CN115167639B - A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster - Google Patents

A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster Download PDF

Info

Publication number
CN115167639B
CN115167639B CN202210271813.9A CN202210271813A CN115167639B CN 115167639 B CN115167639 B CN 115167639B CN 202210271813 A CN202210271813 A CN 202210271813A CN 115167639 B CN115167639 B CN 115167639B
Authority
CN
China
Prior art keywords
heat dissipation
rack
plate
dust
waist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210271813.9A
Other languages
Chinese (zh)
Other versions
CN115167639A (en
Inventor
张志杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Ruifeng Yunke Information Technology Co.,Ltd.
Original Assignee
Beijing Hanxinsheng Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Hanxinsheng Technology Co ltd filed Critical Beijing Hanxinsheng Technology Co ltd
Priority to CN202210271813.9A priority Critical patent/CN115167639B/en
Publication of CN115167639A publication Critical patent/CN115167639A/en
Application granted granted Critical
Publication of CN115167639B publication Critical patent/CN115167639B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开一种大规模渲染集群的中心存储器的多点散热系统,它包括:机架,所述机架的两侧开设有多个第一腰型槽,所述机架的后表面开设有多个第二腰型槽,所述机架的内部滑动安装有多点移动散热机构;其中,所述多点移动散热机构包括有两个对称设置的板体和固定连接在两个板体之间的支撑杆;本发明使用时,将集群的存储器本体设置在支撑板的顶部,通过滑动机架两侧第一腰型槽中的第一横杆带动板体以及散热风扇在支撑板的底部进行左右移动,从而调节散热风扇在支撑板底部的左右位置,同时,滑动第二腰型槽中的第二横杆带动板体以及散热风扇在支撑板的底部进行前后移动,从而调节散热风扇在支撑板底部的左右位置。

Figure 202210271813

The invention discloses a multi-point heat dissipation system for a central memory of a large-scale rendering cluster, which includes: a rack, a plurality of first waist-shaped slots are opened on both sides of the rack, and a plurality of first waist-shaped slots are opened on the rear surface of the rack. A plurality of second waist-shaped slots, and a multi-point mobile heat dissipation mechanism is slidably installed inside the frame; wherein, the multi-point mobile heat dissipation mechanism includes two symmetrically arranged plates and is fixedly connected between the two plates When the present invention is used, the storage body of the cluster is arranged on the top of the support plate, and the first cross bar in the first waist-shaped groove on both sides of the sliding frame drives the plate body and the cooling fan at the bottom of the support plate Move left and right to adjust the left and right position of the cooling fan at the bottom of the support plate. At the same time, slide the second cross bar in the second waist-shaped groove to drive the plate body and the cooling fan to move back and forth at the bottom of the support plate, thereby adjusting the cooling fan at the bottom of the support plate. The left and right position of the bottom of the support plate.

Figure 202210271813

Description

一种大规模渲染集群的中心存储器的多点散热系统及方法A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster

技术领域technical field

本发明属于集群存储器散热技术领域,具体来说,涉及一种大规模渲染集群的中心存储器的多点散热系统,尤其还涉及一种大规模渲染集群的中心存储器的多点散热方法。The invention belongs to the technical field of heat dissipation of cluster memory, and in particular relates to a multi-point heat dissipation system for a central memory of a large-scale rendering cluster, and in particular to a multi-point heat dissipation method for a central memory of a large-scale rendering cluster.

背景技术Background technique

存储器是用来存储程序和各种数据信息的记忆部件。存储器可分为主存储器(简称主存或内存)和辅助存储器(简称辅存或外存)两大类,集群存储是将多台存储设备中的存储空间聚合成一个能够给应用服务器提供统一访问接口和管理界面的存储池,应用可以通过该访问接口透明地访问和利用所有存储设备上的磁盘,可以充分发挥存储设备的性能和磁盘利用率。数据将会按照一定的规则从多台存储设备上存储和读取,以获得更高的并发访问性能。Memory is a memory component used to store programs and various data information. Storage can be divided into two categories: main storage (referred to as main storage or internal memory) and auxiliary storage (referred to as auxiliary storage or external storage). Cluster storage is to aggregate the storage space in multiple storage devices into one that can provide unified access to application servers. The storage pool of the interface and management interface, the application can transparently access and utilize the disks on all storage devices through this access interface, and the performance and disk utilization of the storage device can be fully utilized. Data will be stored and read from multiple storage devices according to certain rules to obtain higher concurrent access performance.

然而,现有技术中,大规模渲染集群的中心存储器的多点散热性能不太好,尤其是存储器集群安装在机架上时,无法根据中心存储器的发热点进行针对性散热,导致散热性能较差,并且在长期摆放时,机架内以及存储器表面容易附着灰尘,从而进一步影响散热性能,并容易覆盖线路造成存储器使用异常。However, in the prior art, the multi-point heat dissipation performance of the central memory of a large-scale rendering cluster is not very good, especially when the memory cluster is installed on a rack, it is impossible to conduct targeted heat dissipation according to the heat-generating points of the central memory, resulting in poor heat dissipation performance. In addition, when placed for a long time, dust is easy to adhere to the inside of the rack and the surface of the memory, which further affects the heat dissipation performance, and it is easy to cover the lines and cause abnormal use of the memory.

发明内容Contents of the invention

针对现有技术中,大规模渲染集群的中心存储器的多点散热性能不太好,尤其是存储器集群安装在机架上时,无法根据中心存储器的发热点进行针对性散热,导致散热性能较差,并且在长期摆放时,机架内以及存储器表面容易附着灰尘,从而影响散热性能并容易造成存储器使用异常的问题,本发明提供了一种具备灵活调节散热点,且不易因附着灰尘而影响散热以及存储器使用的大规模渲染集群的中心存储器的多点散热系统及方法。In the existing technology, the multi-point heat dissipation performance of the central memory of the large-scale rendering cluster is not very good, especially when the memory cluster is installed on the rack, it is impossible to perform targeted heat dissipation according to the heating points of the central memory, resulting in poor heat dissipation performance , and when it is placed for a long time, dust is easy to adhere to the inside of the rack and the surface of the memory, which affects the heat dissipation performance and easily causes the problem of abnormal use of the memory. A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster used for heat dissipation and storage.

为实现上述技术目的,本发明采用的技术方案如下:For realizing above-mentioned technical purpose, the technical scheme that the present invention adopts is as follows:

一种大规模渲染集群的中心存储器的多点散热系统,包括:机架、多点移动散热机构以及辅助散热机构;A multi-point heat dissipation system for the central memory of a large-scale rendering cluster, including: a rack, a multi-point mobile heat dissipation mechanism, and an auxiliary heat dissipation mechanism;

其中,所述机架的两侧开设有多个第一腰型槽,所述机架的后表面开设有多个第二腰型槽,所述机架的内部滑动安装有多点移动散热机构;Wherein, the two sides of the frame are provided with a plurality of first waist-shaped grooves, the rear surface of the frame is provided with a plurality of second waist-shaped grooves, and the inside of the frame is slidingly installed with a multi-point mobile cooling mechanism ;

其中,所述多点移动散热机构包括有两个对称设置的板体和固定连接在两个板体之间的支撑杆,所述第一腰型槽的内部滑动安装第一横杆,所述第二腰型槽的内部滑动安装于第二横杆,所述板体的两侧开设有第一通孔,所述支撑杆的外壁开设有第二通孔,所述第一横杆贯穿第一通孔,所述第二横杆贯穿所述第二通孔,所述第一横杆位于所述第二横杆的顶部,所述板体的顶部安装有散热风扇,所述机架上安装有辅助散热机构。Wherein, the multi-point mobile heat dissipation mechanism includes two symmetrically arranged boards and a support rod fixedly connected between the two boards, the inside of the first waist-shaped groove is slidably installed with a first cross bar, and the The inside of the second waist-shaped groove is slidably installed on the second cross bar, the two sides of the board body are provided with first through holes, the outer wall of the support rod is provided with second through holes, and the first cross bar passes through the first through hole. A through hole, the second cross bar runs through the second through hole, the first cross bar is located at the top of the second cross bar, a cooling fan is installed on the top of the board, and the frame An auxiliary cooling mechanism is installed.

采用上述技术方案的一种大规模渲染集群的中心存储器的多点散热系统由机架、多点移动散热机构以及辅助散热机构组成,使用时,通过滑动机架两侧第一腰型槽中的第一横杆带动板体以及散热风扇在支撑板的底部进行左右移动,从而调节散热风扇在支撑板底部的左右位置,同时,滑动第二腰型槽中的第二横杆带动板体以及散热风扇在支撑板的底部进行前后移动,从而调节散热风扇在支撑板底部的左右位置。The multi-point heat dissipation system of the central memory of a large-scale rendering cluster adopting the above technical solution is composed of a rack, a multi-point mobile heat dissipation mechanism and an auxiliary heat dissipation mechanism. The first cross bar drives the plate body and the heat dissipation fan to move left and right at the bottom of the support plate, thereby adjusting the left and right positions of the heat dissipation fan at the bottom of the support plate. At the same time, sliding the second cross bar in the second waist-shaped groove drives the plate body and heat dissipation The fan moves back and forth at the bottom of the support plate, thereby adjusting the left and right positions of the cooling fan at the bottom of the support plate.

进一步,所述辅助散热机构包括进风通道,所述进风通道安装于所述机架的顶部,所述机架的顶部开设有进风口,所述进风口位于所述进风通道的底部,所述进风通道的顶部安装有风机,所述机架的两侧内壁等距排列的焊接有两组固定块,每组中所述固定块的数量为两个,且每组所述固定块的顶部均设置有支撑板,所述支撑板的顶部嵌套有散热网栅,所述散热网栅的底部固定连接有U形扣,所述U形扣的内部滑动安装有粘尘板,所述支撑板顶部设置有存储器本体。Further, the auxiliary heat dissipation mechanism includes an air inlet channel, the air inlet channel is installed on the top of the frame, the top of the frame is provided with an air inlet, and the air inlet is located at the bottom of the air inlet channel, A fan is installed on the top of the air inlet passage, and two sets of fixing blocks are welded on the inner walls of both sides of the frame at equal intervals, and the number of the fixing blocks in each group is two, and each set of the fixing blocks The top of the support plate is provided with a support plate, the top of the support plate is nested with a heat dissipation grid, the bottom of the heat dissipation grid is fixedly connected with a U-shaped buckle, and the inside of the U-shaped buckle is slidably installed with a sticky board. A memory body is arranged on the top of the support plate.

进一步,所述进风通道的前表面固定连接有固定板,所述固定板的外部开设有若干个进风孔。Further, a fixing plate is fixedly connected to the front surface of the air inlet channel, and several air inlet holes are opened on the outside of the fixing plate.

进一步,所述机架的前表面通过合页铰接有门板,所述门板的前表面嵌装有观察窗。Further, the front surface of the frame is hinged with a door panel, and the front surface of the door panel is embedded with an observation window.

进一步,所述第一横杆和所述第二横杆的两端均固定连接有手柄。Further, both ends of the first crossbar and the second crossbar are fixedly connected with handles.

进一步,所述粘尘板上开设有若干个直孔。Further, several straight holes are opened on the sticky dust plate.

进一步,所述支撑板的两侧通过螺栓固定连接于所述固定块的顶部。Further, both sides of the supporting plate are fixedly connected to the top of the fixing block by bolts.

进一步,所述机架的底部对称固定连接有四个防滑垫。Further, four anti-skid pads are symmetrically fixedly connected to the bottom of the frame.

本发明还提供了一种大规模渲染集群的中心存储器的多点散热方法,包括以下步骤:The present invention also provides a multi-point heat dissipation method for the central memory of a large-scale rendering cluster, comprising the following steps:

S1、将集群的存储器本体设置在支撑板的顶部,通过启动风机和散热风扇对机架内部以及存储器本体进行吹动,进行风力散热;S1. Set the storage body of the cluster on the top of the support plate, and blow the inside of the rack and the storage body by starting the fan and cooling fan to dissipate heat by wind;

S2、通过滑动机架两侧第一腰型槽中的第一横杆带动板体以及散热风扇在支撑板的底部进行左右移动,从而调节散热风扇在支撑板底部的左右位置,同时,滑动第二腰型槽中的第二横杆带动板体以及散热风扇在支撑板的底部进行前后移动,从而调节散热风扇在支撑板底部的左右位置;S2. By sliding the first cross bar in the first waist-shaped groove on both sides of the rack to drive the plate body and the cooling fan to move left and right at the bottom of the support plate, thereby adjusting the left and right position of the cooling fan at the bottom of the support plate, at the same time, sliding the second The second crossbar in the two-waist groove drives the plate body and the cooling fan to move back and forth at the bottom of the support plate, thereby adjusting the left and right positions of the cooling fan at the bottom of the support plate;

S3、通过启动风机,在风机的作用下将风力吹入进风通道,风通过进风通道后从进风口进入机架内,对机架内的存储器本体表面进行散热的同时,将灰尘从存储器本体表面吹落;S3. By starting the fan, under the action of the fan, the wind force is blown into the air inlet passage, and the wind enters the rack from the air inlet after passing through the air inlet passage, and while cooling the surface of the memory body in the rack, dust is removed from the memory Body surface blown off;

S4、在灰尘吹落后进入支撑板上的散热网栅内部,并附着在粘尘板上,用于减少在机架以及存储器本体上的灰尘。S4. After the dust is blown, it enters the inside of the heat dissipation grid on the support plate and attaches to the dust sticky plate to reduce the dust on the rack and the storage body.

进一步,在S4中,散热的风力通过粘尘板上开设的若干个直孔能够继续上下流通。Further, in S4, the wind force of heat dissipation can continue to circulate up and down through several straight holes opened on the dust sticky board.

本发明相比现有技术,具有如下有益效果:Compared with the prior art, the present invention has the following beneficial effects:

1、本发明使用时,通过滑动机架两侧第一腰型槽中的第一横杆带动板体以及散热风扇在支撑板的底部进行左右移动,从而调节散热风扇在支撑板底部的左右位置,同时,滑动第二腰型槽中的第二横杆带动板体以及散热风扇在支撑板的底部进行前后移动,从而调节散热风扇在支撑板底部的左右位置,通过位置的灵活变更,使中心存储器具备多点散热的功能,提高散热效果;1. When the present invention is in use, the plate body and the cooling fan are moved left and right at the bottom of the support plate by sliding the first cross bar in the first waist-shaped groove on both sides of the rack, thereby adjusting the left and right position of the cooling fan at the bottom of the support plate , at the same time, sliding the second bar in the second waist-shaped groove drives the plate body and the cooling fan to move back and forth at the bottom of the support plate, thereby adjusting the left and right positions of the cooling fan at the bottom of the support plate. Through the flexible change of the position, the center The memory has the function of multi-point heat dissipation to improve the heat dissipation effect;

2、本发明中,通过启动风机,在风机的作用下将风力吹入进风通道,风通过进风通道后从进风口进入机架内,对机架内的存储器本体表面进行散热的同时,将灰尘从存储器本体表面吹落,在灰尘吹落后进入支撑板上的散热网栅内部,并附着在粘尘板上,用于减少在机架以及存储器本体上的灰尘,通过去除灰尘,并将灰尘附着回收在粘尘板上后,能够提高机架内存储器的表面散热性能,并避免受灰尘影响导致的存储器使用异常现象发生。2. In the present invention, by starting the fan, under the action of the fan, the wind force is blown into the air inlet passage, and the wind enters the rack from the air inlet after passing through the air inlet passage, and while cooling the surface of the memory body in the rack, The dust is blown off from the surface of the storage body, and after the dust is blown, it enters the heat dissipation grid on the support plate and adheres to the dust sticky plate to reduce the dust on the rack and the storage body. By removing the dust, and After the dust is attached and recovered on the sticky board, the surface heat dissipation performance of the memory in the rack can be improved, and the abnormal use of the memory caused by the influence of dust can be avoided.

附图说明Description of drawings

图1为本发明中心存储器的多点散热系统的结构示意图;Fig. 1 is the structural representation of the multi-point heat dissipation system of the central memory of the present invention;

图2为本发明中心存储器的多点散热系统的另一视角的结构示意图;FIG. 2 is a structural schematic diagram of another perspective of the multi-point heat dissipation system of the central memory of the present invention;

图3为本发明中心存储器的多点散热系统中机架的剖面结构示意图;Fig. 3 is the cross-sectional structure schematic diagram of the frame in the multi-point heat dissipation system of the central memory of the present invention;

图4为本发明中心存储器的多点散热系统中板体和支撑杆的结构示意图;Fig. 4 is a structural schematic diagram of a plate body and a support rod in the multi-point heat dissipation system of the central memory of the present invention;

图5为本发明中心存储器的多点散热系统中支撑板的结构示意图;5 is a schematic structural view of a support plate in a multi-point heat dissipation system of a central memory of the present invention;

图6为本发明中心存储器的多点散热系统中支撑板的剖面结构示意图。FIG. 6 is a schematic cross-sectional structural view of a support plate in a multi-point heat dissipation system of a central memory according to the present invention.

图中标记说明:1、机架;2、第一腰型槽;3、手柄;4、防滑垫;5、门板;6、观察窗;7、进风孔;8、固定板;9、风机;10、进风通道;11、第一横杆;12、螺栓;13、板体;14、固定块;15、散热风扇;16、进风口;17、存储器本体;18、支撑板;19、第二横杆;20、支撑杆;21、第二腰型槽;22、第一通孔;23、第二通孔;24、散热网栅;25、粘尘板;26、直孔;27、U形扣。Marking description in the figure: 1. Rack; 2. First waist groove; 3. Handle; 4. Anti-skid pad; 5. Door panel; 6. Observation window; 7. Air inlet hole; 8. Fixed plate; 9. Fan ; 10, air inlet channel; 11, first crossbar; 12, bolt; 13, plate body; 14, fixed block; 15, cooling fan; 16, air inlet; 17, memory body; 18, support plate; 20, support rod; 21, the second waist groove; 22, the first through hole; 23, the second through hole; 24, heat dissipation grid; 25, sticky dust board; 26, straight hole; 27 , U-shaped buckle.

具体实施方式Detailed ways

为了便于本领域技术人员的理解,下面结合实施例与附图对本发明作进一步的说明,实施方式提及的内容并非对本发明的限定。In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention.

实施例一Embodiment one

如图1-6所示,本实施例提供一种大规模渲染集群的中心存储器的多点散热系统,包括机架1、多点移动散热机构以及辅助散热机构。As shown in FIGS. 1-6 , this embodiment provides a multi-point heat dissipation system for a central memory of a large-scale rendering cluster, including a rack 1 , a multi-point mobile heat dissipation mechanism, and an auxiliary heat dissipation mechanism.

其中,机架1的两侧开设有多个第一腰型槽2,机架1的后表面开设有多个第二腰型槽21,机架1的内部滑动安装有多点移动散热机构。Wherein, both sides of the frame 1 are provided with a plurality of first waist-shaped grooves 2, and the rear surface of the frame 1 is provided with a plurality of second waist-shaped grooves 21, and the inside of the frame 1 is slidably installed with a multi-point movable cooling mechanism.

多点移动散热机构包括有两个对称设置的板体13和固定连接在两个板体13之间的支撑杆20,第一腰型槽2的内部滑动安装第一横杆11,第二腰型槽21的内部滑动安装于第二横杆19,板体13的两侧开设有第一通孔22,支撑杆20的外壁开设有第二通孔23,第一横杆11贯穿第一通孔22,第二横杆19贯穿第二通孔23,第一横杆11位于第二横杆19的顶部,板体13的顶部安装有散热风扇15,机架1上安装有辅助散热机构。The multi-point mobile heat dissipation mechanism includes two symmetrically arranged boards 13 and a support rod 20 fixedly connected between the two boards 13, the first cross bar 11 is slidably installed inside the first waist groove 2, and the second waist The inside of the groove 21 is slidably mounted on the second cross bar 19, the two sides of the plate body 13 are provided with a first through hole 22, the outer wall of the support rod 20 is provided with a second through hole 23, and the first cross bar 11 runs through the first through hole 22. Hole 22, the second crossbar 19 runs through the second through hole 23, the first crossbar 11 is located on the top of the second crossbar 19, the top of the plate body 13 is equipped with a cooling fan 15, and the frame 1 is equipped with an auxiliary cooling mechanism.

辅助散热机构包括进风通道10,进风通道10安装于机架1的顶部,机架1的顶部开设有进风口16,进风口16位于进风通道10的底部,进风通道10的顶部安装有风机9,机架1的两侧内壁等距排列的焊接有两组固定块14,每组中固定块14的数量为两个,且每组固定块14的顶部均设置有支撑板18,支撑板18的顶部嵌套有散热网栅24,散热网栅24的底部固定连接有U形扣27,U形扣27的内部滑动安装有粘尘板25,支撑板18顶部设置有存储器本体17,通过上述技术方案启动风机9,在风机9的作用下将风力吹入进风通道10,风通过进风通道10后从进风口16进入机架1内,对机架1内的存储器本体17表面进行散热的同时,将灰尘从存储器本体17表面吹落,在灰尘吹落后进入支撑板18上的散热网栅24内部,并附着在粘尘板25上,用于减少在机架1以及存储器本体17上的灰尘,其中,散热网栅24能够提高导热效率,增加散热效果,通过去除灰尘,并将灰尘附着回收在粘尘板25上,同时,为了便于粘尘板25的清洁或更换,将粘尘板25滑动安装在U形扣27的内部,使用后能够抽出粘尘板25进行清洁或更换。The auxiliary heat dissipation mechanism includes an air inlet channel 10, the air inlet channel 10 is installed on the top of the frame 1, the top of the frame 1 is provided with an air inlet 16, the air inlet 16 is located at the bottom of the air inlet channel 10, and the top of the air inlet channel 10 is installed There is a fan 9, two sets of fixed blocks 14 are welded equidistantly on the inner walls of both sides of the frame 1, the number of fixed blocks 14 in each group is two, and the top of each set of fixed blocks 14 is provided with a support plate 18, The top of the support plate 18 is nested with a heat dissipation grid 24, the bottom of the heat dissipation grid 24 is fixedly connected with a U-shaped buckle 27, and the inside of the U-shaped buckle 27 is slidably installed with a dust sticky plate 25, and the top of the support plate 18 is provided with a memory body 17 , start the fan 9 through the above-mentioned technical scheme, and under the action of the fan 9, the wind force will be blown into the air inlet passage 10, and the wind will enter the rack 1 from the air inlet 16 after passing through the air inlet passage 10, and the memory body 17 in the rack 1 While the surface is dissipating heat, the dust is blown off from the surface of the memory body 17, and after the dust is blown, it enters the inside of the heat dissipation grid 24 on the support plate 18, and adheres to the dust sticky plate 25, which is used to reduce the dust on the rack 1 and the memory. The dust on the body 17, wherein the heat dissipation grid 24 can improve the heat conduction efficiency and increase the heat dissipation effect, by removing the dust, and attaching the dust to the dust sticky plate 25, at the same time, in order to facilitate the cleaning or replacement of the dust sticky plate 25, The dust sticky plate 25 is slidably installed in the inside of the U-shaped buckle 27, and the dust sticky plate 25 can be taken out for cleaning or replacement after use.

进风通道10的前表面固定连接有固定板8,固定板8的外部开设有若干个进风孔7,通过上述技术方案,在固定板8的外部开设若干个进风孔7能在风机9的作用下抽取外部空气进入进风通道10。The front surface of the air inlet channel 10 is fixedly connected with a fixed plate 8, and the outside of the fixed plate 8 is provided with several air inlet holes 7. Through the above-mentioned technical scheme, several air inlet holes 7 are opened outside the fixed plate 8, so that the blower fan 9 The external air is drawn into the air intake passage 10 under the action of the air intake.

具体的,机架1的前表面通过合页铰接有门板5,门板5的前表面嵌装有观察窗6,通过上述技术方案,操作人员能够通过门板5控制机架1前表面的打开与闭合,并通过观察窗6能够直接观测到机架1内部存储器本体17的使用状况。Specifically, the front surface of the frame 1 is hinged with a door panel 5, and the front surface of the door panel 5 is embedded with an observation window 6. Through the above technical solution, the operator can control the opening and closing of the front surface of the frame 1 through the door panel 5. , and through the observation window 6, the usage status of the internal memory body 17 of the rack 1 can be directly observed.

第一横杆11和第二横杆19的两端均固定连接有手柄3,通过在第一横杆11和第二横杆19两端增加手柄3,更便于操作人员手持第一横杆11和第二横杆19。Both ends of the first crossbar 11 and the second crossbar 19 are fixedly connected with handles 3, and by adding handles 3 at both ends of the first crossbar 11 and the second crossbar 19, it is more convenient for the operator to hold the first crossbar 11 And the second crossbar 19.

具体的,粘尘板25上开设有若干个直孔26,通过上述技术方案在粘尘板25上开设直孔26能够引导散热的风力穿过直孔26继续流通。Specifically, several straight holes 26 are opened on the dust sticky plate 25 , through the above technical solution, the straight holes 26 are opened on the dust sticky plate 25 to guide the wind force of heat dissipation to pass through the straight holes 26 and continue to circulate.

具体的,支撑板18的两侧通过螺栓12固定连接于固定块14的顶部,通过上述技术方案,支撑板18在安装时,能够通过螺栓12贯穿支撑板18的两侧并连接在固定块14顶部,使支撑板18固定。Specifically, both sides of the support plate 18 are fixedly connected to the top of the fixed block 14 through bolts 12. Through the above-mentioned technical solution, when the support plate 18 is installed, the bolts 12 can pass through both sides of the support plate 18 and be connected to the fixed block 14. top, so that the support plate 18 is fixed.

具体的,机架1的底部对称固定连接有四个防滑垫4,通过上述技术方案,防滑垫4使用时能够增加机架1底部的摩擦力,减少机架1滑动现象。Specifically, four anti-skid pads 4 are symmetrically and fixedly connected to the bottom of the frame 1. Through the above technical solution, the anti-skid pads 4 can increase the friction force at the bottom of the frame 1 and reduce the sliding phenomenon of the frame 1 when used.

实施例二Embodiment two

本实施例还提供了一种大规模渲染集群的中心存储器的多点散热方法,包括以下步骤:This embodiment also provides a multi-point heat dissipation method for a central memory of a large-scale rendering cluster, including the following steps:

S1、将集群的存储器本体17设置在支撑板18的顶部,通过启动风机9和散热风扇15对机架1内部以及存储器本体17进行吹动,进行风力散热;S1, the storage body 17 of the cluster is arranged on the top of the support plate 18, and the inside of the rack 1 and the storage body 17 are blown by starting the fan 9 and the cooling fan 15 to perform wind cooling;

S2、通过滑动机架1两侧第一腰型槽2中的第一横杆11带动板体13以及散热风扇15在支撑板18的底部进行左右移动,从而调节散热风扇15在支撑板18底部的左右位置,同时,滑动第二腰型槽21中的第二横杆19带动板体13以及散热风扇15在支撑板18的底部进行前后移动,从而调节散热风扇15在支撑板18底部的左右位置;S2, by sliding the first cross bar 11 in the first waist-shaped groove 2 on both sides of the rack 1 to drive the plate body 13 and the cooling fan 15 to move left and right at the bottom of the support plate 18, thereby adjusting the cooling fan 15 at the bottom of the support plate 18 At the same time, sliding the second cross bar 19 in the second waist-shaped groove 21 drives the plate body 13 and the cooling fan 15 to move back and forth at the bottom of the support plate 18, thereby adjusting the left and right position of the cooling fan 15 at the bottom of the support plate 18. Location;

S3、通过启动风机9,在风机9的作用下将风力吹入进风通道10,风通过进风通道10后从进风口16进入机架1内,对机架1内的存储器本体17表面进行散热的同时,将灰尘从存储器本体17表面吹落;S3, by starting the fan 9, under the action of the fan 9, the wind is blown into the air inlet passage 10, and the wind enters the rack 1 from the air inlet 16 after passing through the air inlet passage 10, and the surface of the memory body 17 in the rack 1 is blown While dissipating heat, the dust is blown off from the surface of the memory body 17;

S4、在灰尘吹落后进入支撑板18上的散热网栅24内部,并附着在粘尘板25上,用于减少在机架1以及存储器本体17上的灰尘。S4. After the dust is blown, it enters the heat dissipation grid 24 on the support plate 18 and attaches to the dust sticky plate 25 to reduce the dust on the rack 1 and the storage body 17 .

具体的,在S4中,散热的风力通过粘尘板25上开设的若干个直孔26能够继续上下流通。Specifically, in S4, the wind force of heat dissipation can continue to flow up and down through several straight holes 26 opened on the dust sticky plate 25 .

结构原理:本发明提出的大规模渲染集群的中心存储器的多点散热系统由机架1、多点移动散热机构以及辅助散热机构组成,使用时,通过滑动机架1两侧第一腰型槽2中的第一横杆11带动板体13以及散热风扇15在支撑板18的底部进行左右移动,从而调节散热风扇15在支撑板18底部的左右位置,同时,滑动第二腰型槽21中的第二横杆19带动板体13以及散热风扇15在支撑板18的底部进行前后移动,从而调节散热风扇15在支撑板18底部的左右位置,通过位置的灵活变更,使中心存储器具备多点散热的功能,提高散热效果,当操作人员启动风机9时,能够在风机9的作用下将风力吹入进风通道10,风通过进风通道10后从进风口16进入机架1内,对机架1内的存储器本体17表面进行散热的同时,将灰尘从存储器本体17表面吹落,在灰尘吹落后进入支撑板18上的散热网栅24内部,并附着在粘尘板25上,用于减少在机架1以及存储器本体17上的灰尘,其中,散热网栅24能够提高导热效率,增加散热效果,通过去除灰尘,并将灰尘附着回收在粘尘板25上,同时,为了便于粘尘板25的清洁或更换,将粘尘板25滑动安装在U形扣27的内部,使用后能够抽出粘尘板25进行清洁或更换。Structural principle: The multi-point heat dissipation system of the central memory of the large-scale rendering cluster proposed by the present invention is composed of the rack 1, the multi-point mobile heat dissipation mechanism and the auxiliary heat dissipation mechanism. 2, the first cross bar 11 drives the plate body 13 and the heat dissipation fan 15 to move left and right at the bottom of the support plate 18, thereby adjusting the left and right position of the heat dissipation fan 15 at the bottom of the support plate 18, and at the same time, slides in the second waist-shaped groove 21 The second crossbar 19 drives the plate body 13 and the cooling fan 15 to move back and forth at the bottom of the support plate 18, thereby adjusting the left and right positions of the cooling fan 15 at the bottom of the support plate 18. Through the flexible change of the position, the central memory has multiple points. The function of heat dissipation improves the heat dissipation effect. When the operator starts the fan 9, the wind force can be blown into the air inlet channel 10 under the action of the fan 9, and the wind enters the frame 1 from the air inlet 16 after passing through the air inlet channel 10. While the surface of the memory body 17 in the frame 1 is cooling, the dust is blown off from the surface of the memory body 17, and after the dust is blown, it enters the inside of the heat dissipation grid 24 on the support plate 18, and is attached to the dust sticky plate 25. In order to reduce the dust on the rack 1 and the memory body 17, the heat dissipation grid 24 can improve the heat conduction efficiency, increase the heat dissipation effect, remove the dust, and attach and recycle the dust on the dust sticky board 25. At the same time, in order to facilitate sticking To clean or replace the dust plate 25, the dust sticky plate 25 is slidably installed inside the U-shaped buckle 27, and the dust sticky plate 25 can be extracted after use for cleaning or replacement.

以上对本申请提供的一种大规模渲染集群的中心存储器的多点散热系统及方法进行了详细介绍。具体实施例的说明只是用于帮助理解本申请的方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请原理的前提下,还可以对本申请进行若干改进和修饰,这些改进和修饰也落入本申请权利要求的保护范围内。A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster provided by the present application has been introduced in detail above. The description of specific embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that those skilled in the art can make some improvements and modifications to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims (9)

1. A multipoint heat dissipation system for a central storage of a mass rendering cluster, comprising:
the heat dissipation device comprises a rack (1), wherein a plurality of first waist-shaped grooves (2) are formed in two sides of the rack (1), a plurality of second waist-shaped grooves (21) are formed in the rear surface of the rack (1), and a multipoint moving heat dissipation mechanism is slidably mounted in the rack (1);
the multipoint mobile heat dissipation mechanism comprises two symmetrically arranged plate bodies (13) and a support rod (20) fixedly connected between the two plate bodies (13), a first cross rod (11) is slidably mounted inside a first waist-shaped groove (2), a second cross rod (19) is slidably mounted inside a second waist-shaped groove (21), first through holes (22) are formed in two sides of each plate body (13), second through holes (23) are formed in the outer wall of the support rod (20), the first cross rod (11) penetrates through the first through holes (22), the second cross rod (19) penetrates through the second through holes (23), the first cross rod (11) is located at the top of the second cross rod (19), a heat dissipation fan (15) is mounted at the top of each plate body (13), and an auxiliary heat dissipation mechanism is mounted on the rack (1);
supplementary heat dissipation mechanism includes inlet air channel (10), inlet air channel (10) install in the top of frame (1), air intake (16) have been seted up at the top of frame (1), air intake (16) are located the bottom of inlet air channel (10), fan (9) are installed at the top of inlet air channel (10), the welding that the both sides inner wall equidistance of frame (1) was arranged has two sets of fixed blocks (14), and in every group the quantity of fixed block (14) is two, and every group the top of fixed block (14) all is provided with backup pad (18), the top of backup pad (18) has nested heat dissipation net bars (24), the bottom fixedly connected with U-shaped of heat dissipation net bars (24) detains (27), the inside slidable mounting that U-shaped detained (27) has dust-binding plate (25), backup pad (18) top is provided with memory body (17).
2. The multi-drop heat dissipation system for a central storage of a mass rendering cluster of claim 1, wherein: the front surface of the air inlet channel (10) is fixedly connected with a fixing plate (8), and a plurality of air inlet holes (7) are formed in the outer portion of the fixing plate (8).
3. The multi-drop heat dissipation system for a hub memory of a mass rendering cluster of claim 1, wherein: the front surface of the frame (1) is hinged with a door panel (5) through a hinge, and the front surface of the door panel (5) is embedded with an observation window (6).
4. The multi-drop heat dissipation system for a central storage of a mass rendering cluster of claim 1, wherein: and the two ends of the first cross rod (11) and the second cross rod (19) are fixedly connected with handles (3).
5. The multi-drop heat dissipation system for a hub memory of a mass rendering cluster of claim 1, wherein: the dust sticking plate (25) is provided with a plurality of straight holes (26).
6. The multi-drop heat dissipation system for a hub memory of a mass rendering cluster of claim 1, wherein: two sides of the supporting plate (18) are fixedly connected to the top of the fixing block (14) through bolts (12).
7. The multi-drop heat dissipation system for a hub memory of a mass rendering cluster of claim 1, wherein: the bottom of the frame (1) is symmetrically and fixedly connected with four anti-skid pads (4).
8. A multipoint heat dissipation method for a central storage of a large-scale rendering cluster is characterized by comprising the following steps:
s1, arranging a memory body (17) of a cluster at the top of a support plate (18), and blowing the inside of a rack (1) and the memory body (17) by starting a fan (9) and a cooling fan (15) to dissipate heat by wind power;
s2, driving a plate body (13) and a cooling fan (15) to move left and right at the bottom of a supporting plate (18) through first cross rods (11) in first waist-shaped grooves (2) on two sides of a sliding rack (1), so as to adjust the left and right positions of the cooling fan (15) at the bottom of the supporting plate (18), and meanwhile, sliding a second cross rod (19) in a second waist-shaped groove (21) to drive the plate body (13) and the cooling fan (15) to move front and back at the bottom of the supporting plate (18), so as to adjust the left and right positions of the cooling fan (15) at the bottom of the supporting plate (18);
s3, blowing wind power into the air inlet channel (10) under the action of the fan (9) by starting the fan (9), enabling the wind to enter the rack (1) from the air inlet (16) after passing through the air inlet channel (10), and blowing dust off from the surface of the memory body (17) while radiating the surface of the memory body (17) in the rack (1);
and S4, after the dust is blown down, the dust enters the interior of the heat dissipation mesh grid (24) on the supporting plate 18 and is attached to the dust sticking plate (25) to reduce the dust on the rack (1) and the storage body (17).
9. The multi-point heat dissipation method for a hub memory of a mass rendering cluster as claimed in claim 8, wherein: in S4, the heat-dissipating wind power can continuously circulate up and down through a plurality of straight holes (26) formed in the dust-binding plate (25).
CN202210271813.9A 2022-03-18 2022-03-18 A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster Active CN115167639B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210271813.9A CN115167639B (en) 2022-03-18 2022-03-18 A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210271813.9A CN115167639B (en) 2022-03-18 2022-03-18 A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster

Publications (2)

Publication Number Publication Date
CN115167639A CN115167639A (en) 2022-10-11
CN115167639B true CN115167639B (en) 2023-03-10

Family

ID=83483991

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210271813.9A Active CN115167639B (en) 2022-03-18 2022-03-18 A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster

Country Status (1)

Country Link
CN (1) CN115167639B (en)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206819267U (en) * 2017-04-11 2017-12-29 西华大学 A new type of dust-proof notebook radiator with fixed-point air intake and heat dissipation
CN209431542U (en) * 2018-12-20 2019-09-24 河北昊天热力发展有限公司 A kind of automatic Control System for Heat Exchanging Station frequency converter
JP6596687B1 (en) * 2019-04-23 2019-10-30 玉環市瑞江電脳有限公司 Desktop computer cabinet
CN210181521U (en) * 2019-06-17 2020-03-24 上海分布信息科技有限公司 Server for building block chain node cluster
CN210405994U (en) * 2019-04-30 2020-04-24 华信纵横科技有限公司 Novel server rack for computer
CN210666680U (en) * 2019-12-31 2020-06-02 池州职业技术学院 Computer heat abstractor
CN211673203U (en) * 2019-10-30 2020-10-16 江苏物网天下智能科技有限公司 Server rack for wireless communication
CN213634294U (en) * 2020-06-01 2021-07-06 舒城县东超五金科技有限公司 Heat dissipation support for portable computer
CN213636841U (en) * 2020-12-11 2021-07-06 神华(福州)罗源湾港电有限公司 Sealed dustproof heat dissipation electrical cabinet applied to severe environment
CN214586779U (en) * 2021-03-29 2021-11-02 大连东软信息学院 A computer cooling device
CN214751780U (en) * 2021-06-04 2021-11-16 浙江商业职业技术学院(杭州商业技工学校) Large-scale IDG data center server centralized intelligent heat dissipation device
CN215009023U (en) * 2021-05-17 2021-12-03 陕西新力源电气有限公司 Novel quick heat-dissipation power distribution cabinet
CN113765012A (en) * 2021-07-31 2021-12-07 宁波佳慧电气实业有限公司 Power distribution cabinet capable of expanding heat dissipation range and method for expanding heat dissipation
CN215181772U (en) * 2021-06-04 2021-12-14 徐耀强 Computer machine case that radiating effect is good
CN215416513U (en) * 2021-06-03 2022-01-04 苏州香橼树网络科技有限公司 Data processor heat abstractor for big data retrieval
CN215555803U (en) * 2021-05-10 2022-01-18 福建省厚博农业科技有限公司 An egg storage device that is easy to ventilate and dissipate heat
CN215872461U (en) * 2021-08-16 2022-02-18 国网河南省电力公司三门峡供电公司 Do benefit to radiating automatic rack of power dispatching

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213598893U (en) * 2020-10-15 2021-07-02 上海赞恩网络科技有限公司 Additional heat dissipation support for notebook computer
CN213522879U (en) * 2020-11-20 2021-06-22 辽宁工程招标有限公司 Join in marriage net big data cluster server rack
CN215582398U (en) * 2021-07-05 2022-01-18 泰州立飞达电镀设备有限公司 Cooling device of refrigerating unit

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206819267U (en) * 2017-04-11 2017-12-29 西华大学 A new type of dust-proof notebook radiator with fixed-point air intake and heat dissipation
CN209431542U (en) * 2018-12-20 2019-09-24 河北昊天热力发展有限公司 A kind of automatic Control System for Heat Exchanging Station frequency converter
JP6596687B1 (en) * 2019-04-23 2019-10-30 玉環市瑞江電脳有限公司 Desktop computer cabinet
CN210405994U (en) * 2019-04-30 2020-04-24 华信纵横科技有限公司 Novel server rack for computer
CN210181521U (en) * 2019-06-17 2020-03-24 上海分布信息科技有限公司 Server for building block chain node cluster
CN211673203U (en) * 2019-10-30 2020-10-16 江苏物网天下智能科技有限公司 Server rack for wireless communication
CN210666680U (en) * 2019-12-31 2020-06-02 池州职业技术学院 Computer heat abstractor
CN213634294U (en) * 2020-06-01 2021-07-06 舒城县东超五金科技有限公司 Heat dissipation support for portable computer
CN213636841U (en) * 2020-12-11 2021-07-06 神华(福州)罗源湾港电有限公司 Sealed dustproof heat dissipation electrical cabinet applied to severe environment
CN214586779U (en) * 2021-03-29 2021-11-02 大连东软信息学院 A computer cooling device
CN215555803U (en) * 2021-05-10 2022-01-18 福建省厚博农业科技有限公司 An egg storage device that is easy to ventilate and dissipate heat
CN215009023U (en) * 2021-05-17 2021-12-03 陕西新力源电气有限公司 Novel quick heat-dissipation power distribution cabinet
CN215416513U (en) * 2021-06-03 2022-01-04 苏州香橼树网络科技有限公司 Data processor heat abstractor for big data retrieval
CN214751780U (en) * 2021-06-04 2021-11-16 浙江商业职业技术学院(杭州商业技工学校) Large-scale IDG data center server centralized intelligent heat dissipation device
CN215181772U (en) * 2021-06-04 2021-12-14 徐耀强 Computer machine case that radiating effect is good
CN113765012A (en) * 2021-07-31 2021-12-07 宁波佳慧电气实业有限公司 Power distribution cabinet capable of expanding heat dissipation range and method for expanding heat dissipation
CN215872461U (en) * 2021-08-16 2022-02-18 国网河南省电力公司三门峡供电公司 Do benefit to radiating automatic rack of power dispatching

Also Published As

Publication number Publication date
CN115167639A (en) 2022-10-11

Similar Documents

Publication Publication Date Title
CN219395419U (en) an internet server
CN109471496B (en) Computer display equipment with good heat dissipation
CN115167639B (en) A multi-point heat dissipation system and method for a central memory of a large-scale rendering cluster
CN206378789U (en) Computer dust-proof radiating mainframe box
CN206584299U (en) A kind of computer automatic dust removing heat radiation host computer case
CN209746485U (en) Hard disk fixing mechanism for computer
CN102143672A (en) Wind guide module and liquid cooling unit
CN219435302U (en) Distributed host mechanism of server
CN117355111B (en) A vehicle-mounted supercomputer cabin cooling system
CN119342764A (en) A server cabinet temperature control mechanism and server cabinet thereof
CN215071241U (en) Heat radiator for switch board
CN218630726U (en) Memory bank heat radiation structure
CN213182595U (en) Microcomputer protection box
CN208421760U (en) cooling device for computer storage medium
CN222692100U (en) Cabinet convenient to operate and maintain for central machine room
CN223310152U (en) Fixed heat dissipation mechanism of solar energy controller
CN222581186U (en) A hydrogen fuel cell control device for heavy trucks
CN219534056U (en) Heat dissipation structure of computer data storage device
CN201054107Y (en) Enclosure structure of data server
CN219936361U (en) Heat abstractor of information processor
CN221973633U (en) Automobile water tank radiator with detachable dustproof device
CN219812415U (en) Heat transfer shell easy to emit heat
CN221995855U (en) Radiator convenient for descaling
CN216644338U (en) A high power consumption industrial radiator module
CN222028580U (en) A computer chip heat dissipation structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20250421

Address after: Room 319, 3rd Floor, Building 2, No. 29 and 31 Baiziwan Road, Chaoyang District, Beijing 100022

Patentee after: Beijing Ruifeng Yunke Information Technology Co.,Ltd.

Country or region after: China

Address before: 100020 499, floor 04, 101, floor 1-14, building 4, yard 59, Chemical Road, Chaoyang District, Beijing

Patentee before: Beijing hanxinsheng Technology Co.,Ltd.

Country or region before: China

TR01 Transfer of patent right