CN115195269A - Film pasting process for pen power front cover plate - Google Patents
Film pasting process for pen power front cover plate Download PDFInfo
- Publication number
- CN115195269A CN115195269A CN202210618613.6A CN202210618613A CN115195269A CN 115195269 A CN115195269 A CN 115195269A CN 202210618613 A CN202210618613 A CN 202210618613A CN 115195269 A CN115195269 A CN 115195269A
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- layer
- board
- ink
- bottom cover
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
Abstract
The invention provides a film pasting process for a pen power front cover plate, which comprises the following steps: 1) Continuously screen-printing 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printer, and screen-printing a layer of black ink bottom cover on the white ink bottom covers; 2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form an ink bottom cover for later use; 3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid to form a primer coating liquid layer after transferring; 4) One end of the front PC board is attached to one end with the bottom coating liquid layer by a binder for a three-station transfer printing machine; 5) Transferring AG textures after attaching, and silk-screen printing positioning lines after forming the AG textures; 6) Selecting a rear PC board with a set specification, coating a layer of optical cement layer on one side of the rear PC board, and coating a layer of rear ink layer on the optical cement layer; the other side of the rear PC board is then bonded to the composite board. The problem of heterochrosis can be effectively solved by the white pigment for three times, the problem of adhesion of glue and printing ink can be solved by the adhesive, and the problem of peeling can be solved by adopting the white printing ink for multiple silk-screen printing.
Description
Technical Field
The invention relates to the technical field of film pasting of a pen-electricity front cover plate, in particular to a film pasting process of the pen-electricity front cover plate.
Background
The current front cover plate of a small notebook (pen) is generally coated with a layer of protective ink on a substrate, and then vacuum film pasting is carried out on the protective ink and curing is carried out. When the film is pasted in vacuum, the ink is directly printed on the cover plate, so that peeling is easy to occur, and the film is not pasted in vacuum.
Disclosure of Invention
The invention aims to provide a film pasting process for a pen power front cover plate, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the film pasting process of the pen power front cover plate comprises the following steps:
1) Continuously screen-printing 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printer, and screen-printing a layer of black ink bottom cover on the white ink bottom covers;
2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form the ink bottom cover for later use;
3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid to form a primer coating liquid layer after transferring;
4) Attaching one end of the front PC board and one end with the bottom coating liquid layer by using a binder for a three-station transfer machine;
5) Transferring AG textures after attaching, and silk-screen printing positioning lines after forming the AG textures;
6) Selecting a rear PC board with a set specification, coating a layer of optical cement layer on one side of the rear PC board, and coating a layer of rear ink layer on the optical cement layer; the other side of the rear PC board is then bonded to the composite board.
Further, the PC board is 0.04mm in specification.
Further, the thickness of the white ink bottom cover and the black ink bottom cover is 5-8 μm.
Further, the thickness of the primer layer is 6-10 μm.
Furthermore, the front PC board is bonded with one end with the bottom coating liquid layer by texture glue; the thickness of the texture glue is 3-7 mu m.
Further, the thickness of the AG texture is 10-20 μm.
Further, the thickness of the photoresist layer is 8-12 μm.
Further, the thickness of the rear ink layer is 4-8 μm.
Further, in step 3), the step of transferring the light panel with the composite sheet is as follows:
(1) selecting a texture mould, fixing the texture mould, and coating a layer of transfer printing glue in the mould; after finishing coating, putting the light panel in transfer glue and rolling the light panel under a roll shaft;
(2) and after rolling, placing the roller under ultraviolet rays, curing the roller by using UV glue under the irradiation of the ultraviolet rays to copy the texture structure, and then taking the roller out of the mold.
Compared with the prior art, the invention has the beneficial effects that:
in the application, 0.04mm PC screen printing 3 white +1 black + adhesive is adopted, namely 3 layers of white ink bottom covers are continuously screen printed by an ink printing machine, one layer of black ink bottom cover is further screen printed on the white ink bottom cover, the black ink bottom cover cannot be kept by the white cover for one or two times, the problem of different colors can be effectively solved by white for three times, the adhesive can solve the problem of adhesion of glue and ink, and the problem of peeling can be solved by adopting the white ink for multiple screen printing,
the light transfer plate aims to solve the problem of high-temperature bubbles, the coated base coating liquid cannot be completely dried (in a semi-dry state) on a product, and the base coating liquid aims to solve the problem that acrylic cannot be adhered to AG behind the product.
Laminating glue can not glue with the UV laminating, because the UV laminating is glued and is resisted firmly ageing, also can not choose for use OCA glue, because OCA glues the hardness not enough, so chooses for use the texture to glue and laminates.
Drawings
Fig. 1 is a flow chart of a film-pasting process of the pen electric front cover plate of the invention.
Detailed Description
The present invention is described in detail below with reference to examples.
Example 1: as shown in fig. 1, the film pasting process of the pen electric front cover plate comprises the following steps:
1) Continuously screen-printing 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printer, and screen-printing a layer of black ink bottom cover on the white ink bottom cover, wherein the thickness of the white ink bottom cover and the black ink bottom cover is 5 mu m;
2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form the ink bottom cover for later use; the thickness of the bottom coating liquid layer is 6 mu m;
(1) selecting a texture mould, fixing the texture mould, and coating a layer of transfer printing glue in the mould; after finishing coating, putting the light panel in transfer glue and rolling the light panel under a roll shaft;
(2) and after rolling, placing the roller under ultraviolet rays, curing the roller by using UV glue under the irradiation of the ultraviolet rays to copy the texture structure, and then taking the roller out of the mold.
3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid to form a primer coating liquid layer after transferring;
4) Attaching one end of the front PC board and one end with the bottom coating liquid layer by using a binder for a three-station transfer machine; the front PC board is bonded with one end with the bottom coating liquid layer by texture glue; the thickness of the texture glue is 3 mu m;
5) Transferring AG textures after attaching, and silk-screen printing positioning lines after forming the AG textures; the thickness of the AG texture is 10 μm;
6) Selecting a rear PC board with a set specification, coating a layer of optical cement layer on one side of the rear PC board, and coating a layer of rear ink layer on the optical cement layer; the other side of the rear PC board is then bonded to the composite board. The thickness of the photoresist layer is 8 mu m; the thickness of the rear ink layer was 4 μm.
The color difference and the peeling problem are avoided through high-temperature test.
Example 2: as shown in fig. 1, the film pasting process of the pen electric front cover plate comprises the following steps:
1) Continuously screen-printing 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printer, and screen-printing a layer of black ink bottom cover on the white ink bottom cover, wherein the thickness of the white ink bottom cover and the black ink bottom cover is 6 mu m;
2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form the ink bottom cover for later use; the thickness of the base coat liquid layer is 7 mu m;
(1) selecting a texture mould, fixing the texture mould, and coating a layer of transfer glue in the mould; after finishing coating, putting the light panel in transfer glue and rolling the light panel under a roll shaft;
(2) and after rolling, placing the roller under ultraviolet rays, curing the roller by using UV glue under the irradiation of the ultraviolet rays to copy the texture structure, and then taking the roller out of the mold.
3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid after transferring to form a primer coating liquid layer;
4) Attaching one end of the front PC board and one end with the bottom coating liquid layer by using a binder for a three-station transfer machine; the front PC board is bonded with one end with the bottom coating liquid layer by a texture adhesive; the thickness of the texture glue is 4 mu m;
5) Transferring AG textures after attaching, and silk-screen printing positioning lines after forming the AG textures; the thickness of the AG texture is 12 μm;
6) Selecting a rear PC board with a set specification, coating a photoresist layer on one side of the rear PC board, and coating a rear ink layer on the photoresist layer; the other side of the rear PC board is then bonded to the composite board. The thickness of the photoresist layer is 9 μm; the thickness of the rear ink layer was 5 μm.
The color difference and the peeling problem are avoided through high-temperature test.
Example 3: as shown in fig. 1, the film pasting process of the pen power front cover plate comprises the following steps:
1) Continuously screen-printing 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printer, and screen-printing a layer of black ink bottom cover on the white ink bottom cover, wherein the thickness of the white ink bottom cover and the black ink bottom cover is 7 mu m;
2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form an ink bottom cover for later use; the thickness of the bottom coating liquid layer is 8 mu m;
(1) selecting a texture mould, fixing the texture mould, and coating a layer of transfer printing glue in the mould; after finishing brushing, putting the light panel in transfer glue and rolling the light panel under a roll shaft;
(2) and after rolling, placing the roller under ultraviolet rays, curing the roller by using UV glue under the irradiation of the ultraviolet rays to copy the texture structure, and then taking the roller out of the mold.
3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid to form a primer coating liquid layer after transferring;
4) Attaching one end of the front PC board and one end with the bottom coating liquid layer by using a binder for a three-station transfer machine; the front PC board is bonded with one end with the bottom coating liquid layer by a texture adhesive; the thickness of the texture glue is 5 mu m;
5) Transferring AG textures after attaching, and silk-screen printing positioning lines after forming the AG textures; the thickness of the AG texture is 14 μm;
6) Selecting a rear PC board with a set specification, coating a layer of optical cement layer on one side of the rear PC board, and coating a layer of rear ink layer on the optical cement layer; the other side of the rear PC board is then bonded to the composite board. The thickness of the optical adhesive layer is 10 micrometers; the thickness of the back ink layer is 6 μm.
The color difference and the peeling problem are avoided through high-temperature test.
Example 4: as shown in fig. 1, the film pasting process of the pen electric front cover plate comprises the following steps:
1) Continuously silk-screening 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printing machine, and silk-screening a layer of black ink bottom cover on the white ink bottom cover, wherein the thicknesses of the white ink bottom cover and the black ink bottom cover are 7 mu m;
2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form an ink bottom cover for later use; the thickness of the bottom coating liquid layer is 9 mu m;
(1) selecting a texture mould, fixing the texture mould, and coating a layer of transfer glue in the mould; after finishing coating, putting the light panel in transfer glue and rolling the light panel under a roll shaft;
(2) after rolling, the texture structure is replicated by curing the rolled material under ultraviolet rays with UV glue under the irradiation of the ultraviolet rays, and then the rolled material is taken out of the mold.
3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid to form a primer coating liquid layer after transferring;
4) Attaching one end of the front PC board and one end with the bottom coating liquid layer by using a binder for a three-station transfer machine; the front PC board is bonded with one end with the bottom coating liquid layer by a texture adhesive; the thickness of the texture glue is 6 mu m;
5) Transferring AG textures after the lamination, and forming a post-silk-screen positioning line by using the AG textures; the thickness of the AG texture is 16 μm;
6) Selecting a rear PC board with a set specification, coating a photoresist layer on one side of the rear PC board, and coating a rear ink layer on the photoresist layer; the other side of the rear PC board is then bonded to the composite board. The thickness of the optical adhesive layer is 11 μm; the thickness of the back ink layer was 7 μm.
The color difference and the peeling are avoided through high temperature test.
Example 5: as shown in fig. 1, the film pasting process of the pen electric front cover plate comprises the following steps:
1) Continuously screen-printing 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printer, and screen-printing a layer of black ink bottom cover on the white ink bottom cover, wherein the thickness of the white ink bottom cover and the black ink bottom cover is 8 mu m;
2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form an ink bottom cover for later use; the thickness of the base coat liquid layer is 10 mu m;
(1) selecting a texture mould, fixing the texture mould, and coating a layer of transfer glue in the mould; after finishing coating, putting the light panel in transfer glue and rolling the light panel under a roll shaft;
(2) after rolling, the texture structure is replicated by curing the rolled material under ultraviolet rays with UV glue under the irradiation of the ultraviolet rays, and then the rolled material is taken out of the mold.
3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid to form a primer coating liquid layer after transferring;
4) One end of the front PC board is attached to one end with the bottom coating liquid layer by a binder for a three-station transfer printing machine; the front PC board is bonded with one end with the bottom coating liquid layer by a texture adhesive; the thickness of the texture glue is 7 mu m;
5) Transferring AG textures after attaching, and silk-screen printing positioning lines after forming the AG textures; the thickness of the AG texture is 20 μm;
6) Selecting a rear PC board with a set specification, coating a layer of optical cement layer on one side of the rear PC board, and coating a layer of rear ink layer on the optical cement layer; the other side of the rear PC board is then bonded to the composite board. The thickness of the photoresist layer is 12 μm; the thickness of the rear ink layer was 8 μm.
The color difference and the peeling are avoided through high temperature test.
The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.
Claims (9)
1. The film pasting process of the pen power front cover plate is characterized by comprising the following steps:
1) Continuously silk-screening 3 layers of white ink bottom covers on a front PC board with a set specification by using an ink printing machine, and silk-screening a layer of black ink bottom cover on the white ink bottom cover;
2) Spraying or rolling a layer of adhesive on the upper part of the black ink bottom cover to form the ink bottom cover for later use;
3) Transferring a light plate by using a composite plate, and spraying a primer coating liquid to form a primer coating liquid layer after transferring;
4) Attaching one end of the front PC board and one end with the bottom coating liquid layer by using a binder for a three-station transfer machine;
5) Transferring AG textures after attaching, and silk-screen printing positioning lines after forming the AG textures;
6) Selecting a rear PC board with a set specification, coating a photoresist layer on one side of the rear PC board, and coating a rear ink layer on the photoresist layer; the other side of the rear PC board is then bonded to the composite board.
2. The process of claim 1, wherein the PC board is 0.04mm in size.
3. The process of claim 1, wherein the thickness of the white ink bottom cover and the black ink bottom cover is 5-8 μm.
4. The film pasting process for the pen power front cover plate as claimed in claim 1, wherein the thickness of the primer liquid layer is 6-10 μm.
5. The film pasting process for the pen power front cover plate according to claim 1, wherein the front PC plate is bonded with one end provided with the primer layer by using a texture glue; the thickness of the texture glue is 3-7 μm.
6. The process of claim 1, wherein the AG texture has a thickness of 10-20 μm.
7. The film pasting process for an electric front cover plate according to claim 1, wherein the thickness of the photoresist layer is 8-12 μm.
8. The process of claim 1, wherein the thickness of the back ink layer is 4-8 μm.
9. The film pasting process for the pen-type front cover plate according to claim 1, wherein in the step 3), the step of transferring the light plate by the composite plate is as follows:
(1) selecting a texture mould, fixing the texture mould, and coating a layer of transfer printing glue in the mould; after finishing coating, putting the light panel in transfer glue and rolling the light panel under a roll shaft;
(2) and after rolling, placing the roller under ultraviolet rays, curing the roller by using UV glue under the irradiation of the ultraviolet rays to copy the texture structure, and then taking the roller out of the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210618613.6A CN115195269A (en) | 2022-06-01 | 2022-06-01 | Film pasting process for pen power front cover plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210618613.6A CN115195269A (en) | 2022-06-01 | 2022-06-01 | Film pasting process for pen power front cover plate |
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| CN115195269A true CN115195269A (en) | 2022-10-18 |
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