CN115198353A - Lamp holder and auxiliary dismounting tool for epitaxial reaction furnace - Google Patents
Lamp holder and auxiliary dismounting tool for epitaxial reaction furnace Download PDFInfo
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- CN115198353A CN115198353A CN202210967257.9A CN202210967257A CN115198353A CN 115198353 A CN115198353 A CN 115198353A CN 202210967257 A CN202210967257 A CN 202210967257A CN 115198353 A CN115198353 A CN 115198353A
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- 238000006243 chemical reaction Methods 0.000 title abstract description 28
- 238000000034 method Methods 0.000 claims description 17
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- 238000000926 separation method Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 description 44
- 150000002367 halogens Chemical class 0.000 description 44
- 239000007789 gas Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000010453 quartz Substances 0.000 description 7
- 210000000080 chela (arthropods) Anatomy 0.000 description 6
- 239000012495 reaction gas Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000009827 uniform distribution Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000000927 vapour-phase epitaxy Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The embodiment of the invention discloses a lamp holder and an auxiliary disassembling tool for an epitaxial reaction furnace; the lamp holder comprises a left lamp holder and a right lamp holder; wherein the lower parts of the left lamp holder and the right lamp holder are connected together through a hinge; a clamping groove is formed above the left lamp holder, and a clamping hook matched with the clamping groove is arranged above the right lamp holder, so that the right lamp holder and the left lamp holder are combined together when the clamping hook is inserted into the clamping groove; and when the clamping hook is pulled out of the clamping groove, the right lamp holder and the left lamp holder are separated.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductor manufacturing, in particular to a lamp holder and an auxiliary disassembling tool for an epitaxial reaction furnace.
Background
The vapor Phase Epitaxy (vapor Phase Epitaxy) is a common epitaxial growth technology, can realize that the epitaxial layers with different conductivity types, resistivity and structures and controllable thickness and resistivity can be grown on the polished wafer substrate, can meet various different requirements, can greatly improve the flexibility and performance of device design, and has wide application prospects in the field of various semiconductor functional devices. Specifically, the epitaxial production process generally uses a chemical vapor deposition method to inject a silicon source gas in a high-temperature sealed epitaxial reaction chamber onto the surface of a polished wafer, and a layer of epitaxial layer is deposited and grown on the upper surface of the polished wafer, so that the manufactured wafer is called an epitaxial wafer. Compared with a polished wafer, the epitaxial wafer has the advantages of less surface defects, capability of controlling the thickness and the resistivity of the epitaxial layer and the like.
With the rapid development of the semiconductor industry technology, the requirements on the flatness and thickness uniformity of the epitaxial wafer are higher and higher, and a uniform temperature field and accurate temperature control are the most important factors for ensuring the flatness of the epitaxial wafer and controlling slip dislocation. The lamp modules are used as heating devices of the epitaxial reaction chamber, and whether the lamp modules are uniformly arranged is the most critical factor influencing the uniform distribution of the temperature field.
However, the conventional lamp holder structural design cannot restore to the original ideal position after each disassembly and assembly, so that the halogen lamps cannot be uniformly distributed, and the uniformity of a temperature field is influenced. On the other hand, in the process of Preventive Maintenance (PM) of the existing lamp module, the lamp module is small in dismounting and mounting operation space due to the fact that the number of halogen lamps contained in the lamp module is large, and time and labor are wasted when the lamp module is dismounted and mounted due to the fact that an operator is difficult to bear force during dismounting and mounting. The problems that the halogen lamp is easy to collide and damage, the lamp holder connecting wire is broken, or the reflector is scratched and the like are caused due to the fact that an operator is difficult to bear force during disassembly and assembly, so that the replacement cost of extra parts is increased, and the PM operation time is prolonged. Secondly, because the lamp stand has been dismantled to the current dismouting in-process, the position has taken place the skew and then still need carry out position calibration to it after installing the lamp stand again, and calibration needs to consume a large amount of time each time to influence equipment utilization rate.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to a lamp socket and an auxiliary tool for mounting and dismounting an epitaxial reactor; the problem of the offset of the installation position of the halogen lamp can be effectively solved, the halogen lamp is ensured to be uniformly distributed, and the uniformity of a temperature field of a reaction chamber is improved, so that the uniformity and the flatness quality of the thickness of the epitaxial wafer are improved. Meanwhile, the PM time is shortened, and the equipment utilization rate is improved.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a lamp socket for an epitaxial reactor, where the lamp socket includes a left lamp socket and a right lamp socket; wherein the content of the first and second substances,
the lower parts of the left lamp holder and the right lamp holder are connected together through a hinge;
a clamping groove is formed above the left lamp holder, and a clamping hook matched with the clamping groove is arranged above the right lamp holder, so that the right lamp holder and the left lamp holder are combined together when the clamping hook is inserted into the clamping groove; and when the clamping hook is pulled out of the clamping groove, the right lamp holder and the left lamp holder are separated.
In a second aspect, an embodiment of the present invention provides an auxiliary disassembling tool, where the auxiliary disassembling tool is used to assist in disassembling a lamp socket for an epitaxial reactor according to the first aspect, and the auxiliary disassembling tool includes:
the first forceps handle and the second forceps handle are hinged through a pin shaft;
the two tong heads can be clamped and separated from each other and are respectively arranged at the front ends of the first tong handle and the second tong handle through a steering shaft;
and the handles are arranged at the tail ends of the first forceps handle and the second forceps handle.
The embodiment of the invention provides a lamp holder and an auxiliary disassembling tool for an epitaxial reaction furnace; the left lamp holder and the right lamp holder are connected together by the hinge, the clamping hook is inserted into the clamping groove after the halogen lamp is installed, so that the left lamp holder and the right lamp holder are combined, and the clamping hook is only required to be lifted upwards to separate the left lamp holder from the right lamp holder when the halogen lamp is disassembled. The lamp holder does not need to be additionally removed in the PM process, so that the offset phenomenon caused by disassembly and assembly of the lamp holder is avoided, and the uniform distribution of the halogen lamps is ensured, thereby ensuring the uniformity of the temperature field of the process chamber of the epitaxial reaction furnace, and further improving the thickness uniformity and the flatness level of the epitaxial wafer. Meanwhile, the calibration step in the original PM flow can be removed, and the PM time is greatly shortened.
Drawings
Fig. 1 is a schematic structural diagram of a conventional epitaxial growth apparatus according to an embodiment of the present invention;
fig. 2 is a schematic view illustrating a disassembling process of a lamp module according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating a halogen lamp being detached from a lamp socket according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a calibration tool after installation of a halogen lamp according to a conventional technique provided by an embodiment of the present invention;
fig. 5 is a schematic view of a lamp socket for an epitaxial reactor according to an embodiment of the present invention, wherein a left lamp socket and a right lamp socket are combined;
fig. 6 is a schematic view of a lamp holder for an epitaxial reactor according to an embodiment of the present invention, wherein a left lamp holder and a right lamp holder are opened;
fig. 7 is a front view of a lamp socket after a halogen lamp is installed according to an embodiment of the present invention;
fig. 8 is a schematic view of an auxiliary tool for disassembly and assembly according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, there is shown a conventional epitaxial growth apparatus 1, the epitaxial growth apparatus 1 specifically including:
a base 10 for carrying a polished wafer W;
a susceptor supporter 20 for supporting the susceptor 10 and epitaxially growing thereonThe base 10 is driven to rotate around the central axis X at a set angular velocity for a long time; wherein the polished wafer W rotates with the susceptor 10 about the central axis X during rotation of the susceptor 10. That is, the polished wafer W is held stationary with respect to the susceptor 10, and thus, a small gap G is required between the radial edge of the susceptor 10 and the adjacent part 10A, typically the adjacent part 10A is a preheating ring for expanding the heat control region beyond the edge of the polished wafer W while preheating the reaction gas that is about to reach the edge of the polished wafer W; the reaction gas includes a silicon source gas and a carrier gas such as H 2 Dopant gases, etc.;
a quartz bell jar 30 including an upper quartz bell jar 30A and a lower quartz bell jar 30B; wherein the upper quartz bell jar 30A and the lower quartz bell jar 30B together enclose a reaction chamber RC in which the susceptor 10 and the susceptor support stand 20 are accommodated; wherein the susceptor 10 partitions the reaction chamber RC into an upper reaction chamber RC1 and a lower reaction chamber RC2, and the polishing wafer W is placed in the upper reaction chamber RC 1. Generally, the gas pressure in the upper reaction chamber RC1 is slightly greater than the gas pressure in the lower reaction chamber RC2 so that the reaction gas in the upper reaction chamber RC1 enters the lower reaction chamber RC2 through the gap G;
a gas inlet 40 for supplying a reaction gas into the upper reaction chamber RC1 so that silicon atoms are generated by reaction of the silicon source gas and H2 and deposited on the polished wafer W to grow an epitaxial layer on the polished wafer W, and the epitaxial layer is doped with a dopant gas to obtain a desired resistivity;
an inlet cap 50, the inlet cap 50 being disposed at the inlet port 40, the reaction gas entering the reaction chamber RC from the inlet cap 50 at one side of the reaction chamber RC during the epitaxial growth;
an exhaust port 60 for exhausting the reaction off-gas inside the reaction chamber RC out of the reaction chamber RC;
a plurality of halogen lamps 70 disposed at the peripheries of the upper and lower quartz bell jars 30A and 30B and for providing a high temperature environment for a chemical vapor epitaxial deposition reaction in the reaction chamber RC through the upper and lower quartz bell jars 30A and 30B;
a mounting part 80 for assembling the respective elements of the epitaxial growth apparatus 1.
It should be noted that, in the conventional epitaxial growth apparatus 1, 76 halogen lamps 70 are provided in the lamp module, and in order to uniformly control the temperature field inside the reaction chamber RC, the whole lamp module is divided into 4 heating zones, including a top lamp module and a bottom lamp module, wherein the top lamp module is further divided into a top outer zone module and a top inner zone module, wherein the top outer zone module is provided with 12 halogen lamps, and the top inner zone module is provided with 20 halogen lamps. Similarly, the bottom lamp module is divided into a bottom outer zone module provided with 32 halogen lamps and a bottom inner zone module provided with 12 halogen lamps.
It should be noted that, the structure of the lamp module is, from outside to inside, in sequence: the device comprises a top cover plate for protecting a halogen lamp set, a pyrometer protection cover, a reflector for uniformly reflecting the heat of a lamp, an air baffle, a cooling disc, a lamp holder protection cover and a lamp holder; wherein the halogen lamps 70 are uniformly arranged in a ring shape. Referring to fig. 2, which shows a lamp module disassembling process, first, an operator needs to remove the top cover plate 21 of the lamp module; then removing the pyrometer protective cover 22; then the stud 23 with the external cylindrical angle is dismantled; the heated protective cover 24 mounted inside the lamp module is then removed; the operator will then remove the peripheral studs 26 around the cooling plate 25; and the air baffle 27 and the cooling plate 25 are removed in sequence; then the reflector 28 can be removed; the worker then removes the socket protection cover 29 to remove the fastening screw 30 of the socket corresponding to each halogen lamp 70, so as to remove the socket, thereby completing the removal of the entire lamp module.
When the fixing screw 30 of the lamp socket is removed, the lamp socket is removed and the halogen lamp 70 is removed from the lamp socket. As shown in fig. 3, which shows a schematic view of the halogen lamp 70 being attached to and detached from the lamp base 3A, as can be seen from fig. 3, the worker can complete the attachment and detachment of the halogen lamp by pulling or inserting the halogen lamp 70 in a direction along a predetermined axis. However, since the lamp module is small in maintenance space after being assembled and the bottom of the lamp socket has a limited area for receiving a force, when the hands of the operating personnel contact the transparent region in the front of the halogen lamp, the transparent region of the halogen lamp 70 is contaminated, and the light transmittance and the thermal field distribution of the halogen lamp 70 are affected. Therefore, the worker is difficult to bear the force when the halogen lamp 70 is detached and installed, and potential risks exist in the PM operation due to the difficulty in bearing the force, so that the halogen lamp is easily collided and damaged, the lamp holder connecting wire is broken, the reflector is scratched, and the like, thereby causing extra part replacement cost and prolonging the PM time of the lamp module.
On the other hand, fig. 4 is a calibration tool 4 after the halogen lamps 70 are installed in the conventional art, and by using the calibration tool 4, the fixing screws 30 of the bottom of the lamp holder 3A corresponding to each halogen lamp 70 are adjusted to ensure uniform distribution among each halogen lamp 70. Because the number of the halogen lamps 70 is large, and the fixing position of the lamp holder 3A can only be finely adjusted by adjusting the fixing screws 30, the calibration time is long, and the position of each halogen lamp 70 cannot be uniformly calibrated due to different levels of operators. While the calibration tool 4 is in direct contact with the transparent area of the halogen lamp, there is a risk of contaminating the light transmission of the halogen lamp.
Based on the above assembling and disassembling process, embodiments of the present invention are expected to provide a lamp socket for an epitaxial reactor, which does not need to be additionally disassembled in the PM process, so as to avoid the offset phenomenon caused by the assembling and disassembling of the lamp socket. Referring to fig. 5 to 7, a lamp holder 3 for an epitaxial reactor according to an embodiment of the present invention is shown, wherein the lamp holder 3 includes a left lamp holder 31 and a right lamp holder 32; wherein the content of the first and second substances,
the lower parts of the left lamp holder 31 and the right lamp holder 32 are connected together through a hinge 33;
a clamping groove 311 is arranged above the left lamp holder 31, and a clamping hook 321 matched with the clamping groove 311 is arranged above the right lamp holder 32, so that when the clamping hook 321 is inserted into the clamping groove 311, the right lamp holder 32 and the left lamp holder 31 are combined together, as shown in fig. 5 specifically; and, as shown in fig. 6, when the hook 321 is pulled out of the card slot 311, the right lamp holder 32 and the left lamp holder 31 are separated.
It can be understood that, for the socket shown in fig. 5, the left socket 31 and the right socket 32 are connected together by a hinge, after the halogen lamp 70 is installed, the hook 321 is inserted into the slot 311 to merge the left socket 31 and the right socket 32 to complete the installation of the halogen lamp 70, and when the halogen lamp 70 is disassembled, the hook 321 is lifted upwards to separate the left socket 31 and the right socket 32, so that the halogen lamp 70 reaching the service life can be disassembled. By adopting the lamp holder 3 shown in fig. 5, the lamp holder does not need to be additionally removed in the PM process, so that the offset phenomenon caused by the disassembly and assembly of the lamp holder is avoided, and the uniform distribution of the halogen lamps is ensured, thereby ensuring the uniformity of the temperature field of the process chamber of the epitaxial reactor and further improving the thickness uniformity and the flatness level of the epitaxial wafer. Meanwhile, the calibration step in the original PM flow can be removed, the PM time is greatly shortened, particularly, the PM time is shortened to 2 hours from about the existing 8 hours, and the equipment utilization rate is greatly improved.
It should be noted that, in the embodiment of the present invention, as shown in fig. 6, one end of the hook 321 is fixedly disposed on the right lamp holder 32, and the hook 321 can swing around the fixed end.
It will be appreciated that in the practice of an embodiment of the invention, a front view of the socket 3 is shown after the halogen lamp 70 is installed, as shown in fig. 7. As can be seen from fig. 7, the left lamp holder 31 can be fixedly mounted on the device by means of the latch 71, and the mounting or dismounting process of the halogen lamp 70 is realized only by opening or closing the right lamp holder 32.
In addition, due to the space limitation in the lamp module, in the embodiment of the present invention, as shown in fig. 7 and 8, a limiting plate 34 is further included in the lamp socket 3, and the limiting plate 34 extends from below the left lamp socket 31 to below the right lamp socket 32, so as to limit the swinging position of the right lamp socket 32 during the separation of the left lamp socket 31 and the right lamp socket 32. It should be noted that the size of the limiting plate 34 is determined according to the swing angle of the right lamp holder 32, and the embodiment of the invention is not limited in particular.
On the other hand, in order to facilitate the disassembly and assembly of the lamp holder 3, as shown in fig. 8, an embodiment of the present invention further provides an auxiliary disassembly and assembly tool 8, where the auxiliary disassembly and assembly tool is used to assist in disassembling and assembling the lamp holder 3 for an epitaxial reactor according to the foregoing technical solution, and the auxiliary disassembly and assembly tool 8 includes:
a first forceps handle 82 and a second forceps handle 83 hinged through a pin 81;
two binding clip 84 that can be clamped and separated from each other, the two binding clip 84 is respectively arranged at the front ends of the first forceps handle 82 and the second forceps handle 83 through a steering shaft 85;
and a handle 86 disposed at the distal ends of the first and second handles 82, 83.
In the embodiment of the present invention, the two pincer heads 84 are movably provided at the front ends of the first and second pincer handles 82 and 83 via the steering shaft 85, and as can be seen from fig. 8, the steering shaft 85 is provided at the middle portion of the pincer heads 84 so that the direction of the force applied when the lamp holder 3 is clamped is always kept the same as the direction of the halogen lamp 70. Moreover, in the embodiment of the invention, only the clamp head 84 can be replaced after being damaged, so that the maintenance cost of the tool is reduced.
It should be understood that, in order to facilitate the application of force during the process of assembling and disassembling the lamp holder 3, in the embodiment of the present invention, as shown in fig. 8, the first forceps handle 82 and the second forceps handle 83 respectively include a front forceps handle 82A and a rear forceps handle 82B, and the length ratio of the front forceps handle 82A to the rear forceps handle 82B is 1:3 to 1:5.
in addition, in order to match the size of the pincer 84 with the size of the lamp holder 3, the pincer 84 is configured to be a square flat plate with a size of 2-6 cm, and the specific size can be determined according to the actual size of the lamp holder 3.
In some possible embodiments, the first handle 82, the second handle 83 and the two handles 84 are made of SUS304. Meanwhile, in order to prevent the lamp socket 3 from being worn during the process of assembling and disassembling, in the embodiment of the present invention, the surfaces of the two pincer heads 84 are provided with a wrapping layer made of Polyvinyl Chloride (PVC) or polyester fiber, and the wrapping layer is in contact with the lamp socket 3 during the process of assisting in assembling and disassembling the lamp socket.
In order to facilitate the operator to hold the auxiliary dismounting tool 8, the handle 86 is thickened in the specific implementation process, and in some possible implementations, the handle is made of silica gel or polyester fiber.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A lamp holder for an epitaxial reactor, the lamp holder comprising a left lamp holder and a right lamp holder; wherein the content of the first and second substances,
the lower parts of the left lamp holder and the right lamp holder are connected together through a hinge;
a clamping groove is formed above the left lamp holder, and a clamping hook matched with the clamping groove is arranged above the right lamp holder, so that the right lamp holder and the left lamp holder are combined together when the clamping hook is inserted into the clamping groove; and when the clamping hook is pulled out of the clamping groove, the right lamp holder and the left lamp holder are separated.
2. The lamp socket of claim 1, wherein one end of the hook is fixedly disposed on the right socket, and the hook is capable of swinging around the fixed end.
3. The lamp holder of claim 1, further comprising a limiting plate extending from below the left lamp holder to below the right lamp holder for limiting a swing position of the right lamp holder during separation of the left and right lamp holders.
4. An auxiliary disassembling tool for assisting in disassembling a lamp socket for an epitaxial reactor according to any one of claims 1 to 3, the auxiliary disassembling tool comprising:
the first clamp handle and the second clamp handle are hinged through a pin shaft;
the two tong heads can be clamped and separated from each other and are respectively arranged at the front ends of the first tong handle and the second tong handle through a steering shaft;
and the handles are arranged at the tail ends of the first forceps handle and the second forceps handle.
5. The auxiliary assembly and disassembly tool of claim 4, wherein the first and second plier handles each comprise a front plier handle and a rear plier handle, respectively, and the length ratio of the front plier handle to the rear plier handle is 1:3 to 1:5.
6. the auxiliary tool for removing and installing the tool according to claim 4, wherein the shape of the binding clip is a square flat plate shape, and the size of the binding clip is 2-6 cm.
7. The auxiliary tool according to claim 4, wherein the first handle, the second handle and the two jaws are made of SUS304.
8. The auxiliary tool for disassembling and assembling of claim 4, wherein said two binding clip surfaces are provided with wrapping layers made of PVC or polyester fiber, and said wrapping layers are in contact with said lamp holder during the auxiliary process of disassembling and assembling said lamp holder.
9. The auxiliary tool as claimed in claim 4, wherein the handle is made of silicone or polyester.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210967257.9A CN115198353A (en) | 2022-08-12 | 2022-08-12 | Lamp holder and auxiliary dismounting tool for epitaxial reaction furnace |
| TW111140804A TWI846111B (en) | 2022-08-12 | 2022-10-27 | A lamp holder and auxiliary disassembly tool for epitaxial reactor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210967257.9A CN115198353A (en) | 2022-08-12 | 2022-08-12 | Lamp holder and auxiliary dismounting tool for epitaxial reaction furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115198353A true CN115198353A (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210967257.9A Pending CN115198353A (en) | 2022-08-12 | 2022-08-12 | Lamp holder and auxiliary dismounting tool for epitaxial reaction furnace |
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| CN (1) | CN115198353A (en) |
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| CN205388296U (en) * | 2016-01-20 | 2016-07-20 | 中山长星光电科技有限公司 | New -type lamp stand |
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| CN207104781U (en) * | 2017-03-31 | 2018-03-16 | 李峰 | A kind of extracting tool for being adapted to outdoor anti-theft strip light |
| CN108343932A (en) * | 2018-02-07 | 2018-07-31 | 佛山市富利来灯饰有限公司 | A kind of lamp holder slotting soon |
| CN209175007U (en) * | 2018-10-04 | 2019-07-30 | 南京正鑫照明科技有限公司 | Wire nipper is used in a kind of gardening light wiring installation |
| CN210860810U (en) * | 2019-12-10 | 2020-06-26 | 深圳市锐拓节能有限公司 | Lamp holder for fixing wall washing lamp |
| CN112342615A (en) * | 2020-10-27 | 2021-02-09 | 北京北方华创微电子装备有限公司 | Heat dissipation device for heating pipe in reaction cavity and reaction cavity |
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| CN214369508U (en) * | 2021-03-09 | 2021-10-08 | 徐广通 | Reinforcing device for table lamp |
| CN214560134U (en) * | 2021-03-30 | 2021-11-02 | 湖南郴岭电力工程有限公司 | Auxiliary maintenance clamping device for power equipment |
| CN114248227A (en) * | 2020-09-23 | 2022-03-29 | 张家港清研再制造产业研究院有限公司 | Auxiliary clamp for disassembling lithium battery |
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| CN104665892A (en) * | 2015-01-06 | 2015-06-03 | 王才丰 | Multipurpose universal medical forceps |
| CN205388296U (en) * | 2016-01-20 | 2016-07-20 | 中山长星光电科技有限公司 | New -type lamp stand |
| CN205746120U (en) * | 2016-07-06 | 2016-11-30 | 李恭新 | A kind of LED daylight lamp |
| CN207104781U (en) * | 2017-03-31 | 2018-03-16 | 李峰 | A kind of extracting tool for being adapted to outdoor anti-theft strip light |
| CN108343932A (en) * | 2018-02-07 | 2018-07-31 | 佛山市富利来灯饰有限公司 | A kind of lamp holder slotting soon |
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| CN210860810U (en) * | 2019-12-10 | 2020-06-26 | 深圳市锐拓节能有限公司 | Lamp holder for fixing wall washing lamp |
| CN114248227A (en) * | 2020-09-23 | 2022-03-29 | 张家港清研再制造产业研究院有限公司 | Auxiliary clamp for disassembling lithium battery |
| CN112342615A (en) * | 2020-10-27 | 2021-02-09 | 北京北方华创微电子装备有限公司 | Heat dissipation device for heating pipe in reaction cavity and reaction cavity |
| CN214369508U (en) * | 2021-03-09 | 2021-10-08 | 徐广通 | Reinforcing device for table lamp |
| CN214560134U (en) * | 2021-03-30 | 2021-11-02 | 湖南郴岭电力工程有限公司 | Auxiliary maintenance clamping device for power equipment |
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|---|---|
| TW202311583A (en) | 2023-03-16 |
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Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |