sensor chip and the shot object.
9. The camera according to claim 6, wherein a central axis of the light-sensing surface, an optical axis of the lens, and a central axis of the subject are parallel to each other;
the sensor chip and the shot object are respectively arranged on the same side of the optical axis of the lens.
10. The high-speed scanner according to claim 9, wherein the sensor chip and the object are disposed to be offset from an optical axis of the lens;
or the optical axis of the lens is respectively arranged by passing through the sensor chip and the shot object.
CN202210846850.8A 2022-07-19 2022-07-19 Camera and high appearance of clapping Pending CN115209025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210846850.8A CN115209025A (en) 2022-07-19 2022-07-19 Camera and high appearance of clapping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210846850.8A CN115209025A (en) 2022-07-19 2022-07-19 Camera and high appearance of clapping

Publications (1)

Publication Number Publication Date
CN115209025A true CN115209025A (en) 2022-10-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210846850.8A Pending CN115209025A (en) 2022-07-19 2022-07-19 Camera and high appearance of clapping

Country Status (1)

Country Link
CN (1) CN115209025A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117676027A (en) * 2024-01-31 2024-03-08 深圳市新良田科技股份有限公司 Portable short arm high-speed shooting instrument

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117676027A (en) * 2024-01-31 2024-03-08 深圳市新良田科技股份有限公司 Portable short arm high-speed shooting instrument
CN117676027B (en) * 2024-01-31 2024-05-07 深圳市新良田科技股份有限公司 Portable short arm high-speed shooting instrument

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