CN115151057A - Automatic tin-plating method and device for PCB (printed circuit board) and computer equipment - Google Patents
Automatic tin-plating method and device for PCB (printed circuit board) and computer equipment Download PDFInfo
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- CN115151057A CN115151057A CN202110336537.5A CN202110336537A CN115151057A CN 115151057 A CN115151057 A CN 115151057A CN 202110336537 A CN202110336537 A CN 202110336537A CN 115151057 A CN115151057 A CN 115151057A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
The application provides an automatic tinning method and device for a PCB (printed circuit board) and computer equipment.A control system acquires a PCB welding layer map, and then determines a layout of soldering positions according to the PCB welding layer map, wherein the layout characterizes the distribution positions and the distribution sizes of the soldering positions on the PCB welding layer map. The control system adjusts the distribution arrangement of the tinning structures according to the layout, controls the adjusted tinning structures to tin on the PCB, and meets the requirements of the subsequent process. The layout of the soldering station is determined by analyzing the PCB soldering layer map, then the tin is coated on the PCB board card after the distribution arrangement of the tin coating structure is adjusted according to the layout of the soldering station, a fixed steel mesh does not need to be manufactured for the PCB board card, and the production cost and the production period are effectively reduced.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to an automatic tinning method and device for a PCB (printed circuit board) and computer equipment.
Background
The Flexible Printed Circuit (FPC) has the characteristics of high wiring density, light weight, thin thickness and the like, and is mainly applied to a plurality of products such as mobile phones, notebook computers, digital cameras and the like. The Surface Mount Technology (SMT) process of the flexible printed circuit board mainly includes three basic links, i.e., solder paste printing, mounting, reflow soldering, and the like, wherein the solder paste printing refers to printing solder paste on a solder pad of a circuit board card (i.e., a PCB card) through a template (i.e., a steel mesh) with a predetermined pattern. When each type of board card is brushed with tin, a unique corresponding steel mesh is required to be prepared, and the steel meshes between the board cards of different types cannot be shared, so that the loss of the steel meshes is large, the repeated utilization rate is low, and the production cost is greatly improved.
Disclosure of Invention
In order to solve the technical problem, the application provides an automatic tin-plating method and device for a PCB (printed circuit board), and computer equipment.
In order to achieve the above object, the present application provides an automatic tin-coating method for a PCB board, which is applied to a tin-brushing device, wherein the tin-brushing device includes a tin-coating structure, and the method includes:
acquiring a PCB welding plate layer map;
determining a layout of the soldering station according to the PCB soldering board layer map, wherein the layout represents the distribution position and the distribution size of the soldering station on the PCB soldering board layer map;
adjusting the distribution arrangement of the tin-coating structure according to the layout;
and controlling the adjusted tinning structure to tin on the PCB.
The application also provides an automatic tinning device of PCB integrated circuit board, is applied to the equipment of brushing tin, the equipment of brushing tin includes the structure of tinning, the device includes:
the acquisition module is used for acquiring a PCB welding plate layer map;
the analysis module is used for determining a layout of the soldering station according to the PCB welding layer map, and the layout represents the distribution position and the distribution size of the soldering station on the PCB welding layer map;
the adjusting module is used for adjusting the distribution arrangement of the tin-coating structure according to the layout;
and the tinning module is used for controlling the adjusted tinning structure to tin on the PCB.
The present application further provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of any one of the above methods when executing the computer program.
The present application also provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, carries out the steps of the method of any of the above.
According to the automatic tinning method and device for the PCB and the computer equipment, the control system obtains the PCB welding layer map, then the layout of the soldering pad positions is determined according to the PCB welding layer map, and the layout characterizes the distribution positions and the distribution sizes of the soldering pad positions on the PCB welding layer map. The control system adjusts the distribution arrangement of the tinning structures according to the layout, controls the adjusted tinning structures to tin on the PCB, and meets the requirements of the subsequent process. This application confirms the overall arrangement picture of soldering station through analytic PCB welds the board layer map, then carries out the tinning on the PCB integrated circuit board after the distribution of tin structure is arranged according to the overall arrangement picture adjustment of soldering station, need not make fixed steel mesh to the PCB integrated circuit board, has effectively reduced manufacturing cost and production cycle.
Drawings
FIG. 1 is a schematic diagram illustrating steps of an automatic soldering method for a PCB in an embodiment of the present application;
fig. 2 is a block diagram of an overall structure of an automatic tin-plating device for a PCB board in an embodiment of the present application;
fig. 3 is a block diagram schematically illustrating a structure of a computer device according to an embodiment of the present application.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
Referring to fig. 1, an embodiment of the present application provides an automatic tin-plating method for a PCB board, which is applied to a tin-brushing device, where the tin-brushing device includes a tin-plating structure, and the method includes:
s1, acquiring a map of a PCB welding plate layer;
s2, determining a layout of the soldering station according to the PCB soldering board layer map, wherein the layout represents the distribution position and the distribution size of the soldering station on the PCB soldering board layer map;
s3, adjusting the distribution arrangement of the tin-coating structure according to the layout;
and S4, controlling the adjusted tinning structure to tin on the PCB.
In the embodiment, an operator inputs a map of a PCB pad layer corresponding to a PCB board card needing a tinning process into a control system of the tinning equipment; or, the operator stores a plurality of maps of the PCB pad layer in a database of the control system in advance, and each map of the PCB pad layer is associated with the corresponding type of the PCB board card. Before the tinning process is carried out, the control system can call the corresponding PCB pad layer map according to the PCB board card model input by an operator, and a new PCB pad layer map does not need to be led in again every time, so that the production efficiency is improved, and the workload of the operator is reduced. The control system obtains the shape of the PCB board card through the recognition of the map of the PCB pad layer, determines the distribution position and the distribution size of each pad position on the PCB board card through the pad positions marked on the map of the PCB pad layer, and generates a layout diagram of the pad positions needing soldering by combining the shape of the PCB board card and the distribution position and the distribution size of each pad. The tin brushing equipment is provided with a tin coating structure, the tin coating structure can be a tin spraying device, and the tin spraying device is composed of a plurality of tin spraying guns with adjustable distribution positions. And the control system correspondingly generates a tin spraying gun matrix map according to the layout of the soldering land, and the tin spraying gun matrix map represents the distribution layout of each tin spraying gun. And then moving the PCB board card to be below the tin spraying device, and controlling all tin spraying guns to be arranged and distributed according to a tin spraying gun matrix map, so that all the tin spraying guns of the tin spraying device correspond to the bonding pad positions on the PCB board card. And finally, the control system controls the arranged and distributed tin spraying guns to directly perform tin spraying on the PCB, so that the PCB is coated with tin. In this embodiment, obtain the layout diagram of welding disk position through PCB pad map analysis, and generate the tin spraying gun matrix map that tin spraying gun distributes and arranges according to the layout diagram, each tin spraying gun that makes the tin spraying device can correspond with the pad position of PCB integrated circuit board after arranging according to tin spraying gun matrix map, can accomplish the tinning technology through directly carrying out the tin spraying on the PCB integrated circuit board at last, need not be to the steel mesh that PCB integrated circuit board preparation corresponds, can not only reduce production cost, can also improve production efficiency (save the preparation cycle of steel mesh).
Further, the step of adjusting the distribution and arrangement of the tin-coating structure according to the layout comprises:
s301, correspondingly generating a tin spraying gun matrix map according to the layout;
s302, moving the PCB board card to the lower part of the tin spraying device, and controlling the tin spraying guns to be arranged and distributed according to the tin spraying gun matrix map.
In this embodiment, the last tin structure of arranging on the equipment of brushing tin is the hot air solder leveling device, and the hot air solder leveling device comprises a plurality of hot air solder leveling rifle, and each hot air solder leveling rifle all can adjust distribution position and hot air solder leveling volume as required. The control system correspondingly deploys the distribution positions and the tin spraying amounts of all the tin spraying guns on the tin spraying device according to the layout of the soldering disk positions on the PCB board card (the soldering disk positions with different shapes and sizes correspond to different tin spraying amounts), so that each soldering disk position corresponds to one tin spraying gun, and a tin spraying gun matrix map is generated. The tin brushing equipment comprises a conveyor belt, wherein a PCB is arranged on the conveyor belt, and the conveyor belt is used for conveying the PCB to the position below the tin spraying device. And the control system controls the tin spraying guns to be distributed and arranged according to the tin spraying gun matrix atlas. Specifically, each tin spraying gun is provided with a unique label (such as a tin spraying gun A, a tin spraying gun B, a tin spraying gun C and the like), and the unique label, the distribution position and the corresponding tin spraying amount of the tin spraying gun are recorded on a matrix map of the tin spraying gun. Therefore, the control system can move the corresponding tin spraying guns to the corresponding distribution positions according to the matrix atlas of the tin spraying guns through the mechanical arms respectively corresponding to the tin spraying guns according to the unique labels of the tin spraying guns. After each tin spraying gun finishes moving arrangement, each tin spraying gun is controlled to spray tin on the PCB according to the corresponding tin spraying amount on the matrix map of the tin spraying gun, and tin coating on the PCB is realized. In the embodiment, the tin spraying device can directly perform tin spraying on the PCB board according to the tin spraying gun matrix atlas generated by the layout of the soldering land positions, and a steel mesh corresponding to the PCB board does not need to be manufactured, so that the production efficiency can be greatly improved (the manufacturing period of the steel mesh is saved), and the production cost is reduced (the manufacturing cost of the steel mesh is saved); the method is flexible to operate, can generate corresponding tin spraying gun matrix maps according to different types of PCB welding layer maps, is high in recycling rate, and is energy-saving and environment-friendly.
Further, the equipment of brushing tin includes the conveyer belt, the PCB integrated circuit board is placed on the conveyer belt, each the control spray tin rifle is according to the step that spray tin rifle matrix map carries out the range distribution, includes:
s3021, obtaining the current placement layout of the PCB boards on the conveyor belt;
s3022, adjusting the distribution position of the tin spraying device relative to the PCB board card according to the length-width corresponding relation between the placement layout of the PCB board card and the PCB welding board layer spectrogram, so that the length-width corresponding relation between the placement layout of the PCB board card, the PCB welding board layer spectrogram and the tin spraying gun matrix spectrogram is consistent;
and S3023, controlling the tin spraying guns on the tin spraying device after the distribution positions are adjusted to be arranged and distributed according to the tin spraying gun matrix atlas.
In this embodiment, after the PCB board moves to the lower side of the tin spraying device through the conveyor belt, the control system obtains the placement layout of the PCB board on the conveyor belt at present through scanning or shooting and other modes, and the placement layout represents the relative angle relationship between the PCB board and the traveling direction of the conveyor belt (for example, the length direction of the PCB board is parallel to the traveling direction of the conveyor belt, or the width direction of the PCB board is parallel to the traveling direction of the conveyor belt, or the PCB board is placed on the conveyor belt in a skew manner, and a certain included angle is formed between the length direction and/or the width direction of the PCB board and the traveling direction of the conveyor belt). The control system adjusts the distribution position of the tin spraying device relative to the PCB board card according to the length-width corresponding relation between the placing layout of the PCB board card and the map of the PCB welding pad layer, so that the length-width corresponding relation between the placing layout of the PCB board card, the map of the PCB welding pad layer and the matrix map of the tin spraying gun is consistent. For example, the length direction of the PCB board card is parallel to the advancing direction of the conveyor belt, the length and the width of the atlas of the PCB welding pad layer correspond to the PCB board card, and the matrix atlas of the tin spraying gun is generated according to the atlas of the PCB welding board layer. Therefore, the control system adjusts the tin spraying device to the extent that the length of the peripheral outline of the tin spraying gun matrix atlas is also parallel to the advancing direction of the conveyor belt, so that the corresponding relation between the length and the width of the peripheral outline of the tin spraying gun matrix atlas and the PCB is consistent. The coupling control system controls each tin spraying gun on the tin spraying device after the distribution position is adjusted to be arranged and distributed according to the tin spraying gun matrix atlas, so that the distribution position of each tin spraying gun can correspond to the soldering pad position on the PCB, the condition of tin spraying dislocation cannot occur, and the accuracy and the production quality of tin coating on the PCB are improved.
Further, the step of adjusting the distribution and arrangement of the tin-coating structure according to the layout includes:
s303, correspondingly generating a steel bar matrix sequence according to the layout;
and S304, controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh.
Preferably, the soldering structure further includes a solder paste printer, and the step of controlling the adjusted soldering structure to perform soldering on the PCB board includes:
s305, covering the matrix splicing steel mesh on the PCB board card;
and S306, controlling the solder paste printer to print solder paste on the matrix splicing steel mesh to realize the tinning of the PCB.
In another embodiment, the tin feeding structure of the tin brushing equipment comprises a steel mesh assembler and a tin paste printing machine, wherein the steel mesh assembler comprises n x n steel bars which are arranged in a longitudinal and transverse mode, each steel bar is provided with a unique identifier, and the unique identifiers are recorded by a control system so as to control the corresponding steel bar to do telescopic motion according to the unique identifier; the solder paste printer is a conventional general-purpose type of apparatus and will not be described in detail herein. And the control system correspondingly simulates and adjusts the movement stroke (including extension movement and contraction movement) of each steel bar on the steel net according to the layout of the welding discs on the PCB board card to generate a steel bar matrix sequence. And then, the control system controls each corresponding steel bar to do extension movement and/or contraction movement according to the unique identifier marked by the steel bar matrix sequence, and moves corresponding movement stroke, so that the generated matrix splicing steel mesh corresponds to the pre-simulated steel bar matrix sequence. The control system covers the generated matrix splicing steel mesh on the PCB board, and then controls the solder paste printer to print solder paste on the matrix splicing steel mesh, so that the PCB board is soldered.
Preferably, if the layout of the pad positions is complex (for example, the number of the pad positions is large, the shape types are large, and the like), when the steel mesh assembler cannot generate the steel bar matrix sequence corresponding to the layout at one time, the layout can be split as required, only the local steel bar matrix sequence corresponding to part of the layout is generated at each time, the matrix splicing steel mesh is generated according to the local steel bar matrix sequence, the PCB board card corresponding to the part of the layout is tinned, and after the multiple splicing, the tinning process for the whole PCB board card is completed (for example, the layout is divided into 4 parts, only one part of tinning is completed at each time, and the complete tinning process for the PCB board card can be completed for 4 times in total).
In the embodiment, the steel bars are adjusted to generate the matrix splicing steel mesh by corresponding to the layout of the soldering station, and the steel bars can be flexibly adjusted when facing different types of PCB boards, so that the steel mesh can be recycled, and the production cost is effectively reduced; meanwhile, the matrix splicing steel mesh can be generated immediately before the tinning process, and does not need to be manufactured by a special steel mesh manufacturing plant, so that the production period is greatly shortened, and the production efficiency is improved.
Further, the layout includes an opening position, an opening size, and an opening shape of each soldering station, the steel bar matrix sequence includes a unique identifier and a movement stroke corresponding to each steel bar, and the step of controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh includes:
s3041, respectively controlling the steel bars to do telescopic motion according to the motion stroke corresponding to the unique identifier of the steel bars, and generating the matrix splicing steel mesh corresponding to the opening position, the opening size and the opening shape of each welding disc position.
In this embodiment, the layout of the pad positions includes the opening position, the opening size, and the opening shape of each pad position on the PCB card, and the matrix sequence of the steel bars generated according to the layout includes the unique identifier and the movement stroke respectively corresponding to each steel bar. And the control system controls the corresponding steel bars to perform extension movement or contraction movement according to the corresponding movement stroke according to the unique identification of the steel bars recorded on the steel bar matrix sequence, so that matrix splicing steel nets corresponding to the opening positions, the opening sizes and the opening shapes of the welding disk positions are generated after the steel bars are spliced. Specifically, the outside one end of billet is provided with the rodent, and the steel mesh assembler still includes driving motor and gear, and the gear setting is on driving motor's transmission shaft, and the gear meshes with the rodent of billet (be provided with the billet part of rodent promptly and be equivalent to the rack, rack and gear engagement), and single billet corresponds single driving motor and gear. When the billet is controlled to carry out concertina movement in needs, through driving motor corotation or reversal, driving motor's the epaxial gear of transmission is through the meshing with the terminal rodent of billet, and then drives the billet and carry out extension motion or shrink motion. Preferably, the gear that two adjacent billet correspond is crisscross to be set up (for example the initial position of the gear of first billet is located the billet end, and the initial position of the gear of second billet is apart from the terminal 5mm of billet, and the billet length of same direction is the same), avoids two adjacent gears because the interval is too closely mutual collision interference. The control system of the embodiment controls each steel bar to perform sequential telescopic movement through the unique identifier, so that the matrix splicing steel mesh which is in accordance with the specifications (opening position, opening size and opening shape) of the bonding pad position is generated, the adjustment is flexible, the repeated utilization is realized, and the excellent environmental protection performance is realized.
Further, the steel mesh assembler comprises an upper layer steel bar array, a middle layer steel bar array and a lower layer steel bar array, wherein the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are sequentially stacked from top to bottom;
the peripheral outline sizes of the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are reduced in sequence;
the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are all composed of a plurality of steel bars which are arranged vertically and horizontally, and each steel bar is provided with a unique identifier;
the upper layer steel bar array is used for configuring the peripheral area of the matrix splicing steel mesh;
the middle layer steel bar array is used for configuring an inner surrounding area of the matrix splicing steel mesh;
the lower layer steel bar array is used for filling gaps formed when the upper layer steel bar array and/or the middle layer steel bar array are configured with the matrix splicing steel mesh.
In this embodiment, the steel mesh assembler preferably includes upper array of steel bars, middle array of steel bars and lower array of steel bars, and upper array of steel bars, middle array of steel bars and lower array of steel bars from top to bottom stack gradually the setting. The peripheral outline size of the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array is reduced in sequence, is similar to an inverted tower shape, and converges layer by layer from top to bottom. Upper strata billet array, middle level billet array and lower floor's billet array constitute by the n x n billet of vertical and horizontal arrangement (individual formation billet array is by the n x n billet of vertical and horizontal arrangement promptly, and the value of n can be the same in the billet array of different layers, also can be different, specifically can select according to actual need, does not do specific limit here), and each billet is provided with unique sign respectively to control system can select corresponding billet to carry out concertina movement according to unique sign when constituteing matrix concatenation steel mesh. When the matrix splicing steel mesh is generated, the upper-layer steel bar array is used for configuring the peripheral area of the matrix splicing steel mesh, namely the peripheral area of the matrix splicing steel mesh is formed by splicing the upper-layer steel bar array; the middle layer steel bar array is used for configuring an inner surrounding area of the matrix splicing steel mesh, namely the inner surrounding area of the matrix splicing steel mesh is formed by splicing the middle layer steel bar array; the lower layer steel bar array is used for filling gaps formed when the upper layer steel bar array and/or the middle layer steel bar array form a matrix splicing steel mesh, namely the lower layer steel bar array exists as a standby steel bar, and when no gap exists, the lower layer steel bar array does not move, so that the original state is preserved. In this embodiment, the basis for distinguishing the peripheral area and the inner area of the matrix splicing steel mesh is the length and the width of the outer contour of the matrix splicing steel mesh, for example, the length and the width of the outer contour of the matrix splicing steel mesh are 8cm and 4cm, respectively, the length and the width of the inner area of the matrix splicing steel mesh are 4cm and 2cm, respectively, wherein the distance between the length edge of the inner area and the length edge of the same side of the outer contour of the matrix splicing steel mesh is 1cm, and the distance between the width edge of the inner area and the width edge of the same side of the outer contour of the matrix splicing steel mesh is 2cm; the area of the matrix splicing steel mesh except the inner area is the outer area. The steel mesh assembler of this embodiment includes from last upper strata billet array, middle level billet array and the lower floor billet array of down successive layer convergence, and each layer billet array can compensate each other when constituteing matrix concatenation steel mesh to make steel mesh assembler can generate the matrix concatenation steel mesh that has complicated welding position (for example welding position quantity, shape type are more).
Referring to fig. 2, an embodiment of the present application further provides an automatic tin coating device for a PCB board, which is applied to a tin brushing device, where the tin brushing device includes a tin coating structure, and the device includes:
the acquisition module 1 is used for acquiring a PCB welding plate layer map;
the analysis module 2 is used for determining a layout of the pad positions according to the PCB welding layer map, and the layout represents the distribution positions and the distribution sizes of the pad positions on the PCB welding layer map;
the adjusting module 3 is used for adjusting the distribution arrangement of the tin-coating structure according to the layout;
and the tinning module 4 is used for controlling the adjusted tinning structure to tin on the PCB.
Further, go up the tin structure and be the tin spraying device, the tin spraying device comprises a plurality of tin spraying guns, adjustment module 3 includes:
the first generating unit is used for correspondingly generating a tin spraying gun matrix map according to the layout;
and the moving unit is used for moving the PCB board card to the lower part of the tin spraying device and controlling the tin spraying guns to be arranged and distributed according to the tin spraying gun matrix atlas.
Further, the equipment of brushing tin includes the conveyer belt, the PCB integrated circuit board is placed on the conveyer belt, the mobile unit includes:
the acquisition subunit is used for acquiring the current placement layout of the PCB on the conveyor belt;
the adjusting subunit is used for adjusting the distribution position of the tin spraying device relative to the PCB board card according to the length-width corresponding relationship between the placement layout of the PCB board card and the PCB welding board layer spectrogram, so that the length-width corresponding relationship between the placement layout of the PCB board card, the PCB welding board layer spectrogram and the tin spraying gun matrix spectrogram is consistent;
and the arrangement subunit is used for controlling the arrangement and distribution of the tin spraying guns on the tin spraying device after the distribution positions are adjusted according to the tin spraying gun matrix atlas.
Further, the tinning structure includes a steel mesh assembler, the steel mesh assembler includes a plurality of steel bars arranged vertically and horizontally, the adjusting module 3 further includes:
a second generating unit, configured to generate a steel bar matrix sequence according to the layout;
and the control unit is used for controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh.
Preferably, the tinning structure further comprises a solder paste printer, and the tinning module 4 comprises:
the covering unit is used for covering the matrix splicing steel mesh on the PCB;
and the printing unit is used for controlling the solder paste printer to print solder paste on the matrix splicing steel net to realize the soldering of the PCB.
Further, the layout diagram includes an opening position, an opening size, and an opening shape of each of the soldering lands, the matrix sequence of the steel bars includes a unique identifier and a movement stroke corresponding to each of the steel bars, respectively, and the control unit includes:
and the movement subunit is used for respectively controlling each steel bar to perform telescopic movement according to the movement stroke corresponding to the unique identifier of the steel bar, so as to generate the matrix splicing steel mesh corresponding to the opening position, the opening size and the opening shape of each welding disc position.
Further, the steel mesh assembler comprises an upper layer steel bar array, a middle layer steel bar array and a lower layer steel bar array, wherein the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are sequentially stacked from top to bottom;
the peripheral outline sizes of the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are reduced in sequence;
the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are all composed of a plurality of steel bars which are arranged vertically and horizontally, and each steel bar is provided with a unique identifier;
the upper layer steel bar array is used for configuring the peripheral area of the matrix splicing steel mesh;
the middle layer steel bar array is used for configuring an inner surrounding area of the matrix splicing steel mesh;
the lower layer steel bar array is used for filling gaps formed when the upper layer steel bar array and/or the middle layer steel bar array are configured with the matrix splicing steel mesh.
In this embodiment, each module, unit, and subunit in the automatic soldering apparatus are used to correspondingly execute each step in the automatic soldering method for the PCB board, and the specific implementation process thereof is not described in detail herein.
According to the automatic tinning device for the PCB board card, the control system obtains the PCB welding board layer map, then the layout of the soldering pad positions is determined according to the PCB welding board layer map, and the layout characterizes the distribution positions and the distribution sizes of the soldering pad positions on the PCB welding board layer map. The control system adjusts the distribution arrangement of the tinning structures according to the layout, controls the adjusted tinning structures to tin on the PCB, and meets the requirements of the subsequent process. The layout of the soldering station is determined by analyzing the PCB soldering layer map, then the tin is coated on the PCB board card after the distribution arrangement of the tin coating structure is adjusted according to the layout of the soldering station, a fixed steel mesh does not need to be manufactured for the PCB board card, and the production cost and the production period are effectively reduced.
Referring to fig. 3, an embodiment of the present application further provides a computer device, where the computer device may be a server, and an internal structure of the computer device may be as shown in fig. 3. The computer device includes a processor, a memory, a network interface, and a database connected by a system bus. Wherein the computer designed processor is used to provide computational and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the computer equipment is used for storing data such as a PCB welding plate layer map and the like. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to realize an automatic tin coating method of the PCB board card, and is applied to tin brushing equipment, and the tin brushing equipment comprises a tin coating structure.
The processor executes the steps of the automatic tin-plating method of the PCB board card:
s1, acquiring a map of a PCB welding plate layer;
s2, determining a layout of the soldering station according to the PCB soldering board layer map, wherein the layout represents the distribution position and the distribution size of the soldering station on the PCB soldering board layer map;
s3, adjusting the distribution arrangement of the tin-coating structure according to the layout;
and S4, controlling the adjusted tinning structure to tin on the PCB.
Further, the step of adjusting the distribution and arrangement of the tin-coating structure according to the layout comprises:
s301, correspondingly generating a matrix map of the tin spraying gun according to the layout;
and S302, moving the PCB board card to the lower part of the tin spraying device, and controlling the tin spraying guns to be arranged and distributed according to the tin spraying gun matrix map.
Further, the equipment of brushing tin includes the conveyer belt, the PCB integrated circuit board is placed on the conveyer belt, each the control spray tin rifle is according to the step that spray tin rifle matrix map carries out the range distribution, includes:
s3021, obtaining the current placement layout of the PCB boards on the conveyor belt;
s3022, adjusting the distribution position of the tin spraying device relative to the PCB board card according to the length-width corresponding relation between the placement layout of the PCB board card and the PCB welding board layer spectrogram, so that the length-width corresponding relation between the placement layout of the PCB board card, the PCB welding board layer spectrogram and the tin spraying gun matrix spectrogram is consistent;
and S3023, controlling the tin spraying guns on the tin spraying device after the distribution positions are adjusted to be arranged and distributed according to the tin spraying gun matrix atlas.
Further, the step of adjusting the distribution and arrangement of the tin-coating structure according to the layout includes:
s303, correspondingly generating a steel bar matrix sequence according to the layout;
and S304, controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh.
Preferably, the soldering structure further includes a solder paste printer, and the step of controlling the adjusted soldering structure to perform soldering on the PCB board includes:
s305, covering the matrix splicing steel mesh on the PCB board card;
and S306, controlling the solder paste printer to print solder paste on the matrix splicing steel mesh to realize the tinning of the PCB.
Further, the layout includes an opening position, an opening size, and an opening shape of each of the pad positions, the steel bar matrix sequence includes a unique identifier and a movement stroke corresponding to each of the steel bars, and the step of controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh includes:
s3041, respectively controlling the steel bars to do telescopic motion according to the motion stroke corresponding to the unique identifier of the steel bars, and generating the matrix splicing steel mesh corresponding to the opening position, the opening size and the opening shape of each welding disc position.
An embodiment of the present application further provides a computer-readable storage medium, where a computer program is stored thereon, and when the computer program is executed by a processor, the method for automatically soldering a PCB board is implemented, where the method is applied to a solder brushing device, where the solder brushing device includes a solder coating structure, and the method for automatically soldering the PCB board specifically includes:
s1, acquiring a map of a PCB welding plate layer;
s2, determining a layout of the soldering station according to the PCB soldering board layer map, wherein the layout represents the distribution position and the distribution size of the soldering station on the PCB soldering board layer map;
s3, adjusting the distribution arrangement of the tin-coating structure according to the layout;
and S4, controlling the adjusted tinning structure to tin on the PCB.
Further, the step of adjusting the distribution and arrangement of the tin-coating structure according to the layout comprises:
s301, correspondingly generating a tin spraying gun matrix map according to the layout;
s302, moving the PCB board card to the lower part of the tin spraying device, and controlling the tin spraying guns to be arranged and distributed according to the tin spraying gun matrix map.
Further, the equipment of brushing tin includes the conveyer belt, the PCB integrated circuit board is placed on the conveyer belt, control each tin spraying gun according to the step that tin spraying gun matrix map arranged and distributed includes:
s3021, obtaining the current placement layout of the PCB boards on the conveyor belt;
s3022, adjusting the distribution position of the tin spraying device relative to the PCB board card according to the length-width corresponding relation between the placement layout of the PCB board card and the PCB welding board layer spectrogram, so that the length-width corresponding relation between the placement layout of the PCB board card, the PCB welding board layer spectrogram and the tin spraying gun matrix spectrogram is consistent;
and S3023, controlling the tin spraying guns on the tin spraying device after the distribution positions are adjusted to be arranged and distributed according to the tin spraying gun matrix atlas.
Further, the step of adjusting the distribution and arrangement of the tin-coating structure according to the layout includes:
s303, correspondingly generating a steel bar matrix sequence according to the layout;
and S304, controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh.
Preferably, the soldering structure further includes a solder paste printer, and the step of controlling the adjusted soldering structure to perform soldering on the PCB board includes:
s305, covering the matrix splicing steel mesh on the PCB board card;
and S306, controlling the solder paste printer to print solder paste on the matrix splicing steel mesh to realize the tinning of the PCB.
Further, the layout includes an opening position, an opening size, and an opening shape of each of the pad positions, the steel bar matrix sequence includes a unique identifier and a movement stroke corresponding to each of the steel bars, and the step of controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh includes:
s3041, respectively controlling the steel bars to do telescopic motion according to the motion stroke corresponding to the unique identifier of the steel bars, and generating the matrix splicing steel mesh corresponding to the opening position, the opening size and the opening shape of each welding disc position.
It will be understood by those skilled in the art that all or part of the processes of the methods of the above embodiments may be implemented by hardware associated with instructions of a computer program, which may be stored on a non-volatile computer-readable storage medium, and when executed, may include processes of the above embodiments of the methods. Any reference to memory, storage, database, or other medium provided herein and used in the examples may include non-volatile and/or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRDRAM), enhanced SDRAM (ESDRAM), synchronous Link (Synchlink) DRAM (SLDRAM), rambus (Rambus) direct RAM (RDRAM), direct bused dynamic RAM (DRDRAM), and bused dynamic RAM (RDRAM).
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, apparatus, first object, or method that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, apparatus, first object, or method. Without further limitation, an element defined by the phrases "comprising a" \8230; "does not exclude the presence of another like element in a process, apparatus, first object, or method that comprises the element.
The above description is only for the preferred embodiment of the present application and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. The automatic tin-coating method of the PCB is characterized by being applied to tin brushing equipment, wherein the tin brushing equipment comprises a tin-coating structure, and the method comprises the following steps:
acquiring a PCB welding plate layer map;
determining a layout of the soldering station according to the PCB soldering board layer map, wherein the layout represents the distribution position and the distribution size of the soldering station on the PCB soldering board layer map;
adjusting the distribution arrangement of the tin-coating structure according to the layout;
and controlling the adjusted tinning structure to tin the PCB.
2. The method of claim 1, wherein the soldering structure is a solder spraying apparatus, the solder spraying apparatus comprises a plurality of solder spraying guns, and the step of adjusting the distribution of the soldering structure according to the layout comprises:
correspondingly generating a tin spraying gun matrix map according to the layout;
and moving the PCB board card to the lower part of the tin spraying device, and controlling the tin spraying guns to be arranged and distributed according to the tin spraying gun matrix map.
3. The method for automatically tinning a PCB board according to claim 2, wherein the tinning equipment comprises a conveyor belt on which the PCB board is placed, and the step of controlling the arrangement and distribution of the tin spraying guns according to the matrix pattern of the tin spraying guns comprises:
obtaining the current placement layout of the PCB boards on the conveyor belt;
adjusting the distribution position of the tin spraying device relative to the PCB board card according to the length-width corresponding relation between the placement layout of the PCB board card and the PCB welding board layer spectrogram, so that the length-width corresponding relation between the placement layout of the PCB board card, the PCB welding board layer spectrogram and the tin spraying gun matrix spectrogram is consistent;
and controlling the arrangement and distribution of the tin spraying guns on the tin spraying device after the distribution positions are adjusted according to the matrix atlas of the tin spraying guns.
4. The method of claim 1, wherein the tinning structure comprises a steel mesh assembler, the steel mesh assembler comprises a plurality of steel bars arranged in a vertical and horizontal direction, and the step of adjusting the distribution of the tinning structure according to the layout comprises:
correspondingly generating a steel bar matrix sequence according to the layout;
and controlling the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix splicing steel mesh.
5. The method of claim 4, wherein the soldering structure further comprises a solder paste printer, and the step of controlling the adjusted soldering structure to solder the PCB card comprises:
covering the matrix splicing steel mesh on the PCB board card;
and controlling the solder paste printer to print solder paste on the matrix splicing steel mesh to realize the tinning of the PCB.
6. The method for automatically tinning a PCB board according to claim 4, wherein the layout comprises the opening position, the opening size and the opening shape of each soldering station, the matrix sequence of the bars comprises the unique identifier and the movement stroke corresponding to each bar, and the step of controlling the bars on the steel mesh assembler to arrange and distribute the bars according to the matrix sequence of the bars to generate a matrix splicing steel mesh comprises:
and respectively controlling each steel bar to perform telescopic motion according to the motion stroke corresponding to the unique identifier of the steel bar, and generating the matrix splicing steel mesh corresponding to the opening position, the opening size and the opening shape of each welding disc position.
7. The automatic tinning method of the PCB board as claimed in claim 4, wherein the steel mesh assembler comprises an upper layer steel bar array, a middle layer steel bar array and a lower layer steel bar array, and the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are sequentially stacked from top to bottom;
the peripheral outline sizes of the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are reduced in sequence;
the upper layer steel bar array, the middle layer steel bar array and the lower layer steel bar array are all composed of a plurality of steel bars which are arranged vertically and horizontally, and each steel bar is provided with a unique identifier;
the upper layer steel bar array is used for configuring the peripheral area of the matrix splicing steel mesh;
the middle layer steel bar array is used for configuring an inner surrounding area of the matrix splicing steel mesh;
the lower layer steel bar array is used for filling gaps formed when the upper layer steel bar array and/or the middle layer steel bar array are configured with the matrix splicing steel mesh.
8. The utility model provides an automatic tinning device of PCB integrated circuit board, its characterized in that is applied to the equipment of brushing tin, the equipment of brushing tin includes the structure of tinning, the device includes:
the acquisition module is used for acquiring a PCB welding plate layer map;
the analysis module is used for determining a layout of the soldering station according to the PCB welding layer map, and the layout represents the distribution position and the distribution size of the soldering station on the PCB welding layer map;
the adjusting module is used for adjusting the distribution arrangement of the tin-coating structure according to the layout;
and the tinning module is used for controlling the adjusted tinning structure to tin on the PCB.
9. A computer device comprising a memory and a processor, the memory having stored therein a computer program, characterized in that the processor, when executing the computer program, implements the steps of the method according to any of claims 1 to 6.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110336537.5A CN115151057A (en) | 2021-03-29 | 2021-03-29 | Automatic tin-plating method and device for PCB (printed circuit board) and computer equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110336537.5A CN115151057A (en) | 2021-03-29 | 2021-03-29 | Automatic tin-plating method and device for PCB (printed circuit board) and computer equipment |
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| Publication Number | Publication Date |
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| CN115151057A true CN115151057A (en) | 2022-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110336537.5A Pending CN115151057A (en) | 2021-03-29 | 2021-03-29 | Automatic tin-plating method and device for PCB (printed circuit board) and computer equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117425289A (en) * | 2023-10-25 | 2024-01-19 | 佛山磐砻智能科技有限公司 | Tin spraying technology for circuit board |
-
2021
- 2021-03-29 CN CN202110336537.5A patent/CN115151057A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117425289A (en) * | 2023-10-25 | 2024-01-19 | 佛山磐砻智能科技有限公司 | Tin spraying technology for circuit board |
| CN117425289B (en) * | 2023-10-25 | 2024-05-17 | 佛山磐砻智能科技有限公司 | Tin spraying technology for circuit board |
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