CN115146419A - Liquid cooling radiating plate flow passage modeling method - Google Patents

Liquid cooling radiating plate flow passage modeling method Download PDF

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CN115146419A
CN115146419A CN202210927402.0A CN202210927402A CN115146419A CN 115146419 A CN115146419 A CN 115146419A CN 202210927402 A CN202210927402 A CN 202210927402A CN 115146419 A CN115146419 A CN 115146419A
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flow channel
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flow path
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解立垚
张煦哲
陈占秀
闵春华
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Hebei University of Technology
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Abstract

The invention provides a liquid cooling radiating plate flow passage modeling method, which belongs to the technical field of heat dissipation and comprises the steps of determining the size of a two-dimensional calculation domain according to the size of a radiating plate; determining the flow rate of the fluid according to the inlet fluid parameters of the heat dissipation plate and the heat dissipation strength; introducing design variables of a two-dimensional calculation domain, and unifying the two-dimensional calculation domain which is scattered into a fluid structure unit or a solid structure unit through the design variables; setting and solving control equations of the fluid structure unit and the solid structure unit, and setting a topological optimization objective function and constraint conditions of a two-dimensional calculation domain according to the requirements of heat dissipation and resistance; iterating the control equation by adopting a moving asymptote algorithm, judging whether convergence occurs according to a target function and a constraint condition of topological optimization, and generating an output material factor graph of a two-dimensional flow channel model corresponding to the target function; and (4) guiding the output material factor graph into a two-dimensional flow channel model and establishing a three-dimensional flow channel model. The heat dissipation performance of the topology optimization flow channel is better than that of a common parallel straight flow channel.

Description

Liquid cooling radiating plate flow passage modeling method
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a liquid cooling heat dissipation plate flow passage modeling method.
Background
In recent years, with the rapid development of aerospace, energy power and electronic information industries, various advanced technologies are changing day by day, the power density of electronic equipment is rapidly improved, and the heat flux density of a latest generation CPU chip reaches 10000W/m 2 . Therefore, how to balance the heat transfer performance and the pressure loss becomes one of the key issues that must be solved in designing a high-efficiency heat exchanger.
At present, the heat exchanger still adopts the natural convection or forced convection mode of the traditional fin heat sink on the heat radiation mode. Single-phase liquid cooling has become the dominant technique due to the complexity constraints of the heat dissipation structure, and the conventional single-phase straight liquid cooling channel is a Rectangular (RCP) type) arrangement, which has several significant disadvantages, such as higher hydraulic resistance generated by the flow channel, and higher temperature gradient and average temperature caused by poor heat dissipation effect. For example, as shown in fig. 1, in a general rectangular parallel flow channel, a vortex is generated at each corner, which causes the coolant to flow very slowly in the third, fourth and fifth secondary channels, the total fluid pressure is reduced in the flow direction according to the bernoulli principle, and the static pressure is reduced in the flow direction due to the friction force generated by the main channel walls, thereby causing poor flow distribution and poor heat dissipation.
Therefore, the conventional straight liquid cooling flow channel cannot meet the heat dissipation requirement of the current electronic equipment, so that a more optimized radiating fin or a radiator is required to be used for assisting the heat dissipation of the electronic equipment so as to guarantee the operating power and the service life of the equipment.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a liquid cooling radiating plate flow channel modeling method.
In order to achieve the above purpose, the invention provides the following technical scheme:
a modeling method for a flow passage of a liquid cooling radiating plate comprises the following steps of:
determining the size of a two-dimensional calculation domain according to the size of the heat dissipation plate;
determining the flow rate of the fluid according to the inlet fluid parameters and the heat dissipation strength of the heat dissipation plate;
introducing design variables of the two-dimensional calculation domain, and unifying the two-dimensional calculation domain which is dispersed into a fluid structure unit or a solid structure unit through the design variables;
setting and solving control equations of the fluid structural units and the solid structural units;
setting an objective function and a constraint condition of the topological optimization of the two-dimensional calculation domain according to the requirements of heat dissipation and resistance;
iterating the control equation by adopting a moving asymptote algorithm, judging whether convergence occurs according to the target function of the topological optimization and the constraint condition, and generating an output material factor graph of the two-dimensional flow channel model corresponding to the target function;
guiding the output material factor graph into a two-dimensional flow channel model;
and establishing a three-dimensional flow channel model according to the two-dimensional flow channel model.
Preferably, the two-dimensional calculation domain includes a heat dissipation surface of the heat dissipation plate, a fluid inlet, and a fluid outlet.
Preferably, the fluid inlet and the fluid outlet are diagonally distributed on two sides of the heat dissipation surface.
Preferably, the topology optimization method used for setting the structural unit of the two-dimensional calculation domain is a variable density topology optimization method.
Preferably, the design variables are an interpolation function and γ.
Preferably, the inlet fluid parameters of the heat dissipation plate comprise a fluid inlet flow speed and a fluid initial temperature, the fluid inlet flow speed is 0.01m/s-1m/s, and the fluid initial temperature is 293.15K.
Preferably, the governing equation of the fluid structural unit is governed by a continuity equation, a momentum equation and an energy equation.
Preferably, the continuity equation is:
Figure BDA0003780241550000021
wherein u is the fluid flow rate,
Figure BDA0003780241550000022
is Laplace operator;
the momentum equation is as follows:
Figure BDA0003780241550000031
wherein rho is the density of the fluid, P is the pressure of the fluid, mu is the kinematic viscosity of the fluid, and F is the volume force applied to the fluid;
the energy equation is:
Figure BDA0003780241550000032
where γ is the design variable, ρ is the density of the fluid, c p Is specific heat capacity, k f Is the thermal conductivity, k, of the fluid s Is the thermal conductivity of the solid, Q is the heat source intensity, and T is the temperature.
Preferably, the topological optimization constraint is a percentage of the total area occupied by the fluid structural unit.
Preferably, the two-dimensional flow channel model generates the three-dimensional flow channel model by smoothing and stretching.
The modeling method of the liquid cooling plate runner provided by the invention has the following beneficial effects:
the topological optimization flow channel model established by the invention adopts a streamline channel layout, can provide a larger heat exchange surface area under the same volume fraction, and has a better heat dissipation effect than that of a common parallel straight flow channel; in addition, under the condition of topology optimization design, the streamline flow channel structure is obtained, so that the flow rate of the fluid is relatively uniform along the channel, the loss along the way and the local loss of the fluid are reduced, the pressure drop of the inlet and the outlet of the fluid can be reduced to 57 percent of that of the common parallel flow channel by the topology optimization flow channel, and the flow loss of the fluid is reduced.
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In order to more clearly illustrate the embodiments of the present invention and the design thereof, the drawings required for the embodiments will be briefly described below. The drawings in the following description are only some embodiments of the invention and it will be clear to a person skilled in the art that other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic diagram of a common parallel liquid cooling DC channel;
FIG. 2 is a schematic diagram of a topology-optimized liquid-cooled flow path;
FIG. 3 is a horizontal sectional view of a topologically optimized liquid cooling flow path;
FIG. 4 is a graph of average fin temperature as a function of heat source intensity for a fixed fluid inlet flow rate of 0.4 m/s;
FIG. 5 shows that the fixed heat source intensity is 10000W/m 2 In the case of (3), the average fin temperature is a function of the fluid inlet flow rate;
FIG. 6 is a graph showing that the intensity of a fixed heat source is 10000W/m 2 The pressure drop of the fluid inlet and outlet and the pressure drop ratio of the fluid inlet and outlet are related to the flow rate of the fluid inlet and outlet.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present invention and can practice the same, the present invention will be described in detail with reference to the accompanying drawings and specific examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing technical solutions of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, e.g., as a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. In the description of the present invention, unless otherwise specified, "a plurality" means two or more, and will not be described in detail herein.
Examples
The invention provides a liquid cooling radiating plate flow channel modeling method, and particularly relates to a method for modeling a radiating surface and a fluid inlet and outlet of a radiating plate as shown in figures 1-6, which comprises the following steps:
step 1: the size of the two-dimensional computational domain, which includes the heat-dissipating surface of the heat-dissipating plate, the fluid inlet, and the fluid outlet, is determined according to the size of the heat-dissipating plate (as shown in fig. 1). The serpentine heat dissipation flow channel (SCP type) has better heat dissipation effect than the straight heat dissipation flow channel (RCP type), so the fluid inlet and the fluid outlet are selected to be distributed on two sides of the heat dissipation surface in an oblique and diagonal manner.
Step 2: and determining the fluid flow rate according to the inlet fluid parameters of the heat dissipation plate and the heat dissipation strength, wherein the inlet fluid parameters of the heat dissipation plate comprise the fluid inlet flow rate and the initial fluid temperature, the fluid inlet flow rate is 0.01m/s-1m/s, and the initial fluid temperature is 293.15K.
And step 3: and introducing design variables of the two-dimensional calculation domain, and unifying the two-dimensional calculation domain which is dispersed into a fluid structural unit or a solid structural unit through the design variables.
The topological optimization method is a topological optimization method of a variable density method, wherein discretization structural units in a two-dimensional calculation domain are unified into fluid structural units and solid structural units through an interpolation function and a design variable gamma, when the structural units are solid, gamma =0, and when the structural units are fluid, gamma =1, and the expression is as follows:
Figure BDA0003780241550000051
where x is the structural unit coordinate, Ω f Is the fluid domain, Ω s Is a solid domain.
And 4, step 4: setting and solving control equations of the fluid structural unit and the solid structural unit; the governing equations of the fluid building blocks are governed by continuity equations, momentum equations and energy equations.
The governing equations of the fluid building blocks are governed by continuity equations and momentum equations.
The flow is represented by the continuity equation:
Figure BDA0003780241550000052
wherein u is the flow rate of the fluid,
Figure BDA0003780241550000053
is the laplacian operator.
The momentum equation:
Figure BDA0003780241550000054
wherein ρ is the density of the fluid, P is the pressure of the fluid, μ is the kinematic viscosity of the fluid, and F is the volume force applied to the fluid.
Since the computational domain is a fluid or solid structural unit, the volume force experienced by the fluid is related to the reverse permeability of the porous medium and the flow rate of the fluid. The volume force F borne by the fluid in the momentum equation is as follows:
F=-αu
where α is the reverse permeability of the porous media, related to γ, and u is the fluid flow rate.
Therefore, an interpolation function needs to be set:
Figure BDA0003780241550000061
wherein q is a penalty factor and gamma is a design variable.
Wherein the maximum reverse permeability alpha max The algorithm of (1) is as follows:
Figure BDA0003780241550000062
where Da is the Darcy number of the fluid, L is the equivalent diameter of the flow channel, and η is the dynamic viscosity of the fluid.
Or
Figure BDA0003780241550000063
Where Re is the Reynolds number of the fluid and Da is the Darcy number of the fluid.
The velocity of the solid region is 0 according to the momentum equation. The thermal conductivities of the two regions are integrated by linear interpolation to obtain energy equations of the fluid structural unit and the solid structural unit.
The energy equation is as follows:
Figure BDA0003780241550000064
where γ is the design variable, ρ is the density of the fluid, c p Is specific heat capacity, k f Is the thermal conductivity of the fluid, k s Is the thermal conductivity of the solid, Q is the heat source intensity, and T is the temperature.
And 5: setting a topological optimization objective function and constraint conditions of a two-dimensional calculation domain according to the requirements of heat dissipation and resistance; the topological optimization constraint is the percentage of the total area occupied by the fluid structural unit.
The objective function is composed of two parts, namely the objective function is changed from the original average temperature of a calculation domain to the minimum of the sum of the average temperature of the calculation domain and the pressure drop of an inlet and an outlet, and the optimization degrees of two different optimization objects are different. The objective function consists of two parts: minimum calculated domain average temperature ratio (F) T ) And minimum inlet-outlet total pressure drop ratio (F) p )。
Minimum calculated domain average temperature ratio (F) T ):
F T =∫T i dΩ/∫T 0
Wherein: t is a unit of i Is the final temperature, T, of each structural unit 0 Omega is the calculated domain area for the initial temperature of the building block.
Minimum inlet/outlet total pressure drop ratio (F) p )
Figure BDA0003780241550000071
Wherein P is out Average pressure, P, of the fluid outlet in Is the fluid inlet average pressure.
Defining the ratio of the pressure drop coefficient and the temperature change coefficient in the objective function as a weighted coefficient ratio w 1 :w 2 Different combinations of (a), (b), w 1 And w 2 Values are taken according to different requirements of designers, and w 1 、w 2 The sum is 1, so the objective function F is:
F=w 1 F p +w 2 F T
and 6: and iterating the control equation by adopting a moving asymptote algorithm, judging whether convergence occurs according to a target function and a constraint condition of topology optimization, and generating an output material factor graph of the two-dimensional flow channel model corresponding to the target function.
And 7: the output material factor was guided to a two-dimensional flow channel model in COMSOL Multiphysics.
And 8: and establishing a three-dimensional flow channel model according to the two-dimensional flow channel model.
And smoothing and stretching the two-dimensional flow channel into a three-dimensional model, namely finishing the design of the three-dimensional topology optimization heat dissipation flow channel, as shown in fig. 1.
The flow channel structure of the invention is divided into a first-stage flow channel, a second-stage flow channel and a third-stage flow channel, wherein I and II in figure 2 are the first-stage flow channel which is equivalent to a trunk circuit in a parallel flow channel, 1-6 are the second-stage flow channels which are equivalent to branch circuits in the parallel flow channel, and a-j are the third-stage flow channels.
The cooling effect of the heat dissipation channel is obviously improved along with the increase of the flow rate (flow velocity) of the fluid in the finally designed topology optimization channel, and the data is converted into a line graph 5 as shown in the figure, so that under the conditions of different inlet flow velocities, all temperature indexes of the topology optimization channel are lower than those of a common channel, namely the cooling capacity of the topology optimization channel is better than that of the common channel; in addition, as shown in fig. 4, as the intensity of the heat source increases, the average temperature and the maximum temperature of the topology optimization flow channel are respectively lower than the average temperature of the common flow channel.
The topologically optimized flow channel always exhibits a flow resistance reducing effect superior to that of the general flow channel, and as shown in fig. 6, the pressure drop of the topologically optimized flow channel is always smaller than that of the general flow channel in the process of increasing the inlet flow rate from 0.01m/s to 1 m/s. And with the increase of the flow velocity of the inlet fluid, the pressure drop ratio of the topology optimization flow channel and the common flow channel shows the trend of increasing after decreasing, and reaches the minimum value when the flow velocity of the fluid inlet is 0.4 m/s. This means that before the inlet flow velocity of the fluid is increased to 0.4m/s, the effect of reducing the flow resistance shown by the topology optimization flow channel is more obvious along with the increase of the inlet flow velocity of the fluid, and the effect is shown that the pressure drop ratio of the inlet and the outlet of the fluid of the topology optimization flow channel and the fluid of the common parallel flow channel is monotonically reduced. Therefore, in practical application, when the heat source intensity is high and a large flow of fluid is needed to cool the radiating fins, namely the fluid inlet flow velocity is high, the flow resistance optimization effect of the topological optimization flow channel is more obvious than that of a common flow channel.
From the above description, the topological optimization flow channel model established by the invention adopts a streamline channel layout, can provide a larger heat exchange surface area under the same volume fraction, and has a much better heat dissipation effect than that of a common parallel straight flow channel; in addition, under the condition of topology optimization design, the streamline flow channel structure is obtained, so that the flow rate of the fluid is relatively uniform along the channel, the loss along the way and the local loss of the fluid are reduced, the pressure drop of the inlet and the outlet of the fluid can be reduced to 57 percent of that of the common parallel flow channel by the topology optimization flow channel, and the flow loss of the fluid is reduced.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and any simple changes or equivalent substitutions of the technical solutions that can be obviously obtained by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.

Claims (10)

1. A liquid cooling heat dissipation plate flow channel modeling method is characterized by comprising the following steps:
determining the size of a two-dimensional calculation domain according to the size of the radiating plate;
determining the flow rate of the fluid according to the inlet fluid parameters of the heat dissipation plate and the heat dissipation strength;
introducing design variables of the two-dimensional calculation domain, and unifying the two-dimensional calculation domain which is dispersed into a fluid structural unit or a solid structural unit through the design variables;
setting and solving control equations of the fluid structural units and the solid structural units;
setting an objective function and a constraint condition of the topological optimization of the two-dimensional calculation domain according to the requirements of heat dissipation and resistance;
iterating the control equation by adopting a moving asymptote algorithm, judging whether convergence occurs according to the target function of the topological optimization and the constraint condition, and generating an output material factor graph of the two-dimensional flow channel model corresponding to the target function;
guiding the output material factor graph into a two-dimensional flow channel model;
and establishing a three-dimensional flow channel model according to the two-dimensional flow channel model.
2. The method of modeling a flow path of a liquid cooled heat sink of claim 1, wherein said two dimensional computational domain includes a heat dissipating surface of said heat sink, a fluid inlet and a fluid outlet.
3. The method of claim 2, wherein the fluid inlet and the fluid outlet are diagonally distributed on both sides of the heat dissipating surface.
4. The method as set forth in claim 1, wherein said topological optimization method used for setting said structural unit of said two-dimensional calculation domain is a variable density topological optimization method.
5. The method of modeling a liquid cooled chiller plate flow path of claim 1 wherein said design variables are an interpolation function and γ.
6. The method of modeling a flow path of a liquid cooled heat sink of claim 1, wherein the inlet fluid parameters of the heat sink include a fluid inlet flow rate and a fluid initial temperature, the fluid inlet flow rate being 0.01m/s to 1m/s and the fluid initial temperature being 293.15K.
7. The method of modeling a flow path of a liquid cooled heat sink of claim 1, wherein the governing equations of the fluid building blocks are governed by a continuity equation, a momentum equation, and an energy equation.
8. The method of modeling a flow path of a liquid cooled heat sink of claim 7, wherein said continuity equation is:
Figure FDA0003780241540000021
wherein u is the fluid flow rate,
Figure FDA0003780241540000022
is a Laplace operator;
the momentum equation is as follows:
Figure FDA0003780241540000023
wherein rho is the density of the fluid, P is the pressure of the fluid, mu is the kinematic viscosity of the fluid, and F is the volume force applied to the fluid;
the energy equation is:
Figure FDA0003780241540000024
where γ is the design variable, ρ is the density of the fluid, c p Is specific heat capacity, k f Is the thermal conductivity, k, of the fluid s Is the thermal conductivity of the solid, Q is the heat source intensity, and T is the temperature.
9. The method of modeling a flow path of a liquid cooled heat sink of claim 1, wherein said topological optimization constraint is a percentage of a total area occupied by said fluid building blocks.
10. The liquid cooling panel flow path modeling method as set forth in claim 1, wherein said two-dimensional flow path model is smoothed and stretched to generate said three-dimensional flow path model.
CN202210927402.0A 2022-08-03 2022-08-03 Liquid cooling radiating plate flow passage modeling method Pending CN115146419A (en)

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Citations (2)

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Publication number Priority date Publication date Assignee Title
CN112084591A (en) * 2020-09-03 2020-12-15 西安电子科技大学 Radiator cooling channel design method based on three-dimensional topological optimization
CN113656974A (en) * 2021-08-20 2021-11-16 江苏科技大学 Dimensionless topological optimization design method for heat exchange plate of battery liquid cooling system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112084591A (en) * 2020-09-03 2020-12-15 西安电子科技大学 Radiator cooling channel design method based on three-dimensional topological optimization
CN113656974A (en) * 2021-08-20 2021-11-16 江苏科技大学 Dimensionless topological optimization design method for heat exchange plate of battery liquid cooling system

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Title
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