CN115188697A - Automatic storage assembly line of chip - Google Patents

Automatic storage assembly line of chip Download PDF

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Publication number
CN115188697A
CN115188697A CN202210973531.3A CN202210973531A CN115188697A CN 115188697 A CN115188697 A CN 115188697A CN 202210973531 A CN202210973531 A CN 202210973531A CN 115188697 A CN115188697 A CN 115188697A
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China
Prior art keywords
storage
wafers
wafer
cassette
framing
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CN202210973531.3A
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Chinese (zh)
Inventor
王晓明
赵晓明
董国庆
文国昇
金从龙
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Jiangxi Zhao Chi Semiconductor Co Ltd
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Jiangxi Zhao Chi Semiconductor Co Ltd
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Priority to CN202210973531.3A priority Critical patent/CN115188697A/en
Publication of CN115188697A publication Critical patent/CN115188697A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses an automatic chip storage assembly line, which comprises a feeding system, a transmission system, a storage system and a master control system, wherein the feeding system is used for feeding chips to the storage system; the feeding system comprises a feeding machine, a feeding mechanical arm and a first information reader, wherein the feeding mechanical arm is used for transferring a wafer placed in the feeding machine onto the transmission system, and the first information reader is used for reading identity information of the wafer on the feeding mechanical arm; the transmission system comprises a transmitter and a wafer station arranged on the transmitter; the storage system comprises a storage manipulator and a plurality of storage devices, wherein each storage device is used for storing the same type of wafers; the master control system is used for receiving the identity information of the wafers and controlling the storage manipulator to transfer the wafers on the conveyor to the corresponding storage device or transfer the wafers in the storage device to the conveyor according to the identity information of the wafers. The invention can effectively improve the efficiency of extracting the wafer through the cooperation of all the systems.

Description

Automatic storage assembly line of chip
Technical Field
The invention relates to the technical field of chip storage, in particular to an automatic chip storage assembly line.
Background
The LED chip is a solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, and the other end of the wafer is connected with an anode of a power supply, so that the whole wafer is packaged by epoxy resin.
In the process of producing the LED chips, the LED wafers need to be stored and extracted, and the like, and the operation is usually completed by an automatic system in the prior art, but before the LED wafers are placed on a storage rack, the LED wafers need to be manually placed on a transmission device in a wafer system one by one, and the LED wafers are clamped and placed on a storage station through automatic equipment in the system; when the wafer needs to be extracted, the identity information corresponding to the wafer is input, and then the extraction can be carried out.
The existing storage and extraction modes of the wafers are single, the wafers cannot be classified before storage, and the wafers cannot be extracted in a short time due to the fact that the number of the stored wafers is large in the later-stage wafer extraction process.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a chip automatic storage production line, aiming at solving the problem that the wafer cannot be extracted in a short time because the wafer cannot be classified and stored in the prior art.
In order to achieve the purpose, the invention is realized by the following technical scheme: a chip automatic storage assembly line comprises a feeding system, a transmission system, a storage system and a master control system;
the feeding system comprises a feeding machine, a feeding mechanical arm and a first information reader, wherein the feeding mechanical arm is used for transferring a wafer placed in the feeding machine onto the transmission system, and the first information reader is used for reading identity information of the wafer on the feeding mechanical arm;
the conveying system comprises a conveyor and a wafer station arranged on the conveyor, the feeding manipulator is used for transferring the wafer placed in the feeding machine to the wafer station, and the conveyor is used for conveying the wafer after the identity information is read;
the storage system comprises a storage manipulator and a plurality of storage devices, each storage device is used for storing the same type of wafers, and the storage manipulator is used for transferring the wafers on the wafer station to the storage device of the type of wafers or transferring the wafers in the storage device to the conveyor;
the master control system is used for receiving identity information of wafers and controlling the storage manipulator to transfer the wafers on the conveyor to the corresponding storage device or transfer the wafers in the storage device to the conveyor according to the identity information of the wafers.
According to one aspect of the technical scheme, the feeding machine comprises a feeding frame and a cassette for storing wafers;
go up the work or material rest and include material loading cassette position and empty cassette and retrieve the position, material loading cassette position is used for the storage to have the card casket of wafer, empty cassette is retrieved the position and is used for the storage the card casket, wherein, material loading manipulator locates material loading cassette position with between the empty cassette is retrieved the position, and be used for with the card casket is in material loading cassette position with the circulation is placed between the empty cassette is retrieved the position.
According to one aspect of the above technical solution, a plurality of placing grooves are arranged on two corresponding side walls of the cartridge at intervals, the placing grooves are arranged along the radial direction of the cartridge, wherein the placing groove on one side is arranged opposite to the placing groove on the other side.
According to one aspect of the technical scheme, the conveyor comprises a conveyor belt with the wafer station and a transfer cassette for storing the wafers after identity information is read;
the transportation cassette is arranged on the wafer station, a cassette storage groove arranged from top to bottom is formed in the transportation cassette, and the cassette storage groove is used for storing wafers.
According to one aspect of the technical scheme, the material storage device comprises a frame, wherein each inner wall of the frame is provided with a plurality of rows of material storage tank groups, and each material storage tank group comprises a plurality of material storage tanks distributed along the radial direction of the frame;
at least one side of the frame is provided with an opening area for the storage manipulator to move, and the storage manipulator is arranged in the frame.
According to an aspect of the above technical scheme, the storage assembly line further comprises a blanking system, the blanking system comprises a blanking manipulator and a blanking machine, and the blanking manipulator is used for transferring the wafers transferred from the storage device to the blanking machine.
According to one aspect of the technical scheme, the blanking machine comprises a cylinder body used for storing wafers;
the side wall of the barrel is provided with a material taking notch, and the material taking notch is used for assisting in placing a wafer in the barrel to take materials.
According to one aspect of the above technical solution, the storage pipeline further comprises a framing system;
the framing system comprises a first framing manipulator, a second framing manipulator, a framing support for storing a connecting piece and a second information reader for reading wafer information;
the first framing manipulator is used for transferring the wafers transferred from the storage system, and the second framing manipulator is used for connecting the connecting piece stored on the framing support with the wafers being transferred and reading the identity information of the wafers connected with the connecting piece through the second information reader, so that the second framing manipulator transfers the wafers connected with the connecting piece to the framing support.
According to one aspect of the above technical solution, the framing system includes a plurality of framing brackets for storing a plurality of connecting members;
wherein each of the plurality of framing supports is configured to store a same kind of wafer connected to the connector.
According to one aspect of the technical scheme, the framing system further comprises a transfer table, the transfer table is arranged between the first framing manipulator and the second framing manipulator, and the transfer table is used for assisting the connection of the connecting piece and the wafer.
Compared with the prior art, the chip automatic storage assembly line has the advantages that:
through setting up the feeding system, the transmission system, storage system and total control system, realize when saving the wafer, can save according to the identity information of wafer, among the background art, because of the storage quantity of wafer is more when drawing the wafer, lead to the problem that can't draw the wafer in the short time, specifically speaking, this feeding system includes the material loading, material loading manipulator and first information reading ware, material loading manipulator is used for shifting the wafer of placing in the material loading machine to the transmission system, first information reading ware is used for reading the identity information of the wafer that is located on material loading manipulator, transmission through transmission system afterwards, shift the wafer to storage system department, through the storage manipulator in the storage system with the wafer station on to the same kind of storage device, wherein, this storage device has a plurality ofly, and every storage device in a plurality of storage devices is used for storing the same kind of wafer.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of an overall structure of a chip automated storage pipeline according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a loading system according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a cassette and a placement slot according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a transmission system according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a memory system according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a blanking system according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a framing system in an embodiment of the present invention.
Description of reference numerals:
100. a wafer; 10. a feeding system; 11. a feeding machine; 111. a cassette; 112. a feeding frame; 1121. a feeding cassette position; 1122. an empty cassette recovery station; 1123. a placement groove; 12. a feeding manipulator; 13. a first information reader; 20. a transmission system; 21. a conveyor; 211. a conveyor belt; 212. transferring the cassette; 213. a cartridge storage slot; 22. a wafer station; 30. a storage system; 31. a storage manipulator; 32. a material storage device; 321. a frame; 322. a material storage tank; 323. an open area; 40. a blanking system; 41. a feeding manipulator; 42. a blanking machine; 421. a barrel; 422. a material taking notch; 50. framing system; 51. a first framing manipulator; 52. a second framing manipulator; 53. a second information reader; 54. framing a bracket; 55. and (4) a transfer platform.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings, in order to make the objects, features and advantages of the invention more comprehensible. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "up," "down," and the like are used for descriptive purposes only and not for purposes of indicating or implying that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
Referring to fig. 1-7, a first embodiment of the present invention provides a chip automated storage pipeline, which includes a loading system 10, a transmission system 20, a storage system 30, and a general control system.
In the present embodiment, the loading system 10 includes a loading robot 11, a loading robot 12, and a first information reader 13, wherein the loading robot 12 is used for transferring the wafer 100 placed in the loading robot 11 to the transport system 20, and the first information reader 13 is used for reading the identity information of the wafer 100 located on the loading robot 12;
specifically, the loader 11 includes a loader frame 112 and a cassette 111 for storing the wafers 100; the loading rack 112 includes a loading cassette position 1121 and an empty cassette recovery position 1122, the loading cassette position 1121 is used for storing the cassettes 111 with the wafers 100, and the empty cassette recovery position 1122 is used for storing the cassettes 111, wherein the loading manipulator 12 is disposed between the loading cassette position 1121 and the empty cassette recovery position 1122, and is used for circularly placing the cassettes 111 between the loading cassette position 1121 and the empty cassette recovery position 1122.
In the embodiment, when the wafer 100 needs to be stored, the cassette 111 is used to provide a placement position for the wafer 100 to be stored, the wafer 100 to be stored in the cassette 111 is clamped by the feeding manipulator 12 to realize a subsequent transportation process, in order to ensure that the trajectory of the feeding manipulator 12 faces the transportation system 20, a track for the feeding manipulator 12 to move may be provided in the feeding system 10, and the trajectory of the track may allow the feeding manipulator 12 to move back and forth between the transportation system 20 and the cassette 111, it should be noted that the first information reader 13 may be a code scanning gun in the prior art.
By way of example and not limitation, by arranging the loading cassette position 1121 and the empty cassette recovery position 1122 of the loading frame 112, that is, by placing one cassette 111 on each of the loading cassette position 1121 and the empty cassette recovery position 1122 of the loading frame 112, in practical cases, the wafers 100 can be placed on both the loading cassette position 1121 and the empty cassette recovery position 1122, so as to increase the storage speed of the loading robot 12 for at least two wafers 100. In addition, the positional relationship between the loading cassette position 1121 and the empty cassette recovery position 1122 depends on whether the wafer 100 is to be stored in the corresponding cassette 111, when the cassette 111 in the loading cassette position 1121 has no wafer 100 to be stored, the loading cassette position 1121 may be the empty cassette recovery position 1122, whereas when the cassette 111 in the empty cassette recovery position 1122 has no wafer 100 to be stored, the empty cassette recovery position 1122 and the loading cassette position 1121 achieve that the wafer 100 can be placed on both the loading cassette position 1121 and the empty cassette recovery position 1122, so as to provide a certain convenience for the loading manipulator 12 to pick up the wafer 100 to be stored, so as to facilitate the empty cassette 111 to place the wafer 100.
Further, a plurality of placing grooves 1123 are disposed on two corresponding side walls of the cassette 111 at intervals, the placing grooves 1123 are arranged along the radial direction of the cassette 111, wherein the placing groove 1123 on one side is disposed opposite to the placing groove 1123 on the other side, it should be noted that the placing grooves 1123 ensure the stability of the wafers 100 stored on the cassette 111, and by the disposition of the plurality of placing grooves 1123, it is realized that one cassette 111 can place a plurality of wafers 100.
By way of example and not limitation, a plurality of cassettes 111 may be provided, and a corresponding number of loading cassette positions 1121 and empty cassette recovery positions 1122 are provided on the loading frame 112, so that the wafers 100 can be stored in batches by increasing the number of cassettes 111.
After the wafer 100 to be stored is clamped by the loading robot 12, the identity information of the wafer 100 is read by the first information reader 13, and the wafer 100 is transferred to the transport system 20, and the wafer 100 is transported by the transport system 20.
In this embodiment, the transmission system 20 includes a transmitter 21 and a wafer station 22 disposed on the transmitter 21, the loading robot 12 is configured to transfer the wafer 100 placed in the loader 11 to the wafer station 22, and the transmitter 21 is configured to transmit the wafer 100 after the identity information is read;
specifically, the conveyor 21 includes a conveyor belt 211 having the wafer station 22 and a transfer cassette 212 for storing the wafer 100 after reading the identification information; the transfer cassette 212 is disposed on the wafer station 22, and the transfer cassette 212 is provided with cassette storage slots 213 arranged from top to bottom, wherein the cassette storage slots 213 are used for storing the wafers 100.
The conveyor belts 211 can be four conveyor belts 211, the four conveyor belts 211 are enclosed to form a frame structure, the feeding system 10 and the storage system 30 are respectively arranged on two corresponding sides of the frame structure, and the arrangement can save the occupied area of the whole chip automatic storage assembly line and the arrangement space of each system to a certain extent.
In practical cases, after the loading robot 12 picks up the wafer 100 to be stored, the loading robot 12 can transfer the wafer 100 to be stored into the transfer cassette 212 on the wafer station 22, and the stability of the wafer 100 to be stored placed on the transfer cassette 212 can be ensured by the arrangement of the cassette storage slot 213, where it should be noted that when the wafer 100 to be stored is transferred onto the transfer cassette 212, the conveyor belt 211 is in a static state, that is, the conveyor belt 211 is in a motion state of stopping one operation; in addition, a plurality of wafer stations 22 may be disposed at intervals on the conveyor belt 211, and a transfer cassette 212 may be disposed on each wafer station 22, so that a plurality of wafers 100 may be transported on one conveyor belt 211 through the plurality of transfer cassettes 212.
The storage system 30 may be utilized to provide a storage process for the stored wafers 100 as the wafers 100 are moved to the storage system 30 by the transport system 20.
The stocker system 30 includes a stocker robot 31 and a plurality of stockers 32, each stocker 32 being used to store the same kind of wafer 100, the stocker robot 31 being used to transfer the wafer 100 located at the wafer station 22 to the stocker 32 of the kind of wafer, or to transfer the wafer 100 in the stocker 32 to the conveyor 21.
The master control system is configured to receive the identity information of the wafer 100, and control the storage robot 31 to transfer the wafer 100 on the conveyor 21 to the corresponding stocker 32 or transfer the wafer 100 in the stocker 32 to the conveyor 21 according to the identity information of the wafer 100.
In the actual process, the storage robot 31 transfers the tape storage wafer 100 on the conveyor belt 211, and in the transfer process, the storage robot 31 stores the identity information of the wafer 100 in the same type of stocker 32, it should be noted that, in order to ensure that the movement track of the storage robot 31 faces the stocker 32, a track for the storage robot 31 to move may be provided in the storage system 30, and the arrangement track of the track may allow the storage robot 31 to move back and forth between the transport system 20 and the stocker 32, through this arrangement, the storage of the wafer 100 is classified, and the purpose that the wafer 100 cannot be extracted in a short time when the wafer 100 is extracted in the background art is solved.
Specifically, the storage device 32 includes a frame 321, each inner wall of the frame 321 is provided with a plurality of rows of storage troughs 322, and each storage trough 322 includes a plurality of storage troughs 322 distributed along the radial direction of the frame 321; wherein, at least one side of the frame 321 is provided with an opening area 323 for the storage manipulator 31 to move, and the storage manipulator 31 is arranged in the frame 321; by way of example and not limitation, the storage system 30 may be spaced apart and the frame 321 in each storage system 30 may store a plurality of wafers 100.
To sum up, adopt the automatic storage assembly line of chip that shows among this embodiment, beneficial effect lies in:
the loading system 10 comprises a loading manipulator 12, a loading manipulator 12 and a first information reader 13, wherein the loading manipulator 12 is used for transferring the wafers 100 placed in the loading manipulator 11 to the transmission system 20, the first information reader 13 is used for reading the identity information of the wafers 100 on the loading manipulator 12, the wafers 100 are transferred to the storage system 30 through the transmission of the transmission system 20, and the wafers 100 on the wafer stations 22 are transferred to the same kind of storage devices 32 through the storage manipulator 31 in the storage system 30, wherein the storage devices 32 are provided with a plurality of storage devices 32, and each storage device 32 in the plurality of storage devices 32 is used for storing the same kind of wafers 100.
Example two
Referring to fig. 1 to 7 again, a second embodiment of the present invention provides an automated chip storage assembly line, and in the assembly line shown in this embodiment, mechanical devices of each system are mainly improved, so that the cooperative operation of system components can be smoother and more efficient.
The automated chip storage line of the second embodiment further includes a blanking system 40 and a framing system 50.
The unloading system 40 includes an unloading robot 41 and an unloading machine 42, and the unloading robot 41 is used for transferring the wafers 100 transferred from the stocker 32 to the unloading machine 42.
Specifically, the unloader 42 includes a cylinder 421 for storing the wafer 100; the side wall of the barrel 421 is provided with a material taking notch 422, and the material taking notch 422 is used for assisting the wafer 100 placed in the barrel 421 to take materials.
In some practical processes, when the wafer 100 stored in the storage system 30 needs to be extracted, the wafer 100 stored in the storage device 32 is extracted by the storage robot 31, and the extracted wafer 100 is transferred to the transmission system 20, and by transmission of the transmission system 20, the wafer 100 is transferred to the cylinder 421 by the gripping of the blanking robot 41, and the extracted wafer 100 is received by the cylinder 421, and since the side wall of the cylinder 421 is provided with the material taking notch 422, the wafer 100 can be subsequently extracted, for example and without limitation, the opposite side walls of the cylinder 421 can be provided with the material taking notches 422.
The framing system 50 includes a first framing robot 51, a second framing robot 52, a framing support 54 for storing connectors, and a second information reader 53 for reading information of the wafer 100;
wherein the first framing robot 51 is configured to transfer the wafer 100 transferred from the storage system 30, and the second framing robot 52 is configured to connect the connection member stored on the framing support 54 with the wafer 100 being transferred, and read the identification information of the wafer 100 connected to the connection member by the second information reader 53, so that the second framing robot 52 transfers the wafer 100 connected to the connection member to the framing support 54.
Further, the framing system 50 includes a plurality of framing supports 54, the framing supports 54 being configured to store a plurality of connectors; wherein each of the plurality of framing supports 54 is configured to store the same type of wafer 100 coupled to the connector.
In addition, the framing system 50 further includes an intermediate turret 55, the intermediate turret 55 being disposed between the first framing robot 51 and the second framing robot 52, the intermediate turret 55 being used to facilitate connection of the connecting members to the wafer 100.
In some practical cases, in order to facilitate subsequent production processes on the wafer 100, for some wafers 100 stored in the storage system 30, an iron ring needs to be installed and placed in a dedicated box, the connection component in this embodiment may be an iron ring in a production process, the framing support 54 in this embodiment may be a box in a production process, the wafer 100 is transferred by the first framing robot 51 in the framing system 50, and after the transfer to a certain extent, the second framing robot 52 connects the connection component with the wafer 100, reads the identity information of the wafer 100 according to the framing information, and places the identity information in the designated framing support 54; in addition, it should be noted that, in the framing system 50, tracks for the first framing robot 51 and the second framing robot 52 to run are provided, and the second information reader 53 may be a code scanning gun of the prior art.
In summary, the chip automated storage pipeline shown in the second embodiment of the present invention has at least the following advantages compared to the chip automated storage pipeline shown in the first embodiment:
in this embodiment, through the arrangement of the blanking system 40 and the framing system 50, convenience is provided for extracting the wafer 100 in the storage system 30, wherein the framing system 50 is convenient to perform subsequent production processes on the extracted wafer 100, in some practical cases, some wafers 100 stored in the storage system 30 need to be provided with iron rings and placed in a special box, then the connecting member in this embodiment can be an iron ring in the production process, the framing support 54 in this embodiment can be a box in the production process, and through this arrangement, when the wafer 100 is subjected to subsequent processes, the subsequent framing processes on the wafer 100 can be saved, and the use of certain manpower is saved.
In the description of the specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent should be subject to the appended claims.

Claims (10)

1. The chip automatic storage assembly line is characterized by comprising a feeding system, a transmission system, a storage system and a master control system;
the feeding system comprises a feeding machine, a feeding mechanical arm and a first information reader, wherein the feeding mechanical arm is used for transferring a wafer placed in the feeding machine onto the transmission system, and the first information reader is used for reading identity information of the wafer on the feeding mechanical arm;
the conveying system comprises a conveyor and a wafer station arranged on the conveyor, the feeding manipulator is used for transferring the wafer placed in the feeding machine to the wafer station, and the conveyor is used for conveying the wafer after the identity information is read;
the storage system comprises a storage mechanical arm and a plurality of storage devices, wherein each storage device is used for storing the same type of wafers, and the storage mechanical arm is used for transferring the wafers positioned on the wafer station to the storage device used for storing the type of wafers or transferring the wafers in the storage device to the conveyor;
the master control system is used for receiving identity information of wafers and controlling the storage manipulator to transfer the wafers on the conveyor to the corresponding storage device or transfer the wafers in the storage device to the conveyor according to the identity information of the wafers.
2. The automated chip storage line of claim 1, wherein the loader comprises a loader and a cassette for storing wafers;
the loading frame comprises a loading cassette position and an empty cassette recovery position, the loading cassette position is used for storing cassettes with wafers, and the empty cassette recovery position is used for storing the cassettes;
the feeding manipulator is arranged between the feeding cassette position and the empty cassette recovery position and used for placing the cassette between the feeding cassette position and the empty cassette recovery position in a circulating mode.
3. The automated chip storage line of claim 2, wherein a plurality of spaced apart placement grooves are formed on two opposite sidewalls of the cassette, and the placement grooves are arranged along a radial direction of the cassette, wherein one of the placement grooves is opposite to the other of the placement grooves.
4. The automated chip storage line of claim 1, wherein the conveyor comprises a conveyor belt having the wafer stations and a transport cassette for storing the wafers after reading the identification information;
the transportation cassette is arranged on the wafer station, a cassette storage groove arranged from top to bottom is formed in the transportation cassette, and the cassette storage groove is used for storing wafers.
5. The automated chip storage line according to claim 1, wherein the storage device comprises a frame, each inner wall of the frame is provided with a plurality of rows of storage troughs, and each storage trough comprises a plurality of storage troughs distributed along the radial direction of the frame;
at least one side of the frame is provided with an opening area for the storage manipulator to move, and the storage manipulator is arranged in the frame.
6. The automated chip storage line of claim 1, further comprising a blanking system, the blanking system comprising a blanking robot and a blanking machine, the blanking robot being configured to transfer wafers transferred from within the stocker onto the blanking machine.
7. The automated chip storage line of claim 6, wherein the stocker comprises a canister for storing wafers;
the side wall of the barrel is provided with a material taking notch, and the material taking notch is used for assisting in placing a wafer in the barrel to take materials.
8. The chip automated storage pipeline of any of claims 1-7, wherein the storage pipeline further comprises a framing system;
the framing system comprises a first framing manipulator, a second framing manipulator, a framing support used for storing a connecting piece and a second information reader used for reading wafer information;
the first framing manipulator is used for transferring the wafers transferred from the storage system, and the second framing manipulator is used for connecting the connecting piece stored on the framing support with the wafers being transferred and reading the identity information of the wafers connected with the connecting piece through the second information reader, so that the second framing manipulator transfers the wafers connected with the connecting piece to the framing support.
9. The automated chip storage pipeline of claim 8, wherein the framing system comprises a plurality of framing supports for storing a plurality of connectors;
wherein each of the plurality of framing supports is configured to store a same kind of wafer connected to the connector.
10. The automated chip storage line of claim 8, wherein the framing system further comprises a transfer table disposed between the first framing robot and the second framing robot, the transfer table configured to assist in coupling the connector to the wafer.
CN202210973531.3A 2022-08-15 2022-08-15 Automatic storage assembly line of chip Pending CN115188697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210973531.3A CN115188697A (en) 2022-08-15 2022-08-15 Automatic storage assembly line of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210973531.3A CN115188697A (en) 2022-08-15 2022-08-15 Automatic storage assembly line of chip

Publications (1)

Publication Number Publication Date
CN115188697A true CN115188697A (en) 2022-10-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210973531.3A Pending CN115188697A (en) 2022-08-15 2022-08-15 Automatic storage assembly line of chip

Country Status (1)

Country Link
CN (1) CN115188697A (en)

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