CN115149724B - Heat radiation structure for motor in centrifugal high-speed blower - Google Patents
Heat radiation structure for motor in centrifugal high-speed blower Download PDFInfo
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- CN115149724B CN115149724B CN202210765926.4A CN202210765926A CN115149724B CN 115149724 B CN115149724 B CN 115149724B CN 202210765926 A CN202210765926 A CN 202210765926A CN 115149724 B CN115149724 B CN 115149724B
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- heat
- semiconductor refrigerating
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- 230000005855 radiation Effects 0.000 title description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 81
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 230000000694 effects Effects 0.000 claims abstract description 21
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000006698 induction Effects 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 12
- 238000005057 refrigeration Methods 0.000 description 40
- 238000009434 installation Methods 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 5
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 4
- 235000017491 Bambusa tulda Nutrition 0.000 description 4
- 241001330002 Bambuseae Species 0.000 description 4
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 4
- 239000011425 bamboo Substances 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/5806—Cooling the drive system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/323—Thermally-sensitive members making use of shape memory materials
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/02—Arrangements for cooling or ventilating by ambient air flowing through the machine
- H02K9/04—Arrangements for cooling or ventilating by ambient air flowing through the machine having means for generating a flow of cooling medium
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention relates to the technical field of motor heat dissipation, in particular to a heat dissipation structure for a motor in a centrifugal high-speed blower, which comprises the following components: the even fixedly connected with four mounting panels in border position of positioning tube front wall still includes: the motor is fixedly arranged on the inner wall of the positioning cylinder and driven by a power supply, and the output end of the motor is fixedly connected with a fan blade; and the mounting groove is formed in the rear wall of the positioning cylinder. According to the invention, the refrigerating mechanism is arranged, after the semiconductor refrigerating sheet works, heat transfer is generated at two ends of the semiconductor refrigerating sheet, so that a temperature difference is generated, a cold end and a hot end are further formed, the cold end can refrigerate the second radiating plate, the cooling effect on the motor is achieved, meanwhile, the heat at the hot end is guided by the fan blade, can enter the positioning cylinder from the first radiating plate, is further discharged from the motor of the blower, the temperature of the hot end of the semiconductor refrigerating sheet can be reduced, and the cooling effect can be improved.
Description
Technical Field
The invention relates to the technical field of motor heat dissipation, in particular to a heat dissipation structure for a motor in a centrifugal high-speed blower.
Background
The blower mainly comprises the following six parts: the motor, air cleaner, air-blower body, air chamber, base (oil tank) and drip nozzle, the air-blower leans on the eccentric operation of rotor of offset in the cylinder to make the volume variation between the blade in the rotor groove inhale, compress, spit out with the air, the air-blower can divide into according to the product classification again: roots blower, blast furnace blower, magnetic levitation blower, and centrifugal blower operate on a principle similar to that of a centrifugal blower, except that the air compression process is typically performed by centrifugal force through several working impellers (or stages). The air blower is provided with a rotor which rotates at a high speed, blades on the rotor drive air to move at a high speed, centrifugal force enables the air to flow into an involute-shaped casing and flow to an outlet of the air blower along the involute, the high-speed air flow has a certain wind pressure, and new air enters and is supplemented from the center of the casing;
The motor is a device for converting electric energy into mechanical energy, and the device utilizes an electrified coil (namely a stator winding) to generate a rotating magnetic field and act on a rotor to form magneto-electric power rotating torque, the motor is divided into a direct-current motor and an alternating-current motor according to different power supplies, most of the motors in a power system are alternating-current motors and can be synchronous motors or asynchronous motors (the magnetic field rotating speed of a motor stator is different from the rotating speed of the rotor), the motor mainly comprises a stator and a rotor, the forced movement direction of an electrified wire in the magnetic field is related to the current direction and the magnetic induction line (magnetic field direction), the working principle of the motor is that the magnetic field acts on the current to rotate the motor, and blades of a blower are driven by the motor, so that a large amount of heat is generated in the motor in the continuous working process, and the working condition of the motor is influenced after the heat cannot be discharged in time;
the existing motor dissipates heat by adding a cooling fan, but the following defects still exist: the radiator fan also needs to rotate through the motor, so that a heating source is increased, and meanwhile, after hot air is discharged, the hot air cannot be timely diffused and is easily sucked into the motor casing, so that the radiating efficiency is low.
For this reason, a heat radiation structure for a motor in a centrifugal high-speed blower is proposed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a heat radiation structure for a motor in a centrifugal high-speed blower, which solves the technical problems that the heat radiation fan provided in the prior art can rotate only by the motor, a heating source is increased, and meanwhile, after hot air is discharged, the hot air cannot be diffused in time and is easily sucked into a motor shell, so that the heat radiation efficiency is lower.
In order to achieve the above purpose, the present invention provides the following technical solutions:
A heat dissipating structure for a motor in a centrifugal high speed blower, comprising: the edge of the front wall of the positioning cylinder is uniformly and fixedly connected with four mounting plates,
Further comprises:
The motor is fixedly arranged on the inner wall of the positioning cylinder and driven by a power supply, and the output end of the motor is fixedly connected with a fan blade;
The mounting groove is formed in the rear wall of the positioning cylinder; and a refrigerating mechanism for improving the heat dissipation effect is arranged in the mounting groove.
Firstly, install the motor at the air-blower through the mounting panel with the locating cylinder, then to the motor circular telegram, the motor can drive the fan blade and rotate in the locating cylinder, can dispel the heat with the interior hot air of motor, directly follow the locating cylinder after the motor heat dissipation air current, the air current flow shortens, the structure is simplified, simultaneously the cost is reduced, the reliability is strengthened, when the radiating effect is relatively poor, refrigeration mechanism begins work, can refrigerate in the motor, can reduce the temperature of hot air, can improve the radiating effect.
Preferably, the refrigerating mechanism comprises a first radiating plate and a second radiating plate, the first radiating plate is matched with the mounting groove, a plurality of radiating fins are fixedly connected to the outer side walls of the first radiating plate and the second radiating plate, limiting rings are fixedly connected to the inner walls of the first radiating plate and the second radiating plate, a semiconductor refrigerating sheet is jointly inserted between the two limiting rings, and the semiconductor refrigerating sheet is driven by a power supply.
After the semiconductor refrigerating sheet works, heat transfer can be generated at two ends of the semiconductor refrigerating sheet, heat can be transferred from one end to the other end, so that a temperature difference is generated, a cold end and a hot end are further formed, the cold end can refrigerate the second radiating plate, the cooling effect on a motor is achieved, meanwhile, the heat at the hot end is guided by the fan blade, can enter the positioning cylinder from the first radiating plate, is further discharged from the motor of the blower, the temperature of the hot end of the semiconductor refrigerating sheet can be reduced, and the temperature difference at two ends of the semiconductor refrigerating sheet can reach between 40 and 65 ℃, so that the temperature of the cold end can be correspondingly reduced, and the cooling effect can be improved.
Preferably, the semiconductor refrigerating sheet is closely attached to the first radiating plate and the second radiating plate, and heat conduction silicone grease is smeared at two ends of the semiconductor refrigerating sheet.
The heat conduction silicone grease can ensure the heat conduction efficiency between the semiconductor refrigerating sheet and the first heat dissipation plate and the second heat dissipation plate, and is beneficial to the heat dissipation and refrigeration of the semiconductor refrigerating sheet.
Preferably, two movable grooves are symmetrically formed in the inner wall of the limiting ring, limiting components are arranged in the movable grooves, each limiting component comprises a limiting head slidably mounted in the movable groove, a spring is fixedly connected to the bottom end of each limiting head, the other end of each spring is fixedly connected with the bottom wall of each movable groove, and limiting grooves matched with the limiting heads are formed in the side walls of the semiconductor refrigerating sheets.
When the semiconductor refrigerating sheet is installed, a user inserts the semiconductor refrigerating sheet into the limiting ring, the limiting head is extruded at the moment and can shrink into the movable groove, after the limiting groove moves to a position corresponding to the limiting head, the spring can push the limiting head into the limiting groove, the semiconductor refrigerating sheet is further clamped in the limiting ring, the installation mode is simple, and the installation efficiency can be improved.
Preferably, the side wall of the limit head is fixedly connected with a deflector rod, the side wall of the limit ring is provided with a groove for the deflector rod to move, and the groove is communicated with the movable groove.
When the semiconductor refrigeration piece is required to be disassembled, the deflector rod can move in the groove by downwards poking the deflector rod, and meanwhile, the deflector rod can drive the limit head to slide in the limit groove, so that the semiconductor refrigeration piece and the limit ring are separated from each other, and the semiconductor refrigeration piece is conveniently taken out.
Preferably, a sealing cavity is formed in the second heat dissipation plate, heat conduction liquid is filled in the sealing cavity, and the liquid level of the heat conduction liquid is located at a position, close to the upper end, of the side wall of the sealing cavity.
The heat conduction liquid can absorb the heat generated by the motor, the heat dissipation of the motor is facilitated, after the refrigerating mechanism works, the semiconductor refrigerating sheet can refrigerate the heat conduction liquid, and as the heat conduction liquid is not filled in the whole sealing cavity, the sealing cavity can be prevented from being broken by expansion after solidification of the heat conduction liquid.
Preferably, the movable hole has been seted up in the lateral wall on second heating panel top, be provided with induction system in the movable hole, induction system includes the heat conduction board of fixed mounting in the movable hole, the one end of heat conduction board extends to outside the lateral wall of second heating panel, the other end fixedly connected with memory alloy silk of heat conduction board, the other end fixedly connected with connector lug of memory alloy silk, and connector lug and power electric connection, fixedly connected with and connector lug matched with connector lug on the lateral wall of movable hole, and connector lug and semiconductor refrigeration piece electric connection.
When the fan blade radiating effect is relatively poor, the temperature in the motor begins to rise gradually at this moment, the heat-conducting plate can transmit the temperature in the motor to the memory alloy wire simultaneously, the memory alloy wire begins to be heated and expanded at this moment, the memory alloy wire can push the connector lug to move towards the wire holder, after the connector lug contacts with the wire holder, the semiconductor refrigerating piece begins to electrify and work at this moment, the motor can be cooled, after the temperature in the motor drops, the memory alloy wire begins to shrink when encountering cold, and therefore the connector lug can be separated from the wire holder, the semiconductor refrigerating piece is powered off in time and stops working temporarily, and energy consumption can be reduced.
Preferably, the connector lug is slidably mounted in the movable hole, a plurality of balls are uniformly mounted on two side walls of the connector lug in a rolling manner, and the balls are tightly attached to the side walls of the movable hole.
The ball can reduce the friction between the connector lug and the movable hole, can avoid the memory alloy wire not pushing the connector lug or pulling the connector lug caused by overlarge friction between the connector lug and the movable hole, and is beneficial to the electrifying and the outage of the semiconductor refrigerating sheet.
Compared with the prior art, the invention has the beneficial effects that:
1. Through setting up refrigerating mechanism, after the work of semiconductor refrigeration piece, the both ends of semiconductor refrigeration piece can produce heat transfer, the heat will be followed one end and is shifted the other end to produce the difference in temperature, further form the cold junction, the cold junction can refrigerate the second heating panel, reach the cooling effect to the motor, the heat at hot junction passes through the fan blade guide simultaneously, can get into in the location section of thick bamboo from first heating panel, further discharge in the motor of air-blower, can reduce the temperature at semiconductor refrigeration piece hot junction, because the difference in temperature at semiconductor refrigeration piece both ends can reach between 45-60 degrees, therefore cold junction temperature can correspondingly drop, can improve the cooling effect.
2. Through setting up induction system, when fan blade radiating effect is relatively poor, the temperature in the motor begins to rise gradually this moment, the heat-conducting plate can give the memory alloy silk with the temperature transfer in the motor simultaneously, this moment memory alloy silk begins the thermal expansion, the memory alloy silk can promote the connector lug to the connection terminal removal, after connector lug and connection terminal contact, semiconductor refrigeration piece begins the circular telegram work this moment, can cool down the motor, after the temperature in the motor drops, the memory alloy silk begins to meet cold shrink, thereby the connector lug can separate with the connection terminal, make the semiconductor refrigeration piece in time outage stop work, can reduce the energy consumption, and the ball can reduce the friction between connector lug and the movable hole, can avoid the too big friction between connector lug and the movable hole to lead to the memory alloy silk can not promote the connector lug or pulling connector lug, be favorable to the circular telegram and the outage of semiconductor refrigeration piece.
3. Through setting up spacing subassembly, when the installation semiconductor refrigeration piece, the user inserts the spacing intra-annular with the semiconductor refrigeration piece, spacing head receives the extrusion this moment, can shrink to the movable inslot, after the spacing inslot removes to the position corresponding with spacing head, the spring can push away the spacing head to the spacing inslot, further with semiconductor refrigeration piece card in the spacing intra-annular, the mounting means is simple, can improve installation effectiveness, when the semiconductor refrigeration piece needs to dismantle, through the downward poking driving lever, the driving lever can remove in the recess, the driving lever can drive the spacing head simultaneously and follow the spacing inslot and slide for semiconductor refrigeration piece breaks away from each other with the spacing ring, the convenience takes out semiconductor refrigeration piece.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a rear view of the positioning cartridge of the present invention;
FIG. 3 is a front view of the present invention;
FIG. 4 is a cross-sectional view of the invention A-A;
FIG. 5 is a schematic view of a refrigeration mechanism according to the present invention;
FIG. 6 is an enlarged view of D of FIG. 4 in accordance with the present invention;
Fig. 7 is an enlarged view of B of fig. 2 according to the present invention.
In the figure: 1. a positioning cylinder; 2. a fan blade; 3. a mounting plate; 4. a first heat dissipation plate; 5. a semiconductor refrigeration sheet; 6. a second heat dissipation plate; 7. a mounting groove; 8. a motor; 9. a heat radiation fin; 10. sealing the cavity; 11. a heat conducting liquid; 12. a limiting ring; 13. a movable hole; 14. a ball; 15. a connector lug; 16. a wire holder; 17. a memory alloy wire; 18. a heat conductive plate; 19. a movable groove; 20. a spring; 21. a positioning head; 22. a deflector rod; 23. a limit groove; 24. a refrigeration mechanism; 25. a limit component; 26. and an induction mechanism.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention solves the technical problems that the heat radiation efficiency is low because the heat radiation fan provided in the background technology can rotate only by the motor, the heating source is increased, and the hot air can not be diffused in time after being discharged and is easily sucked into the motor casing.
The technical scheme in the embodiment of the invention aims to solve the technical problems, and the overall thought is as follows: when the heat dissipation effect is poor, the temperature in the motor starts to rise gradually, the memory alloy wire is heated and expanded to push the connector lug to move towards the connector holder, and when the connector lug is contacted with the connector holder, the refrigerating mechanism starts to work;
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 7, the present invention provides a heat dissipation structure for a motor in a centrifugal high-speed blower, which has the following technical scheme:
A heat dissipating structure for a motor in a centrifugal high speed blower, comprising: the edge of the front wall of the positioning cylinder 1 is uniformly and fixedly connected with four mounting plates 3,
Further comprises:
The motor 8 is fixedly arranged on the inner wall of the positioning cylinder 1, the motor 8 is driven by a power supply, and the output end of the motor 8 is fixedly connected with the fan blade 2;
A mounting groove 7 arranged on the rear wall of the positioning cylinder 1; a cooling mechanism 24 for improving the heat radiation effect is provided in the installation groove 7.
Firstly, install the section of thick bamboo 1 in the motor of air-blower through mounting panel 3, then to motor 8 circular telegram, motor 8 can drive fan blade 2 and rotate in the section of thick bamboo 1 of location, can dispel the heat with the hot air in the motor, the motor heat dissipation air current directly discharges from the section of thick bamboo 1 after the motor, the air current flow shortens, the structure is simplified, simultaneously the cost is reduced, the reliability is strengthened, when the radiating effect is relatively poor, refrigeration mechanism 24 begins work, can refrigerate in the motor, can reduce the temperature of hot air, can improve the radiating effect.
As an embodiment of the present invention, referring to fig. 5, the refrigeration mechanism 24 includes a first heat dissipation plate 4 and a second heat dissipation plate 6, where the first heat dissipation plate 4 is matched with the mounting groove 7, the outer side walls of the first heat dissipation plate 4 and the second heat dissipation plate 6 are fixedly connected with a plurality of heat dissipation fins 9, the inner walls of the first heat dissipation plate 4 and the second heat dissipation plate 6 are fixedly connected with limiting rings 12, a semiconductor refrigeration piece 5 is jointly inserted between the two limiting rings 12, and the semiconductor refrigeration piece 5 is driven by a power source.
After the semiconductor refrigerating sheet 5 works, heat transfer can be generated at the two ends of the semiconductor refrigerating sheet 5, the heat can be transferred from one end to the other end, so that a temperature difference is generated, a cold end and a hot end are further formed, the cold end can refrigerate the second radiating plate 6, the cooling effect on a motor is achieved, meanwhile, the heat at the hot end is guided by the fan blade 2, can enter the positioning cylinder 1 from the first radiating plate 4, is further discharged from the motor of the blower, the temperature of the hot end of the semiconductor refrigerating sheet 5 can be reduced, and the temperature difference at the two ends of the semiconductor refrigerating sheet 5 can reach between 40 and 65 ℃, so that the temperature of the cold end can be correspondingly reduced, and the cooling effect can be improved.
As an embodiment of the present invention, referring to fig. 4 to 5, the semiconductor refrigeration sheet 5 is closely attached to both the first heat dissipation plate 4 and the second heat dissipation plate 6, and both ends of the semiconductor refrigeration sheet 5 are coated with heat conductive silicone grease.
The heat conduction silicone grease can ensure the heat conduction efficiency between the semiconductor refrigeration piece 5 and the first heat dissipation plate 4 and the second heat dissipation plate 6, and is beneficial to the heat dissipation and refrigeration of the semiconductor refrigeration piece 5.
As an embodiment of the present invention, referring to fig. 7, two movable grooves 19 are symmetrically formed on the inner wall of the limiting ring 12, limiting components 25 are respectively arranged in the movable grooves 19, the limiting components 25 comprise a limiting head 21 slidably installed in the movable grooves 19, a spring 20 is fixedly connected to the bottom end of the limiting head 21, the other end of the spring 20 is fixedly connected to the bottom wall of the movable groove 19, and a limiting groove 23 matched with the limiting head 21 is formed on the side wall of the semiconductor refrigeration piece 5.
When the semiconductor refrigeration piece 5 is installed, a user inserts the semiconductor refrigeration piece 5 into the limiting ring 12, the limiting groove 21 is extruded and can be contracted into the movable groove 19, after the limiting groove 23 moves to a position corresponding to the limiting head 21, the spring 20 can push the limiting head 21 into the limiting groove 23, the semiconductor refrigeration piece 5 is further clamped in the limiting ring 12, the installation mode is simple, and the installation efficiency can be improved.
As an embodiment of the present invention, referring to fig. 7, a deflector 22 is fixedly connected to a side wall of the limit head 21, a groove for moving the deflector 22 is formed on a side wall of the limit ring 12, and the groove is communicated with the movable groove 19.
When the semiconductor refrigeration piece 5 needs to be disassembled, the deflector rod 22 can move in the groove by downwards poking the deflector rod 22, and meanwhile, the deflector rod 22 can drive the limit head 21 to slide out of the limit groove 23, so that the semiconductor refrigeration piece 5 and the limit ring 12 are separated from each other, and the semiconductor refrigeration piece 5 is conveniently taken out.
As an embodiment of the present invention, referring to fig. 4, a sealing cavity 10 is formed in the second heat dissipation plate 6, the sealing cavity 10 is filled with a heat conduction liquid 11, and a liquid surface of the heat conduction liquid 11 is located near an upper end of a side wall of the sealing cavity 10.
The heat conduction liquid 11 can absorb heat generated by the motor, heat dissipation of the motor is facilitated, after the refrigerating mechanism 24 works, the semiconductor refrigerating sheet 5 can refrigerate the heat conduction liquid 11, and as the heat conduction liquid 11 is not filled in the whole sealing cavity 10, expansion of the heat conduction liquid 11 after solidification can be avoided to burst the sealing cavity 10.
As an embodiment of the present invention, referring to fig. 6, a movable hole 13 is formed in a side wall at the top end of the second heat dissipation plate 6, a sensing mechanism 26 is disposed in the movable hole 13, the sensing mechanism 26 includes a heat conduction plate 18 fixedly installed in the movable hole 13, one end of the heat conduction plate 18 extends out of the side wall of the second heat dissipation plate 6, the other end of the heat conduction plate 18 is fixedly connected with a memory alloy wire 17, the other end of the memory alloy wire 17 is fixedly connected with a connector lug 15, the connector lug 15 is electrically connected with a power supply, a connector lug 16 matched with the connector lug 15 is fixedly connected on the side wall of the movable hole 13, and the connector lug 16 is electrically connected with the semiconductor refrigeration sheet 5.
When the fan blade 2 is poor in heat dissipation effect, the temperature in the motor starts to rise gradually, meanwhile, the heat conducting plate 18 can transfer the temperature in the motor to the memory alloy wire 17, the memory alloy wire 17 starts to be heated and expanded, the memory alloy wire 17 can push the connector lug 15 to move towards the connector holder 16, after the connector lug 15 is contacted with the connector holder 16, the semiconductor refrigerating piece 5 starts to be electrified and works, the motor can be cooled, after the temperature in the motor is reduced, the memory alloy wire 17 starts to shrink when encountering cold, and therefore the connector lug 15 can be separated from the connector holder 16, the semiconductor refrigerating piece 5 is powered off in time and stops working temporarily, and energy consumption can be reduced.
As an embodiment of the present invention, referring to fig. 6, the connector lug 15 is slidably mounted in the movable hole 13, a plurality of balls 14 are uniformly mounted on both side walls of the connector lug 15 in a rolling manner, and the balls 14 are closely adhered to the side walls of the movable hole 13.
The ball 14 can reduce the friction between the connector lug 15 and the movable hole 13, can avoid the memory alloy wire 17 from being capable of pushing the connector lug 15 or pulling the connector lug 15 due to overlarge friction between the connector lug 15 and the movable hole 13, and is beneficial to the power on and power off of the semiconductor refrigeration piece 5.
Working principle: firstly, the positioning cylinder 1 is arranged in a motor of a blower through the mounting plate 3, then the motor 8 is electrified, the motor 8 can drive the fan blade 2 to rotate in the positioning cylinder 1, hot air in the motor can be discharged for heat dissipation, the heat dissipation airflow of the motor is directly discharged from the positioning cylinder 1 after passing through the motor, the airflow flow is shortened, the structure is simplified, the cost is reduced, the reliability is enhanced, when the heat dissipation effect of the fan blade 2 is poor, the temperature in the motor begins to rise gradually, the heat conducting plate 18 can transmit the temperature in the motor to the memory alloy wire 17, the memory alloy wire 17 begins to be heated and expanded, the memory alloy wire 17 can push the connector lug 15 to move towards the connector lug 16, when the connector lug 15 contacts with the connector lug 16, the semiconductor refrigerating piece 5 begins to be electrified, and heat transfer can be generated at two ends of the semiconductor refrigerating piece 5, the heat is transferred from one end to the other end, thereby generating a temperature difference, further forming a cold end and a hot end, the cold end can refrigerate the second heat radiation plate 6 to achieve the cooling effect on the motor, meanwhile, the heat at the hot end is guided by the fan blade 2, can enter the positioning cylinder 1 from the first heat radiation plate 4 and is further discharged from the motor of the blower, the temperature of the hot end of the semiconductor refrigerating sheet 5 can be reduced, the temperature difference of the two ends of the semiconductor refrigerating sheet 5 can reach between 40 and 65 ℃, the temperature of the cold end can correspondingly be reduced, the cooling effect can be improved, after the temperature in the motor is reduced, the memory alloy wire 17 starts to shrink when the temperature in the motor is reduced, the connector lug 15 can be separated from the wire holder 16, the semiconductor refrigerating sheet 5 is temporarily stopped from power off in time, the energy consumption can be reduced, the heat conducting liquid 11 can absorb the heat generated by the motor in the use process, the heat dissipation of the motor is facilitated, after the refrigerating mechanism 24 works, the semiconductor refrigerating piece 5 can refrigerate the heat conduction liquid 11, because the heat conduction liquid 11 is not fully filled in the whole sealing cavity 10, the sealing cavity 10 is broken through expansion after solidification of the heat conduction liquid 11 can be avoided, meanwhile, the balls 14 can reduce friction between the connector lug 15 and the movable hole 13, the situation that the memory alloy wire 17 cannot push the connector lug 15 or pull the connector lug 15 due to overlarge friction between the connector lug 15 and the movable hole 13 can be avoided, the semiconductor refrigerating piece 5 is facilitated to be electrified and powered off, when the semiconductor refrigerating piece 5 is installed, a user inserts the semiconductor refrigerating piece 5 into the limiting ring 12, the limiting head 21 is extruded, the limiting head 21 can be contracted into the movable groove 19, after the limiting groove 23 moves to a position corresponding to the limiting head 21, the spring 20 can push the limiting head 21 into the limiting groove 23, the semiconductor refrigerating piece 5 is further clamped in the limiting ring 12, the installation mode is simple, the installation efficiency can be improved, when the semiconductor refrigerating piece 5 is required to be detached, the semiconductor refrigerating piece 5 can be conveniently pulled out of the limiting ring 22 through pulling down the sliding rod 22, and the semiconductor refrigerating piece 5 can be conveniently pulled out of the limiting ring 22.
In the description of the present invention, it should be understood that the terms "center", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present invention.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A heat dissipating structure for a motor in a centrifugal high speed blower, comprising: the positioning cylinder (1), the edge position of the front wall of the positioning cylinder (1) is uniformly and fixedly connected with four mounting plates (3), and is characterized in that,
Further comprises:
The motor (8) is fixedly arranged on the inner wall of the positioning cylinder (1), the motor (8) is driven by a power supply, and the output end of the motor (8) is fixedly connected with the fan blade (2);
A mounting groove (7) arranged on the rear wall of the positioning cylinder (1); a refrigerating mechanism (24) for improving the heat dissipation effect is arranged in the mounting groove (7);
The refrigerating mechanism (24) comprises a first radiating plate (4) and a second radiating plate (6), the first radiating plate (4) is matched with the mounting groove (7), a plurality of radiating fins (9) are fixedly connected to the outer side walls of the first radiating plate (4) and the second radiating plate (6), limiting rings (12) are fixedly connected to the inner walls of the first radiating plate (4) and the second radiating plate (6), a semiconductor refrigerating sheet (5) is jointly inserted between the two limiting rings (12), and the semiconductor refrigerating sheet (5) is driven by a power supply;
The semiconductor refrigerating sheet (5) is tightly attached to the first radiating plate (4) and the second radiating plate (6), and heat-conducting silicone grease is smeared at two ends of the semiconductor refrigerating sheet (5);
A sealing cavity (10) is formed in the second heat dissipation plate (6), heat conduction liquid (11) is filled in the sealing cavity (10), and the liquid level of the heat conduction liquid (11) is located at the position, close to the upper end, of the side wall of the sealing cavity (10);
The utility model discloses a semiconductor refrigerating chip, including second heating panel (6), including second heating panel, set up movable hole (13) in the lateral wall on top, be provided with induction mechanism (26) in movable hole (13), induction mechanism (26) are including heat conduction board (18) of fixed mounting in movable hole (13), the one end of heat conduction board (18) extends to outside the lateral wall of second heating panel (6), the other end fixedly connected with memory alloy silk (17) of heat conduction board (18), the other end fixedly connected with connector lug (15) of memory alloy silk (17), and connector lug (15) and power electric connection, fixedly connected with and connector lug (15) matched with connector lug (16) on the lateral wall of movable hole (13), and connector lug (16) and semiconductor refrigerating chip (5) electric connection.
2. A heat dissipating structure for a motor in a centrifugal high speed blower according to claim 1, wherein: two movable grooves (19) are symmetrically formed in the inner wall of the limiting ring (12), limiting components (25) are arranged in the movable grooves (19), each limiting component (25) comprises a limiting head (21) which is slidably mounted in each movable groove (19), a spring (20) is fixedly connected to the bottom end of each limiting head (21), the other end of each spring (20) is fixedly connected with the bottom wall of each movable groove (19), and limiting grooves (23) matched with the corresponding limiting heads (21) are formed in the side wall of each semiconductor refrigerating piece (5).
3. A heat dissipating structure for a motor in a centrifugal high-speed blower according to claim 2, wherein: the side wall of the limiting head (21) is fixedly connected with a deflector rod (22), the side wall of the limiting ring (12) is provided with a groove for the deflector rod (22) to move, and the groove is communicated with the movable groove (19).
4. A heat dissipating structure for a motor in a centrifugal high speed blower according to claim 1, wherein: the connector lug (15) is slidably mounted in the movable hole (13), a plurality of balls (14) are uniformly mounted on the two side walls of the connector lug (15) in a rolling mode, and the balls (14) are tightly attached to the side walls of the movable hole (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210765926.4A CN115149724B (en) | 2022-07-01 | 2022-07-01 | Heat radiation structure for motor in centrifugal high-speed blower |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210765926.4A CN115149724B (en) | 2022-07-01 | 2022-07-01 | Heat radiation structure for motor in centrifugal high-speed blower |
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| CN115149724A CN115149724A (en) | 2022-10-04 |
| CN115149724B true CN115149724B (en) | 2024-04-23 |
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| CN115206734B (en) * | 2022-09-14 | 2022-11-15 | 广州市兆能有限公司 | Relay with overcurrent protection |
| CN115987025B (en) * | 2023-01-05 | 2023-09-08 | 宁波意卡德电器科技有限公司 | Motor for air purifier |
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| CN210892830U (en) * | 2019-08-06 | 2020-06-30 | 田野 | Auxiliary heat dissipation equipment |
| CN111651021A (en) * | 2020-05-27 | 2020-09-11 | 大连赢得科技有限公司 | A high-efficient cooling mechanism for computer fixed terminal |
| CN214436449U (en) * | 2021-02-01 | 2021-10-22 | 深圳市未来像素科技有限公司 | Heat dissipation base of game machine |
| CN214623536U (en) * | 2021-04-23 | 2021-11-05 | 商洛学院 | Computer for computer lab with remove dust and destatic function |
| CN215833868U (en) * | 2021-10-15 | 2022-02-15 | 赵琳 | Computer heat dissipation cooling device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210892830U (en) * | 2019-08-06 | 2020-06-30 | 田野 | Auxiliary heat dissipation equipment |
| CN111651021A (en) * | 2020-05-27 | 2020-09-11 | 大连赢得科技有限公司 | A high-efficient cooling mechanism for computer fixed terminal |
| CN214436449U (en) * | 2021-02-01 | 2021-10-22 | 深圳市未来像素科技有限公司 | Heat dissipation base of game machine |
| CN214623536U (en) * | 2021-04-23 | 2021-11-05 | 商洛学院 | Computer for computer lab with remove dust and destatic function |
| CN215833868U (en) * | 2021-10-15 | 2022-02-15 | 赵琳 | Computer heat dissipation cooling device |
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| CN115149724A (en) | 2022-10-04 |
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