CN115127282A - Radiator based on circulating water cooling type - Google Patents
Radiator based on circulating water cooling type Download PDFInfo
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- CN115127282A CN115127282A CN202210967686.6A CN202210967686A CN115127282A CN 115127282 A CN115127282 A CN 115127282A CN 202210967686 A CN202210967686 A CN 202210967686A CN 115127282 A CN115127282 A CN 115127282A
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- fixedly connected
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- circulating water
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 238000001816 cooling Methods 0.000 title claims description 25
- 238000010521 absorption reaction Methods 0.000 claims abstract description 59
- 238000002791 soaking Methods 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims description 38
- 230000000903 blocking effect Effects 0.000 claims description 18
- 238000009434 installation Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 15
- 238000005057 refrigeration Methods 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 12
- 238000001125 extrusion Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- 238000005429 filling process Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention belongs to the technical field of water-cooled radiators, in particular to a radiator based on a circulating water-cooled type, and provides a scheme which comprises a heat radiating box and a heat absorbing box, wherein a soaking absorption assembly is arranged inside the heat radiating box and positioned outside the heat absorbing box, the soaking absorption assembly comprises a soaking frame, the soaking frame is fixedly connected inside the heat radiating box, the soaking frame is positioned outside the heat absorbing box, one side of the heat absorbing box, facing the soaking frame, is fixedly connected with two supporting plates, the tops of the two supporting plates are fixedly connected with an outer cylinder, and the bottom end of the outer cylinder is fixedly connected with a jacking spring. According to the invention, the heat exchange assembly is arranged and comprises the spiral blanking blade, circulating water after heat absorption flows into the heat exchange cylinder through the communicating pipe, and the circulating water passes through the spiral blanking blade in the flowing process, so that the circulating water is repeatedly contacted with the semiconductor refrigeration sheets at all heights, and therefore, heat in the circulating water is repeatedly absorbed through the heat absorption ends of the semiconductor refrigeration sheets, and the heat exchange effect is improved.
Description
Technical Field
The invention relates to the technical field of water-cooled radiators, in particular to a radiator based on a circulating water cooling type.
Background
Devices or instruments which can timely transfer heat generated by machinery or other appliances during working so as to avoid influencing the normal work of the machinery or other appliances; common radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode.
The existing circulating water cooling type radiator is used, circulating water is in the process of leading in a heat absorption box, only part of water body in the circulating water absorbs part of heat, along with the flowing of the circulating water, the circulating water flows out through a pipeline, and in the process of heat conversion and discharge in the circulating water, the heat exchange operation needs to be carried out on the whole circulating water, however, only part of water body in the circulating water absorbs heat, but the whole heat exchange treatment needs to be carried out, so that the utilization rate of the circulating water is low, and the whole heat dissipation effect is influenced.
Disclosure of Invention
The invention provides a radiator based on a circulating water cooling type, which comprises a heat radiating box and a heat absorbing box, wherein a soaking absorption component is arranged inside the heat radiating box and positioned outside the heat absorbing box, the soaking absorption component comprises a soaking frame, the soaking frame is fixedly connected inside the heat radiating box, the soaking frame is positioned outside the heat absorbing box, one side of the heat absorbing box facing the soaking frame is fixedly connected with two supporting plates, the tops of the two supporting plates are fixedly connected with an outer cylinder, the bottom end of the outer cylinder is fixedly connected with a jacking spring, the top end of the jacking spring is fixedly connected with a jacking column, the top ends of the two jacking columns are fixedly connected with a same vertical plate, the top of the vertical plate is fixedly connected with a blocking arc plate, one side of the blocking arc plate is fixedly connected with a plurality of fixed blocks, the top of each fixed block is connected with a second hydraulic cylinder through a hinge, and the output end of each second hydraulic cylinder is connected to the bottom of the blocking arc plate through a hinge, the heat dissipation box is located a plurality of temperature sensor of inboard fixedly connected with of heat absorption box below, and the bottom fixedly connected with of soaking frame collects the frame, collects the inside equidistance fixedly connected with pneumatic cylinder No. one of frame, and the output of a plurality of pneumatic cylinders has same shielding plate through hinged joint, and hinged joint is passed through in one side inner wall of collecting the frame to the other end of shielding plate.
As a further scheme of the invention, one side of the heat dissipation box is provided with a mounting hole, the interior of the mounting hole is fixedly connected with a mounting frame, and the heat absorption box is fixedly connected to the interior of the mounting frame.
As a further scheme of the invention, the inner wall of the top of the heat dissipation box is fixedly connected with a conveying frame, the bottom of the conveying frame is provided with a connecting hole, the inside of the connecting hole is fixedly connected with a connecting frame, the plugging arc plate is attached to the inner wall of the connecting frame, the inner wall of the bottom of the heat dissipation box is fixedly connected with a circulating pump, the conveying end of the circulating pump is fixedly connected with a circulating pipe, and the other end of the circulating pipe is fixedly connected to the inside of the conveying frame.
As a further scheme of the invention, a heat exchange assembly is arranged in the heat dissipation box below the collecting frame and comprises a heat exchange cylinder, mounting frames are annularly distributed on the outer side of the heat exchange cylinder close to the bottom end, and the other end of each mounting frame is fixedly connected to the inner wall of the bottom of the heat dissipation box.
As a further scheme of the invention, the bottom of the heat exchange cylinder is fixedly connected with a shaft lever, the top of the shaft lever is fixedly connected with a connecting shaft, the outer wall of the connecting shaft is fixedly connected with a spiral discharging blade, the spiral discharging blade is contacted with the inner wall of the heat exchange cylinder, the bottom of the collecting frame is provided with a communicating hole, the inner wall of the communicating hole is fixedly connected with a communicating pipe, and the other end of the communicating pipe is fixedly connected with the top of the heat exchange cylinder.
As a further scheme of the invention, heat exchange holes are formed in the outer side of the heat exchange cylinder at equal intervals, a semiconductor refrigerating sheet is fixedly connected to the inside of each heat exchange hole, the heat absorption end of each semiconductor refrigerating sheet is located in the heat exchange cylinder, and the heat dissipation end of each semiconductor refrigerating sheet is located on the outer side of the heat exchange cylinder.
As a further scheme of the invention, a gas flowing assembly is arranged on the outer side of the heat exchange cylinder and comprises an outer through frame and a flow guide arc sheet.
As a further scheme of the invention, an outer through hole is formed in the outer side of the heat dissipation box, the outer through frame is fixedly connected to the inner portion of the outer through hole, one end of the outer through frame is in contact with the outer side of the heat exchange cylinder, the heat dissipation end of the semiconductor refrigeration piece is located in the outer through frame, one side of the heat dissipation box located on the outer side of the outer through frame is fixedly connected with an outer frame, one side of the outer frame is fixedly connected with an air cylinder, and the flow guide arc piece is fixedly connected to the output end of the air cylinder.
As a further scheme of the invention, hollow plates are fixedly connected to one sides of the heat dissipation boxes at two ends of the outer frame, air blowing holes are formed in the sides of the two hollow plates facing the outer frame at equal distances, an air blower is fixedly connected to one side of the heat dissipation boxes close to the hollow plates, and the air blowing end of the air blower is connected to the inside of the hollow plates through a pipeline.
As a further scheme of the invention, the outer wall of the installation frame, which is positioned at the outer side of the heat absorption box, is provided with the heat conduction assembly, the heat conduction assembly comprises a telescopic heat conduction frame, two sides of the installation frame are both connected with the attaching plates through hinges, one side of each of the two attaching plates is fixedly connected with the heat conduction pieces at equal distances, one end of the telescopic heat conduction frame is fixedly connected to the outer sides of the plurality of heat conduction pieces, the other end of the telescopic heat conduction frame is connected to the outer side of the heat absorption box through hinges, and the opposite sides of the attaching plates and the heat dissipation box are fixedly connected with the extrusion springs at equal intervals.
The beneficial effects of the invention are as follows:
1. through arranging the soaking absorption assembly, when heat inside the heat absorption box is absorbed, circulating water is guided into the heat absorption box through the connecting frame, in the guiding process, the blocking arc plate guides the circulating water, after the circulating water absorbs the heat inside the heat absorption box, the circulating water falls through the lower part of the heat absorption box, the temperature sensor detects the temperature of the circulating water, if the temperature of the circulating water is lower, the heat absorption effect of the part of the circulating water is poor, the background controller controls the first hydraulic cylinder to drive the blocking plate to move, the blocking plate blocks the lower part of the soaking frame, the circulating water falling from the upper part is positioned in the soaking frame, a water body inside the soaking frame rushes into the heat absorption box, the heat is fully absorbed, in the circulating water filling process inside the soaking frame, the circulating water impacts the jacking column to enable the jacking spring to be stretched, then adjust No. two pneumatic cylinders and drive the shutoff arc board and deflect for the shutoff arc board carries out the shutoff to the carriage, ensures that this part circulating water is in endothermic state all the time, detects this part circulating water temperature up to standard when temperature sensor, then pneumatic cylinder and No. two pneumatic cylinders adjust simultaneously, realize the reset of shielding plate and shutoff arc board, thereby improve the heat absorption effect of single circulating water, improve circulating water overall utilization, ensure the radiating effect of this radiator.
2. Through being provided with heat exchange assembly, heat exchange assembly includes spiral unloading leaf, and the circulating water after the heat absorption passes through communicating pipe and flows into in the heat transfer section of thick bamboo, and the circulating water is at the in-process that flows, and it passes spiral unloading leaf for the circulating water contacts with the semiconductor refrigeration piece on each height repeatedly, thereby absorbs the heat in the circulating water repeatedly through the heat absorption terminal pair of semiconductor refrigeration piece, improves heat transfer effect.
3. Through being provided with the gas flow subassembly, the heat absorption end of semiconductor refrigeration piece absorbs the heat, then arrange the inside of outer logical frame with the heat through the heat dissipation end, adjust cylinder drives the water conservancy diversion arc piece and carries out the water conservancy diversion extrusion to the gas of outer logical frame inside, make the inside gas of outer logical frame flow fast, thereby improve the inside heat exhaust effect of outer logical frame, after gas carries the heat and removes to outer logical frame outside, start the air-blower, the air-blower blows this part gas through the blast air pore on the cavity board, accelerate it and keep away from this radiator, thereby further improve the radiating effect of radiator.
4. Through being provided with heat conduction assembly, when carrying out the installation of radiator, with the heat production end contact of heat absorption box and equipment, the in-process of contact, the attaching plate is launched to the outside passively, then the extrusion spring is compressed, each conducting strip on the attaching plate contacts with the heat production end of equipment, improve heat transfer direction efficiency, the conducting strip is to the heat absorption of heat production end, through the inside of flexible heat conduction frame with heat transfer to heat absorption box, flexible heat conduction frame, conducting strip and attaching plate are the heat conduction material, improve the heat transfer effect through heat conduction assembly, the use value of radiator is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of a radiator based on a circulating water cooling type according to the present invention;
FIG. 2 is a schematic diagram of the internal structure of a heat dissipation box of a radiator based on a circulating water cooling type according to the present invention;
FIG. 3 is a schematic view of a soaking absorption assembly of a radiator based on a circulating water cooling type according to the present invention;
FIG. 4 is a cross-sectional view of the overall structure of FIG. 3;
FIG. 5 is a schematic view of the internal structure of the soaking frame of the radiator based on the circulating water cooling type according to the present invention;
FIG. 6 is a schematic view of a heat exchange assembly of a radiator based on a circulating water cooling type according to the present invention;
FIG. 7 is a schematic view of a gas flow assembly for a radiator based on a recirculating water cooling type in accordance with the present invention;
fig. 8 is a schematic view of a heat conduction assembly of a radiator based on a circulating water cooling type according to the present invention.
In the figure: 1. a heat dissipation box; 2. a compression spring; 3. an outer frame; 4. a cylinder; 5. a flow guide arc sheet; 6. a heat conductive sheet; 7. a heat absorption box; 8. attaching a plate; 9. a circulation pipe; 10. a conveying frame; 11. a connecting frame; 12. installing a frame; 13. a blower; 14. a hollow plate; 15. an outer through frame; 16. a heat exchange cylinder; 17. a circulation pump; 18. a collection frame; 19. a temperature sensor; 20. a shielding plate; 21. a first hydraulic cylinder; 22. a soaking frame; 23. blocking the arc plate; 24. a vertical plate; 25. a second hydraulic cylinder; 26. a fixed block; 27. jacking the column; 28. jacking up the spring; 29. an outer cylinder; 30. a support plate; 31. a mounting frame; 32. a shaft lever; 33. spirally discharging the leaves; 34. a communicating pipe; 35. a semiconductor refrigeration sheet; 36. a connecting shaft; 37. a blast hole; 38. a telescoping thermally conductive frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-8, a radiator based on a circulating water cooling type comprises a heat radiation box 1 and a heat absorption box 7, wherein a soaking absorption assembly is arranged inside the heat radiation box 1 and positioned outside the heat absorption box 7, the soaking absorption assembly comprises a soaking frame 22, the soaking frame 22 is fixedly connected inside the heat radiation box 1, the soaking frame 22 is positioned outside the heat absorption box 7, one side of the heat absorption box 7 facing the soaking frame 22 is fixedly connected with two support plates 30, the tops of the two support plates 30 are fixedly connected with an outer cylinder 29, the bottom end of the outer cylinder 29 is fixedly connected with a jacking spring 28, the top end of the jacking spring 28 is fixedly connected with a jacking column 27, the top ends of the two jacking columns 27 are fixedly connected with a same vertical plate 24, the top of the vertical plate 24 is fixedly connected with a blocking arc plate 23, one side of the blocking arc plate 23 is fixedly connected with a plurality of fixed blocks 26, and the top of each fixed block 26 is connected with a second hydraulic cylinder 25 through a hinge, every No. two pneumatic cylinders 25's output all passes through hinged joint in the bottom of shutoff arc board 23, and heat dissipation case 1 is located a plurality of temperature sensor 19 of inboard fixedly connected with of heat absorption box 7 below, and the bottom fixedly connected with of soaking frame 22 collects frame 18, collects the inside equidistance fixedly connected with pneumatic cylinder 21 No. one of frame 18, and the output of a plurality of pneumatic cylinders 21 has same shielding plate 20 through hinged joint, and hinged joint is passed through in one side inner wall of collecting frame 18 to the other end of shielding plate 20.
In the invention, one side of the heat dissipation box 1 is provided with a mounting hole, the interior of the mounting hole is fixedly connected with a mounting frame 12, and the heat absorption box 7 is fixedly connected to the interior of the mounting frame 12.
Referring to fig. 1 and 2, a conveying frame 10 is fixedly connected to the inner wall of the top of the heat dissipation tank 1, a connecting hole is formed in the bottom of the conveying frame 10, the connecting frame 11 is fixedly connected to the inside of the connecting hole, a blocking arc plate 23 is attached to the inner wall of the connecting frame 11, a circulating pump 17 is fixedly connected to the inner wall of the bottom of the heat dissipation tank 1, a circulating pipe 9 is fixedly connected to the conveying end of the circulating pump 17, and the other end of the circulating pipe 9 is fixedly connected to the inside of the conveying frame 10.
Referring to fig. 1 and 6, a heat exchange assembly is arranged inside the heat dissipation box 1 below the collection frame 18, the heat exchange assembly includes a heat exchange cylinder 16, an installation frame 31 is annularly distributed on the outer side of the heat exchange cylinder 16 near the bottom end, and the other end of the installation frame 31 is fixedly connected to the inner wall of the bottom of the heat dissipation box 1.
In the invention, the bottom of the heat exchange cylinder 16 is fixedly connected with a shaft lever 32, the top of the shaft lever 32 is fixedly connected with a connecting shaft 36, the outer wall of the connecting shaft 36 is fixedly connected with a spiral discharging blade 33, the spiral discharging blade 33 is contacted with the inner wall of the heat exchange cylinder 16, the bottom of the collecting frame 18 is provided with a communicating hole, the inner wall of the communicating hole is fixedly connected with a communicating pipe 34, and the other end of the communicating pipe 34 is fixedly connected with the top of the heat exchange cylinder 16.
In the invention, heat exchange holes are formed in the outer side of a heat exchange cylinder 16 at equal intervals, a semiconductor refrigerating sheet 35 is fixedly connected to the inside of each heat exchange hole, the heat absorption end of each semiconductor refrigerating sheet 35 is positioned in the heat exchange cylinder 16, and the heat dissipation end of each semiconductor refrigerating sheet 35 is positioned on the outer side of the heat exchange cylinder 16;
through being provided with heat exchange assembly, heat exchange assembly includes spiral unloading leaf 33, and the circulating water after the heat absorption flows into heat exchange tube 16 through communicating pipe 34, and the circulating water is at the in-process that flows, and it passes spiral unloading leaf 33 for the circulating water contacts with semiconductor refrigeration piece 35 on each height repeatedly, thereby absorbs the heat in the circulating water repeatedly through the heat absorption terminal pair of semiconductor refrigeration piece 35, improves the heat transfer effect.
Referring to fig. 7, a gas flow assembly is arranged on the outer side of the heat exchange cylinder 16, and the gas flow assembly comprises an outer through frame 15 and a guide arc piece 5.
According to the invention, an outer through hole is formed in the outer side of the heat dissipation box 1, the outer through frame 15 is fixedly connected to the inner part of the outer through hole, one end of the outer through frame 15 is contacted with the outer side of the heat exchange tube 16, the heat dissipation end of the semiconductor refrigeration piece 35 is positioned in the outer through frame 15, one side of the heat dissipation box 1, which is positioned on the outer side of the outer through frame 15, is fixedly connected with the outer frame 3, one side of the outer frame 3 is fixedly connected with the air cylinder 4, and the flow guide arc piece 5 is fixedly connected to the output end of the air cylinder 4.
In the invention, hollow plates 14 are fixedly connected to one sides of the heat dissipation box 1 at two ends of the outer frame 3, air blowing holes 37 are formed in one sides of the two hollow plates 14 facing the outer frame 3 at equal distances, an air blower 13 is fixedly connected to one side of the heat dissipation box 1 close to the hollow plates 14, and the air blowing end of the air blower 13 is connected to the inside of the hollow plates 14 through a pipeline;
through being provided with the gas flow subassembly, the heat absorption end of semiconductor refrigeration piece 35 absorbs the heat, then arrange the inside of outer logical frame 15 with the heat through the heat dissipation end, adjust cylinder 4 drives water conservancy diversion arc piece 5 and carries out the water conservancy diversion extrusion to the inside gas of outer logical frame 15, make the inside gas of outer logical frame 15 flow fast, thereby improve the inside heat exhaust effect of outer logical frame 15, after gas carries the heat and removes to outer logical frame 15 outside, start air-blower 13, air-blower 13 blows this part of gas through blast hole 37 on the cavity hollow plate 14, it keeps away from this radiator with higher speed, thereby further improve the radiating effect of radiator.
Referring to fig. 1 and 8, a heat conducting assembly is arranged on the outer wall of the mounting frame 12, which is located on the outer side of the heat absorbing box 7, and the heat conducting assembly comprises a telescopic heat conducting frame 38, two sides of the mounting frame 12 are both connected with attaching plates 8 through hinges, heat conducting fins 6 are fixedly connected to one side of each of the two attaching plates 8 at equal distances, one end of the telescopic heat conducting frame 38 is fixedly connected to the outer sides of the heat conducting fins 6, the other end of the telescopic heat conducting frame 38 is connected to the outer side of the heat absorbing box 7 through hinges, and extrusion springs 2 are fixedly connected to the opposite sides of the attaching plates 8 and the heat dissipating box 1 at equal distances;
through being provided with heat conduction assembly, when carrying out the installation of radiator, the heat generation end contact of heat absorption box 7 and equipment, the in-process of contact, binding plate 8 is passive to the outside expansion, then extrusion spring 2 is compressed, each conducting strip 6 on the binding plate 8 contacts with the heat production end of equipment, improve heat transfer direction efficiency, conducting strip 6 absorbs the heat of heat production end, through flexible heat conduction frame 38 with heat transfer to the inside of heat absorption box 7, flexible heat conduction frame 38, conducting strip 6 and binding plate 8 are the heat conducting material, improve heat transfer effect through heat conduction assembly, the use value of radiator is improved.
When the heat radiator is used, the heat absorption box 7 is contacted with a heat generating end of equipment when the heat radiator is installed, the attaching plate 8 is passively expanded outwards in the contact process, the extrusion spring 2 is compressed, each heat conducting fin 6 on the attaching plate 8 is contacted with the heat generating end of the equipment, the heat transfer guiding efficiency is improved, after the installation is completed, circulating water is guided into the heat absorption box 7 through the connecting frame 11 in the use process, the blocking arc plate 23 guides the circulating water in the guiding process, after the circulating water absorbs heat in the heat absorption box 7, the circulating water falls through the lower part of the heat absorption box 7, the temperature sensor 19 detects the temperature of the circulating water, if the temperature of the circulating water is low, the heat absorption effect of the part of the circulating water is poor, the background controller controls the first hydraulic cylinder 21 to drive the blocking plate 20 to move, and the lower part of the soaking frame 22 is blocked through the blocking plate 20, circulating water falling from the upper part is located in the soaking frame 22, water inside the soaking frame 22 gushes into the heat absorption box 7 to realize sufficient absorption of heat, in the circulating water filling process inside the soaking frame 22, the circulating water impacts the jacking column 27 to stretch the jacking spring 28, the second hydraulic cylinder 25 is adjusted to drive the blocking arc plate 23 to deflect, the blocking arc plate 23 blocks the connecting frame 11 to ensure that the part of circulating water is always in a heat absorption state, when the temperature sensor 19 detects that the temperature of the part of circulating water reaches the standard, the first hydraulic cylinder 21 and the second hydraulic cylinder 25 are adjusted simultaneously to realize the resetting of the blocking plate 20 and the blocking arc plate 23, the circulating water flows into the heat exchange cylinder 16 through the communicating pipe 34 after absorbing heat, and in the flowing process, the circulating water passes through the spiral discharging blade 33 to repeatedly contact with the semiconductor refrigerating sheets 35 at each height, thereby the heat of heat absorption end pair circulation aquatic through semiconductor refrigeration piece 35 absorbs repeatedly, the heat absorption end of semiconductor refrigeration piece 35 absorbs the heat, then arrange the inside of outer logical frame 15 with the heat through the heat dissipation end, adjust cylinder 4 drives water conservancy diversion arc piece 5 and carries out the water conservancy diversion extrusion to the gas of outer logical frame 15 inside, make the inside gas of outer logical frame 15 flow fast, thereby improve the inside heat exhaust effect of outer logical frame 15, after gas carries the heat and removes to outer logical frame 15 outside, start air-blower 13, air-blower 13 blows this part of gas through the blast hole 37 on the hollow plate 14, it keeps away from this radiator with higher speed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. Radiator based on circulating water cooling type, including heat dissipation case (1) and heat absorption box (7), its characterized in that, the inside that heat dissipation case (1) is located heat absorption box (7) outside is equipped with soaking absorption assembly, and soaking absorption assembly includes soaking frame (22), soaking frame (22) fixed connection is in the inside of heat dissipation case (1), soaking frame (22) are located the outside of heat absorption box (7), one side fixedly connected with two backup pads (30) of heat absorption box (7) towards soaking frame (22), and the top of two backup pads (30) all fixedly connected with urceolus (29), the bottom fixedly connected with jack-up spring (28) of urceolus (29), the top fixedly connected with jack-up post (27) of jack-up spring (28), the top fixedly connected with same riser (24) of two jack-up posts (27), the top fixedly connected with shutoff arc board (23) of riser (24), one side fixedly connected with a plurality of fixed blocks (26) of shutoff arc board (23), and the top of every fixed block (26) all has pneumatic cylinder (25) No. two through hinged joint, and the output of every pneumatic cylinder (25) No. two all through hinged joint in the bottom of shutoff arc board (23), heat dissipation case (1) is located a plurality of temperature sensor of inboard fixedly connected with (19) of heat absorption box (7) below, and the bottom fixedly connected with of soaking frame (22) collects frame (18), collects pneumatic cylinder (21) of the inside equidistance fixedly connected with of frame (18), and the output of a plurality of pneumatic cylinders (21) has same shielding plate (20) through hinged joint, and the other end of shielding plate (20) passes through hinged joint in one side inner wall of collecting frame (18).
2. The radiator based on the circulating water cooling type as claimed in claim 1, wherein a mounting hole is formed at one side of the heat radiating box (1), a mounting frame (12) is fixedly connected to the inside of the mounting hole, and the heat absorbing box (7) is fixedly connected to the inside of the mounting frame (12).
3. The radiator based on the circulating water cooling type according to claim 2, wherein a conveying frame (10) is fixedly connected to the inner wall of the top of the radiating box (1), a connecting hole is formed in the bottom of the conveying frame (10), a connecting frame (11) is fixedly connected to the inside of the connecting hole, the blocking arc plate (23) is attached to the inner wall of the connecting frame (11), a circulating pump (17) is fixedly connected to the inner wall of the bottom of the radiating box (1), a circulating pipe (9) is fixedly connected to the conveying end of the circulating pump (17), and the other end of the circulating pipe (9) is fixedly connected to the inside of the conveying frame (10).
4. The radiator based on the circulating water cooling type according to claim 1, wherein a heat exchange assembly is arranged inside the heat dissipation box (1) below the collection frame (18), the heat exchange assembly comprises a heat exchange cylinder (16), an installation frame (31) is annularly distributed on the outer side of the heat exchange cylinder (16) close to the bottom end, and the other end of the installation frame (31) is fixedly connected to the inner wall of the bottom of the heat dissipation box (1).
5. The radiator based on the circulating water cooling type according to claim 4, wherein a shaft rod (32) is fixedly connected to the bottom of the heat exchange cylinder (16), a connecting shaft (36) is fixedly connected to the top of the shaft rod (32), a spiral discharging blade (33) is fixedly connected to the outer wall of the connecting shaft (36), the spiral discharging blade (33) is in contact with the inner wall of the heat exchange cylinder (16), a communicating hole is formed in the bottom of the collecting frame (18), a communicating pipe (34) is fixedly connected to the inner wall of the communicating hole, and the other end of the communicating pipe (34) is fixedly connected to the top of the heat exchange cylinder (16).
6. The radiator based on the circulating water cooling type as claimed in claim 5, wherein heat exchanging holes are formed in the outer side of the heat exchanging cylinder (16) at equal intervals, a semiconductor chilling plate (35) is fixedly connected to the inside of each heat exchanging hole, the heat absorbing end of each semiconductor chilling plate (35) is located in the heat exchanging cylinder (16), and the heat dissipating end of each semiconductor chilling plate (35) is located in the outer side of the heat exchanging cylinder (16).
7. The radiator based on the circulating water cooling type according to claim 6, wherein a gas flow assembly is provided at the outer side of the heat exchange cylinder (16), and the gas flow assembly comprises an outer through frame (15) and a guide arc piece (5).
8. The radiator based on the circulating water cooling type is characterized in that an outer through hole is formed in the outer side of the radiating box (1), the outer through frame (15) is fixedly connected to the inner portion of the outer through hole, one end of the outer through frame (15) is in contact with the outer side of the heat exchange tube (16), the radiating end of the semiconductor refrigerating sheet (35) is located inside the outer through frame (15), an outer frame (3) is fixedly connected to one side, located on the outer side of the outer through frame (15), of the radiating box (1), an air cylinder (4) is fixedly connected to one side of the outer frame (3), and a flow guide arc sheet (5) is fixedly connected to the output end of the air cylinder (4).
9. The radiator based on the circulating water cooling type according to claim 8, wherein a hollow plate (14) is fixedly connected to one side of the radiating box (1) at both ends of the outer frame (3), and air blowing holes (37) are equally spaced from one side of the two hollow plates (14) facing the outer frame (3), a blower (13) is fixedly connected to one side of the radiating box (1) close to the hollow plate (14), and an air blowing end of the blower (13) is connected to the inside of the hollow plate (14) through a pipeline.
10. The radiator based on the circulating water cooling type, according to claim 2, wherein the outer wall of the mounting frame (12) located outside the heat absorbing box (7) is provided with a heat conducting assembly, the heat conducting assembly comprises a telescopic heat conducting frame (38), two sides of the mounting frame (12) are both connected with the attachment plates (8) through hinges, one side of each of the two attachment plates (8) is fixedly connected with heat conducting fins (6) at equal intervals, one end of the telescopic heat conducting frame (38) is fixedly connected with the outer side of the heat conducting fins (6), the other end of the telescopic heat conducting frame (38) is connected with the outer side of the heat absorbing box (7) through hinges, and the opposite sides of the attachment plate (8) and the heat dissipating box (1) are fixedly connected with extruding springs (2) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210967686.6A CN115127282A (en) | 2022-08-12 | 2022-08-12 | Radiator based on circulating water cooling type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210967686.6A CN115127282A (en) | 2022-08-12 | 2022-08-12 | Radiator based on circulating water cooling type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115127282A true CN115127282A (en) | 2022-09-30 |
Family
ID=83385520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210967686.6A Withdrawn CN115127282A (en) | 2022-08-12 | 2022-08-12 | Radiator based on circulating water cooling type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115127282A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117387414A (en) * | 2023-12-13 | 2024-01-12 | 常州安迪维换热器有限公司 | Heat exchanger applied to electric cabinet of iron tower |
| CN117580320A (en) * | 2023-11-10 | 2024-02-20 | 常州亚同数控科技有限公司 | Servo driver with heat radiation structure |
-
2022
- 2022-08-12 CN CN202210967686.6A patent/CN115127282A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117580320A (en) * | 2023-11-10 | 2024-02-20 | 常州亚同数控科技有限公司 | Servo driver with heat radiation structure |
| CN117580320B (en) * | 2023-11-10 | 2024-06-11 | 常州亚同数控科技有限公司 | Servo driver with heat radiation structure |
| CN117387414A (en) * | 2023-12-13 | 2024-01-12 | 常州安迪维换热器有限公司 | Heat exchanger applied to electric cabinet of iron tower |
| CN117387414B (en) * | 2023-12-13 | 2024-02-13 | 常州安迪维换热器有限公司 | Heat exchanger applied to electric cabinet of iron tower |
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Application publication date: 20220930 |
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