CN115139528A - Slice processing method and device in 3D printing, storage medium and electronic equipment - Google Patents
Slice processing method and device in 3D printing, storage medium and electronic equipment Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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Abstract
The application provides a slice processing method, a slice processing device, a storage medium and electronic equipment in 3D printing, and relates to the technical field of printing, wherein the method comprises the following steps: acquiring the outline of a sliced layer of a model to be printed; determining a region to be processed of the sliced layer on a reference plane according to the contour of the sliced layer; and rasterizing the area to be processed. In the embodiment of the application, the region to be processed of the slice layer on the reference surface is determined based on the outline of the slice layer of the model to be printed, that is, the region to be rasterized corresponding to the slice layer is determined, so that the data volume of rasterization processing is reduced in the slicing processing process, the processing efficiency of rasterization processing is improved, and the time consumed for generating the slice file of the model to be printed is shortened.
Description
Technical Field
The application relates to the technical field of 3D printing, in particular to a slice processing method and device in 3D printing, a storage medium and electronic equipment.
Background
In the field of 3D printing, a general user needs to acquire a modeling file of a model, import the modeling file into slicing software, generate a slicing file of the model to be printed that can be recognized by a 3D printer after processing by the slicing software, and perform a printing operation to generate the model.
At present, in photocuring 3D printing, a slice file of a model to be printed generally includes rasterization parameters, and a printer projects ultraviolet rays to an LCD screen according to the rasterization parameters to cure and mold resin in a trough.
Disclosure of Invention
An object of the embodiments of the present application is to provide a method and an apparatus for processing a slice in 3D printing, a storage medium, and an electronic device, so as to solve the problem of low processing efficiency in the slice processing process in the prior art.
In order to solve the above problem, in a first aspect, an embodiment of the present application provides a method for processing a slice in 3D printing, including:
acquiring the outline of a sliced layer of a model to be printed;
determining a region to be processed of the sliced layer on a reference plane according to the contour of the sliced layer;
and rasterizing the area to be processed.
Further, according to the contour of the sliced layer, determining a region to be processed of the sliced layer on a reference plane, comprising:
acquiring first endpoint coordinates of the outline of the sliced layer in a first direction and a second direction, wherein the first direction is vertical to the second direction;
acquiring a second endpoint coordinate according to the first endpoint coordinate;
and determining a region to be processed of the sliced layer on the reference surface according to the second endpoint coordinates.
Further, the rasterizing the to-be-processed area includes:
acquiring a resolution parameter, and acquiring a pixel block parameter according to the resolution parameter;
and rasterizing the area to be processed according to the pixel block parameters.
Further, the obtaining of the contour of the cut layer of the model to be printed includes obtaining the contour of a starting cut layer of the model to be printed, where the starting cut layer is a first cut layer of the base or the model body of the model to be printed;
when the starting cut sheet layer is a base of the model to be printed, the obtaining the outline of the starting cut sheet layer of the model to be printed comprises:
obtaining a model body of the model to be printed, wherein the model body does not comprise a base;
obtaining parameters of a base, wherein the parameters of the base comprise layer thickness, layer number and shape;
acquiring a projection point of the model body on the reference surface, generating the base according to the projection point and parameters of the base, and acquiring the outline of the base as the outline of an initial sliced layer of the model to be printed; or, slicing the model body to obtain the outlines of a plurality of sliced layers of the model body; and superposing the outlines of the multiple sliced layers of the model body to obtain the superposed outlines, generating the base according to the superposed outlines and the parameters of the base, and obtaining the outline of the base as the outline of the initial sliced layer of the model to be printed. Further, after the obtaining the outline of the starting sliced layer of the model to be printed, the method further comprises:
determining parameters of through holes based on the parameters of the outline of the initial sliced layer, wherein the parameters of the through holes comprise the number, the area and the arrangement mode of the through holes;
generating the through hole inside the outline of the initial sliced layer according to the parameters of the through hole;
the projection of the through hole on the reference plane is not coincident with the support projection point of the initial slice layer, and the support projection point is used for generating a support connected with the initial slice layer; the total area of the through holes does not exceed half of the total area of the starting sliced layer.
Further, after generating the mount, the method further comprises:
creating a spacer between the base of the model to be printed and the model body.
Further, after rasterizing the to-be-processed region according to the pixel block parameters, the method further includes:
confirming the pixel blocks covered by the slice layer and the gray values of the pixel blocks covered by the slice layer;
rendering the sliced layer based on the gray value.
In a second aspect, an embodiment of the present application provides a slice processing apparatus in 3D printing, including:
the acquisition module is used for acquiring the outline of the sliced layer of the model to be printed;
the determining module is used for determining a region to be processed of the sliced layer on a reference plane according to the contour of the sliced layer;
and the processing module is used for carrying out rasterization processing on the area to be processed.
In a third aspect, embodiments of the present application further provide a storage medium, where at least one executable instruction is stored in the storage medium, and the executable instruction causes a processor to perform an operation corresponding to the slice processing method in 3D printing according to the foregoing first aspect.
In a fourth aspect, an embodiment of the present application further provides an electronic device, including: the system comprises a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface complete mutual communication through the communication bus;
the memory is used for storing at least one executable instruction, and the executable instruction causes the processor to execute the operation corresponding to the slice processing method in the 3D printing according to the first aspect.
In the embodiment of the application, the region to be processed of the slice layer on the reference surface is determined based on the outline of the slice layer of the model to be printed, that is, the region to be rasterized corresponding to the slice layer is determined, so that the data volume of rasterization processing is reduced in the slicing processing process, the processing efficiency of rasterization processing is improved, and the time consumed for generating the slice file of the model to be printed is shortened.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic flowchart of a slicing processing method provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of an outline of a sliced layer provided by an embodiment of the present application;
FIG. 3 is a schematic view of a region to be processed according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a rasterized region to be processed according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a merging process of multiple tangent plane contour projections provided by an embodiment of the present application;
FIG. 6 is a schematic diagram of a region to be processed including a via according to an embodiment of the present disclosure;
FIG. 7 is a schematic view of a spacer according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a slicing processing apparatus in 3D printing according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The terms "first," "second," and the like in the embodiments of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. Further, the use of "and/or" in this application means that at least one of the connected objects, e.g., a and/or B and/or C, means that 7 cases are included where a alone, B alone, C alone, and both a and B are present, B and C are present, a and C are present, and a, B, and C are present.
The following describes a method of processing a slice in 3D printing according to an embodiment of the present application.
Referring to fig. 1, which is a schematic flowchart of a slicing processing method in 3D printing according to an embodiment of the present application, as shown in fig. 1, the slicing processing method includes the following steps:
The utility model discloses a photo-curing printer, including a photo-curing printer, a model of waiting to print, wherein, the slicer layer of waiting to print the model is along the arbitrary picture layer that the model of waiting to print carries out the section and forms along photocuring printer's print platform's direction of rise and fall, every slicer layer all includes a plurality of projection point, connect the marginal projection point of slicer layer in order and form the profile of slicer layer promptly, the profile of slicer layer also can be understood as the border that a plurality of projection point that the slicer layer includes encloses into the region on the reference surface, because when the printer is treating to print the model, the slicer layer can be projected on the LCD screen, consequently, the reference surface can be understood as being used for simulating the LCD screen of printer. Taking fig. 2 as an example, which is an example of one of the slice layers, P1 to P7 are edge projection points of the slice layer, and P1 to P7 are sequentially connected to form a closed layer, that is, a contour of the slice layer.
In some embodiments, the model to be printed may include a model body or a model body and a base, and it is understood that, before the user imports the modeling file of the model body into the slicing software, the base is not set on the model body, and after the slicing software is imported, the user may select whether the base needs to be generated at the bottom of the model body through the slicing software according to the actual situation of the model body, and the base is used for directly contacting with the printing platform. When the model is peeled off from the printing platform by the scraper knife after the model is printed, the scraper knife directly contacts the base, and the integrity of the model can be ensured due to the existence of the base.
And step 102, determining a region to be processed of the slice layer on a reference plane according to the contour of the slice layer.
As described above, after the contour of the sliced layer is obtained, the to-be-processed area of the sliced layer on the reference surface may be determined accordingly, where rasterization processing is required, and since the LCD screen of the printer can only recognize rasterized images during printing, rasterization processing needs to be performed on the sliced layer, it can be understood that rasterization processing refers to filling the to-be-processed area with regular pixel blocks. All projection points of the slicing layer are located in the region to be processed, and along the arrangement direction of the pixel blocks after rasterization processing, the projection point located at the extreme end is superposed with the outline of the region to be processed. Since the reference plane simulates an LCD screen, the area of the slice layer of the model to be printed is generally smaller than the area of the LCD screen, and therefore the area of the region to be processed is also generally smaller than the area of the reference plane. The amount of calculation for rasterizing only the region to be processed is smaller than if the entire region of the reference plane were rasterized.
103, rasterizing the area to be processed.
As shown in fig. 3, the area indicated in the dashed line frame may be an entire area of the reference plane, and the area indicated in the solid line frame may be an area to be processed, and along the arrangement direction of the pixel blocks after the rasterization process, the projection points P1, P5, and P7 are the extreme points of the slice layer, so that a rectangle generated by the three projection points is the area to be processed. Only the determined area to be processed is rasterized, compared with the prior art that all areas of the reference surface are rasterized, the data size of rasterization processing can be reduced, the processing efficiency of rasterization processing is improved, and the time required for generating the slice file of the model to be printed is greatly shortened. It is to be understood that the region to be processed is not limited to a rectangle, but may be other polygons.
According to the slicing processing method, the outline of each slice layer of the model to be printed is firstly obtained during slicing processing, then the area to be processed corresponding to each slice layer of the model to be printed is determined, and finally rasterization processing is carried out on the area to be processed corresponding to each slice layer. In the embodiment of the application, only rasterization processing is needed to be carried out on the area to be processed, and rasterization processing is not needed to be carried out on all areas of the reference surface, so that the data volume of rasterization processing of each slice layer is reduced, the data volume of rasterization processing of all slice layers of the whole model is reduced, and the time required for generating slice files of the model to be printed is greatly shortened.
In this embodiment of the present application, step S102 determines, according to the contour of the sliced layer, a region to be processed of the sliced layer on the reference plane, including:
acquiring first endpoint coordinates of the outline of the slice layer in a first direction and a second direction, wherein the first direction is vertical to the second direction;
acquiring a second endpoint coordinate according to the first endpoint coordinate;
and determining the area to be processed of the sliced layer on the reference surface according to the second endpoint coordinates.
The first direction and the second direction are the arrangement directions of the pixel blocks after rasterization, the first direction and the second direction jointly represent a rectangular coordinate system on a reference surface, and the datamation processing of a plurality of projection points on the reference surface can be realized based on the rectangular coordinate system. If the first direction is set to indicate the x-axis of the rectangular coordinate system, the second direction indicates the y-axis of the rectangular coordinate system, and the positions of the projection points of the slice layer are indicated by the x-coordinate and the y-coordinate together. The method comprises the steps of obtaining a plurality of x coordinates and y coordinates of a slice layer, confirming limit coordinates (numerical minimum and maximum x coordinates) of the slice layer on an x axis, confirming limit coordinates (numerical minimum and maximum y coordinates) of the slice layer on a y axis, and enabling first endpoint coordinates to be the limit coordinates of the slice layer on the x axis and the y axis. Taking fig. 3 as an example, the x coordinates of the projection points P5 and P7 are the limit coordinates of the slice layer on the x axis, the y coordinates of the projection points P1 and P5 are the limit coordinates of the slice layer on the y axis, four contour lines are generated along the coordinate axis direction corresponding to the limit coordinates according to the four acquired limit coordinates (the x coordinate of P5, the x coordinate of P7, the y coordinate of P1, and the y coordinate of P5), the intersection point of the four contour lines is the second endpoint coordinate, and the rectangle enclosed by the second endpoint coordinates is the region to be processed.
It can be understood that, compared to circular, triangular and other polygonal shapes, the rectangular pattern is parallel to the arrangement direction of the pixel blocks, so that the rectangular pattern of the regions to be processed is beneficial for the subsequent rasterization processing operation.
In this embodiment of the present application, the step S103 performs rasterization processing on the region to be processed, including:
acquiring a resolution parameter, and acquiring a pixel block parameter according to the resolution parameter;
and rasterizing the area to be processed according to the pixel block parameters.
The resolution parameter is a parameter in the slicing software which is adapted to the photocuring printer to be subjected to model printing, and because the photocuring printer is different in model, the resolution of the LCD screen is different, and the resolution of the screen determines the pixel block parameter. Therefore, before the slicing process is performed, a user can select a corresponding model or select an adaptive resolution parameter in the slicing software according to the model of the photo-curing printer to be used.
The pixel block parameter is used to represent the area size of a unit pixel block in the rasterization process, and when the pixel block parameter is determined, the number of pixel blocks included in the to-be-processed area can be determined based on the area size of the to-be-processed area, that is, the rasterization operation of the to-be-processed area is completed, and the rasterized to-be-processed area can be as shown in fig. 4.
For example, if the area size of the area to be processed is set to 100 × 50 units and the area size of the unit grid represented by the pixel block parameter is set to 1 × 1 unit, the area to be processed needs to be divided into 5000 grid blocks during the rasterization process.
In the embodiment of the application, the step S101 of obtaining the contour of the cut layer of the model to be printed includes obtaining the contour of an initial cut layer of the model to be printed, where the initial cut layer is a base of the model to be printed or a first cut layer of the model body;
when the starting cut sheet layer is a base of the model to be printed, acquiring the outline of the starting cut sheet layer of the model to be printed comprises:
obtaining a model body of a model to be printed, wherein the model body does not comprise a base;
obtaining parameters of a base, wherein the parameters of the base comprise layer thickness, layer number and shape;
acquiring a projection point of the model body on a reference surface, generating a base according to the projection point and parameters of the base, and acquiring the outline of the base as the outline of an initial slice layer of the model to be printed;
or, slicing the model body to obtain the outlines of a plurality of slice layers of the model body; the outlines of the multiple slice layers of the model body are overlapped to obtain the overlapped outlines, the base is generated according to the overlapped outlines and parameters of the base, and the outlines of the base are obtained and used as the outlines of the initial slice layers of the model to be printed.
It should be noted that the number of printing layers, the thickness and the shape of the base can be set by a user in slicing software as required, wherein when the base has multiple layers, only the first slicing layer of the base is in contact with the printing platform, and the outline of each slicing layer of the base is the same. Wherein, all projection points of the model body are positioned in the outline of the base.
When the initial slice layer is the first slice layer of the model body of the model to be printed, the model body of the model to be printed is obtained, the projection points of the model body on the reference surface are obtained, and the projection points at the edges are connected to obtain the outline of the initial slice layer of the model to be printed. It can be understood that, the simulation projects the model body on the reference surface to obtain a plurality of projection points on the reference surface, and connects the edge projection points in the plurality of projection points, so as to obtain the contour of the first slice layer of the model body as the contour of the starting slice layer.
Or acquiring a model body of the model to be printed, slicing the model body, and acquiring the outlines of a plurality of sliced layers of the model body; and superposing the outlines of the plurality of sliced layers to obtain the outline of the initial sliced layer of the model to be printed. It can be understood that after the outlines of the multiple cut sheet layers of the model to be printed are obtained, the outlines of the multiple cut sheet layers are overlapped, and the outlines of the overlapped positions of the different cut sheet layers are removed, so that the outline of the first cut sheet layer of the model body serving as the starting cut sheet layer is obtained.
In practice, any one of the above manners may be selected to obtain the contour of the starting sliced layer according to the requirement adaptability, which is not limited in the embodiment of the present application.
Optionally, after obtaining the outline of the starting sliced layer of the model to be printed, the method further includes:
determining parameters of the through holes based on preset parameters and parameters of the outline of the initial slicing layer, wherein the parameters of the through holes comprise the number, the area and the arrangement mode of the through holes;
generating a through hole inside the outline of the initial sliced layer according to the parameters of the through hole;
the projection of the through hole on the reference plane is not coincident with the supporting projection point of the initial slicing layer, and the supporting projection point is used for generating a support connected with the initial slicing layer; the total area of the through-holes does not exceed half of the total area of the starting sliced layer.
As shown in fig. 6, for the starting sliced layer of the model to be printed, through holes (referring to blank pixel cells located in the shaded area in fig. 6) are provided inside the outline of the starting sliced layer. In the actual printing process, because the inside of waiting to print the model is not solid, consequently when waiting to print the model and solidify in the resin tank, probably will have some uncured resin liquid to remain in the inside of waiting to print the model, through set up the through-hole in the position of originated slice layer, after waiting to print the model and print the completion, can pour out the uncured resin liquid that remains in inside from the through-hole, reduce simultaneously also can reduce the use amount of printing material.
In some embodiments, the parameter determination process of the through hole may be:
and determining a target area in the outline of the starting sliced layer, where through holes can be arranged, based on the parameters of the outline of the starting sliced layer, then determining the number, the area and the arrangement mode of the through holes in the target area, and generating the parameters of the through holes based on the selected number, the area and the arrangement mode of the through holes. It is understood that the number, area and arrangement of the through holes in the target region may be adaptively generated based on a preset algorithm of the slicing software, or may be generated based on parameters input by a user.
It should be noted that, in order to reduce the printing material consumed in printing the model, the interior of the model is not generally solid, but supports are generated inside to support the model body. When there is a supporting projection point for generating the supporting member on the starting slice layer, in order to avoid the situation that the model body falls down due to too few supporting points caused by the position of the supporting member occupied by the through hole, the projection of the through hole on the reference plane is not coincident with the supporting projection point of the starting slice layer in this embodiment. It can be understood that the corresponding area in the outline of the starting slicing layer comprises a first subregion provided with a support member and a second subregion not provided with the support member, the target area is understood as the second subregion, and the overlapping of the setting position of the through hole and the setting position of the support member is avoided, so that the situation that the support cannot be stably arranged on the base is avoided, that is, the situation that the support points of the printed model body are insufficient is avoided, and the structural stability of the printed model body is ensured.
It can be understood that, because originated slice layer is used for with print platform adhesion, in order to prevent in the printing process, originated slice layer and print platform before because adhesion is not enough and drop from print platform, lead to the condition that the model printing fails to appear, in this application embodiment, the total area of through-hole is injectd for not exceeding half of the total area of originated slice layer to avoid appearing the condition that adhesion is not enough between originated slice layer and the print platform.
In this embodiment of the present application, after generating the base, the slice processing method provided in this embodiment further includes:
a spacer is created between the base of the model to be printed and the model body.
As shown in fig. 7, the setting of separator is for separating the base and the model body of the model of treating to print to the user is convenient for the separation operation of base and model body, and understandably, the user utilizes the base to support the model body earlier, ensures that the printing operation of model body can be accomplished smoothly, after the model of treating to print is accomplished, separates the model body from the base, promotes the aesthetic property of printing the model, thereby promotes user's use experience.
In practical application, the separating member can be hemispheroid or cone patterns and the like, and a user can adaptively adjust the setting position and the setting specification of the separating member on the base according to requirements, and the embodiment of the application does not limit the setting position and the setting specification.
In this embodiment of the present application, after performing rasterization processing on a region to be processed according to pixel block parameters, the slice processing method provided in this embodiment further includes:
confirming the pixel blocks covered by the slice layer and the gray values of the pixel blocks covered by the slice layer;
rendering the slice layer based on the gray values.
As described above, after rasterization processing is performed on the region to be processed, the pixel blocks covered by the sliced layer can be correspondingly confirmed according to the outline of the sliced layer, where it should be noted that the pixel blocks covered by the sliced layer include a first pixel block and a second pixel block, the first pixel block is used to represent the pixel blocks in the outline of the sliced layer, and the second pixel block is used to represent the pixel blocks covered by the outline of the sliced layer.
For example, if the gray value of a certain second pixel block is 0.2 gray units, the gray value of the second pixel block is 20% of the area of the unit pixel block.
After determining the gray value of the pixel block covered by the slice layer, the rendering operation of the slice layer can be completed accordingly, and it can be understood that the slice file generated by the slice software after processing the model to be printed contains the gray value parameter of the pixel block of each slice layer. Therefore, when the printer prints the model according to the slice file of the model to be printed, the ultraviolet light intensity can be correspondingly regulated and controlled according to the gray values of different pixel blocks contained in the slice file, so that the ultraviolet light intensity of the block corresponding to the second pixel block is reduced, a smoother anti-aliasing effect is generated, and the edge of the cured and molded resin material is smooth.
For example, if the gray value of the first pixel block is set to 1 gray unit and the gray value of the second pixel block is set to 0.2 gray unit, the ultraviolet light intensity projected by the block corresponding to the first pixel block is set to 2 light units if the ultraviolet light intensity projected by the block corresponding to the first pixel block is 10 light units.
The various optional implementations described in the embodiments of the present application may be implemented in combination with each other or implemented separately without conflicting with each other, and the embodiments of the present application are not limited to this.
Referring to fig. 8, which is a schematic structural diagram of a slicing processing apparatus 200 in 3D printing according to an embodiment of the present application, as shown in fig. 8, the slicing processing apparatus 200 includes;
an obtaining module 201, configured to obtain an outline of a sliced layer of a model to be printed;
the determining module 202 is configured to determine, according to the contour of the slice layer, a region to be processed of the slice layer on the reference plane;
and the processing module 203 is configured to perform rasterization processing on the region to be processed. .
Optionally, the determining module 202 includes:
the first determining submodule is used for acquiring first endpoint coordinates of the outline of the sliced layer in a first direction and a second direction, wherein the first direction is vertical to the second direction;
the second determining submodule is used for acquiring a second endpoint coordinate according to the first endpoint coordinate;
and the third determining submodule determines a region to be processed of the sliced layer on the reference surface according to the second endpoint coordinate.
Optionally, the processing module 203 includes:
the parameter acquisition submodule is used for acquiring the resolution parameter and acquiring the pixel block parameter according to the resolution parameter;
and the grid processing submodule is used for carrying out grid processing on the area to be processed according to the pixel block parameters.
Optionally, the obtaining module 201 includes:
the first obtaining submodule is used for obtaining the outline of an initial slice layer of the model to be printed, wherein the initial slice layer is a first slice layer of a base or a model body of the model to be printed;
the slice processing apparatus 200 further includes:
the projection module is used for acquiring projection points of the model body on a reference surface, or slicing the model body, acquiring the outlines of a plurality of sliced layers of the model body, and superposing the outlines of the plurality of sliced layers of the model body to obtain a superposed outline;
the first obtaining submodule is specifically configured to:
obtaining a model body of a model to be printed, wherein the model body does not comprise a base;
obtaining parameters of a base, wherein the parameters of the base comprise layer thickness, layer number and shape;
generating a base according to the projection points and the parameters of the base, and acquiring the outline of the base as the outline of an initial slice layer of the model to be printed; or generating a base according to the superposed outline and the parameters of the base, and acquiring the outline of the initial slice layer of the model to be printed.
Optionally, the slice processing apparatus 200 further includes:
the parameter determining module is used for determining parameters of the through holes based on the parameters of the outline of the initial slicing layer, wherein the parameters of the through holes comprise the number, the area and the arrangement mode of the through holes;
a through hole setting module for generating a through hole inside the outline of the starting sliced layer according to the parameters of the through hole;
the projection of the through hole on the reference plane is not coincident with the supporting projection point of the initial slicing layer, and the supporting projection point is used for generating a support connected with the initial slicing layer; the total area of the through-holes does not exceed half of the total area of the starting sliced layer.
Optionally, the slice processing apparatus 200 further includes:
and the separation module is used for generating a separation piece between the base of the model to be printed and the model body.
Optionally, the slice processing apparatus 200 further includes:
the gray level confirmation module is used for confirming the pixel blocks covered by the slice layer and the gray level values of the pixel blocks covered by the slice layer;
and the rendering module is used for rendering the slice layer based on the gray value.
The slice processing apparatus 200 can implement each process of the method embodiment in fig. 1 in the embodiment of the present application, and achieve the same beneficial effects, and is not described herein again to avoid repetition.
The embodiment of the application further provides the electronic device 300. Referring to fig. 9, the electronic device 300 may include a processor 301, a memory 302, a communication interface 303 and a communication bus 304, wherein the processor 301, the memory 302 and the communication interface 303 complete communication with each other through the communication bus 304;
the memory 302 is used for storing at least one executable instruction, which causes the processor 301 to execute the operations corresponding to the foregoing slice processing method embodiments. When executed by the processor 301, the executable instructions may implement any of the steps in the method embodiment corresponding to fig. 1 and achieve the same advantageous effects, which are not described herein again.
The embodiment of the present application further provides a storage medium, where at least one executable instruction is stored in the storage medium, and the executable instruction enables a processor to execute operations corresponding to the foregoing slice processing method embodiment, and can achieve the same technical effects, and in order to avoid repetition, details are not repeated here.
The storage media of the embodiments of the present application may take any combination of one or more computer-readable media. The computer readable storage medium may be, for example, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an executable instruction execution system, apparatus, or device.
Program code embodied on a storage medium may be transmitted over any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
Computer program code for carrying out operations for aspects of the present application may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, smalltalk, C + +, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or terminal. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).
The foregoing is a preferred embodiment of the embodiments of the present application, and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications should also be construed as the protection scope of the present application.
Claims (10)
1. A method of slice processing in 3D printing, comprising:
acquiring the outline of a sliced layer of a model to be printed;
determining a region to be processed of the sliced layer on a reference plane according to the contour of the sliced layer;
and rasterizing the area to be processed.
2. The slice processing method according to claim 1, wherein the determining the region to be processed of the slice layer on a reference plane according to the contour of the slice layer comprises:
acquiring first endpoint coordinates of the contour of the sliced layer in a first direction and a second direction, wherein the first direction is vertical to the second direction;
acquiring a second endpoint coordinate according to the first endpoint coordinate;
and determining the area to be processed of the sliced layer on the reference surface according to the second endpoint coordinates.
3. The slice processing method according to claim 2, wherein the rasterizing the region to be processed includes:
acquiring a resolution parameter, and acquiring a pixel block parameter according to the resolution parameter;
and rasterizing the area to be processed according to the pixel block parameters.
4. The slice processing method according to claim 1, wherein the obtaining the outline of the slice layer of the model to be printed comprises obtaining the outline of a starting slice layer of the model to be printed, wherein the starting slice layer is a first slice layer of a base or a model body of the model to be printed;
when the starting cut sheet layer is a base of the model to be printed, the obtaining the outline of the starting cut sheet layer of the model to be printed comprises:
obtaining a model body of the model to be printed, wherein the model body does not comprise a base;
obtaining parameters of a base, wherein the parameters of the base comprise layer thickness, layer number and shape;
acquiring a projection point of the model body on the reference surface, generating the base according to the projection point and parameters of the base, and acquiring the outline of the base as the outline of an initial slice layer of the model to be printed;
or, slicing the model body to obtain the outlines of a plurality of sliced layers of the model body; and superposing the outlines of the multiple sliced layers of the model body to obtain the superposed outlines, generating the base according to the superposed outlines and the parameters of the base, and obtaining the outline of the base as the outline of the initial sliced layer of the model to be printed.
5. The slice processing method of claim 4, wherein after the obtaining the outline of the starting slice layer of the model to be printed, the method further comprises:
determining parameters of through holes based on the parameters of the outline of the initial slicing layer, wherein the parameters of the through holes comprise the number, the area and the arrangement mode of the through holes;
generating the through hole inside the outline of the initial sliced layer according to the parameters of the through hole;
the projection of the through hole on the reference plane is not coincident with the support projection point of the initial slice layer, and the support projection point is used for generating a support connected with the initial slice layer; the total area of the through holes does not exceed half of the total area of the starting sliced layer.
6. The slice processing method of claim 5, wherein after generating the base, the method further comprises:
creating a spacer between the base of the model to be printed and the model body.
7. The slice processing method according to claim 3, wherein after rasterizing the region to be processed in accordance with the pixel block parameters, the method further comprises:
confirming the pixel blocks covered by the slice layer and the gray values of the pixel blocks covered by the slice layer;
rendering the sliced layer based on the gray value.
8. A slice processing apparatus in 3D printing, comprising:
the acquisition module is used for acquiring the outline of the sliced layer of the model to be printed;
the determining module is used for determining a region to be processed of the sliced layer on a reference plane according to the contour of the sliced layer;
and the processing module is used for carrying out rasterization processing on the area to be processed.
9. A storage medium having stored therein at least one executable instruction to cause a processor to perform operations corresponding to the method of slice processing in 3D printing as claimed in any one of claims 1 to 7.
10. An electronic device, comprising: the system comprises a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface complete mutual communication through the communication bus;
the memory is used for storing at least one executable instruction which causes the processor to execute the operation corresponding to the slice processing method in the 3D printing according to any one of claims 1-7.
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