CN115206950A - LED lamp panel and manufacturing method thereof - Google Patents
LED lamp panel and manufacturing method thereof Download PDFInfo
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- CN115206950A CN115206950A CN202210728844.2A CN202210728844A CN115206950A CN 115206950 A CN115206950 A CN 115206950A CN 202210728844 A CN202210728844 A CN 202210728844A CN 115206950 A CN115206950 A CN 115206950A
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- 238000004806 packaging method and process Methods 0.000 claims description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
The invention is suitable for the technical field of LEDs, and provides an LED lamp panel which comprises a substrate, wherein the substrate is provided with a circuit layer, and the circuit layer is provided with a bonding pad used for being connected with a plurality of LED chips; the circuit layer is provided with a first light reflecting layer, the first light reflecting layer is provided with a plurality of windowing structures, the windowing structures are arranged in an array mode, and at least one pair of bonding pads used for being connected with the LED chip are distributed in each windowing structure; the LED lamp panel further comprises a second reflecting layer filled between the first reflecting layer and the LED chips, and the reflectivity of the second reflecting layer is greater than that of the first reflecting layer. The invention also provides a manufacturing method of the LED lamp panel. The LED lamp panel and the manufacturing method thereof are beneficial to die bonding, the lighting effect is improved, the process yield is improved, and the manufacturing cost is low.
Description
Technical Field
The invention belongs to the technical field of LEDs, and particularly relates to an LED lamp panel and a manufacturing method thereof.
Background
Regional dimming can be realized to LED backlight plate (local dimming), the display image quality is greatly promoted, and obtain the favor in market, among the prior art, LED backlight plate based on glass substrate need coat the white printing ink of one deck on glass substrate, and do windowing on the position of placing the LED chip and handle in order to expose the pad, the processing of windowing of being convenient for LED chip and pad welding (solid crystal promptly) white printing ink can have very big influence to the light efficiency of backlight plate, it is too big to window (can expose the glass substrate), the light that LED sent can see through glass and the loss, it is the undersize to window, printing ink can cover the pad and cause the solid crystal bad. Meanwhile, the reflectivity of the white ink is generally not high, and the lighting effect of the LED backlight lamp panel is always limited by the reflectivity of the white ink, so that the lighting effect of the LED backlight lamp panel is relatively low, and the improvement of backlight brightness is not facilitated.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides the LED lamp panel and the manufacturing method thereof, which are beneficial to die bonding, improved light efficiency, improved backlight brightness and low manufacturing cost.
The technical scheme of the invention is as follows: an LED lamp panel is characterized in that a circuit layer is arranged on a substrate and provided with a bonding pad used for being connected with an LED chip; the LED packaging structure comprises a circuit layer, a circuit layer and an LED chip, wherein the circuit layer is provided with a first reflecting layer, the first reflecting layer is provided with a plurality of windowing structures, at least one pair of bonding pads is arranged in a region corresponding to each windowing structure, the LED chip is arranged in the windowing structure and connected to the bonding pads corresponding to the windowing structures, and an accommodating region is formed between the outer periphery side of the LED chip and the inner periphery side of the windowing structure; the LED lamp panel further comprises a second reflecting layer filled in the accommodating area.
As a further improvement of the technical scheme, the second reflecting layer is made of silica gel or silicon resin, and reflecting particles are dispersedly arranged on the second reflecting layer.
As a further improvement of the present technical solution, the second light reflecting layer is formed by dispensing glue in the fenestration.
As a further improvement of the technical solution, the LED chip is a flip chip, and a gap is formed between one surface of the LED chip facing the substrate and the substrate; the second light reflecting layer comprises a side light reflecting part connected with the outer periphery of the LED chip and a bottom light reflecting part filled in the gap.
As a further improvement of the technical scheme, a solder paste layer is arranged on the surface of the bonding pad and used for being connected with the LED chip, and the second reflecting layer covers the solder paste layer.
As a further improvement of the present technical solution, the top surface of the first light reflecting layer is between the bottom surface and the top surface of the LED chip, and the top surface of the second light reflecting layer is not higher than the top surface of the first light reflecting layer.
As a further improvement of the present technical solution, the reflectance of the second light reflecting layer is greater than the reflectance of the first light reflecting layer.
As a further improvement of the technical scheme, the first light reflecting layer is made of white ink.
As a further improvement of the present technical solution, the thickness value of the first light reflecting layer ranges from 20 micrometers to 80 micrometers.
As a further improvement of the present technical solution, the size of the windowing structure satisfies the following relationship:
Bx＜Px，By＜Py；
wherein Bx represents the largest dimension of the windowing structure in the transverse direction, by represents the largest dimension of the windowing structure in the longitudinal direction, px represents the transverse spacing between two adjacent LED chips, and Py represents the longitudinal spacing between two adjacent LED chips.
As a further improvement of the technical scheme, the windowing structure is a rectangular through hole, and the length size of the rectangular through hole is more than or equal to 2mm.
The invention also provides a manufacturing method of the LED lamp panel, which is used for manufacturing the LED lamp panel and comprises the following steps:
preparing a substrate;
providing a circuit layer having a pad on the substrate;
a first light reflecting layer formed by a first light reflecting material is arranged on the circuit layer;
arranging a plurality of windowing structures on the first light reflecting layer, so that at least one bonding pad is arranged in the area of each windowing structure;
arranging an LED chip in the windowing structure, and connecting the LED chip with the bonding pad;
and filling a second reflective material in the windowing structure, and enabling the second reflective material to be positioned between the first reflective layer and the LED chip to form a second reflective layer.
According to the LED lamp panel and the manufacturing method thereof, the circuit layer is provided with the first reflecting layer, the first reflecting layer is provided with the plurality of windowing structures, the area corresponding to each windowing structure is provided with at least one bonding pad, the LED chip is arranged in the windowing structure and connected to the bonding pad corresponding to the windowing structure, the accommodating area is formed between the outer peripheral side of the LED chip and the inner peripheral side of the windowing structure, the second reflecting layer is filled in the accommodating area, crystal solidification is facilitated, and the manufacturing cost is low. The LED lamp panel and the manufacturing method thereof provided by the invention are not only beneficial to die bonding, but also improve the lighting effect, are beneficial to improving the backlight brightness, improve the process yield and have low manufacturing cost.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a substrate in an LED lamp panel according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a printed circuit layer on a substrate in an LED lamp panel according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a first reflective layer coated on a circuit layer in an LED lamp panel according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a first reflective layer in an LED lamp panel provided by an embodiment of the present invention, where the first reflective layer is provided with a windowing structure;
fig. 5 is a schematic structural diagram of an LED chip soldered to a solder pad in an LED lamp panel according to an embodiment of the present invention;
fig. 6 is a schematic structural view of an LED lamp panel according to an embodiment of the present invention, in which a second reflective material is filled in an accommodating area;
fig. 7 is a schematic structural diagram of an LED lamp panel according to an embodiment of the present invention;
fig. 8 is a top view of an LED lamp panel according to an embodiment of the present invention;
fig. 9 is another top view of an LED lamp panel according to an embodiment of the present invention.
Reference numbers in the figures:
1-an LED chip; 3-a circuit layer; 4-a first reflective layer, 41-a windowing structure, 410-a containing area; 5-a second reflective layer, 50-a second reflective material, 51-a side reflective part, 52-a bottom reflective part; 6-a substrate; 7-solder paste layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, directly disposed or connected, or indirectly disposed or connected through intervening elements or intervening structures.
In addition, in the embodiments of the present invention, if there are terms of orientation or positional relationship indicated by "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., it is only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the structure, feature, device or element referred to must have a specific orientation or positional relationship, nor must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The various features and embodiments described in the embodiments may be combined in any suitable manner, for example, different embodiments may be formed by combining different features/embodiments, and in order to avoid unnecessary repetition, various possible combinations of features/embodiments in the present invention will not be described in detail.
As shown in fig. 7 to 9, an LED lamp panel provided in an embodiment of the present invention includes a substrate and LED chips 1, where the substrate is a glass substrate 6 (as shown in fig. 1) in this embodiment, the substrate is provided with a circuit layer 3, that is, the surface of the glass substrate 6 is provided with the circuit layer 3, the LED chips 1 are provided with a plurality of LED chips 1, and the circuit layer 3 has at least one pair of pads (as shown in fig. 2) for connecting with the plurality of LED chips 1; the light-emitting diode is characterized in that a first reflective layer 4 (shown in fig. 3) is arranged on the circuit layer 3, the lower surface of the first reflective layer 4 covers the circuit layer 3, the first reflective layer 4 is provided with a plurality of windowing structures 41 (shown in fig. 4), and the windowing structures 41 are hole sites penetrating through the first reflective layer 4. The LED chips 1 are arranged in the window structures 41 (as shown in fig. 5), and are connected to pads corresponding to the window structures 41, in this embodiment, the window structures 41 are arranged in an array, the window area of the window structures 41 is larger than the projection area of the LED chips 1 on the glass substrate 6, the positions of the surfaces of the glass substrates 6, where the LED chips 1 need to be welded, are exposed, and the LED chips 1 are easily placed in the window structures 41, that is, the window structures 41 are arranged to expose the pads, thereby preventing the pads from being covered by the first reflective layer 4, facilitating welding of the LED chips 1 located in the window structures 41 to the corresponding pads, and the gap between the window structures 41 and the LED chips 1 is inconvenient to install and too large, so that light leakage is easy to affect the light efficiency and the yield is low; because the size of structure 41 of windowing is greater than the overall dimension of LED chip 1, LED chip 1 periphery side with form the holding area 410 between the interior week side of structure 41 of windowing, the LED lamp plate still includes second reflector layer 5, second reflector layer 5 fill in holding area 410 (as shown in fig. 6), second reflector layer 5 fill in second reflector layer 5 is located the structure 41 of windowing, and is located the top of circuit layer 3 and the periphery side of LED chip 1, second reflector layer 5 with the close laminating of LED chip 1 periphery side, and second reflector layer 5 and the close laminating of the interior week side of structure 41 of windowing, the size of structure 41 of windowing is greater than LED chip 1's size makes LED chip 1 easily place in structure 41 of windowing, and the preparation is efficient to the preparation is with low costs, does benefit to and guarantees solid brilliant yields, and the second reflector layer 5 through filling formation can be full of holding area 410 well, avoids the clearance. The LED lamp panel provided by the embodiment of the invention is beneficial to die bonding, improves the lighting effect, and is high in preparation efficiency and low in preparation cost.
Furthermore, the reflectivity of the second reflective layer 5 is greater than the reflectivity of the first reflective layer 4, more effective light rays are reflected by the second reflective layer 5 with higher reflectivity, the luminous efficiency is higher, and the luminous efficiency is improved.
Further, the top surface of the first light reflecting layer 4 is between the bottom surface and the top surface of the LED chip 1, and the top surface of the second light reflecting layer 5 is not higher than the top surface of the first light reflecting layer 4. The first light reflecting layer 4 may have a thickness value ranging from 20 to 80 micrometers. In the concrete application, fill second reflector layer 5 in the accommodation region 410 between LED chip 1 and first reflector layer 4, fill promptly in windowing structure 41, and the top surface of second reflector layer 5 can be less than the top surface of first reflector layer 4, perhaps keep the parallel and level with the top surface of first reflector layer 4, second reflector layer 5 in this embodiment adopts the colloid to solidify the back and forms, and the colloid has certain mobility, and it is effectual to fill, avoids appearing lacking the glue, has bad phenomena such as light leak clearance. The thickness of the first light reflecting layer 4 is a (as shown in fig. 3), the thickness of the second light reflecting layer 5 is c (as shown in fig. 7), in order to prevent the colloid from overflowing to the upper surface of the first light reflecting layer 4, the amount of the colloid forming the second light reflecting layer 5 needs to be controlled, so that the thickness c of the second light reflecting layer 5 is not more than the thickness a of the first light reflecting layer 4, the colloid of the second light reflecting layer 5 is prevented from overflowing to the first light reflecting layer 4, the light efficiency consistency of the LED lamp panel is favorably ensured, the value range of a can be 20 micrometers to 80 micrometers, preferably, a is 25 micrometers to 60 micrometers, and more preferably, a is 50 micrometers to 60 micrometers.
Further, the size of the windowing structure 41 satisfies the following relationship: bx is less than Px, by is less than Py; wherein Bx represents the largest dimension of the windowing structure in the transverse direction, by represents the largest dimension of the windowing structure in the longitudinal direction, px represents the transverse distance between two adjacent LED chips 1, and Py represents the longitudinal distance between two adjacent LED chips 1. In the specific application, the structure 41 of windowing is the rectangle, and its maximum dimension then is rectangle length, as shown in fig. 9, promptly the structure 41 of windowing can be the rectangular channel, and the appearance of LED chip 1 can be the rectangle, and adjacent two interval value (Pitch) between the LED chip 1 center is p (as shown in fig. 8, fig. 9), and the horizontal centre-to-centre spacing of two adjacent LED chips 1 is Px and vertical centre-to-centre spacing is Py, the maximum horizontal dimension of the structure 41 of windowing is Bx and the maximum vertical dimension is By (as shown in fig. 7), and Bx < Px, by < Py. The receiving area 410 may be in a shape of a rectangle with a length dimension Bx of 2mm or more, preferably Bx of 3mm or more. In another embodiment, as shown in fig. 8, the window opening structure 41 may also be a circular hole, in which case the largest dimension is the diameter thereof, and the diameters are both smaller than Px and Py.
Further, the LED chip 1 may be a flip chip, a gap may be provided between one surface of the LED chip 1 facing the glass substrate 6 and the glass substrate 6, the second light reflecting layer 5 may include a side light reflecting portion 51 and a bottom light reflecting portion 52, the side light reflecting portion 51 may be in contact with an outer peripheral side of the LED chip 1, and the bottom light reflecting portion 52 may be filled in the gap and in contact with a bottom surface of the LED chip 1.
Further, the surface of the pad is provided with a solder paste layer 7, and the metallic solder paste of the solder paste layer 7 is gray and can absorb blue light. The LED chip 1 is connected to the pad through the solder paste layer 7, and the gap filled with the bottom surface light reflecting portion 52 is formed. The solder paste layer 7 is used for being connected with the LED chip 1, specifically, solder paste is printed on a bonding pad, and the LED chip 1 is welded on the bonding pad, so that die bonding is completed; the top surface of the first reflecting layer 4 is arranged between the bottom surface and the top surface of the LED chip 1, the first reflecting layer 4 is higher than the top surface of the LED chip 1 and can block light, and the first reflecting layer 4 is lower than the bottom surface of the LED chip 1 so as to expose the solder paste layer 7. In this embodiment, the LED chip 1 is connected to the bonding pad through the solder paste layer 7 (metal solder paste), the metal solder paste is gray, the bottom reflection portion 52 at the bottom of the LED chip 1 can be covered on the metal solder paste layer 7, and blue light can be prevented from being absorbed by the solder paste layer 7.
Further, the first light reflecting layer 4 may be made of white ink. The second light reflecting layer 5 is made of silica gel or silicone resin, and light reflecting particles are arranged on the second light reflecting layer 5 in a dispersed mode. In a specific application, the second light reflecting layer 5 contains TiO 2 Reflective particles, baSO 4 At least one of the reflective particles, namely a certain amount of reflective particles are mixed in the sizing material, so that the reflectivity of the second reflective layer 5 is further improved; the reflective layer of LED lamp plate can adopt white printing ink and white glue combination, and white glue and white printing ink all can be used as reflecting material: the white ink has low cost, but low reflectivity and poor fluidity, and is suitable for large-area printing; white glue is expensive, has high reflectivity and strong fluidity, and is generally used for dispensing local gaps in the prior art; in this embodiment, the first reflective layer 4 is made of white oil (white ink), which is low in cost, and the second reflective layer 5 is made of white glue, which is good in fluidity and good in filling effect, wherein the reflectivity of the first reflective layer 4 is generally not higher than 93%, and the reflectivity of the second reflective layer 5 is not less than 98%, and meanwhile, the problems of difficult die bonding, low light efficiency and high cost are solved. The LED lamp panel provided by the invention realizes easy die bondingThe light efficiency is improved, the efficiency is high, the cost is low, the crystal solidification is easy, the cost is considered while the high light efficiency is ensured, the operability is high in the actual production, and the market application value is high.
The embodiment of the invention also provides a manufacturing method of the LED lamp panel, which is used for manufacturing the LED lamp panel and comprises the following steps:
as shown in fig. 1, the substrate is prepared, and the glass substrate 6 is used in this embodiment, so that the stability is good and the cost is low.
As shown in fig. 2, a circuit layer 3 having pads is provided on the substrate, and specifically, the circuit layer 3 is printed on the substrate, and the circuit layer 3 has pads for connecting with the plurality of LED chips 1.
As shown in fig. 3, a first light reflecting layer 4 formed of a first light reflecting material is provided on the circuit layer 3; specifically, in this embodiment, white ink is printed on the circuit layer 3 to form the first reflective layer 4.
As shown in fig. 4, a plurality of windowing structures 41 are disposed on the first light reflecting layer 4, so that at least one pair of pads is disposed in an area of each windowing structure 41; specifically, in this embodiment, the opening structure 41 is formed by an exposure etching process. The first light reflecting layer 4 is provided with a plurality of window structures 41 arranged in a matrix, in this embodiment, the window structures 41 are rectangular grooves (as shown in fig. 7), and in another embodiment, the window structures 41 may also be circular holes (as shown in fig. 8).
As shown in fig. 5, the LED chip 1 is disposed in the window structure 41, and the LED chip 1 is connected to the pad; specifically, the bonding pads corresponding to the same LED chip 1 are also located in the windowing structure 41, that is, the LED chips 1 located in the windowing structure 41 are connected to the corresponding bonding pads, and two or more LED chips 1 may also be disposed in each windowing structure 41.
As shown in fig. 6, a second reflective material 50 (in this embodiment, the reflectivity of the second reflective material 50 is greater than the reflectivity of the first reflective material) is filled in the windowing structure 41, and the second reflective material 50 is located between the first reflective layer 4 and the LED chip 1, so as to form a second reflective layer 5, as shown in fig. 7. Specifically, in the present embodiment, white glue is used as the second light reflecting material 50.
According to the LED lamp panel and the manufacturing method thereof provided by the embodiment of the invention, the circuit layer 3 is provided with the first reflecting layer 4, the first reflecting layer 4 is provided with the plurality of windowing structures 41, the LED chip 1 is arranged in the windowing structures 41 and connected to the bonding pad corresponding to the windowing structures 41, the accommodating area 410 is formed between the outer peripheral side of the LED chip 1 and the inner peripheral side of the windowing structures 41, and the accommodating area 410 is filled with the second reflecting layer 5 with higher reflectivity, so that the die bonding is facilitated, and the preparation cost is low; the reflectivity of the second reflective layer 5 is greater than that of the first reflective layer 4, so that the light efficiency is improved. The LED lamp panel and the manufacturing method thereof provided by the invention are not only beneficial to die bonding, but also improve the light efficiency, improve the process yield and have low preparation cost.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (12)
1. An LED lamp panel comprises a substrate and an LED chip, and is characterized in that a circuit layer is arranged on the substrate, and the circuit layer is provided with a bonding pad used for being connected with the LED chip; the LED packaging structure comprises a circuit layer, a first light reflecting layer, a second light reflecting layer and a plurality of window structures, wherein the circuit layer is provided with the first light reflecting layer, the first light reflecting layer is provided with the plurality of window structures, at least one pair of bonding pads is arranged in a region corresponding to each window structure, an LED chip is arranged in the window structures and connected to the bonding pads corresponding to the window structures, and a containing region is formed between the outer peripheral side of the LED chip and the inner peripheral side of the window structures; the LED lamp panel further comprises a second reflecting layer filled in the accommodating area.
2. The LED lamp panel according to claim 1, wherein the second reflective layer is made of resin, and reflective particles are dispersed in the second reflective layer.
3. The LED lamp panel of claim 2, wherein the second reflective layer is formed by dispensing glue within the fenestration.
4. The LED lamp panel according to claim 1, wherein the LED chip is a flip chip, and a gap is formed between one surface of the LED chip facing the substrate and the substrate; the second light reflecting layer comprises a side light reflecting part connected with the outer periphery of the LED chip and a bottom light reflecting part filled in the gap.
5. The LED lamp panel of claim 1, wherein a solder paste layer is disposed on the surface of the bonding pad, the solder paste layer is used for being connected with the LED chip, and the second reflective layer covers the solder paste layer.
6. The LED lamp panel of any one of claims 1 to 5, wherein the top surface of the first reflective layer is between the bottom surface and the top surface of the LED chip, and the top surface of the second reflective layer is not higher than the top surface of the first reflective layer.
7. The LED lamp panel of claim 1, wherein the reflectivity of the second reflective layer is greater than the reflectivity of the first reflective layer.
8. The LED lamp panel of claim 1, wherein the first reflective layer is made of white ink.
9. The LED lamp panel of claim 1, wherein the first light reflecting layer has a thickness value ranging from 20 micrometers to 80 micrometers.
10. The LED lamp panel of claim 1, wherein the dimensions of the fenestration satisfy the following relationship:
Bx＜Px，By＜Py；
wherein Bx represents the largest dimension of the windowing structure in the transverse direction, by represents the largest dimension of the windowing structure in the longitudinal direction, px represents the transverse spacing between two adjacent LED chips, and Py represents the longitudinal spacing between two adjacent LED chips.
11. The LED lamp panel of claim 1, wherein the windowing structure is a rectangular through hole, and the length dimension of the rectangular through hole is greater than or equal to 2mm.
12. A method for manufacturing an LED lamp panel, wherein the method is used for manufacturing the LED lamp panel according to any one of claims 1 to 11, and comprises the steps of:
preparing a substrate;
providing a circuit layer having a pad on the substrate;
a first light reflecting layer formed by a first light reflecting material is arranged on the circuit layer;
arranging a plurality of windowing structures on the first light reflecting layer, so that at least one bonding pad is arranged in the area of each windowing structure;
arranging an LED chip in the windowing structure, and connecting the LED chip with the bonding pad;
and filling a second reflective material in the windowing structure, and enabling the second reflective material to be positioned between the first reflective layer and the LED chip to form a second reflective layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210728844.2A CN115206950A (en) | 2022-06-24 | 2022-06-24 | LED lamp panel and manufacturing method thereof |
| PCT/CN2023/102012 WO2023246932A1 (en) | 2022-06-24 | 2023-06-24 | Led lamp panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210728844.2A CN115206950A (en) | 2022-06-24 | 2022-06-24 | LED lamp panel and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115206950A true CN115206950A (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210728844.2A Pending CN115206950A (en) | 2022-06-24 | 2022-06-24 | LED lamp panel and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN115206950A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023246932A1 (en) * | 2022-06-24 | 2023-12-28 | 惠州市聚飞光电有限公司 | Led lamp panel |
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2022
- 2022-06-24 CN CN202210728844.2A patent/CN115206950A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023246932A1 (en) * | 2022-06-24 | 2023-12-28 | 惠州市聚飞光电有限公司 | Led lamp panel |
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