CN115160962A - Anaerobic sealant and preparation method thereof - Google Patents
Anaerobic sealant and preparation method thereof Download PDFInfo
- Publication number
- CN115160962A CN115160962A CN202210928259.7A CN202210928259A CN115160962A CN 115160962 A CN115160962 A CN 115160962A CN 202210928259 A CN202210928259 A CN 202210928259A CN 115160962 A CN115160962 A CN 115160962A
- Authority
- CN
- China
- Prior art keywords
- monomer
- polymerization inhibitor
- anaerobic sealant
- accelerator
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000565 sealant Substances 0.000 title claims abstract description 102
- 238000002360 preparation method Methods 0.000 title abstract description 24
- 239000003112 inhibitor Substances 0.000 claims abstract description 102
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 92
- 239000000203 mixture Substances 0.000 claims abstract description 74
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims abstract description 23
- 150000001412 amines Chemical class 0.000 claims abstract description 22
- 239000003999 initiator Substances 0.000 claims abstract description 21
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical class C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims abstract description 21
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims abstract description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims abstract description 8
- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 8
- 150000002923 oximes Chemical class 0.000 claims abstract description 8
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 claims abstract description 3
- 239000000178 monomer Substances 0.000 claims description 163
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- -1 t-butyl acetate peroxide Chemical class 0.000 claims description 49
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 44
- 239000003822 epoxy resin Substances 0.000 claims description 38
- 229920000647 polyepoxide Polymers 0.000 claims description 38
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 27
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 26
- 150000003839 salts Chemical class 0.000 claims description 25
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims description 23
- 150000002148 esters Chemical class 0.000 claims description 23
- 229920001296 polysiloxane Polymers 0.000 claims description 22
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 22
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 22
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 20
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims description 19
- 229940091173 hydantoin Drugs 0.000 claims description 19
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 18
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- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims description 16
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 16
- DZCCLNYLUGNUKQ-UHFFFAOYSA-N n-(4-nitrosophenyl)hydroxylamine Chemical group ONC1=CC=C(N=O)C=C1 DZCCLNYLUGNUKQ-UHFFFAOYSA-N 0.000 claims description 16
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- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 12
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- LBUJPTNKIBCYBY-UHFFFAOYSA-N 1,2,3,4-tetrahydroquinoline Chemical compound C1=CC=C2CCCNC2=C1 LBUJPTNKIBCYBY-UHFFFAOYSA-N 0.000 claims description 10
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- CVHZOJJKTDOEJC-UHFFFAOYSA-M 1,1-dioxo-1,2-benzothiazol-3-olate Chemical class C1=CC=C2C([O-])=NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-M 0.000 claims description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
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- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 claims description 4
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 claims description 4
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- 229920000570 polyether Polymers 0.000 claims description 4
- 239000002244 precipitate Substances 0.000 claims description 4
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- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 3
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- UBUCNCOMADRQHX-UHFFFAOYSA-N N-Nitrosodiphenylamine Chemical group C=1C=CC=CC=1N(N=O)C1=CC=CC=C1 UBUCNCOMADRQHX-UHFFFAOYSA-N 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 3
- QKIUAMUSENSFQQ-UHFFFAOYSA-N dimethylazanide Chemical compound C[N-]C QKIUAMUSENSFQQ-UHFFFAOYSA-N 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 claims 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
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- 229940081974 saccharin Drugs 0.000 description 17
- 235000019204 saccharin Nutrition 0.000 description 17
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 16
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 14
- 150000003512 tertiary amines Chemical class 0.000 description 13
- 229910010413 TiO 2 Inorganic materials 0.000 description 11
- 239000002245 particle Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
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- 229910052760 oxygen Inorganic materials 0.000 description 4
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- 239000004698 Polyethylene Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
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- 238000003786 synthesis reaction Methods 0.000 description 3
- 150000003573 thiols Chemical class 0.000 description 3
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
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- 150000004054 benzoquinones Chemical class 0.000 description 1
- UENWRTRMUIOCKN-UHFFFAOYSA-N benzyl thiol Chemical compound SCC1=CC=CC=C1 UENWRTRMUIOCKN-UHFFFAOYSA-N 0.000 description 1
- JFEVWPNAOCPRHQ-UHFFFAOYSA-N chembl1316021 Chemical compound OC1=CC=CC=C1N=NC1=CC=CC=C1O JFEVWPNAOCPRHQ-UHFFFAOYSA-N 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PTWJGGCOPUFTFL-UHFFFAOYSA-N cyclohexane;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.C1CCCCC1 PTWJGGCOPUFTFL-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 150000005205 dihydroxybenzenes Chemical class 0.000 description 1
- GKCPCPKXFGQXGS-UHFFFAOYSA-N ditert-butyldiazene Chemical compound CC(C)(C)N=NC(C)(C)C GKCPCPKXFGQXGS-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007706 flame test Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- AHAREKHAZNPPMI-UHFFFAOYSA-N hexa-1,3-diene Chemical compound CCC=CC=C AHAREKHAZNPPMI-UHFFFAOYSA-N 0.000 description 1
- QWVBGCWRHHXMRM-UHFFFAOYSA-N hexadecoxycarbonyloxy hexadecyl carbonate Chemical compound CCCCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCCCC QWVBGCWRHHXMRM-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- DNYZBFWKVMKMRM-UHFFFAOYSA-N n-benzhydrylidenehydroxylamine Chemical compound C=1C=CC=CC=1C(=NO)C1=CC=CC=C1 DNYZBFWKVMKMRM-UHFFFAOYSA-N 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- RBXVOQPAMPBADW-UHFFFAOYSA-N nitrous acid;phenol Chemical class ON=O.OC1=CC=CC=C1 RBXVOQPAMPBADW-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 150000004031 phenylhydrazines Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000927 poly(p-phenylene benzobisoxazole) Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- ORIHZIZPTZTNCU-YVMONPNESA-N salicylaldoxime Chemical compound O\N=C/C1=CC=CC=C1O ORIHZIZPTZTNCU-YVMONPNESA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- CSKKAINPUYTTRW-UHFFFAOYSA-N tetradecoxycarbonyloxy tetradecyl carbonate Chemical compound CCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCC CSKKAINPUYTTRW-UHFFFAOYSA-N 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C09J151/085—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds on to polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
- C08F283/124—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes on to polysiloxanes having carbon-to-carbon double bonds
Abstract
The application discloses an anaerobic sealant and a preparation method thereof. The anaerobic sealant comprises a monomer-polymerization inhibitor mixture; an initiator selected from one or more of organic peroxides; the first accelerator and the second accelerator are respectively selected from one or more of first amine, hydrazine and derivatives thereof, mercaptan or first organic dibasic acid; the auxiliary accelerator is selected from one or more of saccharine salt or second organic dibasic acid; a first polymerization inhibitor and a second polymerization inhibitor, each of which is one or more selected from phenol, quinone, oxime, azo compounds and second amines; wherein the mass ratio of the monomer-polymerization inhibitor mixture, the initiator, the first accelerator, the second accelerator, the auxiliary accelerator, the first polymerization inhibitor and the second polymerization inhibitor is 100:1.6-2.0:0.33-0.35:0.8-1.0:0.04-0.05:0.10-0.11:0.014-0.015.
Description
Technical Field
The application relates to the field of chemistry, in particular to an anaerobic sealant and a preparation method thereof.
Background
Since the rapid development of industrialization, the leakage of various industrial media (including acids, alkalis, water, oil, gas, heat and other various chemical agents, etc.) has been a long time cause damages to the ecological environment, the human life safety and the property loss. Generally, such industrial media are stored and transported using containers and/or pipes. To prevent these containers and/or pipes from leaking, sealants are widely used. The anaerobic sealant is an adhesive which is not cured when in contact with air or oxygen, can keep a liquid form for a long time and is rapidly cured under the condition of being isolated from the air or oxygen. The anaerobic sealant for sealing not only needs to be tightly sealed, but also needs to resist high temperature and high leakage pressure in order to meet industrial scenes.
Disclosure of Invention
In order to solve the problems, the application provides an anaerobic sealant and a preparation method thereof. The anaerobic sealant is high temperature resistant and high leakage and pressure resistant.
In one aspect, the present application provides an anaerobic sealant comprising a monomer-inhibitor mixture; an initiator selected from one or more of organic peroxides; the first accelerator and the second accelerator are respectively selected from one or more of first amine, hydrazine and derivatives thereof, mercaptan or first organic dibasic acid; the auxiliary accelerator is selected from one or more of saccharine salt or second organic dibasic acid; and a first polymerization inhibitor and a second polymerization inhibitor, each of which is one or more selected from phenol, quinone, oxime, azo compounds, and second amines; wherein the mass ratio of the monomer-polymerization inhibitor mixture, the initiator, the first accelerator, the second accelerator, the auxiliary accelerator, the first polymerization inhibitor and the second polymerization inhibitor is 100:1.6-2.0:0.33-0.35:0.8-1.0:0.04-0.05:0.10-0.11:0.014-0.015.
In some embodiments, the monomer in the monomer-inhibitor mixture comprises a methacrylic acid monomer comprising one or more of methacrylic acid, bisphenol a methacrylate epoxy monomer, polyether methacrylate epoxy monomer, tetrahydrofurfuryl methacrylate monomer, novolac methacrylate epoxy monomer, polybutadiene methacrylate epoxy monomer, silicone modified methacrylate epoxy monomer, hydantoin methacrylate epoxy monomer, cyclohexane-1,2-diglycidyl ester monomer.
In some embodiments, the methacrylic acid monomer is a mixture of a methacrylic acid silicone modified epoxy monomer, a methacrylic acid hydantoin epoxy monomer, and a methacrylic acid cyclohexane-1,2-diglycidyl ester monomer, and the ratio of the methacrylic acid silicone modified epoxy monomer, the methacrylic acid hydantoin epoxy monomer, and the methacrylic acid cyclohexane-1,2-diglycidyl ester monomer is 20-100%:0-40%:0 to 40 percent.
In some embodiments, the organic peroxide comprises one or more of di-t-butyl peroxide, benzoyl peroxide, cumene hydroperoxide, methyl ethyl ketone peroxide, t-butyl peroxybenzoate, t-butyl peroxypivalate, t-butyl acetate peroxide, t-butyl benzoate peroxide, and cumene peroxide.
In some embodiments, the anaerobic sealant according to claim 4 wherein said organic peroxide is cumene hydroperoxide.
In some embodiments, the first amine comprises one or more of triethylamine, N-dimethylaniline, N-diethylparatoluidine, a-aminopyridine, 1,2,3,4-tetrahydroquinoline, 1,2-propanediamine, triethanolamine, dimethylamide.
In some embodiments, the first amine is triethylamine or N, N-dimethylaniline, the hydrazine and its derivatives are phenylhydrazine, the thiol is dodecyl mercaptan, and the first organic diacid is oxalic acid.
In some embodiments, the saccharinate salt comprises one or more of a SQ salt, a STQ salt, a SMQ salt.
In some embodiments, the saccharinate salt is a SQ salt and the second organic diacid is maleic acid.
In some embodiments, the phenol is hydroquinone or N-nitrophenol, the quinone is p-benzoquinone, the oxime is p-benzoquinone dioxime, and the second amine is N-nitrosodiphenylamine or sulfodiphenylamine.
In some embodiments, the anaerobic sealant further comprises a filler comprising one or more of titanium dioxide, polytetrafluoroethylene, or polyparaphenylene benzobisoxazole.
In some embodiments, the anaerobic sealant further comprises a solvent, wherein the solvent is methacrylic acid or acrylic acid.
In another aspect, the present application provides a method for preparing the above anaerobic sealant, the method comprising: mixing one or more monomer-polymerization inhibitor mixtures; adding a first accelerator, an auxiliary accelerator, a first polymerization inhibitor and a second polymerization inhibitor, and stirring for a first time period until the mixture is uniformly mixed; adding the filler and stirring for a second time period until the mixture is uniformly mixed; adding a second promoter, an initiator and a solvent, and uniformly stirring until no precipitate exists to obtain the anaerobic sealant.
Detailed Description
As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to include the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements. The numerical ranges used in this application are intended to represent each and every value included in the range in a concise and concise manner.
Some embodiments of the present application disclose an anaerobic sealant comprising a monomer-inhibitor mixture, an initiator, an accelerator, an auxiliary accelerator, and an inhibitor.
The monomer may be a component of the anaerobic sealant used to achieve adhesive properties (e.g., anaerobic cure), which may be polymerizable. After the anaerobic sealant is cured, the monomer can form a polymer of a lamellar network. For example, the monomer may be a polymerizable or an oligomeric compound containing an unsaturated bond. In some embodiments of the present application, exemplary monomers may include methacrylic monomers including, but not limited to, one or any combination of methacrylic acid, polymethacrylic acid, diethylene glycol dimethacrylate monomer, bisphenol a methacrylate type epoxy monomer, tetrahydrofurfuryl methacrylate monomer, aliphatic methacrylate epoxy monomer, polyether methacrylate epoxy monomer, novolac methacrylate monomer, hydantoin methacrylate epoxy monomer, silicone methacrylate epoxy monomer, organotitanium methacrylate monomer, cyclohexane-1,2-diglycidyl ester monomer, trimellitic anhydride-triethylene glycol dimer monomer, polyethylene glycol methacrylate monomer, epoxy methacrylate monomer, urethane type methacrylate monomer, hydroxyethyl methacrylate monomer, hydroxypropyl methacrylate monomer, trimethylolpropane methacrylate monomer, alcohol methacrylate monomer, polyethylene glycol dimethacrylate monomer, ethylene glycol dimethacrylate monomer, triethylene glycol dimethacrylate monomer, tetraethylene glycol dimethacrylate monomer, hydroxyethyl methacrylate monomer, hydroxypropyl methacrylate monomer, and the like. Alternatively or preferably, the monomer may include one or more of methacrylic acid, bisphenol a methacrylate epoxy monomer, polyether methacrylate epoxy monomer, tetrahydrofurfuryl methacrylate monomer, novolac methacrylate monomer, polybutadiene methacrylate epoxy monomer, silicone modified methacrylate epoxy monomer, hydantoin methacrylate epoxy monomer, cyclohexane-1,2-diglycidyl ester monomer. Alternatively or preferably, the monomer can be a mixture of a methacrylic silicone modified epoxy monomer, a methacrylic hydantoin epoxy monomer, and a methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer
Polymerization inhibitors, which may also be referred to as stabilizers, may be used to prevent polymerization of the monomers during non-use (e.g., purification, storage and/or transportation) overcharge, thereby affecting the performance of the anaerobic sealant. It is known that although oxygen can act as a barrier to some extent, it does not guarantee good storage stability of the anaerobic sealant. Therefore, the polymerization inhibitor is added to further prevent the monomer from polymerizing, so as to achieve the purpose of long-term storage. In some embodiments, the polymerization inhibitor may be selected from one or more of a phenol, a quinone, an oxime, an azo compound, or an amine (which may be referred to as a second amine in some embodiments). Exemplary phenols include phenol, halophenols, nitrophenols, hydrocarbylphenols, benzenediols, halophenols, hydrocarbylbenzenediols, benzenetriols, naphthols, naphthalenediols, and the like. Alternatively or preferably, the phenol may be hydroquinone, N-nitrophenol or 2,4,6-trinitrophenol. Exemplary quinones can include benzoquinones (e.g., ortho-benzoquinone and para-benzoquinone), as well as naphthoquinones, anthraquinones, phenanthraquinones, and the like. Alternatively or preferably, the quinone may be benzoquinone. Exemplary oximes include dimethyl ketoxime, methyl ethyl ketoxime, cyclohexanone oxime, diphenyl ketoxime, acetaldoxime, salicylaldoxime, diphenylglyoxyloxime, butyraldoxime, methylglyoxaldoxime, 1,2-cyclohexanedione dioxime, p-benzoquinone dioxime and the like. Alternatively or preferably, the oxime may be p-benzoquinone dioxime. Exemplary azo compounds include azobisisovaleronitrile, 4-methoxyazobenzene, p-nitroanilioazobenzene, 2,2' -dihydroxyazobenzene, p-diaminoazobenzene, azotert-butane, and the like. Exemplary second amines may include one or more of aliphatic amines, aromatic amines or halogenated, hydrocarbon-based or thio compounds thereof. Alternatively or preferably, the second amine may be N-nitrosodiphenylamine or thiodiphenylamine (which may also be referred to as phenothiazine).
In some embodiments, the monomer-inhibitor mixture may be obtained by uniformly mixing the monomer and the inhibitor. In some embodiments, the polymerization inhibitor may be added into the reaction system during the synthesis of the monomer, and is retained after reaction and post-treatment without participating in the synthesis of the monomer. The monomer-inhibitor mixture can finally be obtained after the end of the monomer synthesis. The amount of the polymerization inhibitor added is very small and the mass thereof can be omitted compared to the monomer. Reference may be made to the examples section of this application for further description of the monomer-polymerization inhibitor.
In some embodiments, the polymerization inhibitor may include a portion mixed with the monomer, and may further include a first polymerization inhibitor and a second polymerization inhibitor. The first inhibitor may be 2,4,6-trinitrophenol and the second inhibitor may be p-benzoquinone dioxime.
The initiator may be a component for initiating polymerization of the monomer. After air exclusion, the initiator can generate free radicals, causing the monomers to polymerize. During the storage process, free radicals generated by the initiator are continuously consumed under the action of oxygen and a polymerization inhibitor (stabilizer), so that the anaerobic sealant fails after polymerization. In some embodiments herein, the initiator may be selected from organic peroxides. <xnotran> (, , , , , , , ( ) , ), (, 3525 zxft 3525- -3735 zxft 3735- ( ) -3, 3856 zxft 3856- -5283 zxft 5283- , , ), (, , 5329 zxft 5329- , ), (, , 5657 zxft 5657- ( ) , 3264 zxft 3264- ( ) , 3282 zxft 3282- -3434 zxft 3434- , 3825 zxft 3825- -3638 zxft 3638- -3724 zxft 3724- ), (, , , , -2- , , -2- , , , 4924 zxft 4924- ( ) , , (2- ) , </xnotran> Bis (4-t-butylcyclohexyl) peroxydicarbonate, t-butyl peroxyacetate, t-butyl acetate peroxide, t-butyl benzoate peroxide, t-butyl peroxy-3,5,5-trimethylhexanoate, t-butyl peroxy isobutyrate, t-butyl peroxy-2-ethylhexanoate, t-amyl peroxy-2-ethylhexanoate, t-butyl peroxypivalate, t-amyl peroxypivalate, isopropylphenyl peroxyneodecanoate, t-butyl peroxyneodecanoate, etc.), peroxydicarbonate (e.g., dicetyl peroxydicarbonate, ditetradecyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di- (2-ethylhexyl) peroxydicarbonate, etc.), and the like. Alternatively or preferably, the initiator may comprise one or more of di-t-butyl peroxide, benzoyl peroxide, cumene hydroperoxide, methyl ethyl ketone peroxide, t-butyl peroxybenzoate, t-butyl peroxypivalate, t-butyl peroxyacetate, t-butyl peroxybenzoate, and cumene peroxide. Alternatively or preferably, the initiator may be cumene hydroperoxide.
The accelerator may be a component for accelerating the curing reaction. The accelerator, when air excluded, can promote rapid polymerization of the initiated monomer (e.g., the monomer from which polymerization is initiated). The initiator does not affect the storage period and the bonding strength of the anaerobic sealant while realizing the initiation function. In some embodiments of the present application, the anaerobic sealant includes a first accelerator and a second accelerator. The first accelerator and the second accelerator may be respectively selected from one or more of amines (which may be referred to herein as first amines in some embodiments), hydrazine and derivatives thereof, thiols, or organic diacids (which may be referred to herein as first organic diacids in some embodiments). Exemplary first amines may include one or more of aliphatic amines, aromatic amines or halogenated, hydrocarbon-based or thio compounds thereof. Alternatively or preferably, the first amine may be one or more of triethylamine, N-dimethylaniline, N-diethyl-p-toluidine, aminopyridine, 1,2,3,4-tetrahydroquinoline, 1,2-propanediamine, triethanolamine, dimethylamide. Alternatively or preferably, the first amine may be triethylamine or N, N-dimethylaniline. Exemplary hydrazines and derivatives thereof include hydrazine, phenylhydrazine, substituted phenylhydrazines, hydrazides, substituted hydrazides, and the like. Alternatively or preferably, the hydrazine and derivatives thereof may be phenylhydrazine. Exemplary thiols can include alkyl thiols (e.g., methyl mercaptan, ethyl mercaptan, dodecyl mercaptan, etc.), aromatic thiols (e.g., benzyl thiol, p-hydroxyphenylthiol, p-nitrobenzothiophenol, etc.). Alternatively or preferably, the mercaptan may be dodecyl mercaptan. Exemplary first organic diacids can include aliphatic diacids (e.g., alkane diacids such as oxalic acid, malonic acid, succinic acid, and the like, alkene diacids such as butenedioic acid, hexadiene diacid, and the like), aromatic diacids (e.g., phenyl diacids such as phthalic acid, phenylenediacetic acid, phenylenedipropionic acid, and the like). Alternatively or preferably, the first organic diacid may be oxalic acid. In some embodiments herein, the first promoter may be oxalic acid and the second promoter may be N, N-dimethylaniline.
The co-accelerator may be a component for enhancing the effect of the accelerator, which does not have a significant accelerating effect when used alone, and can significantly enhance the effect of the accelerator when used together with the accelerator. In some embodiments of the present application, the co-promoter may be selected from a saccharinate or a second organic diacid. The saccharin salt can be the salt formed by the reaction of saccharin (chemical name of o-benzoylsulfonimide) and other substances. Illustratively, the saccharinate salts may include SQ salts (salifying saccharin with an amine such as a tertiary amine), STQ salts (salifying saccharin with 1,2,3,4-tetrahydroquinoline), SMQ salts (salifying saccharin with 6-methyl-1,2,3,4-tetrahydroquinoline), SQA salts (salifying saccharin with 1,2,3,4-tetrahydroquinoline), and the like. Alternatively or preferably, the saccharinate salt may be a SQ salt. The second organic diacid can also include, in the same or similar manner, aliphatic diacids (e.g., alkane diacids such as oxalic acid, malonic acid, succinic acid, etc., alkene diacids such as butenedioic acid, adipic acid, etc.), aromatic diacids (e.g., phenyl diacids such as phthalic acid, phenylenediacetic acid, phenylenedipropionic acid, etc.) as compared to the first organic diacid. Alternatively or preferably, the second organic diacid may be maleic acid. In some embodiments of the present application, the anaerobic sealant can further include a filler. The fillers may include polymers, fibers, metals and their oxides, silicates, and the like. Alternatively or preferably, the filler may comprise one or more of titanium dioxide, polytetrafluoroethylene or polyparaphenylene benzobisoxazole. Alternatively or preferably, the filler is a mixture of titanium dioxide, polytetrafluoroethylene and polyparaphenylene benzobisoxazole. Wherein, the mesh number of the titanium dioxide can be 200 meshes, 300 meshes, 400 meshes, 500 meshes and the like. Alternatively or preferably, the mesh number of the titanium dioxide may be 400 mesh. The polytetrafluoroethylene may have an average particle size of 10 to 50 μm. Alternatively or preferably, the mean particle size of the polytetrafluoroethylene may be 15-40 μm. Alternatively or preferably, the mean particle size of the polytetrafluoroethylene may be 20-30 μm. Alternatively or preferably, the mean particle size of the polytetrafluoroethylene may be 20-25 μm. The average particle size of the polyparaphenylene benzobisoxazole can be 10 to 50 μm. Alternatively or preferably, the average particle size of the polyparaphenylene benzobisoxazole can be 15 to 40 μm. Alternatively or preferably, the average particle size of the polyparaphenylene benzobisoxazole can be 20 to 30 μm. Alternatively or preferably, the average particle size of the polyparaphenylene benzobisoxazole can be 20 to 25 μm.
In some embodiments of the present application, the anaerobic sealant can further comprise a solvent. The solvent may include acrylic acid or methacrylic acid. Alternatively or preferably, the solvent may be acrylic acid.
In some embodiments of the present application, the mass ratio (in parts by weight) of the monomer-polymerization inhibitor mixture, the initiator, the first accelerator, the second accelerator, the auxiliary accelerator, the first polymerization inhibitor and the second polymerization inhibitor is 100:1.6-2.0:0.33-0.35:0.8-1.0:0.04-0.05:0.10-0.11:0.014-0.015.
In some embodiments, the monomer-inhibitor mixture comprises the methacrylic silicone modified epoxy monomer, the methacrylic hydantoin epoxy monomer, and the methacrylic acid cyclohexane-1,2-diglycidyl ester monomer in a mass ratio of 20-100:0-40:0-40. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 20. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 25. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 33.33. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 40. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 42.5. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 45. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 50. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 50. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 50. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 60. Alternatively or preferably, the mass ratio of the methacrylic silicone modified epoxy resin monomer, the methacrylic hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 100.
Alternatively or preferably, the mass portion of the initiator in the anaerobic sealant can be 1.6, 1.8, 2.0 and the like. The mass ratio of the first accelerant in the anaerobic sealant can be 0.33, 0.34, 0.35 and the like. The mass parts of the second accelerant in the anaerobic sealant can be 0.8, 0.9 and 1.0. The mass part of the auxiliary accelerator in the anaerobic sealant can be 0.04 or 0.05. The mass part of the first polymerization inhibitor in the anaerobic sealant can be 0.10 or 0.11. The mass part of the second polymerization inhibitor in the anaerobic sealant can be 0.014 or 0.015.
In some embodiments of the present application, the anaerobic sealant may be composed of the monomer-polymerization inhibitor mixture, the initiator, the first accelerator, the second accelerator, the auxiliary accelerator, the first polymerization inhibitor, the second polymerization inhibitor, the filler and the solvent. The monomer-polymerization inhibitor mixture, the initiator, the first accelerator, the second accelerator, the co-accelerator, the first polymerization inhibitor, and the second polymerization inhibitor may include those described above. The filler may be composed of titanium dioxide, polytetrafluoroethylene, and polyparaphenylene benzobisoxazole. The mass portion of the titanium dioxide in the anaerobic sealant can be 10-20. E.g., 10, 15, 20, etc. The mass portion of the polytetrafluoroethylene in the anaerobic sealant can be 15-20. For example 15 or 20. The mass portion of the poly-p-phenylene benzobisoxazole in the anaerobic sealant can be 18-20. E.g., 18, 19, 20, etc. The solvent may be acrylic acid. The mass portion of the acrylic acid in the anaerobic sealant can be 10.
Some embodiments of the application disclose a preparation method of the anaerobic sealant. The preparation method comprises the following steps. First, one or more monomer-inhibitor mixtures are mixed homogeneously. The monomer-inhibitor mixture may be obtained during the preparation of the monomer. Wherein, the polymerization inhibitor can be added into the reaction system in the preparation process of the monomer, but does not participate in the reaction. After the post-treatment, a monomer-retarder mixture is obtained. The desired monomer-inhibitor mixture can be added to a reaction vessel such as a reaction kettle or beaker, flask, etc. and mixed with stirring until well mixed. And secondly, adding the first accelerator, the auxiliary accelerator, the first polymerization inhibitor and the second polymerization inhibitor, and stirring for a first time period until the mixture is uniformly mixed. The first period of time may be a predetermined period of time. For example, 10min, 20min, 30min, 40min, 50min, 60min, etc. The first time period can also be adjusted according to actual conditions. For example, it is suitably lengthened or shortened depending on the mixing conditions. And thirdly, adding the filler and stirring for a second time period until the mixture is uniformly mixed. Similarly or similarly, the second time period may also be a preset time period, for example, 1h, 2h, 3h, etc. And fourthly, adding a second promoter, an initiator and a solvent, and uniformly stirring until no precipitate exists to obtain the anaerobic sealant. Wherein, the components and the amount of the components can be referred to the relevant parts of the previous description.
Examples
The present application is further illustrated by the following examples. The application is not limited by these examples.
EXAMPLE 1 preparation of methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer-retarder mixture
The reactants were obtained based on the following formulation:
100 grams of cyclohexane-1,2-diglycidyl ester were weighed into a four-neck flask. Heating, and adding 0.0665 g of hydroquinone when the temperature in the bottle reaches 60 ℃. 53.90 g of methacrylic acid are weighed out and added at an internal temperature of 60 ℃. When the internal temperature reached 70 ℃, 1.7mL of triethylamine was added and mixed. The temperature is adjusted to 80-85 ℃ and the reaction lasts for 3 hours. Heating to 95-100 ℃ and reacting for 5h. After the reaction is finished, cooling to normal temperature, and putting into a polyethylene barrel. The reaction mechanism is as follows:
EXAMPLE 2 preparation of a methacrylic Silicone modified epoxy monomer-Polymer mixture
The reactants were obtained based on the following formulation:
100 g of organic silicon epoxy resin is added into a four-neck flask, the mixture is heated to melt the organic silicon epoxy resin, 0.065 g of hydroquinone serving as a polymerization inhibitor is added into the four-neck flask when the internal temperature reaches 60 ℃, and then 48 g of methacrylic acid is weighed and added when the internal temperature reaches 60 ℃. And (3) gradually heating to an internal temperature of 70 ℃, adding 2mL of triethylamine, uniformly mixing, adjusting the temperature to 85-90 ℃, reacting for 3h, continuously heating to 90-95 ℃, reacting for 4h until the reaction is finished, and pouring into a polyethylene barrel while the reaction is hot. The reaction mechanism is as follows:
example 3-4) preparation of hydantoin methacrylate epoxy monomer-Polymer mixture
The reactants were obtained based on the following formulation:
100 g of hydantoin epoxy resin is put into a four-neck flask, heated, when the internal temperature reaches 60 ℃, 0.063 g of polymerization inhibitor hydroquinone is added into the four-neck flask, and then 46 g of methacrylic acid is weighed and added at the internal temperature of 60 ℃. And (3) gradually heating to an internal temperature of 70 ℃, adding 1.6mL of triethylamine, uniformly mixing, adjusting the temperature to 85-90 ℃, reacting for 3h, continuously heating to 90-95 ℃, keeping the temperature, reacting for 4h until the reaction is finished, and pouring into a polyethylene barrel for later use while the solution is hot to prepare the methacrylic acid-hydantoin epoxy resin monomer. The reaction mechanism is as follows:
EXAMPLE 4 preparation of anaerobic sealant
Anaerobic sealant S1: 20 parts of a monomer A-polymerization inhibitor mixture (methacrylic acid organic silicon epoxy resin monomer-polymerization inhibitor mixture) is added into a flask under stirring, 40 parts of a monomer B-polymerization inhibitor mixture (methacrylic acid hydantoin epoxy resin monomer-polymerization inhibitor mixture) is added, 40 parts of a monomer C-polymerization inhibitor mixture (cyclohexane methacrylate 1,2-diglyceride monomer-polymerization inhibitor mixture) is added, blending and stirring are carried out for 30min, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of salified saccharin (insoluble) and tertiary amine (SQ salt) are added, and stirring is carried out uniformly for 30min. Adding filler TiO of 400 meshes 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly (p-phenylene benzobisoxazole) (20-25 mu m), uniformly stirring for 1h, finally adding 1 part of dimethylaniline, 2 parts of cumyl hydroperoxide and 10 parts of acrylic acid, and uniformly stirring without precipitate.
Anaerobic sealant S2: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 25 parts of monomer A-polymerization inhibitor mixture, 35 parts of monomer B-polymerization inhibitor mixture, 40 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying salt (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S3: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 33.3 parts of monomer A-polymerization inhibitor mixture, 33.3 parts of monomer B-polymerization inhibitor mixture, 33.3 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying agent (SQ salt), and 400-mesh TiO 2 20 portions of polytetrafluoroethylene (20 to 25 mu m), and poly-p-phenylene benzobisoxazole20 parts of oxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumyl hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S4: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 40 parts of monomer A-polymerization inhibitor mixture, 30 parts of monomer B-polymerization inhibitor mixture, 30 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying salt (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S5: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 42.5 parts of monomer A-polymerization inhibitor mixture, 32.5 parts of monomer B-polymerization inhibitor mixture, 25 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying salt (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S6: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 45 parts of monomer A-polymerization inhibitor mixture, 32.5 parts of monomer B-polymerization inhibitor mixture, 22.5 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salification (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S7: the preparation process is the same as that of the anaerobic sealant S1, wherein the components in parts by mass are as follows: 50 parts of monomer A-polymerization inhibitor mixture, 25 parts of monomer B-polymerization inhibitor mixture, 25 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol and p-benzoquinone dioxime0.15 part of saccharin (insoluble) and tertiary amine salification (SQ salt) 0.05 part of 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S8: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 50 parts of monomer A-polymerization inhibitor mixture, 30 parts of monomer B-polymerization inhibitor mixture, 20 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying salt (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S9: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 50 parts of monomer A-polymerization inhibitor mixture, 20 parts of monomer B-polymerization inhibitor mixture, 30 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying salt (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S10: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 50 parts of monomer A-polymerization inhibitor mixture, 25 parts of monomer B-polymerization inhibitor mixture, 25 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying salt (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S11: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: monomer A-inhibitor mixture60 parts, 20 parts of monomer B-polymerization inhibitor mixture, 20 parts of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salification (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
Anaerobic sealant S12: the preparation process is the same as that of the anaerobic sealant S1, wherein the anaerobic sealant comprises the following components in parts by weight: 100 parts of monomer A-polymerization inhibitor mixture, 0 part of monomer B-polymerization inhibitor mixture, 0 part of monomer C-polymerization inhibitor mixture, 0.35 part of oxalic acid, 0.11 part of 2,4,6-trinitrophenol, 0.15 part of p-benzoquinone dioxime, 0.05 part of saccharin (insoluble) and tertiary amine salifying salt (SQ salt), and 400-mesh TiO 2 20 parts of polytetrafluoroethylene (20-25 mu m), 20 parts of poly-p-phenylene benzobisoxazole (20-25 mu m), 1 part of dimethylaniline, 2 parts of cumene hydroperoxide and 10 parts of acrylic acid.
EXAMPLE 5 anaerobic sealant Performance testing
1> tensile shear strength: testing the tensile shear strength of the anaerobic sealant according to GB/T7124-2008;
2> viscosity test: performing anaerobic sealant viscosity test according to GB/T2794-2013
3> Heat resistance test: the anaerobic sealant is prepared into a sealant rod (the diameter is 25mm, the length is 100 mm), the anaerobic sealant is heated for 10 hours at different temperatures, and the shrinkage rate of the sealant rod is measured. When the shrinkage rate of the sealant rod is 0-0.1% at a certain temperature, the anaerobic sealant can be determined to be resistant to the temperature.
4> flame retardancy test: the flame retardancy test of anaerobic sealants was conducted using the flame test method of ANSI/UL94-1979 plastics, USA.
The results are shown in Table 1.
TABLE 1 anaerobic sealant Performance test results
As shown in Table 1, the test results show that the tensile shear strength of the anaerobic sealants S1-S12 can reach 20MPa on average, the heat resistance is more than 200 ℃, and particularly the heat resistance of S9-S12 is more than 300 ℃. And the anaerobic sealants S1-S12 have good flame retardance.
The anaerobic sealant disclosed by the application has the advantages of good dielectric property, high thermal aging resistance, high internal pressure resistance and certain adhesion.
Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered merely illustrative and not restrictive of the broad application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Such alterations, modifications, and improvements are intended to be suggested in some embodiments of this application and are intended to be within the spirit and scope of the exemplary embodiments of this application.
Also, this application uses specific language to describe embodiments of the application. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the present application is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "one embodiment," "an embodiment," or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.
Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.
Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows a variation of ± 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.
The entire contents of each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, are hereby incorporated by reference into this application. Except where the application is filed in a manner inconsistent or contrary to the present disclosure, and except where the claim is filed in its broadest scope (whether present or later appended to the application) as well. It is noted that the descriptions, definitions and/or use of terms in this application shall control if they are inconsistent or contrary to the statements and/or uses of the present application in the material attached to this application.
Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of the present application. Thus, by way of example, and not limitation, alternative configurations of the embodiments of the present application can be viewed as being consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to only those embodiments explicitly described and depicted herein.
Claims (13)
1. An anaerobic sealant, which is characterized by comprising:
a monomer-inhibitor mixture;
an initiator selected from one or more of organic peroxides;
the first accelerator and the second accelerator are respectively selected from one or more of first amine, hydrazine and derivatives thereof, mercaptan or first organic dibasic acid;
the auxiliary accelerator is selected from one or more of saccharine salt or second organic dibasic acid; and
the first polymerization inhibitor and the second polymerization inhibitor are respectively selected from one or more of phenol, quinone, oxime, azo compounds or second amine;
wherein the mass ratio of the monomer-polymerization inhibitor mixture, the initiator, the first accelerator, the second accelerator, the auxiliary accelerator, the first polymerization inhibitor and the second polymerization inhibitor is 100:1.6-2.0:0.33-0.35:0.8-1.0:0.04-0.05:0.10-0.11:0.014-0.015.
2. The anaerobic sealant according to claim 1, wherein the monomer in the monomer-polymerization inhibitor mixture comprises methacrylic acid monomer, including one or more of methacrylic acid, bisphenol a methacrylate epoxy resin monomer, polyether methacrylate epoxy resin monomer, tetrahydrofurfuryl methacrylate monomer, novolac methacrylate epoxy resin monomer, polybutadiene methacrylate epoxy resin monomer, silicone modified methacrylate epoxy resin monomer, hydantoin methacrylate epoxy resin monomer, cyclohexane-1,2-diglycidyl ester monomer.
3. The anaerobic sealant according to claim 2, wherein the methacrylic acid monomer is a mixture of methacrylic acid silicone modified epoxy resin monomer, methacrylic acid hydantoin epoxy resin monomer and methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer, and the mass ratio of the methacrylic acid silicone modified epoxy resin monomer, the methacrylic acid hydantoin epoxy resin monomer and the methacrylic acid-cyclohexane-1,2-diglycidyl ester monomer is 20-100%:0-40%:0 to 40 percent.
4. The anaerobic sealant according to any of claims 1-3, wherein the organic peroxide comprises one or more of di-t-butyl peroxide, benzoyl peroxide, cumene hydroperoxide, methyl ethyl ketone peroxide, t-butyl peroxybenzoate, t-butyl peroxypivalate, t-butyl acetate peroxide, t-butyl benzoate peroxide, and cumene peroxide.
5. The anaerobic sealant according to claim 4, wherein the organic peroxide is cumene hydroperoxide.
6. The anaerobic sealant according to any one of claims 1 to 3 or 5 wherein the first amine comprises one or more of triethylamine, N-dimethylaniline, N-diethylparatoluidine, α -aminopyridine, 1,2,3,4-tetrahydroquinoline, 1,2-propanediamine, triethanolamine, dimethylamide.
7. The anaerobic sealant according to claim 6, wherein the first amine is triethylamine or N, N-dimethylaniline, the hydrazine and the derivative thereof are phenylhydrazine, the mercaptan is dodecyl mercaptan, and the first organic dibasic acid is oxalic acid.
8. The anaerobic sealant according to any one of claims 1 to 3 or claim 7 wherein the saccharinate salt comprises one or more of SQ, STQ, SMQ salts.
9. The anaerobic sealant according to claim 8 wherein the saccharinate salt is SQ salt and the second organic diacid is maleic acid.
10. The anaerobic sealant according to any one of claims 1 to 3 or 9, wherein the phenol is hydroquinone or N-nitrophenol, the quinone is p-benzoquinone, the oxime is p-benzoquinone dioxime, and the second amine is N-nitrosodiphenylamine or sulfide diphenylamine.
11. The anaerobic sealant according to claim 10, further comprising a filler, wherein the filler comprises one or more of titanium dioxide, polytetrafluoroethylene or poly-p-phenylene benzobisoxazole.
12. The anaerobic sealant according to claim 11 wherein said anaerobic sealant further comprises a solvent, said solvent being methacrylic acid or acrylic acid.
13. A process for preparing an anaerobic sealant according to any one of claims 1 to 12, wherein said process comprises:
mixing one or more monomer-polymerization inhibitor mixtures uniformly;
adding a first accelerator, an auxiliary accelerator, a first polymerization inhibitor and a second polymerization inhibitor, and stirring for a first time period until the mixture is uniformly mixed;
adding the filler and stirring for a second time period until the mixture is uniformly mixed;
adding a second promoter, an initiator and a solvent, and uniformly stirring until no precipitate exists to obtain the anaerobic sealant.
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US4235986A (en) * | 1979-04-02 | 1980-11-25 | National Starch And Chemical Corporation | Anaerobic curing adhesive composition and process for making same |
CN112608702A (en) * | 2020-12-03 | 2021-04-06 | 迪马新材料科技(苏州)有限公司 | Double-component acrylic acid modified epoxy adhesive and preparation process thereof |
CN114032037A (en) * | 2021-11-26 | 2022-02-11 | 迪马新材料科技(苏州)有限公司 | Anaerobic sealant and preparation method thereof |
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US4235986A (en) * | 1979-04-02 | 1980-11-25 | National Starch And Chemical Corporation | Anaerobic curing adhesive composition and process for making same |
CN112608702A (en) * | 2020-12-03 | 2021-04-06 | 迪马新材料科技(苏州)有限公司 | Double-component acrylic acid modified epoxy adhesive and preparation process thereof |
CN114032037A (en) * | 2021-11-26 | 2022-02-11 | 迪马新材料科技(苏州)有限公司 | Anaerobic sealant and preparation method thereof |
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