CN115124171A - Treatment method and treatment system for gold-containing waste liquid - Google Patents
Treatment method and treatment system for gold-containing waste liquid Download PDFInfo
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- CN115124171A CN115124171A CN202210738350.2A CN202210738350A CN115124171A CN 115124171 A CN115124171 A CN 115124171A CN 202210738350 A CN202210738350 A CN 202210738350A CN 115124171 A CN115124171 A CN 115124171A
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- 239000010931 gold Substances 0.000 title claims abstract description 261
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 261
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 258
- 239000007788 liquid Substances 0.000 title claims abstract description 229
- 239000002699 waste material Substances 0.000 title claims abstract description 159
- 238000000034 method Methods 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 claims abstract description 85
- 239000011347 resin Substances 0.000 claims abstract description 85
- 238000001179 sorption measurement Methods 0.000 claims abstract description 69
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 61
- 238000005406 washing Methods 0.000 claims description 87
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 72
- 238000001914 filtration Methods 0.000 claims description 34
- 238000007747 plating Methods 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 22
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000007791 liquid phase Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims 1
- 238000011084 recovery Methods 0.000 abstract description 10
- 239000002351 wastewater Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000009776 industrial production Methods 0.000 abstract description 2
- 239000007787 solid Substances 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 239000010405 anode material Substances 0.000 description 4
- 238000003795 desorption Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- -1 gold ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000010406 cathode material Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F9/00—Multistage treatment of water, waste water or sewage
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/001—Processes for the treatment of water whereby the filtration technique is of importance
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/28—Treatment of water, waste water, or sewage by sorption
- C02F1/285—Treatment of water, waste water, or sewage by sorption using synthetic organic sorbents
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2101/00—Nature of the contaminant
- C02F2101/10—Inorganic compounds
- C02F2101/20—Heavy metals or heavy metal compounds
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/16—Nature of the water, waste water, sewage or sludge to be treated from metallurgical processes, i.e. from the production, refining or treatment of metals, e.g. galvanic wastes
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2301/00—General aspects of water treatment
- C02F2301/08—Multistage treatments, e.g. repetition of the same process step under different conditions
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2303/00—Specific treatment goals
- C02F2303/14—Maintenance of water treatment installations
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2303/00—Specific treatment goals
- C02F2303/22—Eliminating or preventing deposits, scale removal, scale prevention
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- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention provides a treatment method and a treatment system of gold-containing waste liquid, wherein the treatment method comprises the following steps: carrying out electrolysis treatment on the first gold-containing waste liquid to obtain metallic gold and electrolysis raffinate; performing adsorption treatment on the electrolysis residual liquid and the second gold-containing waste liquid by using resin to obtain gold-loaded resin and adsorption residual liquid; the gold content in the first gold-containing waste liquid is greater than the gold content in the second gold-containing waste liquid. The treatment method can realize the high-efficiency recovery of gold, does not generate secondary wastewater, and is beneficial to industrial production and application.
Description
Technical Field
The invention relates to the technical field of wastewater treatment, in particular to a treatment method and a treatment system for gold-containing waste liquid.
Background
With the increase of the gold price in the market, the gold plating cost becomes the key point of concern. In the gold plating process of the circuit board, the circuit board to be plated with gold is plated with gold, and then the circuit board after being plated with gold is washed with water, wherein the gold plating residual liquid contains a large amount of unreacted gold salt, and the water washing residual liquid contains a small amount of gold salt.
Therefore, how to effectively treat and recover gold from the gold-containing waste liquid generated in the gold plating process of the circuit board is a technical problem to be solved in the field.
Disclosure of Invention
The invention provides a treatment method and a treatment system for a gold-containing waste liquid, wherein the treatment method can effectively treat and recover the gold-containing waste liquid.
In one aspect of the invention, a method for treating gold-containing waste liquid is provided, which comprises the following steps: carrying out electrolysis treatment on the first gold-containing waste liquid to obtain metallic gold and electrolysis raffinate; respectively adsorbing the electrolysis residual liquid and the second gold-containing waste liquid by using resin to obtain gold-loaded resin and adsorption residual liquid; the gold content in the first gold-containing waste liquid is greater than that in the second gold-containing waste liquid.
According to an embodiment of the present invention, the conditions of the electrolytic treatment are: the voltage is 2.5-5V, the current is 2.5-5V, and the temperature is 50-80 ℃.
According to an embodiment of the invention, the resin comprises an epoxy resin.
According to one embodiment of the invention, before the first gold-containing waste liquid is subjected to electrolysis treatment, the method further comprises filtering the first gold-containing waste liquid; before the resin is adopted to carry out adsorption treatment on the second gold-containing waste liquid, the method further comprises the following steps: and filtering the second gold-containing waste liquid.
According to an embodiment of the present invention, the first gold-containing waste liquid is a gold-plating waste liquid obtained after a circuit board to be gold-plated is subjected to a gold-plating treatment; and the second gold-containing waste liquid is obtained by washing the circuit board subjected to gold plating treatment.
According to an embodiment of the present invention, the water washing process includes the steps of: performing primary washing treatment on the circuit board subjected to the gold plating treatment to obtain second gold-containing waste liquid and the circuit board subjected to the primary washing, and performing secondary washing treatment on the circuit board subjected to the primary washing by using a washing liquid to obtain secondary drainage and a secondary washed circuit board; and (4) performing primary washing treatment on the circuit board subjected to the gold plating treatment by adopting secondary drainage.
In another aspect of the present invention, there is provided a system for processing a gold-containing waste liquid, for implementing the above method for processing a gold-containing waste liquid, including: the liquid phase outlet of the electrolysis device is communicated with the inlet of the resin adsorption device.
According to an embodiment of the invention, the washing device comprises a first-stage washing tank and a second-stage washing tank, wherein a second-stage water outlet is arranged on the second-stage washing tank, and the second-stage water outlet is higher than a first-stage water inlet of the first-stage washing tank in the gravity direction; the first-stage rinsing bath is provided with a first-stage water outlet which is communicated with the resin absorption device.
According to an embodiment of the invention, the gold-containing waste liquor storage device is used for accommodating a second gold-containing waste liquor; the inlet of the liquid storage device is communicated with the outlet of the primary water outlet, and the outlet of the liquid storage device is communicated with the resin absorption device.
According to an embodiment of the present invention, further comprising a first filtering device and a second filtering device; the liquid outlet of the first filtering device is communicated with the inlet of the electrolysis device; the inlet of the second filtering device is communicated with the outlet of the liquid storage tank, and the liquid outlet of the second filtering device is communicated with the inlet of the resin adsorption tank.
The implementation of the invention has at least the following beneficial effects:
according to the method for treating the gold-containing waste liquid, the gold-containing waste liquid to be treated is distinguished according to the content of gold, and is treated by adopting a more appropriate method, so that the gold in the gold-containing waste liquid can be efficiently recovered. Specifically, the gold content of the first gold-containing waste liquid is greater than that of the second gold-containing waste liquid, the first gold-containing waste liquid is subjected to electrolytic treatment to reduce the gold content in the first gold-containing waste liquid, and then the electrolytic raffinate and the second gold-containing waste liquid are subjected to adsorption treatment by using resin respectively to further recover metal gold and reduce the gold content in the electrolytic raffinate and the second gold-containing waste liquid. The treatment method can realize the high-efficiency recovery of gold in the first gold-containing waste liquid and the second gold-containing waste liquid, does not generate secondary waste water, and greatly reduces the treatment cost; in addition, the treatment method also has the advantages of simple treatment process, easy operation and the like, and is beneficial to industrial production and application.
The treatment system for the gold-containing waste liquid provided by the invention combines the electrolysis device and the resin adsorption device, can be used for treating the first gold-containing waste liquid generated in the gold plating process and the second gold-containing waste liquid generated in the water washing process, and has the advantages of simple structure and strong practicability.
Drawings
FIG. 1 is a flow chart of a method for treating a gold-containing waste liquid according to an embodiment of the present invention;
FIG. 2 is a flow chart of a method for treating a gold-containing waste liquid according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a system for treating a gold-containing waste liquid according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first", "second", etc. are used for descriptive purposes only, for example, to distinguish different waste liquids to more clearly describe/explain the technical solution, and are not to be understood as indicating or implying the number of indicated technical features or order with substantial significance, etc. In addition, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "in communication," "connected," "in communication with," and the like, are to be construed broadly, e.g., the communication can be direct or indirect via an intermediary. Those skilled in the art can understand what is specifically meant by the present invention.
As shown in figure 1, the invention provides a method for treating gold-containing waste liquid, which comprises the following steps: carrying out electrolysis treatment on the first gold-containing waste liquid to obtain metallic gold and electrolysis raffinate; respectively adsorbing the electrolysis residual liquid and the second gold-containing waste liquid by using resin to obtain gold-loaded resin and adsorption residual liquid; the gold content in the first gold-containing waste liquid is greater than that in the second gold-containing waste liquid.
The treatment method of the gold-containing waste liquid provided by the invention not only can reduce the content of gold in the gold-containing waste liquid, but also can realize the recovery of gold in the gold-containing waste liquid.
According to the invention, the gold-containing waste liquid comprises a first gold-containing waste liquid and a second gold-containing waste liquid, the content of gold in the first gold-containing waste liquid is high, the metal gold can be recovered by adopting electrolysis treatment, the content of gold in the first gold-containing waste liquid after electrolysis operation is greatly reduced, and the electrolysis residual liquid can be subjected to adsorption treatment by adopting resin. The second gold-containing waste liquid has low gold content and is suitable for recovering gold by resin adsorption.
In some embodiments, the first gold-containing waste liquid is gold-plating waste liquid obtained after gold-plating treatment of a circuit board to be gold-plated, and the content of gold in the first gold-containing waste liquid ranges from 0.4g/L to 1.2 g/L.
Furthermore, the first gold-containing waste liquid can also be gold-containing waste liquid generated in gold precipitation and chemical gold treatment on the surface of the circuit board.
In some embodiments, the second gold-containing waste liquid is obtained by water washing the gold-plated circuit board, that is, the second gold-containing waste liquid is obtained from waste liquid generated by water washing, wherein the content of gold is in a range of 2ppm to 5 ppm.
As shown in fig. 2, in some embodiments, before the performing the electrolytic treatment on the first gold-containing waste liquid, the method further includes filtering the first gold-containing waste liquid to remove solid impurities, silt and the like in the first gold-containing waste liquid, so as to prevent the solid impurities, silt and the like from affecting the effect of the electrolytic treatment.
Generally, the above-mentioned electrolytic treatment is carried out in an electrolytic apparatus comprising at least an electrolytic bath, a cathode plate, and an anode plate, the cathode plate and the anode plate being disposed in the electrolytic bath, the anode plate and the cathode plate being disposed in parallel with each other.
In the electrolytic treatment, the first gold-containing waste liquid is introduced into an electrolytic bath to be electrified for electrolytic treatment, the voltage and the current of the electrolytic treatment are controlled, gold ions in the first gold-containing waste liquid are reduced in the electrolytic process, the gold ions are precipitated on the surface of a negative plate in the form of deposits, then the deposits deposited on the negative plate are scraped, and the deposits are purified, cleaned and dried to obtain the metallic gold. After the electrolysis treatment, the solution remained in the electrolytic bath is the residual electrolyte.
In the above embodiment, the first gold-containing waste liquid is generally subjected to electrolytic treatment by using a stable voltage, so that fluctuation of the voltage is avoided, and the variation amplitude of the current is reduced. The voltage of the electrolytic treatment is 2.5V to 5V, for example, 2.5V, 3V, 3.5V, 4V, 4.5V, 5V or a range consisting of any two thereof. If the voltage of electrolytic treatment is lower, the electrolytic speed is slower, and gold is difficult to deposit on the surface of the cathode; if the voltage is higher, the electrolysis rate is higher, the gold precipitation rate is higher, the thickness of the gold deposited on the polar plate is uneven, the gold easily falls off from the surface of the cathode plate, and the electrolysis treatment effect is influenced.
In some embodiments, the current of the electrolytic treatment is 2.5A-5A, such as a range of 2.5A, 3A, 3.5A, 4A, 4.5A, 5A, or any two thereof. If the current of the electrolytic treatment is smaller, the electron flow is smaller, the probability of electron transfer is reduced, and the gold is not favorably precipitated; if the current is large, the polar plate is easy to heat, and the normal operation of the electrolysis device is influenced.
In order to ensure that the electrolytic treatment process is normally carried out, the temperature of the first gold-containing waste liquid introduced into the electrolytic bath needs to be kept unchanged. In some embodiments, the temperature of the electrolytic treatment is in the range of 50 ℃ to 80 ℃, such as 50 ℃, 55 ℃, 60 ℃, 65 ℃, 70 ℃, 75 ℃, 80 ℃, or any two thereof. If the temperature is lower, the electrolysis speed is slower, the energy consumption is increased, and the electrolysis efficiency is influenced; if the temperature is higher, the solution evaporation in the first gold-containing waste liquid is increased, the crystallization of the deposit is coarse, and the like.
In specific implementation, firstly preheating an electrolytic cell, and setting parameters such as temperature of the electrolytic cell; preheating the first gold-containing waste liquid, and introducing the preheated first gold-containing waste liquid into an electrolytic cell to enable the first gold-containing waste liquid between an anode plate and a cathode plate to flow; when the first gold-containing waste liquid is filled between the anode plate and the cathode plate in the electrolytic cell, the anode plate and the cathode plate are electrified, the voltages at the two ends of the anode plate and the cathode plate are set, and the first gold-containing waste liquid is subjected to electrolytic treatment.
In the specific implementation process, the first gold-containing waste liquid is electrolyzed when the anode plate and the cathode plate in the electrolytic cell are filled with the first gold-containing waste liquid, so that the uniform electrolysis of the first gold-containing waste liquid between the anode plates is facilitated, the gold recovery rate is improved, and the large-scale treatment of the first gold-containing waste liquid is facilitated.
In the above embodiment, when the surface of the cathode material on the cathode plate is filled with the deposit, the cathode plate is taken out from the electrolytic bath, replaced with a new cathode material, and then inserted into the electrolytic bath; when the anode material on the anode plate is consumed, the anode plate is directly taken out of the electrolytic cell, the anode material is removed, a new anode material is replaced, and the anode material is inserted into the electrolytic cell.
In some embodiments, the electrolytic raffinate and the second gold-containing waste liquid are respectively subjected to adsorption treatment by using resin, so that the gold content in the electrolytic raffinate and the second gold-containing waste liquid is further reduced. In the adsorption treatment, residual gold in the electrolysis residual liquid and the second gold-containing waste liquid is adsorbed on resin to obtain gold-loaded resin and adsorption residual liquid. The gold content in the adsorption residual liquid is greatly reduced, and the adsorption residual liquid can be directly discharged into the environment without causing secondary pollution to the environment.
As shown in fig. 2, in the above embodiment, before the adsorption treatment of the second gold-containing waste liquid by using the resin, the method further includes: and filtering the second gold-containing waste liquid to remove solid impurities, silt and the like and prevent the influence of resin blockage on the gold selective adsorption performance of the resin.
In the above embodiment, the electrolysis residual solution and the second gold-containing waste liquid are sufficiently contacted with the resin, so that the residual gold is adsorbed on the resin, and the adsorption treatment is performed under normal temperature conditions.
In the specific implementation process of the invention, the electrolysis residual liquid and the second gold-containing waste liquid are made to flow through the resin so as to make the liquid and the resin fully contact, the resin is usually filled in an adsorption column, and the electrolysis residual liquid and the second gold-containing waste liquid are respectively made to flow into the adsorption column for adsorption treatment, wherein the flow rate of the liquid is 1000L/h-1500L/h.
In the above embodiment, after the resin is saturated with gold, the gold-loaded resin can be removed from the adsorption column, and replaced with a new resin for adsorption.
In the invention, the selected resin has high selectivity to gold, so that the interference of other metals such as copper, nickel and the like on the selectivity of the resin can be eliminated, and the adsorption rate of gold is improved. In some embodiments, the resin comprises an epoxy resin, and the resin of the present invention is commercially available or can be obtained by conventional methods, and the saturated adsorption amount of the resin is not limited herein.
In the above embodiment, after the adsorption treatment is completed, desorption and regeneration of the gold-loaded resin are also included, and the gold on the gold-loaded resin is further extracted by desorbing and regenerating the gold-loaded resin by a conventional method in the art, such as an incineration method, an acid washing method, and the like. Illustratively, the gold-loaded resin is contacted with the desorption solution sufficiently, so that gold adsorbed on the resin is dissolved in the desorption solution in the form of ions, and after the desorption is completed, the desorbed gold-loaded resin is washed by clean water to obtain the regenerated resin.
In the invention, the second gold-containing waste liquid is the waste liquid generated after the circuit board is washed by water, and the washing treatment comprises the following steps: performing primary washing treatment on the circuit board subjected to the gold plating treatment to obtain second gold-containing waste liquid and the circuit board subjected to the primary washing, and performing secondary washing treatment on the circuit board subjected to the primary washing by using a washing liquid to obtain secondary drainage and a secondary washed circuit board; and (4) performing primary washing treatment on the circuit board subjected to the gold plating treatment by adopting secondary drainage.
In the invention, the secondary drainage generated by the secondary washing treatment is used in the primary washing treatment, and the secondary drainage is recycled.
In the above embodiments, the cleaning solution may be a circuit board cleaning solution conventional in the art.
In the invention, the washing treatment of the circuit board and the treatment method of the gold-containing wastewater are combined for application, which is favorable for improving the recovery rate of gold and carrying out large-scale treatment on the first gold-containing waste liquid and the second gold-containing waste liquid.
The invention provides a treatment system of a gold-containing waste liquid, which is used for implementing the treatment method of the gold-containing waste liquid, and the device comprises: the liquid phase outlet of the electrolysis device is communicated with the inlet of the resin adsorption device.
Wherein, the inlet of the electrolysis device can be directly communicated with a waste liquid groove of the gold plating process and also can be communicated with a collecting groove of the first gold-containing waste liquid.
The electrolysis device comprises a power supply, an electrolysis bath, a cathode plate and an anode plate, wherein the cathode plate and the anode plate are arranged in the electrolysis bath, the anode plate is connected with the anode of the power supply, and the cathode plate is connected with the cathode of the power supply.
In the invention, the resin adsorption device comprises an adsorption tank and resin filled in the adsorption tank, wherein the resin is detachably filled in the adsorption tank, and the adsorption tank can be an adsorption column.
In some embodiments, the system further comprises a gold recovery washing device and a gold cylinder, wherein the gold recovery washing device is used for washing deposit gold generated after electrolytic treatment, the gold cylinder is used for collecting recovered gold, an inlet of the gold recovery washing device is communicated with a solid outlet of the electrolytic device, and the gold cylinder is communicated with the gold recovery washing device.
In the above embodiment, the holding tank for the first gold-containing waste liquid is used for collecting the first gold-containing waste liquid. The collecting tank of the first gold-containing waste liquid is communicated with the inlet of the electrolysis device, and the first gold-containing waste liquid in the collecting tank can be introduced into the electrolysis tank of the electrolysis device through the inlet of the electrolysis device.
In some embodiments, the resin adsorption device is used for performing adsorption treatment on the electrolysis residual liquid, and the inlet of the resin adsorption device is communicated with the liquid outlet of the electrolysis device.
In the specific implementation process of the invention, the electrolysis residual liquid is discharged from the liquid outlet of the electrolysis device, so that the electrolysis residual liquid flows into the resin adsorption device for adsorption treatment through the liquid outlet.
In the above embodiments, the communication of the present invention may be a pipe communication.
In the above embodiment, the first filtering device is further included, and the first filtering device is arranged before the electrolysis device and is used for filtering out impurities such as solid particles in the first gold-containing waste liquid. In some embodiments, the inlet of the first filtering device is in communication with a collection tank of the first gold-containing waste liquid, and the liquid outlet of the first filtering device is in communication with an inlet of the electrolysis device.
In some embodiments, the washing device further comprises a first-stage washing tank and a second-stage washing tank, and the first-stage washing tank and the second-stage washing tank are arranged in sequence.
In the above embodiment, the water washing device is used to wash the gold-plated circuit board to obtain the washed circuit board and the second gold-containing waste liquid.
In some embodiments, the side wall of the primary rinsing bath is provided with a primary water inlet and a primary water outlet, and the side wall of the secondary rinsing bath is provided with a secondary water inlet and a secondary water outlet; the first-stage water outlet of the first-stage rinsing bath is communicated with the resin absorption device.
In the above embodiment, the height of the secondary water outlet is not higher than that of the secondary water inlet, and the height of the primary water outlet is not higher than that of the primary water inlet.
In the above embodiment, the height of the secondary water outlet is higher than that of the primary water inlet, and the secondary water outlet is communicated with the primary water inlet through a pipeline.
In the invention, the inlet of the water washing device is a secondary water inlet of the secondary water washing tank, and the outlet of the water washing device is a primary water outlet of the primary water washing tank.
In some embodiments, the flow direction of the cleaning fluid is: the water enters from a secondary water inlet of the secondary rinsing bath, sequentially flows through the secondary rinsing bath and the primary rinsing bath, and is finally discharged from a primary water outlet of the primary rinsing bath.
In the specific implementation process of the invention, the cleaning solution firstly flows into the secondary rinsing bath from the secondary water inlet, overflows to the primary rinsing bath from the secondary rinsing bath after the water height in the secondary rinsing bath exceeds the height of the secondary water outlet, and is discharged from the primary rinsing bath after the water height in the primary rinsing bath exceeds the height of the primary water outlet.
In the invention, when the circuit board is cleaned, the entering sequence of the circuit board after gold plating treatment is opposite to the flow direction of the cleaning liquid. The circuit board after gold plating treatment sequentially flows through the first-stage rinsing bath and the second-stage rinsing bath, namely, the circuit board is firstly rinsed (cleaned) in the first-stage rinsing bath and then moved into the second-stage rinsing bath for cleaning.
In the above embodiment, the circuit board enters from the first-stage outlet of the first-stage rinsing bath, sequentially passes through the first-stage rinsing bath and the second-stage rinsing bath, and finally is discharged from the second-stage water inlet of the second-stage rinsing bath.
In the above embodiment, when the washing device is used for washing the circuit board, the cleaning solution can flow through the secondary washing tank and the primary washing tank in sequence, and then the circuit board enters the washing device for washing, and after the circuit board is washed, the liquid discharged from the primary water outlet is the second gold-containing waste liquid.
In the above embodiment, the washing liquid flows into the in-process of one-level wash bowl from the second grade wash bowl, and the washing liquid is muddy gradually, consequently, when the order that the circuit board got into was opposite with the flow direction of washing liquid, when the circuit board got into by the one-level wash bowl, can use the circuit board that dirtier was washd earlier to turbid washing liquid, along with the circuit board washs in getting into the second grade wash bowl, the circuit board is cleaner and cleaner, and the washing liquid is also cleaner and cleaner, and is also better to the cleaning performance of circuit board to can practice thrift the washing liquid.
According to the invention, the circuit board is cleaned by arranging the two rinsing tanks, and the overflow rinsing manner is adopted, so that the cleaning effect is good, a large amount of cleaning liquid is saved, the production cost is reduced, and the energy conservation and emission reduction are facilitated.
In some embodiments, the method further comprises a liquid storage device, wherein the liquid storage device is used for temporarily containing the second gold-containing waste liquid, and when the amount of the second gold-containing waste liquid in the liquid storage device meets a certain volume, the second gold-containing waste liquid flows to the resin adsorption device.
In the above embodiment, the inlet of the liquid storage device is communicated with the outlet of the water washing device, and the outlet of the liquid storage device is communicated with the resin absorption device.
In the specific implementation process of the invention, the second gold-containing waste liquid generated in the water washing device flows into the liquid storage device, and then the second gold-containing waste liquid is conveyed from the outlet of the liquid storage device to the resin absorption device for adsorption treatment.
In some embodiments, the resin adsorption device is used for performing adsorption treatment on the second gold-containing waste liquid, an adsorption resin is arranged in the resin adsorption device, and an inlet of the resin adsorption device is communicated with an outlet of the liquid storage device.
In the specific implementation process of the invention, the second gold-containing waste liquid is discharged from the outlet of the liquid storage device and flows into the resin adsorption device for adsorption treatment. And adsorbing gold in the second gold-containing waste liquid on the resin to form gold-loaded resin, wherein the adsorption residual liquid can be directly discharged from an outlet of the resin adsorption device.
In the above embodiment, when the adsorption amount of the gold-carrying resin reaches the saturation adsorption amount of the resin, it is necessary to detach the gold-carrying resin from the resin adsorption apparatus, replace the resin with a new one, and then desorb and regenerate the detached gold-carrying resin.
In some embodiments, the treatment system further includes a second filtering device, configured to filter the second gold-containing waste liquid to remove solid impurities, silt, and the like in the second gold-containing waste liquid, so as to prevent the second gold-containing waste liquid from entering the resin adsorption device to block the resin, and thus the performance of the resin for adsorbing gold is not affected.
In the above embodiment, the inlet of the second filtering device is communicated with the outlet of the liquid storage tank, and the liquid outlet of the second filtering device is communicated with the inlet of the resin adsorption tank.
In the invention, the collecting tank of the first gold-containing waste liquid uninterruptedly leads the first gold-containing waste liquid into the electrolysis device, the electrolysis device uninterruptedly carries out electrolysis treatment on the first gold-containing waste liquid, and the water washing device uninterruptedly carries out water washing treatment on the circuit board, so that the uninterruptedly operated treatment system can be used together with the manufacturing production line of the circuit board, and large-scale popularization and application are realized.
The treatment system of the gold-containing waste liquid provided by the invention has a simple structure, is convenient and quick to use, can be used for treating the gold-containing waste liquid, recovering gold in the gold-containing waste liquid, and further reducing the gold content in the gold-containing waste liquid.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The system for treating gold-containing waste liquid in this embodiment is shown in fig. 3, and includes:
a first gold-containing waste liquid collecting tank 1 for collecting first gold-containing waste water;
the water washing device 2 comprises a first-stage water washing tank 3 and a second-stage water washing tank 4 which are sequentially arranged; the water washing device is used for washing the circuit board;
the liquid storage device 5 is used for containing the second gold-containing waste liquid generated after the water washing treatment; the inlet of the liquid storage device 5 is communicated with the outlet of the water washing device 2;
the first filtering device 6 is used for removing solid impurities, silt and the like in the first gold-containing waste liquid; the inlet of the first filtering device 6 is communicated with the first gold-containing waste liquid collecting tank 1;
the second filtering device 7 is used for removing solid impurities, silt and the like in the second gold-containing waste liquid; the inlet of the second filtering device 7 is communicated with the outlet of the liquid storage device 5;
the electrolysis device 8 is used for carrying out electrolysis treatment on the filtered first gold-containing waste liquid; the inlet of the electrolysis device 8 is communicated with the liquid outlet of the first filtering device 6;
the resin adsorption device 9 is used for carrying out adsorption treatment on the electrolysis residual liquid and the filtered second gold-containing waste liquid; the inlet of the resin adsorption device 9 is respectively communicated with the liquid outlet of the electrolysis device 8 and the liquid outlet of the second filtering device 7;
a gold recovery washing device 10 for washing the deposit gold deposited on the cathode by the electrolytic treatment;
and a gold jar 11 for collecting the cleaned gold.
The method for treating the gold-containing waste liquid is performed in the treatment system, and comprises the following steps:
introducing the first gold-containing waste liquid (gold concentration is 0.4-1.2 g/L, median value is 0.8g/L) in the first gold-containing waste liquid collecting tank into a first filtering device, filtering, and flowing into an electrolysis device for electrolysis treatment, wherein the temperature in the electrolysis treatment is controlled at 50 ℃, the voltage is 2-3V, and the current is 3-5A; after electrolytic treatment, the average gold concentration in the electrolytic residual liquid is measured to be 0.0166 g/L;
then discharging the residual electrolyte through a liquid outlet of the electrolysis device, and allowing the residual electrolyte to flow into a resin absorption device for adsorption treatment; controlling the flow rate of the fluid for adsorption treatment to be 1000L/h-1500L/h,
enabling the cleaning solution to enter from the secondary water inlet and flow through the secondary rinsing bath and the primary rinsing bath in sequence; conveying the circuit board into a water washing device for washing, sequentially flowing through a primary water washing tank and a secondary water washing tank, discharging two gold-containing waste liquids generated by washing from a primary water outlet, flowing into a liquid storage device and a second filtering device, filtering, and flowing into a resin absorption device for adsorption treatment; controlling the flow rate of the fluid subjected to adsorption treatment to be 1000L/h-1500L/h, and measuring that the average gold-containing concentration of the second gold-containing waste liquid in the liquid storage device is 0.004368 g/L;
the gold concentration in the adsorption raffinate, measured at the outlet of the resin adsorption unit, was 0.00001g/L and could be discharged directly into the environment.
The treatment method and the treatment system for the gold-containing waste liquid provided by the invention can thoroughly recover the residual gold ions in the first gold-containing waste liquid and the second gold-containing waste liquid, and simultaneously further reduce the gold content in the gold-containing waste liquid, and the treated liquid is discharged into the environment without causing secondary pollution.
The above detailed description of the preferred embodiments of the present invention and experimental verification. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (10)
1. The method for treating the gold-containing waste liquid is characterized by comprising the following steps of: carrying out electrolysis treatment on the first gold-containing waste liquid to obtain metallic gold and electrolysis raffinate;
respectively adsorbing the electrolysis residual liquid and the second gold-containing waste liquid by using resin to obtain gold-loaded resin and adsorption residual liquid;
the gold content in the first gold-containing waste liquid is greater than the gold content in the second gold-containing waste liquid.
2. The treatment method according to claim 1, wherein the conditions of the electrolytic treatment are: the voltage is 2.5-5V, the current is 2.5-5V, and the temperature is 50-80 ℃.
3. The process of claim 1, wherein the resin comprises an epoxy resin.
4. A treatment method according to claim 1, characterized in that before subjecting the first spent gold-containing liquid to electrolytic treatment, it further comprises filtering the first spent gold-containing liquid;
before the adsorption treatment is carried out on the second gold-containing waste liquid by adopting resin, the method further comprises the following steps: filtering the second gold-containing waste liquid.
5. The treatment method according to claim 1, wherein the first gold-containing waste liquid is a gold-plating waste liquid obtained by subjecting a circuit board to be gold-plated to gold-plating treatment;
and the second gold-containing waste liquid is obtained by washing the circuit board subjected to gold plating treatment.
6. The processing method according to claim 5, wherein the water washing process comprises the steps of:
performing primary washing treatment on the circuit board subjected to gold plating treatment to obtain second gold-containing waste liquid and the circuit board subjected to primary washing, and performing secondary washing treatment on the circuit board subjected to primary washing by using a cleaning solution to obtain secondary drainage and a secondary washed circuit board;
and performing the primary water washing treatment on the circuit board subjected to the gold plating treatment by adopting the secondary drainage.
7. A system for treating a gold-containing waste liquid, which is used for implementing the method for treating a gold-containing waste liquid according to any one of claims 1 to 6, and which comprises:
the device comprises an electrolysis device and a resin adsorption device, wherein a liquid phase outlet of the electrolysis device is communicated with an inlet of the resin adsorption device.
8. The treatment system of claim 7, further comprising a water washing device, wherein the water washing device comprises a primary water washing tank and a secondary water washing tank, a secondary water outlet is arranged on the secondary water washing tank, and the secondary water outlet is higher than a primary water inlet of the primary water washing tank in the gravity direction;
and a primary water outlet is arranged on the primary water washing tank and communicated with the resin absorption device.
9. The processing system of claim 8, further comprising a reservoir for holding a second gold-containing waste stream;
the inlet of the liquid storage device is communicated with the outlet of the primary water outlet, and the outlet of the liquid storage device is communicated with the resin absorption device.
10. The treatment system of claim 9, further comprising a first filtration device and a second filtration device;
the liquid outlet of the first filtering device is communicated with the inlet of the electrolysis device;
the inlet of the second filtering device is communicated with the outlet of the liquid storage tank, and the liquid outlet of the second filtering device is communicated with the inlet of the resin adsorption tank.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107555673A (en) * | 2017-09-20 | 2018-01-09 | 苏州东吴黄金文化发展有限公司 | A kind of method of high efficiente callback electroforming waste liquid and useless underwater gold |
| CN111074301A (en) * | 2019-12-30 | 2020-04-28 | 深圳市祺鑫天正环保科技有限公司 | Recovery method and recovery system of gold-containing wastewater |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107555673A (en) * | 2017-09-20 | 2018-01-09 | 苏州东吴黄金文化发展有限公司 | A kind of method of high efficiente callback electroforming waste liquid and useless underwater gold |
| CN111074301A (en) * | 2019-12-30 | 2020-04-28 | 深圳市祺鑫天正环保科技有限公司 | Recovery method and recovery system of gold-containing wastewater |
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