CN115156112A - Power supply for high-speed internet of things - Google Patents
Power supply for high-speed internet of things Download PDFInfo
- Publication number
- CN115156112A CN115156112A CN202210599951.XA CN202210599951A CN115156112A CN 115156112 A CN115156112 A CN 115156112A CN 202210599951 A CN202210599951 A CN 202210599951A CN 115156112 A CN115156112 A CN 115156112A
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- Prior art keywords
- power supply
- equipment power
- main body
- cleaning
- things
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- 238000009434 installation Methods 0.000 claims abstract description 37
- 238000004140 cleaning Methods 0.000 claims description 83
- 230000017525 heat dissipation Effects 0.000 claims description 32
- 239000000428 dust Substances 0.000 description 11
- 238000004891 communication Methods 0.000 description 4
- 230000006855 networking Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/16—Rigid blades, e.g. scrapers; Flexible blades, e.g. wipers
- B08B1/165—Scrapers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a power supply for high-speed internet of things, which comprises an equipment power supply main body, wherein two device installation base blocks are symmetrically arranged at the left end of the equipment power supply main body, a push-pull structure is arranged on the two device installation base blocks, the push-pull structure comprises a connecting base plate, two connecting support plates, two connecting columns and a spring baffle, the connecting support plates are uniformly arranged at the inner ends of the connecting base plates, the two connecting columns are symmetrically arranged at the lower ends of the connecting base plates, the two spring baffles are respectively arranged at the lower ends of the two connecting columns, and a reset spring is sleeved on each connecting column. The invention relates to a power supply for high-speed Internet of things, which belongs to the field of power supplies.
Description
Technical Field
The invention relates to the field of power supplies, in particular to a power supply for high-speed internet of things.
Background
The internet of things is that any object is connected with a network through information sensing equipment according to an agreed protocol, and the object performs information exchange and communication through an information transmission medium so as to realize functions of intelligent identification, positioning, tracking, supervision and the like. The concept of the internet of things is a network concept which extends and expands the user side of the internet concept to any article to carry out information exchange and communication. The definition is as follows: any article is connected with the Internet through information sensing equipment such as Radio Frequency Identification (RFID), an infrared sensor, a global positioning system, a laser scanner and the like according to an agreed protocol to carry out information exchange and communication, so that a network concept of intelligent identification, positioning, tracking, monitoring and management is realized.
A power supply is a device that converts other forms of energy into electrical energy and provides the electrical energy to an electrical circuit (electronic device). The power supply can be divided into a common power supply and a special power supply, and the common power supply can be subdivided into: switching power supplies, inverter power supplies, regulated ac power supplies, regulated DC power supplies, DC/DC power supplies, communication power supplies, modular power supplies, variable frequency power supplies, UPS power supplies, EPS emergency power supplies, clean power supplies, PC power supplies, rectifier power supplies, custom power supplies, heating power supplies, welding power/arc power supplies, electroplating power supplies, network power supplies, power operated power supplies, adapter power supplies, linear power supplies, power controllers/drivers, power supplies, other common power supplies, parametric power supplies, regulated voltage power supplies, transformer power supplies. Unlike linear power supplies, which operate power transistors in a linear mode, PWM switching power supplies operate power transistors in on and off states in which the volt-An Chengji applied to the power transistors is very small (low voltage, high current when on; high voltage, low current when off)/volt-ampere product on the power devices is the loss generated on the power semiconductor devices.
The equipment that constitutes high-speed thing networking mostly needs the power to be its rectification when using, vary voltage steady voltage and filtering are anti-jamming, the power of current high-speed thing networking equipment is in order to have good heat dissipation function, can set up numerous louvres on power shell often, but when high-speed thing networking equipment is outdoor when using, because outdoor dust is great, the gap adhesion that the dust passes high-speed thing networking equipment shell junction easily is to the inner wall of power louvre, and then can influence the radiating effect of power, so need carry out periodic clearance to the louvre, in order to avoid the power to damage because of heat dispersion worsens, but current power is because there is not corresponding cleaning device, thereby make the power louvre can only unpack the power apart clean when needs are clean, finally make the cleaning efficiency of power louvre relatively poor.
Disclosure of Invention
The invention aims to provide a power supply for a high-speed internet of things, which can be used for cleaning a heat dissipation through hole formed in an equipment power supply main body without disassembling the equipment power supply main body when the heat dissipation through hole is required to be cleaned by arranging a first cleaning device and a second cleaning device, so that the cleaning efficiency of the heat dissipation through hole formed in the equipment power supply main body is finally improved, the first cleaning device can be conveniently pushed upwards by arranging a push-pull structure, dust adhered in the heat dissipation through hole can be conveniently pushed out by using the first cleaning device, and the first cleaning device cannot be moved upwards to block the heat dissipation through hole when the first cleaning device is not required to be used by arranging a reset spring.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a power for high-speed thing allies oneself with, includes equipment power main part, two device installation base blocks are installed to the left end symmetry of equipment power main part, two install a push-and-pull structure on the device installation base block, the push-and-pull structure contains connection base plate, joint support board, spliced pole and spring baffle, the joint support board has a plurality of and evenly installs the inner at connection base plate, the spliced pole has two and the symmetry installs the lower extreme at connection base plate, spring baffle has two and installs respectively at the lower extreme of two spliced poles, two all overlap and be equipped with a reset spring on the spliced pole, install a cleaning device in the equipment power main part, a cleaning device installs on the push-and-pull structure, a cleaning device contains clearance roof, roof support column and connected frame, the roof support column has a plurality of and evenly installs the upper end at connected frame, the clearance roof has a plurality of and installs the upper end at a plurality of roof support column respectively, sliding mounting of the upper end of equipment power main part has No. two cleaning device, no. two cleaning device contains clearance scraper blade and T shape connecting block, T shape connecting block has two and the symmetry installs the lower extreme at the clearance scraper blade.
Further, two T shape spouts have been seted up to the upper end symmetry of equipment power main part, a plurality of heat dissipation through-hole has evenly been seted up to the upper end of equipment power main part, the heat dissipation through-hole runs through the upper end of equipment power main part rather than the inner wall, a plurality of the heat dissipation through-hole is located between two T shape spouts, the installation fixed orifices has been seted up in the equipment power main part, a plurality of connection spout, a plurality of have evenly been seted up to the left end of equipment power main part it all runs through the left end of equipment power main part rather than the inner wall to connect the spout.
Furthermore, the two device installation base blocks are fixedly installed at the left end of the equipment power supply main body through screws, the two device installation base blocks are located below a connecting sliding groove formed in the left end of the equipment power supply main body, an installation through hole is formed in each of the two device installation base blocks, and the two installation through holes respectively penetrate through the upper end and the lower end of each of the two device installation base blocks.
Furthermore, the connecting substrate and the connecting support plate on the push-pull structure are of an integrally formed structure, the connecting substrate is located at the upper ends of the two device installation base blocks, the connecting support plates respectively and inwards penetrate through the connecting chutes which are uniformly formed in the left end of the equipment power supply main body, the connecting columns and the spring baffles are of an integrally formed structure, the two spring baffles are respectively located below the two device installation base blocks, the two connecting columns upwards penetrate through the two installation through holes formed in the device installation base blocks respectively, and the connecting columns are fixedly connected with the connecting substrate through screws after penetrating through the installation through holes.
Further, the two return springs are respectively positioned below the two device mounting base blocks.
Furthermore, the cleaning top plate, the top plate supporting columns and the connecting frame on the cleaning device are of an integrally formed structure, the connecting frame is fixedly installed on a plurality of connecting supporting plates arranged on the push-pull structure through screws, and the cleaning top plate is located below a plurality of heat dissipation through holes evenly formed in the upper end of the equipment power supply main body respectively.
Furthermore, a cleaning scraper on the second cleaning device is positioned at the upper end of the equipment power supply main body, the two T-shaped connecting blocks are respectively positioned in two T-shaped sliding grooves symmetrically formed in the upper end of the equipment power supply main body, and the cleaning scraper and the T-shaped connecting blocks are of an integrally formed structure.
Compared with the prior art, the invention has the following beneficial effects:
by arranging the first cleaning device and the second cleaning device, when the heat dissipation through hole formed in the equipment power supply main body needs to be cleaned, the equipment power supply main body can be cleaned without being disassembled, so that the cleaning efficiency of the heat dissipation through hole formed in the equipment power supply main body is finally improved; by arranging the push-pull structure, the first cleaning device can be conveniently pushed upwards, and finally, the first cleaning device is conveniently used for pushing out dust adhered in the heat dissipation through hole; through setting up reset spring, can not upwards remove the jam heat dissipation through-hole when not needing to make a cleaning device.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the main power supply body of the apparatus and the device mounting base block of the present invention;
FIG. 3 is a schematic structural view of the push-pull structure, the return spring and the first cleaning device of the present invention;
FIG. 4 is a schematic view of a first cleaning device according to the present invention;
FIG. 5 is a schematic view of the push-pull mechanism and the return spring of the present invention;
fig. 6 is a schematic structural view of the second cleaning device of the present invention.
In the figure: 1. a device power supply main body; 2. a device mounting base block; 3. a push-pull structure; 4. a return spring; 5. a first cleaning device; 6. a second cleaning device; 7. a T-shaped chute; 8. a heat dissipating through hole; 9. mounting a fixing hole; 10. connecting the sliding chute; 11. mounting a through hole; 12. connecting the substrates; 13. connecting the supporting plate; 14. connecting columns; 15. a spring retainer; 16. cleaning the top plate; 17. a top plate support post; 18. a connecting frame; 19. cleaning a scraper; 20. t-shaped connecting blocks.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example 1:
referring to fig. 1 and 2, a power supply for a high-speed internet of things, includes an apparatus power supply main body 1, two T-shaped chutes 7 are symmetrically formed in an upper end of the apparatus power supply main body 1, a plurality of heat dissipation through holes 8 are uniformly formed in the upper end of the apparatus power supply main body 1, the heat dissipation through holes 8 penetrate through the upper end of the apparatus power supply main body 1 and an inner wall thereof, the heat dissipation through holes 8 are located between the two T-shaped chutes 7, an installation fixing hole 9 is formed in the apparatus power supply main body 1, a plurality of connection chutes 10 are uniformly formed in a left end of the apparatus power supply main body 1, the left end of the apparatus power supply main body 1 and the inner wall thereof are penetrated through by the plurality of connection chutes 10, two device installation base blocks 2 are symmetrically installed on the left end of the apparatus power supply main body 1, the two device installation base blocks 2 are both fixedly installed at the left end of the apparatus power supply main body 1 through screws, the two device installation base blocks 2 are both located below the connection chutes 10 formed in the left end of the apparatus power supply main body 1, one installation through hole 11 is formed in the two device installation base blocks 2, and the two installation through holes 11 respectively penetrate through an upper end and a lower end of the two installation base blocks 2.
Example 2:
referring to fig. 1, 3, 4, 5 and 6, a push-pull structure 3 is installed on two device mounting base blocks 2, the push-pull structure 3 includes a connection base plate 12, a connection support plate 13, a connection post 14 and a spring baffle 15, the connection support plate 13 has a plurality of connection support plates which are uniformly installed at the inner end of the connection base plate 12, the connection post 14 has two connection chutes 10 which are symmetrically installed at the lower end of the connection base plate 12, the spring baffle 15 has two connection base plates 12 and the connection support plate 13 which are respectively installed at the lower ends of the two connection posts 14, the connection base plate 12 is located at the upper ends of the two device mounting base blocks 2, the connection support plates 13 respectively penetrate through a plurality of connection sliding grooves 10 uniformly opened at the left end of a device power supply main body 1, the connection post 14 and the spring baffle 15 are integrally formed, the two spring baffles 15 are respectively located below the two device mounting base blocks 2, the two connection post 14 upwardly respectively penetrate through two mounting through holes 11 opened in the device mounting base blocks 2, the connection base plate 12 and are fixedly connected with the connection through screws, a reset spring baffle 4 is sleeved on the two connection top plates 14, the top of the two device mounting base blocks 4, the top plate 16 is located on the device mounting base blocks 2, a cleaning device 16, the top plate 16 is installed on the frame 16, the cleaning device 16 is installed at the top of a cleaning device 16, the top cleaning device 16, the cleaning device 16 is installed on the cleaning frame 16, the connecting frame 18 is fixedly installed on a plurality of connecting support plates 13 arranged on the push-pull structure 3 through screws, a plurality of cleaning top plates 16 are respectively located below a plurality of heat dissipation through holes 8 uniformly formed in the upper end of the equipment power supply main body 1, a cleaning device 6 is arranged at the upper end of the equipment power supply main body 1 in a sliding mode, the cleaning device 6 comprises cleaning scrapers 19 and T-shaped connecting blocks 20, the T-shaped connecting blocks 20 are symmetrically installed at the lower ends of the cleaning scrapers 19, the cleaning scrapers 19 on the cleaning device 6 are located at the upper end of the equipment power supply main body 1, the two T-shaped connecting blocks 20 are respectively located in two T-shaped sliding grooves 7 symmetrically formed in the upper end of the equipment power supply main body 1, the cleaning scrapers 19 and the T-shaped connecting blocks 20 are of an integrally formed structure, through the arrangement of a cleaning device 5 and a cleaning device 6, when the heat dissipation through holes 8 formed in the equipment power supply main body 1 need to be cleaned, the equipment power supply main body 1 can be cleaned without disassembling the heat dissipation through the cleaning device 5, the heat dissipation through arrangement of the cleaning device 5 can be conveniently pushed upwards, and the dust can be conveniently pushed to be conveniently used without the dust pushing device 5 to be pushed upwards to be pushed to be used.
It should be noted that, the present invention is a power supply for high-speed internet of things, when the heat dissipating through hole 8 formed on the power supply main body 1 of the device is blocked by dust during use, so that when the heat dissipation efficiency of the apparatus power supply main body 1 is deteriorated, the heat dissipation through-holes 8 can be cleaned using the first cleaning device 5 and the second cleaning device 6, the method is that the connecting base plate 12 on the push-pull structure 3 is pushed upwards, at this time, the connecting base plate 12 drives the spring baffle 15 to move upwards, the return spring 4 is compressed along with the upward movement of the spring baffle 15, and when the push-pull structure 3 moves upwards, the first cleaning device 5 is driven to move upwards, finally, the cleaning top plate 16 on the first cleaning device 5 moves into the heat dissipation through hole 8 formed in the upper end of the equipment power supply main body 1, the cleaning top plate 16 pushes out dust blocked in the heat dissipation through hole 8 along with the continuous upward movement of the cleaning top plate 16, so that the dust moves to the upper end of the equipment power supply main body 1, therefore, the heat dissipation through hole 8 is cleaned, then the second cleaning device 6 moves at the upper end of the equipment power supply main body 1, finally, along with the movement of the second cleaning device 6, dust pushed out of the heat dissipation through hole 8 by the cleaning top plate 16 is pushed away by the cleaning scraper 19 on the second cleaning device 6, and finally, the dust is cleaned from the upper end of the equipment power supply main body 1 by the cleaning scraper 19, at the moment, the cleaning of the equipment power supply main body 1 is finished, at the last, the push-pull structure 3 is loosened, at the moment, the push-pull structure 3 is pushed downwards by the reset spring 4, the push-pull structure 3 also drives the first cleaning device 5 to move downwards, and finally the cleaning top plate 16 on the first cleaning device 5 is moved out of the heat dissipation through hole 8, so that the first cleaning device 5 is reset downwards.
Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the invention as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A power supply for high-speed Internet of things, comprising a device power supply main body (1), characterized in that: the cleaning device is characterized in that two device mounting base blocks (2) are symmetrically mounted at the left end of the equipment power supply main body (1), a push-pull structure (3) is mounted on the two device mounting base blocks (2), the push-pull structure (3) comprises a connecting base plate (12), two connecting support plates (13), two connecting columns (14) and spring baffles (15), the connecting support plates (13) are provided with a plurality of devices and are uniformly mounted at the inner end of the connecting base plate (12), the connecting columns (14) are provided with two devices and are symmetrically mounted at the lower end of the connecting base plate (12), the spring baffles (15) are provided with two lower ends which are respectively mounted at the two connecting columns (14), a reset spring (4) is sleeved on the two connecting columns (14), a cleaning device (5) is mounted in the equipment power supply main body (1), the cleaning device (5) is mounted on the push-pull structure (3), the cleaning device (5) comprises a cleaning top plate (16), a top plate support column (17) and a connecting frame (18), the top plate support column (17) is provided with a plurality of devices and is uniformly mounted at the upper end of the cleaning top plate (16) and is mounted on the main body (6), no. two cleaning device (6) contain clearance scraper blade (19) and T shape connecting block (20), T shape connecting block (20) have two and the symmetry install the lower extreme at clearance scraper blade (19).
2. The power supply for high-speed internet of things of claim 1, wherein: two T shape spout (7) have been seted up to the upper end symmetry of equipment power main part (1), a plurality of heat dissipation through-hole (8) have evenly been seted up to the upper end of equipment power main part (1), heat dissipation through-hole (8) runs through the upper end of equipment power main part (1) rather than the inner wall, a plurality of heat dissipation through-hole (8) are located between two T shape spout (7), installation fixed orifices (9) have been seted up on equipment power main part (1), a plurality of connection spout (10), a plurality of have evenly been seted up to the left end of equipment power main part (1) connect spout (10) all run through the left end of equipment power main part (1) rather than the inner wall.
3. The power supply for the high-speed internet of things as claimed in claim 2, wherein: two device installation base block (2) all through screw fixed mounting in the left end of equipment power main part (1), two device installation base block (2) all are located the below of connecting spout (10) that equipment power main part (1) left end was seted up, two all seted up one installation through-hole (11) on device installation base block (2), two installation through-hole (11) run through the upper and lower both ends of two device installation base blocks (2) respectively.
4. The power supply for high-speed internet of things of claim 3, wherein: the connecting base plate (12) and the connecting support plate (13) on the push-pull structure (3) are of an integrally formed structure, the connecting base plate (12) is located at the upper ends of the two device installation base blocks (2), the connecting support plate (13) penetrates a plurality of connecting chutes (10) uniformly formed in the left end of the equipment power supply main body (1) inwards respectively, the connecting column (14) and the spring baffles (15) are of an integrally formed structure, the spring baffles (15) are located below the two device installation base blocks (2) respectively, the connecting column (14) upwards penetrates through two installation through holes (11) formed in the device installation base blocks (2) respectively, and the connecting column (14) penetrates through the installation through holes (11) and then is fixedly connected with the connecting base plate (12) through screws.
5. The power supply for the high-speed internet of things as claimed in claim 4, wherein: the two return springs (4) are respectively positioned below the two device installation base blocks (2).
6. The power supply for the high-speed internet of things of claim 5, wherein: a cleaning top plate (16), a top plate supporting column (17) and a connecting frame (18) on the cleaning device (5) are of an integrally formed structure, the connecting frame (18) is fixedly installed on a plurality of connecting supporting plates (13) arranged on the push-pull structure (3) through screws, and the cleaning top plate (16) is located below a plurality of heat dissipation through holes (8) evenly formed in the upper end of the equipment power supply main body (1) respectively.
7. The power supply for the high-speed internet of things of claim 6, wherein: a cleaning scraper (19) on the second cleaning device (6) is located at the upper end of the equipment power supply main body (1), the two T-shaped connecting blocks (20) are respectively located in two T-shaped sliding grooves (7) symmetrically formed in the upper end of the equipment power supply main body (1), and the cleaning scraper (19) and the T-shaped connecting blocks (20) are of an integrally formed structure.
Priority Applications (1)
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CN202210599951.XA CN115156112A (en) | 2022-05-26 | 2022-05-26 | Power supply for high-speed internet of things |
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CN202210599951.XA CN115156112A (en) | 2022-05-26 | 2022-05-26 | Power supply for high-speed internet of things |
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CN202210599951.XA Pending CN115156112A (en) | 2022-05-26 | 2022-05-26 | Power supply for high-speed internet of things |
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