CN115113750A

CN115113750A - Display module modulus adjusting method, display module and electronic equipment

Info

Publication number: CN115113750A
Application number: CN202110286288.3A
Authority: CN
Inventors: 罗中元; 代晓涛
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-03-17
Filing date: 2021-03-17
Publication date: 2022-09-27

Abstract

The application relates to the technical field of display screens, in particular to a display module modulus adjusting method, a display module and electronic equipment. This display module assembly includes: a display layer; the supporting layer is positioned on the non-display side of the display layer and comprises a metal sheet layer with an initial modulus larger than a preset modulus, the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer; wherein the sheet metal layer is to receive a first current from the power source when the electronic device is about to impact another object, the first current to reduce a modulus of the sheet metal layer. The display module can have different moduli under different scenes so as to cope with extrusion or impact caused by different scenes, and the durability of the display module can be improved.

Description

Display module modulus adjusting method, display module and electronic equipment

Technical Field

The application relates to the technical field of display screens, in particular to a display module modulus adjusting method, a display module and electronic equipment.

Background

A screen support backplane (SCF) is used to support and protect the display screen of the electronic device. The protection effect of the screen support backboard on the display screen can comprise the following two aspects.

The protection function 1 is used for coping with or resisting static extrusion caused by assembly of the electronic equipment and tolerance among parts of the electronic equipment, and preventing color cast of a display panel (panel) under stamping and assembly stress; and to resist crushing of the electronic device that may be encountered in a confined environment (e.g., the electronic device may be placed in a pocket and crushed by a key), etc.

And 2, the protective effect 2 is used for coping with or resisting dynamic impact caused by the whole electronic equipment falling, and preventing falling of broken bright spots, black spots and the like.

Therefore, it is significant to provide a screen supporting back plate with both anti-extrusion capability and anti-impact capability to improve the durability of the screen of the electronic device.

Disclosure of Invention

The embodiment of the application provides a display module modulus adjusting method, a display module and electronic equipment, which can dynamically adjust the modulus of the display module to adapt to different scenes.

In a first aspect, an embodiment of the present application provides a display module configured in an electronic device, where the display module includes: a display layer; the supporting layer is positioned on the non-display side of the display layer and comprises a metal sheet layer with an initial modulus larger than a preset modulus, the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer; wherein the sheet metal layer is to receive a first current from the power source when the electronic device is about to impact another object, the first current to reduce a modulus of the sheet metal layer.

In one possible implementation, the first current is used to decrease the modulus of the sheet metal layer from the initial modulus to a target modulus; the target modulus is determined by an impact energy density caused by the electronic device impacting the other object.

In one possible implementation manner, the first end and the second end are two ends in the length direction of the metal sheet layer; or the first end and the second end are two ends of the metal layer in the width direction.

In one possible implementation, the display layer is foldable; when the display module is bent, the metal sheet layer is used for receiving a second current from the power supply, and the second current is used for reducing the modulus of the metal sheet layer.

In one possible implementation manner, when the display module completes the bending, the metal sheet layer no longer receives current from the power supply, so that the metal sheet layer recovers the initial modulus.

In a second aspect, an embodiment of the present application provides a modulus adjusting method, which is applied to an electronic device configured with a display module, where the display module includes: a display layer; the supporting layer is positioned on the non-display side of the display layer and comprises a metal sheet layer with an initial modulus larger than a preset modulus, the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer; the method comprises the following steps: determining that the electronic device is about to impact other objects; controlling the power supply to output a first current to the sheet metal layer before the electronic device contacts the other object, the first current being for reducing a modulus of the sheet metal layer.

In one possible implementation, the determining that the electronic device is about to impact other objects includes: determining an impact energy density to which the electronic device is to be subjected; determining a target modulus according to the impact energy density and the corresponding relation between the modulus and the impact energy density; the controlling the power supply to output a first current to the sheet metal layer includes: determining a target current density according to the target modulus and the corresponding relation between the modulus and the current density; calculating the product of the target current density and the cross sectional area to obtain a target current; the cross-sectional area is a cross-sectional area of the metal layer perpendicular to a current flow direction; determining a current equal to or greater than the target current as the first current.

In one possible implementation, the other object is the ground; the determining that the electronic device is about to collide with other objects is specifically determining that the electronic device starts to fall from a first height from the ground; the determining an impact energy density to which the electronic device is to be subjected comprises: predicting impact energy when the electronic equipment falls to the ground according to the first height and the mass of the electronic equipment; predicting the contact area between the electronic equipment and the ground when the electronic equipment falls to the ground according to the falling angle of the electronic equipment; dividing the impact energy by the contact area to obtain the impact energy density.

In one possible implementation, the display layer is foldable; the method further comprises the following steps: determining that the display module is bending; controlling the power supply to output a second current to the sheet metal layer, the second current for reducing a modulus of the sheet metal layer.

In one possible implementation, the method further includes: determining that the display module finishes bending; controlling the power source to no longer output current to the sheet metal layer to restore the sheet metal layer to the initial modulus.

In a third aspect, an embodiment of the present application provides an electronic device, including: the display device comprises a display module, a processor and a memory; the display module assembly includes: a display layer; the supporting layer is positioned on the non-display side of the display layer and comprises a metal sheet layer with an initial modulus larger than a preset modulus, the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer; the memory is to store computer instructions; when the electronic device is running, the processor executes the computer instructions, causing the electronic device to perform: determining that the electronic device is about to impact other objects; controlling the power supply to output a first current to the sheet metal layer before the electronic device contacts the other object, the first current being for reducing a modulus of the sheet metal layer.

In one possible implementation, when the electronic device is running, the processor executes the computer instructions, so that the electronic device further performs: determining an impact energy density to which the electronic device is to be subjected; determining a target modulus according to the impact energy density and the corresponding relation between the modulus and the impact energy density; determining a target current density according to the target modulus and the corresponding relation between the modulus and the current density; calculating the product of the target current density and the cross-sectional area to obtain a target current; the cross-sectional area is a cross-sectional area of the metal layer perpendicular to a current flow direction; determining a current equal to or greater than the target current as the first current.

In one possible implementation, the other object is the ground; when the electronic device is running, the processor executes the computer instructions, so that the electronic device further executes: determining that the electronic device has begun to fall from a first height from the ground; the determining an impact energy density to which the electronic device is to be subjected comprises: predicting impact energy of the electronic equipment when the electronic equipment falls to the ground according to the first height and the quality of the electronic equipment; predicting the contact area between the electronic equipment and the ground when the electronic equipment falls to the ground according to the falling angle of the electronic equipment; dividing the impact energy by the contact area to obtain the impact energy density.

In one possible implementation, the display layer is foldable; when the electronic device is running, the processor executes the computer instructions, so that the electronic device further executes: determining that the display module is bending; controlling the power supply to output a second current to the sheet metal layer, the second current for reducing a modulus of the sheet metal layer.

In one possible implementation, when the electronic device is running, the processor executes the computer instructions, so that the electronic device further performs: determining that the display module finishes the bending; controlling the power source to no longer output current to the sheet metal layer to restore the sheet metal layer to the initial modulus.

In a fourth aspect, an embodiment of the present application provides an electronic device, including the display module of the first aspect.

In a fifth aspect, the present application provides a computer storage medium, on which a computer program is stored, which, when executed by a processor, implements the method as provided in the second aspect.

In a sixth aspect, the present application provides a computer program product including instructions for implementing the method as provided in the second aspect.

The display module adjusting method, the display module and the electronic device provided by the embodiment of the application can adjust the modulus of the display module under different scenes so as to cope with extrusion or impact caused by different scenes, and the durability of the display module can be improved.

Drawings

FIG. 1 is a schematic view of a display module;

fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

FIG. 4 is a graph showing the relationship between impact energy density and modulus, and the relationship between extrusion die stress and modulus;

FIG. 5 is a graph showing stress and strain relationships at different current densities;

fig. 6 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

fig. 7 is a flowchart of a method for adjusting a modulus of a display module according to an embodiment of the present disclosure;

fig. 8 is a schematic block diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments.

In the description of the present specification, "a plurality" means two or more unless otherwise specified.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise.

Wherein in the description of this specification, "/" indicates an or meaning, for example, a/B may indicate a or B; "and/or" herein is merely an association describing an associated object, and means that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present application, "a plurality" means two or more than two.

In the description of the present specification, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

A screen support backplane (SCF) is used to support and protect the display of an electronic device. The protection effect of the screen support backboard on the display screen can comprise the following two aspects.

Protection 1, dealing with or resisting static extrusion caused by assembly of electronic equipment and tolerance among parts of the electronic equipment, and preventing color cast of a display panel (panel) under stamping and assembly stress; and resistance to compression of the electronic device in a confined environment (e.g., compression of the electronic device by a key placed in a pocket), etc.

And 2, the protective effect is achieved, dynamic impact caused by falling of the whole electronic equipment is coped or resisted, and falling of bright spots, black spots and the like is prevented.

The requirements of static extrusion resistance and dynamic impact resistance are contradictory to the requirements of the material or performance of the screen supporting backboard. The higher the modulus the higher the crush resistance of the screen support backplate made of the material and the lower the impact resistance, typically metal, PET, PI. The lower the modulus the higher the impact resistance and the lower the crush resistance of the screen support backplate made of materials such as foam and grid glue. At present, it is difficult to satisfy both the requirement of the electronic device for the extrusion resistance and the impact resistance by using a single material for the screen support back plate.

In one approach, as shown in fig. 1, the screen support backplate is prepared by stacking multiple layers of materials such as foam, PI, metal Cu, etc., to absorb dynamic impact with the foam and resist static compression with Cu, PI. As shown in fig. 1, the layers are bonded to each other at their interface by an adhesive. A typical structure of this embodiment is shown in fig. 1, in which the display layer includes a Cover Glass (CG), a Polarizer (POL) bonded to the CG by an optical adhesive (OCA), a display and touch panel (display and touch panel) bonded to the polarizer by an optical adhesive, a PI layer bonded to the display and touch panel by a Pressure Sensitive Adhesive (PSA), a foam layer bonded to the PI layer by a pressure sensitive adhesive or a mesh adhesive, and a metal layer bonded to the foam layer by a pressure sensitive adhesive or a mesh adhesive. In the scheme, the screen supporting back plate comprises stacked multiple layers of materials, and the thickness is thick, so that the whole electronic equipment is not favorably thinned. In addition, the modulus of the metal Cu is only 30-40GPa, the impact resistance is strong, the anti-extrusion capability is weak, and the display screen is easy to generate crushing bright spots due to extrusion.

The embodiment of the application provides a display module modulus adjusting method and a display module, and the display module comprises a display layer and a supporting layer arranged on the back of the display layer, wherein the supporting layer can be made of a single-layer material. And the material from which the support layer is constructed may change modulus, should also resist crush scenarios as well as impact scenarios. In a squeezing-resistant scene, for example, when the electronic device is placed in a narrow pocket and pressed by a key, the supporting layer can be in a high-modulus state to cope with or resist the squeezing of the display module. In impact resistant scenarios, such as drop scenarios, a low modulus state may be present to cope with or resist the impact caused by the drop. Therefore, the contradiction that the high impact resistance and the high extrusion resistance of the screen supporting back plate made of a single-layer material cannot be compatible can be solved. In addition, a buffer layer (cushion) layer (such as a foam layer) is not needed, so that the number of layers of the screen supporting backboard is reduced, and the thickness of the screen supporting backboard is reduced.

The display module and the method for adjusting the modulus of the display module provided by the embodiment of the application can be applied to the electronic device 100. The electronic device 100 may be a portable electronic device such as a mobile phone, a tablet computer, a digital camera, a Personal Digital Assistant (PDA), a wearable device, a laptop computer (laptop), a watch, and a bracelet. The portable electronic device may also be other portable electronic devices such as laptop computers (laptop) with touch sensitive surfaces (e.g., touch panels), etc. It should also be understood that in other embodiments of the present application, the electronic device 100 may not be a portable electronic device, but may be a desktop computer, television, etc. having a touch-sensitive surface (e.g., a touch panel). In other embodiments, the electronic device 100 may also be an LCD module, an OLED module, a navigator, etc. The embodiment of the present application does not specifically limit the type of the electronic device 100.

Fig. 2 shows a schematic structural diagram of the electronic device 100.

The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a Universal Serial Bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a key 190, a motor 191, an indicator 192, a camera 193, a display screen 194, a Subscriber Identification Module (SIM) card interface 195, and the like. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.

It is to be understood that the illustrated structure of the embodiment of the present invention does not specifically limit the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Processor 110 may include one or more processing units, such as: the processor 110 may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), etc. Wherein, the different processing units may be independent devices or may be integrated in one or more processors. In some embodiments, the processor 110 may also be referred to as a system-on-chip.

The controller can generate an operation control signal according to the instruction operation code and the timing signal to complete the control of instruction fetching and instruction execution.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that have just been used or recycled by the processor 110. If the processor 110 needs to use the instruction or data again, it can be called directly from the memory. Avoiding repeated accesses reduces the latency of the processor 110, thereby increasing the efficiency of the system.

The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and/or the charge management module 140, and supplies power to the processor 110, the internal memory 121, the display 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 may also receive a control command sent by the processor 110 and supply power to the relevant power consuming components in response to the control command. The power management module 141 may also be used to monitor parameters such as battery capacity, battery cycle count, battery state of health (leakage, impedance), etc. In some other embodiments, the power management module 141 may also be disposed in the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may also be disposed in the same device.

The display screen 194 is used to display images, video, and the like. The display screen 194 includes a display panel. The display panel may adopt a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED), a flexible light-emitting diode (FLED), a miniature, a Micro-oeld, a quantum dot light-emitting diode (QLED), and the like. In some embodiments, the electronic device 100 may include 1 or N display screens 194, N being a positive integer greater than 1.

In some embodiments of the present application, the display 194 may be folded, i.e., the electronic device 100 may be configured with a foldable display. Here, the display screen 194 may be bent, which means that the display screen may be bent at a fixed position or at an arbitrary position to an arbitrary angle and may be held at the angle. The foldable display screen has two modes: an unfolded state and a folded state. The foldable display screen can be regarded as being in an unfolded state when the bending angle formed by bending the foldable display screen is larger than a preset value, and can be regarded as being in a folded state when the bending angle formed by bending the foldable display screen is smaller than the preset value, and the preset value can be predefined, for example, 90 degrees, 80 degrees and the like. The bending angle may refer to an angle formed at the bending portion on a side of the foldable screen not used for displaying the content. In some embodiments, an angle sensor may be disposed at a bending position of the foldable display screen, and the electronic device may detect the bending angle through the angle sensor and determine whether the foldable display screen is in an unfolded state or a folded state according to the bending angle; and judging whether the foldable display screen is in the bending process or is bending according to the change of the bending angle.

The pressure sensor 180A is used for sensing a pressure signal, and converting the pressure signal into an electrical signal. In some embodiments, the pressure sensor 180A may be disposed on the display screen 194. The pressure sensor 180A can be of a wide variety, such as a resistive pressure sensor, an inductive pressure sensor, a capacitive pressure sensor, and the like. The capacitive pressure sensor may be a sensor comprising at least two parallel plates having an electrically conductive material. When a force acts on the pressure sensor 180A, the capacitance between the electrodes changes. The electronic device 100 determines the strength of the pressure from the change in capacitance. When a touch operation is applied to the display screen 194, the electronic apparatus 100 detects the intensity of the touch operation according to the pressure sensor 180A. The electronic apparatus 100 may also calculate the touched position from the detection signal of the pressure sensor 180A. In some embodiments, the touch operations that are applied to the same touch position but different touch operation intensities may correspond to different operation instructions. For example: and when the touch operation with the touch operation intensity smaller than the first pressure threshold value acts on the short message application icon, executing an instruction for viewing the short message. And when the touch operation with the touch operation intensity larger than or equal to the first pressure threshold value acts on the short message application icon, executing an instruction of newly building the short message. In some embodiments, the pressure sensor 180A may detect a detection signal that a user's finger touches the display screen 194 to determine a contact area and a contact area of the finger touching the display screen 194, and may determine whether the finger is sandwiched between the electronic devices 100 in the folded configuration.

The gyro sensor 180B may be used to determine the motion attitude of the electronic device 100. In some embodiments, the angular velocity of electronic device 100 about three axes (i.e., x, y, and z axes) may be determined by gyroscope sensor 180B. The gyro sensor 180B may be used for photographing anti-shake. For example, when the shutter is pressed, the gyro sensor 180B detects a shake angle of the electronic device 100, calculates a distance to be compensated for by the lens module according to the shake angle, and allows the lens to counteract the shake of the electronic device 100 through a reverse movement, thereby achieving anti-shake. The gyroscope sensor 180B may also be used for navigation, somatosensory gaming scenes.

The air pressure sensor 180C is used to measure air pressure. In some embodiments, electronic device 100 calculates altitude, aiding in positioning and navigation, from barometric pressure values measured by barometric pressure sensor 180C.

The magnetic sensor 180D includes a hall sensor. The electronic device 100 may detect the opening and closing of the flip holster using the magnetic sensor 180D. In some embodiments, when the electronic device 100 is a flip phone, the electronic device 100 may detect the opening and closing of the flip according to the magnetic sensor 180D. And then according to the opening and closing state of the leather sheath or the opening and closing state of the flip cover, the automatic unlocking of the flip cover is set.

The acceleration sensor 180E may detect the magnitude of acceleration of the electronic device 100 in various directions (typically three axes). The magnitude and direction of gravity can be detected when the electronic device 100 is stationary. The method can also be used for recognizing the posture of the electronic equipment, and is applied to horizontal and vertical screen switching, pedometers and other applications.

A distance sensor 180F for measuring a distance. The electronic device 100 may measure the distance by infrared or laser. In some embodiments, taking a picture of a scene, electronic device 100 may utilize range sensor 180F to range for fast focus.

The proximity light sensor 180G may include, for example, a Light Emitting Diode (LED) and a light detector, such as a photodiode. The light emitting diode may be an infrared light emitting diode. The electronic device 100 emits infrared light to the outside through the light emitting diode. The electronic device 100 detects infrared reflected light from nearby objects using a photodiode. When sufficient reflected light is detected, it can be determined that there is an object near the electronic device 100. When insufficient reflected light is detected, the electronic device 100 may determine that there are no objects near the electronic device 100. The electronic device 100 can utilize the proximity light sensor 180G to detect that the user holds the electronic device 100 close to the ear for talking, so as to automatically turn off the screen to achieve the purpose of saving power. The proximity light sensor 180G may also be used in a holster mode, a pocket mode automatically unlocks and locks the screen.

The ambient light sensor 180L is used to sense the ambient light level. Electronic device 100 may adaptively adjust the brightness of display screen 194 based on the perceived ambient light level. The ambient light sensor 180L may also be used to automatically adjust the white balance when taking a picture. The ambient light sensor 180L may also cooperate with the proximity light sensor 180G to detect whether the electronic device 100 is in a pocket to prevent accidental touches.

The fingerprint sensor 180H is used to collect a fingerprint. The electronic device 100 can utilize the collected fingerprint characteristics to unlock the fingerprint, access the application lock, photograph the fingerprint, answer an incoming call with the fingerprint, and so on.

The temperature sensor 180J is used to detect temperature. In some embodiments, electronic device 100 implements a temperature processing strategy using the temperature detected by temperature sensor 180J. For example, when the temperature reported by the temperature sensor 180J exceeds a threshold, the electronic device 100 performs a reduction in performance of a processor located near the temperature sensor 180J, so as to reduce power consumption and implement thermal protection. In other embodiments, the electronic device 100 heats the battery 142 when the temperature is below another threshold to avoid abnormal shutdown of the electronic device 100 due to low temperature. In other embodiments, when the temperature is lower than a further threshold, the electronic device 100 performs boosting on the output voltage of the battery 142 to avoid abnormal shutdown due to low temperature.

The touch sensor 180K is also called a "touch device". The touch sensor 180K may be disposed on the display screen 194, and the touch sensor 180K and the display screen 194 form a touch screen, which is also called a "touch screen". The touch sensor 180K is used to detect a touch operation applied thereto or nearby. The touch sensor can communicate the detected touch operation to the application processor to determine the touch event type. Visual output associated with the touch operation may be provided through the display screen 194. In other embodiments, the touch sensor 180K may be disposed on a surface of the electronic device 100, different from the position of the display screen 194.

The bone conduction sensor 180M may acquire a vibration signal. In some embodiments, the bone conduction sensor 180M may acquire a vibration signal of the human vocal part vibrating the bone mass. The bone conduction sensor 180M may also contact the human pulse to receive the blood pressure pulsation signal. In some embodiments, bone conduction sensor 180M may also be provided in a headset, integrated into a bone conduction headset. The audio module 170 may analyze a voice signal based on the vibration signal of the bone mass vibrated by the sound part acquired by the bone conduction sensor 180M, so as to implement a voice function. The application processor can analyze heart rate information based on the blood pressure beating signal acquired by the bone conduction sensor 180M, so as to realize the heart rate detection function.

The embodiment of the present application provides a display module 400, which can be configured in an electronic device 100. As shown in fig. 3, the display module 400 may include a display layer 410 and a support layer 420. Wherein the support layer 420 is disposed on the non-display surface of the display layer 410. Illustratively, the support layer 420 may be adhesively bonded to the non-display side of the display layer 410. In one example, the adhesive may be a pressure sensitive adhesive. In another example, the adhesive may be a grid adhesive. Illustratively, the support layer 420 may be fixed on the non-display surface of the display layer 410 by nuts, snaps, or the like.

As shown in fig. 3, the support layer 420 may include a metal layer 421. The metal layer 421 may be a metal plate with a higher modulus, which can meet the anti-extrusion requirement of the display module 400. In particular, a developer or a designer of the electronic device 100 or the display module 400 may select a metal plate to prepare the metal layer 421 according to the anti-extrusion requirement of the display layer 410 by the designer or the electronic device 100 or the display module 400.

For example, the display layer 410 may be designed to be able to withstand or respond to a predetermined amount of stress at a maximum, and according to the predetermined amount of stress, a minimum modulus of the support layer 420 that enables the display layer 410 to withstand the predetermined amount of stress without failing or being damaged is determined. That is, when the modulus of the support layer 420 is greater than or equal to the minimum modulus, the display layer 410 is not damaged or fails when subjected to the predetermined amount of stress. The damage or failure of the display layer 410 may refer to a circuit damage or failure of the display panel. Damage or failure of the display layer 410 may also be referred to as display panel stamping or color cast.

Illustratively, the modulus body of the metal layer 420 may refer to a tensile modulus.

In one example, the minimum modulus may be determined using a stress of a predetermined magnitude according to the corresponding relationship between the extrusion die stress and the modulus shown in fig. 4. In FIG. 4, ISEA is an intelligent super elastic alloy (intelligent super elastic alloy), Cu represents copper, and SUS-316L is a stainless steel, i.e., 316L stainless steel.

After the minimum modulus is determined, a metal plate having a modulus greater than or equal to the minimum modulus may be selected for the metal layer 421.

Returning to fig. 3, a first end of the metal layer 421 may be connected to the positive electrode of the battery 142, and a second end may be connected to the negative electrode of the battery 142. Illustratively, the first end and the second end may be opposite ends of the metal layer 421 in the length direction. Illustratively, the first end and the second end may be opposite ends of the metal layer 421 in the width direction. Illustratively, as shown in fig. 3, a first end of the metal layer 421 may be connected to a positive electrode of the battery 142 through a lead 4211, and a second end may be connected to a negative electrode of the battery 142 through a lead 4212.

Thus, the battery 142 can output a current to the metal layer 421, and the circuit can reduce the modulus of the metal layer 421. In particular, metals exhibit an electro-plastic effect, and the modulus of the metal decreases when an electric current is passed through it.

In the embodiment of the present application, the modulus of the metal in the non-energized state may be referred to as an intrinsic modulus, and the modulus of the metal in the energized state may be referred to as a dynamic modulus. Wherein, for the same metal, the dynamic modulus is smaller than the inherent modulus. Therefore, when the electronic device 100 is in an impact-resistant scene, the battery 142 may output a current to the metal layer 421, so as to reduce the modulus of the metal layer 421, that is, reduce the natural modulus to the dynamic modulus, thereby improving the impact resistance of the display module 400.

Wherein the electronic device being in an impact-resistant scene includes a period of time when the electronic device 100 finds that it is about to impact another object, to the time it impacts the other object. The other object is an object other than the electronic device 100, and for convenience, the object to which the electronic device collides may be referred to as an object a. For example, when the electronic device 100 determines that it is falling (i.e., the object a is the ground or other object located under the electronic device 100), it may be determined that it enters an impact-resistant scene. For another example, the electronic device 100 determines that the electronic device 100 and the object a are approaching, and the approaching speed is greater than a preset speed threshold B1 or the acceleration is equal to or greater than a preset acceleration threshold C1 (e.g., gravitational acceleration), and it may be determined that the electronic device 100 enters an impact-resistant scene. At the end of the drop or the impact, the electronic device 100 may be out of the impact-resistant state, for example, when the electronic device 100 detects that the electronic device 100 is stationary after a violent impact occurs or the relative velocity between the electronic device 100 and the object a is lower than a preset velocity threshold B2 (i.e., the relative velocity between the electronic device 100 and the object a is small or even zero), the electronic device 100 may determine that it is out of the impact-resistant scene.

In some embodiments, the electronic device 100 may determine or predict an impact energy density experienced by the electronic device 100 when the electronic device 100 impacts the object a; then, the correspondence between the impact energy density and the modulus can be combined to determine a target modulus of the metal layer 421, i.e., how much modulus is needed to cope with or resist the impact energy density to which the electronic device 100 is subjected. Then, the current magnitude that the battery 142 needs to output to the metal layer 421 can be determined according to the target modulus, and the determined current magnitude can be referred to as a target current; the battery 142 can be controlled to output the target current to the metal layer 421. The modulus of the metal layer 421 may be lowered to the target modulus, or below the target modulus, when the target current is passed through the metal layer 421.

Next, taking the electronic device 100 falling as an example, a process of adjusting the modulus of the metal layer 421 is described as an example.

The electronic device 100 may determine, by the acceleration sensor 180E, that the electronic device 100 is currently accelerated according to the acceleration of gravity, so that it may be determined that the electronic device 100 is currently in a free-fall state, that is, the electronic device 100 falls. At which point electronic device 100 may determine that it entered an impact resistant scenario.

The electronic apparatus 100 can determine the height h1 of the electronic apparatus 100 from the object a (e.g., the ground) placed therebelow through the distance sensor 180F. Then, the gravitational potential energy E1, that is, the impact energy E1, is calculated by using the height h1 and the mass of the electronic device 100 itself, according to the gravitational potential energy formula E — mgh. For example, the height h1 may be set to 0.4m, the mass of the electronic device 100 may be set to 200g, and the calculated E1 may be 0.2Kg 10N/Kg 0.4m may be 0.8J.

When the impact energy E1 is determined, the impact energy density D1 may be determined based on the contact area S1 between the electronic device 100 and the object a when the electronic device 100 collides against the object a. Wherein D1 is E1/S1. For example, the electronic device 100 may determine the posture of the electronic device 100 during a fall, such that it is determined or predicted from the posture that the electronic device 100 has a contact area S1 with the object a1 when colliding with the object a. For example, the electronic device 100 may determine the pose of the electronic device 100 through the gyro sensor 180B. In one example, the electronic apparatus 100 may be set to fall with a corner portion thereof facing downward, and thus it is predicted or determined that the corner portion of the electronic apparatus 100 may directly collide with the object a1 when colliding with the object a1, that is, the corner portion contacts the object a at the moment of collision. The area of the corner may be regarded as the area S1. The area of the corner may be set to 10mm by 5 mm. From this, the impact energy density D1 ═ 0.8J/(10mm × 5mm) ═ 0.016J/mm can be calculated ² 。

The target modulus may be determined from the impact energy density D1. For example, the modulus F1 corresponding to the impact energy density D1 can be determined according to the corresponding relationship curve of the impact energy density and the modulus shown in fig. 4. Illustratively, the modulus F1 may be taken as the target modulus. Illustratively, the modulus F2 may be taken as the target modulus, with the modulus F2 being less than the modulus F1. The impact energy density D1 is 0.016J/mm ² For example, as shown in FIG. 4, 0.016J/mm ² Corresponding to a modulus of 100 GPa. In one example, 100GPa may be taken as the target modulus. In other examples, a modulus of less than 100GPa (e.g., 90GPa) may be used as the target modulus.

Then, a target current may be determined based on the target modulus of 100 GPa. For one metalIts dynamic modulus has a fixed correspondence to the current density through it. The corresponding relationship can be obtained through experimental measurement, and the specific measurement process can refer to the introduction of the prior art, which is not described herein again. Taking SUS-316L as an example, the stress and strain at different current densities are shown in FIG. 5, wherein the modulus is the ratio of the stress to the strain, i.e., the slope of the curve shown in FIG. 5. According to the correspondence of stress strain shown in fig. 5, the current density G1 corresponding to the target modulus can be determined, and the current density G1 is taken as the target current density. Taking the target modulus as 100GPa as an example, according to the relation of stress strain shown in FIG. 5, the current density corresponding to the modulus with the magnitude of 100GPa is determined to be 5.3A/mm ² . Wherein the response time is 4 seconds, that is, the current density is 5.3A/mm ² And continued for 4 seconds or more, the modulus of SUS-316L decreased to 100 GPa.

After the target current density G1 is determined, the product of the cross-sectional area S2 of the metal layer 421 in the direction perpendicular to the current flow and the target current density G1 may be calculated, and the target current I1 may be obtained. In one example, one end of the metal layer 421 in the longitudinal direction may be connected to the positive electrode of the battery 142, and the other end may be connected to the negative electrode of the battery 142. That is, when the metal layer 421 is energized, a current flows through the metal layer 421 along the longitudinal direction of the metal layer 421. The metal layer 421 has a length direction perpendicular to a width direction thereof. From this, the product of the width and the thickness of the metal layer 421 can be calculated, resulting in the cross-sectional area S2 perpendicular to the current flow direction. Further, the product of the cross-sectional area S2 perpendicular to the current direction and the target current density G1 was calculated to obtain the target current I1. In one example, one end of the metal layer 421 in the width direction may be connected to the positive electrode of the battery 142, and the other end may be connected to the negative electrode of the battery 142. That is, when the metal layer 421 is energized, a current flows through the metal layer 421 in the width direction of the metal layer 421. The width direction of the metal layer 421 is perpendicular to the length direction thereof. From this, the product of the length and the thickness of the metal layer 421 can be calculated, resulting in the cross-sectional area S2 perpendicular to the current flow direction. Further, the product of the cross-sectional area S2 perpendicular to the current direction and the target current density G1 was calculated to obtain the target current I1.

In a specific example, the cross-sectional area of the metal layer 421 perpendicular to the current flow direction may be set to be the product of the width and the thickness of the metal layer 421. For example, the metal layer 421 may have a width of 75mm and a thickness of 0.05mm, and a cross-sectional area S2 of 0.05mm by 75mm or 3.75mm ² . Multiplying it by the target current density G1-5.3A/mm ² The target current was 19.875 a. Thus, the electronic apparatus 100 may control the battery 142 to output current of 19.875a to the metal layer 421 to reduce the modulus of the metal layer 421 to 100 GPa.

Specifically, the metal layer 421 may be powered by the target current after the target current is determined (when the electronic device 100 does not collide with or contact the object a), that is, before the electronic device 100 collides with or contacts the object a, so as to reduce the modulus of the metal layer. The power may be stopped upon detecting that the electronic device 100 is out of the impact-resistant scenario to restore the natural modulus of the metal layer 421.

The above description is only illustrative, but not limiting, of the process of determining the target current and outputting the target current to the metal layer 421 in the impact-resistant scenario of the electronic device 100. In other embodiments, the metal layer 421 may be a titanium alloy (with a fixed modulus of 110GPa), an Al-SiC (with a fixed modulus of 103GPa), a stainless steel (with a fixed modulus of 193GPa), a 5052-H18 aluminum alloy (with a fixed modulus of 60-70GPa), a Ni-Ti alloy (with a fixed modulus of 110-130GPa), or the like. A developer or designer of the electronic device 100 or the display module 400 may freely select a metal having a suitable modulus as desired. The correspondence between current density and modulus is different for different metals. The current density may be determined by using the corresponding relationship between the current density and the modulus corresponding to the material according to the specific material of the metal layer 421, and the target current may be further determined, so that the battery 142 may be controlled to output the target current to the metal layer 421, and the modulus of the metal layer 421 may be reduced to the target modulus.

After the electronic device 100 is out of the impact-resistant scene, the battery 142 may be controlled to stop outputting current to the metal layer 421, so that the modulus of the metal layer 421 may be restored to the fixed modulus, and thus the compression may be coped with or resisted.

In some embodiments, the above-described determining the impact energy density, determining the target current, etc., may be performed by the processor 110.

In some embodiments, the thickness of the metal layer 421 may be 0.03mm to 0.07 mm. In one example, as shown in FIG. 3, the metal layer 421 has a thickness of 0.05 mm.

In other embodiments, the thickness of the metal layer 421 may be set by a developer or a designer of the electronic device 100 or the display module 400 according to related requirements, and is not limited herein.

The structure of the display layer 410 shown in fig. 3 is merely an example of the display layer, and is not limited thereto. In other embodiments, the thicknesses of the various layers of display layer 410 may vary, the adhesives used may also vary, and more or fewer layers may be included. The display panel may be a display and touch panel (display and touch panel). Specific implementations of the display layer 410 can refer to the description of the prior art, and the application is not limited thereto.

The buffer layer 422 (e.g., a foam layer or a thermoplastic polyurethane elastomer (TPU)) layer in the support layer 420 shown in fig. 3 is optional, that is, the buffer layer 422 is no longer an optional layer but becomes optional by the solution provided by the embodiment of the present application, thereby facilitating the overall thinning of the electronic device 100.

According to the display module and the modulus adjusting method of the display module, extrusion resistance and impact resistance can be achieved simultaneously by adopting a single-layer metal material, so that a traditional buffer layer (cushion) can be removed, and electronic equipment can be thinned; and a metal plate with higher fixed modulus can be used as a metal layer, and when different metal layers are not electrified, the metal plate can better resist extrusion. For example, according to the scheme of the application, a stainless steel plate can be used as the metal layer, and the metal layer has more than twice of the metal Cu plate which is traditionally used in the extrusion resistance when the stainless steel plate is not electrified.

The electronic device 100 may be a foldable electronic device having a foldable display screen or a foldable display module. For a foldable display screen or a display module, if the modulus of the screen supporting back plate is low, it may be difficult to maintain high flatness of the foldable display screen in the unfolded state. However, if the modulus of the screen supporting back plate is high, a user needs to apply a large bending force when bending the foldable display screen, so that bending is inconvenient, and user experience is poor.

Referring to fig. 6, an embodiment of the present application provides a foldable display module 700 that can be configured in an electronic device 100. As shown in fig. 6, the display module 700 may include a display layer 710, and a support layer 720 disposed on a non-display side of the display layer 710.

In some embodiments, as shown in fig. 6, the display layer 710 comprises a Colorless Polyimide (CPI) film layer, a POL layer bonded to the CPI film layer by an OCA, a display panel bonded to the POL layer by an OCA, and a back film (back film) layer bonded to the display panel by a PSA. The display panel may be a display and touch panel (display and touch panel).

The display layer 710 shown in fig. 6 is for illustration only and is not intended to be limiting. In other embodiments, the thicknesses of the various layers of display layer 710 may vary, the adhesives used may also vary, and more or fewer layers may be included. Specific implementations of the display layer 710 can refer to the description of the prior art, and the application is not limited thereto.

As shown in fig. 6, the support layer 720 may include a metal layer 721. The metal layer 721 is a metal plate structure having electro-plasticity. When metal layer 721 is energized, its modulus decreases. In one example, the metal layer 721 may be a stainless steel plate, such as SUS-316L stainless steel. In one example, the metal layer 721 can be specifically 5052-H18 aluminum alloy sheet. In one example, the metal layer 721 may be a Ni — Ti alloy sheet. In one example, metal layer 721 may be specifically an Al — SiC plate. Etc., which are not listed here.

The metal layer 721 may connect the battery 142 to form a closed loop, so that the battery 142 may output a current to the metal layer 721, which may be used to reduce the modulus of the metal layer 721. Specifically, reference may be made to the above embodiment shown in fig. 3, which is not described herein again.

In the embodiment of the present application, when the bending of the electronic device 100 is detected or performed, the battery 142 may output a current to the metal layer 721 to reduce the modulus of the metal layer 721, so as to facilitate the bending.

The stiffness S and the modulus of the material have the relationship shown in formula (1).

Wherein E represents the modulus of the material and H is the thickness of the material.

The stiffness S of the metal layer may represent the bending force required to bend the metal layer. As can be seen from equation (1), the bending force required to bend the metal layer is proportional to the modulus of the metal layer. I.e. the modulus of the metal layer is reduced by half and the bending force is also reduced by half.

According to the relationship between the bending force and the modulus, a developer or a designer of the electronic device 100 or the display module 700 can select the bending force according to the hand feeling requirement of the product, determine the target modulus according to the bending force, and further determine the target current density when the metal layer is electrified and further determine the target current according to the target modulus. Reference may be made to the above description of the embodiments shown in fig. 3 to fig. 5, which is not repeated herein.

In some embodiments, the electronic device 100 may detect the angle of the main-sub middle frame of the electronic device 100 through the magnetic sensor 180D. When the angle is detected to be less than 180 °, it may be determined that the electronic device 100 is bent or is bent, and at this time, the battery 142 may be controlled to output the target current to the metal layer 721, so as to reduce the modulus of the metal layer 721 and facilitate the bending.

In some embodiments, the electronic device 100 may detect the angle of the main and sub middle frames of the electronic device 100 through the magnetic sensor 180D. When it is detected that the angle is smaller than 180 °, and the angle changes continuously (for example, the angle changes by a preset magnitude in a preset time period), it may be determined that the electronic device 100 is bent or is bent, and the battery 142 may be controlled to supply power to the metal layer 721 to reduce the modulus of the metal layer 721, so as to facilitate bending.

In some embodiments, the electronic device 100 may control the battery 142 to no longer output current to the metal layer 721 when detecting that the bending of the electronic device 100 is finished, so as to restore the modulus of the metal layer 721 to the inherent modulus, so that the display layer 710 may maintain a high flatness.

In some embodiments, the electronic device 100 may detect an angle between the main and sub middle frames of the electronic device 100 through the magnetic sensor 180D. When it is detected that the angle between the main and sub middle frames is not continuously changed (e.g. the angle is not changed in a preset time period or the change amount is smaller than a preset angle threshold), it can be determined that the bending of the electronic device 100 is finished

In some embodiments, as shown in fig. 6, a buffer layer 722 may be further included in the support layer 720. The buffer layer 722 may be disposed between the metal layer 721 and the display layer 710. The cushioning layer 722 may be a foam layer or may be a rubber layer (e.g., a TPU layer).

The application provides a display module and a modulus adjusting method, which can reduce the modulus of a display screen when an electronic device is bent, so that the display screen is easier to bend; when the electronic equipment is in an unfolded state, the original higher modulus of the display screen can be recovered, and the high flatness of the display screen can be maintained.

The embodiment of the application provides a modulus adjusting method, which can be applied to an electronic device 100 configured with a display module, where the display module includes: a display layer; the supporting layer positioned on the non-display side of the display layer comprises a metal sheet layer with an initial modulus larger than a preset modulus, wherein the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer.

As shown in fig. 7, the method includes the following steps.

Step 801, determining that the electronic device is about to impact another object.

And step 802, before the electronic device contacts the other object, controlling the power supply to output a first current to the metal sheet layer, wherein the first current is used for reducing the modulus of the metal sheet layer.

In some embodiments, the determining that the electronic device is about to impact other objects comprises: determining an impact energy density to which the electronic device is to be subjected; determining a target modulus according to the impact energy density and the corresponding relation between the modulus and the impact energy density; the controlling the power supply to output a first current to the sheet metal layer includes: determining a target current density according to the target modulus and the corresponding relation between the modulus and the current density; calculating the product of the target current density and the cross-sectional area to obtain a target current; the cross-sectional area is a cross-sectional area of the metal layer perpendicular to a current flow direction; determining a current equal to or greater than the target current as the first current.

In one illustrative example of this embodiment, the other object is the ground; the determining that the electronic device is about to collide with other objects is specifically determining that the electronic device starts to fall from a first height from the ground; the determining the impact energy density to which the electronic device is to be subjected comprises: predicting impact energy when the electronic equipment falls to the ground according to the first height and the mass of the electronic equipment; predicting the contact area between the electronic equipment and the ground when the electronic equipment falls to the ground according to the falling angle of the electronic equipment; dividing the impact energy by the contact area to obtain the impact energy density.

In some embodiments, the display layer is foldable; the method further comprises the following steps: determining that the display module is bending; controlling the power source to output a second current to the sheet metal layer, the second current for reducing a modulus of the sheet metal layer.

In some embodiments, the method further comprises: determining that the display module finishes bending; controlling the power source to no longer output current to the sheet metal layer to restore the sheet metal layer to the initial modulus.

The display module modulus adjusting method provided by the embodiment of the application can adjust the modulus of the display module in different scenes to cope with extrusion or impact caused by different scenes, and the durability of the display module can be improved.

Referring to fig. 8, an electronic device 900 is provided in an embodiment of the application. The electronic device 900 may include a processor 910, a memory 920, and a display module 930.

The display module 930 includes: a display layer; the supporting layer positioned on the non-display side of the display layer comprises a metal sheet layer with an initial modulus larger than a preset modulus, wherein the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer.

The memory 920 is used to store computer programs. Electronic device 900 may perform the functions of electronic device 100 described above when the computer programs stored by memory 920 are executed by processor 910.

The method steps in the embodiments of the present application may be implemented by hardware, or may be implemented by software instructions executed by a processor. The software instructions may consist of corresponding software modules that may be stored in Random Access Memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), Erasable Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), registers, a hard disk, a removable hard disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. Of course, the storage medium may also be integral to the processor. The processor and the storage medium may reside in an ASIC.

In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the application to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored in or transmitted over a computer-readable storage medium. The computer instructions may be transmitted from one website site, computer, server, or data center to another website site, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device, such as a server, a data center, etc., that incorporates one or more of the available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., Solid State Disk (SSD)), among others.

It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of the present application.

Claims

1. A display module configured in an electronic device, the display module comprising:

a display layer;

the supporting layer is positioned on the non-display side of the display layer and comprises a metal sheet layer with an initial modulus larger than a preset modulus, the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer; wherein the content of the first and second substances,

the sheet metal layer is to receive a first current from the power source when the electronic device is about to impact another object, the first current to reduce a modulus of the sheet metal layer.

2. The display module of claim 1, wherein the first current is used to reduce the modulus of the sheet metal layer from the initial modulus to a target modulus; the target modulus is determined by an impact energy density caused by the electronic device impacting the other object.

3. The display module according to claim 1, wherein the first end and the second end are ends of the metal sheet layer in a length direction; or the first end and the second end are two ends of the metal layer in the width direction.

4. The display module of claim 1, wherein the display layer is foldable; wherein the content of the first and second substances,

when the display module assembly is bent, the metal sheet layer is used for receiving second current from the power supply, and the second current is used for reducing the modulus of the metal sheet layer.

5. The display module of claim 4, wherein when the display module completes the bending, the sheet metal layer no longer receives current from the power source to restore the initial modulus to the sheet metal layer.

6. A modulus adjusting method is applied to electronic equipment provided with a display module, and the display module comprises: a display layer; the supporting layer is positioned on the non-display side of the display layer and comprises a metal sheet layer with an initial modulus larger than a preset modulus, the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer;

the method comprises the following steps:

determining that the electronic device is about to impact other objects;

controlling the power supply to output a first current to the sheet metal layer before the electronic device contacts the other object, the first current being for reducing a modulus of the sheet metal layer.

7. The method of claim 6,

the determining that the electronic device is about to impact other objects includes:

determining an impact energy density to which the electronic device is to be subjected;

determining a target modulus according to the impact energy density and the corresponding relation between the modulus and the impact energy density;

the controlling the power supply to output a first current to the sheet metal layer includes:

determining a target current density according to the target modulus and the corresponding relation between the modulus and the current density;

calculating the product of the target current density and the cross-sectional area to obtain a target current; the cross-sectional area is a cross-sectional area of the metal layer perpendicular to a current flow direction;

determining a current equal to or greater than the target current as the first current.

8. The method of claim 7, wherein the other object is the ground; the determining that the electronic device is about to collide with other objects is specifically determining that the electronic device starts to fall from a first height from the ground;

the determining an impact energy density to which the electronic device is to be subjected comprises:

predicting impact energy of the electronic equipment when the electronic equipment falls to the ground according to the first height and the quality of the electronic equipment; predicting the contact area between the electronic equipment and the ground when the electronic equipment falls to the ground according to the falling angle of the electronic equipment;

and dividing the impact energy by the contact area to obtain the impact energy density.

9. The method of claim 6, wherein the display layer is foldable;

the method further comprises the following steps:

determining that the display module is bending;

controlling the power source to output a second current to the sheet metal layer, the second current for reducing a modulus of the sheet metal layer.

10. The method of claim 9, further comprising:

determining that the display module finishes the bending;

controlling the power source to no longer output current to the sheet metal layer to restore the sheet metal layer to the initial modulus.

11. An electronic device, comprising: the display device comprises a display module, a processor and a memory;

the display module assembly includes: a display layer; the supporting layer is positioned on the non-display side of the display layer and comprises a metal sheet layer with an initial modulus larger than a preset modulus, the first end of the metal sheet layer is connected with the anode of a power supply, and the second end of the metal sheet layer is connected with the cathode of the power supply, so that the power supply can output current to the metal sheet layer;

the memory is to store computer instructions; when the electronic device is running, the processor executes the computer instructions, causing the electronic device to perform:

determining that the electronic device is about to impact other objects;

controlling the power supply to output a first current to the sheet metal layer before the electronic device contacts the other object, the first current for reducing a modulus of the sheet metal layer.

12. The electronic device of claim 11, wherein when the electronic device is run, the processor executes the computer instructions to cause the electronic device to further perform:

calculating the product of the target current density and the cross sectional area to obtain a target current; the cross-sectional area is a cross-sectional area of the metal layer perpendicular to a current flow direction;

13. The electronic device of claim 12, wherein the other object is the ground; when the electronic device is operated, the processor executes the computer instructions to cause the electronic device to further execute:

determining that the electronic device has begun to fall from a first height from the ground;

the determining the impact energy density to which the electronic device is to be subjected comprises:

dividing the impact energy by the contact area to obtain the impact energy density.

14. The electronic device of claim 11, wherein the display layer is foldable; when the electronic device is operated, the processor executes the computer instructions to cause the electronic device to further execute:

determining that the display module is bending;

15. The electronic device of claim 14, wherein when the electronic device is run, the processor executes the computer instructions to cause the electronic device to further perform:

determining that the display module finishes bending;

16. An electronic device comprising the display module according to any one of claims 1 to 5.

17. A computer storage medium, characterized in that the computer storage medium has stored thereon a computer program which, when executed by a processor, carries out the method according to any one of claims 6-10.