CN115207262A - Preparation method of display panel and display device - Google Patents
Preparation method of display panel and display device Download PDFInfo
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- CN115207262A CN115207262A CN202210923738.XA CN202210923738A CN115207262A CN 115207262 A CN115207262 A CN 115207262A CN 202210923738 A CN202210923738 A CN 202210923738A CN 115207262 A CN115207262 A CN 115207262A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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Abstract
The invention provides a preparation method of a display panel and a display device, wherein the preparation method of the display panel comprises the following steps: the invention provides a quantum dot fluorescent film and a light-emitting substrate, wherein the quantum dot fluorescent film comprises a plurality of quantum dot coatings arranged in an array manner, the light-emitting substrate comprises a plurality of light-emitting units arranged in an array manner, a first through hole is formed in one of the quantum dot fluorescent film and the light-emitting substrate, a second through hole or a light-reflecting point corresponding to the first through hole is formed in the other of the quantum dot fluorescent film and the light-emitting substrate, and the quantum dot fluorescent film and the light-emitting substrate are aligned through the first through hole and the second through hole or the first through hole and the light-reflecting point, so that the quantum dot coatings and the light-emitting units are in one-to-one correspondence.
Description
Technical Field
The present invention generally relates to the field of display panel technology, and in particular, to a method for manufacturing a display panel and a display device.
Background
With the continuous development of electronic technology, more and more application scenes in life need to use a display panel, and two substrates are generally aligned in the process of preparing the display panel.
Therefore, how to ensure the precision of the alignment process is a problem to be solved at present.
Disclosure of Invention
In order to solve the above problems or other problems, the present invention provides the following technical solutions.
In a first aspect, the present invention provides a method for manufacturing a display panel, the method at least comprising:
providing a quantum dot fluorescent film and a light-emitting substrate, wherein the quantum dot fluorescent film comprises a plurality of quantum dot coatings arranged in an array, and the light-emitting substrate comprises a plurality of light-emitting units arranged in an array;
forming a first via hole on one of the quantum dot fluorescent film and the light-emitting substrate, wherein the first via hole penetrates through the quantum dot fluorescent film or the light-emitting substrate;
forming a second via hole or a light reflection dot corresponding to the first via hole on the other one of the quantum dot fluorescent film and the light emitting substrate, wherein the second via hole penetrates through the quantum dot fluorescent film or the light emitting substrate; and (c) a second step of,
and aligning the quantum dot fluorescent film and the light-emitting substrate through the first via hole and the second via hole or through the first via hole and the light-reflecting dot, so that the plurality of quantum dot coatings correspond to the plurality of light-emitting units one to one.
According to the manufacturing method of an embodiment of the present invention, the step of aligning the quantum dot fluorescent film and the light emitting substrate through the first via hole and the second via hole or through the first via hole and the light reflection dot so that the plurality of quantum dot coatings correspond to the plurality of light emitting units one to one includes at least:
arranging a laser platform below the quantum dot fluorescent film or the light-emitting substrate on which the first via hole is formed;
calculating the luminous flux received by the laser platform in the process of aligning the quantum dot fluorescent film and the light-emitting substrate through the first via hole and the second via hole or through the first via hole and the light-reflecting dot; and the number of the first and second groups,
when the luminous flux reaches the maximum value, determining that the plurality of quantum dot coatings and the plurality of light-emitting units are in one-to-one correspondence.
According to the manufacturing method of an embodiment of the present invention, when the second via corresponding to the first via is formed on the other one of the quantum dot fluorescent film and the light-emitting substrate, the step of disposing a laser platform below the quantum dot fluorescent film or the light-emitting substrate on which the first via is formed specifically includes:
arranging a first laser platform below the quantum dot fluorescent film or the light-emitting substrate on which the first via hole is formed, and arranging a second laser platform above the quantum dot fluorescent film or the light-emitting substrate on which the second via hole is formed;
wherein when one of the first laser platform and the second laser platform is configured to emit laser light, the other of the first laser platform and the second laser platform is configured to receive the laser light through the first via and the second via.
According to the manufacturing method of an embodiment of the present invention, when the light reflection dot corresponding to the first via hole is formed on the other one of the quantum dot fluorescent film and the light emitting substrate, the step of disposing a laser platform below the quantum dot fluorescent film or the light emitting substrate on which the first via hole is formed specifically includes:
and arranging a third laser platform below the quantum dot fluorescent film or the light-emitting substrate on which the first via hole is formed, wherein the third laser platform is configured to emit laser light and is configured to receive the laser light through the first via hole and the light reflection point.
According to the manufacturing method of the embodiment of the invention, the number of the first via holes is multiple, the area of each first via hole is different, the number of the second via holes is multiple, the area of each second via hole is different, and the first via holes and the second via holes correspond to each other one by one according to the size of the area of the via holes.
According to the manufacturing method of the embodiment of the invention, the plurality of first via holes and the plurality of second via holes are orderly arranged according to the size of the area of the via holes in the first direction and/or the second direction, and an included angle is formed between the first direction and the second direction.
According to the manufacturing method of the invention, the plurality of first via holes and the plurality of second via holes are respectively dispersedly arranged in the quantum dot fluorescent film and the light-emitting substrate.
According to the manufacturing method of the invention, the plurality of first via holes and the plurality of second via holes are respectively located at the edges of the quantum dot fluorescent film and the light-emitting substrate.
According to the manufacturing method of an embodiment of the present invention, when the first via hole and the second via hole located at the edge are respectively formed on the quantum dot fluorescent film and the light-emitting substrate, after the step of aligning the quantum dot fluorescent film and the light-emitting substrate through the first via hole and the second via hole or through the first via hole and the light-reflecting dot so that the plurality of quantum dot coatings correspond to the plurality of light-emitting units one to one, the method further includes:
and cutting off the first via hole and the second via hole.
In a second aspect, the present invention provides a display device, at least comprising a display panel prepared by the preparation method according to any one of the above.
The beneficial effects of the invention are as follows: the invention provides a preparation method of a display panel and a display device, wherein the preparation method of the display panel at least comprises the following steps: the invention provides a quantum dot fluorescent film and a light-emitting substrate, wherein the quantum dot fluorescent film comprises a plurality of quantum dot coatings arranged in an array manner, the light-emitting substrate comprises a plurality of light-emitting units arranged in an array manner, a first through hole is formed in one of the quantum dot fluorescent film and the light-emitting substrate, the first through hole penetrates through the quantum dot fluorescent film or the light-emitting substrate, a second through hole or a light-reflecting point corresponding to the first through hole is formed in the other of the quantum dot fluorescent film and the light-emitting substrate, the second through hole penetrates through the quantum dot fluorescent film or the light-emitting substrate, and the quantum dot fluorescent film and the light-emitting substrate are aligned through the first through hole and the second through hole or the first through hole and the light-reflecting point, so that the quantum dot coatings correspond to the light-emitting units one by one.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments according to the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive effort.
Fig. 1 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention.
Fig. 2 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention.
Fig. 3 is a schematic view of an application scenario of a method for manufacturing a display panel according to an embodiment of the present invention.
Fig. 4 is a schematic view of another application scenario of the method for manufacturing a display panel according to the embodiment of the invention.
Fig. 5 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a movable end according to an embodiment of the present invention.
Fig. 7 is a detailed structural diagram of the movable end according to the embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Referring to fig. 1 and fig. 3, fig. 1 is a schematic flow chart illustrating a method for manufacturing a display panel 100 according to an embodiment of the invention, and fig. 3 is a schematic application scenario illustrating the method for manufacturing the display panel 100 according to the embodiment of the invention.
As shown in fig. 1, the preparation method may include: step S101, first forming step S102, second forming step S103, and alignment step S104 are provided, and the above steps will be described in detail with reference to fig. 1 and 3.
Providing step S101: a quantum dot fluorescent film 110 and a light emitting substrate 120 are provided, wherein the quantum dot fluorescent film 110 includes a plurality of quantum dot coatings arranged in an array, and the light emitting substrate 120 includes a plurality of light emitting units 121 arranged in an array.
Specifically, the display panel 100 in the embodiment of the present invention is a display panel based on a Quantum Dot (QD) technology, and it should be noted that the Quantum Dot display panel uses a blue Organic Light Emitting Diode (OLED) as a Light source, and Quantum Dot coatings capable of being excited by blue Light to emit Light of different colors (such as red and green) are respectively attached to different blue Organic Light Emitting devices, and a blue Light source emitted by the blue Organic Light Emitting device is added to form an RGB matrix, thereby implementing display.
In the process of manufacturing the quantum dot display panel, it is necessary to ensure the accuracy of alignment between each organic light emitting device and the corresponding quantum dot coating layer, and if the alignment is deviated, problems such as color cross may occur, which may affect the display effect of the display panel 100, and the present invention proposes a method for manufacturing the display panel 100 as described below.
Providing step S101: a quantum dot fluorescent film 110 and a light emitting substrate 120 are provided, wherein the quantum dot fluorescent film 110 includes a plurality of quantum dot coatings arranged in an array, and the light emitting substrate 120 includes a plurality of light emitting units 121 arranged in an array.
Specifically, as shown in fig. 3, the plurality of quantum dot coatings include a red quantum dot pattern layer 111a, a green quantum dot pattern layer 111b, and a transparent quantum dot pattern layer 111c, and the light emitting unit 121 is a blue organic light emitting device.
First forming step S102: forming a first via hole on one of the quantum dot fluorescent film and the light-emitting substrate, wherein the first via hole penetrates through the quantum dot fluorescent film or the light-emitting substrate;
second forming step S103: and forming a second through hole or a light reflection point corresponding to the first through hole on the other one of the quantum dot fluorescent film and the light-emitting substrate, wherein the second through hole penetrates through the quantum dot fluorescent film or the light-emitting substrate.
Specifically, as shown in fig. 3, in the first forming step S102 and the second forming step S103 of the present embodiment, the first via 122 is specifically formed on the light emitting substrate 120, and the light reflecting dot 112 corresponding to the first via 122 is formed on the quantum dot fluorescent film 110.
It should be understood that, in another embodiment according to the present invention, a light reflection dot corresponding to the first via hole may be formed on the quantum dot fluorescent film. In another embodiment of the present invention, the first via hole may be formed on the quantum dot fluorescent layer, and the second via hole or the light reflecting dot corresponding to the first via hole may be formed on the light emitting substrate. That is, the present invention does not limit the positions of the "first via" and the "second via or light reflection point" and does not limit the combination of the "first via" and the "second via or light reflection point".
Alignment step S104: and aligning the quantum dot fluorescent film and the light-emitting substrate through the first via hole and the second via hole or the first via hole and the light reflection point so that the plurality of quantum dot coatings correspond to the plurality of light-emitting units one to one.
Specifically, as shown in fig. 3, in the present embodiment, since the first via hole 122 is formed in the light emitting substrate 120 and the light reflecting dot 112 corresponding to the first via hole 122 is formed in the quantum dot fluorescent layer 110, in the present embodiment, the alignment step S104 is specifically:
the quantum dot fluorescent film 110 and the light emitting substrate 120 are aligned through the first via holes 122 and the light reflecting dots 112, so that the plurality of quantum dot coatings correspond to the plurality of light emitting units 121 one to one.
Further, referring to fig. 2 illustrating a further flow chart of the method for manufacturing the display panel 100 according to the embodiment of the present invention, as shown in fig. 2, in the embodiment of the present invention, the alignment step S104 may specifically include the following steps:
laser platform placing step S1041: a laser platform is arranged below the quantum dot fluorescent film or the light-emitting substrate with the first through hole;
calculation step S1042: calculating the luminous flux received by the laser platform in the process of aligning the quantum dot fluorescent film and the light-emitting substrate through the first via hole and the second via hole or through the first via hole and the light reflection point;
determination step S1043: when the luminous flux reaches the maximum value, it is determined that the plurality of quantum dot coatings have one-to-one correspondence with the plurality of light emitting units 121.
In this embodiment, since the first via hole 122 is formed in the light emitting substrate 120 and the light reflection dot 112 corresponding to the first via hole 122 is formed in the quantum dot fluorescent layer 110, in this embodiment, the laser platform placing step S1041 is specifically:
a third laser platform 130 is disposed under the light emitting substrate 120 formed with the first via 122, wherein the third laser platform 130 is configured to emit laser light and is configured to receive the laser light through the first via 122 and the light reflection point 112.
It should be understood that if a combination of the "first via" and the "light reflection point" is formed in the first forming step S102 and the second forming step S103, in the laser platform placing step S1041, the laser platform needs to be configured to emit laser light and to receive the laser light through the first via and the light reflection point, and the laser platform should be disposed below the first via and the light reflection point should be disposed above the first via.
Accordingly, in this embodiment, the calculating step S1042 specifically includes:
during the alignment of the quantum dot fluorescent film 110 with the light emitting substrate 120 through the first via hole 122 and the light reflection dot 112, the light flux received by the third laser stage 130 is calculated.
Further, with reference to fig. 3, in the present embodiment, the number of the first vias 122 is multiple, the via area of each first via 122 is different, the number of the light reflection points 112 is also multiple, the number of the light reflection points 112 is equal to the number of the first vias 122, and the via area and the reflection point area of a corresponding pair of the first vias 122 and the light reflection points 112 are equal.
It should be understood that, in other embodiments according to the present invention, if a plurality of first vias and a plurality of second vias are correspondingly disposed, the number of the first vias is different, the area of the first vias is different, the number of the second vias is also different, the area of the second vias is different, the number of the second vias is equal to the number of the first vias, and the area of the corresponding pair of the first vias and the second vias is equal.
Referring to fig. 3, in the present embodiment, the plurality of first via holes 122 and the plurality of light reflection dots 112 are sequentially arranged in the first direction (not labeled) according to the sizes of the via hole areas and the reflection dot areas, it should be noted that, on the one hand, the complexity of the preparation process can be reduced, and on the other hand, the difficulty of the calculating step S1042 can also be reduced.
It should be noted that, in the alignment step S104, coarse adjustment may be performed by using the first via hole 122 and the light reflection point 112 having larger via hole areas and reflection point areas, and then fine adjustment may be performed by using the first via hole 122 and the light reflection point 112 having smaller via hole areas and reflection point areas.
Further, although not shown, a plurality of first via holes 122 and a plurality of light-reflecting dots 112 may be prepared in a second direction (not labeled) of the quantum dot fluorescent film 110 and the light-emitting substrate 120, wherein the first direction and the second direction have an included angle, and further, in the process of performing the alignment step S104, alignment may be performed first with reference to the first via holes 122 and the light-reflecting dots 112 in the first direction, and then alignment may be performed with reference to the first via holes 122 and the light-reflecting dots 112 in the second direction.
With reference to fig. 3, in the present embodiment, the plurality of first via holes 122 and the plurality of light-reflecting dots 112 are respectively located at the edges of the light-emitting substrate 120 and the quantum dot fluorescent film 110, and therefore, after the alignment step S104 is completed, the method may further include:
the first via hole 122 and the light reflection point 112 are cut.
It should be understood that, in other embodiments according to the present invention, if the first via and the second via are correspondingly disposed, similarly, the plurality of first vias and the plurality of second vias may be orderly arranged according to the size of the via area in the first direction and/or the second direction, the first direction and the second direction have an included angle, and the plurality of first vias and the plurality of second vias are respectively located at the edges of the quantum dot fluorescent film and the light emitting substrate, and similarly, in these embodiments, after the alignment step S104 is completed, the method may further include: and cutting off the first via hole and the second via hole.
Further, referring to another application scenario diagram of the manufacturing method of the display panel 100 according to the embodiment of the invention shown in fig. 4, as shown in fig. 4, in this embodiment, the plurality of first vias 122 and the plurality of light-reflecting dots 112 are respectively disposed in the light-emitting substrate 120 and the quantum dot fluorescent film 110 in a dispersed manner, and therefore, in this embodiment, after the alignment step S104 is completed, the first vias 122 and the light-reflecting dots 112 do not need to be cut.
It should be understood that, in other embodiments according to the present invention, if the first via hole and the second via hole are correspondingly disposed, similarly, a plurality of first via holes and a plurality of second via holes may also be dispersedly disposed in the quantum dot fluorescent film and the light emitting substrate, respectively.
In another embodiment of the present invention, if a first via hole and a second via hole are correspondingly disposed, the laser platform placing step S1041 may specifically include the following steps:
arranging a first laser platform below the quantum dot fluorescent film or the light-emitting substrate with the first through hole, and arranging a second laser platform above the quantum dot fluorescent film or the light-emitting substrate with the second through hole;
wherein when one of the first laser platform and the second laser platform is configured to emit laser light, the other of the first laser platform and the second laser platform is configured to receive laser light through the first via and the second via.
In view of the foregoing, the present invention provides a method for manufacturing a display panel, the method at least comprising: the invention provides a quantum dot fluorescent film and a light-emitting substrate, wherein the quantum dot fluorescent film comprises a plurality of quantum dot coatings arranged in an array manner, the light-emitting substrate comprises a plurality of light-emitting units arranged in an array manner, a first through hole is formed in one of the quantum dot fluorescent film and the light-emitting substrate, the first through hole penetrates through the quantum dot fluorescent film or the light-emitting substrate, a second through hole or a light-reflecting point corresponding to the first through hole is formed in the other of the quantum dot fluorescent film and the light-emitting substrate, the second through hole penetrates through the quantum dot fluorescent film or the light-emitting substrate, and the quantum dot fluorescent film and the light-emitting substrate are aligned through the first through hole and the second through hole or the first through hole and the light-reflecting point, so that the quantum dot coatings correspond to the light-emitting units one by one.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a display device 500 according to an embodiment of the present invention, in which components and relative positions of the components can be visually seen.
As shown in fig. 5, the display device 500 includes a display panel 510, wherein the display panel 510 may be a display panel prepared by the preparation method as described in the above embodiments.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a mobile terminal 400 according to an embodiment of the present invention, the display device 500 is applied to the mobile terminal 400, the mobile terminal 400 may be a smart phone or a tablet computer, and the components of the present invention and the relative position relationship of the components can be visually seen from the figure.
As shown in fig. 6, the mobile terminal 400 includes a processor 401, a memory 402. The processor 401 is electrically connected to the memory 402.
The processor 401 is a control center of the mobile terminal 400, connects various parts of the entire mobile terminal using various interfaces and lines, and performs various functions of the mobile terminal and processes data by running or loading an application program stored in the memory 402 and calling data stored in the memory 402, thereby integrally monitoring the mobile terminal.
Referring to fig. 7, fig. 7 is a detailed structural schematic diagram of a mobile terminal 400 according to an embodiment of the present invention, where the mobile terminal 400 may be a smart phone or a tablet computer, and components of the present invention and relative position relationships of the components can be visually seen from the diagram.
Fig. 7 is a block diagram illustrating a specific structure of a mobile terminal 400 according to an embodiment of the present invention. As shown in fig. 7, the mobile terminal 400 may include Radio Frequency (RF) circuitry 410, memory 420 including one or more computer-readable storage media, an input unit 430, a display unit 440, a sensor 450, audio circuitry 460, a transmission module 470 (e.g., wireless Fidelity (Wi-Fi)), a processor 480 including one or more processing cores, and a power supply 490. Those skilled in the art will appreciate that the mobile terminal architecture shown in fig. 7 is not intended to be limiting of mobile terminals and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
The RF circuit 410 is used for receiving and transmitting electromagnetic waves, and implementing interconversion between the electromagnetic waves and electrical signals, thereby communicating with a communication network or other devices. RF circuit 410 may include various existing circuit components for performing these functions, such as an antenna, a radio frequency transceiver, a digital signal processor, an encryption/decryption chip, a Subscriber Identity Module (SIM) card, memory, and so forth. The RF circuit 410 may communicate with various networks such as the internet, an intranet, a wireless network, or with other devices over a wireless network. The wireless network may include a cellular telephone network, a wireless local area network, or a metropolitan area network. The Wireless network may use various Communication standards, protocols and technologies, including but not limited to Global System for Mobile Communication (GSM), enhanced Data GSM Environment (EDGE), wideband Code Division Multiple Access (WCDMA), code Division Multiple Access (CDMA), time Division Multiple Access (TDMA), wireless Fidelity (Wi-Fi) (e.g., IEEE802.11 a, IEEE802.11 b, IEEE802.1 g and/or IEEE802.11 n), voice over Internet Protocol (VoIP), internet mail Access (world Interoperability for Microwave), wimax, and any other suitable protocols for instant messaging, including those currently developed.
The memory 420 may be configured to store software programs and modules, such as program instructions corresponding to the audio power amplifier control method, and the processor 480 executes various functional applications and data processing by operating the software programs and modules stored in the memory 420, that is, obtains the frequency of the information transmission signal transmitted by the mobile terminal 400. Generating interference signals, and the like. The memory 420 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 420 may further include memory located remotely from the processor 480, which may be connected to the mobile terminal 400 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The input unit 430 may be used to receive input numeric or character information and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function control. In particular, the input unit 430 may include a touch-sensitive surface 431 as well as other input devices 432. The touch-sensitive surface 431, also referred to as a touch display screen or a touch pad, may collect touch operations by a user on or near the touch-sensitive surface 431 (e.g., operations by a user on or near the touch-sensitive surface 431 using any suitable object or attachment such as a finger, a stylus, etc.) and drive the corresponding connection device according to a predetermined program. Alternatively, the touch sensitive surface 431 may comprise both a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, and sends the touch point coordinates to the processor 480, and can receive and execute commands sent by the processor 480. In addition, the touch-sensitive surface 431 may be implemented in various types, such as resistive, capacitive, infrared, and surface acoustic wave. The input unit 430 may include other input devices 432 in addition to the touch-sensitive surface 431. In particular, other input devices 432 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.
The display unit 440 may be used to display information input by or provided to the user and various graphical user interfaces of the mobile terminal 400, which may be made up of graphics, text, icons, video, and any combination thereof. The Display unit 440 may include a Display panel 441, and optionally, the Display panel 441 may be configured in the form of an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), or the like. Further, the touch sensitive surface 431 may overlay the display panel 441, and when a touch operation is detected on or near the touch sensitive surface 431, the touch operation is transmitted to the processor 480 to determine the type of the touch event, and then the processor 480 provides a corresponding visual output on the display panel 441 according to the type of the touch event. Although the touch-sensitive surface 431 and the display panel 441 are shown as two separate components to implement input and output functions, in some embodiments, the touch-sensitive surface 431 and the display panel 441 may be integrated to implement input and output functions.
The mobile terminal 400 may also include at least one sensor 450, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor that may adjust the brightness of the display panel 441 according to the brightness of ambient light, and a proximity sensor that may generate an interrupt when the folder is closed or closed. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when the mobile phone is stationary, and can be used for applications of recognizing the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which may be further configured on the mobile terminal 400, detailed descriptions thereof are omitted.
The audio circuit 460, speaker 461, microphone 462 may provide an audio interface between a user and the mobile terminal 400. The audio circuit 460 may transmit the electrical signal converted from the received audio data to the speaker 461, and convert the electrical signal into a sound signal for output by the speaker 461; on the other hand, the microphone 462 converts the collected sound signal into an electric signal, which is received by the audio circuit 460 and converted into audio data, which is then processed by the audio data output processor 480, and then transmitted to, for example, another terminal via the RF circuit 410, or output to the memory 420 for further processing. The audio circuit 460 may also include an earbud jack to provide communication of peripheral headphones with the mobile terminal 400.
The mobile terminal 400, which may assist the user in receiving requests, sending information, etc., through the transmission module 470 (e.g., a Wi-Fi module), provides the user with wireless broadband internet access. Although the transmission module 470 is shown in the drawing, it is understood that it does not belong to the essential constitution of the mobile terminal 400 and may be omitted entirely as needed within the scope not changing the essence of the invention.
The processor 480 is a control center of the mobile terminal 400, connects various parts of the entire mobile phone using various interfaces and lines, and performs various functions of the mobile terminal 400 and processes data by operating or executing software programs and/or modules stored in the memory 420 and calling data stored in the memory 420, thereby integrally monitoring the mobile terminal. Optionally, processor 480 may include one or more processing cores; in some embodiments, processor 480 may integrate an application processor, which primarily handles operating systems, user interfaces, applications, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into processor 480.
The mobile terminal 400 may also include a power supply 490 (e.g., a battery) for powering the various components, which in some embodiments may be logically connected to the processor 480 via a power management system that may be configured to manage charging, discharging, and power consumption. The power supply 490 may also include any component including one or more dc or ac power sources, recharging systems, power failure detection circuitry, power converters or inverters, power status indicators, and the like.
Although not shown, the mobile terminal 400 further includes a camera (e.g., a front camera, a rear camera, etc.), a bluetooth module, a flashlight, etc., which are not described in detail herein. Specifically, in the present embodiment, the display unit of the mobile terminal 400 is a touch screen display.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by using equivalents or equivalent substitutions fall within the protection scope of the claims of the present invention.
In summary, although the preferred embodiments of the present invention have been described above, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A preparation method of a display panel is characterized by at least comprising the following steps:
providing a quantum dot fluorescent film and a light-emitting substrate, wherein the quantum dot fluorescent film comprises a plurality of quantum dot coatings arranged in an array, and the light-emitting substrate comprises a plurality of light-emitting units arranged in an array;
forming a first via hole on one of the quantum dot fluorescent film and the light-emitting substrate, wherein the first via hole penetrates through the quantum dot fluorescent film or the light-emitting substrate;
forming a second via hole or a light reflection dot corresponding to the first via hole on the other one of the quantum dot fluorescent film and the light emitting substrate, wherein the second via hole penetrates through the quantum dot fluorescent film or the light emitting substrate; and the number of the first and second groups,
and aligning the quantum dot fluorescent film with the light-emitting substrate through the first via hole and the second via hole or through the first via hole and the light reflection dot, so that the plurality of quantum dot coatings correspond to the plurality of light-emitting units one to one.
2. The method for manufacturing a light emitting device according to claim 1, wherein the step of aligning the quantum dot fluorescent film with the light emitting substrate through the first via hole and the second via hole or through the first via hole and the light reflecting dot so that the plurality of quantum dot coatings correspond to the plurality of light emitting units one to one includes at least:
arranging a laser platform below the quantum dot fluorescent film or the light-emitting substrate on which the first via hole is formed;
calculating the luminous flux received by the laser platform in the process of aligning the quantum dot fluorescent film and the light-emitting substrate through the first via hole and the second via hole or through the first via hole and the light reflection point; and (c) a second step of,
when the luminous flux reaches the maximum value, determining that the plurality of quantum dot coatings correspond to the plurality of light-emitting units one by one.
3. The method according to claim 2, wherein when the second via corresponding to the first via is formed on the other of the quantum dot phosphor film and the light-emitting substrate, the step of disposing a laser platform below the quantum dot phosphor film or the light-emitting substrate on which the first via is formed specifically comprises:
arranging a first laser platform below the quantum dot fluorescent film or the light-emitting substrate on which the first via hole is formed, and arranging a second laser platform above the quantum dot fluorescent film or the light-emitting substrate on which the second via hole is formed;
wherein when one of the first laser platform and the second laser platform is configured to emit laser light, the other of the first laser platform and the second laser platform is configured to receive the laser light through the first via and the second via.
4. The method according to claim 2, wherein when the light-reflecting dots corresponding to the first via holes are formed on the other one of the quantum dot phosphor film and the light-emitting substrate, the step of disposing a laser platform below the quantum dot phosphor film or the light-emitting substrate on which the first via holes are formed specifically comprises:
and arranging a third laser platform below the quantum dot fluorescent film or the light-emitting substrate on which the first via hole is formed, wherein the third laser platform is configured to emit laser light and is configured to receive the laser light through the first via hole and the light reflection point.
5. The method according to claim 1, wherein the number of the first vias is plural, the via areas of the first vias are different, the number of the second vias is plural, the via areas of the second vias are different, and the plurality of first vias and the plurality of second vias correspond to each other in a one-to-one manner according to the sizes of the via areas.
6. The method according to claim 5, wherein the first vias and the second vias are arranged in order according to the area of the vias in a first direction and/or a second direction, and the first direction and the second direction form an included angle.
7. The manufacturing method according to claim 5, wherein a plurality of the first via holes and a plurality of the second via holes are dispersedly disposed in the quantum dot fluorescent film and the light emitting substrate, respectively.
8. The method according to claim 1, wherein a plurality of the first via holes and a plurality of the second via holes are respectively located at edges of the quantum dot fluorescent film and the light-emitting substrate.
9. The method according to claim 8, wherein when the first via hole and the second via hole are formed at the edge on the quantum dot phosphor film and the light-emitting substrate, respectively, after the step of aligning the quantum dot phosphor film with the light-emitting substrate through the first via hole and the second via hole or through the first via hole and the light-reflecting dot so that the plurality of quantum dot coatings correspond to the plurality of light-emitting units one to one, the method further comprises:
and cutting off the first via hole and the second via hole.
10. A display device comprising at least a display panel produced by the production method according to any one of claims 1 to 9.
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