CN115141588A - Epoxy resin adhesive for Type C sealing and preparation method thereof - Google Patents
Epoxy resin adhesive for Type C sealing and preparation method thereof Download PDFInfo
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- CN115141588A CN115141588A CN202210752116.5A CN202210752116A CN115141588A CN 115141588 A CN115141588 A CN 115141588A CN 202210752116 A CN202210752116 A CN 202210752116A CN 115141588 A CN115141588 A CN 115141588A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to an epoxy resin adhesive for Type C sealing and a preparation method thereof, wherein the epoxy resin adhesive comprises, by weight, 10-20 parts of epoxy resin, 5-20 parts of alicyclic epoxy resin, 5-20 parts of toughening resin, 30-60 parts of filler, 0.1-5 parts of thixotropic agent, 0.1-1 part of coupling agent and 0.1-5 parts of thermal initiator. The adhesive has the advantages of small shrinkage, low thermal expansion coefficient, high SIR value, strong bonding force to various metal composite materials, good environmental reliability and rapid heating and curing, and solves the sealing and bonding problem between Type C structural members.
Description
Technical Field
The invention belongs to the field of epoxy adhesives, and particularly relates to a single-component epoxy resin adhesive suitable for sealing and bonding a Type C structural member.
Background
USB Type-C is an electronic equipment interface standard, also called USB-C, and is an upgrade version of USB Type-A/B. USB IF releases USB Type-C interface 1.0 standard in 8 months of 2014, and the standard specification of the next generation USB interface is established for the industry. Compare USBType A/B, USBType-C possesses apparent technical advantage, and the industry chain and the ecological chain that the huge power of industry was very formed begin to unify the electronic equipment interface gradually in addition, stride the comprehensive infiltration of hardware platform, and Type-C forms a big ecology. In 3 months 2019, the industry standard of USB4 is released, and brand new USB4 can provide 40Gbps transmission rate (the speed is twice of that of USB 3.2 Gen2 x2) and the power supply capacity is up to 100W; and, starting from USB 3.2 to USB4 including being in the process of being made, USB interfaces will all use USB Type-C interfaces, and traditional a and B Type interfaces will be completely eliminated. The message USB-IF forum of 26/5/2021 just announced that the USB-C2.1 revision will double the charging power of the interface more than one time, from 100W to 240W, which means that users will be able to use the USB-C interface to charge products such as notebook computers.
Along with the USB Type-C standard is high, the performance requirement is higher and higher, and the structural part in the USB Type-C is made of stainless steel, PCB and nylon, so that when the structural part is bonded or fixed by using a common epoxy resin adhesive, the curing shrinkage rate is large, the thermal expansion coefficient is high, the internal stress is large, the bonding force is low, and the phenomena of degumming and poor bonding are caused. Therefore, the development of the composite material has the advantages of small shrinkage rate, low thermal expansion coefficient, high SIR value, strong bonding force to various metal composite materials, good environmental reliability and rapid curing by heating, solves the problem of difficult sealing and bonding between Type C structural members, and becomes a trend requirement of the industry.
Disclosure of Invention
In order to solve the technical problem, the epoxy resin adhesive for Type C sealing is provided, has the advantages of small shrinkage rate, low thermal expansion coefficient, high SIR value, strong bonding force to various metal composite materials, good environmental reliability and quick curing by heating, and solves the problem of difficult sealing and bonding between Type C structural parts.
The technical scheme of the invention is as follows:
the epoxy resin adhesive for Type C sealing is characterized by comprising, by weight, 10-20 parts of epoxy resin, 5-20 parts of alicyclic epoxy resin, 5-20 parts of toughening resin, 30-60 parts of filler, 0.1-5 parts of thixotropic agent, 0.1-1 part of coupling agent and 0.1-5 parts of thermal initiator.
Further, the epoxy resin is broadly referred to as a bisphenol A epoxy resin, and the bisphenol A epoxy resin has a viscosity ranging from 8,000 to 14,000mPa · s/25 ℃.
Further, the viscosity of the alicyclic epoxy resin ranges from 50 to 500 mPa.s/25 ℃.
Further, the toughening resin is polyurethane modified epoxy resin, and the viscosity range is 30000-60000 mPa.s/25 ℃.
Further, the filler is one or two of silicon dioxide, barium sulfate, magnesium hydroxide, calcium carbonate, aluminum hydroxide, aluminum nitride and aluminum oxide.
Further, the thixotropic agent is one or two of organic bentonite and fumed silica.
Furthermore, the coupling agent is one or two of gamma-glycidoxypropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma- (methacryloyloxy) propyltrimethoxysilane and N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane.
Further, the photoinitiator is one or more of diazonium salt, diaryl iodonium salt, triaryl sulfonium salt, alkyl sulfonium salt, iron arene salt, sulfonyloxy ketone and triaryl siloxy ether.
Further, the thermal initiator is one or more of hexafluoroantimonate, hexafluorophosphate, diaryl iodonium salt and triaryl sulfonium salt.
Further, the preparation method of the epoxy resin adhesive for Type C sealing comprises the following steps:
placing bisphenol A epoxy resin, alicyclic epoxy resin and toughened resin in an environment of 50-80 ℃ for pre-drying for 6-12h, then putting into a planetary stirring kettle with vacuumizing equipment, adding an epoxy diluent and a coupling agent, stirring at a low speed (100-300 rpm) for 12-15min without vacuumizing, then opening a kettle cover, adding a filler and a thixotropic agent, continuing to stir at a low speed (100-300 rpm) for 12-15min without vacuumizing, cooling the material to below 25 ℃, then opening the kettle cover, adding a thermal initiator, and continuing to stir at a low speed (100-300 rpm) for 12-15min without vacuumizing; and finally, opening the vacuum equipment until the vacuum degree is more than 0.095MPa, increasing the rotating speed to 400-1000rpm, stirring for 40-120min, and discharging.
By the scheme, the invention at least has the following advantages:
the adhesive prepared by the invention is suitable for sealing a TypeC interface, and has the advantages of small shrinkage rate, low thermal expansion coefficient, high SIR value, strong bonding force to various metal composite materials, good environmental reliability and rapid curing by heating.
The foregoing is a summary of the present invention, and the following is a detailed description of the preferred embodiments of the present invention in order to provide a clear understanding of the technical features of the present invention.
Detailed Description
The following examples are given to further illustrate the embodiments of the present invention. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The test method adopted by the invention is as follows:
(1) Shore hardness: measured according to standard GB/T531.
(2) Coefficient of thermal expansion CTE: TMA compression mode, sample thickness 2mm (-20-200 deg.C, 5 deg.C/min heating, compression mode, heating-cooling-heating scanning, pre-stressing 0.05N (taking second heating process data).
(3) Tensile shear strength: and (3) bonding the aluminum composite ADC12 and the aluminum composite 6061, and bonding the aluminum composite ADC12 and the PCB, and performing Dage test at the speed of 10 mm/min.
(4) Elongation at break: a dog bone sample with a thickness of 1.2mm is prepared, treated by adopting a standard UV + thermosetting condition, and subjected to a mechanical tensile test at a gauge length of 40mm and a tensile speed of 50 mm/min.
(5) SIR value: prepared using 100 ℃ 30min heat curing conditions and then tested for the corresponding values in a double 85 humid heat ageing oven for 168 hours.
(6) Curing shrinkage rate: and testing the density of the glue before and after curing by a true density instrument.
(7) TMA compression mode, sample thickness 2mm (-20-200 deg.C, 5 deg.C/min heating, compression mode, heating-cooling-heating scanning, pre-stress 0.05N (data of second heating process)
(8) Airtightness: and (4) testing whether the air pressure is air leakage or not by adding 100Kpa to the Type C test piece.
Example 1
Putting 15 parts by weight of bisphenol A epoxy resin (with the viscosity of 10,000mPa & S at 25 ℃), 10 parts by weight of alicyclic epoxy resin (Xinnaxi S-28) and 20 parts by weight of polyurethane modified epoxy resin (with the viscosity of 35,000mPa & S at 25 ℃) in an environment of 50 ℃ for pre-drying for 6-12h, then putting the materials into a planetary stirring kettle with vacuumizing equipment while the materials are hot, adding 1 part by weight of coupling agent gamma-glycidyl ether oxypropyltrimethoxysilane, stirring at a low speed (100-300 rpm) for 12-15min without vacuumizing, then opening a kettle cover, adding 30 parts by weight of silicon dioxide and 0.1 part by weight of fumed silica, continuing to stir at a low speed (100-300 rpm) for 12-15min without vacuumizing, then opening the kettle cover, cooling the materials to below 25 ℃, adding 0.1 part by weight of thermal initiator hexafluoroantimonate, and continuing to stir at a low speed (100-300 rpm) for 12-15min without vacuumizing. And finally, opening the vacuum equipment until the vacuum degree is more than 0.095MPa, increasing the rotating speed to 400-1000rpm, stirring for 40-120min, and discharging.
The prepared epoxy adhesive is cured at the use temperature of 100 ℃ for 30min, the hard adhesive is Shore D86, the tensile shear strength is 15MPa, the curing shrinkage rate is 1.5%, the elongation at break is 2.3%, the coefficient of thermal expansion CTE1 is 30 ppm/DEG C, the corresponding value is 5.9 x 1012 after the SIR value is 85 ℃/85 RH168 hours, the Tg is 145 ℃, and the Type C air tightness reaches the standard.
Example 2
10 parts by weight of bisphenol A epoxy resin (with the viscosity of 8,000mPa & s at 25 ℃), 20 parts by weight of alicyclic epoxy resin (DAICEL CELLOXIDE 2021P), 5 parts by weight of polyurethane modified epoxy resin (with the viscosity of 20,000mPa & s at 25 ℃), and 5 parts by weight of carboxyl-terminated liquid nitrile rubber (with the viscosity of 200,000mPa & s at 25 ℃) are placed in a 50 ℃ environment for pre-drying for 6 hours, then the materials are put into a planetary stirring kettle with vacuumizing equipment while hot, 0.5 part by weight of gamma-glycidyl ether oxypropyl trimethoxy silane is added, the materials are not vacuumized, the materials are stirred at a low speed of 200rpm for 12-15min, then a kettle cover is opened, 8 parts by weight of barium sulfate, 15 parts by weight of calcium carbonate, 15 parts by weight of alumina, 15 parts by weight of aluminum nitride and 2.5 parts by weight of fumed silica are added, the stirring is continued at a low speed of 300rpm without vacuumizing, the stirring speed is 5min, then the kettle cover is opened, the materials are cooled to a temperature below 25 ℃,1 part by weight of hot hexafluorophosphate is added, and the stirring is continued (stirring at a low speed of 100-300 rpm) without vacuumizing. And finally, opening the vacuum equipment until the vacuum degree is more than 0.095MPa, increasing the rotating speed to 800rpm, and stirring for 60min to obtain the adhesive.
The prepared epoxy adhesive is cured at the use temperature of 100 ℃ for 30min, the hard adhesive is Shore D83, the tensile shear strength is 13MPa, the curing shrinkage rate is 2.1%, the elongation at break is 3.8%, the coefficient of thermal expansion CTE1 is 45 ppm/DEG C, the corresponding value is 8.3 x 1012 after the SIR value is 85 ℃/85 RH168 hours, the Tg is 151 ℃, and the Type C air tightness reaches the standard.
Example 3
20 parts by weight of bisphenol A epoxy resin (the viscosity at 25 ℃ is 14,000mPa & s), 5 parts by weight of alicyclic epoxy resin (DAICEL CELLOXIDE 8010), 10 parts by weight of urethane modified epoxy resin (the viscosity at 25 ℃ is 20,000mPa & s), pre-drying for 6 hours at 50 ℃, putting the mixture into a planetary stirring kettle with a vacuumizing device while the mixture is hot, adding 0.3 part by weight of gamma-glycidyl ether oxypropyl trimethoxy silane, stirring for 3 minutes at a low speed of 200rpm without vacuumizing, then opening a kettle cover, adding 40 parts by weight of magnesium hydroxide, 10 parts by weight of calcium carbonate and 5 parts by weight of fumed silica, stirring for 3 minutes at a low speed of 200rpm without vacuumizing, then opening the kettle cover, cooling the material to below 25 ℃, adding 5 parts by weight of thermal initiator hexafluorophosphate, and stirring for 12-15 minutes at a low speed (100-300 rpm) without vacuumizing. And finally, opening the vacuum equipment until the vacuum degree is more than 0.095MPa, increasing the rotating speed to 1000rpm, and stirring for 40min to obtain the adhesive.
The prepared epoxy adhesive is cured at the use temperature of 100 ℃ for 30min, the hard adhesive is Shore D85, the tensile shear strength is 14MPa, the curing shrinkage rate is 2.3%, the elongation at break is 4.1%, the coefficient of thermal expansion CTE1 is 38 ppm/DEG C, the corresponding value is 2.2X 1013 after the SIR value is 85 ℃/85 RH168 hours, the Tg is 182 ℃, and the Type C air tightness reaches the standard.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The epoxy resin adhesive for Type C sealing is characterized by comprising, by weight, 10-20 parts of epoxy resin, 5-20 parts of alicyclic epoxy resin, 5-20 parts of toughening resin, 30-60 parts of filler, 0.1-5 parts of thixotropic agent, 0.1-1 part of coupling agent and 0.1-5 parts of thermal initiator.
2. The epoxy adhesive for Type C sealing according to claim 1, wherein said epoxy resin is broadly referred to as bisphenol A epoxy resin, said bisphenol A epoxy resin having a viscosity ranging from 8,000 to 14,000mPa-s/25 ℃.
3. The epoxy adhesive for Type C sealing according to claim 1, wherein the cycloaliphatic epoxy resin has a viscosity ranging from 50 to 500 mPa-s/25 ℃.
4. The epoxy adhesive for Type C sealing according to claim 1, wherein the toughening resin is a urethane-modified epoxy resin having a viscosity in the range of 30000-60000 mPa-s/25 ℃.
5. The epoxy adhesive for Type C sealing according to claim 1, wherein the filler is one or two of silica, barium sulfate, magnesium hydroxide, calcium carbonate, aluminum hydroxide, aluminum nitride, and aluminum oxide.
6. The epoxy adhesive for Type C sealing according to claim 1, wherein the thixotropic agent is one or two of organobentonite and fumed silica.
7. The epoxy adhesive for Type C sealing according to claim 1, wherein the coupling agent is one or two of gamma-glycidoxypropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma- (methacryloyloxy) propyltrimethoxysilane, and N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane.
8. The epoxy adhesive for Type C sealing according to claim 1, wherein the photoinitiator is one or more of diazonium salt, diaryliodonium salt, triarylsulfonium salt, alkylsulfonium salt, iron arene salt, sulfonyloxy ketone, and triarylsiloxy ether.
9. The epoxy adhesive for Type C sealing according to claim 1, wherein the thermal initiator is one or more of hexafluoroantimonate, hexafluorophosphate, diaryliodonium salt, triarylsulfonium salt.
10. The method of providing the epoxy adhesive for Type C sealing of any of claims 1-9, comprising the steps of:
placing bisphenol A epoxy resin, alicyclic epoxy resin and toughened resin in an environment of 50-80 ℃ for pre-drying for 6-12h, then putting into a planetary stirring kettle with vacuumizing equipment, adding an epoxy diluent and a coupling agent, stirring at a low speed (100-300 rpm) for 12-15min without vacuumizing, then opening a kettle cover, adding a filler and a thixotropic agent, continuing to stir at a low speed (100-300 rpm) for 12-15min without vacuumizing, cooling the material to below 25 ℃, then opening the kettle cover, adding a thermal initiator, and continuing to stir at a low speed (100-300 rpm) for 12-15min without vacuumizing; and finally, opening the vacuum equipment until the vacuum degree is more than 0.095MPa, increasing the rotating speed to 400-1000rpm, stirring for 40-120min, and discharging.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116083018A (en) * | 2022-12-30 | 2023-05-09 | 广东粤港澳大湾区黄埔材料研究院 | QFN packaging material, preparation method and application thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504745A (en) * | 2011-11-09 | 2012-06-20 | 烟台德邦科技有限公司 | Double curing encapsulating adhesive and preparation method thereof |
| CN102559115A (en) * | 2011-12-22 | 2012-07-11 | 烟台德邦科技有限公司 | Chip-level bottom filling adhesive and preparation method thereof |
| CN102627929A (en) * | 2012-03-22 | 2012-08-08 | 连云港华海诚科电子材料有限公司 | Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof |
| CN103436211A (en) * | 2013-09-10 | 2013-12-11 | 烟台德邦科技有限公司 | Underfill adhesive with good compatibility and preparation method thereof |
| CN103772981A (en) * | 2013-12-30 | 2014-05-07 | 四川大学 | Low-dielectric-constant polymer/fluorinated graphene composite material and preparation method thereof |
| CN105111986A (en) * | 2015-09-07 | 2015-12-02 | 连云港华海诚科电子材料有限公司 | Ultraviolet/heating-curing epoxy resin adhesive and preparation method thereof |
| CN107312162A (en) * | 2017-07-31 | 2017-11-03 | 南方科技大学 | A kind of epoxy curing agent, a kind of epoxide resin material and preparation method thereof |
| CN107868643A (en) * | 2017-11-28 | 2018-04-03 | 长春永固科技有限公司 | Smart card temperature curing epoxy low adhesive and smart card low-temperature setting method for packing |
| CN108546536A (en) * | 2018-05-17 | 2018-09-18 | 深圳飞世尔新材料股份有限公司 | A kind of OLED frames encapsulation Wear Characteristics of Epoxy Adhesive mixture and preparation method thereof |
| WO2020034496A1 (en) * | 2018-08-13 | 2020-02-20 | 深圳南科新材科技有限公司 | Graphene fluoride, preparation method therefor, and application thereof, and epoxy resin composite material having same |
| CN111909633A (en) * | 2020-07-14 | 2020-11-10 | 江苏矽时代材料科技有限公司 | Low-temperature curing conductive adhesive and preparation method and application thereof |
| CN113004807A (en) * | 2021-03-11 | 2021-06-22 | 无锡帝科电子材料股份有限公司 | Thermosetting conductive adhesive and preparation method thereof |
-
2022
- 2022-06-29 CN CN202210752116.5A patent/CN115141588A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504745A (en) * | 2011-11-09 | 2012-06-20 | 烟台德邦科技有限公司 | Double curing encapsulating adhesive and preparation method thereof |
| CN102559115A (en) * | 2011-12-22 | 2012-07-11 | 烟台德邦科技有限公司 | Chip-level bottom filling adhesive and preparation method thereof |
| CN102627929A (en) * | 2012-03-22 | 2012-08-08 | 连云港华海诚科电子材料有限公司 | Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof |
| CN103436211A (en) * | 2013-09-10 | 2013-12-11 | 烟台德邦科技有限公司 | Underfill adhesive with good compatibility and preparation method thereof |
| CN103772981A (en) * | 2013-12-30 | 2014-05-07 | 四川大学 | Low-dielectric-constant polymer/fluorinated graphene composite material and preparation method thereof |
| CN105111986A (en) * | 2015-09-07 | 2015-12-02 | 连云港华海诚科电子材料有限公司 | Ultraviolet/heating-curing epoxy resin adhesive and preparation method thereof |
| CN107312162A (en) * | 2017-07-31 | 2017-11-03 | 南方科技大学 | A kind of epoxy curing agent, a kind of epoxide resin material and preparation method thereof |
| CN107868643A (en) * | 2017-11-28 | 2018-04-03 | 长春永固科技有限公司 | Smart card temperature curing epoxy low adhesive and smart card low-temperature setting method for packing |
| CN108546536A (en) * | 2018-05-17 | 2018-09-18 | 深圳飞世尔新材料股份有限公司 | A kind of OLED frames encapsulation Wear Characteristics of Epoxy Adhesive mixture and preparation method thereof |
| WO2020034496A1 (en) * | 2018-08-13 | 2020-02-20 | 深圳南科新材科技有限公司 | Graphene fluoride, preparation method therefor, and application thereof, and epoxy resin composite material having same |
| CN111909633A (en) * | 2020-07-14 | 2020-11-10 | 江苏矽时代材料科技有限公司 | Low-temperature curing conductive adhesive and preparation method and application thereof |
| CN113004807A (en) * | 2021-03-11 | 2021-06-22 | 无锡帝科电子材料股份有限公司 | Thermosetting conductive adhesive and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116083018A (en) * | 2022-12-30 | 2023-05-09 | 广东粤港澳大湾区黄埔材料研究院 | QFN packaging material, preparation method and application thereof |
| CN116083018B (en) * | 2022-12-30 | 2023-10-13 | 广东粤港澳大湾区黄埔材料研究院 | QFN packaging material, preparation method and application thereof |
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