CN115138940A - Brazing filler metal presetting device and brazing filler metal presetting method - Google Patents
Brazing filler metal presetting device and brazing filler metal presetting method Download PDFInfo
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- CN115138940A CN115138940A CN202210929336.0A CN202210929336A CN115138940A CN 115138940 A CN115138940 A CN 115138940A CN 202210929336 A CN202210929336 A CN 202210929336A CN 115138940 A CN115138940 A CN 115138940A
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- 238000005219 brazing Methods 0.000 title claims abstract description 140
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 138
- 239000002184 metal Substances 0.000 title claims abstract description 138
- 239000000945 filler Substances 0.000 title claims abstract description 136
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 149
- 239000011248 coating agent Substances 0.000 claims abstract description 85
- 238000000576 coating method Methods 0.000 claims abstract description 85
- 230000004308 accommodation Effects 0.000 claims abstract description 16
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 134
- 238000001514 detection method Methods 0.000 claims description 24
- 238000004321 preservation Methods 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 18
- 238000005476 soldering Methods 0.000 abstract description 7
- 229910000897 Babbitt (metal) Inorganic materials 0.000 description 12
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 12
- 230000005484 gravity Effects 0.000 description 11
- 230000009471 action Effects 0.000 description 7
- 239000007787 solid Substances 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating With Molten Metal (AREA)
Abstract
The invention provides a brazing filler metal presetting device and a brazing filler metal presetting method, and relates to the technical field of brazing. The brazing filler metal presets the device and includes accommodation portion, heating portion and coating portion, accommodation portion includes accommodation space, accommodation space is used for holding the brazing filler metal, coating portion is including circulation passageway and coating mouth, the diameter of coating mouth is 0.1mm-3mm, the degree of depth of coating mouth is 1mm-10mm, the circulation passageway with accommodation space intercommunication, heating portion set up in accommodation portion, in order to right brazing filler metal heating in the accommodation space makes the part of being heated of brazing filler metal can pass through the circulation passageway with the coating mouth flows out. This brazing filler metal preset device can satisfy the brazing filler metal preset demand of complicated brazing position for example found welding position, horizontal position or tilt-up welding position, and the brazing filler metal need not to handle, compares in preparation soldering paste, can reduce the cost that the brazing filler metal preset.
Description
Technical Field
The application relates to the technical field of brazing, in particular to a brazing filler metal presetting device and a brazing filler metal presetting method.
Background
At present, rail vehicle bodies are mainly divided into three types, namely common steel, stainless steel and aluminum alloy, wherein the common steel is low in strength, heavy in weight, high in energy consumption, severe in corrosion and large in maintenance amount, and aluminum alloy materials are applied to rail vehicle body structures due to the advantages of high strength, low density and the like.
Although stainless steel has excellent properties such as high strength, high temperature resistance, corrosion resistance and the like as a vehicle body material, resistance spot welding is generally adopted for a stainless steel vehicle body connecting process, and a lap joint needs to be sealed after the resistance spot welding is fixed, but along with the improvement of the speed grade of a stainless steel vehicle, the requirements of stable air tightness and long-time connection of a vehicle body welding line are increasingly urgent. The welding method for filling the gap of a solid workpiece with liquid brazing filler metal to connect metals has the characteristics of low heating temperature, small deformation of a thin plate, small influence on the mechanical property and structure of a base metal, smooth and flat welding joint, simple brazing equipment and low production investment cost, and can perfectly meet the sealing requirement of a stainless steel vehicle body.
The brazing process comprises four steps: 1. the workpieces with cleaned surfaces are assembled together in a lap joint mode; 2. placing brazing filler metal near or between the joint gaps; 3. when the workpiece and the brazing filler metal are heated to a temperature slightly higher than the melting point of the brazing filler metal, the brazing filler metal is melted (the workpiece is not melted), and is sucked into and filled in gaps among the solid workpieces by virtue of capillary action, so that the liquid brazing filler metal and the workpiece metal are mutually diffused and dissolved; 4. and forming a soldered joint after condensation.
The step 2 is solder presetting, wherein the solder presetting mainly has two forms, and the first form is to prepare the solder into various forms such as powder, silk, ring, foil and the like; the second is to make solder paste with flux and coat the paste on the part to be soldered. However, for some complex soldering positions, such as vertical welding positions, traditional solid solders are difficult to preset, the cost of soldering paste is too high, and the soldering paste has a shelf life and is difficult to store and use for a long time, i.e., the existing preset form of solders cannot meet the soldering requirements.
Disclosure of Invention
In view of this, the present application provides a solder presetting device, which includes a heating portion, so that a solder can be melted, the melted solder flows out through a flow channel and a coating port, the diameter of the coating port is set to 0.1mm-3mm, and the depth is set to 1mm-10mm, so that the solder flowing out through the flow channel and the coating port keeps a 'suspended and not dropped' state on the surface of the coating portion in competition of gravity and capillary action, when the solder is preset, the coating portion moves along the surface of a workpiece to be coated, so that the solder is solidified after contacting the surface of the workpiece to be coated, thereby realizing the solder presetting, and thus, the solder presetting requirements of complicated soldering positions such as a vertical welding position, a horizontal welding position or an elevation angle welding position can be met, and meanwhile, the solder does not need to be processed, and compared with the solder preparation, the solder presetting cost can be reduced.
According to an aspect of the application, a brazing filler metal presetting device is provided, brazing filler metal presetting device includes accommodation portion, heating portion and coating portion, accommodation portion includes accommodation space, accommodation space is used for holding the brazing filler metal, coating portion includes circulation passageway and coating mouth, the diameter of coating mouth is 0.1mm-3mm, the degree of depth of coating mouth is 1mm-10mm, the circulation passageway with accommodation space intercommunication, heating portion set up in accommodation portion, it is right to brazing filler metal heating in the accommodation space, make the part of brazing filler metal that is heated can pass through the circulation passageway with the coating mouth flows out.
Preferably, the solder presetting device further comprises a detection part and a controller, the detection part is arranged on the inner side wall of the accommodating part, the detection part can detect position information of the solder, the controller is in communication connection with the detection part to receive the position information from the detection part, and the controller is in communication connection with the heating part to control the heating part to switch between a first heating temperature and a second heating temperature, wherein the second heating temperature is higher than the first heating temperature.
Preferably, the heating part includes two heating members, both of the two heating members are disposed outside the accommodating part, the controller is in communication with the two heating members respectively to control the two heating members to be turned on or off respectively, and the heating part is at a first heating temperature when one of the two heating members is turned on; when both of the heating members are turned on, the heating portion is at a second heating temperature.
Preferably, the accommodating section has an extending direction, the detecting section includes a first detector and a second detector, both of the first detector and the second detector are disposed at an interval in the extending direction on an inner side wall of the accommodating section, the solder moves in the extending direction in a use state of the solder presetting device, the first detector is located above the second detector, and the controller controls the heating section to switch to a first heating temperature when both of the first detector and the second detector can detect the solder; the controller controls the heating portion to switch to a second heating temperature when the first detector does not detect the brazing filler metal and the second detector can detect the brazing filler metal; when neither the first detector nor the second detector detects the brazing filler metal, the controller gives an alarm to add another brazing filler metal into the accommodating space, and the controller controls the heating portion to switch to a first heating temperature.
Preferably, the coating portion includes curb plate and end plate, the one end of curb plate with the holding portion is connected, the curb plate with both enclose out of end plate accommodation space, the end plate has been seted up the coating mouth, the end plate with extending direction is perpendicular or parallel, the diameter of coating mouth is 0.2mm-1.5mm, the degree of depth of coating mouth is 2mm-5mm.
Preferably, the solder presetting device further comprises a guide part, the guide part is arranged on the inner side wall of the accommodating part, and the guide part is used for guiding the solder.
Preferably, the brazing filler metal presetting device further comprises a heat preservation part, the heat preservation part is sleeved outside the accommodating part, and the heating part is located between the accommodating part and the heat preservation part.
According to another aspect of the present application, a solder presetting method is provided, which is supported by a solder presetting device, the solder presetting device includes a receiving portion, a heating portion and a coating portion, the receiving portion includes a receiving space for receiving solder, the coating portion includes a circulation passage and a coating port, the heating portion is disposed in the receiving portion to heat the solder in the receiving space, so that the heated portion of the solder can flow out through the circulation passage and the coating port, the solder presetting method includes:
placing the brazing filler metal in the accommodating space of the accommodating portion;
controlling the heating part to heat the brazing filler metal so as to melt part of the brazing filler metal;
and moving the coating port along the workpiece to be coated so that the heated part of the brazing filler metal is coated on the surface of the workpiece to be coated.
Preferably, the solder presetting device includes a detection part capable of detecting position information of the solder, and a controller communicatively connected to the detection part to receive the position information from the detection part, the controller communicatively connected to the heating part to control the heating part to switch between a first heating temperature and a second heating temperature, the detection part including a first detector and a second detector to control the heating part to heat the solder so as to partially melt the solder, including:
the controller controls the heating portion to be at a first heating temperature when the brazing filler metal is detected by both the first detector and the second detector;
the controller controls the heating portion to switch to a second heating temperature when the first detector does not detect the brazing filler metal and the second detector can detect the brazing filler metal.
Preferably, the controlling the heating portion to heat the filler metal to partially melt the filler metal further includes: when the brazing filler metal is not detected by both the first detector and the second detector, the controller gives an alarm to add another brazing filler metal to the accommodating space of the accommodating part.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 shows a schematic configuration diagram of a solder presetting device according to an embodiment of the present invention;
FIG. 2 shows a schematic structural view of an end plate according to an embodiment of the invention;
fig. 3 shows a state of use of a solder presetting device in a first embodiment of a solder presetting method;
fig. 4 shows a state of use of the solder presetting device in the second embodiment of the solder presetting method.
An icon: 100-a brazing filler metal rod; 200-a housing; 210-a first cartridge; 220-a second cartridge; 230-a closure; 240-a containment space; 250-a connecting channel; 300-a coating section; 310-side plates; 320-end plate; 330-coating port; 340-a flow-through channel; 400-a heating element; 500-a controller; 600-a detection section; 610-a first detector; 620-a second detector; 700-a feed guide roller; 800-heat preservation part; 900-a workpiece to be coated; l1-coating direction.
Detailed Description
The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, devices, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and/or systems described herein will be apparent to those skilled in the art in view of the disclosure of the present application. For example, the order of operations described herein is merely an example, which is not limited to the order set forth herein, but rather, variations may be made in addition to operations which must occur in a particular order, which will be apparent upon understanding the disclosure of the present application. Moreover, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.
The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and/or systems described herein that will be apparent after understanding the disclosure of the present application.
Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on," "connected to," coupled to, "over," or "overlying" another element, it may be directly "on," "connected to," coupled to, "over," or "overlying" the other element, or one or more other elements may be present therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to," directly coupled to, "directly over" or "directly overlying" another element, there may be no intervening elements present.
As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more of the items.
Although terms such as "first", "second", and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first member, component, region, layer or section discussed in the examples described herein could be termed a second member, component, region, layer or section without departing from the teachings of the examples.
For ease of description, spatial relationship terms such as "above 8230 \8230; above", "upper", "above 8230 \8230; below" and "lower" may be used herein to describe the relationship of one element to another element as shown in the figures. Such spatial relationship terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to other elements would then be oriented "below" or "lower" relative to the other elements. Thus, the term "over" \\8230; \8230; "includes both orientations" over "\8230; \8230and" under "\8230;" depending on the spatial orientation of the device. The device may also be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular forms are also intended to include the plural forms unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, quantities, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and/or combinations thereof.
Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, may be expected. Thus, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.
According to an aspect of the present application, there is provided a solder presetting device, as shown in fig. 1 and 2, the solder presetting device includes a receiving part 200, a heating part, and a coating part 300, the receiving part 200 includes a receiving space 240, the receiving space 240 is used for receiving solder, the coating part 300 includes a circulation passage 340 and a coating port 330 (not shown in fig. 1), the diameter of the coating port is 0.1mm-3mm, the depth of the coating port is 1mm-10mm, the circulation passage 340 is communicated with the receiving space, and the heating part is disposed in the receiving part 200 to heat the solder in the receiving space, so that the heated part of the solder can flow out through the circulation passage 340 and the coating port 330. The brazing filler metal presetting device enables brazing filler metal to be melted by arranging the heating part, the melted brazing filler metal flows out through the flowing channel and the coating port, the diameter of the coating port 330 is set to be 0.1mm-3mm, the depth of the coating port is set to be 1mm-10mm, the brazing filler metal flowing out through the flowing channel 340 and the coating port 330 keeps a 'hanging and non-falling' state on the surface of the coating part 300 under the competition of gravity and capillary action, when brazing filler metal presetting is carried out, the coating part 300 is moved along the surface of a workpiece to be coated, the brazing filler metal is solidified after contacting the surface of the workpiece 900 to be coated, and the presetting of the brazing filler metal is realized.
Further, the solder material can be tin-zinc solder or babbitt metal. The brazing filler metal is solid brazing filler metal, for example, the brazing filler metal can be powder brazing filler metal, granular brazing filler metal or rod-shaped brazing filler metal, the solid brazing filler metal can be melted under the heating of the heating portion, and the melted brazing filler metal is solidified after contacting the surface of a workpiece to be coated, so that brazing filler metal presetting is achieved.
Preferably, the brazing filler metal is a brazing filler metal rod 100, the manufacturing cost of the brazing filler metal rod is lower than that of powdered brazing filler metal and granular brazing filler metal, the diameter of the brazing filler metal rod 100 can be 9.5 +/-0.5 mm, and the length of the brazing filler metal rod 100 can be 10cm-20cm.
As shown in fig. 1 and 2, the receiving part 200 includes a first barrel 210 and a second barrel 220, the first barrel 210 is positioned above the second barrel 220, the first barrel 210 and the second barrel 220 together define a receiving space 240, and an upper end of the first barrel 210 has an open opening through which the solder rod 100 can be added to the inside of the receiving space 240. The coating part 300 is positioned below the second cylinder 220, one end of the flow channel 340 of the coating part 300 is communicated with the accommodating space 240, the other end of the flow channel 340 is connected with the coating port 330, and the melted brazing filler metal can flow to the surface of the workpiece 900 to be coated through the flow channel 340 and the coating port 330.
Further, the inner diameter of the first cylinder 210 is the same as the inner diameter of the second cylinder 220, and the outer diameter of the first cylinder 210 is larger than the outer diameter of the second cylinder 220. The heating part is disposed outside the second barrel 220 to heat the lower end of the solder rod 100, so that the lower portion of the solder rod 100 is partially melted, the melted solder enters the flow channel 340 of the coating part 300 under the action of gravity of the solder rod 100 at the upper end, and then flows to the surface of the workpiece through the coating port 330, and the melted solder is solidified after contacting the surface of the workpiece 900 to be coated, thus completing solder presetting.
As shown in fig. 1, the receiving part 200 includes a closing member 230, the closing member 230 is disposed under the second cartridge 220, the closing member 230 has a connection passage 250, and a portion of the coating part 300 protrudes into the interior of the closing member 230 such that the communication passage 340 communicates with the receiving space 240 through the connection passage 250.
It should be noted that the above descriptions of the first barrel 210, the second barrel 220 and the closure 230 are only for convenience of describing the shape of the container 200, the first barrel 210, the second barrel 220 and the closure 230 are three parts of the container 200, the first barrel 210, the second barrel 220 and the closure 230 are integrally formed, and in the entity of the container 200, there is no dividing line between the first barrel 210 and the second barrel 220 and between the second barrel 220 and the closure 230.
In addition, the solder bar 100 is accommodated by the accommodating part, so that the solder presetting device of the present application is small in size, and convenient to carry and operate.
In addition, the brazing filler metal presetting device further comprises a heat preservation part 800, the heat preservation part 800 is sleeved outside the second cylinder 220, the upper end of the heat preservation part 800 is connected with the first cylinder 210, and the heating part is located between the heat preservation part 800 and the second cylinder 220. By providing the heat insulating unit 800, heat loss due to the heating unit can be avoided.
Preferably, the insulation part 800 may be insulation cotton or a high temperature ceramic sealing ring.
As shown in fig. 1 and 2, the coating portion 300 includes a side plate 310 and an end plate 320, the side plate 310 and the end plate 320 together enclose a flow channel 340, a portion of an upper end of the side plate 310 extends into the interior of the closing member 230, a lower end of the side plate 310 is connected to the end plate 320, and the end plate 320 is provided with one or more coating ports 330, where the number of the coating ports 330 may be one or more.
Preferably, the diameter of the coating port 330 is 0.2mm to 1.5mm, and the depth of the coating port 330 is 2mm to 5mm (the thickness of the end plate 320 is equal to the depth of the coating port 330).
When the heating part heats the solder bar 100, the solder bar 100 at the lower end is melted, the melted solder flows to the coating port 330 through the connecting channel 250 and the circulating channel 340, then the melted solder slowly flows out from the coating port 330, under the competition of gravity and capillary action, the melted solder is in a state of being suspended but not falling, and is hung on the surface of the end plate 320, then the end plate 320 of the coating part 300 is controlled to move along the surface of the workpiece 900 to be coated, and the melted solder hung on the end plate 320 is continuously coated on the surface of the workpiece 900 to be coated.
Further, the end plate 320 is perpendicular or parallel to the extending direction of the accommodating part 200 (the axial direction of the first tube 210 and the second tube 220), and when the end plate 320 is perpendicular to the extending direction of the accommodating part 200, that is, the brazing filler metal presetting device is in the state of fig. 3, at this time, the brazing filler metal presetting device can be adapted to a horizontal welding position or a vertical welding position; when the end plate 320 is parallel to the extending direction of the accommodating portion 200, that is, the brazing filler metal preassembly is in the state of fig. 4, the overhead fillet welding position can be adapted.
Further, the solder presetting apparatus further includes a detection part 600 and a controller 500, the detection part 600 is disposed on an inner sidewall of the receiving part 200, the detection part 600 is capable of detecting position information of the solder bar 100, the controller 500 is communicatively connected with the detection part 600 to receive the position information from the detection part 600, and the controller 500 is communicatively connected with the heating part to control the heating part to switch between a first heating temperature and a second heating temperature, the second heating temperature being higher than the first heating temperature.
Specifically, the heating part includes two heating members 400, and the controller 500 can control the two heating members 400 to be turned on or off, respectively, so that the heating part is switched between the first heating temperature and the second heating temperature. The heating portion is at a first heating temperature when one of the two heating members 400 is turned on and the other heating member 400 is turned off; when both the heating members 400 are turned on, the heating portion is at the second heating temperature.
Preferably, the heating element 400 may be a resistance wire, the two resistance wires are alternately wound to the outside of the second barrel 220, and the heat preservation portion 800 is wrapped on the outside of the resistance wires.
Further, as shown in fig. 1, 3 and 4, the solder presetting device further includes a first detector 610 and a second detector 620, the first detector 610 and the second detector 620 being disposed on the inner sidewall of the receiving part 200, the first detector 610 being located above the second detector 620. When both the first detector 610 and the second detector 620 can detect the solder rod 100, the controller 500 controls the heating portion to be at the first heating temperature, the lower end of the solder rod 100 is melted by the heating portion, the melted solder flows out through the flow channel 340 and the coating port 330 under the gravity of the solder rod 100, and then the melted solder is maintained in a state of being "suspended but not dropped" on the surface of the coating portion 300; then, the lower end of the solder rod 100 is continuously melted, the length of the solder rod 100 is reduced, the gravity of the solder rod 100 is gradually reduced, when the first detector 610 cannot detect the solder rod 100 and the second detector 620 can detect the solder rod 100, that is, the upper end surface of the solder rod 100 is lower than the position of the first detector 610 and higher than the position of the second detector 620, the gravity of the solder rod 100 is not enough to maintain the flow of the melted solder, at this time, the controller 500 controls the heating part to be at the second heating temperature, so as to raise the temperature for heating the solder rod 100, and further improve the fluidity of the melted solder, so that the melted solder is kept in a "suspended and not dropped" state on the end plate 320 after flowing out through the flow channel 340 and the coating opening 330, so as to ensure that the melted solder can be coated on the surface of the workpiece 900 to be coated; when neither the first detector 610 nor the second detector 620 detects the solder rod 100, that is, when the solder rod 100 is lower than the second detector 620, the solder rod 100 is about to be used up, and the controller 500 gives an alarm, and the operator can add another solder rod 100 to the accommodating space 240.
Further, the first heating temperature and the second heating temperature can be set according to requirements, when the brazing filler metal is a tin-zinc brazing filler metal rod, the first heating temperature is 210 ℃, and the second heating temperature is 250 ℃; when the brazing filler metal is a Babbitt alloy brazing filler metal rod, the first heating temperature is 300 ℃, and the second heating temperature is 350 ℃.
The solder presetting device may further include a control panel through which the first heating temperature and the second heating temperature can be adjusted.
As shown in fig. 1, the solder pre-loading device further includes a guide part provided on an inner sidewall of the receiving part 200, and the guide part can guide the solder rod 100 when the solder rod 100 is loaded into the receiving space 240.
Preferably, the guide portion may include two feeding guide rollers 700, and the two feeding guide rollers 700 are disposed at intervals on an inner sidewall of the guide portion in the extending direction of the receiving portion 200.
Preferably, the first detector 610 and the second detector 620 are both proximity switches.
According to a second aspect of the present application, there is provided a solder presetting method based on the solder presetting device, the solder presetting method including:
s1, placing the brazing filler metal in the accommodating space of the accommodating part;
s2, controlling the heating part to heat the brazing filler metal so as to melt part of the brazing filler metal;
and S3, moving the coating port along the workpiece to be coated, so that the heated part of the brazing filler metal is coated on the surface of the workpiece to be coated.
By the solder presetting method, the solder presetting requirements of complex soldering positions such as a vertical welding position, a horizontal welding position and an elevation angle welding position can be met, meanwhile, the solder does not need to be processed, and compared with the solder paste preparation, the solder presetting cost can be reduced.
The step S2 includes three states:
in the first state: the controller controls the heating portion to be at a first heating temperature when the brazing filler metal is detected by both the first detector and the second detector;
at the moment, the lower end of the brazing filler metal is melted, the melted brazing filler metal flows out through the flow channel and the coating opening under the action of gravity of the brazing filler metal at the upper end, and the melted brazing filler metal is in a suspended and not-falling state and is hung on an end plate of the coating part under the competitive action of gravity and capillary action.
In the second state: the controller controls the heating portion to switch to a second heating temperature when the first detector does not detect the brazing filler metal and the second detector can detect the brazing filler metal.
At this moment, the gravity of the residual brazing filler metal is not enough to maintain the flowing of the melted brazing filler metal, the controller controls the heating part to be switched to the second heating temperature, the heating temperature of the brazing filler metal is increased, and the liquidity of the liquid brazing filler metal is improved, so that the melted brazing filler metal is kept in a suspended and not-falling state on the end plate after flowing out of the circulation channel and the coating port and is hung on the end plate of the coating part.
The third state: when the brazing filler metal is not detected by both the first detector and the second detector, the controller gives an alarm to add another brazing filler metal to the accommodating space of the accommodating part.
At the moment, the brazing filler metal is about to be used up, another brazing filler metal is added into the accommodating space, and the gravity of the newly added brazing filler metal enables the melted brazing filler metal at the lower end to continuously flow to the coating opening so as to continue brazing filler metal presetting.
During solder presetting, the first state, the second state, and the third state can be sequentially cycled as shown in fig. 3 and 4.
The solder preparation method may include the following first and second examples.
Example one
At this time, the brazing filler metal is a tin-zinc brazing filler metal rod, as shown in fig. 3, the end plate is perpendicular to the axis of the accommodating part, and brazing filler metal presetting at a transverse welding position can be performed, wherein the brazing filler metal presetting method comprises the following steps:
s1, placing a tin-zinc solder bar in an accommodating space of an accommodating part;
s2, controlling a heating part to heat the tin-zinc solder rod so as to partially melt the tin-zinc solder rod;
the device specifically comprises three states of a brazing filler metal presetting device shown in fig. 3:
when both the first detector 610 and the second detector 620 detect the tin-zinc solder rod, the controller controls the heating portion to be at a heating temperature of 210 ℃.
When the first detector 610 does not detect the tin-zinc solder rod and the second detector 620 can detect the tin-zinc solder rod, the controller controls the heating part to switch to the heating temperature of 250 ℃.
When neither the first detector 610 nor the second detector 620 detects the tin-zinc solder rod, the controller alarms to add another tin-zinc solder rod to the accommodating space of the accommodating part, and the control part controls the heating part to switch to the heating temperature of 210 ℃.
And S3, moving the coating port along the workpiece to be coated (namely moving along the coating direction L1 in the graph of 3), so that the molten tin-zinc solder is coated on the surface of the workpiece to be coated.
Example two
At this time, the brazing filler metal is a babbitt metal brazing filler metal rod as an example, and the brazing filler metal presetting method at this time is as follows:
s1, placing a Babbitt metal brazing rod in an accommodating space of an accommodating part;
s2, controlling the heating part to heat the babbitt metal solder rod so as to partially melt the babbitt metal solder rod;
specifically, the solder presetting device shown in fig. 4 has three states:
when both the first detector 610 and the second detector 620 detect the babbitt metal solder rod, the controller controls the heating portion to be at a heating temperature of 300 ℃.
When the first detector 610 does not detect the babbitt metal solder bar and the second detector 620 is able to detect the babbitt metal solder bar, the controller controls the heating part to switch to the heating temperature of 350 ℃.
When neither of the first detector 610 and the second detector 620 detects the babbitt metal solder rod, the controller gives an alarm, adds another babbitt metal solder rod to the accommodating space of the accommodating part, and the controller controls the heating part to switch to the heating temperature of 300 ℃.
And S3, moving the coating port along the workpiece to be coated (namely moving along the coating direction L1 in the graph of 3), so that the molten Babbitt metal is coated on the surface of the workpiece to be coated.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A brazing filler metal presetting device is characterized by comprising a containing part, a heating part and a coating part, wherein the containing part comprises a containing space, the containing space is used for containing brazing filler metal, the coating part comprises a circulation channel and a coating opening, the diameter of the coating opening is 0.1mm-3mm, the depth of the coating opening is 1mm-10mm,
the circulation passage is communicated with the accommodating space, and the heating part is arranged on the accommodating part to heat the brazing filler metal in the accommodating space, so that the heated part of the brazing filler metal can flow out through the circulation passage and the coating opening.
2. The solder presetting device according to claim 1, characterized in that the solder presetting device further comprises a detection section provided at an inner side wall of the accommodation section, the detection section being capable of detecting positional information of the solder, and a controller communicatively connected with the detection section to receive the positional information from the detection section, the controller communicatively connected with the heating section to control the heating section to switch between a first heating temperature and a second heating temperature, the second heating temperature being higher than the first heating temperature.
3. The solder presetting device according to claim 2, characterized in that the heating portion includes two heating members, both of which are provided outside the accommodating portion,
the controller is respectively in communication connection with the two heating parts to respectively control the two heating parts to be turned on or off,
the heating portion is at a first heating temperature when one of the two heating members is turned on;
when both of the heating members are turned on, the heating portion is at a second heating temperature.
4. Solder preparation arrangement according to claim 2, characterized in that the receiving section has an extension direction,
the detection part comprises a first detector and a second detector, the first detector and the second detector are arranged on the inner side wall of the accommodating part at intervals along the extension direction, the brazing filler metal moves along the extension direction in the using state of the brazing filler metal presetting device, the first detector is positioned above the second detector,
the controller controls the heating portion to switch to a first heating temperature when the first detector and the second detector are both capable of detecting the brazing filler metal;
the controller controls the heating portion to switch to a second heating temperature when the first detector does not detect the brazing filler metal and the second detector can detect the brazing filler metal;
when the first detector and the second detector do not detect the brazing filler metal, the controller gives an alarm to add another brazing filler metal into the accommodating space, and the controller controls the heating part to be switched to a first heating temperature.
5. The solder presetting device of claim 4, wherein the coating portion includes a side plate and an end plate, one end of the side plate is connected with the receiving portion, the side plate and the end plate both enclose the receiving space, the end plate is provided with the coating opening, the end plate is perpendicular or parallel to the extending direction,
the diameter of the coating port is 0.2mm-1.5mm, and the depth of the coating port is 2mm-5mm.
6. The solder presetting device of claim 1, characterized in that the solder presetting device further comprises a guide part disposed at an inner side wall of the receiving part, the guide part being used for guiding the solder.
7. The solder presetting device of claim 1, characterized in that the solder presetting device further comprises a heat preservation part, the heat preservation part is sleeved outside the accommodating part, and the heating part is positioned between the accommodating part and the heat preservation part.
8. A brazing filler metal presetting method is characterized by depending on a brazing filler metal presetting device, the brazing filler metal presetting device comprises a containing part, a heating part and a coating part, the containing part comprises a containing space, the containing space is used for containing brazing filler metal, the coating part comprises a circulation channel and a coating opening, the heating part is arranged in the containing part to heat the brazing filler metal in the containing space, so that the heated part of the brazing filler metal can flow out through the circulation channel and the coating opening,
the brazing filler metal presetting method comprises the following steps:
placing the brazing filler metal in the accommodating space of the accommodating portion;
controlling the heating part to heat the brazing filler metal so as to melt part of the brazing filler metal;
and moving the coating port along the workpiece to be coated so that the heated part of the brazing filler metal is coated on the surface of the workpiece to be coated.
9. The solder presetting method according to claim 8, characterized in that the solder presetting device includes a detection section capable of detecting positional information of the solder and a controller communicatively connected with the detection section to receive the positional information from the detection section, the controller communicatively connected with the heating section to control the heating section to switch between a first heating temperature and a second heating temperature, the detection section including a first detector and a second detector,
controlling the heating portion to heat the brazing filler metal so as to partially melt the brazing filler metal includes:
the controller controls the heating portion to be at a first heating temperature when the brazing filler metal is detected by both the first detector and the second detector;
the controller controls the heating portion to switch to a second heating temperature when the first detector does not detect the brazing filler metal and the second detector can detect the brazing filler metal.
10. The solder presetting method according to claim 9, characterized in that controlling the heating portion to heat the solder so as to partially melt the solder further comprises:
when the brazing filler metal is not detected by both the first detector and the second detector, the controller gives an alarm to add another brazing filler metal to the accommodating space of the accommodating part.
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| CN202210929336.0A CN115138940B (en) | 2022-08-03 | 2022-08-03 | Solder presetting device and solder presetting method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210929336.0A CN115138940B (en) | 2022-08-03 | 2022-08-03 | Solder presetting device and solder presetting method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM305075U (en) * | 2006-07-18 | 2007-01-21 | Chung Shan Inst Of Science | Soldering iron with lighting and temperature control |
| CN102333612A (en) * | 2009-02-25 | 2012-01-25 | 千住金属工业株式会社 | Jet solder bath |
| JP2013149976A (en) * | 2012-01-20 | 2013-08-01 | Samsung Electro-Mechanics Co Ltd | Molten solder injection head |
| CN107427857A (en) * | 2015-01-13 | 2017-12-01 | 千住金属工业株式会社 | Device for draining fluid, fluid discharging method and coating fluid device |
| CN109604759A (en) * | 2019-01-31 | 2019-04-12 | 张博曦 | A kind of electric iron |
-
2022
- 2022-08-03 CN CN202210929336.0A patent/CN115138940B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM305075U (en) * | 2006-07-18 | 2007-01-21 | Chung Shan Inst Of Science | Soldering iron with lighting and temperature control |
| CN102333612A (en) * | 2009-02-25 | 2012-01-25 | 千住金属工业株式会社 | Jet solder bath |
| JP2013149976A (en) * | 2012-01-20 | 2013-08-01 | Samsung Electro-Mechanics Co Ltd | Molten solder injection head |
| CN107427857A (en) * | 2015-01-13 | 2017-12-01 | 千住金属工业株式会社 | Device for draining fluid, fluid discharging method and coating fluid device |
| CN109604759A (en) * | 2019-01-31 | 2019-04-12 | 张博曦 | A kind of electric iron |
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| CN115138940B (en) | 2024-05-17 |
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Inventor after: Wang Bo Inventor after: Wang Shengxi Inventor after: Deng Jianfeng Inventor after: Yin Pengzhi Inventor after: Hao Qingle Inventor after: Zhang Lei Inventor after: Wang Jintao Inventor after: Wu Qilong Inventor before: Wang Bo Inventor before: Hao Qingle Inventor before: Deng Jianfeng Inventor before: Yin Pengzhi Inventor before: Wang Shengxi Inventor before: Zhang Lei Inventor before: Wang Jintao Inventor before: Wu Qilong |
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