CN115109557B - Fast-curing high-adhesion electronic packaging UV adhesive - Google Patents
Fast-curing high-adhesion electronic packaging UV adhesive Download PDFInfo
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- CN115109557B CN115109557B CN202210779180.2A CN202210779180A CN115109557B CN 115109557 B CN115109557 B CN 115109557B CN 202210779180 A CN202210779180 A CN 202210779180A CN 115109557 B CN115109557 B CN 115109557B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 47
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 47
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 16
- -1 acrylic ester Chemical class 0.000 claims abstract description 33
- 239000004814 polyurethane Substances 0.000 claims abstract description 17
- 229920002635 polyurethane Polymers 0.000 claims abstract description 17
- 239000002131 composite material Substances 0.000 claims abstract description 15
- 239000004593 Epoxy Substances 0.000 claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract description 12
- 239000003085 diluting agent Substances 0.000 claims abstract description 9
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 20
- 238000002156 mixing Methods 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 11
- VALXVSHDOMUUIC-UHFFFAOYSA-N 2-methylprop-2-enoic acid;phosphoric acid Chemical group OP(O)(O)=O.CC(=C)C(O)=O VALXVSHDOMUUIC-UHFFFAOYSA-N 0.000 claims description 10
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- 229940124530 sulfonamide Drugs 0.000 claims description 8
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical group C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 claims description 3
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000004383 yellowing Methods 0.000 abstract description 10
- 238000005336 cracking Methods 0.000 abstract description 9
- 238000010298 pulverizing process Methods 0.000 abstract description 9
- 238000005034 decoration Methods 0.000 abstract description 4
- 230000032683 aging Effects 0.000 description 14
- 238000001723 curing Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 238000012360 testing method Methods 0.000 description 8
- 238000010998 test method Methods 0.000 description 7
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 230000002633 protecting effect Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
Abstract
The invention discloses a fast-curing high-adhesion electronic packaging UV adhesive, which relates to the technical field of electronic packaging in the lamp decoration industry, and comprises the following raw materials in parts by weight: 20-50 parts of polyurethane acrylic ester, 10-40 parts of epoxy acrylic ester, 20-50 parts of reactive diluent, 0-2 parts of adhesion promoter and 2-8 parts of composite photoinitiator; the UV adhesive prepared by the invention can be rapidly cured in 1 second, the adhesion to PE lamp wires can reach 1 level, and the outdoor weather resistance can reach more than three years without yellowing, cracking and pulverization, but the similar industrial glue still can not reach the adhesion of 1 level, and is easy to yellow when used for a long time in an outdoor environment.
Description
Technical field:
the invention relates to the technical field of electronic packaging in the lamp decoration industry, in particular to a fast-curing high-adhesion electronic packaging UV adhesive.
The background technology is as follows:
the traditional electronic packaging materials in the lamp decoration industry mostly use epoxy resin systems, but the technology is complex, glue is required to be mixed in proportion, the curing time is long, and the labor cost is high. Packaging with unsaturated resins is also contemplated, but is prohibitive in the face of ultra-high VOCs. At this time, the acrylic resin has been attracting attention for its advantages of low VOC, rapid curing, simple process, and the like.
UV adhesives are a type of adhesive that must be cured by irradiation with ultraviolet light, and can be used as adhesives, as well as sizing materials for paints, coatings, inks, and the like. UV is ultraviolet light, which is a section of electromagnetic radiation beyond visible light and has a wavelength of 10-400 nm, and the curing principle is that a photoinitiator (or photosensitizer) in the UV curing material absorbs ultraviolet light under the irradiation of ultraviolet light to generate active free radicals or cations to initiate chemical reactions of monomer polymerization and crosslinking, so that the adhesive is converted from liquid state to solid state within a few seconds.
The UV adhesive can be cured for 1 second under the irradiation of the UV LED point light source, has high adhesive force to the PE lamp wire, high adhesive strength, tear resistance and low water absorption, has good packaging and protecting effects on luminous components, has good weather resistance, and can prolong the service life of the lamp string.
The invention comprises the following steps:
the invention aims to solve the technical problem of providing the electronic packaging UV adhesive with high adhesive force, which can be cured rapidly, has the hardness of more than 80A, the tensile strength of more than 70MPa and the adhesive force of level 1, has the curing speed of 1 second, and can meet the requirements of electronic packaging in the lamp decoration industry.
The technical problems to be solved by the invention are realized by adopting the following technical scheme:
the invention aims at providing a fast-curing high-adhesion electronic packaging UV adhesive, which comprises the following raw materials in parts by weight:
preferably, the urethane acrylate is a hexafunctional aliphatic urethane acrylate.
Preferably, the epoxy acrylate is a difunctional modified epoxy acrylate.
Preferably, the reactive diluent is difunctional 1, 6-hexanediol diacrylate (HDDA).
Preferably, the adhesion promoter is a methacrylate phosphate.
Preferably, the composite photoinitiator is a photoinitiator 184 and a photoinitiator TPO, which can be prepared from any mixture ratio.
The second purpose of the invention is to provide a preparation method of the fast-curing high-adhesion electronic packaging UV adhesive, which comprises the steps of adding polyurethane acrylic ester, epoxy acrylic ester and reactive diluent into a reaction kettle, heating to 70-80 ℃, stirring and mixing, adding an adhesion promoter and a composite photoinitiator, stirring and mixing, and vacuum defoaming to obtain the UV adhesive.
The beneficial effects of the invention are as follows:
(1) The invention adopts a single-component acrylic ester system, avoids the complex glue preparation operation problem of a double-component epoxy resin system, and can effectively reduce the labor cost; and the UV adhesive prepared by the invention can be rapidly cured in 1 second, and compared with the traditional epoxy resin curing system, the production efficiency is greatly improved.
(2) Compared with an unsaturated resin system, the UV adhesive disclosed by the invention does not contain volatile solvents, does not cause air pollution and human body harm, and is an environment-friendly UV adhesive product.
(3) The adhesive force of the UV adhesive prepared by the invention to PE lamp wires can reach 1 level, and outdoor weather resistance can reach more than three years without yellowing, cracking and pulverization, but the adhesive force of similar industrial glue still can not reach 1 level, and the adhesive force is easy to yellowing when the adhesive is used for a long time in an outdoor environment.
The specific embodiment is as follows:
the invention is further described in connection with the following embodiments in order to make the technical means, the creation features, the achievement of the purpose and the effect of the invention easy to understand.
The polyurethane acrylic ester in the following examples is DM576 polyurethane acrylic ester of double bond chemical industry, and the epoxy acrylic ester is HE3215 epoxy acrylic ester of new materials of Haohui.
Example 1
Adding 35 parts of hexafunctional polyurethane acrylic ester, 30 parts of tetrafunctional phenolic epoxy acrylic ester and 30 parts of difunctional HDDA into a reaction kettle, heating to 70-80 ℃, stirring and mixing for 80min at a speed of 50r/min, adding 0.4 part of methacrylate phosphate and 5 parts of composite photoinitiator (weight ratio of 184 to TPO is 3:2), stirring for 50min, and carrying out vacuum defoaming to obtain the UV adhesive.
The UV glue prepared in the example can be cured under a UV LED point light source (wavelength 365nm, frequency 50Hz, distance 1 cm) for 1 second; the tensile strength of the universal testing machine is 75MPa; the hardness of the product is 86A; the adhesive force reaches 1 level by a hundred-cell test method; and the UV ageing oven is irradiated for 100 hours, so that the UV ageing oven is free from yellowing, cracking and pulverization.
Example 2
Adding 32 parts of hexafunctional polyurethane acrylic ester, 32 parts of tetrafunctional phenolic epoxy acrylic ester and 32 parts of difunctional HDDA into a reaction kettle, heating to 70-80 ℃, stirring and mixing for 80min at a speed of 50r/min, adding 0.4 part of methacrylate phosphate and 6 parts of composite photoinitiator (weight ratio of 184 to TPO is 3:2), stirring for 50min, and carrying out vacuum defoaming to obtain the UV adhesive.
The UV glue prepared in the example can be cured under a UV LED point light source (wavelength 365nm, frequency 50Hz, distance 1 cm) for 1 second; the tensile strength of the universal testing machine is 73MPa; hardness was measured by durometer 87A; the adhesive force reaches 1 level by a hundred-cell test method; and the UV ageing oven is irradiated for 100 hours, so that the UV ageing oven is free from yellowing, cracking and pulverization.
Example 3
36 parts of hexafunctional polyurethane acrylic ester, 28 parts of tetrafunctional phenolic epoxy acrylic ester and 33 parts of difunctional HDDA are added into a reaction kettle, the temperature is raised to 70-80 ℃, stirring and mixing are carried out for 50min at the speed of 50r/min, 0.4 part of methacrylate phosphate and 5 parts of composite photoinitiator (weight ratio of 184 to TPO is 3:2) are added, stirring is carried out for 50min, and vacuum defoaming is carried out, thus obtaining the UV adhesive.
The UV glue prepared in the example can be cured under a UV LED point light source (wavelength 365nm, frequency 50Hz, distance 1 cm) for 1 second; the tensile strength of the universal testing machine is 77MPa; the hardness of the product is 85A; the adhesive force reaches 1 level by a hundred-cell test method; and the UV ageing oven is irradiated for 100 hours, so that the UV ageing oven is free from yellowing, cracking and pulverization.
The invention further aims to provide a fast-curing high-adhesion electronic packaging UV adhesive, which comprises the following raw materials in parts by weight:
wherein, N- [ (4-sulfonamide) phenyl ] acrylamide plays a role of a reinforcing agent, and the hardness and the tensile strength of the UV adhesive are improved by reacting with polyurethane acrylic ester, epoxy acrylic ester and reactive diluent.
Preferably, the urethane acrylate is a hexafunctional aliphatic urethane acrylate.
Preferably, the epoxy acrylate is a difunctional modified epoxy acrylate.
Preferably, the reactive diluent is difunctional 1, 6-hexanediol diacrylate (HDDA).
Preferably, the adhesion promoter is a methacrylate phosphate.
Preferably, the composite photoinitiator is a photoinitiator 184 and a photoinitiator TPO, which can be prepared from any mixture ratio.
The invention aims at providing a preparation method of the fast-curing high-adhesion electronic packaging UV adhesive, which comprises the steps of adding polyurethane acrylic ester, epoxy acrylic ester, N- [ (4-sulfonamide) phenyl ] acrylamide and an active diluent into a reaction kettle, heating to 70-80 ℃, stirring and mixing, adding an adhesion promoter and a composite photoinitiator, stirring and mixing, and vacuum defoaming to obtain the UV adhesive.
Example 4
36 parts of hexafunctional polyurethane acrylic ester, 28 parts of tetrafunctional phenolic epoxy acrylic ester, 5 parts of N- [ (4-sulfonamide) phenyl ] acrylamide and 33 parts of difunctional HDDA are added into a reaction kettle, the temperature is raised to 70-80 ℃, stirring and mixing are carried out for 50min at the rotating speed of 50r/min, then 0.4 part of methacrylate phosphate and 5 parts of composite photoinitiator (184 and TPO weight ratio is 3:2) are added, stirring is carried out for 50min, and vacuum defoaming is carried out, thus obtaining the UV adhesive.
The UV glue prepared in the example can be cured under a UV LED point light source (wavelength 365nm, frequency 50Hz, distance 1 cm) for 1 second; the tensile strength of the universal testing machine is 84MPa; the durometer test hardness is 87A; the adhesive force reaches 1 level by a hundred-cell test method; and the UV ageing oven is irradiated for 100 hours, so that the UV ageing oven is free from yellowing, cracking and pulverization.
Example 4 was a comparative example to example 3, and example 4 differed from example 3 in that only 5 parts of N- [ (4-sulfonamide) phenyl ] acrylamide were added, but the tensile strength was increased by 9.1% and the hardness was increased from 85A to 87A.
Example 5
36 parts of hexafunctional polyurethane acrylic ester, 28 parts of tetrafunctional phenolic epoxy acrylic ester, 8 parts of N- [ (4-sulfonamide) phenyl ] acrylamide and 33 parts of difunctional HDDA are added into a reaction kettle, the temperature is raised to 70-80 ℃, stirring and mixing are carried out for 50min at the rotating speed of 50r/min, then 0.4 part of methacrylate phosphate and 5 parts of composite photoinitiator (184 and TPO weight ratio is 3:2) are added, stirring is carried out for 50min, and vacuum defoaming is carried out, thus obtaining the UV adhesive.
The UV glue prepared in the example can be cured under a UV LED point light source (wavelength 365nm, frequency 50Hz, distance 1 cm) for 1 second; the tensile strength of the universal testing machine is 86MPa; the hardness of the product is 88A; the adhesive force reaches 0 level by a hundred-cell test method; and the UV ageing oven is irradiated for 100 hours, so that the UV ageing oven is free from yellowing, cracking and pulverization.
Example 5 is a comparative example to example 3, and the difference between example 5 and example 3 is that 8 parts of N- [ (4-sulfonamide) phenyl ] acrylamide was added, but the tensile strength was increased by 11.7%, the hardness was increased from 85A to 88A, and the adhesion was also 0.
Comparative example 1
36 parts of hexafunctional polyurethane acrylic ester, 28 parts of tetrafunctional phenolic epoxy acrylic ester, 33 parts of difunctional HDDA and 5 parts of N-phenyl acrylamide are added into a reaction kettle, the temperature is raised to 70-80 ℃, stirring and mixing are carried out for 50min at the rotating speed of 50r/min, then 0.4 part of methacrylate phosphate and 5 parts of composite photoinitiator (184 and TPO weight ratio is 3:2) are added, stirring is carried out for 50min, and vacuum defoaming is carried out, thus obtaining the UV adhesive.
The UV glue prepared in the example can be cured under a UV LED point light source (wavelength 365nm, frequency 50Hz, distance 1 cm) for 1 second; the tensile strength of the universal testing machine is 80MPa; the hardness of the product is 85A; the adhesive force reaches 1 level by a hundred-cell test method; and the UV ageing oven is irradiated for 100 hours, so that the UV ageing oven is free from yellowing, cracking and pulverization.
Comparative example 1 is a comparative example in which example 3 was used as a control, and comparative example 1 differs from example 3 only in that 5 parts of N-phenylacrylamide was added, but the tensile strength was increased by only 3.9%, and the hardness was not changed.
Comparative example 2
36 parts of hexafunctional polyurethane acrylic ester, 28 parts of tetrafunctional phenolic epoxy acrylic ester, 33 parts of difunctional HDDA and 5 parts of acrylamide are added into a reaction kettle, the temperature is raised to 70-80 ℃, stirring and mixing are carried out for 50min at the speed of 50r/min, then 0.4 part of methacrylate phosphate and 5 parts of composite photoinitiator (weight ratio of 184 to TPO is 3:2) are added, stirring is carried out for 50min, and vacuum defoaming is carried out, thus obtaining the UV adhesive.
The UV glue prepared in the example can be cured under a UV LED point light source (wavelength 365nm, frequency 50Hz, distance 1 cm) for 1 second; the tensile strength of the universal testing machine is 73MPa; the hardness of the product is 85A; the adhesive force reaches 1 level by a hundred-cell test method; and the UV ageing oven is irradiated for 100 hours, so that the UV ageing oven is free from yellowing, cracking and pulverization.
Comparative example 2 is a comparative example in which example 3 was used as a control, and comparative example 2 differs from example 3 only in that 5 parts of acrylamide was added, but the tensile strength was reduced by 5.2%, and the hardness was not changed.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The fast-curing high-adhesion electronic packaging UV adhesive is characterized by comprising the following raw materials in parts by weight:
20-50 parts of polyurethane acrylic ester
10-40 parts of epoxy acrylate
1-10 parts of N- [ (4-sulfonamide) phenyl ] acrylamide
20-50 parts of reactive diluent
0-2 parts of adhesion promoter
2-8 parts of a composite photoinitiator;
the polyurethane acrylic ester is aliphatic polyurethane acrylic ester with six functionalities;
the epoxy acrylate is tetrafunctional phenolic epoxy acrylate;
the reactive diluent is difunctional 1, 6-hexanediol diacrylate;
the adhesion promoter is methacrylate phosphate.
2. The fast curing high adhesion electronic packaging UV glue of claim 1, wherein: the composite photoinitiator is a photoinitiator 184 and a photoinitiator TPO.
3. The method for preparing the fast-curing high-adhesion electronic packaging UV adhesive as claimed in claim 1 or 2, which is characterized in that: firstly, adding polyurethane acrylic ester, epoxy acrylic ester, N- [ (4-sulfonamide) phenyl ] acrylamide and an active diluent into a reaction kettle, heating to 70-80 ℃, stirring and mixing, then adding an adhesion promoter and a composite photoinitiator, stirring and mixing, and performing vacuum defoaming to obtain the UV adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779180.2A CN115109557B (en) | 2022-07-04 | 2022-07-04 | Fast-curing high-adhesion electronic packaging UV adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779180.2A CN115109557B (en) | 2022-07-04 | 2022-07-04 | Fast-curing high-adhesion electronic packaging UV adhesive |
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| Publication Number | Publication Date |
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| CN115109557A CN115109557A (en) | 2022-09-27 |
| CN115109557B true CN115109557B (en) | 2024-03-19 |
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| CN202210779180.2A Active CN115109557B (en) | 2022-07-04 | 2022-07-04 | Fast-curing high-adhesion electronic packaging UV adhesive |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101724374A (en) * | 2009-11-30 | 2010-06-09 | 北京海斯迪克新材料有限公司 | UV curing packaging adhesive for liquid crystal display |
| CN101906284A (en) * | 2010-08-12 | 2010-12-08 | 华南理工大学 | UV-cured adhesive for plastic and preparation method thereof |
| CN108034395A (en) * | 2017-12-15 | 2018-05-15 | 广州惠利电子材料有限公司 | LED lens fix UV glue and its preparation method and application |
| CN111378412A (en) * | 2019-11-04 | 2020-07-07 | 塔威新材料科技(上海)有限公司 | Light-cured adhesive composition for shading and edge sealing of display module and preparation method thereof |
-
2022
- 2022-07-04 CN CN202210779180.2A patent/CN115109557B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101724374A (en) * | 2009-11-30 | 2010-06-09 | 北京海斯迪克新材料有限公司 | UV curing packaging adhesive for liquid crystal display |
| CN101906284A (en) * | 2010-08-12 | 2010-12-08 | 华南理工大学 | UV-cured adhesive for plastic and preparation method thereof |
| CN108034395A (en) * | 2017-12-15 | 2018-05-15 | 广州惠利电子材料有限公司 | LED lens fix UV glue and its preparation method and application |
| CN111378412A (en) * | 2019-11-04 | 2020-07-07 | 塔威新材料科技(上海)有限公司 | Light-cured adhesive composition for shading and edge sealing of display module and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 朱万强.《涂料基础教程》.西南交通大学出版社,2012,第260-261页. * |
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